Tyan Brochure

INTEL-BASED HPC/GPU PLATFORMS

Processor

Chipset

Memory

Expansion

Storage

Network

VideoManagementForm Factor

‧Dual LGA2011 sockets support Intel® Xeon® E5-2600 series processors (Sandy Bridge-EP)

‧Intel® C602 PCH‧Intel® C602 PCH + TYAN TRK#5 ROM Kit (S7052WGM5NR)‧(12+12) DDR-III DIMM sockets‧Support up to 768GB of LRDIMM 1333/1066 w/ ECC memory‧Support up to 384GB of R-DDR3 1600/1333/1066 w/ ECC memory‧Support up to 192GB of U-DDR3 1333/1066 w/ ECC memory‧(3) PCI-E (Gen.3) x8 slots‧(1) PCI-E (Gen.3) x4 slot‧(2) SATA 6Gb/s connectors (Intel® RSTe 3.0)‧(4) SATA 3Gb/s connectors (Intel® RSTe 3.0)‧(8) SAS 3Gb/s ports by (2) mini-SAS conncetors (Intel® RSTe 3.0)

(S7052WGM5NR)‧(5) GbE (via Intel® I350-AM4 and Intel® 82574L)

(S7052GM5NR/S7052WGM5NR)‧(3) GbE (via Intel® I350-AM2 and Intel® 82574L) (S7052GM3NR)‧ASPEED AST2300 Integrated Graphics‧ASPEED AST2300 (IPMI v2.0 compliant w/ iKVM)‧SSI EEB (12" x 13", 305mm x 330mm)

Server Board

Server Board

S7012S7012GM4NR / S7012WGM4NR

Processor

ChipsetMemory

Expansion

Storage

NetworkVideoManagementForm Factor

‧Dual LGA1366 sockets support Intel® Xeon® 5500/5600 series processors (Nehalem/ Westmere)

‧Intel® 5520 + ICH10R‧(9+9) DDR-III DIMM sockets‧Support up to 144GB of R-DDR3 1333/1066/800 w/ ECC

memory‧Support up to 48GB of U-DDR3 1333/1066 w/ ECC memory‧(4) PCI-E (Gen.2) x8 slots‧(1) PCI-E x8 slot (w/ x4 link)‧(6) SATA 3Gb/s connectors (Intel® Matrix RAID)‧(8) SAS 3Gb/s ports by (2) mini-SAS connectors (LSI RAID

stack) (S7012WGM4NR)‧(4) GbE (via Intel® 82576EB and 2x Intel® 82574L)‧ASPEED AST2050 Integrated Graphics‧ASPEED AST2050 (IPMI v2.0 compliant w/ iKVM)‧SSI EEB (12" x 13", 305mm x 330mm)

S7050S7050A2NRF / S7050GM4NR / S7050WGM4NR / S7050GM2NR

Processor

Chipset

Memory

Expansion

Storage

Network

VideoAudioFirewireManagementForm Factor


‧Intel® C602 PCH‧Intel® C602 PCH + TYAN TRK#5 ROM Kit (S7050WGM4NR)‧(8+8) DDR-III DIMM sockets‧Support up to 512GB of LRDIMM 1333/1066 w/ ECC memory‧Support up to 256GB of R-DDR3 1600/1333/1066 w/ ECC memory‧Support up to 128GB of U-DDR3 1333/1066 w/ ECC memory‧(2) PCI-E (Gen.3) x16 slots (w/ x16 or x8 link)‧(2) PCI-E (Gen.3) x8 slots (w/ x0 or x8 link)‧(1) PCI-E (Gen.2) x4 slot‧(1) PCI 32/33MHz slot‧(2) SATA 6Gb/s connectors (Intel® RSTe 3.0)‧(4) SATA 3Gb/s connectors (Intel® RSTe 3.0)‧(8) SAS 3Gb/s conncetors (Intel® RSTe 3.0) (S7050WGM4NR)‧(4) GbE (via Intel® i350-AM2 and 2x Intel® 82574L)‧(2) GbE (via 2x Intel® 82574L) (S7050GM2NR,S7050A2NRF)‧ASPEED AST2300 Integrated Graphics‧Realtek ALC262 audio CODEC (S7050A2NRF)‧VIA VT6308 1394a controller (S7050A2NRF)‧ASPEED AST2300 (IPMI v2.0 compliant w/ iKVM)‧SSI EEB (12" x 13", 305mm x 330mm)

