200mm, 300mm

200mm, 300mm

200mm, 300mm

200mm, 300mm

200mm, 300mm

200mm, 300mm

RAD-3520F/12 RAD-3500m/12BG Tape

Wafer Fully-Automatic

BG Tape LaminatorBG Tape

Semi-AutomaticRAD-3520F/12P series RAD-3500m/1212"

TypeProduct Name E series

UV Curable Non-UV

RAD-2510 F/12Sa RAD-2512F/12

Vacuum Wafer Mounter

Wafer Fully-AutomaticWafer Mounter

Semi-Automatic

RAD-2510 F/12Sa8" RAD-2500 F/8

RAD-2500m/12RAD-2500m/8

12"

Wafer Fully-AutomaticRAD-2512F/12

Semi-AutomaticRAD-2512/m1212"

Peeling Tape

D series G seriesType

Product NameUV Curable Non-UV

Dicing Tape

S seriesProduct Name

RAD-3600 F/12 RAD-3500m/12

Wafer Fully-Automatic Semi-AutomaticRAD-3600F/12 RAD-3500m/12 12"

LC Tape Laminator

RAD-2010 m/12RAD-2010 F/12

Wafer Fully-Automatic

UV Irradiation SystemSemi-Automatic

8" RAD-2000F/812"

Dicing Die Bonding TapeStandardTypeLE series

DBGLD seriesProduct Name

LC seriesProduct Name

Backside Coating Tape

Backside Coating Tape

Die Bonding

Molding

Inspection

Die Bonding

Wire Bonding

Molding

Flip Chip Bonding

Wafer MountingBG Tape Peeling

BG Tape Lamination

Backside Coating Tape LaminationLaser MarkingWafer Mounting

Back Grinding

Pick Up

Single Crystal Growth Wafer Cutting Wafer Grinding Surface Oxidation Resist Coating

Exposure

Development

Resist Removal

Ion Implantation and Diffusion

Electrode Deposition

Inspection

RAD series Semi-Automatic Equipment Line-upRAD series Fully-Automatic Equipment Line-up

300mm Fully-Automatic BG Tape Laminator

300mm Fully-Automatic BG Tape Remover

300mm Fully-Automatic Multifunction Wafer Mounter

300mm Fully-Automatic Vacuum Mounter

300mm Fully-Automatic LC Tape Laminator

300mm Fully-Automatic UV irradiation System

■ Reduced wafer warpage with programmable tape tension■ Programmable cutting angles to reduce wafer damage and provide the cleanest possible cut■ Space-saving and High throughput(UPH100 with option/Standard spec is UPH70)

■ Reduced wafer stress during peeling using LINTEC proprietary new peeling method■ Zero wafer backside contact during wafer handling and peeling which reduces the risk of wafer damage

■ Space-saving■ High throughput■ Lowered risk of wafer damage by reducing the number of times the wafer needs to be transported between

units in the equipment■ LINTEC-developed peeling mechanism removes BG tape from ultra-thin wafer without damaging the wafer

■ Vacuum lamination to protect pressure sensitive devices and allow the dicing tape to conform to a variety of backside sufaces

■ Zero circuit surface contact during dicing tape lamination■ Zero drect contact with the backside of the wafer

■ Precise tape lamination without voids■ Inline pre-cutting method to prevent damage on the edge of the wafer

■ More compact with an integrated cassette loader and unloader.Provides high-throughput with two processing lines.

■ Supports the optimization of illuminance and light intensity with high output UV lamp and nitrogen purge function that provides high quality and high performance.

■ A large touch panel improves operability.Ensures safety for operations and maintenance, complying with the SEMI safety guidelines.

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Thin Wafer&

Tough ChipSolutions

1,250mm(W)x1,850mm(D)x1,860mm(H)

1,440mm(W)×2,105mm(D)×1,800mm(H)

2,203mm(W)×3,092mm(D)×1,800mm(H)

1,550mm(W)×1,950mm(D)×1,800mm(H)

2,165mm(W)×3,090mm(D)×1,800mm(H)

1,650mm(W)×1,200mm(D)×1,735mm(H)

RAD-2010m/12RAD-2010F/12

Non-UV Type Dicing Tape

Application

For Si Wafer

For Full-Cut Laser Dicing

Base Material

PVC

PVC

PVC

Feature

For Small Die

For Large Die & Easy Pick Up

Excellent Visibility & Evenness

Primal Product Name

G-19D/G-19SHD/260H

POFor Large Die G-64H

G-11D

G-260H

PVCRoHS 2.0 compliance G-11D/19D/19SHD

SpecialStandard G-765/965/967

UV Curable BG Tape

Dicing Die Bonding Tape

Process

Back Grinding

DBG (Dicing Before Grinding)SDBG(Stealth Dicing Before Grinding)

Application

Standard

For Ultra Thin Grinding (thickness>40µm)

For Micro Bump (including ink dot)

For Medium Bump (height<100μm)

For High Bump (height<250µm)

For Small T.T.V.

Primal Product Name

E-4141A/6152B

E-8180HR

E-6142A/6152B

E-4230BS/8310LS342F/8330HR

E-8510HR/9485

Antistatic E-6130AS

E-3100UN

For Bump E-3281B

Die to Substrate

Die to Die

Die to Die (Same Size Stack /FOW)

For DBG (Dicing Before Grinding)

Backside Coating Tape

Type Primal Product Name

LC88 seriesGeneral

Thickness Line-up

25 µm, 40 µm

Application Type

Cure

Cure

Cureless

Cure

Cure

Primal Product Name

LE82-20

LE5000S, LE82-20

LE4424

LE4777H

LD01D-7

Adhesive Thickness Line-up

20 μm

20 μm

75 µm

7 µm

Process

Back Grinding

Application

Standard (thickness>75µm)

For Thin Grinding (thickness>50µm)

Primal Product Name

P-4130A/4140A/4205B

P-7125/7180LS459H

Infrared-Transmission 25 μm, 40 μm LC28x6 series

For Stealth Dicing 25 μm LC87 series

For Thin Wafer 25 µm, 40 µm LC86R series

Non-UV Type BG Tape

Base Material

PI

PET

Adhesive Type

Silicone

Acrylic

Primal Product Name

C-902/903

H-231F

Heat Resistant Tape

RAD-2500m/12

200mm, 300mm*Two 150mm work pieces can be processed at the time (Option)

300mm Semi-Automatic BG Tape Laminator

■ Simply place the wafer on the application table, then back grinding tape lamination and periphery cutting automatically begins

■ Customized recipes lamination is also available■ Simple touch screen operation

Wafer Size

Equipment Size

Equipment Size

150mm, 200mm, 300mm

300mm Semi-Automatic BG Tape Remover

■ Simply place the wafer on the application table, then back grinding tape peeling automatically begins■ Removes back grinding tape by heat seal type peeling tape to the periphery of the wafer■ Simple touch screen operation

Wafer Size

Equipment Size

200mm, 300mm

300mm Semi-Automatic Wafer Mounter

■ Simply place the wafer and ring frame on the application table, then pre-cut dicing tape is automatically applied

■ By using a pre-cut tape, the tape cutting process is omitted making the operation safer■ Easy button operation

■ Simply place the wafer-mounted work piece on the application table, then UV irradiation automatically begins

■ Simple touch screen operation■ Equipped with nitrogen purge function

200mm Semi-Automatic Wafer Mounter

300mm Semi-Automatic UV Irradiation System

Wafer Size

Equipment Size

300mm*Sizes other than 300mm are for option

*With table fully advanced: max. 1,380mm (D)

Wafer Size

Equipment Size

200mm

*With table fully advanced: max. 1,190mm (D)

*There are also models corresponding to the non pre-cut products: RAD-2500m/12IPC

Wafer Size

Equipment Size

830mm(W)×1,042mm(D)×1,350mm(H)

915mm(W)×1,080mm(D)×1,350mm(H)

671mm(W)×950mm(D)×527mm(H) 568mm(W)×850mm(D)×527mm(H)

300mm Semi-Automatic Vacuum Mounter

■ By simply setting the wafer and tape-mounted ring frame, wafer mounting is automatically processed■ Management of mounting condition is operated simply with a touch screen■ Tape mounting without contact to the wafer surface is achived with the special non-contact table

Wafer Size 300mm*Sizes under 300mm are for option

*Tape mounting for ring frame is required separately: RAD-2500m/12

1,100mm(W)×600mm(D)×1,100mm(H)

870mm(W)×1,080mm(D)×1,185mm(H)

UV Irradiation

Dicing

CP2007

•

• Advanced Materials Operations2-1-2 Koraku Bunkyo-ku, Tokyo 112-0004 JapanTEL. +81-3-3868-7737 FAX. +81-3-3868-7726 http://www.lintec-global.com

Advanced Technologies Division15930 S. 48th Street, Suite 110, Phoenix, AZ 85048 USATEL. +1-480-966-0784 FAX. +1-480-966-5321 http://www.lintec-usa.comEmail: info@lintec-usa.com

LINTEC Corporation

LINTEC OF AMERICA, INC.

www.adwill-global.com/en

UV Curable Dicing Tape

Application Feature

High Expandability

Anti-chipping

Easy Pick Up

Antistatic

High Adhesion

Standard

Standard

Antistatic

Antistatic

Expand and Break

・Expand and Break・Capability of SD through tape・Antistatic ・Expand and Break・Capability of SD through tape

Standard

Standard

Standard

Base Material

PVC

PO

PVC

PO

PVC

PO

PVC

PO

PO

PET

PO

PO

PO

PVC

PO

PO

PVC

PO

PVC

PO

Primal Product Name

D-17xD series

D-670/675

D-17xD series

D-676H(S)/678/686H

D-17xD series

D-485H/678/686H

D-174E/820

D-877H/867A

D-611/611H

RoHS 2.0 compliance PVC D-17xD series

D-210N/241

D-698/841

D-510T(S)/510W

D-830J/841/825/825W/846/847W

D-17xD series

D-611H/678

PVC D-820

D-456H

D-821HS

D-676(S)/676H(S)/686H

D-17xD series

D-485H

Special D-765

For Si Wafer

For Glass/Ceramics

For Package Substrate

For Stealth Dicing (SD)

