Toshiba Bluetooth ICuploadpdf.ic37.com/TOSHIBA/TOSHIBA-BLUETEETHT... · NFC EV/Car Enta BT Mobile Communication(2G/3G/4G) LAN Smart Life Cloud Computing & M2M wireless BIG DATA Bluetooth

© 2015 Toshiba Corporation

January, 2015

Toshiba Corporation Semiconductor & Storage Products company Wireless IC Marketing and Engineering Group

Toshiba Confidential Information

Toshiba

Bluetooth®

IC

Slide No. 2 Toshiba confidential

Cloud computing

Smart Grid Medical & Health care ICT

NFC

EV/Car Enta

BT

Mobile Communication(2G/3G/4G)

LAN

Smart Life Cloud Computing & M2M wireless

BIG

DATA

Bluetooth / BLE ETC/RKE

FlashAir(SD)

TransferJet

Various Devices are

built-in Wireless

function.

WiFi

http://techon.nikkeibp.co.jp/article/NEWS/20110902/197924/?SS=imgview&FD=1824063104


Billions

Devices

PC Peripheral

Bluetooth Application

Mobile Accessory

Smart Home

Heath Care

Automotive

Audio

Remote Control Wearable

In-Door Position


Bluetooth Products with Toshiba IC

Wrist band

Smart watch

Car Audio

Health care monitor

Mobile

POS

Bluetooth PHS

Jacket

Heart Rate monitor

Movement monitor

DSC

BT mouse

Body

Temperature

Monitor

Wearable

Accessory

DSC

Healthcare

Medical

Automotive

Beacon

Key Fog

http://casio.jp/dc/products/ex_fr10/


Toshiba Bluetooth IC Advantages

• Stable performance, based on 15 years BT experience.

• All-in-One solution, with High Quality&Reliable BT profile - HCI, SPP, HID, GATT, SPP+GATT dual

• Low power consumption for real BT low energy

• Full support for BLE stand alone with 128KB Flash ROM inside

• Both Line-ups of BLE MaskROM&Flash ROM with Low Power Solution

NEW


TC35667FT

G

TC35670FT

G

-005 V4.0(LE)

Peak Current=5.9mA

BLE Single+GATT

Under MP

2014

TC35667FTG-006

V4.1(LE) & OTA supported

BLE Single+GATT

Peak Current=5.9mA

ES: Apr.’15 MP:Q2.’15

Bluetooth LE

solution

2015

BLE + NVM

solution

BLE,+GATT

V4.0/OTA supported 128KB Flash ROM

QFN40, 6mm□

ES M/Mar.’15 MP:Q3.’15

BLE+Tag+ NVM

solution

TC35675XBG

BLE+GATT, NFC-Tag V4.0/OTA supported

128KB Flash ROM

FBGA52 4.5x4.5mm, 0.5mm pitch

ES M/Mar.’15 MP:Q3.’15

TC3567x

V4.1(LE)

BLE Single+GATT

3mA Peak Target

QFN, WCSP

ES: Q4.’15 MP:Q2.’16

BLE Ultra Low

Power solution

BLE + NVM

Ultra Low Power

TC3567y

BLE+GATT

128KB Flash ROM

3mA Peak Target

ES Q4.’15 MP:Q2.’16

BLE+Tag + NVM

Ultra Low Power

TC3567z

BLE+GATT, NFC-Tag

128KB Flash ROM

3mA Peak Target

ES Q4.’15 MP:Q2.’16

BTv4.0+DSP

solution

TC35668 BTv4.0 WBS ECNR

Audio CODEC

ES available, MP:Aug.’15

TC35676FTG

TC35670FTG-006

V4.1(LE) & OTA supported

BLE Single+GATT

Peak Current=5.9mA

ES: Apr. ’15 MP:Q2.’15

TC35667FSG-005 (Small package)

QFN40, 5mm□ 0.4mm pitch

ES: B/Mar.’15 CS: E/Jul.’15

WCSP41 3mm □ EV board E/Apr

ES E/May

BLE,+GATT



ES E/Mar. ’15 MP:Q3.’15

TC35676FSG (Small package)

