The 0.15µm GaN Hemt process...GaN TECHNOLOGY GH15 GaN process is optimized up to 35GHz for high...

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GaN TECHNOLOGY

GH15 GaN process is optimized up to 35GHz for high power, high PAE and high linearity. The Gallium Nitride power density combined with a thermal dissipative SiC substrate brings to 3.5W/mm at 30GHz. This MMIC process includes MIM capacitors, inductors, air bridges, metallic resistors, via through the substrate and two metal layers for interconnections.

GH15 is the ideal process to design:• High power and high PAE amplifiers

up to Ka-band• Robust LNA• High Power switches

Build your own solution with UMSwww.ums-gaas.com

The 0.15µm GaN Hemt process

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Contact us:

Worldwide distributor: Richardson RFPDwww.richardsonrfpd.com

UMS SAS – EMEA,Ph: +33 1 69 86 32 00mktsales@ums-gaas.com

UMS USA, Inc. - America,Ph: +1 781 791 5078philippe.labasse@us.ums-gaas.com

UMS - Asia, Ph: +86 21 6103 1703 xavier.taltasse@ums-gaas.com

www.ums-gaas.com

Process Design Kit (PDK) includes non-linear electro-thermal models, noise model, diodes & switches models, passive models, all with associated library elements.

Applications targeted with GH15:• Pt to Pt radio• 5G• Satcom• Radar• Broadband amplification• Hi-Rel products

Element Typical Value

Vt -3,2 V

Idss 1.2 A/mm

Ids+ 1.4 A/mm

Gm 390 mS/mm

VdsDC 20 V

Ft > 35 GHz

Fmax > 100 GHz

MIM density 175 pF/mm2

Metallic resistors 30 and 1000 Ohms/sq

Via-holes available on 70-µm substrate thickness

Process main features

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