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conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 1
Summaries from Day 3, WTMF 2018
Proceedings: magazine.photondelta.eu/wtmf18
On Friday morning June 22nd 2018, 14 short presentations were given summarising the work in the
breakout sessions on Thursday morning and afternoon.
This is an indexed PDF of all the presentations.
Fast Track Search - Click on
to jump to the respective video-presentation related to that topic.
The results of workingsessions Thursday June 21 2018
Click on the link for quick access to the video-presentation:
1. Tele/Datacom/ICTShort - Michael Robertson
2. Tele/datacom/ICTLong - Michael Lebby
3. Telecom/Datacom/ICTWireless - Peter Maat
4. Aerospace - David Mackey
5. Agro-food - Peter O’Brien
6. Back-end - Peter O’Brien
7. Industry & IoT - Christophe Py
8. Defence - Dan Hermansen
9. Healthcare - Peter Harmsma
10. EPDA - Twan Korthorst
11. Automotive - Twan Korthorst
12. Testing - Sylwester Latkowski
13. Front-end - Meint Smit
14. Ecosystems - Peter van Arkel
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 2
Tele, Datacom & ICT
June 22nd 2018
ApplicationsCATV and Radio
RF Analog
Active optical cable (AOC)
Fibre to the X (FTTX)
5G front and back-haul
On-board optics
Optical wireless (Li-Fi)
Undersea and long haul systems
Metro and optical transport
Datacenters
High performance computing
Wide Area Networks (WANs)
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 3
Fiber communications technology advancing since the 1970/80s
1310nm and 1550nm single mode wavelengths for distances >1km
850nm (980nm) for shorter distance multimode fiber interconnects
WDM technologies from ~2000 onwards
First used in telecom networks, now being implemented in datacomm short distance networks andinterconnects
Various forms of WDM including C (coarse), and D (dense)
Electronics
Advanced to the point today where the electronics assists the optical and optoelectronics
Modulation architectures evolved to allow increased information per bit of signal
PICs (photonic integration)
Now advancing for versitile functionality using InP, silicon photonics, dielectrics and polymers
System design
has evolved from 10/20year lifetimes to now 3-5yr lifetimes with reduced and more relatedtemperature specifications, amongst others.
Introduction
1. Higher speed performance both at component and PIC level: 100Gbps line rate (NRZ) →today we are approaching 50Gbps NRZ
2. Advanced, qualified and product PIC platforms (InP, SiP, Dielectric, Polymer) with 4, 8, 16 channels for 400, 800, and 1600Gbps aggregated data rate fiber optic transceivers
3. Lower power consumption for optical devices and transceivers
4. Larger bandwidth cross-section through face-plates whether via standardized pluggable transceivers, on-board optics, or full integration of optics immediately adjacent to the electronics
5. Removing need for laser burn-in
6. Simpler optical coupling and non-hermetic packaging
Critical challenges
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 4
Technological Gaps1. Being able to achieve $1/Gbps at 400Gbps for fiber optic transceivers for short distance (<10km) optical interconnects
2. Athermal designs where TE coolers are not needed to alleviate power consumption and stability (wavelength) issues
3. More advanced, higher performing, lower cost packaging platforms that may include standard packaging techniques such as Chip-on-board, passive alignment, integrated optics with electronics and plastic packages
4. True 100Gbps line rate optical devices and PICs to reduce reliance on modulation techniques such as PAM-4
5. Full hetero-structure PICs that include InP, polymer, dielectrics, silicon, SiGe for more advanced monolithic platforms
6. Burn-in requirement for lasers
7. Simple optical alignment and reliable non-hermetic packaged devices
Market: Fiber optic networks
Application: 400G and beyond transceivers
Challenge: Higher speed performance of PIC platforms – how to get to 100Gbaud/s?
Boundary conditions: Limit to integrated solutions, assume electronics will be available in the next 10 years
Technological challenges (product) Economical Challenges (business)
- Reduce drive voltage of modulators <2V ideally <0.5V for direct drive
- Improve loss/bandwidth trade-off
- Develop linear optical amplifiers (SOAs)
- High-speed RF models of electrical signals on PIC platforms
- Multi-level metallization
- Integrated RF terminations
- Improve overall fabrication robustness/accuracy
- Develop compensation techniques and control methods
Telecom applications need
performance
Datacom driven by cost $/Gb and
power
Break-out on challenges
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 5
Market:
Application: ICT Telecom/datacom
Challenge: Wafer level test and assembly – including optical coupling
Boundary conditions:
Technological challenges (product) Economical Challenges (business)In this box the challenges regarding the technology are described. This can both be on the functional
as on the physical level. i.e. properties of the light, footprint, etc. See the table with parameters in the part of the application in the document.
•Hybrid transceivers
•Wafer level test and assembly – including optical coupling
•PCMs for chip checking
•Etched facet lasers, or grating couplers for on-wafer laser test
•Validate assembly process
•Test most important building blocks first
•A system level model to compare characterisation
•Mode transformer in chips – reflection sensitivity of interfaces
•Athermal –use of phase shifters
•Testing and standarization
Economical challenges are based on business metrics like cost price reduction, scalability or reliability of supply.
• ...
• ...
• ...
• ...
• ...
Break-out on challenges
Market: telecom/data com
Application: PIC based optical transceivers, optical signal processing, wavelength tracking
Challenge: Low-power, self configuring capability for PIC chips to tolerate fabrication error (improve yield) and improve flexibility?
Boundary conditions: Simple, cheap, low power, fast, suitable for mass production
Technological challenges (product) Economical Challenges (business)
1. DemuX and Mux for WDM (DWDM or LAN-WDM or even CWDM)
2. Optical 90-degree hybrid
3. Interference based components
Challenges:
1. Process fluctuations create optical phase errors or coupling ratios which affect yield.
Self-configuring is needed to correct the error to make the optical circuits functional.
2. Possible solutions. Add heaters for thermal tuning. laser trimming or ablation.
3. Detecting errors
4. PN Junction
consume space on the wafer May consume power.
Need software to configure the
device.
More electrodes to control the
device
Break-out on challenges
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 6
Roadmap Gaps0. Car to X communication
1. When will the 400Gbps and 800Gbps nodes for both short distance optical interconnects (<10km) as well as long distance interconnects actually ramp? 100Gbps node is late by 2-3years.
2 Traditional standards like IEEE are slow and late. They typically take 2-3yrs, and by the time things are inked and documented, the industry has moved on to different platforms, footprints, and designs. MSA based activities are becoming popular – will andthey and should they supplant standards?
3. How to take optics closer to electronics for commercial based product solutions. When optical interconnect distances lessthan 3m are considered, electrical alternatives can be competitive both in performance and cost.
4. Ramping PIC based platforms such as Silicon Photonics with limited telecom/Datacom volume. To fully utilized the economies of scale, roadmaps should consider Silicon Photonics applications over and above Datacom/telecom ICT. Examples would be GaAs VCSEL 3D sensing for mobile phones where volumes may reach 2B units.
5. How to drive metrics from $10/Gbps (@400Gbps) down towards $1/Gbps (or lower) optical PIC based solutions. Could this be a SiP volume play, or could it be 6” InP wafers, or perhaps the implementation of polymers and dielectric material based platforms to both SiP and InP? High performance computing is driving towards $0.25 and $0.5/Gbps metrics for their interconnects.
