Tracker Upgrade Week –Sensors Meeting Sensor Production 24. July 2014 Marko Dragicevic

Tracker Upgrade Week –Sensors Meeting

Sensor Production

24. July 2014

Marko Dragicevic

MAPSA LIGHT SENSOR

Marko Dragicevic24. July 2014 2

Status

• Design of sensors and all its variations is ready!– Kudos to Martin Printz (KIT)– An internal design review was conducted between sensor and electronics

group– Made sure that interface between sensor and chip (location of bump bonds)

is correct

• A wafer layout has been proposed – Already contains plenty of sensors for all envisaged assembly and sensor

studies– There would still be some space left…– Otherwise it will be populated with more copies of the existing structures– Deadline: 1. August 2014

• Order from procurement office to CiS is already out– CiS is waiting for the final GDS– Costs for 14 wafers: 27 kEUR (33 kCHF)

Marko Dragicevic24. July 2014

MaPSA light

3

4Marko Dragicevic24. July 2014




2S PROTOTYPE SENSOR(FULL SIZE 6” VERSION)


Status

• Sensor group is working on– Sensor design and wafer layout– Definition of materials and process options– Expected to be ready be the end of summer

• Start administrative process with CERN procurement now– We need to decide were we want to buy and how

much


2S Prototype

Production: Costs

• CNM: 6” strip production not available before 2016!• CiS: 6” production is new! 200 µm physical thickness could be challenging• Infineon:

– Low price quoted is due to sharing of costs for this run– First production of n-on-p sensors– We get 25 wafers, min 10 have to fully comply with our specs rest can be slightly outside– If run is successful, we can order additional pieces for 1000 EUR/wafer (in batches of 10)


EUR per sensor

CNM (4”) HPK (6”) Micron (6”)

SINTEF (6”)

CiS(6”) Infineon (6”)

20 pcs 2850 3200 4425 2000

22 pcs 8200

25 pcs* 2180

* for 25 wafers, min. 10 with full specs

2S Prototype

10

Production: Costs

• Cheapest, reliable manufacturer is: HPK– Sensors of reliable quality are needed soon to test module

components– HPK is an important candidate for the mass production

• Suggest to additionally produce with Infineon – Offers possibilities that HPK might not

• [O] lean, pure FZ• Test of layout and process optimisations

– Production needs to be qualified if we want Infineon for the mass production

– Direct comparison with HPK


EUR per sensor

CNM (4”) HPK (6”) Micron (6”)

SINTEF (6”)

CiS(6”) Infineon (6”)

2850 3200 4425 8200 2000 2180

2S Prototype

• We would like to have sensors from the most promising materials:– p-type MCZ and FZ, 200 µm physical thickness

• Suggestion:20 x dd-FZ200 + 20 x MCZ200– Two batches

• Alternative to lower costs?10 x dd-FZ200 + 10 x MCZ200– Single batch at HPK is around 20 – 25 wafers– I suspect that FZ and MCZ cannot be processed in the same batch– We would again end up at two batches, limited cost savings– If interesting I will clarify with HPK

• Total costs – 40 wafer from: ≈ 120 kEUR (probably lower)– 25 wafers from Infineon: 55 kEUR

Number of Wafers


2S Prototype

Baseline Design 2S Sensor• Wafer:

– Wafer diameter (6” wafer): 150 mm– Forbidden margin 5 mm -> 140 mm usable

• Sensor– Strips: 1016 (8 x 127)– Strip Pitch: 90 µm– Width/Pitch: ~ 0.25– P-stop: Atoll, 4 µm width, 6 µm spacing

• 2S Sensor size

– Fitted size to what is used in CAD models– Not optimised for optimal wafer usage!

