IPAS SPring-8 FADC Project

IPAS SPring-8 FADC Project

章文箴蘇大順

04/26/2002

Super Photon Ring 8 GeV (SPring-8)

Harima Science Garden City

Laser Electron Photon

LEPS Detector Configuration

TPC inside LEPS Detectors

Time Projection Chamber

Working Principles of Time Projection Chamber

1. Passage of charged particles through the gas generates ionization electrons.

2. Electrons drift towards the readout plane along the imposed E x B drifting fields.

3. At the end of readout plane, an avalanche (amplification) will happen upon the arrival of electrons by the proportional sense wires and an induced image charge on the corresponding cathode pads.

4. The pads are connected with a read-out electronics which provides low-noise and high resolution analogue information as well as the drift time associated with the signal.

Electric Field Configuration

Grid Wire

Sense Wire

Field Wires

Cathod

Determination of the Particle Trajectory

Particle Identification by dE/dx vs. P

Time Projection Chamber at SPring-8 LEPS Experiment

Time Projection Chamber at Spring-8 LEPS Experiment

Readout Pads of TPC

Zoom-in View of Wires

TPC Inside the Solenoid Magnet at SPring-8

View of Particle Trajectory along the beam in

Simulation

TPC Mechanical Specification

• Inner radius: < 1.25 cm.• Outer radius: < 30 cm.• Read out channels: 95 sensing wires, 1000 pads.• Pad size:inner 8mm*8mm, outer 8mm*13mm.• Distance between sensing wires and pads: 4mm.• Separation of sensing wire: 4mm.• Cathode readout.• Maximum drift distance : about 70 cm.• Maximum drift time: about 14 sec with drift velocity

= 5.1 cm/sec.

Requirement of TPC Electronics

• Good energy resolution: measuring dE/dx from the charge readout of either wires or pads for the particle identification for K/p separation at low momentum.

• Requirement of spatial resolution:– x,y < 300 m.– z < 1 mm.

• Position information: – x(t),y(t): x from fired sense wires; y from interpolation of

signals on pads(t).– z(t) from time bin of FADC time slice.

• Timing information: fitting of pulse peak in FADC.• On-board zero-suppression to ensure fast data transfer and short

system dead time.

Digitizer in TPC Electronic: FADC

• Large data size:– High sampling rate: 40 MHz = 25 nsec.– Read-out bit (Nbit): 10 bits.– # of Time bins per event: ~600 time bins. (Max drift time/clock = 14

sec/25 nsec = 560 bins.)– 1000 channels.

• Trigger latency: 1 sec .• On-board zero-suppression.• Need of a large buffer size to store 4-5 events on board for

one single VME readout.(16*600*5=48K per channel, w/o a zero suppression factor.)

• High channel density.

SPring-8 FADC Module

– Use TEXONO FADC and IHEP BES version as the starting point.

– 40 MHz; 10-bit FADC: input 0-2 V range.– Shift register inside FPGA: length = trigger latency (1

s).– On-board FPGA for threshold suppression.– Buffer FIFO: dual port memory. – CPLD: controlling VME actions.– Free clock running.– VME 9U; 32 channels/module; 8 attached

cards/module; 4 channel/card.

Main Electronic Components

• Receiver: MAXIM, MAX4145ESD.

• OPA: Analog Device, AD8138ARSO-8.

• FADC: Analog Device, AD9203ARVRU-28.

• FPGA: Xilinx, XC2S150-6FG456.

• FIFO: TI, SN74V245.

SPring-8 FADC Module(4 channels, 10 bits, 40 MHz)

OPA

FADC

FPGA

FIFO

40 MHz sampling rate.10 bits resolution with 2Vp-p dynamic range.Clock distribution with Phase Lock Loop circuit.On Board digital signal delay and Real-Time ZERO-Suppression.High capacity First In First Out Memory.Easy to use with high density connector.

Mixed signal AD Converter Adapter Board

FADC Mother Board

CPLD

Driver

Clock Driver

VME Connector

FPGA, digital signal control chip.

First In First Out memory.

VMEBus slave controller, with high performance BLTransfer Mode.

32 Channels, high sampling rate Flash AD converter.

Differential AD Converter (40 MHz)

16 channels differential signal input connector.

Spring-8 2002/03

Receiver & Driver FADC

Differential Signal from MAMP

10

Hit Flag FIFO

Processing FPGA

ClockTrigger

Receiver & Driver FADC

10

Receiver & Driver FADC

10

Receiver & Driver FADC

10

CH 1

CH 4

CH 3

CH 2

x 8Four ChannelsFour Channels

VA[8..23]

Trigger Counter

Trigger FIFO

VME Control

12

DelayWrite

VME_ResetCheck Trigger NumberClear Trigger FIFORead Trigger FIFO

VD[0..11]

VD[0..11]

x 8

Rea

dR

ST

Read FlagW

rite

Fla

g

Global FPGAGlobal FPGA

JTAG

VD[0..31]

VD[0..31]

VA[8..15]

4 Fla

g

Reset

Download PROM

VD1

VA1

VCAS,D0,D1,AM[0..5],Write,DTACK, et. al.

