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Intel Confidential
The architecture for Discovery
June, 2016
Intel® Solutions Summit 2016
Caught in the Vortex…?
2
Growth Enablers/Inhibitors
Business Efficiency & Agility
DATA: Trust, Privacy,
sovereignty
Innovation: New Economy
Biz Models
Macro Economic Effect
Intel® Solutions Summit 2016 3
Intel Confidential 4
Intel® Solutions Summit 2016
Data Center Blocks
HPC
HPC Compute Block
Cloud
VSAN Ready Node
Enterprise
SMB Server Block
Storage
Reduce Complexity
Intel engineering, validation, support
Speed time to market
Begin with a higher level of integration
Increase Value
Reduce TCO, value pricing
Fuel innovation
Focus R&D on value-add and differentiationServer blocks for specific segments
Data Center Blocks
5
Intel Confidential
A Holistic Design Solution for All HPC Needs
Compute Memory/Storage
Fabric Software
Small Clusters Through Supercomputers
Compute and Data-Centric Computing
Standards-Based Programmability
On-Premise and Cloud-BasedIntel Silicon
Photonics
Intel® Scalable System Framework
Intel® Xeon® Processors
Intel® Xeon Phi™ Processors
Intel® Xeon Phi™ Coprocessors
Intel® Server Boards and Platforms
Intel® Solutions for Lustre*
Intel® SSDs
Intel® Optane™ Technology
3D XPoint™ Technology
Intel® Omni-Path Architecture
Intel® True Scale Fabric
Intel® Ethernet
Intel® Silicon Photonics
HPC System Software Stack
Intel® Software Tools
Intel® Cluster Ready Program
Intel® Visualization Toolkit
14
Intel Confidential
Intel® Xeon®
processor
64-bit
Intel® Xeon®
processor
5100 series
Intel® Xeon®
processor
5500 series
Intel® Xeon®
processor
5600 series
Intel® Xeon®
processor code-
named Sandy
Bridge EP
Intel® Xeon®
processor code-
named
Ivy Bridge
EP
Intel® Xeon®
processor code-
named
HaswellEP
Core(s) 1 2 4 6 8 12 18
Threads 2 2 8 12 16 24 36
SIMD Width 128 128 128 128256 AVX
256AVX
256AVX2
How do we attain extremely high compute density for parallel workloadsAND maintain the robust programming models and tools that developers crave?
Intel® Xeon Phi™
coprocessor
Knights
Corner
Intel® Xeon Phi™
coprocessor
Knights
Landing1
57-61 72
228-244 288
512 2 x 512
More cores More Threads Wider vectors
Parallel is the Path Forward
*Product specification for launched and shipped products available on ark.intel.com. 1. Not launched - in planning.
Intel® Xeon® and Intel® Xeon Phi™ Product Families are both going parallel
Intel Confidential 8
Tick-Tock Development ModelSustained Microprocessor Leadership
Nehalem
Microarchitecture
Sandy Bridge
Microarchitecture
Haswell
Microarchitecture
45nm
New Micro-
architecture(SSE)
TOCK
Nehalem
32nm
New Process
Technology
TICK
Westmere
32nm
New Micro-
architecture(AVX)
TOCK
Sandy Bridge
22nm
New Process
Technology
TICK
Ivy Bridge
22nm
New Micro-
architecture(AVX2)
TOCK
Haswell
14nm
New Process
Technology
TICK
Broadwell
SkyLake
Microarchitecture
14nm
New Micro-
architecture(AVX512)
TOCK
SkyLake
XXnm
New Process
Technology
TICK
Future
Typically, Increase in Transistor Density Enables New Capabilities, Higher Performance
Levels, and Greater Energy Efficiency
Intel Confidential
Intel Confidential
Intel® Xeon® processor E5-2600 v4 product family
Grantley-Refresh Overview
Broadwell microarchitecture
Built on 14nm process technology
Socket compatible# replacement for Intel® Xeon® processor E5-2600 v3 on Grantley
Several new features and capabilities
Feature Xeon E5-2600 v3 (Haswell-EP) Xeon E5-2600 v4 (Broadwell-EP)
Cores Per Socket Up to 18 Up to 22
Threads Per Socket Up to 36 threads Up to 44 threads
Last-level Cache (LLC) Up to 45 MB Up to 55 MB
QPI Speed (GT/s) 2x QPI 1.1 channels 6.4, 8.0, 9.6 GT/s
PCIe* Lanes/ Controllers/Speed(GT/s) 40 / 10 / PCIe* 3.0 (2.5, 5, 8 GT/s)
Memory Population4 channels of up to 3 RDIMMs or 3
LRDIMMs+ 3DS LRDIMM&
Max Memory Speed Up to 2133 Up to 2400
TDP (W) 160 (Workstation only), 145, 135, 120, 105, 90, 85, 65, 55
# Requires BIOS and firmware update
& Depends on market availability
All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice.
