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06 February 2014
The nanoworld of IC manufacturing: smaller, faster, and more accurate
Patrick de JagerDirector New Business
• Chips are everywhere
• Introducing ASML
• Business update
• ASML’s place in the industry
• Lithography, the driving force behind Moore’s Law
• Technology
• How do we do it?
Agenda 22 January 2014
Public
Slide 2
• Chips are everywhere
• Introducing ASML
• Business update
• ASML’s place in the industry
• Lithography, the driving force behind Moore’s Law
• Technology
• How do we do it?
Agenda 22 January 2014
Public
Slide 3
It’s hard to imagine a world without chips22 January 2014
Public
Slide 4
More than 180 billion chips are made every year22 January 2014
Public
Slide 5
Data: WSTS
In 2012, 185 billion chips were produced — 27 for every man, woman and child on the planet.
Global semiconductor industry sales were about $300 billion.
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IC units, in billions
ConfidentialContent consumption drives traffic growth> 100% CAGR since 1990
Slide 6
ConfidentialContent consumption drives traffic growth> 100% CAGR since 1990
Slide 7
Content consumption drives traffic growth> 100% CAGR since 1990
Confidential
26x
80k Petabytes/month = 2 year of video content/s
Everything will be connected which will benefit from being connected
Slide 8
Source: Pieter Vorenkamp, Broadcom, IMEC Technology Forum, may 2012
Market driven by mobile devices and Solid State DrivesMobile drives cloud, cloud drives infrastructure, driving servers and SSD
Bob Johnson, Gartner, ISS jan 2012
Confidential
Slide 9
A chip up close: smallest details <20nm
Hair: 50.000nmGrows 8nm/sec
Red bloodcell: 7,500nm
Grass grows: 33nm/sec
Bacteria: 800 to 1,000nm
Rino virus: 20nm
• Chips are everywhere
• Introducing ASML
• Business update
• ASML’s place in the industry
• Lithography, the driving force behind Moore’s Law
• Technology
• How do we do it?
Agenda 22 January 2014
Public
Slide 11
ASML makes the machines for making those chips22 January 2014
Public
Slide 12
• Lithography is the critical tool for producing chips
• All of the world’s top chip makers are our customers
• 2013 sales: €5.2 bln
• Payroll: about 10,400 FTEs
Founded in 1984 as a spin-off from Philips22 January 2014
Public
Slide 13
2,522 employees
Source: ASML Q4 2013
Over 70 sales and service offices located worldwide
5,654 employees 2,184 employees
22 Januar!2014
Public
Slide 14
A global presence
A global presence22 January 2014
Public
Slide 15
Veldhoven
Wilton (CT)
Chandler (AZ)
Korea
Taiwan
San Diego(CA)
Company2013 semi capex
(estimate, $M)
Intel 10,500
TSMC Group 9,750
Samsung 9,500
GlobalFoundries 4,000
SK Hynix 2,730
Toshiba (incl. SanDisk) 2,580
Micron Technology 1,800
United Microelectronics Group 1,500
SMIC 805
Infineon 640
Sony 617
STMicroelectronics 500
A market of 12 large ASML customers
For the 10th consecutive year, top five of VLSI’s “Best Wafer
Processing” suppliers ‘Good Partner’ AwardPreferred
Quality Supplier AwardTechnology
Collaboration Award
Source: Gartner, Q4 2013
22 Januar!2014
Public
Slide 16
• Chips are everywhere
• Introducing ASML
• Business update
• ASML’s place in the industry
• Lithography, the driving force behind Moore’s Law
• Technology
• How do we do it?
