Stuart Hutchinson

Email hutchinsonstuart@yahoo.com

IntroductionA passionate, hands-on Operations and Manufacturing Engineering professional with achievements in leading process development, lean cross-functional teams, continuous improvement, cost reduction, startup, expansion and sustaining in semiconductor manufacturing and R&D environments. Seeking an opportunity for professional growth, and to make a high-impact contribution. Hands-on expertise by toolset and process ownership in dry etch, wet etch, photolithography, PECVD, PVD, LPCVD, ion implantation, diffusion, thin wafer processing. Further expertise and experience in yield improvement, defect reduction, SPC, FDC, APC. Keywords FET, IGBT, Silicon Photonics, Optoelectronics, MEMS

Education University of Surrey UK 1989-1997B.Eng. Electronic and Electrical EngineeringMSc Microelectronics and Computer EngineeringPhD Electronic Engineering

Employment

April 2013-Present: Innovative Micro Technology, Goleta, CA. Director of Process Development. MEMS Foundry.Lead and mentor a team of Program Managers, Engineers and Technicians to develop manufacturable process flows suited to individual customer requirements. Bring new products from concept to manufacture.Implement enhancements to corporate practices to meet industry standards: FMEA, process control index, wafer handling, planning templates, 8D methodology, continuous improvement, data driven yield enhancement.Develop vendor relationships, procure and manage installation, including facilities engineering, permits.Function within Sales and Marketing to develop new and existing customers, cost modeling, quotation process, delegate new programs to specific program managers. Supervise Program manager performance from inception through manufacturing integration.

October 2007-April 2013: International Rectifier Inc. Temecula, CA. Served in roles of:Module Manager-Dry Etch (9 months), Module Manager-Photolithography (17 months), Manufacturing shift Manager (17 Months), Manufacturing Engineering Manager (11 months), Director of Manufacturing Engineering (12 months)

Director of Manufacturing EngineeringManaged expansion budgets exceeding $30M through project planning, cross functional teams, discipline of on-time delivery. Fostered a culture of continuous improvement leading to consistent gains in cost metrics. Responsible for all engineering and maintenance activity. Owner of departmental budget. Personal leadership of 150,000 photo layer per quarter capacity expansion via developing relationships with aftermarket equipment refurbishers and brokers. Achieved 98% reduction in reliability failure due to passivation cracking. Doubled diffusion load sizes. Led qualification of new toolsets to eliminate obsolete tooling, mentor, motivated and developed a team of 25 engineers and 100 technicians to achieve site goals. Substituted for VP of Operations in times of his absence.Manufacturing Engineering ManagerResponsible for all Process and Equipment engineering activities. Drove Lean initiatives and cross-functional teams to improve costs resulting in dramatic reduction in waste, elimination of unnecessary process steps, materials cost reduction and improvements in manufacturability. Modernized and improved process flows and yields through use of novel and industry-standard processes. Qualified new parts and tools through assembly and reliability test. Hands-on intervention in ongoing engineering issues where imminent success was not obvious.

Manufacturing Shift ManagerDrove all shift performance metrics (moves per operator hour, scrap, finished products out, headcount budget, personnel development, absenteeism) to better than target levels. Managed excursions, root cause analysis, and drove resolution ensuring productivity of following shifts. Doubled as Director of Operations when needed.Module Manager-PhotolithographyOversaw and controlled installation of several ASML steppers and TEL tracks. Tracked down and resolved multiple yield issues using cross functional teams and manufacturing data. Developed Photo team via vendor training to improve maintenance reproducibility and understanding. Fostered spirit of continuous improvement and brought tool availability from an ailing 70% to ~90%.Module Manager-Dry etchEngineering and maintenance of equipment and processes. Driver of continuous improvement strategy leading to yield , productivity and improvements totaling >$3M per year. Implemented recycling of tool components. Changed pump-down strategy for etch tool loadlocks and chambers to give 1.6% yield improvement due to defectivity reduction. Moved processes to more capable platforms where greater selectivity and cooling were needed. Inspired team of engineers and technicians to question legacy issues and practices, and bring improvement suggestions to the table.

November 2002-September 2007: Xponent Photonics Inc. Monrovia, CA. Microfabrication Manager. Silicon PLC and III-V optoelectronic device manufacture.Management of engineers.and technicians. Installation, start up and integration of PECVD, dry etch, PVD, LPCVD, and diffusion toolsets. Responsible for all technical aspects of factory. Successfully outsourced production to 2 foundries.Developed vendor for outsourced novel Au-Sn solder bumping. Made multiple improvements to manufacturability and throughput through development of batch processes for 2 inch wafers. Developed foundries through knowledge sharing and discipline improvements.

October 2000-July 2002: Optical Micro Devices Ltd. Swindon. UK CVD and Etch Manager Optical waveguide and planar light-wave circuit development and manufacture. Process development, product integration. Start-up and qualification of novel 8 micron oxide etch process, 16 micron PECVD waveguide cladding BPSG, Electroplated Au-Sn solder bumping.

September 1999-October 2000 : Applied Materials Ireland Ltd. Senior Customer Engineer. CMP MIRRA Systems. Santa Clara Manufacturing and Final Test. 9 months in Intel Ireland and Israel. Documented and trained all procedures to customer. Led troubleshooting of complex issues in customer factory

September 1998-September 1999: Hewlett Packard UK Ltd, Ipswich, UK. Senior Process Engineer. CVD, dry etch and CMP responsibility. Several tool acquisitions and startups. III-V Optoelectronic devices.

September 1997-August 1998 Applied Materials Inc.. Newbridge, Scotland. CVD Process Engineer. Multiple customer new tool startups to customer specified standards. AMAT Global University. 3 months, Santa Clara applications lab 2 months.

October 1993-September 1997 University of Surrey. UK. Research Fellow. 4-year industrial R&D focused on ion implantation. Tuition and supervision of undergrads. 15 publications. List available on request.