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October 2017 DocID029635 Rev 3 1/34
www.st.com
UM2101 User manual
Getting started with the STEVAL-STLKT01V1 SensorTile integrated development platform
Introduction The STEVAL-STLKT01V1 development kit for the STEVAL-STLCS01V1 SensorTile board is a highly integrated development platform with a broad range of functions aimed at improving system design cycles and accelerating the delivery of results.
The tiny SensorTile core system board (13.5 x 13.5 mm) embeds high-accuracy and very-low-power inertial sensors, a barometric pressure sensor and a digital MEMS top-port microphone. The onboard 80-MHz MCU features a dedicated hardware microphone interface and ultra-low-power support. The wireless network processor provides Bluetooth Smart connectivity and the integrated balun maximizes RF performance for minimum size and design effort.
The kit includes a cradle expansion board for software and system architecture design support and a compact cradle host featuring a battery charger and SD card interface for on-field testing and data acquisition; both boards come complete with SWD programming interfaces.
It contains FCC ID: S9NSTILE01 and module IC 8976C-STILE01 certified with PMN: STEVAL-STLKT01V1; HVIN: STEVAL-STLCS01V1; HMN: STEVAL-STLCX01V1; FVIN: bluenrg_7_1_e_Mode_2-32MHz-XO32K_4M.img.
Figure 1: SensorTile functional block diagram
The FP-SNS-ALLMEMS1 firmware provides a complete framework to build wearable applications. The BlueMS™ application based on the BlueST-SDK protocol allows data streaming and a serial console over BLE controls the configuration parameters for the connected boards.
It is recommended to upgrade the SensorTile firmware to the latest available version on www.st.com.
Contents UM2101
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Contents
1 Getting started ................................................................................. 5
1.1 Overview ........................................................................................... 5
1.2 Package components ........................................................................ 5
1.3 Initial setup with pre-loaded demo ..................................................... 6
1.4 System requirements ........................................................................ 8
2 STEVAL-STLCS01V1 hardware description .................................. 9
2.1 Power supply ................................................................................... 10
3 STLCX01V1 hardware description ............................................... 12
3.1 Power supply ................................................................................... 13
3.2 USB device ..................................................................................... 13
3.3 Audio DAC ...................................................................................... 13
3.4 Solder bridge details ....................................................................... 13
4 STLCR01V1 hardware description ............................................... 15
4.1 Power supply ................................................................................... 16
4.2 SensorTile and cradle assembly in form factor case ....................... 17
5 SensorTile programming interface .............................................. 19
6 Sensors and Bluetooth low energy connectivity ........................ 20
6.1 LSM6DSM ....................................................................................... 20
6.2 LSM303AGR ................................................................................... 20
6.3 LPS22HB ........................................................................................ 20
6.4 MP34DT04 ...................................................................................... 21
6.5 BLUENRG-MS ................................................................................ 21
6.6 BALF-NRG-01D3 ............................................................................ 21
7 Board schematic and bill of materials ......................................... 22
7.1 Bill of materials ................................................................................ 22
7.2 Schematic diagrams ........................................................................ 26
8 Formal notices required by the U.S. Federal Communications Commission ("FCC") ............................................................................. 30
9 Formal product notice required by the Industry Canada ("IC") . 31
10 TYPE certification .......................................................................... 32
11 Revision history ............................................................................ 33
UM2101 List of tables
DocID029635 Rev 3 3/34
List of tables
Table 1: STEVAL-STLCS01V1 main components ..................................................................................... 9 Table 2: STEVAL-STLCS01V1 pinout ...................................................................................................... 10 Table 3: STLCX01V1 main components .................................................................................................. 12 Table 4: STLCX01V1 solder bridge details .............................................................................................. 13 Table 5: STLCR01V1 main components .................................................................................................. 15 Table 6: STEVAL-STLCS01V1 bill of materials ........................................................................................ 22 Table 7: STLCX01V1 bill of materials ....................................................................................................... 24 Table 8: STLCR01V1 bill of materials ....................................................................................................... 25 Table 9: Document revision history .......................................................................................................... 33
List of figures UM2101
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List of figures
Figure 1: SensorTile functional block diagram ........................................................................................... 1 Figure 2: SensorTile kit blister .................................................................................................................... 6 Figure 3: Orientation of SensorTile and cradle expansion connectors ....................................................... 7 Figure 4: SensorTile mounted on cradle expansion ................................................................................... 7 Figure 5: STEVAL-STLCS01V1 main components and pinout .................................................................. 9 Figure 6: STEVAL-STLCS01V1 power supply block diagram .................................................................. 11 Figure 7: STEVAL-STLCS01V1 component placement (top side) ........................................................... 11 Figure 8: STLCX01V1 main components ................................................................................................. 12 Figure 9: STLCX01V1 component placement (top side) .......................................................................... 14 Figure 10: STLCR01V1 cradle main components .................................................................................... 15 Figure 11: SensorTile soldered onto cradle board ................................................................................... 16 Figure 12: Battery connection and power switch ...................................................................................... 16 Figure 13: SensorTile and cradle in plastic case ...................................................................................... 17 Figure 14: STEVAL-STLCR01V1 component placement (top side) ......................................................... 18 Figure 15: STEVAL-STLCR01V1 component placement (bottom side) ................................................... 18 Figure 16: STM32 Nucleo board, cradle and cradle expansion SWD connectors ................................... 19 Figure 17: SWD connections with 5-pin flat cable .................................................................................... 19 Figure 18: STEVAL-STLCS01V1 schematic diagram (1 of 2) .................................................................. 26 Figure 19: STEVAL-STLCS01V1 schematic diagram (2 of 2) .................................................................. 27 Figure 20: STLCX01V1 schematic diagram ............................................................................................. 28 Figure 21: STLCR01V1 schematic diagram ............................................................................................. 29
UM2101 Getting started
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1 Getting started
1.1 Overview
STEVAL-STLKT01V1 is the development kit includes everything you need to remotely sense and measure motion, environmental and acoustic parameters. It is designed to support the prototyping phases of new projects and can be used in the contexts below.