Server Board

Workstation Board

Server Board

Workstation Board

S7010S7010AGM2NRF

Processor

ChipsetMemory

Expansion

StorageNetworkVideoAudioFirewireManagementForm Factor



memory‧Support up to 48GB of U-DDR3 1333/1066 w/ ECC memory‧(1) PCI-E (Gen.2) x16 slot‧(2) PCI-E (Gen.2) x8 slots‧(1) PCI-E x4 slot‧(1) PCI 32/33MHz slot‧(6) SATA 3Gb/s connectors (Intel® Matrix RAID)‧(2) GbE (via 2x Intel® 82574L)‧ASPEED AST2050 Integrated Graphics‧Realtek ALC262 audio CODEC‧VIA VT6308 1394a controller‧ASPEED AST2050 (IPMI v2.0 compliant w/ iKVM)‧SSI EEB (12" x 13", 305mm x 330mm)

Intel® C600Series Chipset

Intel® 5500Series Chipset

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S7052S7052GM3NR / S7052GM5NR / S7052WGM5NR

<HPC> TYAN offers multiple High Performance Computing (HPC) server platforms that support either the newest Intel® Xeon® processor E5-2600 product family or Intel® Xeon® 5600 series processor . Both platforms are designed for high performance in massively parallel computing environments which meet users’ complex workloads requirements while accelerating general computing capability. Ranging from mainstream workloads to the most challenging computing applications, TYAN offers various platforms that support our customers need to build scalable, efficient, flexible, and easily managed datacenters as well as other complicated high performance computing infrastructure.

<GPU> Supporting the latest Intel® Xeon® Processor E5-2600 product families, Intel® Xeon® 5600 Series Processor and Graphic Computing Processors (GPU), TYAN’s GPU platforms offer data accuracy and double precision floating-point performance with uncompromised accuracy. TYAN’s Intel Xeon based GPU platforms range from 1 GPU up to 8 GPUs inside traditional 1U, 2U and 4U rackmount chassis, which help reduce the rack space requirements required for high performance applications. With the right workload, these platforms can offer higher performance and reduce power consumption when compared to traditional CPU centric platforms.

Target Applications:

‧Bio-Informatics, Life Sciences and Computational Chemistry

‧Electronic-Design Automation ‧Computational Finance and

Computational Fluid Dynamics‧Computer Vision and MATLAB

Acceleration‧Data mining, Analytics and

Databases‧Imaging, Molecular Dynamics,

Weather, Climate Modeling and Atmospheric

‧Oil, Gas and Petroleum Exploration ‧Physic and Scientific Research

HPC

/GPU

Platforms -

Intel Based

SMB

Platforms

SM

B Platform

sEm

bedded Platforms

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bedded Platforms

Matrix

Matrix

13 14

● TYAN HPC/GPC Platforms │ Intel Based

Cloud Platform

sC

loud Platforms

Server Board

Server Board


Processor

ChipsetMemory

Expansion

Storage




memory‧Support up to 48GB of U-DDR3 1333/1066 w/ ECC memory‧(1) PCI-E (Gen.2) x16 slot‧(2) PCI-E (Gen.2) x8 slots‧(2) SATA 3Gb/s connectors (Intel® Matrix RAID)‧(4) SATA 3Gb/s ports by (1) mini-SAS connector (Intel®

