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UIC UIC Engineering Engineering Measurement of Interface Traps in HgCdTe and InAs/GaSb Superlattice Metal-Insulator-Semiconductor Structure Michael McGovern UIC REU 2006 August 3 rd , 2006

UICEngineering Measurement of Interface Traps in HgCdTe and InAs/GaSb Superlattice Metal-Insulator- Semiconductor Structure Michael McGovern UIC REU 2006

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Page 1: UICEngineering Measurement of Interface Traps in HgCdTe and InAs/GaSb Superlattice Metal-Insulator- Semiconductor Structure Michael McGovern UIC REU 2006

UICUICEngineeringEngineering

Measurement of Interface Traps in HgCdTe and InAs/GaSb Superlattice Metal-Insulator-

Semiconductor StructureMichael McGovern

UIC REU 2006August 3rd, 2006

Page 2: UICEngineering Measurement of Interface Traps in HgCdTe and InAs/GaSb Superlattice Metal-Insulator- Semiconductor Structure Michael McGovern UIC REU 2006

UICUICEngineeringEngineering Applications

Astronomy Electronics

Security Medicine

Page 3: UICEngineering Measurement of Interface Traps in HgCdTe and InAs/GaSb Superlattice Metal-Insulator- Semiconductor Structure Michael McGovern UIC REU 2006

UICUICEngineeringEngineering p-i-n Photodiode Current consists of the flow of

“conduction band” electrons and “valence band holes”

The p-i-n photodiode has 3 layers: mostly holes (p), mostly electrons (n) and a region of negligible carrier concentration (i)

Ideally no current can flow under “reverse bias”

Optically generated carriers can cause current flow

As reverse bias is increased, avalanche effect begins and significant current flows

Carriers are multiplied in the avalanche effect leading to increased signal

Page 4: UICEngineering Measurement of Interface Traps in HgCdTe and InAs/GaSb Superlattice Metal-Insulator- Semiconductor Structure Michael McGovern UIC REU 2006

UICUICEngineeringEngineering

Passivation

The surface of the semiconductor has dangling bonds and allows Hg to evaporate

Dangling bonds and Hg evaporation reduce device sensitivity

The surface can be passivated to reduce these problems

Passivation itself leads to other problems

Surface states will appear at the interface that will allow carrier recombination

•HgCdTe Infrared Detector Material: History, Status and Outlook, Rogalski, A

Page 5: UICEngineering Measurement of Interface Traps in HgCdTe and InAs/GaSb Superlattice Metal-Insulator- Semiconductor Structure Michael McGovern UIC REU 2006

UICUICEngineeringEngineering

InAs/GaSb Superlattice

~50Å

~100Å

The InAs/GaSb superlattice consists of alternating layers of InAs and GaSb

The band gap of InAs is about .8eV, while that of GaSb is about .4eV

The result is a periodic potential

Page 6: UICEngineering Measurement of Interface Traps in HgCdTe and InAs/GaSb Superlattice Metal-Insulator- Semiconductor Structure Michael McGovern UIC REU 2006

UICUICEngineeringEngineering

InAs/GaSb Superlattice

The potential resembles a “particle in a well”

The Schrödinger equation can be used to find the electron wave function

The solution can be found exactly. While not difficult, this is tedious and the resulting expression is very long

The result is that there is a single lowest allowed energy level for electrons in the conduction band that can be altered by varying the superlattice geometry

Page 7: UICEngineering Measurement of Interface Traps in HgCdTe and InAs/GaSb Superlattice Metal-Insulator- Semiconductor Structure Michael McGovern UIC REU 2006

UICUICEngineeringEngineering HgCdTe

• Hg1-xCdxTe has a narrow band gap that varies with x

• Band gap corresponds to energies in the IR spectrum

• “Direct band gap”: High absorption coefficient

Page 8: UICEngineering Measurement of Interface Traps in HgCdTe and InAs/GaSb Superlattice Metal-Insulator- Semiconductor Structure Michael McGovern UIC REU 2006

UICUICEngineeringEngineering

C-V Measurements

Interface trapped charges can exchange charges with the semiconductor layer

This increases the capacitance under negative voltage

Physics of Semiconductor Devices, Second Edition, Sze, S., Chap. 7, John Wiley and Sons, New York, 1981

Page 9: UICEngineering Measurement of Interface Traps in HgCdTe and InAs/GaSb Superlattice Metal-Insulator- Semiconductor Structure Michael McGovern UIC REU 2006

UICUICEngineeringEngineering

Terman Method

The Terman method can extract trap density information from C-V data:

