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2.5’’ SSD Low Profile
Preliminary Evaluation
PDR
Maxim Birger
Nov 2011
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Capacity and Mechanical evaluation
Performance evaluation
Input Power Path and Fault Condition Supply
Agenda
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2.5’’ Form Factor, Low Profile 7mm thickness
400GB/800GB SKUs
Chipset
Boss MSP6001
MCP (MSP2025 + Hynix F20B ODP/QDP)
DDR3 SDRAM (Gen2)
Power
Operation from 5V/12V supply
BUCK regulators with integrated inductors
Fault condition power source
Features (preliminary)
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800GB Configuration
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400GB – Configuration 1
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400GB – Configuration 2
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Connectivity – SSD mode (SHC like)
/8/ToggleFlash
MSP2025
/8/
Master Channel
Slave Channel
/8/ Flash
Flash
Flash
Internal
I/F
Internal
I/F
100MHz,
200MBPs
One Channel Connectivity
/8/ToggleFlash
MSP2025
/8/
Master Channel
Slave Channel
/8/ Flash
Flash
Flash
Internal
I/F
Internal
I/F
100MHz,
200MBPs
Two Channels Connectivity
Toggle/8/
100MHz,
200MBPs
Boss
Boss
Channel 1
Channel 1
Channel 2
8 x CE
1 x RnB
8 x CE
1 x RnB
8 x CE
1 x RnB
8 x CE
1 x RnB
SSD mode (SHC like)
Single host channel
operation
Reduced layout
complexity – single
MCP connection
Boss and MSP2020
support mixed-mode
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SHC vs. BHC
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Performance
Boss IO external limitations based on throughput calculations
Board layout and load capacitance not taken into consideration
800GB 400GB 400GB
MCPPackage MSP2025 + F20 ODP MSP2025 + F20 ODP MSP2025 + F20 QDP
MCP # 16 8 16
FlashDie size 8GB 8GB 8GB
Die # (per 2 ch) 8 8 4
SSD configuration 16x (8x8GB) MCP = 1024GB 8x (8x8GB) MCP = 512GB 16x (4x8GB) MCP = 512GB
Internal channel clock/data rate
ASYNC SDR 80MHz/ 80MBps
SYNC DDR SE 166MHz/ 333MBps
SYNC DDR2 DIFF 200MHz/ 400MBps
External channel configuration 2x (8x8GB) MCP = 128GB 1x (8x8GB) MCP = 64GB 2x (4x8GB) MCP = 64GB
PPN1.5/MSP channel limitationDDR Diff + Vref 166MHz/333MBps
DDR SE, no Vref 100MHz/200MBps
MSP external limitations -Single channel
Seq. read 200MBps 200MBps 200MBps
Seq. program 152MBps ? 152MBps ? 160MBps ?
CC 84MBps ? 84MBps ? 112MBps ?
SSD overall througputon external
Seq. read 1.6GBps 1.6GBps 1.6GBps
Seq. program 1.2GBps 1.2GBps 1.28GBps
SSD overall througput on SATA
Seq. read
Gen2 performanceSeq. program
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Mechanics – 800GB/ 400GB-2
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Mechanics – 400GB-1
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Main and Fault Condition Power
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Fuse – Short circuit protection
Sense resistor – OVC protection
Charge voltage/current meter – OV/UV detection
Regulators control
Discharge circuit
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Cap module features
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Constant Power Load Discharge
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Drive power consumption = 6W (0.12 - 0.18 joule)
Time to shutdown = 20ms < t < 30ms
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Energy vs. Capacitance
Time to
shutdown
Energy Charge voltage Capacitance
20ms 0.14 joule 40V 189µF
20ms 0.14 joule 50V 118µF
30ms 0.21 joule 40V 284µF
30ms 0.21 joule 50V 177µF
Calculation based on ESR value of 0.68Ω, and Buck efficiency 85%
Calculation doesn’t take spare energy into consideration
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Aluminum Electrolytic Caps
Tantalum Fused Caps – Availability issues in low profiles
Ceramic Caps – Area consuming (Not a good option!)
ASMLC – Custom Lead and Packaging ceramic Caps
Various dielectrics – Expensive, min. q-ty and long L/T
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Form Factor Energy sources
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Available Caps
Manuf. P/N CAP [μF] TOL [%] VDC [V] ESR [ohm] DielectricøD [mm]
L xW [mm] H [mm]
Panasonic EEEFT1H470AP 47 ±20% 50 0.68 Electrolytic 6.3 5.8±0.3
CDE CornellAVES226M50D16T-F 22 ±20% 50
9(1 total) Electrolytic 6.3±0.5 5.3±0.2
Surge 47 ±20% 50V Electrolytic 8±0.5 5±1
XICON L50V33 33 ±20% 50V Electrolytic 8 ±1 5 ±0.5
http://www.cde.com/catalog/alum/#radial_leaded
www.xicon-passive.com
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Expected Lifetime:
~2 years @ 75°C
~3.5 years @ 65°C
~5 years @ 60°C
Capacitance vs. Size efficiency
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Aluminum Electrolytic - Panasonic
47uF/50V
6.3x5.8
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TBD
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Aluminum Electrolytic - CDE
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Capacitor physical size and life time
Performance
Capacitor module – open circuit detection
Cost
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Open Issues
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Thank you!