Intel may make changes to specifications and product descriptions at any time, without notice
Intel Confidential
Intel Confidential*Results will vary. This simplified test is the result of the distillation of the more in-depth programming guide found here: https://software.intel.com/sites/default/files/article/383067/is-xeon-phi-right-for-me.pdf
All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice.1 Over 3 Teraflops of peak theoretical double-precision performance is preliminary and based on current expecations of cores, clock frequency and floating point operations per cycle. FLOPS = cores x clock frequency x floating-point operations per second per cycle.2 Host processor only
22 nm process
Coprocessor only
>1 TF DP Peak
Up to 61 Cores
Up to 16GB GDDR5
Available Today
Knights CornerIntel® Xeon Phi™
x100 Product Family
Coming Soon
Knights LandingIntel® Xeon Phi™ x200 Product Family
Future
Knights Hill3rd generation
14 nm process
Host Processor & Coprocessor
>3 TF DP Peak1
Up to 72 Cores
Up to 16GB HBM
Up to 384GB DDR42
~500 GB/s STREAM
Integrated Fabric2
10 nm process
Integrated Fabric (2nd
Generation)
In Planning…
Intel® Xeon Phi™ Product FamilyHighly-parallel processing to power your breakthrough innovations
“Meet Knight's Landing: Intel's most powerful chip ever is overflowing with cutting-edge technologies”
– PC World 06/2014
Intel Confidential
Intel Confidential
Solution for future clusters with both Xeon and Xeon Phi
Binary-compatible with Intel® Xeon® processor (Skylake)
Higher performance density for highly parallel applications2
Reduced system power consumption2
Higher perf/Watt & perf/$$3
Solution for general purpose servers and workstations
Targeted for applications with larger sections of serial work1
Upgrade path from Knights Corner as PCIe* card
Knights Landing Processor“Self-boot” Intel® Xeon Phi™ processor platform
*Other names and brands may be claimed as the property of others.1 Projections based on early product definition and as compared to prior generation Intel® Xeon Phi™ Coprocessors2 Based on Intel internal analysis. Lower power based on power consumption estimates between (2) HCAs
compared to 15W additional power for KNL-F. Higher density based on removal of PCIe* slots and associated
HCAs populated in those slots.3 Results have been estimated based on internal Intel analysis and are provided for informational purposes only. Any
difference in system hardware or software design or configuration may affect actual performance.
