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TI Information– Selective DisclosureTI Information– Selective Disclosure
Trends for Integrated Isolated DC/DC Conversion in Automotive Applications
Jeff Morroni, PhDTexas Instruments -- Kilby Labs
TI Information– Selective Disclosure
Introduction• Jeffrey Morroni
– Director of Kilby Labs Power Management– PhD in Power Electronics from University of Colorado, Boulder– Joined TI with the National Semiconductor acquisition– Based in Dallas
2
TI Information– Selective Disclosure
Cars of the Future…Now2000 Model Year Toyota Camry
3
2020 Model Year Toyota Camry Hybrid
TI Information– Selective Disclosure
Automotive Drive for More Electronics
4
Source: Freescale Semiconductors/IC Insights IC Market Drivers 2013
0%
10%
20%
30%
40%
50%
60%
1950 1960 1970 1980 1990 2000 2005 2010 2030
1% 2,5%5%
10%15%
22%
30%35%
50%
Elec
tron
ic C
ost a
s a
% o
f Tot
al C
ar C
ost
Automotive Electronic Content Growth?
Source: BMW
0.6
0.8
1
1.2
1.4
1.6
1.8
2
2.2
2005 2007 2009 2011 2013 2015
Semiconductors216%
Modules187%
Vehicles145%
VehiclesModulesSemiconductors
Vehicles : Modules : Semiconductors = 1 : 2 : 3
More than 8000 Semiconductor devices in a carPower Management:
Battery Management Wireless Power Adaptive lighting Universal chargerPOL Power…
• Electronic systems account for 1/3 of new vehicles cost
• 41% analog IC and 39% microcontroller
TI Information– Selective Disclosure
Moore vs. Goodenough
*Source: Enabling technologies for autonomous MAV operations
5
• Battery energy density have doubled every ~120 months
• Transistors have historically doubled every 24 months
• If batteries had followed Moore’s law– 300 mile range– $1 battery– That would fit in the palm of your hand!
• More electronics, similar batteries Power management innovations required to sustain
Battery Energy and Cost vs. Time
TI Information– Selective Disclosure 6
EV/HEV Needs High Voltage Power ProductsHEV/EVNeeds
Vehicle Implications
Power System Implications
Longer Range
Faster Charging
Affordable
Passenger Safety
Light Weight
Higher Power
Battery utilization
HV Isolation
Efficiency Power Density Low EMI Smaller Magnetics Lesser Cooling WBG Switches HV isolation
Driving a path towards more power supplies on chip
TI Information– Selective DisclosureTI Information– Selective Disclosure
Application for Solid State Relays
TI Information– Selective Disclosure
Automotive EV/HEV Application Overview
8
~ 1 MΩ
HV+
HV-
Main switch
Pre-Chargeswitch
Main switch
Traction Inverter
HVDCL+
HVDCL-
HV Coolant Heater
HVAC Compressor
HV PTC Heater
DCDC
12 V
HVDCL-HV Discharge
Isolation Check HV-
~ 15 Ω
Isolation Check HV+~ 1 MΩ
ChassisGround
ChassisGround
ChassisGround
= Isolated Load Switch
BatteryVoltageCheck
~ 1 MΩ
Motor/Generator
TI Information– Selective Disclosure
Relay Limitations in Automotive
9
• Old challenges• Reliability in the environment
• High vibration• Dusty and humid environment
• Bulky• New Challenges
• EV driving increased need• Fast responses• High voltages
Failu
re R
ate
Time
Relay
Solid State
QualityFails
Useful Life WearoutWhat is a Relay?