8. Communication between super computers
9. cheap tunable transmitters
10. Gap: cryptography
Topic: High speed performance
Overlaps with chapters on: InP, Silicon, polymers, GaAs, assembly, packaging, testing, standardization, substrates, PIC devices, and front end processing. Also emerging healthcare, aerospace, automotive and industrial markets.
Topic: Multi-channel PIC platforms
Overlaps with chapters on: InP, Silicon, polymers, GaAs, assembly, packaging, testing, standardization, substrates, PIC devices, and front end processing. Also emerging healthcare, aerospace, automotive and industrial markets.
Topic: Lower power consumption photonic devices and PICs
Overlaps with chapters on: InP, Silicon, polymers, GaAs, assembly, packaging, testing, standardization, substrates, PIC devices, and front end processing
Topic: Larger bandwidth cross-section on faceplates
Overlaps with chapters on: Packaging, assembly, testing, cost modeling as well as InP, silicon, GaAs, polymer and dielectric platform materials.
Overlaps
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 7
Datacom/Telecom & ICT
IntroMarket
descriptionPIC cost Attributes Challenges Alternatives Building Blocks
Information sources
Conclusion
General introduction **
CATV and radio **
RF analog ** * ** **
AOC ** ** ** * **
FTTX ** ** * * *
5G * * *
OBO * * *
Li-Fi
Under sea system **
Metro optical transport
Datacenters
High performance computing
WAN **
General conclusion
Progress
Tele/datacomlong distance
June 21st 2018
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 8
13:00 – 13:10 General welcome and introduction
13:10 – 13:30 Introduction of participants + supply chain overview.
13:30 – 13:40 WGL presents challenges morning workshop + new challenges.
13:40 – 13:50 Ranking challenges from WG presentation. (Mentimeter)
13:50 – 14:20 Break-out sessions to develop solution chains per challenge 1.
14:20 – 14:45 Presentation of results
14:45 – 15:15 Break-out sessions to develop solution chains per challenge 2.
15:15 – 15:30 Presentation of results
15:30 – 15:40 Evaluation of results
15:40 – 15:55 Set action points and timeline
15:55 – 16:00 Closing remarks
Schedule
DefinitionsLong distance
Undersea
500-1000km and beyond
Optical transport
100-500km
Metro
20km to 100km
FTTH
Up to 5-20km
Long distance
Short distance
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 9
ApplicationsLong distance
Undersea
1000km+ undersea
Amplifier and repeater driven
Coherent and complex modulation
LiNoB, InP (polymer, silicon photonics growth)
Optical transport
Coherent technologies, complex modulation
Performance driven, smaller footprints
Switch architecture, wavelength conversion
Metro
Higher sensitivity to $/Gb/end user (both ends) up to 40/80km
Increasing use of coherent/modulation systems
Use of InP, SiP and new technologies (polymer)
FTTH
Higher sensitivity to cost
$/Gb, Power consumption, footprint, standards
Scie
nce
and
rese
arch • Company
name
• Academia– UCSB, MIT, Ghent, Tu/E etc
Man
ufa
ctu
rin
g eq
uip
men
t • Company name
• Ficontec
• Amricra
• Veeco
Fro
nt-
end
pro
cess
ing • Company
name
• AMSL
• EVG
Bac
k-en
dp
roce
ssin
g • Company name
• CST
• Helia
• DISCO
des
ign
to
ols
& s
ervi
ces • Company
name
• Rsoft
• Phoenix
• VLC
• Lumerical
• PhotonDesign
• Bright Photonics
Ap
plic
atio
n b
uild
ing • Company
name
• IBM
Introduction (device tools value chain)
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 10
Waf
eran
dep
itax
ialg
row
th • Company name
• Sumitomo
• AXT
• IQE
Fou
nd
ryan
dfa
b • Company name
• TSMC, ST micro, IMEC, Global Foundry, AIM Photonics
• Smart Photonics, GCS, CPFC, Jeppix, CST
PIC
san
dd
evic
es • Company name
• Intel, IBM, Avago-Broadcom, Finisar, Lumentum-Oclaro, Neo, Sumitomo, Acacia, Luxtera
• New smaller PIC players: LightwaveLogic, POET, Effect, Artic, etc
Sub
syst
ems • Company
name
• Juniper, Cisco,
• AristaNetworks
• Alcatel, NEC
• Nokia
• Intel
Net
wo
rks • Company
name
• Cisco, Juniper
• Huawei
• Alcatel
• Fujitsu
Med
ia
• Company name
• Microsoft
• Amazon
• Apple
Introduction (wafer, fab, devices, value chain)
System level: The collection of well-tuned functions, e.g. performed by separate boxes/pcbs or other photonic components, which jointly constitute an independently operating appliance.
Module/PCB/Box level: A device comprising a set of functions which cannot be used independently from other modules to constitute a system or a device.
Photonic Integrated Circuit level: a Photonic Integrated Circuit (PIC) is a single chip that fulfils optical functions.
Definitions
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 11
By Michael Lebby & Jeroen Duis
Overview of main challenges in upcoming 10 years
1000km + using 100Gbps NRZ to drive 800Gbps and 1.6Tbps systems
More advanced modulation techniques (FEC, higher optical budgets for modulation)NRZ, DUO-Binary, PAM4, QAM
Faster ICs with 100Gbps NRZ data rates (DSPs, FPGAs, gearboxes)
Fiber advancements: Few mode(s) fiber, multicore fiber, (O, L, C bands)
More efficient amplifiers/repeaters, programable ROADMs/WSS, passives
Longer spans, longer distances
Greater than 300km repeater spacings
Higher capacity per fiber (WDM, multicore)
Introduction (13:30 – 13:40)
By Michael Lebby & Jeroen Duis
Overview of main challenges in upcoming 10 years
More efficient technologies for PICs
InP → PIC platform for 100Gbps NRZ (100GBaud)
Silicon Photonics → PIC platform for 50/100G + integrated electronics
Polymer PICs for low voltage 100Gbps NRZ (100 Gbaud)
PICs for telecom performance/specs
Advanced silicon electronics (to assist optics)
More functional/complex DSPs (with AI?)
Silicon electronics for FEC, modulation, higher optical performance
Lower cost coherent IC designs for chip architectures
Dynamic implementations IC’s: Switch of CDR for non used links
Introduction (13:30 – 13:40)
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 12
By Michael Lebby & Jeroen Duis
Overall system price ($/Gb/s) for long haul systems
Chip cost per applicationHigh performance low volume vs high volume low cost
High startup cost vs pay as you go
Larger wafers lower real estate costs for InP (and GaAs), (other markets driving cost...)
Volume drivers for silicon wafer platforms (long haul volume is too small)
Component complexity and density (more functionality / mm2 or even mm3)
Integral packaging solutionsMore effective and lower cost packaging for 50 and ideally 100Gbps NRZ solutions
Power BudgetMore optimized photodiode sensitivity vs laser output power for optical budgets
Intermediate amplifiers (SOA), programmable WSS/ROADMs and other passives
Introduction (13:30 – 13:40)
By Michael Lebby & Jeroen Duis
Standards
Faster standards process IEC 86B, WG4? Better than 3 years. Less than 1 year needed
Avanced recognition of MSAs to replace standards (as footprints evolving quickly)
Reliability of telecom devices still applicable in other markets?
Can reliability be eased through software design/architecture? SDN + perhaps?