Matrix RAID)‧(8) SAS 3Gb/s ports by (2) mini-SAS connectors (LSI RAID

stack) (S7016WGM3NR)‧(3) GbE (via Intel® 82576EB and Intel® 82574L)‧ServerEngine Pilot II Integrated Graphics‧ServerEngine Pilot II (IPMI v2.0 compliant w/ iKVM)‧EATX (12" x 13", 305mm x 330mm)

Server Board

Workstation Board

Server Board

Workstation Board

S7025S7025AGM2NR / S7025WAGM2NR

Processor

ChipsetMemory

Expansion

Storage

NetworkVideoAudio ManagementForm Factor


‧Intel® 5520 + 5520 + ICH10R‧(4+4) DDR-III DIMM sockets‧Support up to 64GB of R-DDR3 1333/1066/800 w/ ECC

memory‧Support up to 32GB of U-DDR3 1333/1066 w/ ECC memory‧(4) PCI-E (Gen.2) x16 slots‧(1) PCI-E (Gen.2) x8 slot‧(1) PCI-E (Gen.2) x4 slot‧(1) PCI 32/33MHz slot‧(6) SATA-II connectors running at 3.0 Gb/s w/ RAID 0, 1, 10,

5 support‧(8) SAS ports by (2) mini-SAS connectors w/ RAID 0, 1, 1E

support (S7025WAGM2NR)‧(2) GbE (via two Intel® 82574L)‧ASPEED AST2050 Integrated Graphics‧Realtek ALC262 audio CODEC‧ASPEED AST2050 (IPMI v2.0 compliant w/ iKVM)‧SSI EEB (12" x 13", 305mm x 330mm)


FT77A- B7059B7059F77AV4R (BTO)


Server Board

Server Board

S7053S7053GM2NR / S7053WGM2NR / S7053GM4NR / S7053WGM4NR


World’s Only 8 GPU Barebone‧Supporting (2) Intel® Xeon® E5-2600 Processor Series‧Supporting up to (8) GPU cards in a 4U chassis‧(24) DDR-III R/U-DIMM slots‧(8) PCI-E x16 Gen.3 slots‧(4) 2.5” HDDs


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Processor

Chipset

Memory

Expansion

Storage

Network



‧Intel® C602 PCH‧Intel® C602 PCH + LSI SAS2308 (S7053WGM2NR/S7053WGM4NR)‧(8+8) DDR-III DIMM sockets‧Support up to 512GB of LRDIMM 1333/1066 w/ ECC memory‧Support up to 256GB of R-DDR3 1600/1333/1066 w/ ECC memory‧Support up to 128GB of U-DDR3 1333/1066 w/ ECC memory‧(2) PCI-E (Gen.3) x16 slots‧(4) PCI-E (Gen.3) x8 slots‧(2) SATA 6Gb/s connectors (Intel® RSTe 3.0)‧(4) SATA 3Gb/s connectors (Intel® RSTe 3.0)‧(4) SATA 3Gb/s ports by (1) mini-SAS connector (Intel® RSTe 3.0)‧(8) SAS 6Gb/s ports by (2) mini-SAS conncetors (LSI RAID stack)

(S7053WGM2NR/S7053WGM4NR)‧(2) GbE (via Intel® I350-AM2) (S7053GM2NR/S7053WGM2NR)‧(4) GbE (via Intel® I350-AM4) (S7053GM4NR/S7053WGM4NR)‧ASPEED AST2300 Integrated Graphics‧ASPEED AST2300 (IPMI v2.0 compliant w/ iKVM)‧SSI EEB (12" x 13", 305mm x 330mm)

Processor

Chipset

Memory

ExpansionStorage



‧Intel® C602 PCH‧Intel® C602 PCH + LSI SAS2308 (S7066WGM3NR)‧(8+8) DDR-III DIMM sockets‧Support up to 512GB of LRDIMM 1333/1066 w/ ECC memory‧Support up to 256GB of R-DDR3 1600/1333/1066 w/ ECC memory‧Support up to 128GB of U-DDR3 1333/1066 w/ ECC memory‧(2) PCI-E (Gen.3) x16 slots‧(2) SATA 6Gb/s connectors (Intel® RSTe 3.0)‧(4) SATA 3Gb/s ports by (1) mini-SAS connector (Intel® RSTe 3.0)‧(8) SAS 6Gb/s ports by (2) mini-SAS conncetors (LSI RAID stack)