Power Supply on a chip
TI Information– Selective Disclosure
Path Towards Higher Power and Efficiency
10
Opto-Couplers Silicon Capacitors Integrated Transformers
Power Xfr Very low Low/Expensive High
Op Temp -40C 100C/125C -40C 125C -40C 125C
Op Temp -40C 100C/125C -40C 125C -40C 125C
Prop Delay Very Large Large Small
Preferred technology will depend on application needs
Source: https://www.allaboutcircuits.com/technical-articles/beyond-the-optocoupler-understanding-digital-isolators/
TI Information– Selective DisclosureTI Information– Selective Disclosure
Application for Isolated Bias Supplies
TI Information– Selective Disclosure 12
HEV/EV Traction Inverter Bias
ISOLA
TION
ISOLA
TION
ISOLA
TION
ISOLA
TION
ISOLA
TION
ISOLA
TION
Motor
3-Phase AC-Drive Power Stage [I-V]
Motor Terminal
AC-Drive ControlModuleSpeed / Torque
Analog & Digital I/O Isolated DC/DC
ControllerInterface
Digital I/O Isolated DC/DC
Enabling Requirements• Very small size very high frequency• Low temperature rise high efficiency• Low EMI Stringent auto requirement• High isolation Safety critical
TI Information– Selective Disclosure
Distributed Power Vs. Centralized Power
13
Advantages of Separate Power Supply per Gate Driver:• Improved power density• Reduce EMI
• Compact routing is good for emission suppression• Low EMI techniques in integrated power converters
• Simplifies PCB layout• Avoid multi-layer PCB with HV and LV line interaction
• Better bias power quality• Avoid cross regulation issues and eliminate need for post-regulator
• Distributed weight• Resistant to mechanical vibrations• Reduce the transformer profile
• Distributed power loss for easy cooling
12mm x12mm x 1mm6x 144mm3
864mm3
27mm x 35mm x 14mm13,230mm3
TI Information– Selective Disclosure
Path Towards Distributed Bias: Efficiency
14
Enabling Requirements• Very small size very high frequency• Low temperature rise high efficiency
Mag. Core
Mag. Core
𝑄𝜔𝐿𝑅
freq
LAir Core
Freq
Q
100MHz5MHz
Air Core
• Air core solutions can have very high Q, but at very high frequency
• Magnetic integration enables a better trade-off• High Q• At much lower frequency
Source: https://www.analog.com/en/technical-articles/icoupler-products-with-isopower-technology.html
TI Information– Selective Disclosure
Better efficiency, thermal performance higher density
5 Vin, 5 Vout, 100 mA, 25°C
Magnetic Core (UCC12050)Air Core Solution
TI Information– Selective Disclosure
Path Towards Distributed Bias: EMI
16
GND1 GND2vin+- Cin Cout vout
inoise
+-
CG_PS
PRIM
ARY
SEC
ON
DAR
Y• Methods to minimize EMI
• Reduce pri-sec capacitance: Transformer optimization• Minimize the dv/dt: Symmetric drives/topologies• Reduce the dipole gain: Additional external cap, stitching capacitors• Filters: Ferrite beads, pre/post regulators
TI Information– Selective Disclosure
Reducing Common Mode Currents: Faraday ShieldsFaraday shields:• Allow magnetic fields to pass• Are grounded on either side of the isolation
barrier
Benefits:• Reduced noise from capacitive coupling• Not available in discrete components with
similar size
P1P2S1S2
TI Information– Selective Disclosure
Better EMI performance = higher power density
• Same (apple-to-apple) EVM configuration: no ferrite beads , no LDO, no stitch capacitors, on two-layer PCB
• Tested to CISPR32 Class B Limit, in 10 m chamber
Max = - 5.835 dB Max = + 19.533 dB
Magnetic Core (UCC12050) @ 100 mA: Aircore solution @ 100 mA:
TI Information– Selective Disclosure
Conclusions
19
• Expansion of electronics in automotive is driving the need for integrated power management
• Isolation is critical for EV systems with high voltage present
• Two leading examples of that are solid state relays and distributed bias generation for EVs
• Density (thermals) and EMI are critical requirements to enable the trends
• Fully integrated, isolated power supplies have the opportunity to address these issues