Design, routing, processing, testing, packaging -> prevents overpromising
Introduction (13:30 – 13:40)
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 13
Next we are going to deterimine the main challenges that need to be discussed using Mentimeter.
The options are determined by the market working group, but you can all add additional challenges when needed. The working groups have described some of their challenges in a template shown on the next slide.
All participants can divide 100 points over the challenges to reflect how important they find a challenges (more points = more important)
Instruction to challenges and voting
Market: long haul
Application: terrestrial networking
Challenge: Lower cost, higher performance coherent architectures
Boundary conditions: Using 100Gbps NRZ (100GBaud) components to drive 400/800/1600G system design
Technological challenges (product) Economical Challenges (business)In this box the challenges regarding the technology are described. This can both be on the functional
as on the physical level. i.e. properties of the light, footprint, etc. See the table with parameters in the part of the application in the document.
•Must operate at 100Gbps NRZ/100GBaud (for 800 and 1.6Tbps system design)
•Must be able to work with tighter optical link budgets for better signal integrity
•More advanced coherent and multi modulation schemes/architectures
•Faster standards for new smaller footprint, higher performing repeaters/amplifier
designs
•More intelligent IC design for DSP for higher signal integrity.
•Denser WDM designs with more efficient mux/demux
•
Economical challenges are based on business metrics like cost price reduction, scalability or reliability of supply.
•Performance metric → 100Gbps
NRZ
•Faster optical devices with lower
power designs (InP, polymer, silicon)
•More intelligent ICs using DSPs with
FEC etc
•More complex PICs (including
packaging) for coherent 100Gbps
NRZ systems.
Break-out on challenges – long haulterrestrial
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 14
Market: long haul
Application: submarine
Challenge: Faster data rates, longer repeater spans, more efficient amplification (fiber amplifiers)
Boundary conditions: Utilize baseline 100Gbps NRZ (100GBaud) data rates/optical budgets (today most advanced system is 400Gbps aggregate)
Technological challenges (product) Economical Challenges (business)In this box the challenges regarding the technology are described. This can both be on the functional
as on the physical level. i.e. properties of the light, footprint, etc. See the table with parameters in the part of the application in the document.
•Must operate at 100Gbps NRZ/100GBaud (for 800 and 1.6Tbps system design)
•Must be able to work with tighter optical link budgets
•Coherent and multi modulation schemes/architectures
•Faster standards for new smaller footprint, higher performing repeaters/amplifier
designs
•More intelligent IC design for DSP to assist optics in long haul fiber
•Longer repeater spans? New designs?
•Denser WDM designs with more efficient mux/demux
•More datacentre designs being submarine (heat issues) as per Microsoft in 2018
Economical challenges are based on business metrics like cost price reduction, scalability or reliability of supply.
•Performance metric → 100Gbps
NRZ
•Faster optical devices with lower
power designs (InP, polymer)
•More intelligent Ics using DSPs with
FEC etc
• Integrity of submarine datacenters
and technology to support them.
Break-out on challenges - long haulsubmarine
Market: long haul
Application: metro
Challenge: Cost effective, low power consuming, PIC based coherent components for high speed interconnect
Boundary conditions: 100Gbps NRZ data rates/optical budgets that are more price sensitive
Technological challenges (product) Economical Challenges (business)In this box the challenges regarding the technology are described. This can both be on the functional
as on the physical level. i.e. properties of the light, footprint, etc. See the table with parameters in the part of the application in the document.
•Advance components performance to 100Gbps NRZ/100GBaud (for 800 and 1.6Tbps
system design)
•More advanced and cost sensitive coherent and multi modulation
schemes/architectures
•Faster standards evolution for new smaller footprint, higher performing
repeaters/amplifier designs
•More intelligent IC design for DSP to assist optics in long haul fiber
•More emphasis on lower power solutions using lower power optical and electronic
components
•Lower system cost design using advanced coherent communications techniques.
•Denser WDM designs with more efficient mux/demux
Economical challenges are based on business metrics like cost price reduction, scalability or reliability of supply.
•Performance metric → 100Gbps
NRZ (100GBaud)
•Faster optical devices with lower
power designs (InP, polymer)
•More intelligent ICs using DSPs with
FEC for example to improve signal
integrity at 100Gbps NRZ
(100GBaud)
•Advanced manufacturing of PICs
using InP, silicon, polymers,
dielectric materials
Break-out on challenges – long haulmetro
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 15
Market: long haul
Application: FTTH
Challenge: standardized low cost optical modules with higher levels of intelligence
Boundary conditions: 25G and 50G modules with intelligence (OTDR, single mode, small footprint, low power, multi wavelength, WDM)
Technological challenges (product) Economical Challenges (business)In this box the challenges regarding the technology are described. This can both be on the functional
as on the physical level. i.e. properties of the light, footprint, etc. See the table with parameters in the part of the application in the document.
•Advance network design for 50Gbps (50GBaud).
•Lower module, interconnect, network cost using both coherent and non-coherent
technologies
•More advanced non-coherent and coherent multi modulation schemes/architectures
•Faster standards for new smaller footprint, higher performing OLTs
•More intelligent IC design for improved signal integrity
•Denser WDM designs with more efficient mux/demux
Economical challenges are based on business metrics like cost price reduction, scalability or reliability of supply.
•Performance metric → 50Gbps NRZ
•Faster optical devices with lower
power designs (InP, polymer)
•More intelligent ICs that include
OTDR and other fault diagnosis
intelligence.
•Volume product of PIC technologies
that meet the low $/Gbps metrics
($1-2/Gbps range)
Break-out on challenges – long haulFTTH
Go to www.menti.com
89 90 49
Ranking challenges (mentimeter)
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 16
During the break-out session there will be three or four groups that each will tackle a challenge using the worksheet in the next slide.
The goal is to develop a “solution-train” over all supply-chain shackles to tackle the challenge.
This includes the design of the system, modules and PICs and the technologies.
Instruction break-out sessions
Break-out session part 1
Group 1:
Test equipement for 100G
- Sylverster
- Boudewijn
- Michael
- Makoto
Group 2:
Operate at 100Gbps NRZ
- Erwin
- John
Group 3:
Efficient PDK and circuit modelling for
complex circuit
- Stephane
- Yu
- Jeroen
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 17
Technology selection:
100G NRZ operation
- DML (<20km
- EML (Mach zehnder)
- LiNbO3
- InP
- Polymer
- Silicion Photonics (SIP)
- Drive voltage?
- Laser power?
Route to 1Tbit single fiber transmission from 20k m to 1000 km
Modulation techniques
- Coherent, QAM (8/16/32/64/ etc.)
- DSP speed?