An evaluation system
Evaluate high accuracy and very low power ST sensors in an optimized system architecture
Field-test data fusion and embedded signal processing algorithms
Deploy data collection campaigns to support custom algorithm development
Reference design
Compact solution for high-accuracy, low-power motion, environmental and audio sensor data in compact form-factor designs
Complete hardware and software examples form the starting point for new designs with:
hardware: schematics, Gerber, BoM, 3D CAD
software: from basic examples (STSW-STLKT01) to complete function packs (FP-SNS-ALLMEMS1, FP-AUD-BVLINK1)
Embedded software development kit
Source code project examples based on the STM32Cube architecture
Fully compatible with the Open.Software embedded processing libraries, and supported by the STM32 ODE
host board implements the Arduino UNO R3 expansion connector to enable bridging to well-known development ecosystems such as STM32 ODE and Arduino
Fast prototyping tool
Plug or solder onto your prototype motherboard to instantly add its embedded sensing and communication functions to your design
Use the 3D CAD files to integrate the SensorTile in your mechanical design
1.2 Package components
Inside the STEVAL-STLKT01V1 package, you will find all the components needed to experience the demo on this optimized platform and to start developing you application.
Getting started UM2101
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Figure 2: SensorTile kit blister
1.3 Initial setup with pre-loaded demo
The easiest thing to do after unpacking is to run the preloaded software using the SensorTile board together with the cradle expansion (STLCX01V1).
1 Take the SensorTile and plug it on the cradle expansion through the dedicated connector. Take care to match the orientation shown below.
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Figure 3: Orientation of SensorTile and cradle expansion connectors
Figure 4: SensorTile mounted on cradle expansion
2 Connect a USB type A to mini-B USB cable to turn ON the board for the first time, verify that the J2 jumper is in position 2-3 (power supply from USB). If everything works fine then you’ll see the SensorTile LED blinking approximately every 2 seconds.
3 The board is now ready to connect to the “ST BlueMS” mobile App: available on official stores for Android or iOS. For more details on the embedded software and the apps, please refer to the BLUEMICROSYSTEM2 documentation on www.st.com/bluemicrosystem.
Getting started UM2101
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To exploit the newest features, upgrade the default firmware version to the new version of the FP-SNS-ALLMEMS1 function pack available at www.st.com/en/embedded-software/fp-sns-allmems1.html
1.4 System requirements
As the STEVAL-STLKT01V1 is already programmed with BLUEMICROSYSTEM firmware, to run the demo, you only need:
A smartphone or tablet with minimum Android™ 4.4 or iOS™ 8.0 operating systems and minimum BLE technology 4.0
A USB type A to mini-B USB cable for power supply (connected to a PC, AC adapter or any other source)
To start designing your own project, you will need:
A Windows™ PC (ver. 7 or higher) with an IAR, KEIL or AC6 firmware development environment
A USB type A to Micro USB male cable to connect the STEVAL-STLKT01V1 to the PC for power supply
An STM32 Nucleo board with ST-Link V2.1 in-circuit debugger/programmer (preferred) or other compatible device
The ST-LINK Utility for firmware download (latest embedded software version on www.st.com)
UM2101 STEVAL-STLCS01V1 hardware description
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2 STEVAL-STLCS01V1 hardware description
STEVAL-STLCS01V1 (SensorTile) is a highly integrated reference design that can be plugged into form-factor prototypes, adding sensing and connectivity capabilities to new designs through a smart hub solution. It can also easily support development of monitoring and tracking applications as standalone sensor nodes connected to iOS™/Android™ smartphone applications.
The SensorTile occupies a very small 13.5x13.5 mm square outline, with all the electronic components on the top side and small connector on the bottom side to plug it onto the cradle expansion board. The connector pinout is repeated on 18 PCB pads that render the SensorTile a solderable system on module as well.
The figure below and following two tables provide the main board component and pinout details.
Figure 5: STEVAL-STLCS01V1 main components and pinout
Table 1: STEVAL-STLCS01V1 main components
Reference Device Description
A MP34DT04 MEMS audio sensor digital microphone
B LD39115J18R 150 mA low quiescent current low noise LDO 1.8 V
C STM32L476 MCU
ARM Cortex-M4 32-bit microcontroller
D LSM6DSM iNEMO inertial module: low-power 3D accelerometer and 3D gyroscope
E LSM303AGR Ultra-compact high-performance eCompass module: ultra-low power 3D accelerometer and 3D magnetometer
F LPS22HB MEMS nano pressure sensor: 260-1260 hPa absolute digital output barometer
STEVAL-STLCS01V1 hardware description UM2101
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Reference Device Description
G BlueNRG-MS Bluetooth low energy network processor
H BALF-NRG-01D3
50 Ω balun with integrated harmonic filter
Table 2: STEVAL-STLCS01V1 pinout
Board pin
CONN pin
Pin name MCU pin Main functions(1)
1 2 MIC_CLK PC2 DFSDM1_CKOUT, ADC
2 4 VDD_OUT VDD/VBAT 1.8V from onboard LDO
3 6 VIN / Power supply for LDO [2V-5.5V]
4 8 VDDUSB VDDIO2
VDDUSB
Power supply for USB peripheral and VDDIO2 [1.8V-3.3V]
5 10 GND VSS Ground
6 12 RXD/USB_DP PD2/PA12 USART5 RX or USB_OTG_FS DP(2)
7 14 TXD/USB_DM PC12/PA11 USART5 TX or USB_OTG_FS DM 1
8 16 SAI_CLK PG9(3) SAI2_SCK_A, SPI3_SCK
9 15 SAI_FS PG10(3) SAI2_FS_A, SPI3_MISO
10 13 SAI_MCLK PG11(3) SAI2_MCLK_A, SPI3_MOSI
11 11 SAI_SD PG12(3) SAI2_SD_A, SPI3_NSS
12 9 GPIO2 PB8/PB9/PC1 DFSDM_DATIN6, I2C3_SDA
13 7 GPIO3 PC0 DFSDM_DATIN4, I2C3_SCL
14 5 NRST NRST STM32 Reset
15 3 SWD_CLK
SWD Programming interface clock
16 1 SWD_IO
SWD Programming interface IO
17 / GND
Ground
18 / GND
Ground
Notes:
(1)Refer to STM32L476 Datasheet on www.st.com for the complete set of functions of each pin (2)USB_OTG_FS Peripheral is functional for VDDUSB ≥ 3V (3)Logic level of this pins is referred to VDDIO2
2.1 Power supply
The SensorTile board has the following input supply pins:
1. VIN is the input for the onboard voltage regulator generating 1.8 V (150 mA max). 2. VDDUSB is an input for the STM32L4 VDDUSB and VDDIO2 pins (to use the
STM32L4 USB OTG peripheral, VDDUSB must be ≥ 3 V)
VDD is an output for 1.8 V.
