THE COMPLETE

A-Z GLOSSARYOF CONTRACT MANUFACTURING

LECTRONICS.NET

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8D 8 Disciplines of Problem Solving. A detailed, team-oriented, problem-solving method to find the root cause of a problem and address it, both for the current issue and in the long term (systematically).

DFT Design For Testability. When products are designed with testability features included, allowing for easier application of manufacturing tests to the PCBA. Validates test plans for functional testing, In-Circuit Testing, or flying probe testing options.

DNP Do Not Populate. Can be listed on the BoM for components/reference designators that will not get placed on the PCB during the assembly process.

EMS Provider

Electronics Manufacturing Services Provider. Companies that design, manufacture, test, distribute, and provide repair services for electronic components for Original Equipment Manufacturers (OEMs).

EOL End of Life. When a product has outlived its use and a vendor stops marketing or selling it.

ESD Electrostatic Discharge. The sudden flow of electricity between two electrically charged objects when they come into contact or experience a dielectric breakdown or electrical short.

FAA First Article Approval. When a design has gone through first article inspection and received approval to move into the next stages of development.

FAIR First Article Inspection Report. A report of the results of first article inspection, a form of design verification and history file to provide reported measurements in the manufacturing process.

Flying Probe

A Type Of Testing. A type of testing for PCBs to determine low-mid volume production boards that present accessibility problems, and prototypes.

FR4 Most Commonly Used PCB Material (Flame Resistant Rating). A composite, flame-resistant material made of woven fiberglass and epoxy resin.

FTB First Time Build. An initial build of a design for the purposes of a first article inspection report.

Gerber file Design Files For Fabricating a PCB. A standard file format used for communicating design information for manufacturing a bare PCB.

HA Hand Assembly. A form of assembly completed by hand when automated electronic methods are not feasible.

HDI High Density Interconnector. A form of connection between layers that accommodate for high input/output density of advanced packages in substrates and PCBs. Microvias provide the interconnections.

HS Hand Solder. The soldering of a wire or component manually, such as a soldering iron or soldering gun for electrical and electronics work.

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ICs Integrated Circuits. A set of smaller circuits together on one chip of semiconductor material that performs the function of a dedicated electronic component. Allows for ease of mass- production of parts, smaller components, and faster operation at a cheaper price.

ICT In Circuit Testing. A method of testing internal structure conducted by an electrical probe checking for any shorts, resistance, capacitance, opens, and other basic quantities in a PCB.

IPC Institute For Printed Circuits. A trade association founded in 1957 that provides global standards for acceptability in the electronics industry with the aim of standardizing the assembly and production of electronic equipment.

IPC Class 2

Institute For Printed Circuits Workmanship Standard. A type of workmanship standard for building electronic assemblies defined by the IPC. Class 2 products require extended life and continued performance, but a failure would not cause catastrophic results in the end-use environment.

IPC Class 3

Institute For Printed Circuits Workmanship Standard. A workmanship standard for building electronic assemblies defined by the IPC. Class 3 products require high performance on demand in potentially harsh environments. If a Class 3 product, such as a life support system, were to fail or experience down time, it would lead to disastrous complications.

ISO13485 Medical Certification. A list of regulations and requirements for comprehensive quality management of the design and manufacture of medical devices, originally published in 1996.

ISO9001 Quality Management Certification. A certification for quality-management standards that show a company's capacity to consistently provide products and services that meet both customers’ needs and regulatory requirements.

ITAR International Traffic In Arms Regulation. A form of regulation that controls imports and exports of any defense-related articles on the United States Munitions list. Any manufacturer, broker, or exporter of defense services, articles, and related technical data must be ITAR compliant.

KPI Key Performance Indicators. A quantifiable measure that indicates success in meeting performance objectives for organizations, employees, and other similar parties.

M2M Machine To Machine. Any form of technology that does not require manual assistance of humans to function through the exchange of information and performance of actions by networked devices.

NDA Non Disclosure Agreement. A legal agreement between at least two parties indicating information, material, or knowledge that neither shall reveal to outside parties. Also known as confidentiality, confidential disclosure, proprietary information, and secrecy agreements.

NPI New Product Introduction. A process for successfully launching a new product to the market through conceptualization, testing, manufacturing, and analysis.

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PCB Printed Circuit Board. A type of circuit board that relies on features etched from layered copper and laminated on and between layers of non-conductive substrate. Provides mechanical support and electrical connection to electrical components.

PCB Array Multiple Copies Of The Same Pcb In A Matrix. Combining multiple copies of a single PCB in a matrix that creates a larger array of connected boards. Allows for easier manufacturing processes.

PCBA Printed Circuit Board Assembly. The process of integrating PCBs by soldering the electronic components to the bare printed circuit board.

PFMEA Process Failure Mode Effects Analysis. A form of analysis for studying problems that might arise from malfunctions by reviewing components, assemblies, and subsystems, while defining potential causes and effects of failure in the process stage.

PRP Product Realization Process. The stage of the design process of a product where there is a clear standard for the process of bringing a product to market. Includes understanding what a product will be, statements of work, and functional product specs.

RFQ Request For Quotation. A business process where suppliers bid on specific products or services. Also referred to as “call for bids” and “invitation for bid”.

Schematic Technical Drawing. A technical drawing that details the connections between PCB components while omitting unnecessary details and providing clarification to assist with understanding the build.

SMT Surface Mount Technology. A method of placing electronic components. Components are mounted or placed directly onto PCBs, creating surface-mount devices.

SPI System

Solder Paste Inspection. An automated system that conducts a scan of the paste placed on a PCB, checking for missing or insufficient paste between pads and other missed alignments. The inspection produces a 3D report of the errors.

SSM Selective Solder Machine. A machine that solders components to PCBs that could be damaged by other soldering methods, such as reflow ovens and wave soldering.

TTC System

Track, Trace And Control System. A system to determine current and past locations of an item or property in distribution and logistics systems, most often through a real-time database. Provides traceability to the reference designator for every PCBA.

UL Ul Certified Product; Underwriters Laboratory Nationally Recognized Standards For Safety. A global safety consulting and certification company that provides recognized standards of safety. It is approved by OHSA to conduct safety testing across a variety of industries, including electronics.

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