For Wafer with LC Tape

For TAIKO Wafer

For Full-cut Laser Dicing

200mm, 300mm

200mm, 300mm

200mm, 300mm

200mm, 300mm

200mm, 300mm

200mm, 300mm

RAD-3520F/12 RAD-3500m/12BG Tape

Wafer Fully-Automatic

BG Tape LaminatorBG Tape

Semi-AutomaticRAD-3520F/12P series RAD-3500m/1212"

TypeProduct Name E series

UV Curable Non-UV

RAD-2510 F/12Sa RAD-2512F/12

Vacuum Wafer Mounter

Wafer Fully-AutomaticWafer Mounter

Semi-Automatic

RAD-2510 F/12Sa8" RAD-2500 F/8

RAD-2500m/12RAD-2500m/8

12"

Wafer Fully-AutomaticRAD-2512F/12

Semi-AutomaticRAD-2512/m1212"

Peeling Tape

D series G seriesType

Product NameUV Curable Non-UV

Dicing Tape

S seriesProduct Name

RAD-3600 F/12 RAD-3500m/12

Wafer Fully-Automatic Semi-AutomaticRAD-3600F/12 RAD-3500m/12 12"

LC Tape Laminator

RAD-2010 m/12RAD-2010 F/12

Wafer Fully-Automatic

UV Irradiation SystemSemi-Automatic

8" RAD-2000F/812"

Dicing Die Bonding TapeStandardTypeLE series

DBGLD seriesProduct Name

LC seriesProduct Name

Backside Coating Tape

Backside Coating Tape

Die Bonding

Molding

Inspection

Die Bonding

Wire Bonding

Molding

Flip Chip Bonding

Wafer MountingBG Tape Peeling

BG Tape Lamination

Backside Coating Tape LaminationLaser MarkingWafer Mounting

Back Grinding

Pick Up

Single Crystal Growth Wafer Cutting Wafer Grinding Surface Oxidation Resist Coating

Exposure

Development

Resist Removal

Ion Implantation and Diffusion

Electrode Deposition

Inspection

RAD series Semi-Automatic Equipment Line-upRAD series Fully-Automatic Equipment Line-up

300mm Fully-Automatic BG Tape Laminator

300mm Fully-Automatic BG Tape Remover

300mm Fully-Automatic Multifunction Wafer Mounter

300mm Fully-Automatic Vacuum Mounter

300mm Fully-Automatic LC Tape Laminator

300mm Fully-Automatic UV irradiation System

■ Reduced wafer warpage with programmable tape tension■ Programmable cutting angles to reduce wafer damage and provide the cleanest possible cut■ Space-saving and High throughput(UPH100 with option/Standard spec is UPH70)

■ Reduced wafer stress during peeling using LINTEC proprietary new peeling method■ Zero wafer backside contact during wafer handling and peeling which reduces the risk of wafer damage

■ Space-saving■ High throughput■ Lowered risk of wafer damage by reducing the number of times the wafer needs to be transported between

units in the equipment■ LINTEC-developed peeling mechanism removes BG tape from ultra-thin wafer without damaging the wafer

■ Vacuum lamination to protect pressure sensitive devices and allow the dicing tape to conform to a variety of backside sufaces

■ Zero circuit surface contact during dicing tape lamination■ Zero drect contact with the backside of the wafer

■ Precise tape lamination without voids■ Inline pre-cutting method to prevent damage on the edge of the wafer

■ More compact with an integrated cassette loader and unloader.Provides high-throughput with two processing lines.

■ Supports the optimization of illuminance and light intensity with high output UV lamp and nitrogen purge function that provides high quality and high performance.

■ A large touch panel improves operability.Ensures safety for operations and maintenance, complying with the SEMI safety guidelines.

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Thin Wafer&

Tough ChipSolutions

1,250mm(W)x1,850mm(D)x1,860mm(H)

1,440mm(W)×2,105mm(D)×1,800mm(H)

2,203mm(W)×3,092mm(D)×1,800mm(H)

1,550mm(W)×1,950mm(D)×1,800mm(H)

2,165mm(W)×3,090mm(D)×1,800mm(H)

1,650mm(W)×1,200mm(D)×1,735mm(H)

RAD-2010m/12RAD-2010F/12

Non-UV Type Dicing Tape

Application

For Si Wafer

For Full-Cut Laser Dicing

Base Material

PVC

PVC

PVC

Feature

For Small Die

For Large Die & Easy Pick Up

Excellent Visibility & Evenness

Primal Product Name

G-19D/19SHD/260H

POFor Large Die G-64H

G-11D

G-260H

PVCRoHS 2.0 compliance G-11D/19D/19SHD

SpecialStandard G-765/965/967

UV Curable BG Tape

Dicing Die Bonding Tape

Process

Back Grinding

DBG (Dicing Before Grinding)SDBG(Stealth Dicing Before Grinding)

Application

Standard

For Ultra Thin Grinding (thickness>40µm)

For Micro Bump (including ink dot)

For Medium Bump (height<100μm)

For High Bump (height<250µm)

For Small T.T.V.

Primal Product Name

E-4141A/6152B

E-8180HR

E-6142A/6152B

E-4230BS/8310LS342F/8330HR

E-8510HR/9485

Antistatic E-6130AS

E-3100UN

For Bump E-3281B

Die to Substrate

Die to Die

Die to Die (Same Size Stack /FOW)

For DBG (Dicing Before Grinding)

Backside Coating Tape

Type Primal Product Name

LC88 seriesGeneral

Thickness Line-up

25 µm, 40 µm

Application Type

Cure

Cure

Cureless

Cure

Cure

Primal Product Name

LE82-20

LE5000S, LE82-20

LE4424

LE4777H

LD01D-7

Adhesive Thickness Line-up

20 μm

20 μm

75 µm

7 µm

Process

Back Grinding

Application

Standard (thickness>75µm)

For Thin Grinding (thickness>50µm)

Primal Product Name

P-4130A/4140A/4205B

P-7125/7180LS459H

Infrared-Transmission 25 μm, 40 μm LC28x6 series

For Stealth Dicing 25 μm LC87 series

For Thin Wafer 25 µm, 40 µm LC86R series

Non-UV Type BG Tape

Base Material

PI

PET

Adhesive Type

Silicone

Acrylic

Primal Product Name

C-902/903

H-231F

Heat Resistant Tape

RAD-2500m/12

200mm, 300mm*Two 150mm work pieces can be processed at the time (Option)

300mm Semi-Automatic BG Tape Laminator

■ Simply place the wafer on the application table, then back grinding tape lamination and periphery cutting automatically begins

■ Customized recipes lamination is also available■ Simple touch screen operation

Wafer Size

Equipment Size

Equipment Size

150mm, 200mm, 300mm

300mm Semi-Automatic BG Tape Remover

■ Simply place the wafer on the application table, then back grinding tape peeling automatically begins■ Removes back grinding tape by heat seal type peeling tape to the periphery of the wafer■ Simple touch screen operation

Wafer Size

Equipment Size

200mm, 300mm

300mm Semi-Automatic Wafer Mounter

■ Simply place the wafer and ring frame on the application table, then pre-cut dicing tape is automatically applied

■ By using a pre-cut tape, the tape cutting process is omitted making the operation safer■ Easy button operation

■ Simply place the wafer-mounted work piece on the application table, then UV irradiation automatically begins

■ Simple touch screen operation■ Equipped with nitrogen purge function

200mm Semi-Automatic Wafer Mounter

300mm Semi-Automatic UV Irradiation System

Wafer Size

Equipment Size

300mm*Sizes other than 300mm are for option

*With table fully advanced: max. 1,380mm (D)

Wafer Size

Equipment Size

200mm

*With table fully advanced: max. 1,190mm (D)

*There are also models corresponding to the non pre-cut products: RAD-2500m/12IPC

Wafer Size

Equipment Size

830mm(W)×1,042mm(D)×1,350mm(H)

915mm(W)×1,080mm(D)×1,350mm(H)

671mm(W)×950mm(D)×527mm(H) 568mm(W)×850mm(D)×527mm(H)

300mm Semi-Automatic Vacuum Mounter

■ By simply setting the wafer and tape-mounted ring frame, wafer mounting is automatically processed■ Management of mounting condition is operated simply with a touch screen■ Tape mounting without contact to the wafer surface is achived with the special non-contact table

Wafer Size 300mm*Sizes under 300mm are for option

*Tape mounting for ring frame is required separately: RAD-2500m/12

1,100mm(W)×600mm(D)×1,100mm(H)

870mm(W)×1,080mm(D)×1,185mm(H)

UV Irradiation

Dicing

CP2007

•

• Advanced Materials Operations2-1-2 Koraku Bunkyo-ku, Tokyo 112-0004 JapanTEL. +81-3-3868-7737 FAX. +81-3-3868-7726 http://www.lintec-global.com

Advanced Technologies Division15930 S. 48th Street, Suite 110, Phoenix, AZ 85048 USATEL. +1-480-966-0784 FAX. +1-480-966-5321 http://www.lintec-usa.comEmail: info@lintec-usa.com

LINTEC Corporation

LINTEC OF AMERICA, INC.

www.adwill-global.com/en

UV Curable Dicing Tape

Application Feature

High Expandability

Anti-chipping

Easy Pick Up

Antistatic

High Adhesion

Standard

Standard

Antistatic

Antistatic

Expand and Break

・Expand and Break・Capability of SD through tape・Antistatic ・Expand and Break・Capability of SD through tape

Standard

Standard

Standard

Base Material

PVC

PO

PVC

PO

PVC

PO

PVC

PO

PO

PET

PO

PO

PO

PVC

PO

PO

PVC

PO

PVC

PO

Primal Product Name

D-17xD series

D-670/675

D-17xD series

D-676H(S)/678/686H

D-17xD series

D-485H/678/686H

D-174E/820

D-877H/867A

D-611/611H

RoHS 2.0 compliance PVC D-17xD series

D-210N/241

D-698/841

D-510T(S)/510W

D-830J/841/825/825W/846/847W

D-17xD series

D-611H/678

PVC D-820

D-456H

D-821HS

D-676(S)/676H(S)/686H

D-17xD series

D-485H

Special D-765

For Si Wafer

For Glass/Ceramics

For Package Substrate

For Stealth Dicing (SD)