If the USB peripheral and other 3.3 V signals are not needed for a particular application, you can connect VDD to VDDUSB so that one power supply can power the whole system.
UM2101 STEVAL-STLCS01V1 hardware description
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This connection can be done externally (e.g., SB8 on STLCX01V1) or by soldering a 0 Ω resistor on R2 (bottom layer).
Figure 6: STEVAL-STLCS01V1 power supply block diagram
Figure 7: STEVAL-STLCS01V1 component placement (top side)
STLCX01V1 hardware description UM2101
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3 STLCX01V1 hardware description
The SensorTile cradle expansion is an easy-to-use companion board for SensorTile and the SensorTile cradle boards included in the SensorTile Kit. The SensorTile board does not need to be soldered onto the cradle expansion board, but can be plugged onto the dedicated connector (see Figure 3: "Orientation of SensorTile and cradle expansion connectors" and Figure 4: "SensorTile mounted on cradle expansion".
Apart from being a standalone host for the SensorTile board, the cradle expansion board can be connected to an STM32 Nucleo or other expansion board via the Arduino UNO R3 connectors to easily expand functionality.
Figure 8: STLCX01V1 main components
Table 3: STLCX01V1 main components
Reference Device Description
A SensorTile connector and footprint To plug or solder the SensorTile board
B Arduino UNO R3 UNO R3 connector For STM32 Nucleo board compatibility
C ST2378ETTR 8-bit dual supply 1.71 V to 5.5 V level translator
D micro-USB connector, USBLC6-2P6 (U1), LDK120M-R (U4)
micro USB power supply /communication port and 3.3 V voltage regulation
E Audio DAC, phono jack 16-Bit, low-power stereo audio DAC and 3.5 mm stereo phono jack
F SWD connector, Reset button 5-pin SWD connector for programming debugging and board reset button
UM2101 STLCX01V1 hardware description
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3.1 Power supply
The power is either supplied by the host PC via USB or by an external source through the Arduino UNO R3 connector (CN6.5).
Jumper J2 selects the power source for the onboard 3.3 V regulator (U4) and the SensorTile VIN pin:
position 1-2: 5 V external
position 2-3: 5 V via USB (default)
The 3.3 V output of the regulator can be routed to the Arduino UNO R3 connector to power on other external components by soldering SB18 (default OFF).
The VDDUSB pin of the SensorTile can be connected to two different power sources:
3.3 V – SB9 (default ON)
1.8 V (SensorTile VDD) – SB8 (default OFF)
3.2 USB device
The USB connector on the board can be used to supply power and for communication (USB_OTG_FS).
To use the USB peripheral, use the following solder bridge configuration:
SB10, SB11, SB20 and SB21 OFF (disconnect the signals from U5)
SB9 ON (supply 3.3 V to the USB peripheral of the STM32 MCU)
3.3 Audio DAC
The PCM1774 is a low-power stereo DAC designed for portable digital audio applications, and can be driven by the SensorTile to play any kind of Audio stream. A dedicated 3.5 mm audio jack makes it easy to connect headphones or active loudspeakers.
In order to use the onboard audio DAC (U3), the SAI (serial audio interface) and I²C signals must be routed to the component using the following configuration:
SB12, SB13, SB14, SB15, SB16 and SB17 OFF (disconnect the signals from Arduino UNO R3 connector)
SB2, SB3, SB4, SB5, SB6, SB7 ON (connect the signals to the DAC)
3.4 Solder bridge details
Table 4: STLCX01V1 solder bridge details
Solder Bridge SensorTile signal Onboard signal Arduino signal
SB1 Reset
CN8.2
SB2(1) GPIO3 DAC control – I2C SCL (pull-up)
SB3(1) GPIO2 DAC control – I2C SDA (pull-up)
SB4(1) SAI_SD DAC Audio – I2S_SD
SB5(1) SAI_SCK DAC Audio – I2S_SCK
SB6(1) SAI_FS DAC Audio – I2S_WS
SB7(1) SAI_MCLK DAC Audio – I2S_MCLK
SB8 VDDUSB VDD – 1.8V from SensorTile
SB9(1) VDDUSB 3V3 from regulator
STLCX01V1 hardware description UM2101
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Solder Bridge SensorTile signal Onboard signal Arduino signal
SB10 RXD-USB_DP Level Translator - UART_RX CN9.2
SB11 RXD-USB_DP Level Translator - UART_TX CN9.1
SB12 SAI_SD SPI_CS CN5.3
SB13 SAI_MCLK SPI_MOSI CN5.4
SB14 SAI_FS SPI_MISO CN5.5
SB15 SAI_SCK SPI_SCK CN5.6
SB16(1) GPIO3
CN5.10
SB17(1) GPIO2
CN5.9
SB18 MIC_CLK Level Translator - MIC_CLK_3V3 CN9.5
SB19
3V3 – 3V3_Nucleo CN6.2 CN6.3
SB20 TXD-USB_DM Level Translator - UART_RX CN9.2
SB21 TXD-USB_DM Level Translator - UART_TX CN9.1
SB22 GPIO2 Level Translator - GPIO2_3V3 CN9.6
SB23 GPIO3 Level Translator – GPIO3_3V3 CN9.7
Notes:
(1)closed by default
Figure 9: STLCX01V1 component placement (top side)
UM2101 STLCR01V1 hardware description
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4 STLCR01V1 hardware description
The SensorTile cradle is a small companion board for SensorTile, geared at the development of form factor prototypes. You need to solder the SensorTile board to this board to render the system robust.