Agenda 22 January 2014
Public
Slide 17
949 919
183742
1,452 1,252892
930 844
277
1,069
1,529
1,228
1,187
934697
555
1,176
1,459
1,229
1,318
955
494
581
1,521
1,211
1,023 1,848
0
1000
2000
3000
4000
5000
6000
2007 2008 2009 2010 2011 2012 2013
Ne
t S
ale
s
Total net sales M€
3,768
Numbers have been rounded for readers’ convenience
2,954
1,596
4,508
5,651
22 January 2014
Q1
Q2
Q3
Q4
Slide 18
4,732
Public
5,245
Net system sales breakdown in value: Q4 2013Total value is € 1,441 million
Technology
EUV 4%
ArF Immersion74%
KrF19%
Korea 21%
Taiwan41%
USA 16%
Region
Foundry46%
Memory35%
IDM19%
End-Use
EUV ArF i ArFdry KrF I-Line
Sales in Units27 26
22 January 2014
Public
Slide 19
Numbers have been rounded for readers’ convenience
Europe 5%
Rest of Asia 1%
Japan 3%
China13%
21
ArF dry 3%
• Chips are everywhere
• Introducing ASML
• Business update
• ASML’s place in the industry
• Lithography, the driving force behind Moore’s Law
• Technology
• How do we do it?
Agenda 22 January 2014
Public
Slide 20
Moore’s Law:The amount of transistors per given area doubles every 2 years at similar cost
The industry is sustained by the need to make cheaper, smaller ICs that do more
Public
Slide 21
Factories and tools are more expensive, but:
Transistors can be made faster and more economical, so:
Electronics becomes cheaper, or has more functionality for the same price
Driving the semiconductor industry: Moore’s Law
Gordon Moore (1965): Number of transistors per chip doubles every year.
Later adjusted to two years, the trend has held for more than four decades.
22 January 2014
Public
Slide 22
2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015
Source: Gartner. High quality Flash
Lithog
raphy
cost per
unit o
f m
em
ory
$/G
Byt
e
Moore’s Law makes chips cheaper…
10000
100
10
1
1000
22 January 2014
Public
Slide 23
$1,162 for 1 GB
$0.17 for 1 GB
… and more energy-efficientComputations per Kilowatt hour double every 1.5 years
Source: Jonathan Koomey, Lawrence Berkeley National Laboratory and Stanford University, 2009
Dell Optiplex GXI
486/25 and 486/33 Desktops
IBM PC-ATIBM PC-XT
Commodore 64
DEC PDP-11/20
Cray 1 supercomputer
IBM PC
SDS 920
Univac I
EniacEDVAC
Univac II
Univac III (transistors)
Regression results:N = 76Adjusted R-squared = 0.983Comps/kWh = exp(0.440243 x year – 849.259)Average doubling time (1946 to 2009) = 1.57 years
IBM PS/2E + Sun SS1000
Gateway P3. 733 MHz
Dell Dimension 2400
SiCortex SC5832
2008 + 2009 laptops1.E+16
1.E+15
1.E+14
1.E+13
1.E+12
1.E+11
1.E+10
1.E+09
1.E+08
1.E+07
1.E+06
1.E+05
1.E+04
1.E+03
1.E+02
1.E+01
1.E+00
Co
mp
uta
tio
ns p
er
kW
h
1940 1950 1960 1970 1980 1990 2000 2010
22 January 2014
Public
Slide 24
Moore’s Law means doing more with less
Cray 1: The first supercomputer
• 8 megabytes of memory
• 5.5 tons
• 150 kilowatt power supply
• “Innovative Freon cooling system”
• $8.8 million ($30 million in today’s dollars)
1976
22 January 2014
Public
Slide 25
Moore’s Law means doing more with less
1976 2013
The supercomputer in your pocket:a fraction of the
materials,price,
power consumption
16 October 2013
Public
Slide 26
• Chips are everywhere
• Introducing ASML
• Business update
• ASML’s place in the industry
• Lithography, the driving force behind Moore’s Law
• Technology
• How do we do it?