Toshiba BT/BLE IC Roadmap

BLE v4.0

NVM

BLE + NVM

solution

BLE,+GATT


676:QFN40, 6mm□

ES Jun.’15 MP:Q3.’15

BLE+Tag+ NVM

solution

TC35675XBG

BLE+GATT, NFC-Tag V4.1/OTA supported

128KB Flash ROM

FBGA52 4.5x4.5mm, 0.5mm pitch

ES Jun.’15 MP:Q3.’15

TC35676FTG

BLE,+GATT



ES Jun. ’15 MP:Q3.’15

TC35676FSG (Small package)

BLE v4.1

NBM Low Power

BLE+Tag

solution


BLE TC35667FTG-005 TC35667FSG-005

TC35667WCSP-005

BLE TC35667FTG-xxx TC35667FSG-xxx

BLE+NVM TC35676FTG TC35676FSG

BLEv2 TC3567x

BLEv2+NVM TC3567y

BT Spec. V4.0 BLE V4.1 BLE(Apr) V4.0 BLE V4.1(June)

V4.1 BLE V4.1 BLE

CPU/Clock frequency ARM7/13MHz ARM7/13MHz ARM7/13MHz M0 (TBD）/13MHz

M0 (TBD)/ 13MHz

Mask ROM 384KB 384KB 256KB 384KB 256KB

SRAM 128KB 128KB 224KB (96KB for App. & Profile)

128KB 224KB

Flash ROM Size --- --- 128KB (User Area=96KB est.)

--- 128KB (User Area=96KB)

Access time --- --- 0.5MHz --- < 13MHz

Erase /Write time

--- --- Write: 20usec@256B Erase: 150msec@64KB

--- TBD

Read time --- --- 4msec@8KB --- TBD

OTA update Under Development Supported Supported Supported Supported

Current Consumption

Operating Peak

5.9mA(Rx) 5.9mA(Rx) 6.0mA 3.0mA (Target)

3.0mA (Target)

Deep Sleep < 0.1uA < 0.1uA < 0.1uA < 0.1uA < 0.1uA

Erase /Write Flash ROM

--- --- 20mA@256B --- <10mA

Package FTG:QFN40, 6x6mm 0.5mm pitch

FSG:QFN40, 5x5mm 0.4mm pitch

WCSP: 3x3mm 0.4mm pitch

FTG:QFN40, 6x6mm 0.5mm pitch


FTG:QFN40, 6x6mm 0.5mm pitch


QFN, WCSP (TBD)

QFN

Status FTG: MP FSG: Jul. 2015

WCSP: Under plan’g

ES: Mar. 2015 ES:Mar.2015 ES:Q4.2015 ES:Q4.2015

Toshiba BLE IC Comparison Table


SmartPhone

Coupon

Web Site

Start BT communication

Reference Model

Touch! １．Touch with Smart Phone, which supports BLE & NFC

２．BD address is transferred by NFC Tag. ３．Automatically BT paring is completed. ４．BT communication is started. ★ Easy to use Bluetooth !!

Coupon

Web Site

表示

SmartPhone

BD address by NFC Tag

Demo: Auto BT connection by NFC tag

Reference Model

Automatic BT paring

TC35670: Bluetooth® SMART + NFC Tag


Products Introduction

- TC35667

- TC35670

- TC35661

- TC35675

- TC35676

- TC35668


Low Power Consumption

BLE Single IC

TC35667


TC35667 Product Brief

TC35667 Block Diagram Ultra Low Power Consumption Peak Power Consumption 5.9 mA (Tx-4dBm)5.7mA(Rx)

Deep Sleep Power Consumption 0.1 μA

Interface Functions (16 GPIOs) UART: 2ch, I2C: 1 ch, SPI: 1 ch (Selectable)

10-bit ADC: 3 ch for Input pins, 1 ch for VDD monitor PWM : 3 ch for Buzzer, LED, or etc.