The small cradle is ideal for applications requiring small, standalone, battery-powered sensor nodes.
Figure 10: STLCR01V1 cradle main components
Table 5: STLCR01V1 main components
Reference Device Description
A SensorTile footprint To solder the SensorTile board
B HTS221 Capacitive digital sensor for relative humidity and temperature
C STBC08PMR, STC3115, LDK120M-R, USBLC6-2P6
800 mA standalone linear Li-Ion battery charger with thermal regulation, Gas gauge IC, 200 mA low quiescent current very low noise LDO, very low capacitance ESD protection
D Power on/off switch
E SWD connector 5-pin SWD connector for programming and debugging
F Micro USB connector, 3-pin battery connector
micro USB battery charging supply /communication port and connector for Li-Ion battery power supply
G micro-SD card socket
Solder the SensorTile board onto the cradle board as shown in the figure below.
STLCR01V1 hardware description UM2101
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Figure 11: SensorTile soldered onto cradle board
4.1 Power supply
The main board power supply is the 100 mAh lithium-Ion polymer battery attached to the appropriate connector on the PCB.
Figure 12: Battery connection and power switch
The battery can be recharged via USB connected to a PC or any micro-USB battery charger.
A RED LED indicates the charging status:
steady ON: the USB plug is correctly connected and the board is charging
steady OFF: charging complete
blinking: battery not present
UM2101 STLCR01V1 hardware description
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The onboard STBC08 battery charger IC is configured by default with a maximum charging current of 50 mA. It is possible to modify this current by changing the R5 resistor value.
Equation 1:
𝐼𝑐ℎ𝑟𝑔 =1𝑉
𝑅5∙ 1000
The default 20 kΩ value for R5 hence gives:
1𝑉
20𝐾∙ 1000 = 50𝑚𝐴
During normal usage, the battery needs to be connected to the board for proper operation. When the battery is plugged, the board is turned ON via the SW1 switch. This switch enables LDK120 3V3 voltage regulator pin, which powers all board components.
4.2 SensorTile and cradle assembly in form factor case
Refer to the following image for the orientation of the soldered SensorTile and cradle boards in the dedicated form factor case.
Figure 13: SensorTile and cradle in plastic case
STLCR01V1 hardware description UM2101
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Figure 14: STEVAL-STLCR01V1 component placement (top side)
Figure 15: STEVAL-STLCR01V1 component placement (bottom side)
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5 SensorTile programming interface
To program the board, connect an external ST-LINK to the SWD connector on the cradle; a 5-pin flat cable is provided in the SensorTile Kit package.
The easiest way to obtain an ST-LINK device is to get an STM32 Nucleo board, which bundles an ST-LINK V2.1 debugger and programmer.
Ensure that CN2 jumpers are OFF and connect your STM32 Nucleo board to the SensorTile cradle via the cable provided, paying attention to the polarity of the connectors. Pin 1 is identified by:
a small circle on the PCB silkscreen – STM32 Nucleo board and SensorTile cradle expansion
the square shape of the soldering pad – connector on the SensorTile cradle.
Figure 16: STM32 Nucleo board, cradle and cradle expansion SWD connectors
Figure 17: SWD connections with 5-pin flat cable
Sensors and Bluetooth low energy connectivity UM2101
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6 Sensors and Bluetooth low energy connectivity
6.1 LSM6DSM
The LSM6DSM is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 0.65 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer. The LSM6DSM supports main OS requirements, offering real, virtual and batch sensors with 4 Kbytes for dynamic data batching.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DSM has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±245/±500/±1000/±2000 dps. The LSM6DSM fully supports EIS and OIS applications as the module includes a dedicated configurable signal processing path for OIS and auxiliary SPI configurable for both gyroscope and accelerometer.
High robustness to mechanical shock makes the LSM6DSM the preferred choice of system designers for the creation and manufacturing of reliable products.
6.2 LSM303AGR
The LSM303AGR is an ultra-low-power high-performance system-in-package featuring a 3D digital linear acceleration sensor and a 3D digital magnetic sensor. The Device has linear acceleration full scales of ±2g/±4g/±8g/±16g and a magnetic field dynamic range of ±50 gauss.
The LSM303AGR includes an I2C serial bus interface that supports standard, fast mode, fast mode plus, and high-speed (100 kHz, 400 kHz, 1 MHz, and 3.4 MHz) and an SPI serial standard interface. The system can be configured to generate an interrupt signal for free-fall, motion detection and magnetic field detection.
The magnetic and accelerometer blocks can be enabled or put into power-down mode separately.
6.3 LPS22HB
The LPS22HB is an ultra-compact piezoresistive absolute pressure sensor which functions as a digital output barometer. The device comprises a sensing element and an IC interface which communicates through I²C or SPI from the sensing element to the application.
The sensing element, which detects absolute pressure, consists of a suspended membrane manufactured using a dedicated process developed by ST.
The LPS22HB is available in a full-mold, holed LGA package (HLGA). It is guaranteed to operate over a temperature range extending from -40 °C to +85 °C. The package is holed to allow external pressure to reach the sensing element.
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LPS22HB is factory calibrated but a residual offset could be introduced by the soldering process. This offset can be removed with a one-point calibration.a
6.4 MP34DT04
The MP34DT04 is an ultra-compact, low-power, TOP port, digital MEMS microphone built with a capacitive sensing element and an IC interface. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to produce audio sensors. The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital output signal in PDM format.
The MP34DT04 has an Acoustic Overload Point of 120 dBSPL with a 64 dB Signal-to-Noise Ratio and –26 dBFS sensitivity.
6.5 BLUENRG-MS
The BlueNRG-MS is a very low power Bluetooth low energy (BLE) single-mode network processor, compliant with Bluetooth specification v4.1. The BlueNRG-MS supports multiple roles simultaneously and can act at the same time as Bluetooth smart sensor and hub device.