DWDM
- O, L, C band
Photodetectors 80Ghz
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 18
Challenges:
- chip status: R&D
- technology selection
- product development
- packaged design
- electronics development (drivers & TIA & DSP)
- testing
- high speed electrical interface
Solution name: Solution per supply-chain shackle Challenges to realize the solution
Product
System example Bit Error Rates,Eye Diagrams ‘as per mask criteria’Type of modulation schemeFEC, Dispersion management
Module example Wavelenght, Noise performance (linewidth, RIN) Output power, recievedpower, temperature performanceEMI testingRefrence Tx and RX, RF testing (subassembly)Crosstalk
>100GHz signal integrity
PIC example Small signal S-parameter testingLarge signal testingCalibration, Crosstalk
>100GHz bandwidth sources and detectors
Tools EPDA / PDKs toolsCalibrated models in simulation tools,Test element gourps for 100G
Interpretation of test results
Process
Front endWafer-level sampling performance100GHz Process Controll Mmodules / wafer verification cell,
Chips selection strategy /performance binning
Assembly100GHz interconnectsRf design
PackagingConnector style (optical and electrical)RF design
Interconnects
TestingGolden sample, calibration Shared test facilities with 100 GHz capabilitie
Market: Long houl
Application:
Challenge: Test equipment 100GHz
Boundary conditions: 100GHz performance
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 19
Challenges: Efficient PDK and circuit modelling for complex circuit (Design for Manufacturing)
Standardisation on measurement methods (get equipment builders to build specific testing protocals.
Library’s are missing
Parametric models -> standardised
No statistics, needs to be build up over time and needs components from multiple runs to provide a complete view
Building blocks are not characterised -> Long time for manual characterisation of each individual building block
Need a broad set of test equipment for the initial characterisation that might not be required during the production any more.
How to perform 100Gb RF testing on wafer level?
Group 3
Solutions
Standardised test cell with full functionality (statistics) -> allows comparison
Technology Maturity -> Run multiple runs with identical process
Automated test equipment for testing test cells
Pre-invest in the characterisation
Measurement Methodology IEC86B WG4
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 20
Tele/datacomwireless
AIST – JP LioniX Int. – NLUISTC – CH RMIT – AUTUE – NL ASTRON – NL
Wireless........
5G
Satcom
Radar
Optical wireless communication
…
Picture: ViaSat
Integrated Photonics:
Fibre-optic Interconnections
Microwave-photonic Signal Processing
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 21
Approach:Applications in the WTMF document
5G
On-Board Optics
RF Analog
Optical Wireless Communication Li-Fi
Challenges:
Update of earlier defined challenges
New challenges
Challenges:
Focus on a single application: 5G
Challenges depend strongly on the type of application
Application: 5G
Antenna
Amplifier
Mixer / Filter
Modulated Array (256)
Laser
Photonic BeamFormer
WDM Mux/Switch
Link
WDM Demux
Coherence detector
L.O.
Central
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 22
Application: 5G
o RF interfacing to modulator
Budget for the system? Who’s paying?
o Hard to package
Who should integrate the optical/electrical components?
o Electrical and optical interfacing to the modulator array
o Thermal design laser and photonic beam former
What is the form factor?
o Bandwidth limitation due to poor performance of the A-RoF link
o Low modulator cross-talk
Time to market?
Antenna
Amplifier
Mixer / Filter
Modulated Array (256)
Laser
Photonic BeamFormer
WDM Mux/Switch
Link
WDM Demux
Coherence detector
L.O.
Central
Challenges:
Questions:
Supply chain is identified
Next Steps
Further analysis of the challenges
Descriptions of the wireless applications needupdate
Telecons for further discussions
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 23
Aerospace
June 22nd 2018
Aerospace Applications
Main impressions from the workshop session:
Defense and aerospace are markets that currently don’t require much push for photonics as the pull is already there.
Desire for SWaP and overall system performance improvements give a large pull
Larger market potential then is perhaps expected that can enable growth. It has a good mix of lower volume, higher value products but also scope for medium to high volumes.
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 24
Aerospace Workshops
We focused on 3 narrower applications:
LIDAR application - Highlighted importance of identifying capabilities and differences of PIC platforms and stages of the supply chain
Microwave photonics for Radar signal processing/conditioning - enables very broadband applications
Free space optical satellite communication -enables new satellite markets vHTS and QKD
Aerospace ApplicationsRoadmap Actions: Identify and outline more key applications and any related existing development work.
Identify photonic platforms that can best serve each application now and how better to serve the applications in the future.
Identify best ways to improve the supply chain for a bottom up market approach: continuous process improvement approach as well as advancing platform capabilities.
WTMF roadmap shall is a key tool to make PIC technology adoption have fewer barriers for applications/new entrants looking to adopt PICs.
OCT Application
Platform Comparison
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 25
Agri-Food
June 21st 2018
AWG Stakeholder Selection
1. Regulators & Public Bodies (eg. FDA, EPA)
2. Researchers & Universities
3. Industry (eg. food producers, processors, equipment vendors)
4. Large Technology Companies / Mobile Platforms (eg. Apple, Amazon [Whole Foods])
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 26
Technology Examples
1. Integrated Photonics + Energy Harvesting + Communication (eg. remote sensing)
2. Remote Gas Sensors (NH3 for Animal Growth and Health)
3. Integrated Photonics + Microfluidics
4. Portable Spectrometers (eg. hyper-spectral imaging for plant health)
5. MIR Sources, Detectors & Waveguides (> 2000nm)
52
Technology Challenges
1. Very wide spectral range from UV to Mid-IR
2. Hybrid PIC-to-PIC integration (align with backend TWG)
3. Price Points (1$ -> 10$ -> 100$ -> 1,000$ -> 10,000$)
SiN InP Si
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 27
Back-end
June 21st 2018
General Introduction
Current
‘Gold Box’ Package
Future
‘Fiber-Free’ Package
10-100 times cheaper
component-level
packaging
wafer-level
packaging
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 28
Optical Integration Electrical Thermal
GratingCoupler
EdgeCoupler
LensedFiber
FiberArray
HybridIntegration
MicroOptical
EndFacet
Wirebonding
Flipchip
2.5D 3D
ActiveCooling
PassiveCooling
Photonic Integrated Circuit
MicroOptics
Optical FiberFree SpaceInterposer Interposer
PCB Micro-Interposer
Hermetic
Non-Hermetic
Wirebonding
Flipchip
2.5D 3D
Mechanical
Backend Process Steps
1. Non-bonded optical fiber interconnect for pluggable, free-space and disposable applications withless than 0.5 -> 0.1dB loss per interface
2. Wafer-scale micro optics for pluggable/free-space connectors (grating and edge coupled) withexpanded beams to relax mechanical alignment tolerance to > 10um
3. Passive optical fiber bonding with less than 0.5 -> 0.1dB loss per interface with unit packagingtimes going from minutes to seconds
4. Combined optical and electrical (RF to 60GHz) interposers for PIC and IC co-integration
Challenges (optical & electrical)
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 29
1. Active thermal management with reduced power consumption (eg. on-PIC TECs)
2. Passive thermal management with new thermal interface materials
3. Packaged PIC modules with increased thermal resilience (eg. withstand solder reflow)
4. Low cost encapsulation techniques (eg. LED polymer encapsulation)
Challenges (thermo-mechanical)
Thermal Control
Environment
1. Less than 1dB coupling loss for PIC-to-PIC interfaces (eg. InP to SiN)
2. Coupling with spectral range of 100nm @ -3dB
3. More robust PIC-to-PIC bonding techniques (eg. non-epoxy)
4. Increased number of optical interconnects (> 20 channels)
Challenges (hybrid PIC integration)
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 30
Top 10 challenges for sensors (healthcare, agro-food, Industry & IoT) morning session
1. Disconnect between technical capability, biological understanding, and clinical application2. Development of mid IR sources and spectrometers3. Exploration of clear application for teraHertz imaging, thermal Imaging, microwave Imaging,
ground penetrating radar, (sun induced) chlorophyll fluore4. Sensor specificity / selectivity (does it actually measure what it is supposed to measure?) In
particular for POC.5. Microfluidic integration and other sampling strategies6. Bridge gap between photonics community and agrifood community (as well for industry as for
academia)7. High speed/ sensitive sensor and imaging systems for food inspections8. Assuming a need for PICs, diversity of potential applications, use cases, and form factors creates
additional challenges9. For health care: bridge the gap between the photonics technology and rather conservative
doctors10.LED technology for plant growth modules and/ or imaging applications
Top 10 challenges for sensors (healthcare, agro-food, Industry & IoT)morning session1. Disconnect between technical capability, biological understanding, and clinical application2. Development of mid IR sources and spectrometers3. Exploration of clear application for teraHertz imaging, thermal Imaging, microwave Imaging,
ground penetrating radar, (sun induced) chlorophyll fluore4. Sensor specificity / selectivity (does it actually measure what it is supposed to measure?) In
particular for POC.5. Microfluidic integration and other sampling strategies6. Bridge gap between photonics community and agrifood community (as well for industry as for
academia)7. High speed/ sensitive sensor and imaging systems for food inspections8. Assuming a need for PICs, diversity of potential applications, use cases, and form factors creates
additional challenges9. For health care: bridge the gap between the photonics technology and rather conservative
doctors10.LED technology for plant growth modules and/ or imaging applications
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 31
Market: Healthcare/agrifood
Application: sensors for detection/diagnostics
Challenge: There is a disconnect between the problems that matter and the technology available
Boundary conditions:
Technological challenges (product) Economical Challenges (business)
Lack of multidiscipline approach/scientist/engineer to best address problem
Lacking infrastructure (other parts of the system) to bring technology to market
Determining value addedTakes time and money to train
Break-out on challenges (1)
Market: health / agro / IoT
Application: gas sensing / medical imaging
Challenge: mid-IR and THz systems: availability / performance / cost
Boundary conditions: -
Technological challenges (product) Economical Challenges (business)
• THz building blocks not available as standardized components, though technology has
been demonstrated.
