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Wrap Wrap - - up Report up Report 1. COTS / NON-STANDARD PARTS 2. RADIATION 3. RELIABILITY (FAILURE RATE) 4. QML / TRB 5. COOPERATION 6. FPGA OCT. 22, 2004 SUMIO MATSUDA Space Component Engineering Center

Wrap-up Report - JAXA · • British National Space ... Many rockets and sarellites projects use RTSX-S/ ... Fuses, etc. • Establish quality evaluation

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WrapWrap--up Reportup Report1. COTS / NON-STANDARD PARTS2. RADIATION3. RELIABILITY (FAILURE RATE)4. QML / TRB5. COOPERATION6. FPGA

OCT. 22, 2004

SUMIO MATSUDASpace Component Engineering Center

1. COTS / NON-STANDARD PARTS

DLR

4. 4. COTS proceduresCOTS procedures of CNESof CNES

Intervening parties :Intervening parties :

GoalGoal

French MultiFrench Multi--partnershippartnership

In progressIn progress

Other space agencies only for Other space agencies only for General Requirements Spec.General Requirements Spec.

Vivian BERNARD / 21 October 2004

17th MEWS

PROCEDURES SET ON COMMERCIAL PARTS, GIVING METHODOLOGYFOR SELECTION, PROCUREMENT AND ASSEMBLY PROCESS

Mission profileMission profileLEO orbits : around 750km LEO orbits : around 750km => low radiation exposure (estimation : 3 => low radiation exposure (estimation : 3 kradkrad))2 years in orbit2 years in orbitNo redundancy : only one OBC No redundancy : only one OBC

5. 5. MicrosatellitesMicrosatellites program program

What is MYRIADE project?What is MYRIADE project?

A generic platform conceived with COTS (equipments & A generic platform conceived with COTS (equipments & components)components)Several missions : Demeter (in orbit), Parasol (nearly launched Several missions : Demeter (in orbit), Parasol (nearly launched ……))Total weight of satellite (with payload) = about 130kgTotal weight of satellite (with payload) = about 130kgDimensions : about 60cm X 70cm x 100cmDimensions : about 60cm X 70cm x 100cm

=> Objective : to reduce space access costs for scientists => Objective : to reduce space access costs for scientists

Vivian BERNARD / 21 October 2004

17th MEWS

2. RADIATION

RADIATION• CHANGE DESIGN AND PROCESSES, BOTH

ARE VERY COSTLY IN THE ADVANCED TECHNOLOGIES.

• DESIGN FOR RADIATION TOLERANCE GIVES INCREASED COSTS FOR DESIGN TOOLS AND SOFTWARE.

• USAGE OF SHIELDING OR RAD PACKS ARE ALSO EXPENSIVE AND NOT VERY EFFICIENT AGAINST SOME TYPES OF RADIATION

3. RELIABILITY (FAILURE RATE)

RELIABILITY• NEW TECHNOLOGIES NOT INTENDED

FOR HIGH RELIABILITY SPACE MISSIONS

• DESIGN FOR LIMITED LIFE TIME ONLY

• TESTING LIMITED TO INTENDED APPLICATION

• NEW FAILURE MODES WITH NEW SUBMICRON TECHNOLOGIES

4. QML / TRB

XXIXXI

Defense Logistics AgencyDefense Logistics Agency Defense Supply Center ColumbusTaking the Lead in Land and Maritime Support

TRB Focus of Study• Qualification plans

– Pre determined– Individualized

• Process has reached targeted requirements • Review of historical data

– SPC– Commercial process– Life test– Screening Yields– TCI– Failure Analysis

XXIXXI

Defense Logistics AgencyDefense Logistics Agency Defense Supply Center ColumbusTaking the Lead in Land and Maritime Support

TRB Analysis of Data• Identification of test critical nodes,

– If critical to outcome, identify and control– Capability to assure low product defect rates– Control and understanding of assignable causes

• Long term Reliability : Unaffected or is improved• Process control

– Establish control limits at critical nodes• Knowledge of out of control conditions effect on reliability