The Bluetooth Low Energy stack runs on the embedded ARM Cortex-M0 core. The stack is stored on the on-chip non-volatile Flash memory and can be easily upgraded via SPI.
The device comes pre-programmed with a production-ready stack imageb. A different or more up-to-date stack image can be downloaded from the ST website and programmed on the device through the ST provided software tools.
The BlueNRG-MS allows applications to meet the tight advisable peak current requirements imposed by standard coin cell batteries.
The maximum peak current is only 10 mA at 1 dBm output power. Ultra low-power sleep modes and very short transition times between operating modes allow very low average current consumption, resulting in longer battery life.
The BlueNRG-MS offers the option of interfacing with external microcontrollers via SPI transport layer.
6.6 BALF-NRG-01D3
BALF-NRG-01D3 is a 50 Ω conjugate match to BLUENRG-MS (QFN32 package) that integrates balun transformer and harmonics filtering. It features high RF performances with a very small footprint and a RF BOM reduction. It has been chosen as the best trade-off for costs, area occupation and high radio performances. The layout has been optimized to suit a 4-layer design and a chip antenna.
a For further details, refer to application note AN4833, "Measuring pressure data from ST's LPS22HB digital
pressure sensor", on www.st.com.
b Its version could change at any time without notice
Board schematic and bill of materials UM2101
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7 Board schematic and bill of materials
This section contains the bill of materials and schematics.
7.1 Bill of materials
Table 6: STEVAL-STLCS01V1 bill of materials
Item Q.ty Ref. Value Description Order code Manufacturer
1 1 U1
ARM Cortex-M4 32b MCU Microcontroller
STM32L476JGY6TR ST
2 1 U2 150 mA,
1.8 V
low quiescent current low noise LDO
LD39115J18R ST
3 1 U9
Ultra-low Power Acc + Magn
LSM303AGRTR ST
4 1 U10
Low-Power Accelerometer + Gyroscope
LSM6DSMTR ST
5 1 U6
Bluetooth Low-Energy Chip V4.1 - MS
BlueNRG-MSCSP ST
6 1 U13
Low-Power Pressure sensor
LPS22HBTR ST
7 1 U11
MEMS audio sensor digital microphone
MP34DT04 ST
8 1 U4
Bluetooth Low-Energy Balun Chip
BALF-NRG-01D3 ST
9 1 X2
CRYSTAL 32MHZ 8PF SMD
CX2016DB32000D0FLJCC AVX
10 1 X1 32.7680kHz, 20ppm, 4pF, 60kΩ
Crystal ABS06-107-32.768KHZ-T Abracon
11 2 C2, C20
4pF 25V CAP CER NP0 0201
CBR02C409B3GAC Kemet
12 2 C12, C17
15pF 25V CAP 0201 NP0
02013A150JAT2A AVX
13 1 FT1 10pF 25V CAP CER NP0 0201
250R05L100GV4T Johanson Technology
14 1 R2 0 Ω Resistor SMD R0402
Any
15 1 FT2
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Item Q.ty Ref. Value Description Order code Manufacturer
16 1 MT 0.40pF 25V CAP CER NP0 0201
250R05L0R4AV4T Johanson Technology
17 2 C32, C34
2.2µF 6.3V CAP CERAMIC X5R, 0201
02016D225MAT2A AVX
18 1 C9 0.22µF 6.3V CAP CER X7S 0201
C0603X7S0J224K030BC TDK
19 1 C30 150nF, 10V CAP, MLCC, X5R, 0201
C0603X5R1A154K030BB TDK
20 2 C14, C31
100pF 25V CAP CER NP0 0201
250R05L101JV4T Johanson Technology
21 1 ANT1 2.4GHZ ANTENNA SMD
ANT016008LCS2442MA1 TDK
22 9
C4, C5,
C10, C11, C13, C18, C29, C33, C43
0.1µF 6.3V ±10%
CAP CER X5R 0201
GRM033R60J104KE19D Murata
23 1 R1 560 Ω Resistor SMD
Any
24 9
C1, C3, C6, C7, C8,
C15, C16, C19, C44
1µF 6.3V CAP CER X5R 0201
CL03A105KQ3CSNC Samsung
25 1 LED 605 nm, 2 V, 10 mA, 50 mcd
LED, Low Power, Orange
KPG-0603SEC-TT KINGBRIGHT
26 1 CONN 0.4mm Connector Board-to-Board
BM10NB(0.8)-16DS-0.4V(51)
Hirose
27 1 L1 3.9nH 400mA 300 MΩ
FIXED IND LQP03TN3N9B02D Murata
28 1 SWD Cable
2.54mm, L=15cm
5 pin ribbon cable
Board schematic and bill of materials UM2101
24/34 DocID029635 Rev 3
Table 7: STLCX01V1 bill of materials
Item Q.ty
Ref. Value Description Order code Manufacturer
1 1 CN2
BM10JC-16DP-0.4V(53)
BM10JC-16DP-0.4V(53)
Hirose
2 1 CN5
HEADER 10 SSQ-110-03-L-S Samtec
3 2 CN6,CN9
HEADER 8 SSQ-108-03-L-S Samtec
4 1 CN8
HEADER 6 SSQ-106-03-L-S Samtec
5 5 C1,C5,C10,
C13,C14 100nF X7R
6 2 C4,C6 47µF, 6.3V Tantal
7 4 C8,C9,C11,
C12
4.7µF, >6.3V, <2 Ω ESR
Tantal
8 2 C15,C16 4.7µF, 10V X5R
9 1 J1
PHONOJACK STEREO
35RASMT4BHNTRX
Switchcraft
10 1 J2
Header M 3x1
11 4 J3,J4,J5,J6
PCB Hole
12 1 RESET
SYS_MODE PTS820 J20M SMTR LFS
C&K Components
13 1 R1 47kΩ ±1%
14 1 R2 147kΩ±1%
15 11
SB2,SB3,R3,SB4,R4,SB5,SB6,SB7,SB9,SB16,SB
17
0R
16 2 R5,R6
4K7
17 14
SB1,SB8,SB10,SB11,SB12,SB13,SB14,SB15,SB18,SB19,SB20,SB21,SB
22,SB23
NC
18 1 SWD
CON5
19 1 USB
USB-MICRO USB3075-30-A GCT
20 1 U1
USBLC6-2P6
USBLC6-2P6 ST
21 1 U3
PCM1774RGP
PCM1774RGP TI
22 1 U4
LDK120M-R LDK120M-R ST
23 1 U5
ST2378ETTR
ST2378ETTR ST
UM2101 Board schematic and bill of materials
DocID029635 Rev 3 25/34
Table 8: STLCR01V1 bill of materials
Item Q.ty Ref. Value Description Order code Manufacturer
1 1 BATT
Battery Connector 78171-0003 Molex
2 1 CHRG
LED Red
3 3 C1,C8,C9 100nF X7R
4 4 C2,C3,C6,C7 10V, 4.7µF X5R
6 1 C10 10V, 1µF X5R
7 1 LED1
LED Green
8 1 R1 47kΩ±1%
9 1 R2 147kΩ±1%
10 1 R3 2kΩ
11 2 R4,R8 1kΩ
12 1 R5 20kΩ±1%
13 3 R6,R7,R11
NC
14 1 R10 0 Ω
15 1 R9 50mΩ±1%, >=1/16W
16 1 SD
Micro-SD DM3D-SF Hirose
17 1 SWD
CON5
18 1 SW1
PWR SSAJ120100 Alps Electric Co.
