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DescriptionThe STWIN SensorTile wireless industrial node (STEVAL-STWINKT1) is a development kit and reference design that simplifiesprototyping and testing of advanced industrial IoT applications such as condition monitoring and predictive maintenance.
The kit features a core system board with a range of embedded industrial-grade sensors and an ultra-low-power microcontrollerfor vibration analysis of 9-DoF motion sensing data across a wide range of vibration frequencies, including very high frequencyaudio and ultrasound spectra, and high precision local temperature and environmental monitoring.
The development kit is complemented with a rich set of software packages and optimized firmware libraries, as well as a clouddashboard application, all provided to help speed up design cycles for end-to-end solutions.
The kit supports BLE wireless connectivity through an on-board module, and Wi-Fi connectivity through a special pluginexpansion board (STEVAL-STWINWFV1). Wired connectivity is also supported via an on-board RS485 transceiver. The coresystem board also includes an STMod+ connector for compatible, low cost, small form factor daughter boards associated withthe STM32 family, such as the LTE Cell pack.
Apart from the core system board, the kit is provided complete with a 480 mAh Li-Po battery, an STLINK-V3MINI debugger anda plastic box.
Figure 1. STEVAL-STWINKT1 SensorTile Wireless Industrial Node
How to use the STEVAL-STWINKT1 SensorTile Wireless Industrial Node for condition monitoring and predictive maintenance applications
UM2622
User manual
UM2622 - Rev 1 - September 2019For further information contact your local STMicroelectronics sales office.
www.st.com
1 STWIN kit components
The SensorTile Wireless Industrial Node (STWIN) is packaged with the components shown below.
Figure 2. STWIN Core System board top and bottom
Figure 3. Protective plastic case
UM2622STWIN kit components
UM2622 - Rev 1 page 2/40
Figure 4. 480mAh 3.7V Li-Po Battery
Figure 5. STLink-V3Mini Debugger/Programmer for STM32
Figure 6. Programming cable
UM2622STWIN kit components
UM2622 - Rev 1 page 3/40
2 Functional blocks
Figure 7. STEVAL-STWINKT1 functional block diagram
SPI3
ADC1
USART2
EnancedSWD
Connector
UART5
I2C2ADC3GPIOAuxiliary
Connector
DFSDM1
I2C2
IMP34DT05Digital Microphone
LPS22HHPressure Sensor
HTS221Humidity and
Temperature Sensor
STTS751Temperature Sensor
IIS2MDC3D Magnetometer
STM32L4R9ZIJ6Microcontroller
Ultra Low PowerCortex M4F@120MHz
32 kHzCrystal
16 MHzCrystal
SPBTLE-1SBLE Application
Processor Module
STR485LVRS485 Interface
SPI2
MP23ABS1Analog Microphone
TS922EIJTLow noise, low
distortion OpAmp
20-pin STMOD+
12-pin female sensor connector
12-pin maleconnector
40-pin Flex
STSAFESecure Element*
I2C2
SPIx, I2S, USARTx,...
IIS2DH3D Accelerometer
IIS3DWBVibrometer
ISM330DHCX6-Axis IMU
USBLC6-2P6USB ESD protection
ESDALC6V1-1U2Single Line ESD
protection
EMIF06-MSD02N16EMI filter and ESD
protection
STBC02Li-Ion linerar battery
charger
ST1PS01EJRstep-down switching
regulator
LDK130Low Noise LDO
Sensing
Processing
Connectivity
Power Mng.
Analog
Secure
* not mounted
connector
connector
2.1 Sensing
The core system board offers a comprehensive range of sensors specifically designed to support and enable theIndustry 4.0 applications.
Figure 8. STEVAL-STWINKT1 functional block diagram of sensing elements and STM32L4R9ZIJ6
SPI3
ADC1
DFSDM1
I2C2
IMP34DT05Digital Microphone
LPS22HHPressure Sensor
HTS221Humidity and
Temperature Sensor
STTS751Temperature Sensor
IIS2MDC3D Magnetometer
STM32L4R9ZIJ6Microcontroller
Ultra Low PowerCortex M4F@120MHz
MP23ABS1Analog Microphone
TS922EIJTLow noise, low
distortion OpAmp
IIS2DH3D Accelerometer
IIS3DWBVibrometer
ISM330DHCX6-Axis IMU
Sensing
Analog
The motion sensors communicate with the STM32L4R9ZIJ6 microcontroller via SPI in order to accommodate thehigh data rates, while the magnetometer and environmental sensors communicate via I2C.
UM2622Functional blocks
UM2622 - Rev 1 page 4/40
The suitably filtered signal from the MP23ABS1 analog microphone is amplified by a TS922 low noise OpAmpand then sampled by the internal 12-bit ADC in the MCU, while the signal from digital microphone is directlymanaged by the digital filter for Sigma-Delta modulators (DFSDM) interface in the MCU.
Figure 9. Core system board sensor locationsU2: HTS221 relative humidity and temperature sensorU3: LPS22HH digital absolute pressure sensorU6: STTS751 low-voltage digital local temperature sensorU8: TS922 rail-to-rail, high output current, dual operational amplifierU9: ISM330DHCX 3D acc. + 3D gyro iNEMO IMU with machine learning coreU11: IIS3DWB ultra-wide bandwidth MEMS vibrometer up to 5 kHzU12: IIS2DH ultra-low-power high performance MEMS motion sensorU13: IIS2MDC ultra-low-power 3-axis magnetometerM1: MP23ABS1 wideband analog MEMS microphoneM2: IMP34DT05 industrial grade digital MEMS microphone
2.1.1 HTS221 humidity and temperature sensorThe HTS221 is an ultra-compact relative humidity and temperature sensor with a sensing element and a mixedsignal ASIC to provide measurement information through digital serial interfaces.The sensing element consists of a polymer dielectric planar capacitor structure capable of detecting relativehumidity variations and is manufactured using a dedicated ST process.The HTS221 is available in a small top-holed cap land grid array (HLGA) package guaranteed to operate over atemperature range from -40 °C to +120 °C.
RELATED LINKS Visit the product web page for the HTS221 relative humidity and temperature sensor
2.1.2 LPS22HH MEMS pressure sensorThe LPS22HH is an ultra-compact piezoresistive absolute pressure sensor which functions as a digital outputbarometer. The device consists of a sensing element and an IC interface which communicates through I²C, MIPII3CSM or SPI from the sensing element to the application.The sensing element, which detects absolute pressure, consists of a suspended membrane manufactured using adedicated process developed by ST.The LPS22HH is available in a full-mold, holed LGA package (HLGA). It is guaranteed to operate over atemperature range extending from -40 °C to +85 °C.
UM2622Sensing
UM2622 - Rev 1 page 5/40
RELATED LINKS Visit the product web page for the LPS22HH MEMS pressure sensor
2.1.3 STTS751 digital temperature sensorThe STTS751 is a digital temperature sensor which communicates over a 2-wire SMBus 2.0 compatible bus. Thetemperature is measured with a user-configurable resolution between 9 and 12 bits. At 9 bits, the smallest stepsize is 0.5 °C, and at 12 bits, it is 0.0625 °C. At the default resolution (10 bits, 0.25 °C/LSB), the nominalconversion time is 21 milliseconds.Up to eight devices can share the same 2-wire SMBus without ambiguity, allowing a single application to monitormultiple temperature zones.
RELATED LINKS Visit the product web page for the STTS751 digital temperature sensor
2.1.4 TS922 rail-to-rail, high output current, dual operational amplifierThe TS922 is a rail-to-rail dual BiCMOS operational amplifier optimized and fully specified for 3 V and 5 Voperation. The very low noise, low distortion, low offset, and high output current capability render this devicehighly suitable for high quality, low voltage, or battery operated audio systems.
RELATED LINKS Visit the product web page for the TS922 rail-to-rail, high output current, dual operational amplifier
2.1.5 ISM330DHCX iNEMO IMU 3D Acc + 3D GyroThe ISM330DHCX is a system-in-package featuring a high-performance 3D digital accelerometer and +3D digitalgyroscope tailored for Industry 4.0 applications.The sensing elements of the accelerometer and of the gyroscope are implemented on the same silicon die, whichensures superior stability and robustness.Several embedded features such as programmable FSM, FIFO, sensor hub, event decoding and interrupts allowthe implementation of smart and complex sensor nodes able to deliver high performance at very low power.
RELATED LINKS Visit the product web page for the ISM330DHCX iNEMO IMU 3D Acc + 3D Gyro
2.1.6 IIS3DWB wide bandwidth accelerometerThe IIS3DWB is a system-in-package featuring a 3-axis digital accelerometer with low noise over an ultra-wideand flat frequency range. The wide bandwidth, low noise, very stable and repeatable sensitivity, together with thecapability of operating over an extended temperature range (up to +105 °C), render the device particularlysuitable for vibration monitoring in industrial applications.The high performance delivered at low power consumption, together with the digital output and embedded digitalfeatures like FIFO and interrupts are of primary importance in battery-operated industrial wireless sensor nodes.