– Sensor width: 94.183 mm– Sensor length: 102.7 mm– Active size: 100.6 x 91.5 mm2


150 mm

5 mm

140

mm

2S Prototype

13

94.183 mm

102.7 m

m

Wafer Layout


• 2S sensor– 94 mm x 103 mm

• Test sensors– 1 x BabyStrip: 127 ch x 50 mm – 6 x BabyStrixel: 127 ch x 23 mm– 4 x TinyStrixel: 127 ch x 12.5 mm

• Teststructures– Wafer will be filled with Teststructures– Currently only Diodes are implemented– Size of TS will be significantly reduced

compared to old “Halfmoon”

2S Prototype

14

2S Sensor

BabyStripB

ab

yStr

ixe

l Ba

byS

trixel

TinyStrixel

2S Sensor

BabyStripB

ab

yStr

ixe

l Ba

byS

trixel

TinyStrixel

Design Options• BabyStrip:

– Standard test sensors for CBC with 5 cm strips

• BabyStrixel1. P-stop Atoll geometries

• Following the results from the KIT/CNM run

2. P-stop Common geometries• Consumes less space, should have similar performance

3. Strixel segmentation area• Optimising the pitch between strixels at the segmentation

area

4. Center Bias Line for strixels• To connect strixels at the center• Moves bond pad nearer to sensor edge

5. Irradiation Sensor• Standard design like main 2S Sensor Prototype

6. ???

• TinyStrixel1. No P-stop

2. - 4. ???


2S Prototype

• Material: 20 x dd-FZ200@200 + 20 x MCZ200– All in 200 µm physical/active thickness– We consider using dd-FZ200 (active: 200 µm/ physical 320 µm)

which is thinned to 200 µm to get a lower [O] spread– FTH200 = dd-FZ320@200 ≠ dd-FZ200@200

• Process options (for both materials) – 14 x standard p-stop (as suggested by HPK/used for the HPK

campaign)– 2 x p-stop Dose/Depth Variation 1 (tbd)– 2 x p-stop Dose/Depth Variation 2 (tbd)– 2 x p-spray (as suggested by HPK/used for the HPK campaign)

Total of 40 Wafer: ≈ 120 kEUR

Process Options - HPK


2S Prototype

Process Options - Infineon

• Material: 20 x FZ200+ 5 x MCZ200– All in 200 µm physical/active thickness– The FZ material is pure oxygen lean ([O] < 2E16/cm3) FZ

• Process options– First production of NonP sensors at Infineon– Need to tune parameters for all implantations, especially p-stop

and p-spray– Will discuss with Infineon

Total of 25 Wafer: = 55 kEUR

(Then 10 kEUR/10 wafers with same masks)17Marko Dragicevic24. July 2014

2S Prototype

Tentative Timeline

• Until September (CMS Upgrade Week)– Finalize sensor design and wafer layout– Define materials and process– Start administrative process with CERN

Procurement (HPK and Infineon)

• September – Beginning 2015– Start the production– HPK: Approximate lead time is 4 months,

procurement of wafers might add some time– Infineon: potentially faster, but many unknowns


2S Prototype

Conclusions I

The 2S Prototype Sensors are an essential step in the Tracker R&D to successfully:• Evaluate the design of the 2S sensor

– Test of different sensor layout options with small sensors

• Evaluate radiation hardness of sensor design and material– Continuation of the HPK Thin Sensor Campaign

• Evaluate the 2S module design by building a full size prototype– Already needed now to test 8xCBC hybrid

prototypes

• Evaluate vendors and prepare for the mass production


2S Prototype

8” N-ON-P SENSORSWITH INFINEON


Status

• Order is already out for some time– To encourage Infineon to work on it

• Costs: 120 kEUR• Sensor design and layout will be inherited from the 6” 2S Sensor

Prototype Run• Infineon has defined the process plan• They have processed one batch of 8” wafers going through the

complete process with arbitrary masks (Kurzläufer)• Goal:

Estimate the yield for a 8” production at 200 µm thickness

Outcome:

All wafers survived!21Marko Dragicevic24. July 2014

8” Infineon

Conclusions II


Upcoming sensors productions (2S, MAPSA-light and 8”) will yield plenty of test sensors and structures!

Great opportunity to:• Join the effort to characterise sensors and

test structure• To perform interesting studies with your

students

If you are interested contact• Alexander Dierlamm• Marko Dragicevic

THANKS FOR YOUR ATTENTION!

Documents

Tracker Upgrade Week –Sensors Meeting Sensor Production 24. July 2014 Marko Dragicevic