APPLICATION NOTE

User Guide for Atmel ATA6870 and Atmel ATmega32HVBEvaluation Kit Hardware

ATA6870-DK10

Features

● Evaluation of Atmel® ATA6870

● Monitoring of 12 battery cells

● Monitoring:● Overvoltage (every cell)● Undervoltage (every cell)● Overheating● Overcurrent

● Open clamp detection

● 12-bit battery cell measurement

● 12-bit temperature measurement

● Controlling of charge/discharge FETs

● Status LEDs for easy evaluation

● Charge balancing

● Coulomb counting for SOC determination

Figure 1. Atmel ATA6870-DK10

9228C-AUTO-02/15

1. Introduction

The Atmel® ATA6870-DK10 is a demonstration board for the Atmel ATA6870, which offers an easy way to start evaluation of battery applications using the Atmel ATmega32HVB in combination with the Atmel ATA6870. The included software demonstrates implementation of a 12 Cell Battery Management System. The supplied code serves as an example of how to use the Atmel ATMega32HVB and Atmel ATA6870 together. The example is not a complete application intended for use with smart batteries, and it is best to use the devices in a slightly different way in a smart battery application.

2. Safety Precautions When Using Li-ion Batteries

Please observe the safety guidelines supplied with the batteries. If improperly used or defective, li-ion and polymer batteries and packs may explode and cause a fire.

3. Demonstration Board

The Atmel ATA6870-DK10 was developed to allow easy evaluation of control software for a microcontroller which controls multiple Atmel ATA6870s. The sample code supplied demonstrates a simple permanent running measurement of voltages and temperatures.

Figure 3-1. Board Concept

ATA6870

Cell 12

Cell 11

ATA6870

Monitoring (V,T)Coulomb counting

ATmega32HVB

Charge/Discharge

Control Unit

Cell 02

Cell 01

ATA6870-DK10 [APPLICATION NOTE]9228C–AUTO–02/15

2

3.1 System Start

Follow these steps to launch the system.

3.1.1 Installing the Hardware

● Connect the load/charger to be powered between pack+ and pack- on J1

● For demonstration purposes it is possible to use a resistor to simulate a load

● Connect the battery cell stack to the screw connectors on the demonstration board

● Led 1 indicates the enabled status of the demonstration board (controlled by microcontroller SW)

● In case of emulating cells such as a voltage divider, apply sufficient voltage (see Section 3.3 “Powering the Board” on page 5)

3.1.2 Number of Cells

It is possible to run the board with a reduced number of cells. The minimum voltage for each IC is 6.9V. Cell 1 and cell 6 (MBAT) have to be connected. The missing cells should be connected to the upper cell potential of the module. For further information refer to the Atmel ATA6870 datasheet Section 7.3: Reduced Number of Battery Cells Configuration. For the voltage range see Section 3.3 “Powering the Board” on page 5. If fewer than 6 cells are used per IC, the config.h file should be adjusted (CELLSIC# under General Setting). See Section 4.1 “Supplied Code” on page 7 for further information on how to configure the supplied software correctly.

3.2 The Demonstration Board

Figure 3-2. Evaluation Board with 2 Stacked Atmel ATA6870 and Atmel ATMega32HVB

3ATA6870-DK10 [APPLICATION NOTE]9228C–AUTO–02/15

3.2.1 On-board Features

The demonstration board includes the following items:

● 2 Atmel® ATA6870 QFN 7mm 7mm

● Atmel ATMega32HVB

● 12 external N-channel MOSFETs for balancing of battery cells

● Connectors

● ISP connector for programming/debugging the Atmel ATMega32HVB

● Screw connectors for connecting up to 12 battery cells

J9 should never be set while the Atmel ATmega32HVB is being programmed or while it is entering debug mode. It can be mounted as soon as AVR Studio prompts for additional SPI lines to be connected in debug mode or after the device has been correctly programmed.