RELATED LINKS Visit the product web page for the IIS3DWB wide bandwidth accelerometer
2.1.7 IIS2DH ultra-low power 3-axis high-performance accelerometerThe IIS2DH is an ultra-low-power high-performance three-axis linear accelerometer with digital I2C/SPI serialinterface standard output.The device may be configured to generate interrupt signals from two independent inertial wake-up/free-fall events,as well as from the position of the device itself.
UM2622Sensing
UM2622 - Rev 1 page 6/40
RELATED LINKS Visit the product web page for the IIS2DH ultra-low power 3-axis high-performance accelerometer
2.1.8 IIS2MDC 3-axis magnetometerThe IIS2MDC is a high-accuracy, ultra-low-power 3-axis digital magnetic sensor. It has a magnetic field dynamicrange up to ±50 gauss, and includes an I²C serial bus interface that supports 100 kHz, 400 kHz, 1 MHz, and3.4 MHz rates and an SPI serial standard interface.The device can be configured to generate an interrupt signal from magnetic field detection.
RELATED LINKS Visit the product web page for the IIS2MDC 3-axis magnetometer
2.1.9 MP23ABS1 analog MEMS microphoneThe MP23ABS1 is a compact, low-power microphone built with a capacitive sensing element and an IC interface.The device has an acoustic overload point of 130 dBSPL with a typical 64 dB signal-to-noise ratio, with sensitivityat -38 dBV ±1 dB @ 94 dBSPL, 1 kHz.
RELATED LINKS Visit the product web page for the MP23ABS1 analog MEMS microphone
2.1.10 IMP34DT05 digital MEMS microphoneThe IMP34DT05 is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitivesensing element and an IC interface; the device features 64 dB signal-to-noise ratio and -26 dBFS ±3 dBsensitivity.The IC interface includes a dedicated circuit able to provide a digital signal externally in PDM format.
RELATED LINKS Visit the product web page for the IMP34DT05 digital MEMS microphone
2.2 Processing and connectivity
The STWIN core system board features several wired and wireless connectivity options and the STM32L4R9ZIultra-low-power microcontroller, which is part of the STM32L4+ series MCUs based on the high-performance ArmCortex-M4 32-bit RISC core, operating at up to 120 MHz and equipped with 640 Kb SRAM and 2 MB Flashmemory.
UM2622Processing and connectivity
UM2622 - Rev 1 page 7/40
Figure 10. Main connectivity components and the STM32L4R9ZI processing unit
USART2
STM32L4R9ZIJ6MicrocontrollerUltra Low Power
Cortex M4F@120MHz
32 kHzCrystal
16 MHzCrystal
SPBTLE-1SBLE Application
Processor Module
STR485LVRS485 Interface
SPI2
SPI1
Secure
Processing
Connectivity
STEVAL-STWINWFV112-pin male com.
connector
Each connectivity component is connected to an independent bus on the STM32L4R9ZI MCU, so they can all beconfigured individually.
UM2622Processing and connectivity
UM2622 - Rev 1 page 8/40
Figure 11. MCU and connectivity element locationsU4: STM32L4R9ZI Cortex-M4F 120MHz 640Kb RAMU5: SPBTLE-1S application module for Bluetooth v4.2U7: STSAFE-A100 authentication and brand protection secure solutionU17: STG3692 high bandwidth quad SPDT switchU19: STR485 3.3V RS485 up to 20MbpsUSB: Micro-USB connector (power supply + data)X1: 16MHz crystal oscillatorX2: 32.768 kHz crystal oscillatorJ2: STDC14 programming connector for STLINK-V3J1: RS485 interface header connectorCN3: Connectivity expansion connectorCN4: Audio/sensor expansion connectorSD: microSD card socket
2.2.1 STM32L4R9ZI Cortex-M4F 120MHz 640Kb RAMThe STM32L4R9ZI devices is an ultra-low-power microcontroller (STM32L4+ Series MCU) based on the high-performance Arm Cortex-M4 32-bit RISC core, which operates at a frequency of up to 120 MHz.The Cortex-M4 core features a single-precision floating-point unit (FPU), which supports all the Arm single-precision data-processing instructions and all the data types. The Cortex-M4 core also implements a full set ofDSP (digital signal processing) instructions and a memory protection unit (MPU) which enhances applicationsecurity.These devices embed high-speed memories (2 Mbytes of Flash memory and 640 Kbytes of SRAM), a flexibleexternal memory controller (FSMC) for static memories (for devices with packages of 100 pins and more), twoOctoSPI Flash memory interfaces and an extensive range of enhanced I/Os and peripherals connected to twoAPB buses, two AHB buses and a 32-bit multi-AHB bus matrix.The MCU embeds several protection mechanisms for embedded Flash memory and SRAM: readout protection,write protection, proprietary code readout protection and a firewall.These devices offer a fast 12-bit ADC (5 Msps), two comparators, two operational amplifiers, two DAC channels,an internal voltage reference buffer, a low-power RTC, two general-purpose 32-bit timer, two 16-bit PWM timersfor motor control, seven general-purpose 16-bit timers, and two 16-bit low-power timers. The devices support fourdigital filters for external sigma delta modulators (DFSDM). In addition, up to 24 capacitive sensing channels areavailable.They also feature standard and advanced communication interfaces such as:• Four I2Cs• Three SPIs• Three USARTs, two UARTs and one low-power UART• Two SAIs• One SDMMC
UM2622Processing and connectivity
UM2622 - Rev 1 page 9/40
• One CAN• One USB OTG full-speed• Camera interface• DMA2D controller
The device operates in the -40 to +85 °C (+105 °C junction) and -40 to +125 °C (+130 °C junction) temperatureranges from a 1.71 to 3.6 V for VDD power supply when using internal LDO regulator and a 1.05 to 1.32 V V DD12power supply when using external SMPS supply. A comprehensive set of power-saving modes allows the designof low-power applications.Some independent power supplies are supported, such as an analog independent supply input for ADC, DAC,OPAMPs and comparators, a 3.3 V dedicated supply input for USB and up to 14 I/Os, which can be suppliedindependently down to 1.08 V. A VBAT input allows backup of the RTC and the registers. Dedicated VDD12 powersupplies can be used to bypass the internal LDO regulator when connected to an external SMPS.
RELATED LINKS Visit the product web page for the STM32L4R9ZI micrcontroller
2.2.2 SPBTLE-1S application module for Bluetooth v4.2The SPBTLE-1S is a Bluetooth low energy system-on-chip application processor certified module, compliant withBT specifications v4.2 and BQE qualified. It supports multiple roles simultaneously and can act as a Bluetoothsmart master and slave device at the same time.The module is based on the BlueNRG-1 system-on-chip, with the entire Bluetooth low energy stack and protocolsembedded in the module to provide a complete RF platform in a tiny form factor. The integrated radio, embeddedantenna and high frequency oscillators complete the certified solution that can help minimize the time to market offinal applications.The SPBTLE-1S can be powered directly with a pair of AAA batteries or any power source from 1.7 to 3.6 V.
RELATED LINKS Visit the product web page for the SPBTLE-1S application module for Bluetooth v4.2
2.2.3 STR485LV 3.3V RS485 up to 20MbpsThe STR485 is a low power differential line transceiver for RS485 data transmission standard applications in half-duplex mode. Data and enable signals are compatible with 1.8 V or 3.3 V supplies.Two speeds are selectable via the SLR pin: fast data rate up to 20 Mbps or slow data rate up to 250 kbps forextended cables.Excessive power dissipation caused by bus contention or faults is prevented by a thermal shutdown circuit thatforces the driver outputs into a high impedance state. The receiver has a fail-safe feature that guarantees a highoutput state when the inputs are left open, shorted or idle.
RELATED LINKS Visit the product web page for the STR485LV 3.3V RS485 up to 20Mbps
2.2.4 USB connectorThe Micro-USB connector on the board can be used for both power supply and data transfer (USB Device only).Different examples of USB class implementation can be found in STSW-STWINKT01 software package.
2.2.5 STSAFE-A100 (footprint only) authentication and brand protection secure solutionThe STSAFE-A100 is a secure element providing authentication and data management services to a local orremote host. It consists of a full turnkey solution with a secure operating system running on the latest generationof secure microcontrollers.The STSAFE-A100 can be integrated in IoT devices, smart-home, smart-city and industrial applications,consumer electronics devices, consumables and accessories.RELTABLE: authentication and brand protection secure solution DS12911
UM2622Processing and connectivity
UM2622 - Rev 1 page 10/40
RELATED LINKS Visit the product web page for the STSAFE-A100 authentication and brand protection secure solution
2.2.6 microSD card socketOn the bottom side of the STWIN core system board is a microSD Card socket that is accessible even when theboard is mounted in the plastic box. The card is accessed through a 4-bit wide SDIO port for maximumperformance.A couple of firmware examples involving high speed data logging on the SD card are available in the STSW-STWINKT01 software package.