32Kbyte User Program Area Provide Not only GATT protocol&profile but also 32KByte user Program area for user application.

Realizes "Stand-alone" operation. Release Software development Kit(SDK).

RF Block

LE

Modem

ARM Processor

Mask ROM

SRAM

CLK

ADC

UART1

I2C

GPIO

PWM DCDC

Under MP

On-Chip DC-DC with 1.8 to 3.6 V Input Provides wide range of operation voltage

Simplifies external power supply circuit

Bluetooth Smart Compliant and Ultra Low Power Consumption

SPI

Small Package: QFN40, 6 mm□, 0.5 mm pitch Supports 2-layer PCB and reduces BOM cost

Temperature: -40℃ to 85℃

UART2


BLE IC TC35667FTG

BLE IC TC35667-xxx

BT Spec. V4.0 BLE V4.1 BLE

CPU/Clock frequency 13MHz 13MHz

Mask ROM 384KB 384KB

SRAM 128KB 128KB

OTA (Over The Air) Not Supported Supported

Current Consumption

Operating Peak 5.9mA(Rx) 5.9mA(Rx)

Deep Sleep 0.1uA 0.1uA

Input Voltage 1.8 – 3.6V 1.8 – 3.6V

Package QFN40, 6mm□ QFN40, 6mm□

Status MP ES:Nov.2014 MP:Q1.2015

TC35667 BLE IC Comparison Table


TC35667 Advantages

Standalone System (for Sensors, etc)

TC35667

EEPROM (eg.256kbit)

User Program RAM (32KByte)

I2C

GPIO

Mask ROM

Bluetooth LE

GATT

Host MCU + Bluetooth System

TC35667

EEPROM (eg.256kbit)

User Program RAM (32KByte)

I2C

GPIO

Mask ROM

Bluetooth LE

GATT

UART

Host MCU

Application Program

Peripherals

GATT Client/Server Supported GATT roles: Client and Server GAP roles: Central and Peripheral

GATT Server Database Embedded Simplifies operation on Host MCU for service search, etc.

Sleep Function Supported Realizes low power consumption during connecting, advertising, and idle state. Wake up signal for Host MCU Wake up signal from Host MCU

User Program RAM Area User Program download from EEPROM on power-up Host-less system ("Stand-alone")

EEPROM is optional.

Wakeup


TC35667 Software structure for external MCU

TC35667 Low energy Stack & Profile

L2CAP

ATT

GAP

GATT

SMP Con_update

Service database

Application interface

Bluetooth Low Energy RF-PHY, Link Layer, 4.0HCI

Application / Profile (in case of external MCU use)

UART

Build-in stack

Sample source code

for application and

Profile can be

provided by

TOSHIBA


TC35667FTG Module board Size: 20×15mm□ 2layer PCB Pattern Antenna EEPROM（512kbit）

TMPM395FWAXBG

TMPM395FWAXBG as HostMCU (FlashROM：128kByte/RAM：8kByte)

Temperature sensor／Accelerator／Buzzer USB power supply／button battery Software development tool (IDE） KEIL and IAR

The following materials are available. Circuit BOM list Operation manual Antenna characteristics Sample source code

TC35667 & TMPM395FWAXBG Starter Kit

MCU+BLE Software starter Kit


TC35667 SDK for Stand alone

TC356667 Software

development kit

PC UART for debug data

- Development tool - ARM Thumb C Compiler and ARM Thumb linker

- RVDS2.1 or IAR

JTAG for software debug

RealView debugger



BLE Single + NFC Tag Combo IC

TC35670


TC35670 Block Diagram

Smooth Handover from NFC to BLE Support NFC pairing for easy connection setup

BLE Communication with NFC Pairing to Easy Connection Setup

Compliant with NFC forum Tag Specification NFC Typ3 TAG

212k/424kbps automatically selected

On-Chip EEPROM (1.5 KB) Data Storage Storing data, data transfer without host is available