19 1 USB
USB-MICRO USB3075-30-A
GCT
20 1 U1
USBLC6-2P6 USBLC6-2P6 ST
21 1 U2
STBC08PMR STBC08PMR ST
22 1 U3
LDK120M-R LDK120M-R ST
23 1 U4
STC3115IQT STC3115IQT ST
24 1 U5
HTS221 HTS221 ST
25 1 Battery 3.7V 100mAh LiPO-501225 3pin connector
LiPO-501225 Himax electronics
26 1 Plastic Box
Plastic Box
27 2 M2-Nut HEX shape HEX Nut M2 - steel
RS or equivalent
28 1 M2-Screw Pan head - Phillips
10mm M2 Pan head Phillips - steel
RS or equivalent
29 1 M2-Screw Pan head - Phillips
12mm M2 Pan head Phillips - steel
RS or equivalent
Board schematic and bill of materials UM2101
26/34 DocID029635 Rev 3
7.2 Schematic diagrams
Figure 18: STEVAL-STLCS01V1 schematic diagram (1 of 2)
Decoupling Capacitors
LED
1K
PG
-06
03
SE
C-T
T
GND
R1
LE
DS
AI_
SD
1u1u 100n 100n1u
GND GNDGNDGND GND
1u
GND
1u
GND
C1C3 C4 C5C6C8 C15
VD
D
VD
D
VD
D
VD
D
VD
D
VD
D
VD
DU
SB
Crystal
ABS06-107-32.768KHZ-T
4p 4p
GND GND
X1
C2 C20
OS
C3
2_
OU
T
OS
C3
2_
IN
Ultra-low-power DSP STM32L476xx Microcontroller
STM32L476JGY6
VDDUSBA1
PA15A2
PD2A3
PG9A4
PG14A5
PB3A6
PB7A7
VSS1A8
VDDA9
VSS2B1
PA14B2
PC12B3
PG10B4
PG13B5
VDDIO2B6
PB6B7
PC13B8
VBATB9
PA
12
C1
PA
13
C2
PC
11
C3
PG
12
C5
PG
11
C4
PB
4C
6
PB
5C
7
PC
15
C8
PC
14
C9
PA
11
D1
PA
10
D2
PC
10
D3
BO
OT
0D
7
PH
1D
8
PH
0D
9
PC
9E
1
PA
8E
2
PA
9E
3
PB8E7
PB9E8
NRSTE9
PC7F1
PC8F2
PC6F3
PC2F7
PC1F8
PC0F9
PB15G1
PB14G2
PB11G3
PA1G4
PA4G5
PA2G6
PC3G7
VREF+G8
VSSAG9
PB
12
H1
PB
13
H2
PB
10
H3
PA
7H
4P
A6
H5
PA
5H
6P
A3
H7
PA
0H
8V
DD
AH
9V
DD
2J1
VS
S3
J2
PB
2J3
PB
1J4
PB
0J5
PC
5J6
PC
4J7
VD
D3
J8
VS
S4
J9
U1
BLU
E_M
OS
I
BLU
E_S
CK
BLU
E_IR
Q
BLU
E_M
ISO
BLU
E_C
S
BLU
E_R
ST
GN
D
GN
D
GND
GND
GND
GN
D
VD
D
VD
DV
DD
VDD
VDD
VDD
NRST
TXD-USB_DMT
XD
-US
B_D
M
GP
IO6
GPIO5GPIO3GPIO2
GPIO2GPIO2
VDDUSB
VDDUSB
MIC_CLK
RXD-USB_DPR
XD
-US
B_D
PSAI_SCK
SAI_FS
SA
I_M
CLK
SA
I_S
D
INT2
INT2
INT2INT2
INT2INT2
MIC_DATA
OS
C32_O
UT
OS
C32_IN
CS
_A
G
CS
_M
CS
_A
CS
_P
SP
I_C
LK
SPI_SDAT
ES
T1
Low-Drop Out Voltage Regulator
LD39115J18
1u
VD
D
GND GND
100n
GND GND
1u
GND
1u
VD
D
VD
D
VD
D
0
ENA2
GNDA1
INB2
OUTB1
U2
C7
C10 C16C19
R2
VD
D
VIN VD
DU
SB
Hirose bottom connector (optional)
BM10NB(0.8)-16DS-0.4V(51)
P1P1
P2P2
P3P3
P4P4
P5P5
P6P6
P7P7
P8P8
P9P9
P10P10
P11P11
P12P12
P13P13
P14P14
P15P15
P16P16
G2G2
G1G1
G4G4
G3G3
CONN
GND
GND
GND
GND
GND
VDDNRST VIN
TXD-USB_DM
GPIO6GPIO5
GPIO3GPIO2
VDDUSB
MIC_CLK
RXD-USB_DP
SAI_SCKSAI_FSSAI_MCLK
SAI_SD
SWD_GNDSWD_IOSWD_CLK
SWD_VDD
LP_UART_TX, I2C3_SDA, ADC_IN2, DFSDM_CKIN4 (DFSDM_DATIN6)LP_UART_RX, I2C3_SCL, ADC_IN1, DFSDM_DATIN4
ADC_IN3, DFSDM_CKOUT
USART RX or USB DPUSART TX or USB DM
SWD_RST
SPI3_NSS, SAI2_SD_ASPI3_MOSI, SAI2_MCLK_A
SPI3_SCK, SAI2_SCK_ASPI3_MISO, SAI2_FS_A
Moon Pin output
GND
GND
GNDVDD
NRST
VIN
TXD-USB_DM
GPIO6GPIO5
GPIO3GPIO2
VDDUSB
MIC_CLK
RXD-USB_DP
SAI_SCKSAI_FS SAI_MCLK
SAI_SD
+5V supply3.0V - 3.6V supply
UM2101 Board schematic and bill of materials
DocID029635 Rev 3 27/34
Figure 19: STEVAL-STLCS01V1 schematic diagram (2 of 2)
Digital Microphone
MP34DT04GND
CLKB3
DOUTB4
GNDG1*4
LRB2
VDDB1
U11
GNDVDD
MIC_CLK
MIC_DATA
Accelerometer + Gyroscope
100n 100n
C11 C18
GN
D
GN
D
VD
D
VD
D
LSM6DS3H
SDOP1
SDXP2
SCXP3
INT1P4
VD
DIO
P5
GN
D1
P6
GN
D2
P7
VDDP8
INT2P9
OCSP10
NCP11
CS
P1
2S
CL
P1
3S
DA
P1
4
U10
GN
DG
ND
GNDGND
VD
D
VDD