– Establish relationship between field failures and test optimized

• Use of JEP-121 Guideline for MIL-STD-883 Screening & QCI Optimization

XXIXXI

Defense Logistics AgencyDefense Logistics Agency Defense Supply Center ColumbusTaking the Lead in Land and Maritime Support

Conclusion

• Class S is Rules Oriented– Many requirements and restrictions– Don’t think, just do– Just follow the rules

• Class V is Results Oriented – Fewer requirements and restrictions– Think first then do

• Review the old requirements against current process• Produce high reliability space product without unnecessary costs• Study, discuss, coordinate, approve and document enhanced

process

5. COOPERATION

5. SUMMARY(1)Luckily, I have discovered superior radiation-

resistance of InP and solar cells. We have developed high-efficiency InP and GaAs-on-Si solar cells and performed a space flight demonstration.

(2)We have also developed a break-through technology (DH-structure tunnel junction) for multi-junction solar cells.

(3) Based on our research results, the NEDO R&D project for high-efficiency multi-junction solar cells for terrestrial application has been started in Japan.

5. SUMMARY-Continued(4) In that project, high-efficiency InGaP/GaAs 2-

junction and InGaP/InGaAs/Ge 3-junction cells with AM0 efficiencies of 26.9% and 29.2%, respectively, have been developed and their technologies have been transferred for space use.

(5) We have sown seeds for high-efficiency and low-cost multi-junction concentrator solar cells and modules, flexible and high-efficiency thin multi-junction cells, and radiation-resistant thin-film CuInGaSe cells for space applications.

(6) However, I really expect that results from R&D on materials, devices, components and systems for space use will be transferred to terrestrial use in the similar way with the Apollo Project in USA.

SOLUTIONS?• MANY SPACE APPLICATIONS WILL

NOT NEED STATE OF THE ART COMPONENTS

• SUPPORT HIGH REL MANUFACTURERS

• EXTEND LIFE TIME OF COMPONENTS• STANDARDISE PART TYPES• DEFINE BUILDING BLOCKS

WAY FORWARD• STANDARDISATION

• INTERNATIONAL COOPERATION

• EXCHANGE OF INFORMATION

• WORLDWIDE MARKET

Key Focus Areas & Initiatives• Lead-Free Issues

– Lead-Free Issues Task Group (Task G02-02)– GEB2: Reducing the Risk of Tin Whisker Induced Failures in Electronic

Equipment– AIA Lead-free Aerospace Electronics Working Group (LAEWG)– Proposed JEDEC Test Method for Evaluating Tin Whisker Growth on Plated

Surfaces • Use of COTS Parts in Military and Aerospace Applications

– SSB-1: Guidelines for Using Plastic Encapsulated Microcircuits & Semiconductors– PEM Procurement Standardization (Task G97-03)– Aerospace Qualified Electronic Component (AQEC)– Design Guide for Satellite Parts (Task G98-03)

• Diminishing Manufacturing Sources and Material Shortages (DMSMS)– GEB1: DMSMS Management Practices– Diminishing Supplier Base for Space Qualified Parts

• Other Focus Areas– SD-18 Update Recommendations (Task G03-02)– Failure Rate Estimating Methods (Task G00-10)– RGA Testing (Task G95-04)– Long Term Dormant Storage (Task G03-03)

Collaborative Relationships

JC-13 Government Liaison• JC-13.1 Discrete Devices• JC-13.2 Microelectronic Devices• JC-13.4 Radiation Hardness Assurance and Characterization• JC-13.5 Hybrids, RF/Microwave, MCMJC-14 Quality & Reliability

US Government • DSCC• US Army• US Navy• US Air Force • NASA• DMEA• GIDEP• DMPG

Teaming

Europe & Asia• Japan Aerospace

Exploration Agency (JAXA)

• European Space Agency (ESA)

• British National Space Centre (BNSC)

• Deutsches Zentrum fürLuft- und Raumfahrte.V (DLR)

6. FPGA

6-1 Issue Statement

JAXA has not obtained sufficient information on the folloeing items:(1)How this failure was first detected(2)Response from U.S. users including Tiger Team

to the ACTEL’s comments of the failure(3)Failure investigation activities by U.S. users

other than Tiger Team and NASA(4)Inherent structure defects with MEC die?