For Wafer with LC Tape

For TAIKO Wafer

For Full-cut Laser Dicing

200mm, 300mm

200mm, 300mm

200mm, 300mm

200mm, 300mm

200mm, 300mm

200mm, 300mm

RAD-3520F/12 RAD-3500m/12BG Tape

Wafer Fully-Automatic

BG Tape LaminatorBG Tape

Semi-AutomaticRAD-3520F/12P series RAD-3500m/1212"

TypeProduct Name E series

UV Curable Non-UV

RAD-2510 F/12Sa RAD-2512F/12

Vacuum Wafer Mounter

Wafer Fully-AutomaticWafer Mounter

Semi-Automatic

RAD-2510 F/12Sa8" RAD-2500 F/8

RAD-2500m/12RAD-2500m/8

12"

Wafer Fully-AutomaticRAD-2512F/12

Semi-AutomaticRAD-2512/m1212"

Peeling Tape

D series G seriesType

Product NameUV Curable Non-UV

Dicing Tape

S seriesProduct Name

RAD-3600 F/12 RAD-3500m/12

Wafer Fully-Automatic Semi-AutomaticRAD-3600F/12 RAD-3500m/12 12"

LC Tape Laminator

RAD-2010 m/12RAD-2010 F/12

Wafer Fully-Automatic

UV Irradiation SystemSemi-Automatic

8" RAD-2000F/812"

Dicing Die Bonding TapeStandardTypeLE series

DBGLD seriesProduct Name

LC seriesProduct Name

Backside Coating Tape

Backside Coating Tape

Die Bonding

Molding

Inspection

Die Bonding

Wire Bonding

Molding

Flip Chip Bonding

Wafer MountingBG Tape Peeling

BG Tape Lamination

Backside Coating Tape LaminationLaser MarkingWafer Mounting

Back Grinding

Pick Up

Single Crystal Growth Wafer Cutting Wafer Grinding Surface Oxidation Resist Coating

Exposure

Development

Resist Removal

Ion Implantation and Diffusion

Electrode Deposition

Inspection

RAD series Semi-Automatic Equipment Line-upRAD series Fully-Automatic Equipment Line-up

300mm Fully-Automatic BG Tape Laminator

300mm Fully-Automatic BG Tape Remover

300mm Fully-Automatic Multifunction Wafer Mounter

300mm Fully-Automatic Vacuum Mounter

300mm Fully-Automatic LC Tape Laminator

300mm Fully-Automatic UV irradiation System

■ Reduced wafer warpage with programmable tape tension■ Programmable cutting angles to reduce wafer damage and provide the cleanest possible cut■ Space-saving and High throughput(UPH100 with option/Standard spec is UPH70)

■ Reduced wafer stress during peeling using LINTEC proprietary new peeling method■ Zero wafer backside contact during wafer handling and peeling which reduces the risk of wafer damage

■ Space-saving■ High throughput■ Lowered risk of wafer damage by reducing the number of times the wafer needs to be transported between

units in the equipment■ LINTEC-developed peeling mechanism removes BG tape from ultra-thin wafer without damaging the wafer

■ Vacuum lamination to protect pressure sensitive devices and allow the dicing tape to conform to a variety of backside sufaces

■ Zero circuit surface contact during dicing tape lamination■ Zero drect contact with the backside of the wafer

■ Precise tape lamination without voids■ Inline pre-cutting method to prevent damage on the edge of the wafer

■ More compact with an integrated cassette loader and unloader.Provides high-throughput with two processing lines.

■ Supports the optimization of illuminance and light intensity with high output UV lamp and nitrogen purge function that provides high quality and high performance.

■ A large touch panel improves operability.Ensures safety for operations and maintenance, complying with the SEMI safety guidelines.

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Thin Wafer&

Tough ChipSolutions

1,250mm(W)x1,850mm(D)x1,860mm(H)

1,440mm(W)×2,105mm(D)×1,800mm(H)

2,203mm(W)×3,092mm(D)×1,800mm(H)

1,550mm(W)×1,950mm(D)×1,800mm(H)

2,165mm(W)×3,090mm(D)×1,800mm(H)

1,650mm(W)×1,200mm(D)×1,735mm(H)

RAD-2010m/12RAD-2010F/12

Non-UV Type Dicing Tape

Application

For Si Wafer

For Full-Cut Laser Dicing

Base Material

PVC

PVC

PVC

Feature

For Small Die

For Large Die & Easy Pick Up

Excellent Visibility & Evenness

Primal Product Name

G-19D/19SHD/260H

POFor Large Die G-64H

G-11D

G-260H

PVCRoHS 2.0 compliance G-11D/19D/19SHD

SpecialStandard G-765/965/967

UV Curable BG Tape

Dicing Die Bonding Tape

Process

Back Grinding

DBG (Dicing Before Grinding)SDBG(Stealth Dicing Before Grinding)

Application

Standard

For Ultra Thin Grinding (thickness>40µm)

For Micro Bump (including ink dot)

For Medium Bump (height<100μm)

For High Bump (height<250µm)

For Small T.T.V.

Primal Product Name

E-6142S/6152B

E-8180HR

E-6142A/6152B

E-4230BS/8310LS342F/8330HR

E-8510HR/9485

Antistatic E-6130AS

E-3100UN

For Bump E-3281B

Die to Substrate

Die to Die

Die to Die (Same Size Stack /FOW)

For DBG (Dicing Before Grinding)

Backside Coating Tape

Type Primal Product Name

LC88 seriesGeneral

Thickness Line-up

25 µm, 40 µm

Application Type

Cure

Cure

Cureless

Cure

Cure

Primal Product Name

LE82-20

LE5000S, LE82-20

LE4424

LE4777H

LD01D-7

Adhesive Thickness Line-up

20 μm

20 μm

75 µm

7 µm

Process

Back Grinding

Application

Standard (thickness>75µm)

For Thin Grinding (thickness>50µm)

Primal Product Name

P-4130A/4140A/4205B

P-7125/7180LS459H

Infrared-Transmission 25 μm, 40 μm LC28x6 series

For Stealth Dicing 25 μm LC87 series

For Thin Wafer 25 µm, 40 µm LC86R series

Non-UV Type BG Tape

Base Material

PI

PET

Adhesive Type

Silicone

Acrylic

Primal Product Name

C-902/903

H-231F

Heat Resistant Tape

RAD-2500m/12

200mm, 300mm*Two 150mm work pieces can be processed at the time (Option)

300mm Semi-Automatic BG Tape Laminator

■ Simply place the wafer on the application table, then back grinding tape lamination and periphery cutting automatically begins

■ Customized recipes lamination is also available■ Simple touch screen operation

Wafer Size

Equipment Size

Equipment Size

150mm, 200mm, 300mm

300mm Semi-Automatic BG Tape Remover

■ Simply place the wafer on the application table, then back grinding tape peeling automatically begins■ Removes back grinding tape by heat seal type peeling tape to the periphery of the wafer■ Simple touch screen operation

Wafer Size

Equipment Size

200mm, 300mm

300mm Semi-Automatic Wafer Mounter

■ Simply place the wafer and ring frame on the application table, then pre-cut dicing tape is automatically applied

■ By using a pre-cut tape, the tape cutting process is omitted making the operation safer■ Easy button operation

■ Simply place the wafer-mounted work piece on the application table, then UV irradiation automatically begins

■ Simple touch screen operation■ Equipped with nitrogen purge function

200mm Semi-Automatic Wafer Mounter

300mm Semi-Automatic UV Irradiation System

Wafer Size

Equipment Size

300mm*Sizes other than 300mm are for option

*With table fully advanced: max. 1,380mm (D)

Wafer Size

Equipment Size

200mm

*With table fully advanced: max. 1,190mm (D)

*There are also models corresponding to the non pre-cut products: RAD-2500m/12IPC

Wafer Size

Equipment Size

830mm(W)×1,042mm(D)×1,350mm(H)

915mm(W)×1,080mm(D)×1,350mm(H)

671mm(W)×950mm(D)×527mm(H) 568mm(W)×850mm(D)×527mm(H)

300mm Semi-Automatic Vacuum Mounter

■ By simply setting the wafer and tape-mounted ring frame, wafer mounting is automatically processed■ Management of mounting condition is operated simply with a touch screen■ Tape mounting without contact to the wafer surface is achived with the special non-contact table

Wafer Size 300mm*Sizes under 300mm are for option

*Tape mounting for ring frame is required separately: RAD-2500m/12

1,100mm(W)×600mm(D)×1,100mm(H)

870mm(W)×1,080mm(D)×1,185mm(H)

UV Irradiation

Dicing

CP2007

•

• Advanced Materials Operations2-1-2 Koraku Bunkyo-ku, Tokyo 112-0004 JapanTEL. +81-3-3868-7737 FAX. +81-3-3868-7726 http://www.lintec-global.com

Advanced Technologies Division15930 S. 48th Street, Suite 110, Phoenix, AZ 85048 USATEL. +1-480-966-0784 FAX. +1-480-966-5321 http://www.lintec-usa.comEmail: info@lintec-usa.com

LINTEC Corporation

LINTEC OF AMERICA, INC.

www.adwill-global.com/en

UV Curable Dicing Tape

Application Feature

High Expandability

Anti-chipping

Easy Pick Up

Antistatic

High Adhesion

Standard

Standard

Antistatic

Antistatic

Expand and Break

・Expand and Break・Capability of SD through tape・Antistatic ・Expand and Break・Capability of SD through tape

Standard

Standard

Standard

Base Material

PVC

PO

PVC

PO

PVC

PO

PVC

PO

PO

PET

PO

PO

PO

PVC

PO

PO

PVC

PO

PVC

PO

Primal Product Name

D-17xD series

D-670/675

D-17xD series

D-676H(S)/678/686H

D-17xD series

D-485H/678/686H

D-174E/820

D-877H/867A

D-611/611H

RoHS 2.0 compliance PVC D-17xD series

D-210N/241

D-698/841

D-510T(S)/510W

D-830J/841/825/825W/846/847W

D-17xD series

D-611H/678

PVC D-820

D-456H

D-821HS

D-676(S)/676H(S)/686H

D-17xD series

D-485H

Special D-765

For Si Wafer

For Glass/Ceramics

For Package Substrate

For Stealth Dicing (SD)