• Sharp absorption peaks over broad wavelength ranges: multiple source requirements
• Sensitivity requirements: for some applications, ppm is state of the art, ppb needed
• In liquids: spectral fingerprints broaden, reducing selectivity.
• Spectral fingerprints in THz are very complex, making it hard to identify which molecules
cause the resonances.
• Spectral response in THz to measure humidity depends on soil itself. This poses a
calibration challenge.
• Believe that represented material platforms address longer wavelengths. How to get IR
sources / detectors / filters / … in the current ecosystem.
• Frequency combs are expensive and
large
• QCLs: same
• Ppb sensitivity may enable point-of-
care diagnostics based on breath
analysis. Opportunity.
Break-out on challenges (2&3)
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 32
Market: Health care / Clinical diagnostics / Ag / Food
Application:
Challenge: Ensuring specificity and selectivity of the detection
Boundary conditions:
Technological challenges (product) Economical Challenges (business)
• (1) Spectroscopy: Detecting a spectral feature in the context of everything else
• (2) Evanescent field sensing: specificity of a recognition molecule and strategy for treating
the rest of the sensor to reject nonspecific binding
•Spectroscopy; depends on resolution of detection and development of libraries of reference
spectra. Detection requirements will depend on complexity of the sample being measured (i.e.
is there a unique spectral feature far from everything else, or do you need very high resolution
to pick out a feature)
•Evanescent field based sensing: Define specific requirements for antibodies or other capture
molecules (dissociation constant, specificity). Methods for anti-fouling coating. May also need
to combine with sample prep (filtration). Sensor / sampling co-design.
•Packaging (sensor functionalization for specificty)
•Signal processing methods to enhance specificity
Economical challenges are based on business metrics like cost price reduction, scalability or reliability of supply.
•Cost (may be expensive to get high
specificity; will the market support?)
• IP and licensing landscape (potential
need for consortium reagent
development)
Break-out on challenges (4)
1. Need more end-user representation to ensure technical development matches market needs2. Lower cost packaging and integration platforms3. Build trust amongst industrial partners, roadmap developers, R&D to ensure the roadmap drives
developments and innovation4. Education and workforce development5. expansion of photonic platforms to longer wavelengths6. lacking building blocks for sensing7. Full hetero junction PICs8. Industrial applications9. Low temperature (<100c) packaging10.understanding system infrastructure for sensor11.Precision agriculture12.Environmental monitoring13.Athermal designs
Roadmap gaps (in order of importance)
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 33
Sensors (Automotive, Aerospace, Defence)
June 20 – 22nd 2018
The Defence market covers
Submerged
At sea
At land
In Air
In Space
Applications improved by PICs
Optical
Microwave
Applications
DEFENCE
AEROSPACEAUTO-
MOTIVE
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 34
Automotive Sensors
For a fully autonomous vehicle each sensor type (Radar, Camera, LiDAR) will be represented roughy six times to achieve long/short range and 360° coverage
Road Condition Monitoring
To meet these use cases we need support for different wavelengths and polarization….
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 35
Can photonics be used to create a hemisperical laser warning sensor with direction finding capabilities?
What are the benefits of photonics?
What are the challenges to realize this application?
Laser warning sensors
Demands for Command & Control systems are higher than ever before
Communication systems are keyelements to realize the future C2-systems
Invisible
Light and compact
License free
Data rates from 1Gb/s to 1Tb/s
Robust and jamming-resistant
Wideband Optical Communication
Laser communication has a high volume potential
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 36
The need for adaptable, phased array and software definedradars is increasing to avoid frequency conflicts and provide new features like
Countering stealth technology in air and on ground
Non-detectable radar waveforms
Adaptable to multiple target types
Low Slow Small (drones)
Fast (transport planes)
Ultra-sonic (jets, missiles andgrenades)
Ground (persons and vehicles)
Agile Microwave Radar
Find the applications where PICs have a huge impact (x10)
Apply a structured method for analysis
Match applications, market needs and unique selling points
Applications to be ranked by impact of introducing PICS
Differentiate to impact!
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 37
Integrating electronics and photonics is a challenge
Technical challenges were pointed out regarding
Reduced SWaP-C solid state LiDAR applications seems to score a high rank
A number of markets were assessed and scored where PICs can be used for LiDAR
High Volume requires High Reliability
Defence is High Margin & technology driven
Reduce SWaP-C to differentiate!
Reducing Size, Weight, Power and Cost
Healthcare: starting point
• Chapter 3.3 under construction: considerable work done, needs further updates• Considerable market potential
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 38
Healthcare: starting point
• Few applications no input yet• Other topics need further updates
Top 10 challenges for sensors (healthcare, agro-food, Industry & IoT)morning session1. Disconnect between technical capability, biological understanding, and clinical application2. Development of mid IR sources and spectrometers3. Exploration of clear application for teraHertz imaging, thermal Imaging, microwave Imaging,
ground penetrating radar, (sun induced) chlorophyll fluore4. Sensor specificity / selectivity (does it actually measure what it is supposed to measure?) In
particular for POC.5. Microfluidic integration and other sampling strategies6. Bridge gap between photonics community and agrifood community (as well for industry as for
academia)7. High speed/ sensitive sensor and imaging systems for food inspections8. Assuming a need for PICs, diversity of potential applications, use cases, and form factors creates
additional challenges9. For health care: bridge the gap between the photonics technology and rather conservative
doctors10.LED technology voor plant growth modules and/ or imaging applications
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 39
Market: Healthcare/agrifood
Application: sensors for detection/diagnostics
Challenge: There is a disconnect between the problems that matter and the technology available
Boundary conditions:
Technological challenges (product) Economical Challenges (business)
•Lack of multidisplinary approach/scientist/engineer to best address problem
•Lacking infrastructure (other parts of the system) to bring technology to market
•Determine added value for end user•Takes time and money to educate
Break-out on challenges (1)
Market: health / agro / IoT
Application: gas sensing / medical imaging
Challenge: mid-IR and THz systems: availability / performance / cost
Boundary conditions: -
Technological challenges (product) Economical Challenges (business)
• THz building blocks not available as standardized components, though technology has
been demonstrated.