2.2.7 Clock sourcesThere are two external clock sources on the STWIN core system board:• X1: 16 MHz high speed external (HSE) oscillator for the MCU.• X2: 32.768 kHz low speed external (LSE) oscillator for the RTC embedded in the MCU.
2.3 Power management
The STWIN core system board includes a range of power management features that enable very low powerconsumption in final applications.
Figure 12. Power and protection components
STM32L4R9ZIJ6Microcontroller
Ultra Low PowerCortex M4F@120MHz
LDK130Low Noise LDO
ESDALC6V1-1U2Single Line ESD
protection
USBLC6-2P6USB ESD protection
EMIF06-MSD02N16EMI filter and ESD
protection
ST1PS01EJRstep-down
switching regulator
STBC02Li-Ion linerar
battery charger
UM2622Power management
UM2622 - Rev 1 page 11/40
Figure 13. Power and protection component locationsU1: EMIF06-MSD02N16 6-line EMI filter and ESD protection for T-Flash and microSD card interfacesU10: LDK130 300 mA very low noise LDOU14, U16: ST1PS01 400 mA Synchronous step-down converterU15: STBC02 Li-Ion linear battery chargerU18: USBLC6-2 low capacitance ESD protection for USBD1, D2, D3: Single-line low capacitance Transil for ESD protectionD4: Power Schottky rectifier (1A)BATT: Battery connectorJ4: Battery pinsJ5: 5V Ext power supply connectorJ6, J7, J9, J10: Current monitoring SMD jumperPWR: Power button
2.3.1 Battery connectorsThe battery supply voltage (VBAT) may be provided by connecting the 480 mA LiPo battery included in theSTWIN kit to the dedicated battery connector, or by supplying an external voltage through the J4 connector.
Figure 14. Battery and J4 connectors for VBAT supply
3 2 1 21VB
AT
BAT_N
TC
GN
D
VBAT
GND
2.3.2 Power SupplyThe STWIN core system board can receive power through several sources:• V_USB: through micro USB connector [5V]
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UM2622 - Rev 1 page 12/40
• 5V: through J5 connector [5V]• V_EXT: through CN1 or CN2 [5V]• VBAT: LiPo Battery connected to BATT connector
The battery is always optional. The STBC02 battery charger automatically checks the available power inputs andselects one to power the system. When the battery is connected as well as one of the other sources, the STBC02automatically charges the battery.
Figure 15. Power circuits
STWIN core system board
USB
3V3 DCDCU14
CN3 (Wi-Fi)STSAFE
5V
SYS (5V or VBAT)
CN2 (AMicArray)CN2
CN1
VBAT
J5 STBC02Battery Charger
Analog Mic OpAmp
U102.7 LDO
DCDC_1 DCDC_2
3V3_Ext
U163V3 DCDC
VEXT
J3
µSDCardRS485
SYS
V_USB
5V
STM32L4+Sensors
BLE
2.3.3 Power ON/OFF procedureIf the STWIN core system board is not powered via battery, then the board will turn on and off when you connectand disconnect an external supply, respectively.Follow the steps below to power the board on and off when it is powered by a LiPo battery.
Step 1. Push the PWR button for about a second to power the board on.Power on is managed by the STBC02 battery charger WAKE-UP hardware feature.
Step 2. Push the PWR button again to turn the board off.In the application code examples provided with the software, the microcontroller detects the pushaction and activates the battery charger SHUTDOWN command to switch the power supply off.
2.3.4 Power consumption evaluationThere are several test points and jumpers on the STWIN core system board available to monitor the electricalperformance of running applications. In particular, there are four jumpers for monitoring the current consumptionin each of the four main power supply domains on the board.The best way to evaluate general power consumption is to remove both the battery and the USB cable andprovide 5 V directly on the J5 connector.
UM2622Power management
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Figure 16. Power monitoring pointsJ6: Sensor current monitoringJ4: Battery supplyJ7: STM32 digital power supply current monitoringJ9: SPBTLE-1S BLE module current monitoringJ10: STEVAL-STWINWFV1 (Wi-Fi expansion) and STSAFE-A100 current monitoringTP1, TP2: GNDTP3: DCDC_1 (3.3V)
UM2622Power management
UM2622 - Rev 1 page 14/40
2.4 Buttons, LEDs and connectors
Figure 17. Buttons, LEDs and connectorsUSR: User buttonPWR: connected to the STBC02 for integrated WAKE-UP function and the STM32L4R9ZI MCU as generic USR buttonRESET: connected to STM32 MCU reset pin (BLACK)LED_C: Red LED connected to STBC02 and used for battery status feedbackLED1: Green LED connected to STM32LED2: Orange LED connected to STM32CN1: 40-pin flex general purpose expansionCN2: STMod+ connectorCN3: 12-pin male connectivity expansion connector, suitable for the STEVAL-STWINWFV1 expansion boardCN4: 12-pin female sensor expansion connector, suitable for the STEVAL-STWINMAV1 analog microphone array expansionboardBatt
2.4.1 Flex expansion connector
Figure 18. CN1 Flex connector top view140
This is a general purpose expansion connector.
Table 1. CN1 pin descriptions
Pin No. Description STM32 pin Default Signal
1 USART3_CTS PB13 -
2 STMOD2 PD8/ PC3 USART3_TX/ SPI2_MOSI
3 STMOD3 PD9/ PD3 USART3_RX/ SPI2_MISO
4 STMOD4 PD1/ PB1 SPI2_CLK/ USART3_RTS
5 GND - -
6 VEXT - -
UM2622Buttons, LEDs and connectors
UM2622 - Rev 1 page 15/40
Pin No. Description STM32 pin Default Signal
7 I2C4_SCL PD12 -
8 SPI2_MOSI_p2 PB15 -
9 SPI2_MISO_p2 PC2 -
10 I2C4_SDA PD13 -
11 PC5/WKUP5 PC5 WKUP5
12 EX_RESET PD11 -
13 EX_ADC PA5 -
14 EX_PWM PA15 -
15 VEXT - -
16 GND - -
17 PG12 PG12 EX_CN (ex tint)
SAI218 PG10 PG10 TIM
19 PG9 PG9 TIM
20 PB14 PB14 TIM, DSFDMD2
21 PA9 PA9 -
22 PA10 PA10 -
23 PB11 PB11 DSI_TE,TIM,LPUART_TX
24 PC13 PC13 TAMP, WKUP
25 PB9 PB9CAN, TIM, DSFDM,I2C1
26 PB8 PB8
27 PE9 PE9 TIM, DSFDMCLK
28 3V3_Ext - -
29 DSI_D1_N -STM32 Display Serial Interface (DSI) Host
30 DSI_D1_P -
31 GND - -
32 DSI_D0_N -STM32 Display Serial Interface (DSI) Host
33 DSI_D0_P -
34 SYS - -
35 DSI_CLK_N -STM32 Display Serial Interface (DSI) Host
36 DSI_CLK_P -
37 3V3_Ext - -
38 PA0 PA0 ADC_IN5
39 PA1 PA1 ADC_IN6
40 SYS - -
RELATED LINKS View the vendor documentation on handling FH34SRJ series connectors
UM2622Buttons, LEDs and connectors
UM2622 - Rev 1 page 16/40
2.4.2 STMod+ connector
Figure 19. STMod+ connector top views
20
PCBEdge Border
Daughterboard Host board
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
PCBEdge
Border7.62 mm2.77 mm
Male connector Female connector
Table 2. STMod+ connector pin assignments and descriptions
STMod+ Pin number Function(1) of the primary host mapped Description
1 SPIx_NSS(2) / UARTy_CTS Output / Input
2 SPIx_MOSIp(3) / UARTy_TX Output / Output Output / Output
3 SPIx_MISOp(4) / UARTy_RX Input / Input Input / Input
4 SPIx_SCK / UARTy_RTS Output / Output Output / Output
5 GND Ground Reference Ground reference
6 +5 V Power Supply(5) Power supply
7 I2Cz_SCL Input / Output Input / Output
8 SPIx_MOSIs(3) Output Output
9 SPIx_MISOs(4) Input / Output Input / Output
10 I2Cz_SDA Input / Output Input / Output
11 INT(6) Input Input
12 RESET Output Output
13 ADC Input Input
14 PWM Output Output
15 +5 V Power Supply(5) Power supply
16 GND Ground Reference Ground reference
17 GPIO(7) Output / Input
18 GPIO(7) Output / Input
19 GPIO(7) Output / Input
20 GPIO(7) Output / Input
1. If two functions are provided on a STMod+ connector pin, you can connect two different I/O ports from STM32: the firmwaremanages the conflicts that may arise. MOSIs means used in Serial Daisy Chained-SPI mode and MOSIp means used inParallel SPI mode. More alternate functions may be available from STM32, refer to the User manual of the host board andthe corresponding STM32 datasheet available on www.st.com.