For Wafer with LC Tape

For TAIKO Wafer

For Full-cut Laser Dicing

200mm, 300mm

200mm, 300mm

200mm, 300mm

200mm, 300mm

200mm, 300mm

200mm, 300mm

RAD-3520F/12 RAD-3500m/12BG Tape

Wafer Fully-Automatic

BG Tape LaminatorBG Tape

Semi-AutomaticRAD-3520F/12P series RAD-3500m/1212"

TypeProduct Name E series

UV Curable Non-UV

RAD-2510 F/12Sa RAD-2512F/12

Vacuum Wafer Mounter

Wafer Fully-AutomaticWafer Mounter

Semi-Automatic

RAD-2510 F/12Sa8" RAD-2500 F/8

RAD-2500m/12RAD-2500m/8

12"

Wafer Fully-AutomaticRAD-2512F/12

Semi-AutomaticRAD-2512/m1212"

Peeling Tape

D series G seriesType

Product NameUV Curable Non-UV

Dicing Tape

S seriesProduct Name

RAD-3600 F/12 RAD-3500m/12

Wafer Fully-Automatic Semi-AutomaticRAD-3600F/12 RAD-3500m/12 12"

LC Tape Laminator

RAD-2010 m/12RAD-2010 F/12

Wafer Fully-Automatic

UV Irradiation SystemSemi-Automatic

8" RAD-2000F/812"

Dicing Die Bonding TapeStandardTypeLE series

DBGLD seriesProduct Name

LC seriesProduct Name

Backside Coating Tape

Backside Coating Tape

Die Bonding

Molding

Inspection

Die Bonding

Wire Bonding

Molding

Flip Chip Bonding

Wafer MountingBG Tape Peeling

BG Tape Lamination

Backside Coating Tape LaminationLaser MarkingWafer Mounting

Back Grinding

Pick Up

Single Crystal Growth Wafer Cutting Wafer Grinding Surface Oxidation Resist Coating

Exposure

Development

Resist Removal

Ion Implantation and Diffusion

Electrode Deposition

Inspection

RAD series Semi-Automatic Equipment Line-upRAD series Fully-Automatic Equipment Line-up

300mm Fully-Automatic BG Tape Laminator

300mm Fully-Automatic BG Tape Remover

300mm Fully-Automatic Multifunction Wafer Mounter

300mm Fully-Automatic Vacuum Mounter

300mm Fully-Automatic LC Tape Laminator

300mm Fully-Automatic UV irradiation System

■ Reduced wafer warpage with programmable tape tension■ Programmable cutting angles to reduce wafer damage and provide the cleanest possible cut■ Space-saving and High throughput(UPH100 with option/Standard spec is UPH70)

■ Reduced wafer stress during peeling using LINTEC proprietary new peeling method■ Zero wafer backside contact during wafer handling and peeling which reduces the risk of wafer damage

■ Space-saving■ High throughput■ Lowered risk of wafer damage by reducing the number of times the wafer needs to be transported between

units in the equipment■ LINTEC-developed peeling mechanism removes BG tape from ultra-thin wafer without damaging the wafer

■ Vacuum lamination to protect pressure sensitive devices and allow the dicing tape to conform to a variety of backside sufaces

■ Zero circuit surface contact during dicing tape lamination■ Zero drect contact with the backside of the wafer

■ Precise tape lamination without voids■ Inline pre-cutting method to prevent damage on the edge of the wafer

■ More compact with an integrated cassette loader and unloader.Provides high-throughput with two processing lines.

■ Supports the optimization of illuminance and light intensity with high output UV lamp and nitrogen purge function that provides high quality and high performance.

■ A large touch panel improves operability.Ensures safety for operations and maintenance, complying with the SEMI safety guidelines.

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Thin Wafer&

Tough ChipSolutions

1,250mm(W)x1,850mm(D)x1,860mm(H)

1,440mm(W)×2,105mm(D)×1,800mm(H)

2,203mm(W)×3,092mm(D)×1,800mm(H)

1,550mm(W)×1,950mm(D)×1,800mm(H)

2,165mm(W)×3,090mm(D)×1,800mm(H)

1,650mm(W)×1,200mm(D)×1,735mm(H)

RAD-2010m/12RAD-2010F/12

Non-UV Type Dicing Tape

Application

For Si Wafer

For Full-Cut Laser Dicing

Base Material

PVC

PVC

PVC

Feature

For Small Die

For Large Die & Easy Pick Up

Excellent Visibility & Evenness

Primal Product Name

G-19D/G-19SHD/260H

POFor Large Die G-64H

G-11D

G-260H

PVCRoHS 2.0 compliance G-11D/19D/19SHD

SpecialStandard G-765/965/967

UV Curable BG Tape

Dicing Die Bonding Tape

Process

Back Grinding

DBG (Dicing Before Grinding)SDBG(Stealth Dicing Before Grinding)

Application

Standard

For Ultra Thin Grinding (thickness>40µm)

For Micro Bump (including ink dot)

For Medium Bump (height<100μm)

For High Bump (height<250µm)

For Small T.T.V.

Primal Product Name

E-4141A/6152B

E-8180HR

E-6142A/6152B

E-4230BS/8310LS342F/8330HR

E-8510HR/9485

Antistatic E-6130AS

E-3100UN

For Bump E-3281B

Die to Substrate

Die to Die

Die to Die (Same Size Stack /FOW)

For DBG (Dicing Before Grinding)

Backside Coating Tape

Type Primal Product Name

LC88 seriesGeneral

Thickness Line-up

25 µm, 40 µm

Application Type

Cure

Cure

Cureless

Cure

Cure

Primal Product Name

LE82-20

LE5000S, LE82-20

LE4424

LE4777H

LD01D-7

Adhesive Thickness Line-up

20 μm

20 μm

75 µm

7 µm

Process

Back Grinding

Application

Standard (thickness>75µm)

For Thin Grinding (thickness>50µm)

Primal Product Name

P-4130A/4140A/4205B

P-7125/7180LS459H

Infrared-Transmission 25 μm, 40 μm LC28x6 series

For Stealth Dicing 25 μm LC87 series

For Thin Wafer 25 µm, 40 µm LC86R series

Non-UV Type BG Tape

Base Material

PI

PET

Adhesive Type

Silicone

Acrylic

Primal Product Name

C-902/903

H-231F

Heat Resistant Tape

RAD-2500m/12

200mm, 300mm*Two 150mm work pieces can be processed at the time (Option)

300mm Semi-Automatic BG Tape Laminator

■ Simply place the wafer on the application table, then back grinding tape lamination and periphery cutting automatically begins

■ Customized recipes lamination is also available■ Simple touch screen operation

Wafer Size

Equipment Size

Equipment Size

150mm, 200mm, 300mm

300mm Semi-Automatic BG Tape Remover

■ Simply place the wafer on the application table, then back grinding tape peeling automatically begins■ Removes back grinding tape by heat seal type peeling tape to the periphery of the wafer■ Simple touch screen operation

Wafer Size

Equipment Size

200mm, 300mm

300mm Semi-Automatic Wafer Mounter

■ Simply place the wafer and ring frame on the application table, then pre-cut dicing tape is automatically applied

■ By using a pre-cut tape, the tape cutting process is omitted making the operation safer■ Easy button operation

■ Simply place the wafer-mounted work piece on the application table, then UV irradiation automatically begins

■ Simple touch screen operation■ Equipped with nitrogen purge function

200mm Semi-Automatic Wafer Mounter

300mm Semi-Automatic UV Irradiation System

Wafer Size

Equipment Size

300mm*Sizes other than 300mm are for option

*With table fully advanced: max. 1,380mm (D)

Wafer Size

Equipment Size

200mm

*With table fully advanced: max. 1,190mm (D)

*There are also models corresponding to the non pre-cut products: RAD-2500m/12IPC

Wafer Size

Equipment Size

830mm(W)×1,042mm(D)×1,350mm(H)

915mm(W)×1,080mm(D)×1,350mm(H)

671mm(W)×950mm(D)×527mm(H) 568mm(W)×850mm(D)×527mm(H)

300mm Semi-Automatic Vacuum Mounter

■ By simply setting the wafer and tape-mounted ring frame, wafer mounting is automatically processed■ Management of mounting condition is operated simply with a touch screen■ Tape mounting without contact to the wafer surface is achived with the special non-contact table

Wafer Size 300mm*Sizes under 300mm are for option

*Tape mounting for ring frame is required separately: RAD-2500m/12

1,100mm(W)×600mm(D)×1,100mm(H)

870mm(W)×1,080mm(D)×1,185mm(H)

UV Irradiation

Dicing

CP2007

•

• Advanced Materials Operations2-1-2 Koraku Bunkyo-ku, Tokyo 112-0004 JapanTEL. +81-3-3868-7737 FAX. +81-3-3868-7726 http://www.lintec-global.com

Advanced Technologies Division15930 S. 48th Street, Suite 110, Phoenix, AZ 85048 USATEL. +1-480-966-0784 FAX. +1-480-966-5321 http://www.lintec-usa.comEmail: info@lintec-usa.com

LINTEC Corporation

LINTEC OF AMERICA, INC.

www.adwill-global.com/en

UV Curable Dicing Tape

Application Feature

High Expandability

Anti-chipping

Easy Pick Up

Antistatic

High Adhesion

Standard

Standard

Antistatic

Antistatic

Expand and Break

・Expand and Break・Capability of SD through tape・Antistatic ・Expand and Break・Capability of SD through tape

Standard

Standard

Standard

Base Material

PVC

PO

PVC

PO

PVC

PO

PVC

PO

PO

PET

PO

PO

PO

PVC

PO

PO

PVC

PO

PVC

PO

Primal Product Name

D-17xD series

D-670/675

D-17xD series

D-676H(S)/678/686H

D-17xD series

D-485H/678/686H

D-174E/820

D-877H/867A

D-611/611H

RoHS 2.0 compliance PVC D-17xD series

D-210N/241

D-698/841

D-510T(S)/510W

D-830J/841/825/825W/846/847W

D-17xD series

D-611H/678

PVC D-820

D-456H

D-821HS

D-676(S)/676H(S)/686H

D-17xD series

D-485H

Special D-765

For Si Wafer

For Glass/Ceramics

For Package Substrate

For Stealth Dicing (SD)