When a voltage is applied across a Metal-Iinsulator-Semiconductor (MIS) structure, part of the voltage drop appears across the insulator and part occurs between the bulk and surface of the semiconductor. The second contribution is the “surface potential”

From the charge that accumulates at the surface, the surface potential can be determined

Page 10: UICEngineering Measurement of Interface Traps in HgCdTe and InAs/GaSb Superlattice Metal-Insulator- Semiconductor Structure Michael McGovern UIC REU 2006

UICUICEngineeringEngineering

Terman Method

Some of the charge will come from the normal doping of the semiconductor, while some will come from interface traps

A surface potential function for the ideal case of no traps can be constructed

The rate at which the difference between the actual applied voltage for a given capacitance and the ideal voltage at the same capacitance changes with respect to surface potential is proportional to the interface traps exchanging charge at that potential

Page 11: UICEngineering Measurement of Interface Traps in HgCdTe and InAs/GaSb Superlattice Metal-Insulator- Semiconductor Structure Michael McGovern UIC REU 2006

UICUICEngineeringEngineering

Results

Graph shows CV data for MIS device with 4000Å ZnS passivant layer

8.00

9.00

10.00

11.00

12.00

13.00

14.00

15.00

16.00

-30.00 -20.00 -10.00 0.00 10.00 20.00 30.00

Voltage (V)

Ca

pa

cit

an

ce

(p

F)

Foward

Reverse

Page 12: UICEngineering Measurement of Interface Traps in HgCdTe and InAs/GaSb Superlattice Metal-Insulator- Semiconductor Structure Michael McGovern UIC REU 2006

UICUICEngineeringEngineering

Results

An ideal curve was constructed in order to use the Terman method

8.00

9.00

10.00

11.00

12.00

13.00

14.00

15.00

16.00

-30.00 -20.00 -10.00 0.00 10.00 20.00 30.00

Voltage (V)

Ca

pa

cit

an

ce

(p

F)

Foward

Reverse

Ideal

Page 13: UICEngineering Measurement of Interface Traps in HgCdTe and InAs/GaSb Superlattice Metal-Insulator- Semiconductor Structure Michael McGovern UIC REU 2006

UICUICEngineeringEngineering

Results

The maximum trap density is about 2*10^15 traps/eVcm^2

The best results previously obtained on MCT gave 5*10^12 traps/eVcm^2. We have a long way to go

The density is still negative at some points, which does not make sense

Dit(traps/eVcm^2)

-4E+15

-3E+15

-2E+15

-1E+15

0

1E+15

2E+15

3E+15

-1.00E-01 0.00E+00 1.00E-01 2.00E-01 3.00E-01

Page 14: UICEngineering Measurement of Interface Traps in HgCdTe and InAs/GaSb Superlattice Metal-Insulator- Semiconductor Structure Michael McGovern UIC REU 2006

UICUICEngineeringEngineering

Results

Same set of data, reverse pass

Dit

-5E+14

0

5E+14

1E+15

1.5E+15

2E+15

-1.00E-01 0.00E+00 1.00E-01 2.00E-01 3.00E-01

Dit

Page 15: UICEngineering Measurement of Interface Traps in HgCdTe and InAs/GaSb Superlattice Metal-Insulator- Semiconductor Structure Michael McGovern UIC REU 2006

UICUICEngineeringEngineering

InAs/GaSb C-V Curve

5.40E+01

5.50E+01

5.60E+01

5.70E+01

5.80E+01

5.90E+01

6.00E+01

6.10E+01

6.20E+01

-2.00E+01

-1.50E+01

-1.00E+01

-5.00E+00

0.00E+00

5.00E+00

1.00E+01

Voltage (V)

Cap

acit

ance

(p

F)

The capacitance grows again after reaching a minimum rather than saturating at a low value. This may indicate that the frequency is not high enough

There is a bump on the C-V curve. The cause of this is unknown

The Terman method can not be used on this data because it assumes high frequency

Page 16: UICEngineering Measurement of Interface Traps in HgCdTe and InAs/GaSb Superlattice Metal-Insulator- Semiconductor Structure Michael McGovern UIC REU 2006

UICUICEngineeringEngineering

Acknowledgements

NSF CTS-0630470 & 0434201 GOALI: Atomic-scale Investigation of High Dielectric Constant Thin Films Using In Situ and Other Techniques, (Director C.G. Takoudis)

NSF EEC-0453432 Grant, Novel Materials and Processing in Chemical and Biomedical Engineering (Director C.G. Takoudis), funded by the DoD-ASSURE and NSF-REU Programs

Shubhrangshu Mallick

Dr. An

Professor Ghosh

Professor Takoudis