D.Websdale: RICH Meeting 3-11-99

1

RICH photodetector Cost estimates (summary):

Photodetectors CORE(TP) PAD Pixel MaPMT

N-tubesN-channelsN-active channelsCost per tube (SF)Cost/active channel (SF)

240368k368k

15,1009.84

21644236844236892504.52

45446489634685669909.15

3504237568224256

931+70(lens)15.66

Tube Total 3620k 1998k 3173k 3507k

D.Websdale: RICH Meeting 3-11-99

2

Electronics L0: CORE(TP) PAD Pixel MaPMT

Cost of F/E chip, hybridCost of Interface Boards, triggerand clock links

160k 212k 132k371k529k

L0-L1 links:

N-linksCost of links

11500140k

13824130k

14528137k

742470k

Electronics L1:

Cost of VME cards, trigger andclock links, M/plex and Readoutunits

900k 892k 356k 489k

L0/L1 Power supplies: 100k 100k 100k 100k

Electronics Total 1300k 1334k 725k 1559k

Costs: L0 and L1 Readout Electronics

D.Websdale: RICH Meeting 3-11-99

3

CORE(TP) PAD Pixel MaPMT

TOTAL: 4.92M 3.33M 3.90M 5.07M

Cost/active channel (SF) 13.3 7.5 11.2 22.6

TOTAL COST:Including spares andcontingency

4.92M 4.06M 4.72M 6.00M

Cost relative to CORE -17% -4% +22%

Total Cost: Photodetectors and Readout

D.Websdale: RICH Meeting 3-11-99

4

Photodetector Costs (detail) 2.11.99

TubeCosts:

PAD Pixel MaPMT

Hardware Hardware HardwareEnvelopeBaseplateCeramic/drillingSilicon SensorSCTA128:16x130SF

14704404005002080

Pixel chipSi SensorCarrier

500 100 100

TubeLens

93170

Production costs Production costsPreparation ofsealAssembly/Bonding(8hr)Prep facilitiesand consumablesPC depositionfacilitiesManpower

300

600

180

1280

2000

AnodeassemblyBump-BondingTube (DEP)

300

1005890

Single tube

Total tubecost

9250

216 x = 1998k

6990

454 x = 3173k

1001

3504 x = 3507k

D.Websdale: RICH Meeting 3-11-99

5

L0 Elect.F/E chipF/E hybridInterface/Adapter BoardsTTC/DCSTrigger/Clocklinks(fibre)

Included in tubeIncluded in tube216 x 700SF

216 x 100SF216 x 180SF

151.2k

21.6k39.2k

In tubeIn tube227 x 300SF

227 x 100SF227 x 180SF

68.1k

22.7k40.9k

1856x 130SF1856x 70SF232 x 2kSF

232 x 100SF232 x 180SF

241.3k129.9k464.0k

23.2k41.8k

Total L0cost

212.0k 131.7k 900.2k

L0/L1 Links 13824 x 9.4SF 130k 14528x 9.4SF 137k 7424x 9.4SF 70k

L1 Electr.9U VME boardsTrigger/Clocklinks (fibre)VME crates +P/STTC/DCSMultiplexersReadout Units

144 x 5kSF144 x 180SF

9 x 10kSF144 x 100SF9 x 2.5kSF4 x 5kSF

720k25.9k

90k14.4k22.5k20k

57 x 5kSF57 x 180SF

4 x 10kSF57 x 100SF4 x 2.5kSF3 x 5kSF

285k10.3k

40k5.7k10k15k

78 x 5kSF78 x 180SF

5 x 10kSF78 x 100SF5 x 2.5kSF3 x 5kSF

390k14.0k

50k7.8k12.5k15k

Total L1cost

892.8k 356.0k 489.3k

Costs: L0/L1 Electronics (detail)

D.Websdale: RICH Meeting 3-11-99

6

Tasks requiring human resources, not included in Cost Estimate:

PAD-HPD

R&D: Development of SCTA128 (common with VTX) [1 iteration]Development and testing of prototype tubes

Pre-prod: Design and commissioning of 2 optimised deposition facilities.

Production: Testing of production Anode components.Supervision of production process.

Post-prod: Testing of completed HPDs and readout.

D.Websdale: RICH Meeting 3-11-99

7

Tasks requiring human resources, not included in Cost Estimate:

Pixel-HPD

R&D: Testing of Pixel chip (common with ALICE)Development of Pixel chip (LHCb specific) [1 iteration]Development and testing of prototype tubes

Production: Testing of production Anode components

Post-prod: Testing of completed HPDs and readout

D.Websdale: RICH Meeting 3-11-99

8

Tasks requiring human resources, not included in Cost Estimate:

MaPMT:

R&D: Development of SCTA128 (common with VTX) [1 iteration]Adaptation of SCTA128 for MaPMT signals [1 iteration]Development of FE boards

Pre-prod: Testing of FE chips

Production: Assembly of modules

Post-prod: Testing assembled MaPMT modules and readout

D.Websdale: RICH Meeting 3-11-99

9

RISK LIST PAD Pixel PMT

Dependence on single supplier x xFluctuation of cost estimate xQE specification not in quotation x xDevelopment of appropriate LHCb F/E chip x x xOperation of tube with encapsulated chip x xBump-bonding xDetection efficiency with final electronics to be confirmed x x xYield of tubes with good QE xStability/Reproducibility of production process

x

Timescale for production xLong-term stability x x xB-field shielding x x xCross-talk from large signals xRisks associated with binary readout xMapping of electron optics in-situ (is it necessary ?)

x x

Operation of tube at high voltage xBaseline stability of F/E chip (related to overshoot/occupancy)

x x

L0-L1 data Links (analogue) x xL1-connection density (finance) x xMounting problems in RICH1 x x xTight tolerances in integration x