Table 3-1. Connector Overview

J7 Function J8 Function

1 CELL- 1 VDDHVM

2 PACK- 2

3 3 VCC

4 VFET 4 GND

5 5 IRQ

6 GND 6 CLK

7 OD 7 MISO

8 OC 8 MOSI

9 RESET 9 SCK

10 GND 10 CS_N

J1 Connector for charger/device to be powered

J2 ISP connector

J3 Upper battery stack (cells 7-12)

J4 Bottom battery stack (cells 1-6)

J9 Jumper to enable/disable MISO line of Atmel ATA6870

ATA6870-DK10 [APPLICATION NOTE]9228C–AUTO–02/15

4

Figure 3-3. Connectors

3.3 Powering the Board

3.3.1 Power Supply

The board supports supply voltages from 13.8V (6.9V per Atmel ATA6870) to 60V. However, to run the board on voltages below 24V the ZDiode D3 needs to be replaced with a jumper to supply the Atmel® ATmega32HVB with sufficient voltage. If the jumper is mounted, the stack voltage should not exceed 48V! The Atmel ATmega32HVB supports operating voltage from 4V to 24V.

3.3.2 Emulating Cells

Battery cells can be emulated by connecting a voltage divider to the specified clamps. Section 3.1.1 “Installing the Hardware” on page 3 describes how to connect cells. The voltage limits for this setup are the same as for real batteries. Section 3.3.1 “Power Supply” on page 5 specifies these limits.

5ATA6870-DK10 [APPLICATION NOTE]9228C–AUTO–02/15

4. Software Description: Monitoring of Up to 12 Battery Cells

The supplied code is documented and easy to adjust for verifying the functions of the Atmel® ATA6870 and start BMS application development work.

After the board has been connected as described above the microcontroller automatically starts a cyclic measurement of voltages, temperature, and current. LED 1 indicates these cyclic measurements. It toggles in default operation. A continuously illuminated LED1 indicates an open clamp. See Section 4.2 “Open Cell Check” on page 7 for more information about open clamp detection. LED 2 indicates that for some reason the MOSFETS have been disabled. The default software disables the FETs in case of these events:

● Overvoltage (at least 1 cell exceeds the upper default threshold of 4.2V)

● Undervoltage (at least 1 cell exceeds the lower default threshold of 2.5V)

● Overcurrent (the current through the shunt exceeds the default threshold of 80mA)

● Overheating (the temperature exceeds the upper threshold, default value is 60°C)

● Low temperature threshold (the default threshold is -20°C)

LED 3 indicates whether the Atmel ATA6870s are turned on or not. An active LED indicates that the Atmel ATA6870s are enabled.

The Atmel ATmega32HVB has no clock divider to provide an external slower clock than 1/2 CPU clock. Requirement of Atmel ATA6870 is fCLK > 2 fSPI. Hence, the clock frequency of 1MHz is mandatory to provide a 500kHz clock for the ADCs of the Atmel ATA6870 and 250kHz for SPI.

Table 4-1. LED Functions

LED Function

LED 1Indicates clamp is open when permanently illuminatedIndicates cyclic measurements when blinking

LED 2 On indicates disabled MOSFETs for one of the reasons listed above

LED 3 On indicates active Atmel ATA6870

ATA6870-DK10 [APPLICATION NOTE]9228C–AUTO–02/15

6

4.1 Supplied Code

4.1.1 config.h

This section refers to the config.h file provided in the zip archive with this Application Note. Only values in the User Setting paragraph should be changed!

------------- GENERAL SETTING--------------------------------CELLSIC# Selecting which Cells are used Bits 0-5 -> Cells 1-6------------- TEMPERATURE SETTING----------------------------RES_REF# Value of the mounted reference resistor (default: 3300)T_TLS Temperature belonging to the first Value in the lookup

table (index 0, default: -20)T_TLE Temperature belonging to the last value in the lookup

table (default: 80)T_TLSZ Temperature step size used in the lookup table (default: 1)T_LOWERTHRESHOLD Lower temperature thresholdT_UPPERTHRESHOLD Upper temperature threshold ------------- COULOMBCOUNTER SETTING-------------------------SHUNT_RESISTANCE Value of the shunt resistor in mOhmRCC_CONVERSIONPERIOD The cycle times for the Regular Current Check

0x00 - 256ms (default)0x01 - 512ms 0x02 - 1s

0x11 - 2sRCC_DIVIDEDSZ 0x01 to enable divided Voltage (Current) stepsizeRCC_CHARGETHRESHOLD Threshold for charging current, exceeding the

threshold will turn off the MosfetsRCC_DISCHARGETHRESHOLD Threshold for discharging current, exceeding the

threshold will turn off the Mosfets

Other values should not be changed in the default HW setup!

