Technology Roadmap 2004 Q2 - ASE Kaohsiung $ %ˆ ˇ " ˇ ˇ Available 2004 2005 2006 Bump Pitch (um) Solder Printing 150 150 100 100 Material BCB/PI PI PI PI RDL Bump on SiN/PI PI

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Flip Chip

Fine Pitch & Low-KWire Bonding

Substrate/Bumping/Assembly/Test

Turnkey Solution

Test Program Conversion

Stacked Die SIP!��

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BCC QFN

Green Solutions

MEMS

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Package Size (mm2)

Die Thickness

Laminate C4 PadPitch (um)

Ball Pitch (mm)

Pkg Thickness (mm)

Package Size (mm2)

Bump Pitch (um)

Package Size (mm2)

Die Size (mm2)

Ball Count

Bump Material

Organic Substrate

2006

FC C

SP

Mol

ding

FC

CS

PFC

BG

A

2005ITEM Available 2004

Hig

h P

erfo

rman

ceFC

BG

A

4 x 4 ~ 15 x 1514 x 22

1.7 ~ 1.0 0.8 min

4 x 4 ~ 17 x 17

0.7 min 0.6 min

4 x 4 ~ 19 x 19 4 x 4 ~ 21 x 21

220/225NSMD/SMD, no

line pass

195/205NSMD/SMD, no

line pass

175/185NSMD/SMD, no

line pass

165/170NSMD/SMD, no

line pass0.5 ~ 1.0 0.4 ~ 1.0

8 mils for 8"10 mils for 12"


9 mils for 12 inch


15x15~40x40 12x12~42.5x42.5 12x12~45x45 12x12~47.5x47.5

4x3~23x26

121 ~1936

4 / 6 Layer Laminate4 ~ 8 Layer BT Build-up

with Ni/Au / Presoldered /SOP Pad

Sn63/Pb37 /Pb95/Sn5

Sn63/Pb37 / Pb95/Sn5 / Pb97/Sn3 / Leadfree

4x3~28x28 4x3~31x31 4x3~33x33

121 ~2500 121 ~2601 121 ~2916

4 / 6 Layer Laminate4 ~ 12 Layer BT Build-up

3/5/7 Layer PTFEwith Ni/Au / Presoldered/ SOP Pad

12x12 ~45x45 12 x12 ~50x50 12x12 ~52.5x52.5 12x12 ~55x55

200 (Production)/ 180 (Proto)

180 (Production)/ 150 (Proto)

HVM / proto200 / 180




C4 Pad Pitch (um)

Heatspreader

Package Size (mm2)

Die Size (mm2)

Ball Count

Bump Pitch (um)

Bump Material

Substrate

Multi chip

Multi package

Wafer Technology

Hig

hP

erfo

rman

ceFC

BG

AC

eram

ic F

C B

(P)G

AS

IP

Leadframe Type Flip Chip

20062005ITEM Available 2004125 SMD, no line pass150 SMD, one line pass

115 no line130 one line pass

1-pc / 2-pc Cu with Ni plated1-pc Cu / Al / AlSiC Cap

Cu DLA for 17 x 17 or smaller

1-pc / 2-pc Cu with Ni plated1-pc Cu / Al / AlSiC Cap

Cu DLA for 31 x 31 or smaller

Alumina CeramicHi TCE Ceramic

LTCC Glass Ceramic

Sn63/Pb37 / Pb95/Sn5 /Pb97/Sn3

High Lead / Eutectic / Leadfree


13x11~52.5x52.5 13x11 ~ 60x60

2.3 x 2.5 ~ 26 x 26 2.3 x 2.5 ~ 28 x 28

65 ~2533 65 ~3481


Side-by-side FC BGA 40x40F/C + W/B staked FCBGA13x13

Flip chip staked 31x31

Flip chip + 2- or 4- CSP BGA 31 x 31with passive component

Combined MCM FC or F/C + W/B with multi package in one

Al: 0.13umCu: 0.13 um FSG/

lowKCu: 90 nm Low-K Cu: 90 / 65 nm ultra Low-K

FC QFN 10x1088L

FC BCC 8 x 8 56LStaggeredTerminals

175 SMD, no line pass200 SMD, one line pass

25x32.5~50x50

6.5x6.5~10x10


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Available 2004 2005 2006

Bump Pitch (um) Solder Printing 150 150 100 100

Material BCB/PI PI PI PI

RDL Bump on SiN/PI PI PI PI

Cu/Low-k Wafer Eutectic Pb-free Pb-free Pb-free

90nm Wafer Eutectic Eutetic Pb-free Pb-free

60nm Wafer n/a Eutetic Pb-free Pb-free

8" PrintingEutetic (w/ ULA)

Pb-Free (SnAgCu)SnAgCu SnAgCu SnAgCu

12" Printing Eutetic (w/ ULA)Pb-Free (SnAgCu)

SnAgCu SnAgCu SnAgCu

ITEM

Repassivation&

RDL

Bump onNanotechnology

/Cu/Low-k

Bump Material

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Available 2004 2005 2006

Bump Pitch(um)

