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The 3-rd Work Meeting of the CBM -MPD STS Consortium
“Technical challenges of the CBM and MPDSilicon Tracking Systems 2009”
THE CABLES THE CABLES FORFOR THE CBM STSTHE CBM STS FROM FROM UKRAINEUKRAINE
June 1 - 4, 2009June 1 - 4, 2009Sortavala, Karelia, Russia
Scientific Research Technological Institute of Instrument Engineering Kharkov, Ukraine e-mail:
Session # 2:Session # 2:R&D of essential parts of the CBM R&D of essential parts of the CBM STSSTS
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SSD MODULESschematic view
e-mail: [email protected]
Sortavala, June, 2009
Schematic view of the arrangement for the sensor, analog cables and daisy-chain cables.
Double-deckanalog cable
Daisy-chaincable
Double-deckanalog cable
Two analog cables (for each side of sensor) with constant 116 µm pitch are laminated together with a lateral shift of 58 µm (effectively as a cable with 58 µm pitch).
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ANALOG CABLEbasic characteristics
e-mail: [email protected]
Sortavala, June, 2009
Material:foiled dielectric FDI-A-24 thickness: of Al layer 12 - 14 um of polyimide layer 10 um
Sensor bonding areaHybrid bonding
area (pitch-adapter)
Pitch of trace 116 um; 116 um;
Width of trace 36 - 44 um; 36 - 44 um;
Quantity of traces 512 512 (+bias)(+bias)
Expected resistance Rtr (0.5 ÷ 0.7) Ohm/cm;
Expected capacitance Ctr (0.3 ÷ 0.32) pF/cm.
Length: from 100 up to 550 mm
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ANALOG CABLEfirst pre-prototype
e-mail: [email protected]
Sortavala, June, 2009
A first iteration of analog cable has been designed and produced at our institute
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DAISY-CHAIN CABLEbasic characteristics
e-mail: [email protected]
Sortavala, June, 2009
Material:foiled dielectric FDI-A-20 thickness: of Al layer 8 - 10 um of polyimide layer 10 um
Pitch of trace 58 um; 58 um;
Width of trace 22 - 30 um; 22 - 30 um;
Quantity of traces 1024 1024 (+bias)(+bias)
Expected resistance Rtr (0.9 ÷ 1.4) Ohm/cm;
Expected capacitance Ctr (0.34 ÷ 0.40) pF/cm.
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DAISY-CHAIN CABLEfirst pre-prototype
e-mail: [email protected]
Sortavala, June, 2009
A first iteration of daisy-chain cable has been designed and produced at our institute
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SENSOR TOPOLOGYsensor CBM03
e-mail: [email protected]
Sortavala, June, 2009
The recommendations to topology of a sensor with allowance of capabilities for further assembly of flexible cables were
developed
N-side
P-side
Pitch of bond padsin two rows – 58 um
Pads dimension – 60 x 180 um
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KIND OF CONNECTIONSof daisy-chain cables to sensor
e-mail: [email protected]
Sortavala, June, 2009
TAB-bonding
(Pitch 58 um)
Sensorbonding area
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KIND OF CONNECTIONSof analog cables to sensor
e-mail: [email protected]
Sortavala, June, 2009
1. Ultrasonic bonding of Flexible cables to Sensor:
520 bonds (on both sides)
2. Bonds protection (Glue EpoTec T7110)
Type of wedges (Gaiser Tool )for single-point TAB bonding:GT1183-01710B
Pool strength: 6-8 gram
Bonds quality
0
2
4
6
8
10
1 1,2 1,4 1,6 1,8 2 2,2 2,4 2,6
Power
Po
ol
str
en
gth
, g
ram
T=10
T=10
T=30
T=40
T=50
T=60
Bonding of Cable to Sensor
The first researches of bonding of analog cables to a sensor were executed at assembly of the Demonstrator 0-b
The flexible cables(material - FDI-A-24)with a pitch of traces 100 um were used
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AUTOMATIC BONDER EM-4370
e-mail: [email protected]
Sortavala, June, 2009
Composition of EM-4370:1. Ultrasonic generator 2. Bonding equipment3. Table for electrical equipment4. Optical head5. Lighter6. Monitor7. Keyboard + manipulator “mouse”
Main parameters of EM-4370automatic wire bonder
– Al wire size: 18-50um;– bonding area: X Axis: 100 mm Y Axis: 200 mm Z Axis: 1.2 mm–placing of bonding objects in bonding position on X,Y, Z axis: moving of positioning table – total bond placement accuracy: 3.0 um– bond force: 5 - 120g– bond time: 1 - 250msec– bond power: 0 - 4W– amount of wires per program: more then 1000– amount of chips per module: no more then 10– ultrasonic frequency: 66kHz– power configuration: 230V, 50Hz– power consumption: 0.8kW– dimensions (W/D/H): 1200mmХ750mmХ1450mm– weight: no more then 400kg
11e-mail: [email protected]
Sortavala, June, 2009
KIND OF CONNECTIONSof analog cables to FEB
Analogcable
Output:Pitch 50.7 um(two rowsat 101.4um)
Kind of connection with using of pitch-adapter will ensure fan-in of Analog cable traces pitch from 116 microns to chip pads pitch 50 microns. In this case the Analog cable can be TAB-bonded to pitch-adapter pads; and the chips can be wire-bonded to pitch-adapter pads.
TAB-bonding
(Pitch 116um)
Wire-bonding
(Pitch 50.7um)
Input:Pitch 116um
Pitch-adapter
Sensor
Analog cable
Front-End Board
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POSSIBLE DESIGN OF A TWO-LAYER CHIP - CABLE FOR THE CHIP N-XYTER
e-mail: [email protected]
Sortavala, June, 2009
With the purpose of simplification of a FEB design at use of the n-XYTER chip
- it is possible to apply a two-layer chip-cable
Example of such cable
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POSSIBLE DESIGN OF A TREE-LAYER FLEXIBLE BOARD FOR FEB
e-mail: [email protected]
Sortavala, June, 2009
For mechanical Demonstrator 1-c the dummy FEBwith use of multi-layer aluminum-polyimide board can be made
Alumina base(rigid heat-sink)
Pitch-adapter
Bottom Flexible layer
TopFlexible layer
Double-layerchip-cablewith chip
ScreenFlexible layer
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CONCLUSIONS
e-mail: [email protected]
Sortavala, June, 2009
Now under development are design of daisy-chain cables and analog cables with allowance of new sensor topology.
The following tasks: - manufacture of the cables prototypes; - research of sequences and regimes of cable assembly.
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