WP1 Gateway HW Design & Implementation

WP1GatewayHWDesign&ImplementationLEADER: EUROTECH

INVOLVEDPARTNERS: ATOS, SKYWATCH, BIOASSIST, MOBISTAR, L IBEL IUM

AGILEKICK-OFFMEETING,12-14January2016,TrentoIT

WP1Objectives(recap)Mainobjective:

specification, designandimplementationofthehardwareofthemodular gateway.

Themodulargateway:• willbeavailableintwoversions:• the“makers”versionbasedonRaspberryPi;• theindustrialversionwithanewHWdesignbasedonIntelarchitecture.

• willbebasedonasetofcoreandexpansionmodules:• coremodules:carriermodule,cpumodule,thestoragemoduleorthepowersupply,etc.;

• extensionmodules:thecommunicationmodules,sensingmodules,etc..


WP1Objectives(recap2)Addresstwolevelsofmodularity:• modularityforexistingHW:anexpansionmodule(shield)allowstheRPi tobeextendedwithnewmodules;

• intrinsicmodularity:inthe industrialgatewayanyarchitecturalelement isamodule.

Hardwaremoduleinteroperability:❓ identifytheHWtechnologiesthatsimplifyandpromoteinteroperability;❓ specifyasetofruletofollowduringmodulesdesignanddevelopment.

Hardwareprototypes development:• Implementasetofprototypesofthe“makers”gateway;• Implementasetofprototypesoftheindustrialgateway;• implement asetofexpansionmodulesthatwillbeadoptedinthepilots.


WP1- StatusT1.1 Wehavetostartcollectingtherequirement fromWP8:taskendsatM5.

T1.2Maker’sGatewaydesign:ongoing.

T1.3 DesignofindustrialGateway:ongoing.

Nextdeadlines:◦ M6- D1.1AGILEGatewayarchitecturespecificationsandinitialdesign◦ Gatewayrequirements,designspecificationandinitialarchitecturaldesignforboththeindustrialandmakersversion.


WP1- Timeline

• D1.1- AGILEGatewayarchitecturespecificationsandinitialdesignGatewayrequirements,designspecificationandinitialarchitecturaldesignforboththeindustrialandmakersversion.

• D1.2- AGILEGatewayhardwarefinalprototypes2ndAGILERelease– HardwarePlatformFinaldesigns,featuresandfunctionalspecificationsofthehardwareprototypes.DeliveryofthefinalAGILEGatewayprototypes.

• MS1- AGILEInitialDesignMS1&DraftFrameworkReleaseInitialdesignoftheAGILEplatform(SWandHW)andreleaseofadraftversionoftheAGILEframework(sw andbasichw builtonexistingprototypingplatforms).

• MS2- AGILEFramework(SWandHW)release&InitialIntegrationDeliveryoftheAGILEplatform(softwarecomponents,makersandindustrialgatewayprototypes)andtheinitialintegrationofthesoftwarecomponents.


DesignmethodologyDesignformodularity (DFM):DFMfollowstheemerging trendinHWdesignandmanufacturing knownas“BuildtoOrder”.◦ BTOproductsarenotbuiltuntilaconfirmedorderforproductsisreceived.◦ WeextendBTOalsotothedesignphase(notonlymanufacturing).◦ Traditionally,BTOisthemostappropriateapproachusedforhighlycustomizedorlowvolumeproducts.

◦ DFMallowstomapacustomdesigninadesignbasedonstandardmodules!

WhyBTO?Modularityhasacostandisonlypartiallycoveredbythehighercostofacustomproduct.

DFM&BTOobjectives:◦ reducetheeffectsoffixedcosts;◦ reducethedevelopmentcosts;◦ offercustomproductswithlowercosts.

Twodifferenttypesofmodularity:◦ modularityforexistingHW- anexpansionmodule(shield)allowstheRPi tobeextendedwithnewmodules;

◦ intrinsicmodularity- intheindustrialgatewayanyarchitecturalelementisamodule.

DFMMethodology(design&dev)1. Analysisofthecompanyexpertise,background,verticalmarkets, customers,etc..

2. Requirementsdefinition intermsof:◦ systemfunctionalities,◦ targetprice,◦ leadtime,◦ lifecycle.

3. Referencepartitioning ofthesystemarchitecture.

4. Designreviewandoptimizationbasedonthetargetverticals:1. technicalaspects,2. manufacturing,stockingplanningandoperationaspects,3. verticalevaluation.Itprovidesasetoftrade-off,adjustmentsandcostsbalancing.

