smtconnect.com

Nuremberg, 7 – 9 May 2019

Solutions for Electronic Assemblies and Systems

Technology DaysEnglish Seminar ProgramPractical knowledge to take you into the future!

Tuesday, 7 May 2019

Welcome Session (in German)

09.30 – 10.00 am VDMA Geschäftsklimaumfrage des Elektronik-Maschinenbaus

Grußwort: Prof. Dr. Klaus-Dieter Lang, Fraunhofer IZM Daniel Müller, VDMA Electronics Volker Pape, Viscom AG

Coffee break

Seminar 1 (in German)

10.15 – 11.45 am Verbindungstechniken: Löten, Sintern, TLPB – für höhere Betriebstemperaturen

Dr. Matthias Hutter, Fraunhofer IZM Constanze Weber, Fraunhofer IZM

Special Session 1

12.00 – 12.25 pm Automotive PCBA & No-Clean Solder Paste – Enhanced Electrical Reliability for High-Power Components

Karthik Vijay, Indium Corporation

Lunch

Special Session 2

01.00 – 01.25 pm High Reliability Lead-Free Alloys for Performance Critical Applications

Ralph Christ, Alpha Assembly Solutions Germany GmbH

Seminar 2 (in German)

01.30 – 03.00 pm Herausforderungen bei der Verarbeitung von kritischen LGA-Bauelementen

Dr. Hans Bell, Rehm Thermal Systems GmbH Henryk Maschotta, Thales Deutschland GmbH Dr. Heinz Wohlrabe, TU Dresden

Coffee break

Seminar 3

03.15 – 04.45 pm Implementation of a low melting point soldering alloy in electronics assembly

Steven Teliszewski, Interflux Electronics NV

Wednesday, 8 May 2019

Special Session 1 (in German)

08.30 – 08.55 am Substrate für Schaltungsträger: Basiseigenschaften und Metallisierungen zur Ankontaktierung

Prof. Dr. Martin Schneider-Ramelow, Fraunhofer IZM

Seminar 1 (in German)

09.00 – 12.00 pm Lieferspezifikation und Designrules für drahtgebondete Substrate und Baugruppen

Stefan Schmitz, Bond-IQ GmbH Dr. Josef Sedlmair, Uwe Nacke, F & K DELVOTEC Bondtechnik GmbH

(including coffee break)

Special Session 2 (in German)

12.15 – 12.40 pm Stretchable und Conformable PCB / Electronics als neue Herausforderung für den Elektronikentwickler – TWINflex-Stretch

Dr. Jan Kostelnik, Würth Elektronik GmbH & Co. KG

Lunch

Special Session 3

01.30 – 01.55 pm Nan Ya millimeter-wave, high reliability materials for automotive radar and safety applications

Gavin Chen, Nan Ya Plastics Corp.

Seminar 2

02.00 – 03.30 pm Recent Advancements in Thin and Thick Film Technology Dr. Alexander Kaiser, Cicor Reinhardt Microtech GmbH

Dr. Günter Reppe, RHe Microsystems GmbH

Wednesday, 8 May 2019

Special Session 3

08.30 – 08.55 am Miniaturization Trends Dr. Ning-Chen Lee, Indium Corporation

Seminar 4

09.00 – 12.00 am Reliability of Solder Joints Dr. Ning-Chen Lee, Indium Corporation (including coffee break)

Lunch

Seminar 5

02.00 – 05.00 pm DFM for Advanced Soldering Technology Dr. Ning-Chen Lee, Indium Corporation (including coffee break)

Soldering Technologies Substrate Technologies

Media partners Supported byChair

Prof. Dr. Klaus-Dieter Lang Fraunhofer IZM

More information about the committee at smtconnect.com

At a glance

Participation fees

Svenja SpeidelConference Assistant Tel.: +49 711 61946-974svenja.speidel@mesago.com

Mesago Messe Frankfurt GmbHRotebühlstraße 83 – 8570178 Stuttgartmesago.com

Organizer

Booking until 4 April 2019

Booking from 5 April 2019

1 Seminar (1,5hrs) 210.00 EUR 260.00 EUR

1 Seminar (3hrs) 380.00 EUR 470.00 EUR

1-Day ticket 575.00 EUR 720.00 EUR

2-Day ticket 920.00 EUR 1,150.00 EUR

Welcome Session & Special Sessions inclusive inclusive

All fees plus 19% VAT. On-site registration: plus 30.00 EUR per person.Contractual conditions at smtconnect.com/registration

Your services

Participation at the presentations booked incl. seminar handout(s) Entry to the Welcome Session on 7 May 2019 Coffee breaks and lunch on the day booked Exhibition season ticket Ticket for the Welcome Party on 7 May 2019

Entitlement to services only after payment of the participation fee.

Your contact