VDD
INT2
CS
_A
GS
PI_
CLK
SP
I_S
DA
Pressure Sensor
LPS22HB
SD
OP
5
VDD_IOP1
SCLP2
CSP6
INT/DRDYP7
GN
D1
P8
GN
D2
P9
VD
DP
10
RE
SP
3
SD
AP
4
U13
GN
D
GN
D
GN
D
VD
D
VDDCS_PSPI_CLK
SP
I_S
DA
Accelerometer + Magnetometer
220n
GND
LSM303AGR
C9
SCLP1
CS_XLP2
CS_MAGP3
SDAP4
DRDYP7
GND2P8
VDDP9
VDD_IOP10
INT
1P
12
INT
2P
11
C1
P5
GN
D1
P6
U9
GND
GN
D
VDDVDD
CS_M
CS_ASPI_CLK
SPI_SDA
BlueNRG - Bluetooth low energy chip
Tuning
Balun + chip antenna
Board schematic and bill of materials UM2101
28/34 DocID029635 Rev 3
Figure 20: STLCX01V1 schematic diagram
15
SH
1
7
OUT
SensorTile
SAI_FS
18
2
5V
12
13
SWDIO
TILE_RESET
1
SensorTile ConnectorUSB, SWD, Power
RXD-USB_DP
SWDCLK
SB8
CN2
BM10B(0.8)-16DP-0.4V(51)
3
1
C15
4.7μF 6
3V3
14
3V3
GN
D
2
6
MIC_CLK
G3
VDDUSB
13
GPIO2
D11
GPIO3
SAI_MCLK
V_USB
G2
4
8
10
V_USB
VIN
RXD-USB_DP
GPIO2
J2
11
3
VIN
3 SB9
16
SAI_MCLK
Max 200mA
SAI_SCK
4
4
C16
4.7μF
2
TXD-USB_DM
5
3EN
SensorTile Footprint
3
7
V_USB
2
VDD
ADJ
11
4
12
SWDCLK
SWDIO
TXD-USB_DMG1
9
D3
TXD-USB_DM
3
VIN
16
5
8
14
GPIO3
D4
TILE_RESET
SH
2
D2
VDD
4
IN
VDDUSB
1
USB-MICRO
1
5
MIC_CLK17
5
VDDUSB
C1
100nF
SAI_SD
2
1
1
1
1
Fixing holesOn the cornersHole: 2.2mmHead: 4mm
STM32 Nucleo
R2
147K
10
RXD-USB_DP
VBUS5
SAI_SCK
VDD
4
1
6
RESET
3
C14
100nF
TILE_RESET2
5
15
R1
47K
9
1
G4
VIN
SAI_FS
6
SAI_SD
GND2
SAI_SCK
3
6
3
I2C_SCL
3V3
2
CN9
SB18
6
UART_TX
SB19 7
GPIO2_3V3
2
CN5
R5
4K7
SPI_CS7
SB15
1
SB14
SB12
4
UART_RX
6
SB16
TILE_RESET
SAI_MCLK
5
3
4
6
5
GPIO3_3V3
SAI_FS
SPI_SCK
8
2
8
CN6
3
1
8
3V3_Nucleo
5
GPIO21
I2C_SDAGPIO3
SB1
2
SPI_MOSI
5
4
R6
4K7
SPI_MISO
3V3
CN8
5V
SB17
10
SAI_SD
1
4
9
MIC_CLK_3V3
7
SB13
SWDCLK3
4
TILE_RESET5
SWD
1
VDD
SWDIO
2
SB10
4
2
C10
100nF
L6
11
UART_RX
6
GPIO3
SB20
SB23L3
RXD-USB_DP
8
19
VC
C
13CC7
20
16
L5
TXD-USB_DM
CC3
14
CC1
U5
ST2378ETTR
UART_TX
L7
MIC_CLK_3V3 3CC2
OE
TXD-USB_DM
L1
17
CC4
MIC_CLK
5
18
VDD
CC515
10
CC67
SB22
GPIO3_3V3
SB11
GPIO2_3V3
1
CC89
VL
VDD
C13
100nF
L8
RXD-USB_DP
L2
GPIO2
12
GN
D
SB21
L4
3V3
U4 LDK120M-R
ADR
1
VC
OM
3
SAI_FS
SC
KI
SAI_MCLK
SB5
R40R
17
19
+
3V3
AG
ND +
SB4 11
P
13
MODE
5
J1
PHONOJACK STEREO
H_L
VD
D7
3V3
14
AIR
VIO
2
1
PAD
C4 47μF
4
LRCK
C114.7μF1
6
SB2PGNDGPIO3
DINSB6
3
4
SB7C5
100nF
VC
C
SAI_SCK
+
12
2
GPIO2
20
6
R30R
18
+
15
BC
K
C9 4.7μF
9
SDA
C124.7μF
SAI_SD
3V3 8D
GN
D
AIL
H_R
+
SB3
10
SCL
C8 4.7μF
VPA
5C6 47μF
+
U3 PCM1774RGP
U1 USBLC6-2P6
UM2101 Board schematic and bill of materials
DocID029635 Rev 3 29/34
Figure 21: STLCR01V1 schematic diagram
3
D2
3V3
5
USBLC6-2P6
6
VBUS
D1RXD-USB_DP
2
RESET
C1
100nF
SWDCLK
D4
5
2
1
3
VDD
3
USB, SWD, Power switch
V_USB
USB-MICRO
4D3
R41K
2
1RXD-USB_DM
5
4
1
SH
2
2
1
SWDIO
SWD
SH
1
LED1
4
SWDCLK
V_USB
GND
SDA
5
2 1
1
DRDY
VDD
C9
100nF
DA
T0
4
SCL
CL
KV
DD
SWB
U5
R7NC
2
I2C_SDA
SD_MISO
DETC
3V3
I2C_SCL
6
SD_SCK
DA
T2
SD_CS
SD
Micro-SD
GND
CD
/DA
T3
CS
8
SW
DA
T1
3
6
57
C8
100nF
GN
D
SWA
4
CM
D
VDD
R6NC
SD_MOSI
3
HTS221
HTS221 sensor
micro-SD card socket
2
SCL
C10
1μF
VBat
3
Vcc
5
SDA
BATT
Battery Connector
SW1
PWR
VIN
R9
50 mΩR8
1K
ADJ
1
4
VCC
VBat
V_USB
9
BAT_NTC
CHRGPWR_ON
6
BATD/CD
VBat
8
5
C7
4.7μF
I2C_SCL
PROG
U4
C2
4.7μFV_USB2
1
4
OUT
10
VPROG = 1V
IBAT=(VPROG/RPROG)x1000
RPROG=1000*VPROG/IBAT
BAT_NTC
PA
D
R11NC
R100R
7
2
1
2
Bat-
VBat
R2147K
Battery Charger
GND
GN
D C3
