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1/25/2015
1
1991 – 2015 TechLead Corporation
Technology Disrupts; Supply Chains Manage
Dr. Herbert J. Neuhaus
TechLead Corporation
1991 – 2015 TechLead Corporation
Outline
• Supply Chain Management
• Disruptive Innovation
• SMT Examples
– Chip-on-Board
– Package-on-Package
• Insights & Recommendations
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1991 – 2015 TechLead Corporation
Supply Chain Management
1991 – 2015 TechLead Corporation
Supply Chain Management Definition
• Management of the flow of goods
• Movement & storage: origin to consumption
– Raw materials
– Work-in-process inventory
– Finished goods
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1991 – 2015 TechLead Corporation
Supply Chain Management Definition II
• Systemic, strategic coordination
– Traditional business functions & tactics
– Across business functions within a company
– Across businesses within the supply chain
– Improving long-term performance
• Individual companies
• Supply chain as a whole
1991 – 2015 TechLead Corporation
Supply Chain Elements
• Plan: strategy
• Source: choose suppliers of goods & services
• Make: manufacture
• Deliver: orders, warehouses, carriers, invoices, payments
• Return: defective or excess products
• Reciprocity – You are supplier’s customer
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1991 – 2015 TechLead Corporation
Historical Developments
• Creation– Early industrial revolution, mass production (Henry Ford)– Re-engineering, downsizing, cost reduction programs
• Integration– Electronic data interchange (EDI) systems – Enterprise resource planning (ERP) systems
• Globalization– Integrate global sources into core business
• Specialization– Focus on "core competencies" & specialization– Outsource manufacturing & distribution
1991 – 2015 TechLead Corporation
Supply Chain Disruptions
Accenture
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1991 – 2015 TechLead Corporation
Disruptions
Semiconductor Industry Association- Global Billings Report
1991 – 2015 TechLead Corporation
Disruptions
• Intel expects $1B less revenue: cites hard drive shortage, Thai floods
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1991 – 2015 TechLead Corporation
Disruptive Innovation
1991 – 2015 TechLead Corporation
Sustaining Technology
• Incremental improvements to an already established technology
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1991 – 2015 TechLead Corporation
Disruptive Technology
• Lacks refinement
• Often introduces performance problems
• Appeals to a limited audience
• May not yet apply to a proven practical application
1991 – 2015 TechLead Corporation
Incumbents Often Dismiss Disruptive Innovation
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1991 – 2015 TechLead Corporation
Winning Disruptive Innovations
• Telephone vs telegraph
• Diesel electric vs steam locomotive
• Solid state electronics vs vacuum tubes
• Mini-mills vs integrated steel producers
• Digital cameras vs film
• Amazon vs brick and mortar bookstores
• iTunes vs compact disks vs records
1991 – 2015 TechLead Corporation
Value Recognition Is Critical
• Unrecognized value
– Threat
– Lack of a response IS a response
– Typical of entrenched suppliers
• Recognized value
– Opportunity
– Rapidly reconfigure supply chain
– Integrate innovation into manufacturing
– Typical of new entrants and well managed firms
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1991 – 2015 TechLead Corporation
Chip-on-Board
1991 – 2015 TechLead Corporation
Chip-on-Board
• Bare chip bonded to board
• Wire-bond interconnect
• Liquid encapsulation
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1991 – 2015 TechLead Corporation
Chip-on-Board
• Now mature but once a disruptive innovation
• Advantages
– Form factor reduction
– Rapid time to market
– Cost reduction?
