1 The 3-rd Work Meeting of the CBM -MPD STS Consortium “Technical challenges of the CBM and MPD Silicon Tracking Systems 2009” THE CABLES FOR THE CABLES

1

The 3-rd Work Meeting of the CBM -MPD STS Consortium

“Technical challenges of the CBM and MPDSilicon Tracking Systems 2009”

THE CABLES THE CABLES FORFOR THE CBM STSTHE CBM STS FROM FROM UKRAINEUKRAINE

June 1 - 4, 2009June 1 - 4, 2009Sortavala, Karelia, Russia

Scientific Research Technological Institute of Instrument Engineering Kharkov, Ukraine e-mail:

[email protected]

Session # 2:Session # 2:R&D of essential parts of the CBM R&D of essential parts of the CBM STSSTS

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SSD MODULESschematic view

e-mail: [email protected]

Sortavala, June, 2009

Schematic view of the arrangement for the sensor, analog cables and daisy-chain cables.

Double-deckanalog cable

Daisy-chaincable

Double-deckanalog cable

Two analog cables (for each side of sensor) with constant 116 µm pitch are laminated together with a lateral shift of 58 µm (effectively as a cable with 58 µm pitch).

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ANALOG CABLEbasic characteristics



Material:foiled dielectric FDI-A-24 thickness: of Al layer 12 - 14 um of polyimide layer 10 um

Sensor bonding areaHybrid bonding

area (pitch-adapter)

Pitch of trace 116 um; 116 um;

Width of trace 36 - 44 um; 36 - 44 um;

Quantity of traces 512 512 (+bias)(+bias)

Expected resistance Rtr (0.5 ÷ 0.7) Ohm/cm;

Expected capacitance Ctr (0.3 ÷ 0.32) pF/cm.

Length: from 100 up to 550 mm

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ANALOG CABLEfirst pre-prototype



A first iteration of analog cable has been designed and produced at our institute

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DAISY-CHAIN CABLEbasic characteristics



Material:foiled dielectric FDI-A-20 thickness: of Al layer 8 - 10 um of polyimide layer 10 um

Pitch of trace 58 um; 58 um;

Width of trace 22 - 30 um; 22 - 30 um;

Quantity of traces 1024 1024 (+bias)(+bias)

Expected resistance Rtr (0.9 ÷ 1.4) Ohm/cm;

Expected capacitance Ctr (0.34 ÷ 0.40) pF/cm.

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DAISY-CHAIN CABLEfirst pre-prototype



A first iteration of daisy-chain cable has been designed and produced at our institute

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SENSOR TOPOLOGYsensor CBM03



The recommendations to topology of a sensor with allowance of capabilities for further assembly of flexible cables were

developed

N-side

P-side

Pitch of bond padsin two rows – 58 um

Pads dimension – 60 x 180 um

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KIND OF CONNECTIONSof daisy-chain cables to sensor



TAB-bonding

(Pitch 58 um)

Sensorbonding area

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KIND OF CONNECTIONSof analog cables to sensor



1. Ultrasonic bonding of Flexible cables to Sensor:

520 bonds (on both sides)

2. Bonds protection (Glue EpoTec T7110)

Type of wedges (Gaiser Tool )for single-point TAB bonding:GT1183-01710B

Pool strength: 6-8 gram

Bonds quality

0

2

4

6

8

10

1 1,2 1,4 1,6 1,8 2 2,2 2,4 2,6

Power

Po

ol

str

en

gth

, g

ram

T=10

T=10

T=30

T=40

T=50

T=60

Bonding of Cable to Sensor

The first researches of bonding of analog cables to a sensor were executed at assembly of the Demonstrator 0-b

The flexible cables(material - FDI-A-24)with a pitch of traces 100 um were used

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AUTOMATIC BONDER EM-4370



Composition of EM-4370:1. Ultrasonic generator 2. Bonding equipment3. Table for electrical equipment4. Optical head5. Lighter6. Monitor7. Keyboard + manipulator “mouse”

Main parameters of EM-4370automatic wire bonder

– Al wire size: 18-50um;– bonding area: X Axis: 100 mm Y Axis: 200 mm Z Axis: 1.2 mm–placing of bonding objects in bonding position on X,Y, Z axis: moving of positioning table – total bond placement accuracy: 3.0 um– bond force: 5 - 120g– bond time: 1 - 250msec– bond power: 0 - 4W– amount of wires per program: more then 1000– amount of chips per module: no more then 10– ultrasonic frequency: 66kHz– power configuration: 230V, 50Hz– power consumption: 0.8kW– dimensions (W/D/H): 1200mmХ750mmХ1450mm– weight: no more then 400kg

11e-mail: [email protected]


KIND OF CONNECTIONSof analog cables to FEB

Analogcable

Output:Pitch 50.7 um(two rowsat 101.4um)

Kind of connection with using of pitch-adapter will ensure fan-in of Analog cable traces pitch from 116 microns to chip pads pitch 50 microns. In this case the Analog cable can be TAB-bonded to pitch-adapter pads; and the chips can be wire-bonded to pitch-adapter pads.

TAB-bonding

(Pitch 116um)

Wire-bonding

(Pitch 50.7um)

Input:Pitch 116um

Pitch-adapter

Sensor

Analog cable

Front-End Board

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POSSIBLE DESIGN OF A TWO-LAYER CHIP - CABLE FOR THE CHIP N-XYTER



With the purpose of simplification of a FEB design at use of the n-XYTER chip

- it is possible to apply a two-layer chip-cable

Example of such cable

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POSSIBLE DESIGN OF A TREE-LAYER FLEXIBLE BOARD FOR FEB



For mechanical Demonstrator 1-c the dummy FEBwith use of multi-layer aluminum-polyimide board can be made

Alumina base(rigid heat-sink)

Pitch-adapter

Bottom Flexible layer

TopFlexible layer

Double-layerchip-cablewith chip

ScreenFlexible layer

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CONCLUSIONS



Now under development are design of daisy-chain cables and analog cables with allowance of new sensor topology.

The following tasks: - manufacture of the cables prototypes; - research of sequences and regimes of cable assembly.

15e-mail: [email protected], June, 2009

Thank you

for your attention

Documents

1 The 3-rd Work Meeting of the CBM -MPD STS Consortium “Technical challenges of the CBM and MPD Silicon Tracking Systems 2009” THE CABLES FOR THE CABLES