• Sharp absorption peaks over broad wavelength ranges: source requirements
• Sensitivity requirements: what is available is down to ppm, need to go to ppb
• Spectral fingerprints: broaden in liquids, reducing selectivity. Very complex in THz, making it
hard to identify which molecules cause the resonances.
• Spectral response in THz to measure humitiy depends on soil itself. This poses a calibration
challenge.
• None of the represented material platforms can address (is that so?) longer wavelengths.
How to get IR sources / detectors / filters / … in the current ecosystem.
• Frequency combs are expensive and
large
• QCLs: same
• Opportunity: humidity detection takes
only ppth
Break-out on challenges (2&3)
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 40
Market: Health care / Clinical diagnostics / Ag / Food
Application:
Challenge: Ensuring specificity and selectivity of the detection
Boundary conditions:
Technological challenges (product) Economical Challenges (business)
1.Spectroscopy: detecting a spectral feature in the context of everything else
• Depends on resolution of detection and development of libraries of reference spectra.
• Detection requirements will depend on complexity of the sample being measured. i.e. is there
a unique spectral feature far from everything else, or do you need very high resolution to pick
out a feature)
2.Contact-based (evanescent field) sensing: specificity of a recognition molecule and
strategy for treating the rest of the sensor to reject nonspecific binding
•Define specific requirements for antibodies or other capture molecules (dissociation constant,
specificity).
•Methods for anti-fouling coating.
•Coating lifetime
•May also need to combine with sample prep (filtration). Sensor / sampling co-design.
•Packaging (sensor functonalization for specificity)
•Signal processing methods to enhance specificity
Economical challenges are based on business metrics like cost price reduction, scalability or reliability of supply.
•Cost (may be expensive to get high
specificity; will the market support?)
• IP and licensing landscape (potential
need for consortium reagent
development)
Break-out on challenges (4)
1. Need more end-user representation to ensure technical development matches market needs2. Lower cost packaging and integration platforms3. Build trust amongst industrial partners, roadmap developers, R&D to ensure the roadmap drives
developments and innovation4. Education and workforce development5. Expansion of photonic platforms to longer wavelengths6. lacking building blocks for sensing7. Full hetero junction PICs8. Industrial applications9. Low temperature (<100c) packaging10.understanding system infrastructure for sensor11.Precision agriculture12.Environmental monitoring13.Athermal designs
Roadmap gaps (in order of importance)
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 41
Break-out sessions on solutions(Afternoon session) – supply chain
Group 1:
Development of mid IR sources and
spectrometers
Group 2:
Sensor specificity / selectivity (does
it actually measure what it is
supposed to measure?) In particular for POC.
Group 3:
Microfluidic integration and other sampling strategies
Solution name: Solution per supply-chain shackle Challenges to realize the solution
Process
Front end
PIC (with or without channels)Microfluidics wafer with channelsMicrofluidics with semi-standard cells
Planarization for good hermetic sealing of the lid with the PICCustom design wafers
Assembly
Bonding the microfluidics to the PIC either wafer level or lids to wafers.Typically adhesive bonding (epoxy). Can be also direct bonding (for that the requriement for planarity is higher)
Ensuring leak-proof sealingAccuracy of positioning is not an issue now as they are not verysmall typically. Only for certain fluids where submicronappertues?channels are needed.
Packaging
IO ports for fluids, optical, and electrical… Eeasy/fast optical inut&output optical coupling, specially fordisposable chips. High accuracy specially needed for single mode fibersFunctionalizing is typically done at the end (temperature and life time are boundaries)
Interconnects
Wire bonds, flip-chip, TSB Incorporating TSBs
Testing
Sampling Temperature control
Market: Healthcare
Application:
Challenge: Microfluids
Boundary conditions:
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 42
Sensor specificity / selectivity
PIC coating packaging storage use
reader
interpretation
•Front-end / back-end supply chain
•Sensing device
•Exposure window
•Wafer level? •Process: low-temperature
•Non-destructive bonding
•uFluidics•Optical interface•Electrical interface
•Shelf life •Apply sample fluid
•Clinician•Farmaceutical
company•AI
•Decent engineering
• Test• Cost• Who pays?
•Spotting / printing/ ALD / …•Primary layer: chemical manufacturer
•Non-specific binding•Antibodies: assay developer / DNA sequencing
•Replace this by synthetic surfaces. Gap in supply chain•Selectivity / specificity / life time
•Stabilization reagent
!!
!June 22 2018 - University Twente - NL -WTMF 2018
Mid-IR sensing (1-10 um)
Health – agro – food – IoT
Market pull is real
Challenge: sources QCL: power, tunability, costsSupercontinuum: size, power, costsThermal: low power, uniform emissionRare-earth: low TRL
Challenge: detectors need cooling, bulky
Integration: not possible in ecosystem
Alternative: RamanOn-chip: waveguide Raman signal to be suppressed
Challenge: ecosystem of IR sensing unexplored. Align with MIRPHAB / AIM initiativeUnderstand supply chain & business case, take if from there.
June 22 2018 - University Twente - NL -WTMF 2018
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 43
General recommendations / actions
For mid-wave IR: Get a better understanding of what is available and what is neededIdentify relevant partners: knowledge/expertise/infrastructure/etc.
Need to add mid-IR platform to the eco system?
Are we talking about a photonics roadmap or an integrated photonics roadmap? Get clarification on this matter. How is the end user best served?
Make sure education is covered: stimulate multidisciplinary thinking.
Most importantly: end-users are absent in the community. Facilitate the discussion between and users and technological developers / R&D. Make sure the process involves multidisciplinary discussions.
June 22 2018 - University Twente - NL -WTMF 2018
EPDA and Building Blocks
June 22nd 2018
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 44
Workshop Participants
Andre (VPIphotonics, Germany)
Martijn (Aarhus University, Denmark)
Weiming (PITC, Netherlands)
Zhiyong (SEMI @ CAS, China)
Martijn (Berenschot, Netherlands) - moderator
Twan (Synopsys, Netherlands) - chair
June 22 2018 - University Twente - NL -WTMF 2018
We believe this is of pivotal importance
We are surprised the workshop was cancelled/shifted under EPDA
We need to:
Identify building blocks from an application perspective
Identify what parameters are important per building block
Set required specifications on a time-line
To achieve this, we need:
A champion
A process
Commitment from the Application Groups to provide input
Building Blocks
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 45
June 2017: WTMF in Den Bosch
Minutes and summary slides
October 2017: AIM / IPSR-I meeting in Albany
Summary slides
June 2017 – May 2018: Interactions with WG members
Excel Spreadsheet with challenges: inputs collected
Concern highlighted: Lack of input / feed-back from the designer community
Unfortunately, only limited contents for EPDA in the WRIP document
Progress EPDA
EPDA is defined as design automation for photonic integrated devices, circuits and systems, manufactured in a monolithic/hybrid/heterogenous fabrication technology
The tools & flows need to support PDK driven as well as custom design
EPDA SCOPE
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 46
Tool and Flow Capabilities
PDA, EDA, PDA-PDA, EPDA, ….