Low Power NFC Tag Function Wait state current < 1 uA, Operation current < 1 mA

Wake Up from Zero-Current Standby Internal power supply realizes wake-up from zero-current standby at connection request from remote: battery-less operation

Peak Power Consumption: 5.9mA(Tx-4dBm)/5.7mA(Rx) Deep Sleep Current: 0. 1 uA

Under MP

BLE Single + NFC Tag IC: TC35670 Product Brief

Small Package: QFN40, 6 mm□, 0.5 mm Pitch Compatible with TC35667 (BLE single IC, no NFC tag)

Easy design shift to tag-less application available

BLE RF Block

LE Modem

ARM Processor

MaskROM

SRAM CLK Gen.

ADC

UART

I2C

DCDC

SPI

PWM

NFC Tag Logic

SRAM

I2C

NFC Tag Analog Block

EEPROM

GPIO

JTAG

Smartphone Tablet

Touch!

NFC Pairing

Accessories

Bluetooth®

NFC


Execute command response from TAG

Polling (Including anti-collision), Authentication (Using 3DES),

Write EEPROM

Read EEPROM • Read the data written to the EEPROM in this mode

• Read the data written to the EEPROM in the mode (2)

To notify the host that is during communication. • RFDET and WAKE_UP

• Connection destination and Operation of the MPU is controlled

by the MPU side.

Communicate with a wired terminal (make external memory for the

HOST)

The start-up of this mode: PONB H → L

Write EEPROM

Read EEPROM • Read the data written to the EEPROM in this mode

• Read the data written to the EEPROM in the mode (1)

Communicate by using setting IF

The communication is performed through to MPU

Start communication is start from the Polling of (1).

Communicate via the RAM • The TAG completion of reception: READYB output H → L to the

HOST.

• Output data from the TAG

• Reply via the RF from the TAG at the time of the end of the reply

from the Host.

Logic

RFID

Block

MPU

EE

PROM

I/O

RA

M

Logic

RFID

Block

MPU

EE

PROM

I/O

RA

M

Logic

RFID

Block

MPU

EE

PROM

I/O

RA

M

TC35670 TAG Functions

(1) RF communication mode

(2) Wired communication mode

(3) Through mode

RFDET

PON

WAKEUP

RFDET

WAKEUP


TC35670 & TMPM395FWAXBG Starter Kit

TC35670FTG Module board Pattern Antenna for BLE Size: 20×15mm□ 2layer PCB EEPROM（512kbit） Antenna for TAG

TMPM395FWAXBG

TMPM395FWAXBG as HostMCU (FlashROM：128kByte/RAM：8kByte)

Temperature sensor／Accelerator／Buzzer USB power supply／button battery Software development tool (IDE）

KEIL and IAR

The following materials are available. Circuit BOM list Operation manual Antenna characteristics Sample source code


TC35670 SDK for Stand alone

TC35670 Software

development kit

PC UART for debug data

- Development tool - ARM Thumb C Compiler and ARM Thumb linker

- RVDS2.1 or IAR

JTAG for software debug

RealView debugger

TAG Board

BLE Board


Bluetooth® SMART + NFC Tag

TC35670 Reference Model 1

※Bluetooth®SMARTおよびBluetooth®は、Bluetooth SIG Inc.の登録商標です。 ※ARM®はARM社のEUおよびその他の国における登録商標です。

※FeliCaは、ソニー株式会社の登録商標です。 ※FeliCaは、ソニー株式会社が開発した非接触ICカードの技術方式です。

※本製品は、ソニー株式会社からのFeliCa Lite-S技術ライセンスに基づいて製品化しています。

Stand alone 6 axis sensor EEPROM (512kbit) Coin battery (CR2032/2025) Case size: Φ30mm PCB size: Φ25mm, 4layers BLE chip antenna & NFC antenna


TC35670 Reference Model 2 ~ Beacon~

TC35670FTG Beacon Reference Model Built-In MPU-6550(6axis-Sensor) Coin Battery(CR2032) Power Supply Case Size: 35mm(W) x 12mm(H) x 75mm(D) Built-In EEPROM（512kbit） Antenna for Bluetooth® and NFC-TAG