8 bits DIP Switch

8

Write_inRead_out

Download PROM

Shift Register 10 bits Data

Threshold

Comparator

32 bits FIFO10

10

Trigger

Clock Counter & Control

Enable

Clock

Over_Threshold

Comp_Control

Write_header&trailerClock

RstReset

VD[0…15]

VA[8…15]

Re

ad

Wri

t e

Ena

ble W

rite

Disable Clear

Count

Write_Data

Write_Flag

Read

Write Flag

S

R

QFlag

10

10

L=(Trigger Latency + 1)

VA2

VD2

Fig. 2 Block Diagram of Processing FPGA

Clo

ck

Data Format

16 15 14 13 12 11 10 09 08 07 06 05 04 03 02 01

CS 0 0 1 ND FADC Module Number (1-64) Channel Number (1-32)

CS 0 1 0 ND ND ADC (0-1024)

CS 1 0 0 ND ND Number of ADC data bins (0-600)

CS 0 1 1 ND ND Time (0-1024)

Header 1

ADC

Time

Trailer

CS: Checksum bit

ND: Not defined.Lowest Bit

CS 0 0 1 ND Event Number (1-5)Header 2

CSR Format

16 15 14 13 12 11 10 09 08 07 06 05 04 03 02 01

Reset

Sampling Count: default value 1020.

VME address: 0x010000

Lowest Bit

1

1 0 0 Last six digits of number of sampling count.

FADC VME Action List (A24/D16)

• 0x0i0000: address to write, bit 9 for resetting FIFO and set ready, bit 10 for resetting suppression threshold and bit 11 for setting the sample count of the FADC i. (Address modifier: 0x3D).

• 0x0i0100: address to read the merged 32 FIFOs’ content in BLT mode for FADC i. (Address modifier: 0x3B, 0x3F).

• 0x0i0101: address to read the BLT reading cycle for FADC i. (Address modifier: 0x3B, 0x3F).

• 0x0i0000+j*0x000100: address to read the single FIFO content in AO mode for channel j. (Address modifier: 0x3D)

• 0x0i0000+j*0x000100: address to write for setting the zero-suppression threshold for channel j. (Address modifier: 0x3D)

The Control Flow of FADC

< 5 events

Send IRQ to VME CPU

DAQ READ FIFO

DAQ send Reset

FADC clear BUSY

Clear trigger Veto

Yes

No

DAQ Start

Trigger Count *Veto

NIM

CPLD FADC Trigger Clock 100MHz

Trigger signal

Trigger

FADC

Busy

FADC Module

Preamplifier Module

For each channel

VME

CPU

Reset

Master

Slave

Trigger , Conversion

Observation Window of Signals

Signal

Trigger

Conversion Strobe

Sampling Counts ( max 1024*25ns=25s)

Shift Register Length ( max 100*25ns = 2.5 s)

DAQ Trigger Logic TEXONO

MAMP

LTDS1

Rst

LTD0

Strb

SCLK

HTD0

Evnt

H VT

L VT

LeCroy222

START

OR

BLANK

STOP

NIM

DELTTL

NIM

BUSY

1.0

10

100

1.0 10100

1.0

LATCH

10

Full scale width

START

OR

BLANK TTL

NIM

BUSY

1.0

10

100

1.0 10100

1.0

LATCH

10

Full scale width

STOP

DEL

NIM

FB

SY

INT

RE

AD

CLK

Bus

y

Res

et +5V +12V -12V-5.2V SPring-8 32-channel FADC

Trig

ger

Voltage Reference

Clock Generator

TEXONO Online Event Display

(400 KHz sine wave)

TEXONO Online Event Display

(1 MHz sine wave)

ROOT Offline Event Display for 2 SPring-8 FADC (64

channels)Module 1

Module 2

Events

• 02/09/2001: Prof. Imai and Ahn visited AS. Collaborating plan was discussed and finalized.

• 03/31/2001: Wen-Chen and Henry visited IHEP, Beijing and explored the R&D plan in IHEP.

• 05/31/2001: IHEP was not able to perform the R&D plan.• 08/01/2001: Da-Shun visited IHEP for 3 weeks to learn the

conceptual design.• 02/01/2002: Prototype 1 boards made.• 02/28/2002: Wen-Chen and Da-Shun tested prototype-1

boards with TPC at SPring-8.• 04/25/2002: Finished up 64 channels of prototype-1 and

deliver them to SPring-8.

Plan

• 04/30/2002: Issue out prototype-2 (quasi-final) fabrication order.

• 05/21/2002: Deliver prototype-2 to SPring-8.• 06/01/2002: System test with a complete electronic chain (Pre-

amp, shaper, and FADC) with TPC and Solenoid magnet.• 06/15/2002: Issue out final production fabrication order (1440

channels).• 07/01/2002: Send production boards for stuffing.• 07/15/2002 – 07/31/2002: Test production boards.• 08/01/2002 – 08/31/2002: Delivery of production board,

installation, system test and DAQ.• 09/15/2002: Commission Run with photon beam.

Remarks

• Many valuable experiences learned: board design, firmware, modification of TEXONO DAQ, coordinating people, etc.

• A good starting point for a continuing “rooting” process of experimental technique at IPAS.

• Thanks to many people: Henry, P.K., A.C., K.C., Tracy, IHEP group….