At device, circuit and system level
Contents
PDKs, IP libraries
“Infrastructure”
Standardization (of terminology)
EPDA Identified Key Challenge Areas
EPDA Identified Key Challenge AreasEPDA Roadmap information collection
I think in general it would be very nice to have a separate column where it is mentioned how
the EDA industry addresses this at the moment. Lots of issues might actually already have been
solved, and - if not - the EDA tools might give us some inspiration. This is useful background
anyway for all photonics people, show have nevre played with the current EDA tools.
(table initially prepared by Twan Korthorst, based on input from two roadmapsessions: Den Bosch Jun 2017 and Albany Oct 2017)
(May 2018: table updated with input from: Andre Richter, Martijn Heck, Pieter Dumon)
Available Today (y/n) Improvement Area's Required by (year)
Key challenges Area 1: Tool and flow capabilities A lot is already in place I think. Depending on the application area, some further developments are still required to link the component to the circuit and the circuit to the system level.
1.1 Point Solutions that work i
1.2 Integration of PDA & PDA Solutions i standardized data formats for interfacing
1.3 Integration of PDA & EDA Solutions i standardized data formats for interfacing
Technology level simulations
Component level simulations
Passive devices i
- basic linear operation is well covered currently.
- possble improvement: accuracy of simulation tool when insertion losses of passive
components become too low, e.g., the coupler in a 100M Q resonator.
- possible improvement: roughness and roughness correlation lengths should be taken into
account for loss and - especially - backscatter simulations. This requires foundry input through
the PDK.
- possible improvement: nonlinearities, in all varieties, become increasingly importnat, e.g., for
supercontinuum generation. Currently this is time-intensive to simulate.
Functional devices i electro-optics, thermo-optics
Active devices i electro-optics, thermo-optics, quantum dots
Simulation tools are available, at the physical level and the circuit level, addressing various
abstraction levels. The trade-off is clear: in-depth simulations for gain spectra and circuit-level
simulations for (complex) laser structures. With the advance of analog applications (noise, side-
mode suppression, ...) and ultrafast and high-power applications (spectral hole-burning, carrier
heating, carrier field screening, etc.), there will be a drive to implement more physics into the
circuit-level simulators.
Circuit level simulations
Schematic capture i automation, cloud-based solutions
Time-domain modelling i speed vs accuracy, simplify usage Challenge: phase and amplitude noise spectra typically require simulation over long timescales.
Frequency-domain modelling i simplify usage
Including Thermal i
detailed consideration (currently very
limited)
Challenge: What to include here. Device heating can be modeled relatively easily, local circuit
hot spots are harder, and global temperature effects will depend on the package (probably
addressed below).
Including Process (variations) i
simplify usage, automated capture of
performances
Challenge: to get this into a PDK. Sidewall and surface roughness and correlation length, index
variations, linewidth variations, thickness variations, and sidewall angle variations are all
required, eventually.
Layout implementation & verification
(Assisted) routing
Auto-routing
(Assisted) placing
Auto-placing
Circuit Synthesis
currently ves limited, very much needed for
general designs
DRC
LVS
Parasitics: cross-talk, scattering, ..
Challenge: Optical crosstalk and RF crosstalk need to be addressed. This is geometry
dependent, obviously. It is hard to see how this can be done without some kind of 'ray tracing'
like efforts (optical). For analog applications, RF crosstalk will be really limiting. The solution to
alleviate the requirements on the EPDA tools could be to implement various isolation
approaches by default. This can include EM shielding and active (= absorbing) areas between
components.
System level design
The question here is to which extent the wheel needs to be reinvented. A lot can be
learned/borrowed/stolen from our electronics friends…
Thermal
RF
Package
Co-design with electronics
Cost-modelling
Key challenges Area 2: Contents
The key challenge is to ensure processes will be dialed in, will be stable, and will be available
over a certain period of time (5 - 10 years). The cost of developing PDKs and IP Blocks becomes
unfeasible otherwise. In general I would give this ‘contents’ challenge a higher priority than the two others
2.1 Photonic PDK (foundry provided) i
standardized models/parameters,
automated update processes,
data/model validation/verification
2.2 EPDA PDK (foundry provided)
2.3 IP libraries (3rd party provided) i
currently very limited,
need to be based on open (standardized)
interfaces
How will this be done? What is the business model on who pays who and when? How will this
be enforced?
Common standard to be adopted?
yes, needed (could be more then one
standard)
Material properties
The challenge here is typically foundry IP: materials, processes, geometries, etc., will these be
disclosed? What is disclosed in, e.g., a 32-nm CMOS process?
Cross-sectional information
Process flow information
Compact models (frequency domain)
Compact models (time-domain)
Process statistical data (in-line)
Measurement data (off-line)
Design Rules
Shared tech file infrastructure
Shared electronic & photonic PDKs
Key challenges Area 3: Infrastructure
I would like to see 'education and training' on this roadmap. Students at the universities are
educated in EDA tools, but not in PDA tools. We should ask ourselves the question: let's
assume everything goes according to plan in this roadmap. Then - by 2025/2030 - we have
tools that can simulate everything, but who will be the users? How long will it take a PhD
student to get up to speed before he/she can design a PIC? How long for a new employee at a
start-up or multinational to be part of the constructive workforce? Developing a common language (component names, parameters, …) is vital for the progress of the field I think. The rest of the mentioned things are already largely in place. Of course at some research fabs, I’m sure you know as well that they haven’t really heard about data management yet.
How to share data between fabs, sw vendors, designers?
good question - must be automized, made
much simpler and reliable
Governance: versioning, distribution, licensing yes, needed
Interfacing tools: common language, list of components and parameters
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 47
As a PIC designer I need in addition to what is available today:
1. Information from the fabrication processes• Including process variations
2. An automated (and dynamic) interface between electronics and photonics design tools
3. Improved Verification Capabilities• Consistent Design rule checking (Need: shared language for DRC rules)• Post layout (circuit) simulation• Layout versus Schematic
4. Interfaces between device and circuit simulation tools• “No cut copy paste”
5. Ability to extract / deal with “parasitics”• Reflections• RF• Scattering / Straylight• Cross-talk• Thermal
Identified Priorities
Testing
June 21st 2018
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 48
Testing TWG
• Identify saleable product
• Enable process engineers to push the performance-yield envelope to make more and cheaper products
• Create improved models for the designers to make next generation product
• Testing often used as short-hand for
• Validation
• Verification
• Selection
• Measurement
• CharacterisationChart based on data from a study of Erica R. H. Fuchs in IEEE JLT, vol. 24, No.8, 2006.
Introduction
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 49
Test is a challenge!