2. Instead of SPIx_NSS, a GPIO can be used as SPI Chip Select.3. Pins 2 and 8 are the same SPIx_MOSI signals, but they must come from two different I/O ports.
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4. Pins 3 and 9 are the same SPIx_MISO signals, but they must come from two different I/O ports.5. Power Supply is Output or Input, depending on host / daughterboard configuration.6. INT is an interrupt line.7. GPIO ports with many alternate functions (like UART, I²C, SPI and analog inputs/outputs) are privileged to offer optimum
flexibility.
RELATED LINKS Read TN1238: STMod+ interface specification available on the ST website for more information
2.4.3 Connectivity expansion connector
Figure 20. CN3 connectivity connector top view
b6 b1
a6 a1
This connector is suitable for the STEVAL-STWINWFV1 Wi-Fi expansion board.
Table 3. CN3 pin descriptions
Pin Description STM32 pin Pin Default Signal STM32 pin
a1 GND - b1 WIFI_DRDY PE11
a2 CS/USART3_CTS PB13 b2 WIFI_WAKEUP PD7
a3 SPI1_CLK/USART3_RTS PB1 b3 WIFI_BOOT0 PF12
a4 SPI1_MISO/USART3_RX PD9 b4 WIFI_RST PC6
a5 SPI1_MOSI/USART3_TX PD8 b5 I2C3_SDA PG8
a6 3V3 Output (VDD_WIFI) - b6 I2C3_SCL PG9
2.4.4 Sensor expansion connector
Figure 21. CN4 sensor connector top view
b6b1
a6a1
This connector is suitable for the STEVAL-STWINMAV1 analog microphone expansion board.
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Table 4. CN4 pin descriptions
Pin Description STM32 pin Pin Default Signal STM32 pin
a1 5V/Batt Output - b1 DFSDM1_D7 PB10
a2 3V3 Output - b2 DFSDM1_CKOUT PE9
a3 SAI1_FS_A - DFSDM_D3 PE4 b3 I2C2_SCL PF1
a4 GND - b4 I2C2_SDA PF0
a5 SAI1_SD_A/ SAI1_SD_B/DFSDM_D2 PE6 b5 SAI1_SCK_A PE5
a6 GND - b6 SAI1_MCLK_A/DFSDM_D5 PE2
2.5 Protective plastic box
The plastic case is designed to protect and hold the STWIN core system board and the LiPo battery together.The case can also house two magnets (not included in the STEVAL-STWINKT1 kit), allowing you to stick thewireless industrial node on appropriate metallic areas in the monitored equipment.
RELATED LINKS The system was tested with the following 25x8x3mm magnets
2.6 STLINK-V3MINI debugger and programmer for STM32
The STLINK-V3MINI is a standalone debugging and programming mini probe for STM32 microcontrollers, withJTAG/SWD interfaces for communication with any STM32 microcontroller located on an application board.It provides a Virtual COM port interface for host PCs to communication with target MCUs via UART.The STLINK-V3MINI is supplied with an STDC14 to STDC14 flat cable.
Figure 22. STLINK-V3MINI and STDC14 cable
UM2622Protective plastic box
UM2622 - Rev 1 page 19/40
3 STWIN assembly steps
To assemble your SensorTile Wireless Industrial Node, you need the following components:• STWIN core system board• 4x M3 bolts and nuts• Plastic box (2 parts)• Battery• 2x Magnets (optional - not included in the kit):
– RS Stock No. 177-4040 Brand Eclipse Mfr Part No.N859
Figure 23. Exploded cad drawing of STWIN node components
UM2622STWIN assembly steps
UM2622 - Rev 1 page 20/40
Step 1. (Optional) Insert the magnets in the rectangular recesses in the bottom of the main case.
Figure 24. Optional magnets inserted in main case
Step 2. Slide the U-shaped bracket into the main case.This will secure the magnets if they are present.
Step 3. Insert the STWIN core system board with the correct orientation.
Figure 25. Core system board inserted in main case
UM2622STWIN assembly steps
UM2622 - Rev 1 page 21/40
Step 4. Fasten the core system board to the case using the nuts and bolts provided with the kit.
Figure 26. Core system board fastened with bolts
UM2622STWIN assembly steps
UM2622 - Rev 1 page 22/40
4 How to run the default Serial_DataLog application
The Serial DataLog application shows how to stream sensor data via USB Virtual COM Port class, so the datacan be viewed using any serial terminal software like TeraTerm or PuTTy.Following reset, the firmware performs the following initial tasks:1. configures HAL and clocks2. configures LED1 and LED23. initializes the USB peripheral4. Gets inertial and environmental data and sends them to PCThe application collects data from:• ISM330DHCX:
– Linear acceleration (mg)– Angular acceleration (mdps)
• IIS2MDC:– Magnetic Field (mgauss)
• LPS22HH:– Pressure (hPa)
• STTS751:– Local temperature (°C)
• HTS221:– Environmental temperature (°C)– Humidity (%rH)
To use the Serial DataLog application:
Step 1. Connect the board to a PC via micro-USB cable.The PC will recognize the board as a Virtual COM Port.
Step 2. Open the COM port with a serial terminal like Putty or TeraTerm.Use the following parameters: 8N1, 115200 bauds, no HW flow control, line endings LF or CR-LF(Transmit) and LF (receive).When connected to the PC, the board configures the sensors and starts streaming data to the PC.
RELATED LINKS If required, you can download the STM32 Virtual COM Port Driver for Windows from the ST website
UM2622How to run the default Serial_DataLog application
UM2622 - Rev 1 page 23/40
5 Schematic diagrams
Figure 27. STEVAL-STWINKT1 schematic - power
D4
D0
SB12 0R
C26
4.7uF
5
B2
C1
NC
DCDC_1
BUTTON_PWR
SW2_OA
D5
J5
CON2
DCDC_1 BAT_NTCE2
SB22 NC
3V3_Ext
5
R1856K
3
GN
D
OTG_FS_DP
VBUS
D2
1
2
R13 NC (10k )
SW
R12100k
F4
D3
SYS
D2
5
E4
GND
V_USB
1
E3
SW_SEL
F5
1
U16
ST1PS01EJR
GND
V_USB
2
1
nRESET
C22
22uF
EXT 5V 3.3V DC-DC
2.7V Analog LDO
SYS
2V 7A
EN
A4
E1
1
ISET
DCDC_1
1
CEN
BAT2
R172k
D1
B5
B3
C21 10uF
BATSNS
OUT
5V
TP2
TH
E3
R20 100k
VOUT
D1
ESDALC6V1-1U2
TP3
TH
B4
SW1_I
VBat
C2
D2
4
R19 0R
3V3_LDO
C18
22uF PGOOD
AGN
D
C20 1uF
2
A1
PWR
C23
10uF
A2
A1
A1
RESET_NOW
VBat
6IN
D1
D0
A3
L2 2.2uH
C12
1uF
USBLC6-2P6
L1 2.2uH
USB
C151uF
5V2
SW2_I
VBat
DCDC_1
C1
1
1
SW1_OA
C24
10uF
C_EN
GN
D
100mA
NC2
2
Battery management
1
OTG_FS_DM
CHG
GND
BAT_NTC
TP7
R15 1M
DCDC_1
A3
BATMS
C27
100nF
D1
SYS
1D1
SW1_OBE3
3
3
IN1
SB23 0R
B2
SYS1
EN
NTC
R11 20K
R21 0R
U10 LDK130PU-RWAKEUP
C5
4
U14
ST1PS01EJR
B1
R14 100k
D4
2
uC_ADC_BATT
SW2_OB
2
E1
C3
LED_C
Red
3
VIN
BATT
Battery Connector
F2
DCDC_1
BATSNSFV
U15
STBC02AJR
3V3 400mA
3V3 400mA.