For Wafer with LC Tape

For TAIKO Wafer

For Full-cut Laser Dicing

200mm, 300mm

200mm, 300mm

200mm, 300mm

200mm, 300mm

200mm, 300mm

200mm, 300mm

RAD-3520F/12 RAD-3500m/12BG Tape

Wafer Fully-Automatic

BG Tape LaminatorBG Tape

Semi-AutomaticRAD-3520F/12P series RAD-3500m/1212"

TypeProduct Name E series

UV Curable Non-UV

RAD-2510 F/12Sa RAD-2512F/12

Vacuum Wafer Mounter

Wafer Fully-AutomaticWafer Mounter

Semi-Automatic

RAD-2510 F/12Sa8" RAD-2500 F/8

RAD-2500m/12RAD-2500m/8

12"

Wafer Fully-AutomaticRAD-2512F/12

Semi-AutomaticRAD-2512/m1212"

Peeling Tape

D series G seriesType

Product NameUV Curable Non-UV

Dicing Tape

S seriesProduct Name

RAD-3600 F/12 RAD-3500m/12

Wafer Fully-Automatic Semi-AutomaticRAD-3600F/12 RAD-3500m/12 12"

LC Tape Laminator

RAD-2010 m/12RAD-2010 F/12

Wafer Fully-Automatic

UV Irradiation SystemSemi-Automatic

8" RAD-2000F/812"

Dicing Die Bonding TapeStandardTypeLE series

DBGLD seriesProduct Name

LC seriesProduct Name

Backside Coating Tape

Backside Coating Tape

Die Bonding

Molding

Inspection

Die Bonding

Wire Bonding

Molding

Flip Chip Bonding

Wafer MountingBG Tape Peeling

BG Tape Lamination

Backside Coating Tape LaminationLaser MarkingWafer Mounting

Back Grinding

Pick Up

Single Crystal Growth Wafer Cutting Wafer Grinding Surface Oxidation Resist Coating

Exposure

Development

Resist Removal

Ion Implantation and Diffusion

Electrode Deposition

Inspection

RAD series Semi-Automatic Equipment Line-upRAD series Fully-Automatic Equipment Line-up

300mm Fully-Automatic BG Tape Laminator

300mm Fully-Automatic BG Tape Remover

300mm Fully-Automatic Multifunction Wafer Mounter

300mm Fully-Automatic Vacuum Mounter

300mm Fully-Automatic LC Tape Laminator

300mm Fully-Automatic UV irradiation System

■ Reduced wafer warpage with programmable tape tension■ Programmable cutting angles to reduce wafer damage and provide the cleanest possible cut■ Space-saving and High throughput(UPH100 with option/Standard spec is UPH70)

■ Reduced wafer stress during peeling using LINTEC proprietary new peeling method■ Zero wafer backside contact during wafer handling and peeling which reduces the risk of wafer damage

■ Space-saving■ High throughput■ Lowered risk of wafer damage by reducing the number of times the wafer needs to be transported between

units in the equipment■ LINTEC-developed peeling mechanism removes BG tape from ultra-thin wafer without damaging the wafer

■ Vacuum lamination to protect pressure sensitive devices and allow the dicing tape to conform to a variety of backside sufaces

■ Zero circuit surface contact during dicing tape lamination■ Zero drect contact with the backside of the wafer

■ Precise tape lamination without voids■ Inline pre-cutting method to prevent damage on the edge of the wafer

■ More compact with an integrated cassette loader and unloader.Provides high-throughput with two processing lines.

■ Supports the optimization of illuminance and light intensity with high output UV lamp and nitrogen purge function that provides high quality and high performance.

■ A large touch panel improves operability.Ensures safety for operations and maintenance, complying with the SEMI safety guidelines.

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Thin Wafer&

Tough ChipSolutions

1,250mm(W)x1,850mm(D)x1,860mm(H)

1,440mm(W)×2,105mm(D)×1,800mm(H)

2,203mm(W)×3,092mm(D)×1,800mm(H)

1,550mm(W)×1,950mm(D)×1,800mm(H)

2,165mm(W)×3,090mm(D)×1,800mm(H)

1,650mm(W)×1,200mm(D)×1,735mm(H)

RAD-2010m/12RAD-2010F/12

Non-UV Type Dicing Tape

Application

For Si Wafer

For Full-Cut Laser Dicing

Base Material

PVC

PVC

PVC

Feature

For Small Die

For Large Die & Easy Pick Up

Excellent Visibility & Evenness

Primal Product Name

G-19D/G-19SHD/260H

POFor Large Die G-64H

G-11D

G-260H

PVCRoHS 2.0 compliance G-11D/19D/19SHD

SpecialStandard G-765/965/967

UV Curable BG Tape

Dicing Die Bonding Tape

Process

Back Grinding

DBG (Dicing Before Grinding)SDBG(Stealth Dicing Before Grinding)

Application

Standard

For Ultra Thin Grinding (thickness>40µm)

For Micro Bump (including ink dot)

For Medium Bump (height<100μm)

For High Bump (height<250µm)

For Small T.T.V.

Primal Product Name

E-4141A/6152B

E-8180HR

E-6142A/6152B

E-4230BS/8310LS342F/8330HR

E-8510HR/9485

Antistatic E-6130AS

E-3100UN

For Bump E-3281B

Die to Substrate

Die to Die

Die to Die (Same Size Stack /FOW)

For DBG (Dicing Before Grinding)

Backside Coating Tape

Type Primal Product Name

LC88 seriesGeneral

Thickness Line-up

25 µm, 40 µm

Application Type

Cure

Cure

Cureless

Cure

Cure

Primal Product Name

LE82-20

LE5000S, LE82-20

LE4424

LE4777H

LD01D-7

Adhesive Thickness Line-up

20 μm

20 μm

75 µm

7 µm

Process

Back Grinding

Application

Standard (thickness>75µm)

For Thin Grinding (thickness>50µm)

Primal Product Name

P-4130A/4140A/4205B

P-7125/7180LS459H

Infrared-Transmission 25 μm, 40 μm LC28x6 series

For Stealth Dicing 25 μm LC87 series

For Thin Wafer 25 µm, 40 µm LC86R series

Non-UV Type BG Tape

Base Material

PI

PET

Adhesive Type

Silicone

Acrylic

Primal Product Name

C-902/903

H-231F

Heat Resistant Tape

RAD-2500m/12

200mm, 300mm*Two 150mm work pieces can be processed at the time (Option)

300mm Semi-Automatic BG Tape Laminator

■ Simply place the wafer on the application table, then back grinding tape lamination and periphery cutting automatically begins

■ Customized recipes lamination is also available■ Simple touch screen operation

Wafer Size

Equipment Size

Equipment Size

150mm, 200mm, 300mm

300mm Semi-Automatic BG Tape Remover

■ Simply place the wafer on the application table, then back grinding tape peeling automatically begins■ Removes back grinding tape by heat seal type peeling tape to the periphery of the wafer■ Simple touch screen operation

Wafer Size

Equipment Size

200mm, 300mm

300mm Semi-Automatic Wafer Mounter

■ Simply place the wafer and ring frame on the application table, then pre-cut dicing tape is automatically applied

■ By using a pre-cut tape, the tape cutting process is omitted making the operation safer■ Easy button operation

■ Simply place the wafer-mounted work piece on the application table, then UV irradiation automatically begins

■ Simple touch screen operation■ Equipped with nitrogen purge function

200mm Semi-Automatic Wafer Mounter

300mm Semi-Automatic UV Irradiation System

Wafer Size

Equipment Size

300mm*Sizes other than 300mm are for option

*With table fully advanced: max. 1,380mm (D)

Wafer Size

Equipment Size

200mm

*With table fully advanced: max. 1,190mm (D)

*There are also models corresponding to the non pre-cut products: RAD-2500m/12IPC

Wafer Size

Equipment Size

830mm(W)×1,042mm(D)×1,350mm(H)

915mm(W)×1,080mm(D)×1,350mm(H)

671mm(W)×950mm(D)×527mm(H) 568mm(W)×850mm(D)×527mm(H)

300mm Semi-Automatic Vacuum Mounter

■ By simply setting the wafer and tape-mounted ring frame, wafer mounting is automatically processed■ Management of mounting condition is operated simply with a touch screen■ Tape mounting without contact to the wafer surface is achived with the special non-contact table

Wafer Size 300mm*Sizes under 300mm are for option

*Tape mounting for ring frame is required separately: RAD-2500m/12

1,100mm(W)×600mm(D)×1,100mm(H)

870mm(W)×1,080mm(D)×1,185mm(H)

UV Irradiation

Dicing

CP2007

•

• Advanced Materials Operations2-1-2 Koraku Bunkyo-ku, Tokyo 112-0004 JapanTEL. +81-3-3868-7737 FAX. +81-3-3868-7726 http://www.lintec-global.com

Advanced Technologies Division15930 S. 48th Street, Suite 110, Phoenix, AZ 85048 USATEL. +1-480-966-0784 FAX. +1-480-966-5321 http://www.lintec-usa.comEmail: info@lintec-usa.com

LINTEC Corporation

LINTEC OF AMERICA, INC.

www.adwill-global.com/en

UV Curable Dicing Tape

Application Feature

High Expandability

Anti-chipping

Easy Pick Up

Antistatic

High Adhesion

Standard

Standard

Antistatic

Antistatic

Expand and Break

・Expand and Break・Capability of SD through tape・Antistatic ・Expand and Break・Capability of SD through tape

Standard

Standard

Standard

Base Material

PVC

PO

PVC

PO

PVC

PO

PVC

PO

PO

PET

PO

PO

PO

PVC

PO

PO

PVC

PO

PVC

PO

Primal Product Name

D-17xD series

D-670/675

D-17xD series

D-676H(S)/678/686H

D-17xD series

D-485H/678/686H

D-174E/820

D-877H/867A

D-611/611H

RoHS 2.0 compliance PVC D-17xD series

D-210N/241

D-698/841

D-510T(S)/510W

D-830J/841/825/825W/846/847W

D-17xD series

D-611H/678

PVC D-820

D-456H

D-821HS

D-676(S)/676H(S)/686H

D-17xD series

D-485H

Special D-765

For Si Wafer

For Glass/Ceramics

For Package Substrate

For Stealth Dicing (SD)