(S7066WGM3NR)‧(3) GbE (via Intel® I350-AM2 and Intel® 82574L)‧ASPEED AST2300 Integrated Graphics‧ASPEED AST2300 (IPMI v2.0 compliant w/ iKVM)‧EATX (12" x 13", 305mm x 330mm)



Model NumberEnclosure Form FactorSupported CPUChipsetChipset InterconnectionNumber of DIMM SlotMemory Type (max.capacity)Storage ControllerRAID SupportNetworking

PCI Expansion Slots

Standard Model Number of HDD Bay Storage Backplane Power SupplyB7059F77AV4R (BTO) (4) Internal 2.5" N/A (2+1) 2,400W RPSU

Intel® C602 PCHIntel® QPI 8.0/ 7.2/ 6.4GT/s

(8) PCI-E (Gen.3) x16 + (1) PCI-E (Gen.3) x8+ (1) PCI 32/33MHz + (1) PCI-E (Gen.3) x8 Mezzanine slot

24/ 12+12R-DDR3 1600/1333 / 1066 w/ ECC (384GB)U-DDR3 1600/ 1333/ 1066 w/ ECC (192GB)Intel® C602 PCH (SATA 6Gb/s & 3Gb/s)

0, 1, 5, 10 (Intel® RSTe 3.0)(2) GbE (shared IPMI NIC)

FT77A-B70594U (28" in depth)

(2) Intel® Xeon® E5-2600 Series (Sandy Bridge-EP)

S7055S7055AGM3NR / S7055WGM3NR / S7055GM3NR-B / S7055GM3NR-2T-B

Processor

Chipset

Memory

Expansion

Storage

Network

VideoAudioManagementForm Factor


‧Intel® C602 PCH‧Intel® C602 PCH + TYAN TRK#5 ROM Kit (S7055WGM3NR)‧(4+4) DDR-III DIMM sockets‧Support up to 256GB of LRDIMM 1333/1066 w/ ECC memory‧Support up to 128GB of R-DDR3 1600/1333/1066 w/ ECC memory‧Support up to 64GB of U-DDR3 1600/1333/1066 w/ ECC memory‧(4) PCI-E (Gen.3) x16 slots ‧(2) PCI-E (Gen.3) x8 slots (S7055GM3NR-B)‧(1) PCI 32/33MHz slot‧(2) SATA 6Gb/s connectors (Intel® RSTe 3.0)‧(4) SATA 3Gb/s connectors (Intel® RSTe 3.0)‧(8) SAS 3Gb/s ports by (2) mini-SAS connectors (Intel® RSTe 3.0)

(S7055WGM3NR)‧(3) GbE (via Intel® I350-BT2 and Intel® 82574L)

(S7055AGM3NR / S7055WGM3NR / S7055GM3NR)‧(2) 10GbE (via Intel® X540-AT2) + (1) GbE (Intel® 82574L)

(S7055GM3NR-2T-B)‧ASPEED AST2300 Integrated Graphics‧Realtek ALC262 audio CODEC (S7055AGM3NR)‧ASPEED AST2300 (IPMI v2.0 compliant w/ iKVM)‧SSI EEB (12" x 13", 305mm x 330mm)