Beacon Reference Model Function Custom software implemented in EEPROM Wake up from NFC-TAG or 6axis-Sensor Modify Bluetooth® Parameter(e.g. Advertising Interval/Tx-Power) and Beacon ID(UUID/

Major/Minor/RSSI) from NFC-TAG Demonstration Summary

Stamp Raｌｌy Demo for Digital Singage Modify Beacon ID(UUID/Major/Minor/RSSI)

from Smart Phone

Coin

Battery TC35670

Module

NFC

Anntena

PCB Image（45.0mm x 28.9mm)

Figure of Case “FRISK case”

Main Board


Bluetooth v4.0 Profile Supported IC

TC35661-xxx

TFBGA64-0505-0.5


Bluetooth Core Spec. V4.0 compliant, EDR & LE supported

RF Block Class2 supported World wide Top level Sensitivity (-91dBm) On-chip Balun, ANT SW, LNA, etc

Baseband Block On-chip MaskROM, PatchRAM

Interface UART, SPI, I2C, I2S/PCM Support IEEE802.15.2 2/3/4 wire Coexistence

Low Power Consumption Data Transfer(DH5, UART=2Mbps): 30mA(typ.) Sleep: 30uA(max)

Input Frequency, Power Supply 13 to 52MHz(5points)/1.8V or 3.3V

Package FBGA64 5mm body, 0.5mm ball pitch FBGA64 7mm body, 0.8mm ball pitch

Bluetooth v4.0 IC:TC35661(Chiron) Product Brief

BT HCI:TC35661 Block Diagram

RF Block

EDR/LE Modem

FlashROM IF

ARM7 Processor

MaskROM

SRAM CLK Gen.

UART

PCM/I2S

I2C/SPI

GPIO

JTAG

WiFi Coex

Total Solution Provider

Toshiba provides Bluetooth IC and proven protocol stack&profiles

with various engineering service&support


BT Processor

USB 2.0

EDR+LE

Modem

SRAM

RF Analog

for v4.0,EDR&LE

Host Processor

TMPM367FD (MCU) High-Performance, Low Power,

USB enabled MCU

TC35661 (Chiron)

1.2V LDO

ARM7TDMI

MaskROM I2S/PCM

I2C/SPI

SPI

UART

JTAG

Sleep CLK

UART

TX03 MCU+BT HCI(TC35661) Application Example

BT_WKUP

HP_WKUP Patch RAM

Bluetooth Module

26MHz OSC

1.8V

or 3.3V

ARM

Cortex-M3

I2C

SPI

UART

16bit Timer

USB 2.0

FS Device

GPIO

MPT

On-chip

Regulator

Flash ROM

SRAM

DMAC

RTC

ADC/DAC

8M

Hz

32

KH

z

2.7

V~

3.6

V

BT Stack/Profile

EEPROM

Provide BT+MCU kit solution with a few ext. components


Bluetooth v4.0 compliant EDR & LE support

Class2 support RF Characteristics

Tx: +4dBm (@IC) Rx: -91dBm (typ.)

Antenna Pattern Antenna Chip Antenna

Others Provide various materials

Circuit diagram and Gerber data BOM list Antenna characteristics PC Application Software

Bluetooth v4.0:TC35661 2layer Reference PCB


SBC

MP3

HCI ( Host Controller Interface)

L2CAP

AVDTP AVCTP

PBAP

Application

AVRCP

v1.4 GAVDP

A2DPv1.2

GOEP

RFCOMM

DUN

SIM

EC/NR

SRC

OPP

Bluetooth V3.0： TC35661 Stack & Profile

Sync

ML MAP

BNEP

PAN SPP

HFPv1.6

With AT cmd

Bluetooth Profile/Protocol

DID1.3

SDAP

HSP

SDP

HID

GAP

voice/Audio Middleware

Application


UART Driver

Internal HCI

L2CAP

ATT

GAP

GATT

SMP Conn_update

Service database

Profile API or Profile Management Task

Bluetooth V4.0： TC35661 LE Stack & Profile

Bluetooth Profile/Protocol TOSHIBA can provide

Application/Profile Customer implement layer


SPP (Serial Port Profile)