4.7μF
3
CHRG
C6
4.7μF
1
6
CHRG
BAT
EN3
VBat
NC
R520K
3
U3
I2C_SDAALM
Max 200mA
4
R32K
V_USB
3V3_EN IN1
GN
D
CHRG
5
VBat
R147K
3V3
CG
STBC08PMR
2
7RSTIO
U1
LDK120M-R
U2
STC3115IQT
VDD3V3
SWDCLKSWDIO
RESET
MIC_CLK
RXD-USB_DPRXD-USB_DM
SD_CSSD_MISOSD_SCK
SD_MOSI
I2C_SCLI2C_SDA
SensorTile footprint
123456789 10
14
1615
131211
1718
Formal notices required by the U.S. Federal Communications Commission ("FCC")
UM2101
30/34 DocID029635 Rev 3
8 Formal notices required by the U.S. Federal Communications Commission ("FCC")
Model: STEVAL-STLKT01V1
FCC ID: S9NSTILE01
FCC NOTICE: This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment.
Additional warnings for FCC
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference's by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and the receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
UM2101 Formal product notice required by the Industry Canada ("IC")
DocID029635 Rev 3 31/34
9 Formal product notice required by the Industry Canada ("IC")
Model: STEVAL-STLKT01V1
IC: 8976C-STILE01
Innovation, Science and Economic Development Canada Compliance - This device complies with Innovation, Science and Economic Development RSS standards. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment.
Conformité à Innovation, Sciences et Développement Économique Canada - Cet appareil est conforme aux normes RSS d'Innovation, Science et Développement économique. L'utilisation est soumise aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interférences nuisibles, et (2) cet appareil doit accepter de recevoir tous les types d’interférence, y comprises les interférences susceptibles d'entraîner un fonctionnement indésirable. Les changements ou les modifications non expressément approuvés par le fabricant pourraient annuler le permis d'utiliser l'équipement.
TYPE certification UM2101
32/34 DocID029635 Rev 3
10 TYPE certification
The module has been tested according to the following TYPE certification rules:
Type of specified radio equipment:
radio equipment according to the certification ordinance article 2-1-9
sophisticated low power data communication system in a 2.4 GHz band
Class of emissions, assigned frequency and antenna power:
F1D, 2402 to 2480 MHz, channel separation 2 MHz/40 channels, 0.006 W
Certification number:
006-000482
The design and manufacturing are certified on the basis of the Japan Radio Law 38-24.
UM2101 Revision history
DocID029635 Rev 3 33/34
11 Revision history Table 9: Document revision history
Date Version Changes
17-Aug-2016 1 Initial release.
28-Aug-2017 2
Updated Section "Introduction", Section 1.1: "Overview", Section 1.3: "Initial setup with pre-loaded demo", Section 6.4: "MP34DT04", Section 6.5: "BLUENRG-MS" and Section 9: "Formal product notice required by the Industry Canada ("IC")"
30-Oct-2017 3
Added Figure 7: "STEVAL-STLCS01V1 component placement (top side)", Figure 9: "STLCX01V1 component placement (top side)", Figure 14: "STEVAL-STLCR01V1 component placement (top side)", Figure 15: "STEVAL-STLCR01V1 component placement (bottom side)" and Section 10: "TYPE certification"
Updated Figure 21: "STLCR01V1 schematic diagram"
UM2101
34/34 DocID029635 Rev 3
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