Battery monitor(4.2V -> 3V)
SH2
DCDC_2_EN
R10 47.5K
CHRG
C3
TP1
TH
NC
3V3_SD_485
R222k
F1
C3
DCDC_1
IPRE
1
A3
1
R23100K
V_USB
DCDC_2
4
LDO
2D4
C25 10uF
6
BUTTON_PWR
VBat
EN
A5
SH1
2
RST_PENDING
BATMS
SW
J4
STRIP254P-M-2
F3
SB17 NC
C4
DCDC_2
SW_SEL
PGOOD
SW_SEL
SYS2
C1
PGOOD
VOUT
D2
2
E1
VIN
D3
1
3V3 150mA
BATMS
ADJ
E5
R1620K
4
B2
IN2
BAT1
3
U18USB-MICRO
10mA
UM
2622 - Rev 1
page 24/40
UM
2622Schem
atic diagrams
Figure 28. STEVAL-STWINKT1 schematic - connectors
NC
10
STMOD4
SPI2_MISO_p2
3
4S1
3-4SEL
40
8
16
DSI_D1_N
20
18
21
EX_RESET7
7
PC5/WKUP5
13
2
12
19
PG10
PB14
3-4SEL
15
17
EX_PWM
SYS
PG10
17
3V3_Ext
10 PG12
USART3_RTS
10
3
DSI_CLK_N
D3
PG918
1
PB11
16
29
VEXT 26
SPI2_MOSI15
PA9
PB9
USART3_CTS
920
C60100nF
31
STMOD2
I2C4_SCL
4
CN1
FH34SRJ-40S-0.5SH(99)
1-2SEL
13
PA0
3
PG9
DSI_D0_P
25
3
DSI_D1_PUSART3_CTS
1S1
12STMOD2
5
30
8
U17
STG3692
19
1
I2C4_SDA
GND
VEXT
32
SPI2_MISO
SYS
STMOD2
14
1-2SEL
4S214
SPI2_CLK
STMOD4
7
USART1
WKUP5
TIM, DSFDMCLK
TIM
TAMP, WKUPDSI_TE,TIM,LPUART_TX
DCDC_1
4
11
2S1
VCC
I2C4_SDA
2
33
2
EX_PWM
17
4
11
27
STMOD3
DSI_D0_N
1STMOD3
9
PA1
SPI2_MISO_p2
35
38
2S26
14
I2C4_SCL
34
PC5/WKUP5
5V
24
STMod+ interfacePE9
6
SPI2_MOSI_p2
PB8
9
2
28
PG12
1
EX_RESET
36
D21S2
13
PB1416
J3
CN2
PA10
6
39
VEXT
3S1
23
5
PC13
3S2STMOD4
D1USART3_RX
5
STMOD3
37
SPI2_MOSI_p2
EX_ADC
15
EX_ADC
SAI2
CAN, TIM, DSFDM,I2C1
TIM,DSFDMD2TIM
ADC_IN5ADC_IN6
EX_CN
USART3_TX
22
11
8 DSI_CLK_P
DCDC_1
12
D4
UM
2622 - Rev 1
page 25/40
UM
2622Schem
atic diagrams
Figure 29. STEVAL-STWINKT1 schematic - sensors
INT2_DH
I2C2_SDA
CS
VDD
SCL/SPCC13
100nF
INT1
3V3_Sensors
4
C14
100nF
SPI3_MISO
OCS_Aux
VDD
R47.5k
C1
9
14
2
CS
2
SPI3_MISO
8
5
5
SDO_Aux 1OCS_Aux
SCL
6
RES
12
C8
100nF
6
3
SDA
5
INT2_DHC
1
INT2_ADWB
TP4U9
ISM330DHCX
SPI3_CLK
GN
D1
NC
111
C58
10uF
8
GN
D2
SCx
3
CS
VDD
CS
13
VDD
INT
3V3_Sensors
7
I2C2_SCL
C31
100nF
5
4
104
SDO/SA0
I2C2_SCL
GND
INT1
GN
D
5
U6
SDO/SA0
U2HTS221
INT2
SPI3_MOSI
9
C56100nF
3
9
I2C2_SCL
3
12
3V3_Sensors
4
C17100nF
I2C2_SDA
SCL
3
3V3_Sensors
8
3V3_Sensors
SPI3_MOSI
TP6
10
C40
100nF
1
C57
100nF
SDA
U3LPS22HH
3
6
DRDY
5
11
I2C2_SDA
3V3_Sensors
GN
D2
5
SCx
3V3_Sensors
2
INT1
R57.5k
SPI3_CLK
U12
TP8
3V3_Sensors
9
CS_DH
SPI3_MOSI
CS_ADWB
SCL
SDO/SA0
J6
Sensors and digital mic current monitoring
13
4
12
SPI3_CLK
7
VDD
IO
CSINT_DRDY
6-AxisAcc + Gyro
Pressure
SPI3_MISO
INT1_ADWB
SDO_Aux
3V3_Sensors
28
614
SDA
3V3_Sensors
GN
D2
1
4
7
TP5
SDA/SDI/SDO
C11
10uF
SCL/SPC
SDO/SA01
9
10
SPI3_CLK
1
U11SPI3_MOSI
1
INT_HTS
2
2
I2C2_SMBA
6
SDA/I/O
I2C2_SCL
VDDVDDIO
3V3_Sensors
VDDIO
SDA/I/O
12
I2C2_SDA
3V3_Sensors
CS
7
6
I2C Addr: 1001000b
I2C Addr: 0011110b
I2C Addr: 1011111b
I2C Addr: 1011101b
8
3V3_Sensors
GN
D1
EV
11
SCL
INT_M
7
10
INT2
VDD
IO
C190.22uF
C59
100nF
SPI3_MISO
3V3_Sensors
10
GN
D
GND3
NC
2Therm
2
INT2
3V3_Sensors 3V3_Sensors
1
SDA
Magnetometer
Vibrometer
Humidity & Temperature
U13IIS2MDC
3V3_Sensors
GN
D1
VDD
NC3
3V3_Sensors
2
C37
4.7uF
C16
100nF
3
VDDINT1_DHC
6
I2C2_SCL
INT_STT
CS_DHC
DCDC_1
SDx
SCL
4
GND2
I2C2_SDA
SDx
TP9
VDD_IO
GND
RES
3V3_Sensors11
GND2
Accelerometer
Temperature
IIS3DWB
STTS751
IIS2DH
UM
2622 - Rev 1
page 26/40
UM
2622Schem
atic diagrams
Figure 30. STEVAL-STWINKT1 schematic - MCU
U4
X1
16MHz
STM32L4R9ZIJ6
CS_WIFI
I2C3_SDA
2
F10
J1
G5
M6
SAI1_MCLK_A
PF12
PB1
C6
VDD
USB
A9
C11
R34.7k
PH1-OSC_OUT
INT1_DHC
H9
G3
PGOOD
WIFI_BOOT0
L6
PD15
SWDIO
R341k
G7
D2
ESDALC6V1-1U2
RESET
PF0
BOOT0-PE0
E9
PA0
PB10
F7
K8
PC0
C1
VDD_uC
VSS4
SPI1_MOSI
1
J9
PB11
B2
K9
LED2
SDMMC_D3
10
2
PA10
C49
6.8pF
OSC32_OUT
PA9
PG5
PF2
PG9
INT1_ADWB
E11
PG10
PG7
C45
100nF
LED2Orange
R24.7k
INT_M
Differential pairs100 OHM
R324.7k
D3
ESDALC6V1-1U2
LED2
SPI3_MISO
B1
EX_PWM
PA10
I2C2_SMBA
VBAT
VSSD
SI
CHRG
R334.7k
INT_STT
CS_ADWB
D4
VDD
A
C5
5.6pF
PC14-OSC32_IND1
H6PF15
SPI2_MISO
WIFI_DRDY
B8
PD12
I2C4_SDA
PF7
PA15
SDMMC_D1
H10
L2
PD3
PA1PE2
A8
C3
VDD_uC
PD7
PB9
PD9
7
PC13
VDD
5
J2
PE11
PC1
L11
USART2_TX
BOOT0-PE0
PC9
PA14/SWCLK
C12
PD8
SPI2_MOSI_p2
H7B12
PB8
PE3
M10
PA5L4
C48
1uF
RESET
OSC32_OUT
STSAFE_RESET
VDD
1
C35
100nF
PB14
R35560R
PC2
PD14
I2C4_SCL
DSI_D0_P
G12
VDD
4
PF5
1
2
USART3_RTS
DAC1_OUT1
DFSDM1_CKOUT
5
H12
PD0
M3
E2
PE15
PF1
PF14
PC11
PE5
PG10
E3
C41
4.7uF
SWDCLK
PD6
INT2_ADWB
G8
PA0/WKUP1
PF6
USART2_TX
SDMMC_D0
K3
PA8
F11
D11
VSS5
E12
NRST
H3
4
PB5
PB3
PC4
G4
4
L5
VDD
2
PB12
A10
USART2_RX
PG3
PA6
K10
OSC_IN
11
C39
100nF
J12
PB14
VREF
+
C10
D12PC6
OSC32_IN
PA11
INT2_DHC
E1
A6
M8
VDD
IO2_
1
PG1
USART3_TX
4
A11
VSS3
INT2_DH
DSI_CLK_N
K12
PG6
PE7G6
E4
DFSDM1_D7
F9
3
1
SAI1_SD_B
BUTTON_PWR
M7
WIFI_WAKEUP
1
PE14
SDMMC_CK
G9
C7
SAI1_SD_A
PD4
PE8
CS_DH
PB2
2V7A
H5
DSIHOST_D0P
SPI1_CLKPG2
PE4D3
J10
SD_DETECT
PC8
PD1
PC10
B7
E10
I2C4_SCL
8
BOOT0-PE0D8
SPI3_MOSI D5
B3
I2C2_SCL
SWDCLK
PE13
PF9
OSC32_IN
K5
K1
J4
12
A7
H4
BLE_RST
USART3_RX
B10
VDD
6
D6
F4
VDD_uC
PG12
1
INT_HTS
DSIHOST_D1P
RTC_TAMP1
H11
PA3SAI1_FS_A/DFSDM_D3
B9
J6
C2
C9
uC_ADC_BATT
PG8
DSI_D1_N
SPI2_CLK
PB6
VSS6
G11
2
G2
ADC1_IN2
PA4
VSS9
J7
STM32 Current monitoring
PA1
M4
K4
A5
B4
F12
PB4
SPI1_MISO
2
VDD_uC
PE12
R110k
C4
PD10
PC3
H8
14
OSC_OUT
PB15
6
9
A12
PE10
PG0
M5
D7
PF3
VDD
IO2_
2
H1
I2C2_SDA
E5
PH0-OSC_IN
1
OSC_OUT
I2C3_SCL
PC5/WKUP5
USART3_CTS