For Wafer with LC Tape

For TAIKO Wafer

For Full-cut Laser Dicing

200mm, 300mm

200mm, 300mm

200mm, 300mm

200mm, 300mm

200mm, 300mm

200mm, 300mm

RAD-3520F/12 RAD-3500m/12BG Tape

Wafer Fully-Automatic

BG Tape LaminatorBG Tape

Semi-AutomaticRAD-3520F/12P series RAD-3500m/1212"

TypeProduct Name E series

UV Curable Non-UV

RAD-2510 F/12Sa RAD-2512F/12

Vacuum Wafer Mounter

Wafer Fully-AutomaticWafer Mounter

Semi-Automatic

RAD-2510 F/12Sa8" RAD-2500 F/8

RAD-2500m/12RAD-2500m/8

12"

Wafer Fully-AutomaticRAD-2512F/12

Semi-AutomaticRAD-2512/m1212"

Peeling Tape

D series G seriesType

Product NameUV Curable Non-UV

Dicing Tape

S seriesProduct Name

RAD-3600 F/12 RAD-3500m/12

Wafer Fully-Automatic Semi-AutomaticRAD-3600F/12 RAD-3500m/12 12"

LC Tape Laminator

RAD-2010 m/12RAD-2010 F/12

Wafer Fully-Automatic

UV Irradiation SystemSemi-Automatic

8" RAD-2000F/812"

Dicing Die Bonding TapeStandardTypeLE series

DBGLD seriesProduct Name

LC seriesProduct Name

Backside Coating Tape

Backside Coating Tape

Die Bonding

Molding

Inspection

Die Bonding

Wire Bonding

Molding

Flip Chip Bonding

Wafer MountingBG Tape Peeling

BG Tape Lamination

Backside Coating Tape LaminationLaser MarkingWafer Mounting

Back Grinding

Pick Up

Single Crystal Growth Wafer Cutting Wafer Grinding Surface Oxidation Resist Coating

Exposure

Development

Resist Removal

Ion Implantation and Diffusion

Electrode Deposition

Inspection

RAD series Semi-Automatic Equipment Line-upRAD series Fully-Automatic Equipment Line-up

300mm Fully-Automatic BG Tape Laminator

300mm Fully-Automatic BG Tape Remover

300mm Fully-Automatic Multifunction Wafer Mounter

300mm Fully-Automatic Vacuum Mounter

300mm Fully-Automatic LC Tape Laminator

300mm Fully-Automatic UV irradiation System

■ Reduced wafer warpage with programmable tape tension■ Programmable cutting angles to reduce wafer damage and provide the cleanest possible cut■ Space-saving and High throughput(UPH100 with option/Standard spec is UPH70)

■ Reduced wafer stress during peeling using LINTEC proprietary new peeling method■ Zero wafer backside contact during wafer handling and peeling which reduces the risk of wafer damage

■ Space-saving■ High throughput■ Lowered risk of wafer damage by reducing the number of times the wafer needs to be transported between

units in the equipment■ LINTEC-developed peeling mechanism removes BG tape from ultra-thin wafer without damaging the wafer

■ Vacuum lamination to protect pressure sensitive devices and allow the dicing tape to conform to a variety of backside sufaces

■ Zero circuit surface contact during dicing tape lamination■ Zero drect contact with the backside of the wafer

■ Precise tape lamination without voids■ Inline pre-cutting method to prevent damage on the edge of the wafer

■ More compact with an integrated cassette loader and unloader.Provides high-throughput with two processing lines.

■ Supports the optimization of illuminance and light intensity with high output UV lamp and nitrogen purge function that provides high quality and high performance.

■ A large touch panel improves operability.Ensures safety for operations and maintenance, complying with the SEMI safety guidelines.

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Thin Wafer&

Tough ChipSolutions

1,250mm(W)x1,850mm(D)x1,860mm(H)

1,440mm(W)×2,105mm(D)×1,800mm(H)

2,203mm(W)×3,092mm(D)×1,800mm(H)

1,550mm(W)×1,950mm(D)×1,800mm(H)

2,165mm(W)×3,090mm(D)×1,800mm(H)

1,650mm(W)×1,200mm(D)×1,735mm(H)

RAD-2010m/12RAD-2010F/12

Non-UV Type Dicing Tape

Application

For Si Wafer

For Full-Cut Laser Dicing

Base Material

PVC

PVC

PVC

Feature

For Small Die

For Large Die & Easy Pick Up

Excellent Visibility & Evenness

Primal Product Name

G-19D/G-19SHD/260H

POFor Large Die G-64H

G-11D

G-260H

PVCRoHS 2.0 compliance G-11D/19D/19SHD

SpecialStandard G-765/965/967

UV Curable BG Tape

Dicing Die Bonding Tape

Process

Back Grinding

DBG (Dicing Before Grinding)SDBG(Stealth Dicing Before Grinding)

Application

Standard

For Ultra Thin Grinding (thickness>40µm)

For Micro Bump (including ink dot)

For Medium Bump (height<100μm)

For High Bump (height<250µm)

For Small T.T.V.

Primal Product Name

E-4141A/6152B

E-8180HR

E-6142A/6152B

E-4230BS/8310LS342F/8330HR

E-8510HR/9485

Antistatic E-6130AS

E-3100UN

For Bump E-3281B

Die to Substrate

Die to Die

Die to Die (Same Size Stack /FOW)

For DBG (Dicing Before Grinding)

Backside Coating Tape

Type Primal Product Name

LC88 seriesGeneral

Thickness Line-up

25 µm, 40 µm

Application Type

Cure

Cure

Cureless

Cure

Cure

Primal Product Name

LE82-20

LE5000S, LE82-20

LE4424

LE4777H

LD01D-7

Adhesive Thickness Line-up

20 μm

20 μm

75 µm

7 µm

Process

Back Grinding

Application

Standard (thickness>75µm)

For Thin Grinding (thickness>50µm)

Primal Product Name

P-4130A/4140A/4205B

P-7125/7180LS459H

Infrared-Transmission 25 μm, 40 μm LC28x6 series

For Stealth Dicing 25 μm LC87 series

For Thin Wafer 25 µm, 40 µm LC86R series

Non-UV Type BG Tape

Base Material

PI

PET

Adhesive Type

Silicone

Acrylic

Primal Product Name

C-902/903

H-231F

Heat Resistant Tape

RAD-2500m/12

200mm, 300mm*Two 150mm work pieces can be processed at the time (Option)

300mm Semi-Automatic BG Tape Laminator

■ Simply place the wafer on the application table, then back grinding tape lamination and periphery cutting automatically begins

■ Customized recipes lamination is also available■ Simple touch screen operation

Wafer Size

Equipment Size

Equipment Size

150mm, 200mm, 300mm

300mm Semi-Automatic BG Tape Remover

■ Simply place the wafer on the application table, then back grinding tape peeling automatically begins■ Removes back grinding tape by heat seal type peeling tape to the periphery of the wafer■ Simple touch screen operation

Wafer Size

Equipment Size

200mm, 300mm

300mm Semi-Automatic Wafer Mounter

■ Simply place the wafer and ring frame on the application table, then pre-cut dicing tape is automatically applied

■ By using a pre-cut tape, the tape cutting process is omitted making the operation safer■ Easy button operation

■ Simply place the wafer-mounted work piece on the application table, then UV irradiation automatically begins

■ Simple touch screen operation■ Equipped with nitrogen purge function

200mm Semi-Automatic Wafer Mounter

300mm Semi-Automatic UV Irradiation System

Wafer Size

Equipment Size

300mm*Sizes other than 300mm are for option

*With table fully advanced: max. 1,380mm (D)

Wafer Size

Equipment Size

200mm

*With table fully advanced: max. 1,190mm (D)

*There are also models corresponding to the non pre-cut products: RAD-2500m/12IPC

Wafer Size

Equipment Size

830mm(W)×1,042mm(D)×1,350mm(H)

915mm(W)×1,080mm(D)×1,350mm(H)

671mm(W)×950mm(D)×527mm(H) 568mm(W)×850mm(D)×527mm(H)

300mm Semi-Automatic Vacuum Mounter

■ By simply setting the wafer and tape-mounted ring frame, wafer mounting is automatically processed■ Management of mounting condition is operated simply with a touch screen■ Tape mounting without contact to the wafer surface is achived with the special non-contact table

Wafer Size 300mm*Sizes under 300mm are for option

*Tape mounting for ring frame is required separately: RAD-2500m/12

1,100mm(W)×600mm(D)×1,100mm(H)

870mm(W)×1,080mm(D)×1,185mm(H)

UV Irradiation

Dicing

CP2007

•

• Advanced Materials Operations2-1-2 Koraku Bunkyo-ku, Tokyo 112-0004 JapanTEL. +81-3-3868-7737 FAX. +81-3-3868-7726 http://www.lintec-global.com

Advanced Technologies Division15930 S. 48th Street, Suite 110, Phoenix, AZ 85048 USATEL. +1-480-966-0784 FAX. +1-480-966-5321 http://www.lintec-usa.comEmail: info@lintec-usa.com

LINTEC Corporation

LINTEC OF AMERICA, INC.

www.adwill-global.com/en

UV Curable Dicing Tape

Application Feature

High Expandability

Anti-chipping

Easy Pick Up

Antistatic

High Adhesion

Standard

Standard

Antistatic

Antistatic

Expand and Break

・Expand and Break・Capability of SD through tape・Antistatic ・Expand and Break・Capability of SD through tape

Standard

Standard

Standard

Base Material

PVC

PO

PVC

PO

PVC

PO

PVC

PO

PO

PET

PO

PO

PO

PVC

PO

PO

PVC

PO

PVC

PO

Primal Product Name

D-17xD series

D-670/675

D-17xD series

D-676H(S)/678/686H

D-17xD series

D-485H/678/686H

D-174E/820

D-877H/867A

D-611/611H

RoHS 2.0 compliance PVC D-17xD series

D-210N/241

D-698/841

D-510T(S)/510W

D-830J/841/825/825W/846/847W

D-17xD series

D-611H/678

PVC D-820

D-456H

D-821HS

D-676(S)/676H(S)/686H

D-17xD series

D-485H

Special D-765

For Si Wafer

For Glass/Ceramics

For Package Substrate

For Stealth Dicing (SD)