S7056S7056GM3NR / S7056WGM3NR / S7056WGM3NR-2T

Processor

Chipset

Memory

Expansion

Storage

Network



‧Intel® C602 PCH‧Intel® C602 PCH + TYAN TRK#5 ROM Kit

(S7056WGM3NR/S7056WGM3NR-2T)‧(8+8) DDR-III DIMM sockets‧Support up to 512GB of LRDIMM 1333/1066 w/ ECC memory‧Support up to 256GB of R-DDR3 1600/1333/1066 w/ ECC memory‧Support up to 128GB of U-DDR3 1333/1066 w/ ECC memory‧(2) PCI-E (Gen.3) x16 slots‧(2) PCI-E (Gen.3) x4 slots in-lined w/ x16 slots & x8 link‧(2) SATA 6Gb/s connectors (Intel® RSTe 3.0)‧(4) SATA 3Gb/s ports by (1) mini-SAS connector (Intel® RSTe 3.0)‧(8) SAS 3Gb/s ports by (2) mini-SAS connectors (Intel® RSTe 3.0)

(S7056WGM3NR/S7056WGM3NR-2T)‧(3) GbE (via Intel® I350-BT2 and Intel® 82574L)

(S7056GM3NR/S7056WGM3NR)‧(2) 10GbE (via Intel® X540-AT2) + (1) GbE (Intel® 82574L)

(S7056WGM3NR-2T)‧ASPEED AST2300 Integrated Graphics‧ASPEED AST2300 (IPMI v2.0 compliant w/ iKVM)‧EATX (12" x 13", 305mm x 330mm)

HPC

/GPU

Platforms -

Intel Based

HPC

/GPU

Platforms -

Intel Based

SMB

Platforms

SM

B Platform

sEm

bedded Platforms

Em

bedded Platforms

Matrix

Matrix

15 16

● TYAN HPC/GPU Platforms │ Intel Based ● TYAN HPC/GPU Platforms │ Intel Based

SMB

Platforms

SM

B Platform

sEm

bedded Platforms

Em

bedded Platforms

Matrix

Matrix

Cloud Platform

sC

loud Platforms

Cloud Platform

sC

loud Platforms

FT48-B7025B7025F48W4H / B7025F48W8HR

GOLD

FT48-B7055B7055F48W8HR

TN70-B7066B7066T70W12HR

GOLD

TN70-B7016B7016T70-077V12HR

GOLD

GN70-B7056B7056G70V8HR / B7056G70V8HR-2T

GOLD

YR292-B7008-X4B7008Y292X4-080V4HR

Model NumberEnclosure Form FactorSupported CPU (per node)Chipset (per node)QuickPath InterconnectNumber of DIMM Slot(per node)Memory Type (max. capacity)(per node)Storage Controller (per node)RAID Support (per node)Networking (per node)PCI Expansion Slots (pernode)

Standard Model Number of HDD Bay Storage Backplane Power SupplyB7008Y292X4-080V4HR (4) Hot-swap 2.5"

(per node)4-port SAS/ SATA

6Gb/s(per node)

(1+1) 800W RPSU

Intel® 5500 + ICH10RIntel® QPI 6.4/ 5.86/ 4.8 GT/s

(1) PCI-E (Gen.2) x16

9

R-DDR3 1333/1066/800 w/ ECC (72GB)U-DDR3 1333/1066 w/ ECC (36GB)

Intel® ICH10R (SATA 3Gb/s)RAID 0, 1, 5, 10 (Intel® Matrix RAID)

(2) GbE + (1) IPMI

YR292-B7008-X42U (28.74" in depth) / 4 Nodes

(1) Intel® Xeon® 5500/5600 Series (Nehalem/ Westmere)




Model NumberEnclosure Form FactorSupported CPUChipsetChipset InterconnectionNumber of DIMM SlotMemory Type (max.capacity)Storage ControllerRAID SupportNetworking

PCI Expansion Slots

Standard Model Number of HDD Bay Storage Backplane Power SupplyB7025F48W4H (4) Hot-swap 3.5" 4-port SAS/ SATA

3Gb/s1,300W (2x 650W)

B7025F48W8HR (8) hot-swap 3.5" (2) 4-port SAS/ SATA3Gb/s

(2+1) 1,300W RPSU

Intel® 5520 + 5520 + ICH10RIntel® QPI 6.4/ 5.86/ 4.8 GT/s

(4) PCI-E (Gen.2) x16 + (1) PCI-E (Gen.2) x8 +(1) PCI-E (Gen.2) x4 + (1) PCI 32/33MHz