PH3-BOOT0A4
L12
I2C2_SDA
L10PF10
I2C4_SDA
C38
100nF
C1
100nF
DSIHOST_D0N
PA13/SWDIO
EX_ADC
PC13/WKUP2
3-4SEL
1
C6
5.6pF
SPI2_MOSI
EX_RESET
BLE_SPI_CS
DSI_D0_N
PD13
DSIHOST_D1N
DSIHOST_CKP
H2
G10
SDMMC_D2
3
PF13
K7
PG13
OTG_FS_DM
K11
K2
2V7A
PC12
PE12
D9
J11
BLE_TEST9
PG12
C50
100nF
E8
LED1
D10
A1
PB0
VSS1
USART2_RTS
2
C46
10nF
L9
PB7
PC7
PD2
B6
VDD_uC
C436.8pF
RESET
J8
PF8
VDD
3
F1
G1
PC5/WKUP5
C42
100nF
C32
100nF
SW_SEL
PA9
A2
1
13
PE0
D2
VSS2
PC15-OSC32_OUT
DCDC_2_EN
C_EN
M1
F2
2
E6
2
2
VDD_uC
PB11
AGND
EXTI_LINESEXTI0 --> USR ButtonEXTI1 --> BLEEXTI2 --> INT2_DH or INT2_ADWBEXTI3 --> BLE_TEST9EXTI4 --> INT2_DHCEXTI5 --> WKUP_INTEXTI6 --> HTS EXTI7 --> PGOODEXTI8 --> INT1_DLCEXTI9 --> MagEXTI10 --> PWR_BTN EXTI11 --> WiFiEXTI12 --> EX_CNEXTI13 --> TAMP,WKUP ExtEXTI14 --> INT1_ADWBEXTI15 --> INT_STT
USR/BOOT
VCAP
DSI
BLE_TEST8
ADC1_IN1
PB8
RESET
1-2SEL
VDD
7
PG4
K6
DSI_CLK_P
PF11
VDD_uC
PE6/WKUP3
F5
PG9
VSS8
1
USART2_RX
PA2/WKUP4
B5
CHRG
LED1Green
SDMMC_CMD
J7
M12
PA7
J2
STDC14
PE9
M9
SAI1_SCK_A
DSIHOST_CKN
A3PB9
M2
DCDC_1
3
WIFI_RST
E7
J3
C8
PE1
OTG_FS_DP
LED1
C34
100nF
L3
X232.7680KHZ
SP1
L8
PD11
VSS7
C5
SPI3_CLK
PD5
OSC_IN
F6
B11
M11
I2C2_SCL
PF4
CS_DHC
PE9
Close toVREF/VDDA
Close to VDD/VDDIO2
Close toVDDUSB
SWDIO
BLE_INT
C44
100nF
PA12
J5
L7
PB13
DSI_D1_P
C7
2.2uF
VSSA
/VR
EF-
C36
1uF
L1
F3
USR
3
4
DFSDM1_DATIN5 C47
100nF
SPI2_MISO_p2
F8
UM
2622 - Rev 1
page 27/40
UM
2622Schem
atic diagrams
Figure 31. STEVAL-STWINKT1 schematic - audio, RS485, SD card
AudioCoupon Connector
HP Filter --> fc = 15.9 HzLP Filter --> fc = 99.4 KHzDAC for mic bias
DFSDM_D2DFSDM_D5
DCDC_1
3V3_Sensors
2V7A
2V7A
2V7A
SYS
DFSDM1_DATIN5
DFSDM1_CKOUT
DFSDM1_CKOUTDFSDM1_D7
SAI1_FS_A/DFSDM_D3
SAI1_MCLK_ASAI1_SD_A SAI1_SCK_A
I2C2_SDAI2C2_SCL
SAI1_SD_B
DAC1_OUT1
ADC1_IN2
ADC1_IN1
PE12
R74.7k
C2100nF
C51100nF
R81M
CN4M55-6001242R
a1 b1a2 b2a3 b3a4 b4a5 b5a6 b6
C910nF
U8TS922EIJT
Vcc-C2
+IN2C3
OUT2A3
-IN2
B3
Vcc+A2
OUT1A1
-IN1
B1
+IN1C1
C5410nF
C551uF
R2810k
M1
DOUT1
GN
D1
2
GN
D2
3
VDD5
GN
D3
4
SB110R
C10100nF
C521uF
M2
DOUT4
LR2
GN
D5A
VDD1
CLK3
GN
D5B
GN
D5D
GN
D5C
R6100k
R91M
SB10NC
R29160
C301uF
MREF
M1 M1P_FILT
M1P_FILT
MREF
M1P
MREF_DIVMREF
RE
CLK_Ex
EP11
2
10A
SDMMC_D2
CM
D
USART2_RTS
3
SB25 0R
11
U1 EMIF06-MSD02N16
4
RDAT3_GND
DETGNDA
SDMMC_CMD
17
10
C2910nF
7DAT0_Ex
SD
Micro-SD
6
CLK_In
3V3_SD_485
SDMMC_D0
9A
SDMMC_D1
15
VCC
SDMMC_D3
VCC
1 10
C3
100nF
USART2_TX
VDD
14
GN
D
DAT2_Ex
1
6
DAT
1
DAT2_In3
GND
SD Card
RS485
SB24 NC
Card Removed --> CLOSECard Inserted --> OPEN
DETGNDB
5
9B3
DEB
CD
/DAT
3D
AT2
J1
NC
1
5CMD_In
DAT1_Ex
6
3V3_SD_485
SD_DETECT
C28
100nF
SD_DETECT
CLK
9
4
2
DAT3_In
GN
D
DAT
0
8
R24 62
DETCA
2
C4
10uF
5
DETCB
8
1312
4
DAT1_In
VL
RDATA_VCC
CMD_Ex
7
16
R
U19 STR485LVR25 62
SLR
10B
3
D
USART2_RX
DAT0_In
DAT3_Ex
1
9
WP/CD
8A 7
SDMMC_CK
2
3V3_SD_4853V3_SD_485
IMP34DT05
MP23ABS1
UM
2622 - Rev 1
page 28/40
UM
2622Schem
atic diagrams
Figure 32. STEVAL-STWINKT1 schematic - BLE, Wi-Fi, STSAFE
SB18 0R
4.7k
SB8 0R
BLE_SPI_SCK
100nF
Wi-Fi Current monitoring
USART3_TX
BLE Current monitoring
2
SB20 0R
47k
BLE_RST
2
21
VDD_BLE
ADC IN1
DIO
9/TC
K/SW
TCK
DCDC_2
WIFI_RST
16
a4
BLE_SPI_MISO
SB5 0R
WIFI
DIO
11/U
ART_
RXD
9
SB9 NC
VDD_BLE
SB21 0R
J10
CS_WIFI
1
4.7k
BLE_SPI_MOSI
13
SB2 NCSPI1_MISO
5
b3
218
U5 SPBTLE-1S
107
BLE_SWDCLK
DIO
8/U
ART_
TXD
b6
WIFI_WAKEUP
I2C3_SCL
11
1
DIO0/SPI_CLK
SB7 NC
22
1
VDD_BLE
BLE_SPI_SCK
BLE_SWDIO
4
VDD_WIFI
BLE_INTSB13 NC
WIFI_DRDY
a6
BLE_TEST9
ANAT
EST1
NC
#22
SPI2_MISO
DIO1/SPI_CS
BLE_SPI_MISO
DIO
14/A
NAT
EST0
BLE_RST
STRIP254P-M-5-90-SMD
USART2_TXDefault OFF
8
BLE
R30
Default OFF
DCDC_2b2
BLE_SPI_CS
319
b5
DIO
6/U
ART_
RTS
R26
I2C3_SDA
BLE_SPI_MOSI
Default ON
USART3_CTS
23N
C#2
3
DCDC_1
4
SPI1_MOSI
Male Conn
BLE_SWDIO
DIO2/SPI_MISO
a2
12
R27
6
SPI1_MOSI
15
TAMPER
SB15 NC
a5
BLE_TEST8
a1
SB4 0R
DIO3/SPI_MOSI
DIOA12
SB19 0R
BLE_SWDCLK
14R31
20
RTC_TAMP1
SPI2_MOSI
SPI2_CLK
Default ON
b4
USART2_RX
M55-7001242R
b1 DIO
7/BO
OT/
UAR
T_C
TS
USART3_RX
C33
I2C3_SCL
WIFI_BOOT0
17
SB3 NC
BLE_INT
4.7k
BLE_CS
SPI1_MISO
DIO5/I2C_SDA
NC
#21
VDD_WIFI
BT_RESET
2
USART3_RTS
CN3
DIO4/I2C_CLK
SB16 NC
SCL4
7
STSAFE-A100
NC#2
100nF
I2C3_SCL26VCC5
RESET NC#3
SO8N
8
DCDC_2
3C53STSAFE_RESET
U7 STSAFE-A100
1
NC#1SDAGND I2C3_SDA
SPI1_CLK
GN
D
a3
BLE_CS
J9
J8
I2C3_SDA
1
SB6 0R
VBLUE
DIO
10/T
MS/
SWTD
I
5
VDD_BLE
SPI1_CLK
SB14 NC
ADC IN2
SB1 NC
3
UM
2622 - Rev 1
page 29/40
UM
2622Schem
atic diagrams
6 Bill of materials
Table 5. Bill of materials
Item Q.ty Ref. Part / Value Description Manufacturer Order code
1 1 BATT Battery ConnectorAmass Molex 78171-0003
2 1 CN1 Hirose FH34SRJ-40S-0.5SH(99)
3 1 CN2 HEADER 10 Samtec SQT-110-01-F-D-RA
4 1 CN3 M55 series 12 pinconnector, 1.27pitch Harwin M55-7001242R
5 1 CN4M55 series 12 pinconnector - Female,1.27pitch
Harwin M55-6001242R
6 30
C1, C2, C3, C8,C10, C13, C14,C16, C17, C27,C28, C31, C32,C33, C34, C35,C38, C39, C40,C42, C44, C45,C47, C50, C51,C53, C56, C57,C59, C60
100nF, 16V,±10%
CAP CER X7R0402, 0402 (1005Metric)
MurataElectronicsNorthAmerica
GRM155R71C104KA88J
7 7C4, C11, C21,C23, C24, C25,C58
10µF, 10V, ±20%CAP CER X5R0402, 0402 (1005Metric)
SamsungElectro-MechanicsAmerica, Inc.