For Wafer with LC Tape

For TAIKO Wafer

For Full-cut Laser Dicing

200mm, 300mm

200mm, 300mm

200mm, 300mm

200mm, 300mm

200mm, 300mm

200mm, 300mm

RAD-3520F/12 RAD-3500m/12BG Tape

Wafer Fully-Automatic

BG Tape LaminatorBG Tape

Semi-AutomaticRAD-3520F/12P series RAD-3500m/1212"

TypeProduct Name E series

UV Curable Non-UV

RAD-2510 F/12Sa RAD-2512F/12

Vacuum Wafer Mounter

Wafer Fully-AutomaticWafer Mounter

Semi-Automatic

RAD-2510 F/12Sa8" RAD-2500 F/8

RAD-2500m/12RAD-2500m/8

12"

Wafer Fully-AutomaticRAD-2512F/12

Semi-AutomaticRAD-2512/m1212"

Peeling Tape

D series G seriesType

Product NameUV Curable Non-UV

Dicing Tape

S seriesProduct Name

RAD-3600 F/12 RAD-3500m/12

Wafer Fully-Automatic Semi-AutomaticRAD-3600F/12 RAD-3500m/12 12"

LC Tape Laminator

RAD-2010 m/12RAD-2010 F/12

Wafer Fully-Automatic

UV Irradiation SystemSemi-Automatic

8" RAD-2000F/812"

Dicing Die Bonding TapeStandardTypeLE series

DBGLD seriesProduct Name

LC seriesProduct Name

Backside Coating Tape

Backside Coating Tape

Die Bonding

Molding

Inspection

Die Bonding

Wire Bonding

Molding

Flip Chip Bonding

Wafer MountingBG Tape Peeling

BG Tape Lamination

Backside Coating Tape LaminationLaser MarkingWafer Mounting

Back Grinding

Pick Up

Single Crystal Growth Wafer Cutting Wafer Grinding Surface Oxidation Resist Coating

Exposure

Development

Resist Removal

Ion Implantation and Diffusion

Electrode Deposition

Inspection

RAD series Semi-Automatic Equipment Line-upRAD series Fully-Automatic Equipment Line-up

300mm Fully-Automatic BG Tape Laminator

300mm Fully-Automatic BG Tape Remover

300mm Fully-Automatic Multifunction Wafer Mounter

300mm Fully-Automatic Vacuum Mounter

300mm Fully-Automatic LC Tape Laminator

300mm Fully-Automatic UV irradiation System

■ Reduced wafer warpage with programmable tape tension■ Programmable cutting angles to reduce wafer damage and provide the cleanest possible cut■ Space-saving and High throughput(UPH100 with option/Standard spec is UPH70)

■ Reduced wafer stress during peeling using LINTEC proprietary new peeling method■ Zero wafer backside contact during wafer handling and peeling which reduces the risk of wafer damage

■ Space-saving■ High throughput■ Lowered risk of wafer damage by reducing the number of times the wafer needs to be transported between

units in the equipment■ LINTEC-developed peeling mechanism removes BG tape from ultra-thin wafer without damaging the wafer

■ Vacuum lamination to protect pressure sensitive devices and allow the dicing tape to conform to a variety of backside sufaces

■ Zero circuit surface contact during dicing tape lamination■ Zero drect contact with the backside of the wafer

■ Precise tape lamination without voids■ Inline pre-cutting method to prevent damage on the edge of the wafer

■ More compact with an integrated cassette loader and unloader.Provides high-throughput with two processing lines.

■ Supports the optimization of illuminance and light intensity with high output UV lamp and nitrogen purge function that provides high quality and high performance.

■ A large touch panel improves operability.Ensures safety for operations and maintenance, complying with the SEMI safety guidelines.

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Thin Wafer&

Tough ChipSolutions

1,250mm(W)x1,850mm(D)x1,860mm(H)

1,440mm(W)×2,105mm(D)×1,800mm(H)

2,203mm(W)×3,092mm(D)×1,800mm(H)

1,550mm(W)×1,950mm(D)×1,800mm(H)

2,165mm(W)×3,090mm(D)×1,800mm(H)

1,650mm(W)×1,200mm(D)×1,735mm(H)

RAD-2010m/12RAD-2010F/12

Non-UV Type Dicing Tape

Application

For Si Wafer

For Full-Cut Laser Dicing

Base Material

PVC

PVC

PVC

Feature

For Small Die

For Large Die & Easy Pick Up

Excellent Visibility & Evenness

Primal Product Name

G-19D/G-19SHD/260H

POFor Large Die G-64H

G-11D

G-260H

PVCRoHS 2.0 compliance G-11D/19D/19SHD

SpecialStandard G-765/965/967

UV Curable BG Tape

Dicing Die Bonding Tape

Process

Back Grinding

DBG (Dicing Before Grinding)SDBG(Stealth Dicing Before Grinding)

Application

Standard

For Ultra Thin Grinding (thickness>40µm)

For Micro Bump (including ink dot)

For Medium Bump (height<100μm)

For High Bump (height<250µm)

For Small T.T.V.

Primal Product Name

E-4141A/6152B

E-8180HR

E-6142A/6152B

E-4230BS/8310LS342F/8330HR

E-8510HR/9485

Antistatic E-6130AS

E-3100UN

For Bump E-3281B

Die to Substrate

Die to Die

Die to Die (Same Size Stack /FOW)

For DBG (Dicing Before Grinding)

Backside Coating Tape

Type Primal Product Name

LC88 seriesGeneral

Thickness Line-up

25 µm, 40 µm

Application Type

Cure

Cure

Cureless

Cure

Cure

Primal Product Name

LE82-20

LE5000S, LE82-20

LE4424

LE4777H

LD01D-7

Adhesive Thickness Line-up

20 μm

20 μm

75 µm

7 µm

Process

Back Grinding

Application

Standard (thickness>75µm)

For Thin Grinding (thickness>50µm)

Primal Product Name

P-4130A/4140A/4205B

P-7125/7180LS459H

Infrared-Transmission 25 μm, 40 μm LC28x6 series

For Stealth Dicing 25 μm LC87 series

For Thin Wafer 25 µm, 40 µm LC86R series

Non-UV Type BG Tape

Base Material

PI

PET

Adhesive Type

Silicone

Acrylic

Primal Product Name

C-902/903

H-231F

Heat Resistant Tape

RAD-2500m/12

200mm, 300mm*Two 150mm work pieces can be processed at the time (Option)

300mm Semi-Automatic BG Tape Laminator

■ Simply place the wafer on the application table, then back grinding tape lamination and periphery cutting automatically begins

■ Customized recipes lamination is also available■ Simple touch screen operation

Wafer Size

Equipment Size

Equipment Size

150mm, 200mm, 300mm

300mm Semi-Automatic BG Tape Remover

■ Simply place the wafer on the application table, then back grinding tape peeling automatically begins■ Removes back grinding tape by heat seal type peeling tape to the periphery of the wafer■ Simple touch screen operation

Wafer Size

Equipment Size

200mm, 300mm

300mm Semi-Automatic Wafer Mounter

■ Simply place the wafer and ring frame on the application table, then pre-cut dicing tape is automatically applied

■ By using a pre-cut tape, the tape cutting process is omitted making the operation safer■ Easy button operation

■ Simply place the wafer-mounted work piece on the application table, then UV irradiation automatically begins

■ Simple touch screen operation■ Equipped with nitrogen purge function

200mm Semi-Automatic Wafer Mounter

300mm Semi-Automatic UV Irradiation System

Wafer Size

Equipment Size

300mm*Sizes other than 300mm are for option

*With table fully advanced: max. 1,380mm (D)

Wafer Size

Equipment Size

200mm

*With table fully advanced: max. 1,190mm (D)

*There are also models corresponding to the non pre-cut products: RAD-2500m/12IPC

Wafer Size

Equipment Size

830mm(W)×1,042mm(D)×1,350mm(H)

915mm(W)×1,080mm(D)×1,350mm(H)

671mm(W)×950mm(D)×527mm(H) 568mm(W)×850mm(D)×527mm(H)

300mm Semi-Automatic Vacuum Mounter

■ By simply setting the wafer and tape-mounted ring frame, wafer mounting is automatically processed■ Management of mounting condition is operated simply with a touch screen■ Tape mounting without contact to the wafer surface is achived with the special non-contact table

Wafer Size 300mm*Sizes under 300mm are for option

*Tape mounting for ring frame is required separately: RAD-2500m/12

1,100mm(W)×600mm(D)×1,100mm(H)

870mm(W)×1,080mm(D)×1,185mm(H)

UV Irradiation

Dicing

CP2007

•

• Advanced Materials Operations2-1-2 Koraku Bunkyo-ku, Tokyo 112-0004 JapanTEL. +81-3-3868-7737 FAX. +81-3-3868-7726 http://www.lintec-global.com

Advanced Technologies Division15930 S. 48th Street, Suite 110, Phoenix, AZ 85048 USATEL. +1-480-966-0784 FAX. +1-480-966-5321 http://www.lintec-usa.comEmail: info@lintec-usa.com

LINTEC Corporation

LINTEC OF AMERICA, INC.

www.adwill-global.com/en

UV Curable Dicing Tape

Application Feature

High Expandability

Anti-chipping

Easy Pick Up

Antistatic

High Adhesion

Standard

Standard

Antistatic

Antistatic

Expand and Break

・Expand and Break・Capability of SD through tape・Antistatic ・Expand and Break・Capability of SD through tape

Standard

Standard

Standard

Base Material

PVC

PO

PVC

PO

PVC

PO

PVC

PO

PO

PET

PO

PO

PO

PVC

PO

PO

PVC

PO

PVC

PO

Primal Product Name

D-17xD series

D-670/675

D-17xD series

D-676H(S)/678/686H

D-17xD series

D-485H/678/686H

D-174E/820

D-877H/867A

D-611/611H

RoHS 2.0 compliance PVC D-17xD series

D-210N/241

D-698/841

D-510T(S)/510W

D-830J/841/825/825W/846/847W

D-17xD series

D-611H/678

PVC D-820

D-456H

D-821HS

D-676(S)/676H(S)/686H

D-17xD series

D-485H

Special D-765

For Si Wafer

For Glass/Ceramics

For Package Substrate

For Stealth Dicing (SD)