5. Referencepartitioning refinement.

6. Consolidatedmodulardesign(basedonoff-the-shelfmodulesand/orcustommodules).

DFMMethodology(productimplementation)Customergatewaydesignandmanufacturing.

1. Customerrequirementsanalysis.

2. Mapping/fittingoftherequirementsonthegatewayconsolidateddesign.

3. Implementationchoicesaboutmodules:◦ thefunctionalmodulebecomesaphysicalmodule;◦ thefunctionalmoduleisintegratedonthecarrier;◦ thefunctionalmoduleisintegratedinSoC.

4. Potentialcustommodulesdevelopment.

5. Finaldesignofthecustomergateway.

WP1- Makersgateway


FIRSTDESIGN

•Architecture&Configurationdefined

•ShieldforRaspberryPiindesign• Workingonfirstprototype• 2modulestobepluggedontopofRaspPi• RaspberryPiGPIOsaccessible forsensors

•HotSwapà Allowedbypressingbutton• Thegatewayisabletorecognizewhichmodule(amongthelistofsupportedmodules)hasbeenplugged

WP1- Makersgateway


FIRSTDESIGN

WP1- Makersgateway


FIRSTDESIGN

•CONNECTIVITY

• RaspberryPi2• 2modulestobeplugged• Wifi &3G/4Gà USBDongle• RaspberryPi3• 2modulestobeplugged• Wifi &BluetoothLowEnergyà includedinRaspberry• 3G/4Gà USBDongle

WP1- Makersgateway


WP1- Makersgateway


OtherREQUIREMENTS

•GettingRequirements fromPILOTS• Communicationtechnologies• Physicalconstraints(weightandvolume)

•GettingRequirements fromIoT Survey• Communicationtechnologies

•AccordingtoD1.1à definitionofaplanfortheelicitationofusecasedependent requirements fromWP8.

Industrialmodulargateway:requirementsRequirementselicitationfrom:◦ Eurotechbackground;◦ horizontalrequirements;◦ WP8:pollution &airqualitymonitoring usecase.

Mainrequirements:◦ modulararchitecture;◦ togrowalibraryof standardHW“buildingblocks”tobereusedacrossverticalsandsystemconfiguration;

◦ confineanycustomizationoutside thecore“buildingblocks”,inparticularUserI/O,connectivity,mechanics&enclosure, thermalsolutions.

◦ standardComputerOnModule(COM)◦ forembeddedapplication,multivendorsupport,◦ commercialgradeandindustrialgradeversionsavailable,◦ withrecognizedroadmapuntil2018,◦ designedforIntelArchitecture.

…mainrequirements:◦ UseofstandardBUSes providingperipheralenumerationsupport.◦ UseofwidelyadoptedstandardperipheralinterfacesforES.◦ SupportformultipleWAN/LANconnectivityoptions.◦ Verticals&certificationdrivenpowersupplyconfiguration.◦ Fanless thermaldesign.◦ Multiple storagesolutionsavailable.◦ Supportforawiderangeofenvironmentalsensingmodules◦ withpre-calibratedsensorconditioning.

◦ Timestampandoptionalgeo-localization information.◦ Maximumpowerconsumption40W.◦ Extendedtemperaturerangesupport(target-20+70°C).◦ Maximumsize:250x200x88mm(LxDxH,SBCfootprint,2rack-mountunit).

Industrialmodulargateway:requirements(2)

I/OExpansionModule

Modulesphysicallyindependentandconnectedtothecarrierwithcabledconnection

CarrierModule

CPUModuleBoard

ManagementModule(BMM)

Powersupplymodule

InternalExpansionModule1


AUXI/OModule

I/OModuleforfieldbus


Modulesphysicallyindependentandconnectedtothecarrierviaaboardtoboardconnection

Canbeanexternalmoduleoraninternalexpansionorintegrated

UserI/O

Storagemodule

DFMGatewaymodulardesign

IndustrialGatewayModulesCPUModule:◦ IntelAtomBayTrail orApolloLakefamilies◦ 10WTDPClassCPU◦ COMExpressType10

BoardManagementModuleBMM:◦ 32BitMicrocontroller◦ Managessystemandmodulesstatusandrelatedtransitions(coldboot,warmboot,lowpowerstatessuchassuspendorhybernate).