CL05A106MP8NUB8
8 2 C5, C6 5.6pF, 10V, ±1%CAP CER C0G/NP00402, 0402 (1005Metric)
Yageo CC0402BRNPO9BN5R6
9 1 C7 2.2µF, 10V,±20%
CAP CER X5R0402, 0402 (1005Metric)
WurthElectronicsInc.
Wurth-885012105013
10 4 C9, C29, C46,C54 10nF, 25V, ±10%
CAP CER X7R0402, 0402 (1005Metric)
AVXCorporation 04023C103KAT2A
11 8C12, C15, C20,C30, C36, C48,C52, C55
1µF, 10V, ±10%CAP CER X5R0402, 0402 (1005Metric)
Taiyo Yuden JMK105BJ105KV-F
12 2 C18, C22 22µF, 10V, ±20%CAP CER X5R0603, 0603 (1608Metric)
Taiyo Yuden LMK107BBJ226MA-T
13 1 C19 0.22µF, 16V,±10%
CAP CER X7R0402, 0402 (1005Metric)
MurataElectronicsNorthAmerica
GRM155R71C224KA12D
14 3 C26, C37, C41 4.7µF, 10V,±20%
CAP CER X5R0402, 0402 (1005Metric)
MurataElectronicsNorthAmerica
GRM155R61A475MEAAD
15 2 C43, C49 6.8pF, 10V, ±5%CAP CER C0G/NP00402, 0402 (1005Metric)
MurataElectronicsNorthAmerica
GRM0225C1E6R8CA03L
UM2622Bill of materials
UM2622 - Rev 1 page 30/40
Item Q.ty Ref. Part / Value Description Manufacturer Order code
16 3 D1, D2, D3
Single-line lowcapacitanceTransil™ for ESDprotection, ST0201
ST ESDALC6V1-1U2
17 1 D4 1A Power Schottkyrectifier, STmite ST STPS120M
18 1 J1 N.M. Stripline for RS485(not mounted) - -
19 1 J2 STDC14 STDC14 - ARMMIPI10 compatible Samtec FTSH-107-01-L-DV-K
20 1 J3 CON5_1 V_EXT selector - -
21 1 J4 STRIP254P-M-2 - -
22 1 J5 CON2 Morsettiera a 2 vie,passo 2.54mm - -
23 1 J6 0 OHM 1206 or2.54 Jumper
Sensors and digitalmic currentmonitoring: RESSMD
Yageo AF1206JR-070RL
24 1 J7 0 OHM 1206 or2.54 Jumper
STM32 Currentmonitoring: RESSMD
Yageo AF1206JR-070RL
25 1 J8 N.M. STRIP254P-M-5-90-SMD (not mounted) - -
26 1 J9 0 OHM 1206 or2.54 Jumper
BLE Currentmonitoring: RESSMD
Yageo AF1206JR-070RL
27 1 J10 0 OHM 1206 or2.54 Jumper
Wi-Fi Currentmonitoring: RESSMD
Yageo AF1206JR-070RL
28 1 LED_C Red LED, LED_0402
VishaySemiconductor OptoDivision
VLMS1500-GS08
29 1 LED1 Green LED, LED_0402PanasonicElectronicComponents
LNJ347W83RA
30 1 LED2 Orange LED, LED_0402PanasonicElectronicComponents
LNJ847W86RA
31 2 L1, L2 2.2uH, ±20% Inductor, 2520 Wurth Wurth-74438323022
32 1 M1 1.3A MEMS audio sensor ST MP23ABS1TR
33 1 M2 MEMS audio sensor ST IMP34DT05
34 2 USR, PWR 4.2x3.2x2.5mm,white
SW PUSHBUTTON-SPST-2 ALPS SKRPABE010
35 1 RESET 4.2x3.2x2.5mm,black
SW PUSHBUTTON-SPST-2 ALPS SKRPADE010
36 1 R1 10k, 100ppm/C,1/16W, ±1%
RES SMD 0402,0402 (1005 Metric) Yageo RC0402FR-0710KL
37 8R2, R3, R7, R26,R30, R31, R32,R33
4.7k, 100ppm/C,1/16W, ±1%
RES SMD 0402,0402 (1005 Metric)
TEConnectivityPassiveProduct
CRG0402F4K7
UM2622Bill of materials
UM2622 - Rev 1 page 31/40
Item Q.ty Ref. Part / Value Description Manufacturer Order code
38 2 R4, R5 7.5k, 100ppm/C,1/16W, ±5%
RES SMD 0402,0402 (1005 Metric) Yageo RC0402JR-077K5L
39 4 R6, R12, R14,R20
100k, 100ppm/C,1/16W, ±1%
RES SMD 0402,0402 (1005 Metric)
TEConnectivityPassiveProduct
CRG0402F100K
40 3 R8, R9, R15 1M, 100ppm/C,±1%
RES SMD 0402,0402 (1005 Metric)
TECONNECTIVITY
CRG0402F1M0
41 1 R1047.5K,100ppm/C,1/16W, ±1%
RES SMD 0402,0402 (1005 Metric) Yageo RC0402FR-0747K5L
42 2 R11, R16 20K, 100ppm/C,1/16W, ±1%
RES SMD 0402,0402 (1005 Metric) Yageo RC0402FR-0720KL
43 1 R13 10k N.M., ±1%RES, SMD, 0402(not mounted), 0402(1005 Metric)
TECONNECTIVITY
CRG0402F10K
44 2 R17, R22 2k, 100ppm/C,±1%
RES SMD 0402,0402 (1005 Metric) Yageo RT0402FRE072KL
45 1 R18 56K, 100ppm/C,±1%
RES SMD 0402,0402 (1005 Metric) Yageo RC0402FR-0756KL
46 2 R19, R21 0R RES SMD 0402,0402 (1005 Metric) Vishay Dale CRCW04020000Z0ED
47 1 R23 100K,100ppm/C, ±1%
RES SMD 0402,0402 (1005 Metric) Yageo RC0402FR-07100KL
48 2 R24, R25 62, 100ppm/C,1/16W, ±1%
RES SMD 0402,0402 (1005 Metric) Yageo RC0402FR-0762RL
49 1 R27 47k, 100ppm/C,1/16W, ±1%
RES SMD 0402,0402 (1005 Metric)
SamsungElectro-MechanicsAmerica, Inc.