4.2 Open Cell Check

The implemented function checks for open clamps by measuring the cell voltages two times. During the first check a normal measurement is completed and the values stored. During the second check the voltages are measured while the discharge function for all cells is active. If the two measurements for the same cell differ by more than 100mV it is very likely that one or more cells are not properly connected. The implemented method cannot be used to determine which cell is not properly connected. A continuously illuminated LED1 indicates an open clamp.

4.3 Voltage Measurements

The standard software loop measures the voltage ADC value and the offset ADC value for every cell and checks for overvoltage and undervoltage once per cycle. Further information about the acquiring of voltages can be found in the Atmel® ATA6870 datasheet Section 7.5.1. The formula for calculating the voltage:

Voltage (Cell) 4VVacq Voffset–

3031 Voffset–--------------------------------- =

7ATA6870-DK10 [APPLICATION NOTE]9228C–AUTO–02/15

4.4 Temperature Measurements

The default software only measures channel 1 of chip 1. The temperature sensors are based on a resistor divider using a standard resistor and an NTC resistor. This resistor divider is connected to the reference of the ADC for temperature measuring. Because the ADC is sharing the same reference value, the output of temperature measurement with ADC is ratio metric. Further information is found in the Atmel ATA6870 datasheet Section 7.5.3: Temperature Channel.

For this application Atmel recommends using Res_Ref1 = 3.3k and RES_NTC1 R25 = 10k, B = 3435. The software supplied for this board uses these values as default. The function uses a lookup table to determine the temperature. This table has to be edited if an NTC other than the recommended one is used. The values in the lookup table range from –20°C (index 0) to +80°C (index 100). These values can be edited via the config.h file in the User Settings section. More Information about this file can be found in Section 4.1 “Supplied Code” on page 7. The calculation of RES_NTC is carried out based on the formula provided in the Atmel ATA6870 datasheet Section 7.5.3:

When using another NTC, the LookupADC.txt has to be edited to match the NTC used.

4.5 State of Charge Measurements

Highly precise SOC measurement is possible by combining the features of the Atmel ATmega32HVB and the Atmel ATA6870. The coulomb counting feature of the Atmel ATmega32HVB enables highly precise measurements of the change in the state of charge. Frequent reading of the current in a shunt is used to update the SOC frequently. The acquired cell voltages and temperatures can be used to determine the SOC without the Atmel ATmega32HVB. The easiest way is to compare the SOC measured by the added/extracted charge with the calculated SOC using the cell voltage, temperature, and the data provided by the manufacturer of the cells. Further information regarding the coulomb counting ADC as well as an implementation suitable for the Atmel ATmega16HVA is found in Application Note AVR352.

4.6 Overcurrent Protection

The current through the shunt is calculated by measured voltage drop. The limit can be set via the CADRDC/CADRCC register. The step size depends on the settings of the CADCSRC register and the shunt used. For further information about limiting current see the Atmel ATmega32HVB datasheet Section 19.4: Regular Current Detection Operation. The supplied software allows the feature to be tested by adjusting the values in the config.h file. More Information about this file can be found in Section 4.1 “Supplied Code” on page 7. Values/part of the code should only be changed if you are aware of possible consequences. The default implementation continuously measures the current and generates an interrupt if the entered thresholds are exceeded. The thresholds are defined in the config.h file. The thresholds are written to the registers in the function CCinit in the Atmel ATA6870_func.c file. Refer to the features of the Atmel ATmega32HVB in the coulomb counter section to learn more about the time the controller waits for the values to be written.

adc (out) 2048 1RES_NTC(1)

(RES_NTC(1) + RES_REF(1))--------------------------------------------------------------------------- 8

15------ 8

10------–+

=

C Code Example

CADRCC = RCC_CADRCC;while(CADCSRA & (1 << CADUB));CADRDC = RDC_CADRDC;while(CADCSRA & (1 << CADUB));

// Charge Threshold// Wait values to be written// Discharge Threshold// Wait values to be written

ATA6870-DK10 [APPLICATION NOTE]9228C–AUTO–02/15

8

5. Features of the Atmel ATmega32HVB

Since the Atmel® ATmega32HVB is a part of the Atmel AVR® family which is dedicated to battery management there are several special features such as coulomb counting and the control of the two charge/discharge MOSFETs.