6-2 Objective

The delegation is to confirm information obtained during the period 2004 MAPLD conference andto obtain as much new information as possible.

6-3 Impact at JAXA and conclusion

Many rockets and sarellites projects use RTSX-S/SX-A series FPGA. If these devices have largefailure rate, many of the world’s space activities willbe affected and Japanese space program will besignificantly delayed.

It is serious problem!!

So we would like to discuss about the possiblefailure mode of those devices and exchangeinformation with each other to mitigate the risk.

• All critical parts will be made in Japan.

• Promote export. (e.g. capacitors)

• Reduce costs by changing from QPL to QML.

• Use COTS such as automobile parts.

•Most of parts in the category are imported.Capacitors,

Resistors, Connectors, Oscillators

Resistors, Capacitors, etc.

Passive Parts

• Establish low risk and high quality parts procurement system

• Establish low risk and high quality parts procurement system.

• All critical parts will be made in Japan.

• Promote export.

• All critical parts will be made in Japan.

• Use domestic parts more than 40% of the total parts.

Goal(2010)

Hybrid ICsMMIC、MCM

• Introduce production of mixed lots with different ratings.

• Support parts suppliers dedicated to producing multiple types in small quantity.

• Develop with CNES jointly.

• All parts are imported except for solar cells.

DC/DCConvertersPW-MOSFETsSolar CellsAnalog Multiplexers

Power D

evices

PWBs, Relays, Switches, RF parts

TransistorsDiodes

MPUs、FPGAsSRAM

Item Implementation ApproachStatusCategory

• Establish quality evaluation technology for procurement.

•Majority of parts in this category are imported.

PWBs, Thermistors, Heaters, Fuses, etc.

• Establish quality evaluation technology for procurement.

• Most of parts in this category are imported.

Transistors, Diodes, etc.

• Reduce part types by implementing a system using LSIs. Increase the number of qualified parts.

• Promote use of COTS memories(collaboration with CNES).

• Used approx. 150 different parts per satellite.

• All critical ICs are imported except for MPUs.

ICs

Active Parts

10% of all parts shall be C

OTS in quantity and cost.

:Focused areas for this fiscal year

Status and Goal of SpaceStatus and Goal of Space--Use Electronic Parts ActivitiesUse Electronic Parts Activities

LongLong--Term Plan for SpaceTerm Plan for Space--Use Electronic PartsUse Electronic Parts

PWB, Relays, Switches, RF parts

PWB, Thermistors, Sensors, etc.

Capacitors, Resistors, Connectors, Oscillators

Resistors, Capacitors, etc.

Passive Parts

Target

Technology Trend

Hybrid ICs, MMICs, MCMs

DC/DCConvertersPowerMOSFETs

Solar CellsAnalogMultiplexers

Power D

evices

Transistors, Diodes

MPUs, FPGAsSRAMs (Memory)

Item 3rd Period 1st Period 2nd PeriodCategory

Transistors, Diodes, etc.

Dev.of.SI Devices Dev. of SIO

Devices

ICs

Active Parts

Silicon Devices

Dev. And Prod. of SOC

Maintain required parts as project qualified parts.MEMS(MMIC)

DevelopmentMiniaturization and Lightweight

Dev and sustain production of thin film cells.MEMS化(MMIC)

Dev. & Prod. of GaAs Devices

Promote use of COTS(collaboration with CNES)

Maintain off-shore alternative sources and establish quality evaluationtechnology for procurement.

Replace with ceramic capacitors except for special applications

Sustain domestic production.

Maintain off-shore alternative sources and establish quality evaluation technology for procurement.

Versatile available

parts.

10%of all parts shall be C

OTS in quantity and cost.

•Develop parts required for m

iniaturization and higher perform

ance of equipment.

•Sustain production capabilities of critical parts in Japan.2004 2010 2015

  SOI(Silicon On Insulator) Devices  SiC(Silicon Carbide) Devices

  Optical Netwrok Devices/ Wireless LAN Devices