Solder Plating 150 150 100 100

Material PI PI PI PI

RDL Bump on PI PI PI PI

Cu/Low-k Wafer High Lead Eutectic(w/ ULA) Pb-free Pb-free

90nm Wafer n/a Hi-Pb/Eutectic Pb-free Pb-free

60nm Wafer n/a n/a Hi-Pb/Eutectic Hi-Pb/Eutectic

8" Plating Hi-Pb (w/ ULA) Eutectic(w/ ULA) Pb-free Pb-free

12" Plating Hi-Pb (w/ ULA) Eutectic(w/ ULA) Pb-free Pb-free

Bump Material

Repassivation&

RDL

Bump onNanotechnolog

y /Cu/Low-k

ITEM

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Available 2004 2005 2006

Ultra CSPPackage Size

Package Size 5x5 6x6 7x7 8x8

Std. Ultra CSP Eutectic/Lead Free Higher Cu Low Alpha Low Alpha

Polymer CollarUltra CSP

Eutectic Lead Free Higher Cu Low Alpha

Wafer Size 6"/8" 6'/8" 6"/8" 12"

Wafer Thickness 12mil 10mil 8mil 6mil

Ball Pitch/Size 0.5/0.35 0.4/0.25 0.35/0.2 0.3/0.2

Passivation BCB PI PI PI

BacksideProtection

N/A Molding Molding Molding

Surface Material

Ball Material

ProcessCapability

ITEM

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Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

Micro-Display

RF-MEMS

BiometricSensor

PDIC PDIC

Package

Module

MEMS

ImageSensor

2005 2006ITEM Available

2004

Hermetic CeramicPackage

Wafer Level Hermetic Sealing

CLCC / OLCC

FaceIdentification

Camera Modulewith ASE WLCSP

Camera Modulew/ CLCC , w/ PCB

Solder Reflow HermeticSealing

Finger Print

Acoustics Sensors, Switchs

RetinaIdentification

LGA Clear Mold LGA Blue Ray Wafer Level

LGA Clear Mold 48L

WLCSP with Embedded Lens

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0.18 0.13 0.09 0.065• IC Feature Size (um)

45 40 30 25

60 50 45 40

60 50 45 40

70 60 55 50

� Leading-Edge Fine-Pitch Capabilities

In-Line: 45 um; Staggered: 60 um; Tri-Tier: 60 um ; Quad-Tier: 70um

� World’s Largest Capacity: 5230 Bonders

• Wire Bond pad Pitch (um)(Single-In-Line)

• Wire Bond Pad Pitch (um) (2 Row Staggered)

• Wire Bond Pad Pitch (um)(Tri-Tier)

• Wire Bond pad pitch (um )

( Quad-Tier )

Item Current 2004 2005 2006

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Base on customer volumeASE engineering study

Wafer Tech.DielectricMaterial

PackageType

Production

QFP

BGA

Flip Chip

QFP Y2004H2

BGA Y2004H2

Flip Chip

QFP Y2005H1

BGA Y2005H1

Flip Chip Y2004H1

QFP Y2006H2

BGA Y2006H2

Flip Chip Y2006H2

ELK

90nm

65um

0.13um

FSG

Low-K

Low-K

QualRun

RealiabilityTest

TrialRun

CapabilityStudy

1.4mm

1.2mm

0.8mm

1.0mm

0.5mm

2 die 3 die 4 die 5 die 7 die

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MPBGA

SPBGA(POP)

2~3 Chips 4 Chips 6 Chips

PIP

MPBGA

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Wafer Thickness (8”)

Wafer Thickness (12”)

Substrate Thickness (2L)

Substrate Thickness (4L)

Mold Thickness

Loop Height

Available 2004 2005 2006

75um/3mils

0.17 mm 0.12 mm 0.1 mm

0.35 mm 0.3 mm

50um / 2mils 25um / 1mils

0.25 mm

150um/ 6mils 100um/4mils 75um/3mils 50um / 2mils

75um 50um

0.26 mm 0.24 mm 0.22 mm

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2-Chip Stack

3-Chip Stack

4-Chip SCSP

1.4m SCSP

MPBGA

SPBGA (POP)

PIP BGA

Available 2004 2005 2006

1.2mm

WB + Passives System Module

2 Package(1.8mm Max)

1.4 mm Max

1.0mm 0.8mm

4/5 chips 6 chips 7 chips

1.2mm(0.65mm cap)

1.0mm(0.53mm cap)

1.0mm (0.53mm cap)

0.8mm(0.45mm cap)

0.8mm(0.45mm cap)

0.5mm(0.3mm cap)


1.2 mm Max 1.0 mm Max


1.2mm (0.65mm cap)

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Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

Package Size

PackageThickness

Terminal

MSL Level

Multi Dies

Sawing Type

Punch Type

MSL Level

QFN

2005 2006ITEM Available

2004

BCC3x3 ~ 9x9 mm 3x3 ~ 15x15mm 3x3 ~ 19x19mm

Triple Terminal

3x3 ~ 9x9 mm Thermally Enhanced Type

Level-2A260

Level-2260

Stagger Terminal

0.5mm0.8mm

Level-1260

3x3 ~ 7x7 mm8x8 mm9x9 mm

Level-2A260

Level-2260

Level-1260

Stagger Termal

Single Die2 DiesStack

Sandwich StackDies

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Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

Package Type

Lead FrameType

MSL Level

Lead FramePlating Material

BGA typeMSL Level

2006ITEM Available

2004E 2005

Sn Cu / SnBi / Matt Tin

MSL 3260°C

MSL 2260°C

MSL 1260°C

MSL 3260°C

MSL 2A260°C

MSL 2260°C

Lead Frame TypeBGA Laminate Type

WL-CSPFlip Chip BGA

Matt Sn/PPFSn Cu / SnBi / Matt Tin

Documents

Technology Roadmap 2004 Q2 - ASE Kaohsiung $ %ˆ ˇ " ˇ ˇ Available 2004 2005 2006 Bump Pitch (um) Solder Printing 150 150 100 100 Material BCB/PI PI PI PI RDL Bump on SiN/PI PI