5.1 Coulomb Counter

The coulomb counter ADC runs on a different clock than the CPU. This clock is slower and therefore several things have to be kept in mind before using it. Writing several registers in sequence takes a long time depending on the delays between each write cycle. A possible solution is given in the supplied software example:

The Update Busy (CADUB) bit in CADSRA is cleared and written by hardware.

5.2 Charging/Discharging FETs

The two FETs are controlled by an N-channel FET driver. The pins (OC and OD) are designed for outputting a high voltage of approx. 13V. The status of the pins is controlled by software via the FCSR - FET control and status register.

The example above implements an easy method to enable or disable the two FETs independently of each other. For more information, see the Atmel ATmega32HVB datasheet page 148ff.

C Code Example

void CCinit(){

CADRCC = RCC_CADRCC;while(CADCSRA & (1 << CADUB));CADRDC = RDC_CADRDC;while(CADCSRA & (1 << CADUB));SETBIT(CADCSRB,1<<CADRCIE);while(CADCSRA & (1 << CADUB));

SETBIT(CADCSRC,RCC_DIVIDEDSZ<<CADVSE);while(CADCSRA & (1 << CADUB));

// Charge Threshold

// Discharge Threshold

// Interrupt Enable

// Voltage Scaling

SETBIT(CADCSRA,((1<<CADEN)|(1<<CADSE)|(RCC_CONVERSIONPERIOD<<1)));

while(CADCSRA & (1 << CADUB));}

// ADC Enable, RCC Mode, Sampling // Interval

C Code Example

void Configure_Fet(unsigned char Fet){

if(Fet&0x01)SETBIT(FCSR, (1<<DFE));

elseCLEARBIT(FCSR,(1<<DFE));

if(Fet&0x02)SETBIT(FCSR,(1<<CFE));

elseCLEARBIT(FCSR,(1<<CFE));

}

9ATA6870-DK10 [APPLICATION NOTE]9228C–AUTO–02/15

6. Power Consumption

There are several ways to reduce the power consumption of the Atmel ATA6870 and the Atmel ATmega32HVB. Sleep modes are documented in the datasheet of the Atmel ATA6870 Section 7.1.1 and in the Atmel ATmega32HVB datasheet Section 10. This board allows the Atmel ATA6870 to be enabled/disabled using the Atmel ATmega32HVB software. The pin PB2 is used to control a transistor for activating/deactivating the Atmel ATA6870. Other options which are not implemented are the use of interrupts and a timer (sleep between cycles).

