D.Websdale: RICH Meeting 3-11-99
1
RICH photodetector Cost estimates (summary):
Photodetectors CORE(TP) PAD Pixel MaPMT
N-tubesN-channelsN-active channelsCost per tube (SF)Cost/active channel (SF)
240368k368k
15,1009.84
21644236844236892504.52
45446489634685669909.15
3504237568224256
931+70(lens)15.66
Tube Total 3620k 1998k 3173k 3507k
D.Websdale: RICH Meeting 3-11-99
2
Electronics L0: CORE(TP) PAD Pixel MaPMT
Cost of F/E chip, hybridCost of Interface Boards, triggerand clock links
160k 212k 132k371k529k
L0-L1 links:
N-linksCost of links
11500140k
13824130k
14528137k
742470k
Electronics L1:
Cost of VME cards, trigger andclock links, M/plex and Readoutunits
900k 892k 356k 489k
L0/L1 Power supplies: 100k 100k 100k 100k
Electronics Total 1300k 1334k 725k 1559k
Costs: L0 and L1 Readout Electronics
D.Websdale: RICH Meeting 3-11-99
3
CORE(TP) PAD Pixel MaPMT
TOTAL: 4.92M 3.33M 3.90M 5.07M
Cost/active channel (SF) 13.3 7.5 11.2 22.6
TOTAL COST:Including spares andcontingency
4.92M 4.06M 4.72M 6.00M
Cost relative to CORE -17% -4% +22%
Total Cost: Photodetectors and Readout
D.Websdale: RICH Meeting 3-11-99
4
Photodetector Costs (detail) 2.11.99
TubeCosts:
PAD Pixel MaPMT
Hardware Hardware HardwareEnvelopeBaseplateCeramic/drillingSilicon SensorSCTA128:16x130SF
14704404005002080
Pixel chipSi SensorCarrier
500 100 100
TubeLens
93170
Production costs Production costsPreparation ofsealAssembly/Bonding(8hr)Prep facilitiesand consumablesPC depositionfacilitiesManpower
300
600
180
1280
2000
AnodeassemblyBump-BondingTube (DEP)
300
1005890
Single tube
Total tubecost
9250
216 x = 1998k
6990
454 x = 3173k
1001
3504 x = 3507k
D.Websdale: RICH Meeting 3-11-99
5
L0 Elect.F/E chipF/E hybridInterface/Adapter BoardsTTC/DCSTrigger/Clocklinks(fibre)
Included in tubeIncluded in tube216 x 700SF
216 x 100SF216 x 180SF
151.2k
21.6k39.2k
In tubeIn tube227 x 300SF
227 x 100SF227 x 180SF
68.1k
22.7k40.9k
1856x 130SF1856x 70SF232 x 2kSF
232 x 100SF232 x 180SF
241.3k129.9k464.0k
23.2k41.8k
Total L0cost
212.0k 131.7k 900.2k
L0/L1 Links 13824 x 9.4SF 130k 14528x 9.4SF 137k 7424x 9.4SF 70k
L1 Electr.9U VME boardsTrigger/Clocklinks (fibre)VME crates +P/STTC/DCSMultiplexersReadout Units
144 x 5kSF144 x 180SF
9 x 10kSF144 x 100SF9 x 2.5kSF4 x 5kSF
720k25.9k
90k14.4k22.5k20k
57 x 5kSF57 x 180SF
4 x 10kSF57 x 100SF4 x 2.5kSF3 x 5kSF
285k10.3k
40k5.7k10k15k
78 x 5kSF78 x 180SF
5 x 10kSF78 x 100SF5 x 2.5kSF3 x 5kSF
390k14.0k
50k7.8k12.5k15k
Total L1cost
892.8k 356.0k 489.3k
Costs: L0/L1 Electronics (detail)
D.Websdale: RICH Meeting 3-11-99
6
Tasks requiring human resources, not included in Cost Estimate:
PAD-HPD
R&D: Development of SCTA128 (common with VTX) [1 iteration]Development and testing of prototype tubes
Pre-prod: Design and commissioning of 2 optimised deposition facilities.
Production: Testing of production Anode components.Supervision of production process.
Post-prod: Testing of completed HPDs and readout.
D.Websdale: RICH Meeting 3-11-99
7
Tasks requiring human resources, not included in Cost Estimate:
Pixel-HPD
R&D: Testing of Pixel chip (common with ALICE)Development of Pixel chip (LHCb specific) [1 iteration]Development and testing of prototype tubes
Production: Testing of production Anode components
Post-prod: Testing of completed HPDs and readout
D.Websdale: RICH Meeting 3-11-99
8
Tasks requiring human resources, not included in Cost Estimate:
MaPMT:
R&D: Development of SCTA128 (common with VTX) [1 iteration]Adaptation of SCTA128 for MaPMT signals [1 iteration]Development of FE boards
Pre-prod: Testing of FE chips
Production: Assembly of modules
Post-prod: Testing assembled MaPMT modules and readout
D.Websdale: RICH Meeting 3-11-99
9
RISK LIST PAD Pixel PMT
Dependence on single supplier x xFluctuation of cost estimate xQE specification not in quotation x xDevelopment of appropriate LHCb F/E chip x x xOperation of tube with encapsulated chip x xBump-bonding xDetection efficiency with final electronics to be confirmed x x xYield of tubes with good QE xStability/Reproducibility of production process
x
Timescale for production xLong-term stability x x xB-field shielding x x xCross-talk from large signals xRisks associated with binary readout xMapping of electron optics in-situ (is it necessary ?)
x x
Operation of tube at high voltage xBaseline stability of F/E chip (related to overshoot/occupancy)
x x
L0-L1 data Links (analogue) x xL1-connection density (finance) x xMounting problems in RICH1 x x xTight tolerances in integration x