RC1005F473CS
50 1 R28 10k, 100ppm/C,1/16W, ±1%
RES SMD 0402,0402 (1005 Metric) Yageo RC0402FR-0710KL
51 1 R29 160, 100ppm/C,1/16W, ±1%
RES SMD 0402,0402 (1005 Metric)
TEConnectivityPassiveProduct
CRG0402F160R
52 1 R34 1k, 100ppm/C,1/16W, ±1%
RES SMD 0402,0402 (1005 Metric) Yageo RC0402FR-071KL
53 1 R35560R,100ppm/C,1/16W, ±1%
RES SMD 0402,0402 (1005 Metric) Yageo RC0402FR-07560RL
54 13
SB1, SB2, SB3,SB7, SB9, SB10,SB13, SB14,SB15, SB16,SB17, SB22,SB24
0 OHM N.M.RES SMD 0402 (notmounted), 0402(1005 Metric)
Vishay Dale CRCW04020000Z0ED
55 12
SB4, SB5, SB6,SB8, SB11,SB12, SB18,SB19, SB20,SB21, SB23,SB25
0R RES SMD 0402,0402 (1005 Metric) Vishay Dale CRCW04020000Z0ED
UM2622Bill of materials
UM2622 - Rev 1 page 32/40
Item Q.ty Ref. Part / Value Description Manufacturer Order code
56 1 SD Micro-SD WurthElectronics 693071010811
57 1 SP1 N.M. (not mounted) - -
58 7TP4, TP5, TP6,TP7, TP8, TP9,TAMPER
1mm N.M.TEST POINT 1MMSMD PADSTASCK(not mounted)
- -
59 1 TP1 Test Point ThroughHole
KeystoneElectronics 5001
60 2 TP2, TP3 N.M. Test Point ThroughHole (not mounted) - -
61 1 USB USB Micro-B, USB-Micro-B GCT USB3075-30-A
62 1 U16-line IPAD™, EMIfilter and ESDprotection
ST EMIF06-MSD02N16
63 1 U2
Humidity,Temperature,HLGA-6L(2 x 2 x 0.9mm)
ST HTS221TR
64 1 U3
MEMS NANOPRESSURESENSOR: 260-1, (2x 2 x 0.73 mm)
ST LPS22HHTR
65 1 U4 STM32L496,UFBGA144 ST STM32L4R9ZIJ6
66 1 U5 ST BlueNRG-1module ST SPBTLE-1S
67 1 U6 Digital temperaturesensor, UDFN-6L ST STTS751-0DP3F
68 1 U7 N.M. Secure element (notmounted), SO8N ST STSAFE-A100
69 1 U8
OpAmp - excellentaudio performance /low distortion(0.005%)
ST TS922EIJT
70 1 U9
3D accelerometerand 3D gyroscope,LGA-14L (2.5 x 3 x0.83 mm)
ST ISM330DHCX
71 1 U10 300 mAvery lownoise LDO, DFN6 ST LDK130PU-R
72 1 U11
Accelerometor UltraWide Bandwidth,LGA-14L (2.5 x 3 x0.83 mm)
ST IIS3DWB
73 1 U12Accelerometor Ultra-low-power, LGA-12(2.0x2.0x1 mm)
ST IIS2DHTR
74 1 U13MEMSMagnetometer,(2.0x2.0x0.7)
ST IIS2MDCTR
UM2622Bill of materials
UM2622 - Rev 1 page 33/40
Item Q.ty Ref. Part / Value Description Manufacturer Order code
75 2 U14, U16400mA step-downswitching regulator,Flip-chip
ST ST1PS01EJR
76 1 U15
Li-Ion Linear BatteryCharger with LDO3.3V, Flip Chip30(2.59x2.25 mm)
ST STBC02AJR
77 1 U17Low voltage highbandwidth quadSPDT switch
ST STG3692
78 1 U18 USB Protection ST USBLC6-2P6
79 1 U19Low powertransceiver forRS-485, DFN10
ST STR485LV
80 1 X1 16MHz 16.00MHz Crystal8pF NDK NX3225GA-16MHZ-STD-
CRG-1
81 1 X2 32.7680KHZCRYSTAL32.7680KHz 6PFSMD
NDK NX3215SA-32.768K-STD-MUA-14
82 1 STEVAL-STWINKT1 STLINK-V3MINI ST STLINK-V3MINI
83 1 STEVAL-STWINKT1
Programming Cable(Included in ST-LINK)
- -
84 1 STEVAL-STWINKT1 Plastic Box - -
85 1 STEVAL-STWINKT1 480mAh Battery LiPo Himax LiPo-752535
86 4 STEVAL-STWINKT1 12mm M3 Pan head phillips -
steel - -
87 4 STEVAL-STWINKT1 M3 HEX Nut - steel - -
UM2622Bill of materials
UM2622 - Rev 1 page 34/40
Revision history
Table 6. Document revision history
Date Version Changes
11-Sep-2019 1 Initial release.
UM2622
UM2622 - Rev 1 page 35/40
Contents
1 STWIN kit components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2 Functional blocks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2.1 Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1.1 HTS221 humidity and temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1.2 LPS22HH MEMS pressure sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1.3 STTS751 digital temperature sensor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1.4 TS922 rail-to-rail, high output current, dual operational amplifier. . . . . . . . . . . . . . . . . . . . . 6
2.1.5 ISM330DHCX iNEMO IMU 3D Acc + 3D Gyro . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1.6 IIS3DWB wide bandwidth accelerometer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1.7 IIS2DH ultra-low power 3-axis high-performance accelerometer . . . . . . . . . . . . . . . . . . . . . 6
2.1.8 IIS2MDC 3-axis magnetometer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1.9 MP23ABS1 analog MEMS microphone. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1.10 IMP34DT05 digital MEMS microphone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Processing and connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2.1 STM32L4R9ZI Cortex-M4F 120MHz 640Kb RAM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2.2 SPBTLE-1S application module for Bluetooth v4.2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.2.3 STR485LV 3.3V RS485 up to 20Mbps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.2.4 USB connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.2.5 STSAFE-A100 (footprint only) authentication and brand protection secure solution . . . . . 10
2.2.6 microSD card socket . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.2.7 Clock sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.3 Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.3.1 Battery connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.3.2 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.3.3 Power ON/OFF procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.3.4 Power consumption evaluation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.4 Buttons, LEDs and connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.4.1 Flex expansion connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.4.2 STMod+ connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.4.3 Connectivity expansion connector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
UM2622Contents
UM2622 - Rev 1 page 36/40
2.4.4 Sensor expansion connector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.5 Protective plastic box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.6 STLINK-V3MINI debugger and programmer for STM32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3 STWIN assembly steps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
4 How to run the default Serial_DataLog application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
5 Schematic diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
6 Bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
UM2622Contents
UM2622 - Rev 1 page 37/40
List of figuresFigure 1. STEVAL-STWINKT1 SensorTile Wireless Industrial Node . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1Figure 2. STWIN Core System board top and bottom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2Figure 3. Protective plastic case . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2Figure 4. 480mAh 3.7V Li-Po Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3Figure 5. STLink-V3Mini Debugger/Programmer for STM32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3Figure 6. Programming cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3Figure 7. STEVAL-STWINKT1 functional block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4Figure 8. STEVAL-STWINKT1 functional block diagram of sensing elements and STM32L4R9ZIJ6 . . . . . . . . . . . . . . . . 4Figure 9. Core system board sensor locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5Figure 10. Main connectivity components and the STM32L4R9ZI processing unit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Figure 11. MCU and connectivity element locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Figure 12. Power and protection components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Figure 13. Power and protection component locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Figure 14. Battery and J4 connectors for VBAT supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Figure 15. Power circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Figure 16. Power monitoring points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14Figure 17. Buttons, LEDs and connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Figure 18. CN1 Flex connector top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Figure 19. STMod+ connector top views . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17Figure 20. CN3 connectivity connector top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Figure 21. CN4 sensor connector top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Figure 22. STLINK-V3MINI and STDC14 cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Figure 23. Exploded cad drawing of STWIN node components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20Figure 24. Optional magnets inserted in main case. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21Figure 25. Core system board inserted in main case. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21Figure 26. Core system board fastened with bolts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22Figure 27. STEVAL-STWINKT1 schematic - power. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24Figure 28. STEVAL-STWINKT1 schematic - connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25Figure 29. STEVAL-STWINKT1 schematic - sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26Figure 30. STEVAL-STWINKT1 schematic - MCU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27Figure 31. STEVAL-STWINKT1 schematic - audio, RS485, SD card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28Figure 32. STEVAL-STWINKT1 schematic - BLE, Wi-Fi, STSAFE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
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List of tablesTable 1. CN1 pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Table 2. STMod+ connector pin assignments and descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17Table 3. CN3 pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Table 4. CN4 pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Table 5. Bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30Table 6. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
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