BR / EDR Low Energy

HID standalone (Human Interface Device)

GATT (Generic attribute Profile)

HCI (Host Controller interface)

HID+GATT (BR/LE dual support)

SPP standalone (Serial Port Profile)

TC35661SBG-007

MP: Jan/2013

TC35667

TC35661-102

ES: Available

TC35661-203

MP: Mar/2013

TC35661-xxx (Profile type): Software lineup

SPP+GATT (BR/LE dual support)

TC35661-700

ES: Available

TC35661-501

TC35661-6xx

Planning

SPP+HSP (Serial Port +

Head Set Profile(AG))

TC35661-800

Planning


Under MP

System Example

TC35661-203

GPIO(Max. 15pin)

Mask ROM

Bluetooth Baseband

Profile(SPP)

UART

Host MCU

Application Program

LED

Host

Wake Up

Built-in Serial Port Profile(SPP) Easy development to Bluetooth products.

Supported High Throughput SPP data transfer bit rate >1.5Mbps

(@UART=3Mbps)

Supported GPIO interface for Host Host can control all GPIO.

Supported pulse out put for LED A variable periodic setup is possible.

Host Wake Up Function Host can go to sleep mode in Bluetooth Sniff mode.

Deep Sleep Function This device can use deep sleep function at long time interval connection like a sniff

mode. It realizes low power consumption.

SPP(Serial Port Profile) is connectable with the application of a smart phone. iPhone/Android phone etc.

Bluetooth Built-in SPP :TC35661-203


Standalone System Built-in Serial Port Profile(SPP)

Easy development to Bluetooth products.

User RAM for custom program(13kByte) The system without a host MUC is realized.

Custom program is downloaded from

EEPROM(I2C) at the time of boot.

The UART command is customizable by

custom program.



ES Available

TC35661-700

EEPROM (128kbit)

Custom Program RAM (13kByte)

I2C

GPIO (Max.16pin)

Mask ROM

Bluetooth Baseband

Profile(SPP)


TC35661-700

EEPROM (128kbit)


I2C

GPIO(Max. 12pin)

Mask ROM

Bluetooth Baseband

Profile(SPP)

UART

Host MCU

Application Program

Peripherals

Bluetooth Built-in SPP(Stand alone) :TC35661-700


Standalone System(Mouse, Keyboard, …)

ES Available

TC35661-102

EEPROM (128kbit)


I2C

GPIO (Max.16pin)

Mask ROM

Bluetooth Baseband

Profile(HID)


TC35661-102

EEPROM (128kbit)


I2C

GPIO(Max. 12pin)

Mask ROM

Bluetooth Baseband

Profile(HID)

UART

Host MCU

Application Program

Peripherals

Bluetooth Built-in HID(Stand alone) :TC35661-102

Built-in HID(Human interface Device ) Profile

Easy development to Bluetooth products.

User RAM for custom program(12kByte) The system without a host MUC is realized.

Custom program is downloaded from EEPROM(I2C) at the time of boot.

The UART command is customizable by custom program.

Deep Sleep Function This device can use deep sleep function

at long time interval connection like a sniff



Supported both BR and Low Energy(LE) Built-in both SPP(Serial Port Profile)for BR and GATT (Generic Attribute Profile) for

Low Energy.

Standby for BR/LE Connection Request Simultaneously

Host MCU can request both page scan and

advertising for connection establishment.

Supported GATT Client/Server function This device does not support “Central” role.

However this device supported both GATT Client and Server function.

Built-in GATT Server Database Supported auto reply function for service discovery request from remote device.



