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DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.
© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 1
Electronic Costing & Technology Experts
www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]
April 2015 – Version 1 – Written by Sylvain Hallereau
STMicroelectronics HTS221 Humidity and Temperature Sensor
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Glossary1. Overview / Introduction 4
– Executive Summary– Reverse Costing Methodology
2. Company Profile 7– STMicroelectronics – HTS221 Characteristics
3. Physical Analysis 14– Synthesis of the Physical Analysis– Physical Analysis Methodology– Package
– Package Views, Dimensions & Pin Out– Package Opening– Wire Bonding Process– Package Cross-Section
– ASIC Die– View, Dimensions & Marking– Delayering– Main Blocks Identification– Cross-Section – Process Characteristics
– Humidity Sensor Die– View, Dimensions & Marking– Bond Pad Opening & Bond Pad– Cap Removed & Cap Details– Sensing Area Details– Cross-Section (Sensor, Cap & Bonding)– Process Characteristics
– Humidity Sensor Comparison– STMicroelectronics HTS221– Sensirion SHTC1– Bosch BME280
4. Manufacturing Process Flow 70– Global Overview– ASIC Front-End Process– Humidity Sensor Process Flow– Wafer Fabrication Unit– Packaging Process Flow– Package Assembly Unit
5. Cost Analysis 87– Synthesis of the cost analysis– Main steps of economic analysis– Yields Hypotheses– ASIC Front-End Cost– ASIC Back-End 0 : Probe Test & Dicing– ASIC Wafer & Die Cost– Humidity Sensor Front-End Cost– Humidity Sensor Front-End Cost per process steps– Humidity Sensor Back-End 0 : Probe Test & Dicing– Humidity Sensor Wafer & Die Cost– Back-End : Packaging Cost– Back-End : Packaging Cost per Process Steps– Back-End : Final Test & Calibration Cost– HTS221 Component Cost– Humidity Sensor Cost Comparison
6. Estimated Price Analysis 116– Manufacturer Financial Ratios– Estimated Selling Price
Contact 121
STMicroelectronics HTS221 Humidity and Temperature Sensor
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© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 3
• This full reverse costing study has been conducted to provide insight on technology data,
manufacturing cost and selling price of the STMicroelectronics HTS221 Humidity and Temperature
Sensor.
• It is the first MEMS Humidity and Temperature manufactured by STMicroelectronics for consumer
applications. It combines a 16-bit humidity and temperature sensor in a 2.0x2x0.9mm LGA package.
• The HTS221 integrates a humidity sensor die and an ASIC die. The package is built around an
original holed cap developed by STMicroelectronics. The HTS221 has a temperature range of -40 to
+12°C.
• The sensor die calibration is directly implemented on the die.
• With its heater mode and a reference capacitor, the HTS221 offers a high output data rate of 12
measures per second.
• The HTS221 applications: Air conditioning, heating and ventilation, Air humidifier, Refrigerators,
Wearable devices, Smart home automation, Industrial automation.
STMicroelectronics HTS221 Humidity and Temperature Sensor
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© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 4
The reverse costing analysis is conducted in 3 phases:
Teardown analysis
• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.
Costing analysis
• Setup of the manufacturing environment• Cost simulation of the process steps
Selling price analysis
• Supply chain analysis• Analysis of the selling price
STMicroelectronics HTS221 Humidity and Temperature Sensor
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© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 5
Package top view Package bottom view
Package Side View
2mm
0.9mm
2.0mm
• Marking: H423• Package: HLGA 6-pin (Top-Holed Cap Land Grid Array)
• Dimensions: 2 x 2 x 0.9mm
• Pin Pitch: 0.5mm
STMicroelectronics HTS221 Humidity and Temperature Sensor
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© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 6
• Polysilicon capacitors are present on the circuit.
Polysilicon/Silicon Capacitors – SEM View
Polysilicon/Silicon Capacitors – SEM View
Die Overview
STMicroelectronics HTS221 Humidity and Temperature Sensor
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© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 7
• The die marking includes the logo of STMicroelectronics and:
HSC6
Humidity Sensor Die Marking
STMicroelectronics HTS221 Humidity and Temperature Sensor
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© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 8Capacitor element – SEM View
MEMS Cap
MEMS Sensor
Al-Ge alloy
Package Molding
Reference Capacitor Cross-Section Overview
Cavity
112µm
Oxide ringOxide ring
Capacitor element – SEM View
STMicroelectronics HTS221 Humidity and Temperature Sensor
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© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 9
Sensing polyimide
Insulating Oxide
Tantalum
drawing not to scale
Aluminum
STMicroelectronics HTS221 Humidity and Temperature Sensor
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© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 10
ASICFront-End Cost
ASICProbe Test Cost
ASICThinning & Dicing Cost
Packaging Cost
Final Test Cost
Humidity Sensor
MEMSFront-End Cost
MEMSProbe Test Cost
MEMSDicing Cost
• We perform the economic analysis of the IC with the IC Price+ tool.
• We perform the economic analysis of the MEMS and packaging with the MEMS CoSim+ tool.
STMicroelectronics HTS221 Humidity and Temperature Sensor
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© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 11
STMicroelectronics HTS221 Humidity and Temperature Sensor
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© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 12
STMicroelectronics HTS221 Humidity and Temperature Sensor
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© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 13
Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.
Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated).
These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:
• Consulting and Specific Analysis
– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.Email: [email protected]
– Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.Email: [email protected]
– RoW: Jean-Christophe Eloy, President & CEO, Yole DéveloppementEmail: [email protected]
• Report business
– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.Email: [email protected]
– Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service Email: [email protected]
– Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.Email: [email protected]
– Korea: Hailey Yang, Business Development Manager, Korean OfficeEmail: [email protected]
• Financial services
– Jean-Christophe Eloy, CEO & PresidentEmail: [email protected]
• General
– Email: [email protected]