8/ 4+4R-DDR3 1333/ 1066/ 800 w/ ECC (64GB)

U-DDR3 1333/ 1066 w/ ECC (32GB)LSI SAS1068E (SAS 3Gb/s)

0, 1, 1E (LSI RAID stack)(2) GbE (shared IPMI NIC)

FT48-B70254U (27.5" in depth)


GOLD

Model NumberEnclosure Form Factor

Supported CPU

ChipsetQuickPath InterconnectNumber of DIMM SlotMemory Type (max.capacity)

Storage Controller

RAID Support

NetworkingPCI Expansion Slots

Standard Model Number of HDD Bay Storage Backplane Power SupplyB7016T70-077W12HR (12) hot-swap 3.5" 12-port SAS/ SATA (1+1) 770W RPSU

Intel® 5520 + ICH10RIntel® QPI 6.4/ 5.86/ 4.8 GT/s

18/ 9+9R-DDR3 1333/ 1066/ 800 w/ ECC (144GB)

U-DDR3 1333/ 1066 w/ ECC (48GB)LSI SAS1068E (SAS 3Gb/s)Intel® ICH10R (SATA 3Gb/s)

0, 1, 1E (LSI RAID stack)0, 1, 5, 10 (Intel Matrix RAID)(3) GbE (shared IPMI NIC)

(2) PCI-E (Gen.2) x8 + (2) PCI-E (Gen.2) x4

TN70-B70162U (27.56" in depth)




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Model NumberEnclosure Form Factor

Supported CPU

ChipsetQuickPath Interconnect

Number of DIMM Slot

Memory Type (max.capacity)

Storage Controller

RAID Support

NetworkingPCI Expansion Slots

Standard Model Number of HDD Bay Storage Backplane Power SupplyB7066T70W12HR (12) hot-swap 3.5" 12-port SAS/ SATA (1+1) 770W RPSU


16/ 8+8

R-DDR3 1600/ 1333/ 1066/ 800 w/ ECC (256GB)U-DDR3 1333/ 1066 w/ ECC (128GB)

LSI SAS2308 (SAS 6Gb/s)Intel® C602 PCH (SATA 6Gb/s & 3Gb/s)

0, 1, 1E, 10 (LSI RAID stack)0, 1, 5, 10 (Intel® RSTe 3.0)(3) GbE (shared IPMI NIC)

(4) PCI-E (Gen.3) x8

TN70-B70662U (27.56" in depth)


SILVER


Model NumberEnclosure Form FactorSupported CPUChipsetChipset InterconnectionNumber of DIMM SlotMemory Type (max.capacity)Storage ControllerRAID Support

Networking

PCI Expansion Slots

Standard Model Number of HDD Bay Storage Backplane Power Supply

B7055F48W8HR (8) hot-swap 3.5" (2) 4-port SAS/ SATA6Gb/s (2+1) 1,540W RPSU


(4) PCI-E (Gen.3) x16 + (2) PCI-E (Gen.3) x8 + (1) PCI 32/33MHz

8/ 4+4R-DDR3 1600/ 1333/ 1066/ 800 w/ ECC (256GB)

U-DDR3 1600/ 1333/ 1066 w/ ECC (64GB)Intel® C602 PCH (SATA 6Gb/s & 3Gb/s)

0, 1, 5, 10 (Intel® RSTe 3.0)(3) GbE (shared IPMI NIC), or

(2) 10GbE + (1) GbE (shared IPMI NIC)

FT48-B70554U (27.5" in depth)


Model NumberEnclosure Form FactorSupported CPUChipsetQuickPath InterconnectNumber of DIMM SlotMemory Type (max.capacity)Storage ControllerRAID Support