Bluetooth Built-in SPP+GATT :TC35661-501

System Example

TC35661-501

GPIO(Max. 15pin)

Mask ROM

Bluetooth Baseband

Profile(SPP)

UART

Host MCU

Application Program

Profile(GATT)

Under MP



BLE+NVM+Tag Combo IC

TC35675XBG


TC35675 Block Diagram Ultra Low Power Consumption ・Peak current=6.0mA(Rx, SRAM code fetch) ・Deep Sleep current<0.1uA

Various Interfaces ・UART 1ch, SPI/I2C 1ch(selectable) ・10bit ADC: 3ch for ext. / 1ch for int.(VDD monitor) ・PWM 3ch(Beep, LED etc.) ・Ext. interrupt 12ch

Built-in 128KB Flash ROM For GATT protocol, BLE profile and User Application SW. Other information data can be also stored.

RF Block

LE Modem

ARM7TDMI

MaskROM

SRAM CLK Gen.

ADC

UART

I2C

GPIO

JTAG DCDC

SPI

PWM

Built-in DC-DC converter (1.8-3.6V input) Simplifies power supply circuit by wide range of input voltage.

Bluetooth Smart with internal Flash ROM and Ultra Low Power

Package: FBGA52, 4.5mm□, 0.5mm pitch Supports 2-layer PCB and reduces BOM cost.

Built-in NFC standard Tag Analog performance is improved compared with TC35670.

BLE+NVM+Tag IC:TC35675 Product Brief

Flash ROM

BLE Single LSI

TC3567xBLE

GATT Profile

Application SW

EEPROM

L

E

D

I2C

Keys

GPIO

(12pin max)

2

1

Display

26MHz

Battery

1 buzzer

Filter

NFC Tag Logic

SRAM

UART/SPI/I2C

NFC Tag

Analog

Block EEPROM

RF & Peripheral blocks are same as TC35670 BLE+NVM+Tag TC35675XBG

ES:Mar.2015, MP:Q2.2015



BLE+NVM IC

TC35676FTG/FSG


TC35676/7 Block Diagram Ultra Low Power Consumption ・Peak current=6.0mA(Rx, SRAM code fetch) ・Deep Sleep current<0.1uA

Various Interfaces ・UART 1ch, SPI/I2C 1ch(selectable) ・10bit ADC: 3ch for ext. / 1ch for int.(VDD monitor) ・PWM 3ch(Beep, LED etc.) ・Ext. interrupt 12ch(676), 4ch(677)

Built-in 128KB Flash ROM For GATT protocol, BLE profile and User Application SW. Other information data can be also stored.

RF Block

LE Modem

ARM7TDMI

MaskROM

SRAM CLK Gen.

ADC

UART

I2C

GPIO

JTAG DCDC

SPI

PWM

Built-in DC-DC converter (1.8-3.6V input) Simplifies power supply circuit by wide range of input voltage.

Bluetooth Smart with internal Flash ROM and Ultra Low Power

Package: TC35676: QFN40, 6mm□, 0.5mm pitch

TC35677: QFN40, 5mm□, 0.4mm pitch Supports 2-layer PCB and reduces BOM cost.

BLE+NVM IC:TC35676FTG/FSG Product Brief

Flash ROM

BLE Single LSI

TC3567xBLE

GATT Profile

Application SW

EEPROM

L

E

D

I2C

Keys

GPIO

(12pin max)

2

1

Display

26MHz

Battery

1 buzzer

Filter

RF & Peripheral blocks are same as TC35667 BLE+NVM

TC35676FTG/FSG

ES:Feb.2015, MP:Q2.2015


Bluetooth +DSP

TC35668IXBG

ES：available


block diagram Bluetooth v4.0, EDR+LE support

All in one (Complete model) Support profile for Classic and low energy Variety of profile and Middleware Multipoint and Multi profile support

Built-in external parts Integrated ANT-SW, Balun, PA, LNA ES: available

MP: Aug/2015

Built in high-performance DSP. WBS (Wide Band Speech) +ECNR support SBC, MP3, AAC Codec support

Compact package PVFBGA97pin, 6mm□, 0.5mm Ball pitch

TC35668 (BTDSP) : Product Description

BT core (ARM7)