Knights Landing CoprocessorRequires Intel® Xeon® processor host
Ingredient in Grantley/Purley PlatformGroveport Platform
For more info, download the Groveport (KNL) Snapshot:https://sharepoint.amr.ith.intel.com/sites/snapshot/Groveport
Three (3) Knights Landing Products
Knights Landing Architectural Diagram
DMI
MCDRAM MCDRAM MCDRAM
MCDRAM
MCDRAM
MCDRAM MCDRAM MCDRAM
DDR4
DDR4
DDR4
Wellsburg
PCH
Up to 72 cores
HFI
DDR4
DDR4
DDR4
PCIe Gen3
x36
6 channels
DDR4
Up to
384GB
Common with
Grantley PCH
2 ports Storm Lake
Integrated Fabric
On-package
50 GB/s bi-directional
Up to 16GB high-bandwidth
on-package memory
(MCDRAM)
Exposed as NUMA node
~500 GB/s sustained BWUp to 72 cores
2D mesh architecture
Over 3 TF DP peak
Full Xeon ISA compatibility through AVX-512
~3x single-thread vs. compared to Knights
Corner
Core Core
2 VPU
2VPU
1M
B L
2H
UB
Tile
Mic
ro-C
oa
x C
ab
le
(IF
P)
Mic
ro-C
oa
x C
ab
le
(IF
P)
2x 512b VPU per core
(Vector Processing Units)
Based on Intel® Atom Silvermont processor
with many HPC enhancements
Deep out-of-order buffers
Gather/scatter in hardware
Improved branch prediction
4 threads/core
High cache bandwidth
& more
Intel Confidential
Intel Confidential — Do Not Forward
Intel® True Scale Fabric
Network Infrastructure - Optimized Price/Performance interconnect for HPC
Host Architecture - High MPI message rate & low end-to-end latency
Scalable Switch Solution - Performance & Latency scales with network
~10% of Verbs-based
Instructions
Intel Confidential
Intel® Omni-Path Architecture:
Changing the Fabric Landscape
Time
Next Intel® Xeon® processorDiscrete PCIe HFI
Intel® Xeon Phi™ processor (Knights Landing)Multi-chip package integration
Next Intel® Xeon® processor
Next Intel® Xeon Phi™ processor
(Knights Hill)
Next Generation
Intel® Xeon® processor E5-2600 v3Discrete PCIe HFI
Intel® OPA
HFI Card +
CPU-Fabric
Integration
Optimizing
• Performance
• Density
• Power
• Cost
Intel Confidential
Intel® Omni-Path Architecture Product Family
1 Available as a reference design and Intel product. Director class switch features and introduction in planning2 192- and 768-port DCS products are QSFP-based with 32-port leaf modules. In planning: 264- and 1056-port DCS products with uQSFP-based (44-port leaf modules), and 288- and
1152-port DCS products, Intel® Silicon Photonics-based with onboard 4x4 optical transceivers (48-port leaf modules).
Standard
PCIe Board1
(Chippewa Forest)
Low Profile PCIe v3.0 x16
Low Profile PCIe v3.0 x8
Single Port QSFP28
24 / 48 port individual QSFP28 ports
Short reach – QSFP28 Cu cables
Long reach – QSFP28 AOC
Air cooling, N+1 redundant fans
Optional redundant power supply
In-band management supported
Optional management card
Full Bisection Bandwidth
QSFP-based leaf module
In planning: Micro-QSFP
and embedded 4x4 Optical
transceiver options
N+1 Redundant Power
Air cooling, N+1 red. fans
and chassis mgmt, hot plug
HFI
ASIC
Wolf River
Intel OPA Gen1 Host Fabric Interface (HFI) Silicon
2 x 100 Gbps, 50 GB/sec Fabric Bandwidth
Intel OPA Gen1 Switch Silicon
48 ports, 9.6Tb/s, 1200 GB/sec Fabric Bandwidth
Integrated Xeon®
and Xeon Phi™
Prairie River
Knights Landing:
2 x 100 Gbps ports
Skylake (Xeon®):
1x100Gbps port
Custom Mezz
& PCIe Cards
OEM products
based on Wolf
River ASIC TBD
192-port (7U)
264-port2(in planning)
Director Class
Switches (DCS)1
(Sawtooth Forest)
Edge Switch1
(Eldorado Forest)
Custom
Switches
OEM products
based on Prairie
River ASIC TBD
Switch
ASIC
Product Line
768-port (20U)
1056-port2(in planning)
Software Cables
Intel® Fabric Suite[based on OFA with
Intel® OPA support]
Passive Copper
& Active Optical
Cable (AOC)
AOC*
Passive CuCable
Thank You.