ATA6870-DK10 [APPLICATION NOTE]9228C–AUTO–02/15

10

7. Schematic

Figure 7-1. Schematic

R59

1kΩR34

100Ω

DISCH5 MB

AT6

OD

MB

AT7

VD

DH

VIR

Q_I

NC

LK_O

UT

CS

_N_O

UT

SC

K_O

UT

MO

SI_

OU

T

CS

_N13 14 15 16 17 18 19 20 21 22 23 24

48 47 46 45 44 43 42 41 40 39 38 37

SC

KM

OS

IM

ISO

MFI

RS

TD

TST

SC

AN

MO

DE

CS

_FU

SE

VD

DFU

SE

DV

SS

DV

DD

GN

D

GN

D

DIS

CH

6

MIS

O_I

NP

D_N

VD

DH

VP

123456789

10

1211

MBAT5DISCH4MBAT4DISCH3MBAT3DISCH2MBAT2

MBAT1DISCH1

IC2

AtmelATA6870

IRQCLK

36123

J50Ω

D

S

G

3534333231302928272625

VDDHVMPD_N_OUTPOW_ENA

PWTSTBIASRES

TEMPREFTEMP2TEMP1

TEMPVSSAVSSAVDDATST

R40

C6

51kΩ

nc (33μF/50V)+

Q6FMMT620

121kΩ

GND_2GND_2GND_2

GND_2

GND_2

R55

R38

7.5kΩ

R4

10Ω/0.25W

R41 PB2

4.7kΩ

R58

1kΩ

R45

1kΩ

R46

1kΩ

R96

D2

MM3Z13VC

56kΩ

R109

56kΩ

R93

56kΩ

PACK+

R94

56kΩ

T18

ZXMN2F34FH

CELL+

CELL-

J3-7

R30

100Ω T14

ZXMN2F34FH

R33

100Ω T17

ZXMN2F34FH

R32

100Ω T16

ZXMN2F34FH

R31

100Ω

R29

100Ω T15

ZXMN2F34FH

T13

ZXMN2F34FH

J3-6

J3-5

J3-4

J3-3

J3-2

J3-1

J1-3

R270Ω

R8610Ω/0.25W

C3+

10μF30V

C19

100nF30V

C8

2.2μF25V

C5

100nF50V

C1+

10μF30V

C32

100nF30V

R39

10Ω/0.25W

R12

tbd

R37150Ω

R144.7kΩ

R104.7kΩ

D4LL4148

C10

100nF

Q7SQ2301ES

Q5IRF5210SPBF

Q4IRF5210SPBF

C33

10nF

R66

100k

Ω

C38

220nF

C11

100nF

C12

100nF

C13

100nF

C14

100nF

C15

100nF

GN

D_2

GN

D_2

GN

D_2

GN

D_2

GN

D_2

R49

R57

3.3k

kΩ

3.3k

kΩ

R52

R56

NTC

NTC

R47

1kΩ

R53

1kΩ

R54

1kΩ

R25

1kΩ

R190Ω

R11

100Ω

D1

D

G

G

S

S

D

MM3Z13VC

DISCH5 MB

AT6

MB

AT7

VD

DH

VIR

Q_I

NC

LK_O

UT

CS

_N_O

UT

SC

K_O

UT

MO

SI_

OU

T

CS

_N13 14 15 16 17 18 19 20 21 22 23 24

48 47 46 45 44 43 42 41 40 39 38 37

SC

KM

OS

IM

ISO

MFI

RS

TD

TST

SC

AN

MO

DE

CS

_FU

SE

VD

DFU

SE

DV

SS

DV

DD

GN

D

GN

D

DIS

CH

6

MIS

O_I

NP

D_N

VD

DH

VP

123456789

10

1211

MBAT5DISCH4MBAT4DISCH3MBAT3DISCH2MBAT2

MBAT1DISCH1

IC1

AtmelATA6870

IRQCLK

LED1

J9

PB2

RESET

CLK

SCKMOSIMISO

IRQCS_N

LED_0603

LED3

LED2

36123

J60Ω

3534333231302928272625

7

PA1 (ADC1/SGND/PCINT1)PA2 (PCINT2/T0)PA3 (PCINT3/T1)

PB0 (PCINT4/ICP00)

PB2 (PCINT6)

VCC

IC3ATMEGA32HVB

VCCVREGVREFVFET

PB3 (PCINT7)PB4 (SS/PCINT8)

PB5 (SCK/PCINT9)

PB1 (PCINT5/CKOUT)