1991 – 2015 TechLead Corporation
Chip-on-Board Applications
• Portable electronics
– Watches, pagers, calculators, games
• Low end, short life cycle products
• Not suitable for high reliability or high value die
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1991 – 2015 TechLead Corporation
Chip on Board Disruptive
• Contamination control– Clean room required, Class 10,000 or better
• Bare die– Procurement
– Handling
– Quality
• Wire-bond
• Rework& Yield Management– Impractical after encapsulation
– In-Circuit Test in Cleanroom
1991 – 2015 TechLead Corporation
Chip-on-Board Process
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1991 – 2015 TechLead Corporation
Chip Adhesive
1991 – 2015 TechLead Corporation
Chip Placement
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1991 – 2015 TechLead Corporation
Bare Die Quality
• Bare die testing limited
• Unknown Bad Die (UBD) a reality
• EIA/JEDEC JESD49 covers die procurement info
– Leaves details to supplier discretion
• Wafer yield data highly proprietary
• Significant Supply Chain Challenge
1991 – 2015 TechLead Corporation
Wire Bonding
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1991 – 2015 TechLead Corporation
Wire Bonding
1991 – 2015 TechLead Corporation
Wire Bonding
• Mature, complex process
• Not a traditional SMT skill
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1991 – 2015 TechLead Corporation
Glop-top Encapsulant
1991 – 2015 TechLead Corporation
Rework Options
• Mounted, Wire-bonded die reworkable
– Die failure analysis possible
– Dress board pads
– Replace die
• More difficult after encapsulation
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Yield Management Example
• Yielded Cost Model shows
– COB without rework of bad chips impractical for high value chips
– One rework is sufficient to render COB cost effective regardless of chip yield or value
$1.00 chip, 0 Reworks Allowed
$0.75 chip, 0 Reworks Allowed
$0.50 chip, 0 Reworks Allowed
$1.00 chip, 1 Reworks Allowed
$1.00 chip, 2 Reworks Allowed
Cos
t of
scr
app
ed c
hip
per
100
boa
rds
Chip Yield
1991 – 2015 TechLead Corporation
COB Supply Chain Learnings
• COB known, but disruptive
• Supply Chain Issues
– Upstream• Die procurement (quality)
– In-house• Cleanrooms
• Die handling
• Wire bonding
• Encapsulation
• Rework & yield management
– Downstream• Restricted field feedback
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1991 – 2015 TechLead Corporation
Package-on-Package
1991 – 2015 TechLead Corporation
Package on Package (PoP)
• Individual Packages Stacked On Each Other
• Bottom Package Typically Logic Device
• Top Package Typically Memory Device
Bottom Package Logic Module
PoPb
Top PackageMemory Module
PoPt
PCB
Source: Intel
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1991 – 2015 TechLead Corporation
Package on Package (PoP)
• Package on Package (PoP) growing fast!
• Products:
– Cell phones
– Digital camera
– PDA
– Tablets
– Ultra mini PC (UMPC)
Source: Intel
1991 – 2015 TechLead Corporation
Package on Package (PoP)
• Advantages:– Mix & Match Package Suppliers
– Reduce Total Cost of Ownership
– Small Board Footprint
– Test Individual Packages For Known Good Die
– High Die/Package Area Ratio
– Compatible With Standard SMT Process
• Disadvantages:– Who Owns Failures?
– Cost
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1991 – 2015 TechLead Corporation
Package on Package (PoP)
• Top Memory Packages:
– Molded package
– Usually same size as the bottom package
– Only 2 rows of balls
– Mold cap height depends on # of Si die
3 die+1Spacer
2 die+1Spacer
4 memory die
Source: Intel
1991 – 2015 TechLead Corporation
Package on Package (PoP)
• Standard PoP packages :
– Wire bond style PoP bottom package
– Flip Chip style PoP bottom package
Source: Intel
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1991 – 2015 TechLead Corporation
PoP Assembly Process
Source: Intel
Bottom packageTop package
Flux applied to fixture of
known depth
Top package dipped in flux
Top package placed on
bottom package
PoP board reflowed via
standard SMT process
Bottom package
placed via standard
SMT process
1991 – 2015 TechLead Corporation
Assembly Option: Pre-Stacking
• Some customers prefer not to do PoP stacking in mainline SMT process– Use subcontractor to obtain pre-stacked units
– Pre-stacked units assembled on special pallets
Source: Intel
Bottom units placed in SMT carrier
Pre-stacked PoP unit