Networking

PCI Expansion Slots

Standard Model Number of HDD Bay Storage Backplane Power SupplyB7056G70V8HR (8) hot-swap 3.5" 8-port SAS/ SATA (1+1) 770W RPSUB7056G70V8HR-2T (8) hot-swap 3.5" 8-port SAS/ SATA (1+1) 770W RPSU


GN70-B70562U (27.56" in depth)



16/ 8+8R-DDR3 1600/ 1333/ 1066/ 800 w/ ECC (512GB)

U-DDR3 1333/ 1066 w/ ECC (128GB)Intel® C602 PCH (SATA 6Gb/s & 3Gb/s)

0, 1, 5, 10 (Intel® RSTe 3.0)(3) GbE (shared IPMI NIC), or

(2) 10GbE + (1) GbE (shared IPMI NIC)

Model NumberEnclosure Form FactorSupported CPU (per node)Chipset (per node)QuickPath InterconnectNumber of DIMM Slot(per node)Memory Type (max. capacity)(per node)

Storage Controller (per node)

RAID Support (per node)

Networking (per node)PCI Expansion Slots (per node)

Standard Model Number of HDD Bay Storage Backplane Power SupplyB7018Y290D2-045V8H (8) Hot-swap 2.5"

(per node)8-port SAS/ SATA 3Gb/s

(per node)450W PSU(per node)

YR290-B7018-D22U (28.74" in depth) / 4 Nodes

(2) Intel® Xeon® 5500/5600 Series (Nehalem/ Westmere)Intel® 5500 + ICH10R

Intel® QPI 6.4/ 5.86/ 4.8 GT/s

12/ 6+6

R-DDR3 1333/1066/800 w/ ECC (96GB)U-DDR3 1333/1066 w/ ECC (48GB)

LSI SAS1068E on TYAN P3202 HBA (SAS 3Gb/s)Intel® ICH10R (SATA 3Gb/s)

RAID 0, 1, 1E (LSI RAID stack)RAID 0, 1, 5, 10 (Intel® Matrix RAID)

(3) GbE (shared IPMI NIC)


B7018Y290D2-045W8HR (8) Hot-swap 2.5"(per node)

8-port SAS/ SATA 3Gb/s(per node)

(1+1) 450W RPSU(per node)

YR292-B5518-X4B5518Y292X4-080V4HR

Model NumberEnclosure Form FactorSupported CPU (per node)Chipset (per node)Number of DIMM Slot(per node)Memory Type (max. capacity)(per node)Storage Controller (per node)RAID Support (per node)Networking (per node)PCI Expansion Slots (pernode)

Standard Model Number of HDD Bay Storage Backplane Power Supply

B5518Y292X4-080V4HR (4) Hot-swap 2.5"(per node)

4-port SAS/ SATA6Gb/s

(per node)

(1+1) 800W RPSU

Intel® C204 PCH

YR292-B5518-X42U (28.74" in depth) / 4 Nodes

(1) Intel® Xeon® E3-1200 v2 Series/ Next Gen. Xeon E3-1200 Processor (Sandy Bridge-DT)

4

U-DDR3 1333/1066/ 1600 w/ ECC (32GB)

Intel® C204 PCH (SATA 6Gb/s & 3Gb/s)RAID 0, 1, 5, 10 (Intel® RST 11.x)

(2) GbE + (1) IPMI

(1) PCI-E (Gen.2) x16

YR290-B7018-D2B7008Y292X4-080V4HR

HPC

/GPU

Platforms -

Intel Based

HPC

/GPU

Platforms -

Intel Based

SMB

Platforms

SM

B Platform

sEm

bedded Platforms

Em

bedded Platforms

Matrix

Matrix

17 18

● TYAN HPC/GPU Platforms │ Intel Based ● TYAN HPC/GPU Platforms │ Intel Based

SMB

Platforms

SM

B Platform

sEm

bedded Platforms

Em

bedded Platforms

Matrix

Matrix

Cloud Platform

sC

loud Platforms

Cloud Platform

sC

loud Platforms

Documents

Tyan Brochure