◦ Managessystemmaintenance,e.g.:◦ secureupdate,◦ autotest,◦ extendedinputwakeup&suspend,◦ specialfeatureslikeinjectionsensing,timedprocedure,etc.

IndustrialGatewayModules(2)Storagemodule:

1. storageintegratedintheCPUmodule,e.g.eMMC Flash,SATASSD(e.g.itisusedinhighruggedandreliablesystemtoavoidvibrationissue).

2. Internalexpansion,e.g.mSATA SSDDriveorSDMemoryCard.

3. Externalstoragemodule,e.g.HDD/SDDDiskwithoptionalDriveBay.

AUXI/OModule(e.g.PoE orpaneldisplaybacklight):thesemoduleshaveapowerabsorptionthatisnotsupportedbythecarrierandmustbeconnecteddirectlytothepowersupplymodule.TheI/Omodulesarepoweredbythecarrier.

IndustrialGatewayModules(3)I/OExpansionmodules:◦ theygeneratethesignalthatmustbeavailableontheexternalpanel;◦ implement I/Ofunctionalities foraspecificvertical;◦ provideconnectorsforaspecificvertical;◦ allowstocustomizetheexternalconnections.◦ Examples:◦ BUSconverter◦ Expander,e.g.I2C->10GPIO◦ IsolatedandprotectedI/O◦ SpecialfunctionslikeaparticularfieldbusforaScada application.

I/OExpansionModule

USB

EXTERNALPANEL

3xRS485

Ethernet RJ45ML2MIL

IndustrialGatewayModules(3)UserI/OModules:itcanbeanexternalmoduleorasetoffunctionalitiesimplementedinthecarrier.It’scheaperthanI/Oexpansionandsatisfiesmechanicalrequirements.◦ SDMemoryCard.◦ Test,debuganddevelopmentinterfaces.◦ Maintenanceinterfaces.◦ Legacyinterfaces,likemouseandkeyboard.

I/OModulesforfieldbus:◦ integrated,providedbytheCPUmoduleorbytheBMM,e.g.CANBus;◦ internalexpansionmodule, providingpotentiallyanykindoffieldbus.

Powermodule:itcanbeintegratedorexternalandprovideawiderangepowerformultipledomainapplication(24V-110V).◦ Insulatedand/orprotectedversionavailable.◦ Support fortensionslowerthanthenominalrange(e.g.forautomotive).◦ DesignedforEN50155,MIL-STD,FCC,CE.

CarrierModule

CPUModuleStandardCOMExpress

Rev.2.1

BoardManagement

Module(BMM)

IntegratedPowersupply

N xminiPCIeslots

expansion

GPSmodule(?)

I/OExpansionModule(CANBus,I/Oexpander)

OptionalPoE

custominternal

expansion

UserI/O

AlternatePowersupply

eMMCFlash

SATADRIVE(Drivebay?)

IntegratedMicroSDCardSlot

MaintenanceI/O

DumbI/OPanel(e.g.foruserI/O)

ConsolidateAGILEmodulargatewaydesign

Integratedmodule

Internalexpansion

Externalexpansion

IndustrialgatewaypreliminaryspecificationsStandardCOMExpressRev.2.1

IntelAtomBayTrail andApolloLakeCPUfamilies.

8GBeMMC Flash

1xSATAinternalconnectoroncarrier(DriveBay),1xSATAinternalconnector,MicroSDslot(maintenance).

I/Ointerfaces:2x(10/100/100)Ethernet,1USB3.0circular,1USB2.0maintenance,1xRS232,3xRS485/RS422,1xCANBus,1xMiniDisplay,8xDigitalI/O,1xAudioLineIn,1xAudioLineout.

Radiointerfaces:3G/4G,802.11b/g/n,Bluetooth4.0BLE,GPS.

Power:24V/110V,4W-17W.

D1.1DeliverableTOCandcontentsdiscussion.

Requirements:◦ wecanstartthe identificationoftheusecaseindependent requirements;◦ definitionofaplanfortheelicitation ofusecasedependentrequirementsfromWP8.

Definitionofadeadlineforcontributions.

Documentlinks:

https://redmine.create-net.org/dmsf/files/6340/download

https://drive.google.com/a/create-net.org/file/d/0B2wGNjDl_JNZeXFIakFwX1Btb3M/view?usp=sharing_eid&ts=5703c734

Thanksfortheattention.That’sallfolks.

Technology

WP1 Gateway HW Design & Implementation