For Wafer with LC Tape

For TAIKO Wafer

For Full-cut Laser Dicing

200mm, 300mm

200mm, 300mm

200mm, 300mm

200mm, 300mm

200mm, 300mm

200mm, 300mm

RAD-3520F/12 RAD-3500m/12BG Tape

Wafer Fully-Automatic

BG Tape LaminatorBG Tape

Semi-AutomaticRAD-3520F/12P series RAD-3500m/1212"

TypeProduct Name E series

UV Curable Non-UV

RAD-2510 F/12Sa RAD-2512F/12

Vacuum Wafer Mounter

Wafer Fully-AutomaticWafer Mounter

Semi-Automatic

RAD-2510 F/12Sa8" RAD-2500 F/8

RAD-2500m/12RAD-2500m/8

12"

Wafer Fully-AutomaticRAD-2512F/12

Semi-AutomaticRAD-2512/m1212"

Peeling Tape

D series G seriesType

Product NameUV Curable Non-UV

Dicing Tape

S seriesProduct Name

RAD-3600 F/12 RAD-3500m/12

Wafer Fully-Automatic Semi-AutomaticRAD-3600F/12 RAD-3500m/12 12"

LC Tape Laminator

RAD-2010 m/12RAD-2010 F/12

Wafer Fully-Automatic

UV Irradiation SystemSemi-Automatic

8" RAD-2000F/812"

Dicing Die Bonding TapeStandardTypeLE series

DBGLD seriesProduct Name

LC seriesProduct Name

Backside Coating Tape

Backside Coating Tape

Die Bonding

Molding

Inspection

Die Bonding

Wire Bonding

Molding

Flip Chip Bonding

Wafer MountingBG Tape Peeling

BG Tape Lamination

Backside Coating Tape LaminationLaser MarkingWafer Mounting

Back Grinding

Pick Up

Single Crystal Growth Wafer Cutting Wafer Grinding Surface Oxidation Resist Coating

Exposure

Development

Resist Removal

Ion Implantation and Diffusion

Electrode Deposition

Inspection

RAD series Semi-Automatic Equipment Line-upRAD series Fully-Automatic Equipment Line-up

300mm Fully-Automatic BG Tape Laminator

300mm Fully-Automatic BG Tape Remover

300mm Fully-Automatic Multifunction Wafer Mounter

300mm Fully-Automatic Vacuum Mounter

300mm Fully-Automatic LC Tape Laminator

300mm Fully-Automatic UV irradiation System

■ Reduced wafer warpage with programmable tape tension■ Programmable cutting angles to reduce wafer damage and provide the cleanest possible cut■ Space-saving and High throughput(UPH100 with option/Standard spec is UPH70)

■ Reduced wafer stress during peeling using LINTEC proprietary new peeling method■ Zero wafer backside contact during wafer handling and peeling which reduces the risk of wafer damage

■ Space-saving■ High throughput■ Lowered risk of wafer damage by reducing the number of times the wafer needs to be transported between

units in the equipment■ LINTEC-developed peeling mechanism removes BG tape from ultra-thin wafer without damaging the wafer

■ Vacuum lamination to protect pressure sensitive devices and allow the dicing tape to conform to a variety of backside sufaces

■ Zero circuit surface contact during dicing tape lamination■ Zero drect contact with the backside of the wafer

■ Precise tape lamination without voids■ Inline pre-cutting method to prevent damage on the edge of the wafer

■ More compact with an integrated cassette loader and unloader.Provides high-throughput with two processing lines.

■ Supports the optimization of illuminance and light intensity with high output UV lamp and nitrogen purge function that provides high quality and high performance.

■ A large touch panel improves operability.Ensures safety for operations and maintenance, complying with the SEMI safety guidelines.

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Wafer Size

Equipment Size

Thin Wafer&

Tough ChipSolutions

1,250mm(W)x1,850mm(D)x1,860mm(H)

1,440mm(W)×2,105mm(D)×1,800mm(H)

2,203mm(W)×3,092mm(D)×1,800mm(H)

1,550mm(W)×1,950mm(D)×1,800mm(H)

2,165mm(W)×3,090mm(D)×1,800mm(H)

1,650mm(W)×1,200mm(D)×1,735mm(H)

RAD-2010m/12RAD-2010F/12

Non-UV Type Dicing Tape

Application

For Si Wafer

For Full-Cut Laser Dicing

Base Material

PVC

PVC

PVC

Feature

For Small Die

For Large Die & Easy Pick Up

Excellent Visibility & Evenness

Primal Product Name

G-19D/G-19SHD/260H

POFor Large Die G-64H

G-11D

G-260H

PVCRoHS 2.0 compliance G-11D/19D/19SHD

SpecialStandard G-765/965/967

UV Curable BG Tape

Dicing Die Bonding Tape

Process

Back Grinding

DBG (Dicing Before Grinding)SDBG(Stealth Dicing Before Grinding)

Application

Standard

For Ultra Thin Grinding (thickness>40µm)

For Micro Bump (including ink dot)

For Medium Bump (height<100μm)

For High Bump (height<250µm)

For Small T.T.V.

Primal Product Name

E-4141A/6152B

E-8180HR

E-6142A/6152B

E-4230BS/8310LS342F/8330HR

E-8510HR/9485

Antistatic E-6130AS

E-3100UN

For Bump E-3281B

Die to Substrate

Die to Die

Die to Die (Same Size Stack /FOW)

For DBG (Dicing Before Grinding)

Backside Coating Tape

Type Primal Product Name

LC88 seriesGeneral

Thickness Line-up

25 µm, 40 µm

Application Type

Cure

Cure

Cureless

Cure

Cure

Primal Product Name

LE82-20

LE5000S, LE82-20

LE4424

LE4777H

LD01D-7

Adhesive Thickness Line-up

20 μm

20 μm

75 µm

7 µm

Process

Back Grinding

Application

Standard (thickness>75µm)

For Thin Grinding (thickness>50µm)

Primal Product Name

P-4130A/4140A/4205B

P-7125/7180LS459H

Infrared-Transmission 25 μm, 40 μm LC28x6 series

For Stealth Dicing 25 μm LC87 series

For Thin Wafer 25 µm, 40 µm LC86R series

Non-UV Type BG Tape

Base Material

PI

PET

Adhesive Type

Silicone

Acrylic

Primal Product Name

C-902/903

H-231F

Heat Resistant Tape

RAD-2500m/12

200mm, 300mm*Two 150mm work pieces can be processed at the time (Option)

300mm Semi-Automatic BG Tape Laminator

■ Simply place the wafer on the application table, then back grinding tape lamination and periphery cutting automatically begins

■ Customized recipes lamination is also available■ Simple touch screen operation

Wafer Size

Equipment Size

Equipment Size

150mm, 200mm, 300mm

300mm Semi-Automatic BG Tape Remover

■ Simply place the wafer on the application table, then back grinding tape peeling automatically begins■ Removes back grinding tape by heat seal type peeling tape to the periphery of the wafer■ Simple touch screen operation

Wafer Size

Equipment Size

200mm, 300mm

300mm Semi-Automatic Wafer Mounter

■ Simply place the wafer and ring frame on the application table, then pre-cut dicing tape is automatically applied

■ By using a pre-cut tape, the tape cutting process is omitted making the operation safer■ Easy button operation

■ Simply place the wafer-mounted work piece on the application table, then UV irradiation automatically begins

■ Simple touch screen operation■ Equipped with nitrogen purge function

200mm Semi-Automatic Wafer Mounter

300mm Semi-Automatic UV Irradiation System

Wafer Size

Equipment Size

300mm*Sizes other than 300mm are for option

*With table fully advanced: max. 1,380mm (D)

Wafer Size

Equipment Size

200mm

*With table fully advanced: max. 1,190mm (D)

*There are also models corresponding to the non pre-cut products: RAD-2500m/12IPC

Wafer Size

Equipment Size

830mm(W)×1,042mm(D)×1,350mm(H)

915mm(W)×1,080mm(D)×1,350mm(H)

671mm(W)×950mm(D)×527mm(H) 568mm(W)×850mm(D)×527mm(H)

300mm Semi-Automatic Vacuum Mounter

■ By simply setting the wafer and tape-mounted ring frame, wafer mounting is automatically processed■ Management of mounting condition is operated simply with a touch screen■ Tape mounting without contact to the wafer surface is achived with the special non-contact table

Wafer Size 300mm*Sizes under 300mm are for option

*Tape mounting for ring frame is required separately: RAD-2500m/12

1,100mm(W)×600mm(D)×1,100mm(H)

870mm(W)×1,080mm(D)×1,185mm(H)

UV Irradiation

Dicing

CP2007

•

• Advanced Materials Operations2-1-2 Koraku Bunkyo-ku, Tokyo 112-0004 JapanTEL. +81-3-3868-7737 FAX. +81-3-3868-7726 http://www.lintec-global.com

Advanced Technologies Division15930 S. 48th Street, Suite 110, Phoenix, AZ 85048 USATEL. +1-480-966-0784 FAX. +1-480-966-5321 http://www.lintec-usa.comEmail: info@lintec-usa.com

LINTEC Corporation

LINTEC OF AMERICA, INC.

www.adwill-global.com/en

UV Curable Dicing Tape

Application Feature

High Expandability

Anti-chipping

Easy Pick Up

Antistatic

High Adhesion

Standard

Standard

Antistatic

Antistatic

Expand and Break

・Expand and Break・Capability of SD through tape・Antistatic ・Expand and Break・Capability of SD through tape

Standard

Standard

Standard

Base Material

PVC

PO

PVC

PO

PVC

PO

PVC

PO

PO

PET

PO

PO

PO

PVC

PO

PO

PVC

PO

PVC

PO

Primal Product Name

D-17xD series

D-670/675

D-17xD series

D-676H(S)/678/686H

D-17xD series

D-485H/678/686H

D-174E/820

D-877H/867A

D-611/611H

RoHS 2.0 compliance PVC D-17xD series

D-210N/241

D-698/841

D-510T(S)/510W

D-830J/841/825/825W/846/847W

D-17xD series

D-611H/678

PVC D-820

D-456H

D-821HS

D-676(S)/676H(S)/686H

D-17xD series

D-485H

Special D-765

For Si Wafer

For Glass/Ceramics

For Package Substrate

For Stealth Dicing (SD)

For Wafer with LC Tape

For TAIKO Wafer

For Full-cut Laser Dicing