PA0 (ADC0/SGND/PCINT1)8910

1436

64

121311

51535

3

4443

12

4218

OCOD

16

37

1727

2021222324252628

293031

246

VCC

3x2M

MOSIMISOSCK

RESET

J2

135

323334

41403938

19

VDDHVMPD_N_OUTPOW_ENA

PWTSTBIASRES

TEMPREFTEMP2TEMP1

TEMPVSSAVSSAVDDATST

C7

nc (33μF/50V)+

+

121kΩ

R21

R24

1kΩR18

nc

opt. ext.supply

TP1

R3

1kΩ

R5

1kΩ

T12

ZXMN2F34FH

Q2MMBT2222A

OC

J1-2

J1-1

J1-4

R954.7kΩ

Q1MMBT2222A

Q2NSS60601MZ4

D3BZV55C6V8-TP

J4-7

R6

100Ω T8

ZXMN2F34FH

R10

R22 nc 100Ω T11

ZXMN2F34FH

R9

100Ω T10

ZXMN2F34FH

R8

100Ω

R1

100Ω

R2

1kΩ

T9

ZXMN2F34FH

T7

ZXMN2F34FH

J4-6

J4-5

J4-4

J4-3

J4-2

J4-1

C16

100nF

C20

10nF

R44

100k

Ω

R17

5.1k

Ω

C24

C24

nc

220nFC17

100nF

C18

100nF

C21

100nF

C22

100nF

C23

100nFV

DD

_HV

M

VC

C

VC

C

R20

5.1k

Ω

VC

C

R13

R23

3.3k

Ω

3.3k

Ω

R77

R76

NTC

NTC

R7

1kΩ

R15

1kΩ

R16

C30 100nF

C27

100nF

C31

C34

100nF

100nF

C2 2.2μF

1kΩ

100ΩR89

R113RSENSE 1kΩR99

100ΩR91

1kΩR100PACK-

VFET

R881kΩ

R28 1kΩ

R35 1kΩ

R36 1kΩ

R26

10/0.25WΩ

PB6 (MOSI/PCINT10)PB7 (MISO/PCINT11)

PC0 (INT0/EXTPROT)PC1 (INT1)PC2 (INT2)

PC4 (SCL)PC5

PV1PV2PV3PV4

RESET/DW

PC3 (INT3/SDA)

BATTVCLMP10

GNDGNDGND

PIPPININNI

1CELL-

RSENSE

10x1F

J7

10x1F

J8Piggypack Board

for other Microcontroller

VDD_HVM

VCC

CLKIRQ

CS_NSCK

MOSIMISO

PACK-

VFET

ODOCRESET

2345678910

NVOCOD

PVT

NCNC

VREFGND

123456789

10

11ATA6870-DK10 [APPLICATION NOTE]9228C–AUTO–02/15

Figure 7-2. PCB Top

ATA6870-DK10 [APPLICATION NOTE]9228C–AUTO–02/15

12

Figure 7-3. PCB Bottom

13ATA6870-DK10 [APPLICATION NOTE]9228C–AUTO–02/15

8. Revision History

Please note that the following page numbers referred to in this section refer to the specific revision mentioned, not to this document.

Revision No. History

9228C-AUTO-02/15 Put document in the latest template

9228B-AUTO-10/12 Section 4.4 “Temperature Measurements” on page 8 updated

ATA6870-DK10 [APPLICATION NOTE]9228C–AUTO–02/15

14

XX X XX XAtmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200 | www.atmel.com

© 2015 Atmel Corporation. / Rev.: 9228C–AUTO–02/15

Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, AVR®, and others are registered trademarks or trademarks of Atmel Corporation in U.S. and other countries. Other terms and product names may be trademarks of others.

DISCLAIMER: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rightis granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALES LOCATED ON THEATMEL WEBSITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTSINCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENTSHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGESFOR LOSS AND PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HASBEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of thisdocument and reserves the right to make changes to specifications and products descriptions at any time without notice. Atmel does not make any commitment to update the informationcontained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel products are not intended,authorized, or warranted for use as components in applications intended to support or sustain life.

SAFETY-CRITICAL, MILITARY, AND AUTOMOTIVE APPLICATIONS DISCLAIMER: Atmel products are not designed for and will not be used in connection with any applications wherethe failure of such products would reasonably be expected to result in significant personal injury or death (“Safety-Critical Applications”) without an Atmel officer's specific writtenconsent. Safety-Critical Applications include, without limitation, life support devices and systems, equipment or systems for the operation of nuclear facilities and weapons systems.Atmel products are not designed nor intended for use in military or aerospace applications or environments unless specifically designated by Atmel as military-grade. Atmel products arenot designed nor intended for use in automotive applications unless specifically designated by Atmel as automotive-grade.