Test !!! ->
WTMF 2017 & WRIP 2018
• World Technology Mapping Forum
• June 2018 Den Bosh, The Netherlands
• 6 teleconferences
• 8 iterations of Testing Chapter
• 18 pages
• 16 tables
• Text is already being written (75%)
• 12 participants & Team committed to work further
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 50
WTMF 2017 vs WTM 2018 (I)
WTMF 2017 vs WTM 2018 (II)
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 51
WTMF 2017 vs WTM 2018 (III)
Test TWG: Key challenges< 5 Years 5 - 10 Years > 10 Years
Adopt semiconductor EIC industry test practices ••• •• •
Standardization of test procedures and test structures ••• •• ••
Test data exchangeacross value chain ••• •• •Technology agnostic testing • •• •••
Test automation at wafer, bar, die, module and system – level ••• ••• •
Design for test ••• •• •
Circles and their number in the time ranges/columns represent the intensity of efforts needed to overcome the relevant key challenge. No circle means the challenge has been solved or lost relevance and does not require any efforts
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 52
Test TWG: What’s nextWRIP IPSR-I is set as an on-going activity:
The challenges have to be uptaded in future
Increase diversty of contributing parties
Converge with IPSR!
On Technical Working Groups level
Coherent and unified message
Global roadmap for integrated photonics in the future (2019?)
WRIP 2018 -> IPSR-I 2019
TWG participants’ workload
Workload of 10 hrs per annum?
oTeleconferences ~ 3 hrs
o6 x 30min (bi-monthly)
oInput to their TWG chapter ~3 hrs
oProvide raw input in scope of their expertise
oText write-up and revisions ~ 4 hrs
oMove raw data to readable content
oAlign with other chapters of the roadmap
<- Yes it is possible!
(~20hrs/year more likely)
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 53
Thank [email protected]
The End
Conclusions
Instead of continuing in separate work groups for InP, SiP and SiN, we propose to continue in two new work groups in which we focus on common platform requirements, but with attention for platform specific requirements
1. Heterogeneous integration on silicon (long term goal for all platforms)- to realize wafer size and uniformity advantages for cost and performance- to scale performance, density and production volume
2. Foundry process(es) for photonics (High Mix / Low volume) (short and medium term goal) - to realize the Silicon tool solutions across the 3 platforms- partitioning of dedicated tools for photonics within a state-of-the-art electronics factory flow
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 54
Heterogeneous integrationProcess integration roadmapTechniques→ Hybrid (flip-chip) Integration Heterogeneous integration by adhesive/direct bonding of Direct Growth of InP on Silicon
un-patterned III-V epitaxy (die-to-wafer bonding /transfer printing)
(semi-)processed lasers by transfer printing
Specs (in no order) 2017 2020 2025 2035 2017 2020 2025 2035 2017 2020 2025 2035 2017 2020 2025 2035
Integration process
complexity in view of
available tools and
techniques
Heat Sinking properties
Integration density
Efficiency of usage of III-V
material
Wafer scale integration
Throughput of laser
integration in one
integration step
Pre-testing of lasers before
integration
General Maturity (express
in terms of TRL)
The columnsTechniques (specs for 2017, 2020, 2025, 2030)→
1. Hybrid (flip-chip) Integration
2. Heterogeneous integration by adhesive/direct bonding of 1. un-patterned III-V epitaxy (die-to-wafer bonding /transfer printing)
2. (semi-)processed lasers by transfer printing
3. Direct Growth of InP on Silicon
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 55
The rows1. Integration process complexity in view of available tools and
techniques
2. Heat Sinking properties
3. Integration density
4. Efficiency of usage of III-V material
5. Wafer scale integration
6. Throughput of III-V component integration in one integration step
7. Pre-testing of III-V components before integration
8. General Maturity (express in terms of TRL)
Foundry process for photonics (High Mix / Low volume)
Identify common requirements AND platform specific requirements for equipment manufactures (manufacturing, packaging, test)
1. Different for SiP and InP (and SiN)1. SiP access to high performance tools for large wafers and high volumes2. InP needs high-performance tools (uniformity, reproducibility), but for small
wafers (3”, 4”, 6”)
2. However: important things in common, e.g.1. Heterogenous SiP is dependent on III-V epitaxy (on small wafers?)2. SiP volumes are too small for full 30 cm line: partial process line for lower
volume3. Waveguide edge roughness and extreme CD control important for both
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 56
New Work groupsGroup 1:
Heterogeneous Integration
- Abdul Rahim
- Lionel Kimerling
- Meint Smit
- Sami Musa
- John Rawsthorne
- Smart Photonics
- Bertrand Szelag
- Makoto Okano
- UCSB
Group 2:
Foundry integration for Photonics
High mix/low volume
- Huub Ambrosius
- Luc Augustin
- Meint Smit
- Mapper
- Lionel Kimerling
Ecosystems & Human Capital workshop
June 21st, 2018
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 57
Goals of the ecosystems & HC WGEcosystems
Easily finding partners on a global scale (which organization does what?)
Human capital
Highlighting training priorities
Sharing best practices
Standardization of skills
Scie
nce
and
rese
arch • Company
name
Man
ufa
ctu
rin
g eq
uip
men
t • Company name
Fro
nt-
end
pro
cess
ing • Company
name
Bac
k-en
dp
roce
ssin
g • Company name
Bey
on
d b
ack-
end
des
ign
to
ols
& s
ervi
ces • Company
name
Ap
plic
atio
n b
uild
ing • Producers
and users of applications
Supply groups
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 58
END USERS
ORIGINAL EQUIPMENT MANUFACTURERS (OEM)
DEFENSE CONTRACTORS
ELECTRONIC/PHOTONIC MANUFACTURING SERVICES (EMS)
TEST EQUIPMENT MANUFACTURERS
ASSEMBLY EQUIPMENT MANUFACTURERS
SEMICONDUCTOR EQUIPMENT MANUFACTURERS
TRANSEIVER SYSTEM/COMPONENT SUPPLIERS
ROUTER AND SWITCH SUPPLIERS
LASER & LED SUPPLIERS
ELECTRONIC PACKAGING SUPPLIERS
PHOTONIC SYSTEMS
SUBSTRATE MANUFACTURERS
CONNECTOR/CABLE MANUFACTURERS
PRECISION DEVICE SUPPLIERS
MATERIAL SUPPLIERS
Sub divisions
POLYMER WAVEGUIDE AND COMPONENT SUPPLIERS
SEMICONDUCTOR FOUNDRIES
SEMICONDUCTOR MANUFACTURERS
SEMICONDUCTOR/PHOTONIC MANUFACTURERS
FABLESS SEMICONDUCTOR/PHOTONIC MANUFACTURERS
HETEROGENEOUS INTEGRATION, InP MANUFACTURER
DESIGN TOOLS
R&D CONSORTIA
UNIVERSITIES/RESEARCH INSTITUTES
COMMUNITY COLLEGES
FEDERAL AGENCIES
TRADE ASSOCIATIONS
PROFESSIONAL SOCIETIES
CONSULTANTS/PUBLISHERS
VENTURE CAPITAL/INVESTMENT BANKERS
Working out the structure with groups & sub-groups (Bob & Peter)
Divide WTMF companies in those sub-groups (Peter & ...?)
Ask two-ish more participants for the working group (Bob, Peter)
Set action points ecosystems
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 59
Highlighting training priorities
Sharing best practices
Standardization of skills
Human capital template
Highlighting training priorities
conclusions wtmf18 - June 22 2018
proceedings: magazine.photondelta.eu/wtmf18 60
Standardization of skills