RF

EDR/LE Modem

ARM7

Mask ROM

SRAM

SYSTEM core (Cortex-M3)

UART/ I2C/SPI

I2S/PCM

SRAM

Cortex -M3

AUDIO core (DSP)

TeakLite-Ⅲ

SRAM

Trace UART

Boot ROM

AEC-Q100 Compliant by July

EV-board:

available


BT+DSP

Audio core

BT core (ARM7)

ARM7

EDR/BLE

Modem

SRAM

RF Analog

UART

TeakLite-Ⅲ

GPIO

Quad Serial FlashROM

PLL

SPI

TraceUART

(RTS/CTS)

MROM

Trace UART

Debug IF PLL for I2S

UART

GPIO

32kHz

Filter

3.3V

PCM

CoEx

I2S/PCM

Wi-Fi Co-ex

SYSTEM core (Cortex-M3)

Cortex

-M3 SRAM

UART High Speed

SPI

I2C/SPI

UART

Data

Comm.

Wi-Fi Coex

I2S/PCM

SRAM

I2S/PCM (3ch)

1.2 V

Boot ROM

PLL for DSP & System

TC35668 (BTDSP) : Block diagram

HostCPU

XTAL

26MHz etc.


HCI (Host Controller Interface)

L2CAP

AVCTP

P

B

A

P

Application and Profile for BLE

AVRCP

v1.5

GAVDP

A2DP

GOEP

D

U

N

S

I

M

O

P

P

TC35668 (BTDSP) : Supported Profile/Protocol

Syn

c M

L

M

A

P

BNEP

PAN SPP

×

2ch

HFPv1.6 With AT cmd

×2ch

mSBC

DID

SDAP

H

S

P

SDP

H

I

D

GAP

AVDTP RFCOMM

GATT

ATT

Serv

ice

Data

base

Co

nn

ectio

n

up

date

SMP

EC/NR

SRC

SBC

MP3

AAC

Classic BLE

2015/2Q

Phone Book

parser

File task


Echo canceller by TOSHIBA


TOSHIBA ECNR “TEKAPO”

Cellular Network

Far-end Near-end (vehicle side)

TEKAPO

Bluetooth

NAVI/Audio

Road Noise Echo from Speaker

Clear Voice

Echo Cancelling, Noise Reduction and Voice Enhancement

1. Natural Voice Quality, based on Accurate Algorithm Design.

2. High Performance Echo Reduction, Over 60dB.

3. Superior Noise Reduction, passed 3-QUEST test.

4. High Duplexity, Category 2a.

5. Low Algorithm Latency, 10ms in Narrowband and 24ms in Wideband.

Technical Features

TEKAPO – TEKAPO is an Software Echo Cancellation and Noise Reduction (ECNR) C library for Car Hands Free Terminal (HFT).

– Tested with VDA & ITU-T Car HFT specification. Available in both Narrowband(8kHz) and Wideband(16kHz) mode.

– TEKAPO originated in the Mobile ECNR deployed with Android Tablets and Laptop PC of Toshiba.

speaker microphone

http://brand.hdq.toshiba.co.jp/idwh/detail/20061315

http://brand.hdq.toshiba.co.jp/idwh/detail/20061315


Continuous Brash-up iterations

Noise Reduction for Speech Recognition

ECNR for Hands Free Talk

TOSHIBA ECNR “TEKAPO”

2014 2015 2016 2017 2018

MP

1mic Solution

Multi-mic

Solution

Under Planning. 2015



Wide Band

Multi -mic

Narrow Band

NR for Server SR

NR for Standalone SR

End 2014

Roadmap

Library Specification – Fixed-point C callable library with API of ECNR frame processing.

– OS independent.

– Supported Core : ARM Cortex-A9 (w/NEON), CEVA TeakLite3（TC35668IXBG)

SWB 24k

32k

Early 2015 Under Planning. Mid 2016


RESTRICTIONS ON PRODUCT USE

Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice.

This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.

Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.

Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human li fe, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document.

Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations.

The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.

Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations.


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