Agenda 22 January 2014
Public
Slide 27
Key to Moore’s Law: Making smaller transistors22 January 2014
Public
Slide 28
The first integrated circuit on silicon, on a wafer the size of a fingernail(Fairchild Semiconductor, 1959)
Today: More than a billion transistors on the same area(Intel, 2012)
Transistor length has shrunk by a million
The manufacturing loop
Exposure
Developing
Etching
Ion implantationStripping
Deposition
Photoresist coating
19 July 2012
Public
Slide 29
How a lithography system works19 July 2012
Public
Slide 30
Keeping up with Moore’s Law
PAS 2500
ASML’s first successful stepper, 1986
22 January 2014
Public
Slide 31
NXT:1970Ci
First shipped in Q3 2013
Keeping up with Moore’s Law
PAS 2500
ASML’s first successful stepper, 1986
22 January 2014
Public
Slide 32
Resolution: 900 nanometers
70 wafers per hour(150mm wafers)
Overlay:150 nanometers
NXT:1970Ci
First shipped in Q3 2013
Keeping up with Moore’s Law
PAS 2500
ASML’s first successful stepper, 1986
PublicSlide 33
Resolution: 38 nanometers
250 wafers per hour(300 mm wafers)
Overlay:As little as 2 nanometer
22 January 2014
NXT:1970Ci
First shipped in Q3 2013
10
100
Re
solu
tio
n /
ha
lf p
itch
, "S
hri
nk
" [n
m]
6
2002 2004 2006 2008 2010 2012 2014 2016 2018 2020
Year of Production start *
Public
Slide 34
Keeping up with Moore’s Law requires constant technology upgrades
DRAM 13.9%
* Note: Process development 1.5 ~ 2 years in
advance
200
XT:1400
XT:1700i
AT:1200
XT:1900i
NXT:1950i
20
30
40
5060
80
NXE:3100
NXE:3300B
NXT:1960Bi 2
34
2
2
Single Exposure
2D LEn
Patterning
1D SADP
1D SAQP
n
NXT:1970Ci
Re
so
luti
on
/ h
alf
pit
ch
, “S
hri
nk
” [
nm
]
LE = Litho-Etch, n = number of iterations
SADP = Self Aligned Double Patterning
SAQP = Self Aligned Quadruple Patterning
NAND 17% Logic 14.1%
22 January 2014
• Chips are everywhere
• Introducing ASML
• Business update
• ASML’s place in the industry
• Lithography, the driving force behind Moore’s Law
• Technology
• How do we do it?
Agenda 22 January 2014
Public
Slide 35
Public
Slide 36
The challenge of ASML engineersSlide 36
Make small structures that are all equal within nanometers
Do that lightning fast
And put 30 to 40 layers on top of each other within nanometers
AND all at the same time !
Resolution:
Numerical aperture:
NA = n sin(Θ)
© IBM Research
John William Strutt, lord Rayleigh
R = resolution (smallest feature)λ = wavelength of lightNA = Numerical ApertureK1 = process factor (minimum 0.25)n = breaking index. Air = 1; water is 1.38
λλλλR = k1
NA
The basic rule of lithography Publicslide 37
State of the art in production• Smallest feature: 38nm• Wavelength: 193nm• Increase NA: 1.35• k1: 0.265
Key innovation: TWINSCAN22 January 2014
Public
Slide 38
• Chips are everywhere
• Introducing ASML
• Business update
• ASML’s place in the industry
• Lithography, the driving force behind Moore’s Law
• Technology
• How do we do it?
Agenda 22 January 2014
Public
Slide 39
High R&D spending to sustain technology leadership
1984:PAS 2000
Resolution:>1µm
overlay: 250 nm
1989:PAS 5000
Resolution: <500 nm
overlay: 100 nm
1990s:PAS 5500 (step/scan)
Resolution: 400 to 90 nm
overlay: 100 to 12 nm
Confidential
2010s:NXE EUV systems
Resolution: 32 to <18 nm
overlay: <3 nm
2000s:TWINSCAN
Resolution: 100 to 38 nm
overlay: 20 to 2 nm
Slide 40
Great people in an integrated supply chain22 January 214
Public
Slide 41
+/- 10,000 payroll employees
+/- 3,000 flex
R&D:
+/- 3,300 payroll
+/- 1,400 flex
>500
PhD/Dr.
Supplier and technology network:
32,000 people
Open Innovation makes complexity and cost manageable
Academia
Suppliers
Customers
Technology partners
22 January 2014
Public
Slide 42