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Assembly Option: Pre-Stacking
• Pre stacking benefits:
– No dipping process at SMT assembly
– Single step SMT placement process
• Pre stacking disadvantage:
– PoP units go through extra reflow cycle
– Testing challenges with pre-stacked units
– Failure accountability following SMT assembly
Source: Intel
1991 – 2015 TechLead Corporation
PoP Package Technology
• TSOP Stacking
– Interposer with PTH connects TSOPS
– Sn plated TSOP leads
– SAC 305 soldered Stacked unit
– 0.5 mm pitch for both bottom & top parts
Source: Intel
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1991 – 2015 TechLead Corporation
Board Level Underfill Options
• Common Dispense Options:– Underfill (full fill)
– Both top & bottom
– Bottom only
– Corner glue (CG)
– Dots
– L shape
Selected dispense option & materials optimized to product
use condition requirements
Corner glue L shape
Underfill full fill
Corner glue L shape
Source: Intel
1991 – 2015 TechLead Corporation
Board Level Underfill Options
• No Underfill PoP – Joint failures tend to occur at bottom package joints
• Selectively Underfill One PoP Level Only – Failure location & mechanisms transfer to other levels
– Overall PoP reliability comparable to no underfill
• Fully Underfill of PoPb & PoPt packages– Maximizes reliability benefits
Fully Underfilled PoP
Source: Intel
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1991 – 2015 TechLead Corporation
PoP Supply Chain Learnings
• PoP SMT based, yet disruptive
• Supply Chain Issues
– Upstream• Packaged die (pre-stacked?)
• Interposers?
– In-house• Fluxing
• Underfill
• Reflow
• Rework & yield management
– Downstream• Field repair
• Accountability
1991 – 2015 TechLead Corporation
Insight #1
Distinction between manufacturing & services has blurred
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1991 – 2015 TechLead Corporation
Manufacturing & Services
• Manufacturing’s Service-like activities
– R&D
– Customer support
– Test & Inspection
– Inventory management
• External production
– EMS
1991 – 2015 TechLead Corporation
Value-Add
• Value added through
– Enhanced customer value
– Cost reduction
– Differentiation
• Value added basis for supply chain sourcing
• Some value-add transient
– Not apparent in final product
– Difficult to recognize, especially with disruptive innovations
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1991 – 2015 TechLead Corporation
Supply Chain Impact
• Value added accounting must include transient value-add
– Service-like activities
• Test & inspection
• Customer support
• Failure to accurately account value-add services
– Poor make-or-buy decisions
1991 – 2015 TechLead Corporation
Value-Add Service Example
• New yield management paradigm
– Enhanced role of supply chain management
• COB Bare die quality
– Known Good Die
– Probably Good Die
– Unknown Bad Die
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1991 – 2015 TechLead Corporation
Insight #2
Supply Chain not linear; really a complex mesh
1991 – 2015 TechLead Corporation
Supply Chain?
• The word “chain” implies a linear flow
• But the supply chain is a NOT linear
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1991 – 2015 TechLead Corporation
Supply Mesh
1991 – 2015 TechLead Corporation
Disruptive Innovation & Supply Chain
• Disruptive innovation often re-orders
– Manufacturing operations
– Upstream & Downstream Supply Chain
• Accountability becomes a source of conflict
• All participants (“links”) must manage supply chain
• Inertia breeds failure (or missed opportunity)
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Losing Sight of the Common Objective
I'm glad that the holeis not on our side!
1991 – 2015 TechLead Corporation
Inertia
• Resistance to change
• Defines
– Important criteria
– Acceptable solutions
– “Correct” viewpoint
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1991 – 2015 TechLead Corporation
Conclusions
• Innovation
– Sustains
– Disrupts
• Sustaining Innovation
– Powers incremental growth
– Reconfigures supply chain
• Disruptive Innovation
– Redefines value-add (harder to recognized)
– Redefines supply chain
1991 – 2015 TechLead Corporation
Disruptive Innovation
• Threat or Opportunity?
• Threat when incumbents dismiss innovation outside
– Established thinking
– Established supply chain
• Opportunity
– Recognize innovative value
– Rapidly reconfigure supply chain
– Integrate innovation into manufacturing