1. TFT LCD 8. CELL Flow

4. 4. TFT TFT
5. TFT 5. TFT FlowFlow
6. TFT 6. TFT
7. 7. CELL CELL
8. 8. CELL CELL FlowFlow
9. C/F 9. C/F
10. 10. C/F C/F FlowFlow
11. C/F 11. C/F
12. Module 12. Module
13. 13. Module Module FlowFlow
1. 1. TFT LCDTFT LCD
*OverCoat TN Mode ITO, IPS Mode .
) TFT Glass
Gate
- - - - - -
Polarizer

*1 On/Off *2
BLACK MATRIX COLOR

PHOTO ETCH STRIP
TFT SHOPTFT SHOP
4. TFT 4. TFT TFT TFT PROCESS PROCESS
5. TFT 5. TFT Flow Flow
, , DI SHOWER, BRUSH , PARTICLE TFT . BARE GLASS , DEPO PARTICLE PRE-DEPO .

< < >>
Speed 1.2m/min Tact time 48sec
• LD/ULD : : ROBOT • O3Rinse : • R/B : Brush (Roll Brush) Particle • Ultra Sonic : • Bubble Jet : Glass • Air Knife : Air Knife slit Dry Air

55. TFT. TFT Flow Flow SPUTTERING SPUTTERING
RF(DC) POWER PLASMA Ar(He) (-) Ar+ TARGET TARGET PIXEL ITO, S/D Cr GATE AL, Mo TARGET TARGET .
AR+
DC
5. TFT 5. TFT Flow Flow SPUTTER SPUTTER
CASSETTE STAGE
ROBOT
LOAD LOCK
PROCESS CH
LOAD LOCK
PROCESS CH
PROCESS CH
HEAT CHAMBER
• CST Stage :Cassette CTV MGV
• Robot :Glass Robot • L/L Chamber :Process Glass
, Buffer .
• H/Chamber :P/Ch & Pattern .
• P/Chamber : Chamber
5. TFT 5. TFT Flow Flow PECVDPECVD
CHAMBER GAS RF POWER GAS PLASMA . ACTIVE a-si/n+ a-si PASSIVATION siN .
SI
H
RF
5. TFT 5. TFT Flow Flow PECVD PECVD
PROCESS CHAMBER
PROCESS CHAMBER
Pro/ Ch 370-380
• ACLS :Auto Cassette Loading Station • ATM Robot :Glass . • L/L Chamber: Buffer. • T/Ch,V/Rob : GLS
• H/Ch : Chamber • P/Ch : Chamber
* Atmosphere Robot
5. TFT 5. TFT Flow Flow PHOTOPHOTO
PATTERN MASK PR MASK PATTERN . PR PR COATING, MASK EXPOSURE , PR DEVELOP . PARTICLE PATTERN PANEL .
PR
2 Carrier Station
Main Arm
Cooling Unit
5. TFT 5. TFT Flow Flow PHOTO PHOTO

* Rinse Spin Dry
PR
5. TFT 5. TFT Flow Flow ETCH ETCH
PHOTO PATTERN WET ETCH GAS, RF POWER 3 GAS PLASMA DRY ETCH . DRY ETCH CHAMBER .
RF
PLASMA
PROCESS CHAMBER
PROCESS CHAMBER
SENDER/ RECEIVER
PROCESS CHAMBER
LOADLOCK CHAMBER
5. TFT 5. TFT Flow Flow DRY ETCH DRY ETCH
< < DryEtchDryEtch >>

/

•CTV(Clean Transfer Vehicle) Rail •AGV(Auto Guided Vehicle) Magnetic •MGV(Manual Guided Vehicle)
5. TFT 5. TFT Flow Flow WET ETCHWET ETCH
SPIN DRY JEL ROBOT
PORT
< < Chemical Chemical >>
(AL etchant) (75%) (15%) (8%) (ITO etchant) (47.5%) (5%) (Cr etchant) CAN(10%) (23%)
:Tilting Chemical
DI Drain
DI Return
5. TFT 5. TFT Flow Flow STRIPSTRIP
PHOTO PATTERN COATING PR WET ETCH/ DRY ETCH ETCHING PR
< < Stripper >Stripper >
SPIN DRY DI SHOWER
< < STRIP STRIP >>
L/UL
MATERIAL
1. • D.I//
2.BUS (Al)
•Data Line Pixel TFT •Gate
Sputter Al Target Tkns : 2000 Å
3.PHOTO •Gate Coater/ Developer
PR Tkns : 15,000 Å
4.Etch/Strip •Photo PR Open Bus
CFM/Stripper Al Etchant Strip
5.Gate (Mo)
•Hillock Short Sputter Mo Target Tkns : 1000 Å
6.PHOTO •Gate Coater/ Developer
PR Tkns : 15,000 Å
7.Etch/Strip •Photo PR Open Gate
CFM/Stripper Mo Etchant Strip
6. 6. TFT TFT BUS/GATEBUS/GATE
Al
MATERIAL
8.Act (a-si,n+ a-si ,siN)
•SiNx Short •
PECVD SiH4,PH3,NH3 N2,H2 Tkns :6000 Å
9.PHOTO •Active Coater/ Developer
PR Tkns : 15,000 Å
Cl2,SF6,O2 Ash: O2 Strip
11.S/D (Cr)
12.PHOTO •S/D Coater/ Developer
PR Tkns : 15,000 Å
CFM Dry Etch/Asher Stripper
ACT, S/DACT, S/D6. 6. TFT TFT
MATERIAL
14.PAS (SiN)
PECVD SiH4,N2,NH3 Tkns : 2000 Å
15.PHOTO •Pad/Pas Coater/ Developer
PR Tkns : 15,000 Å
Dry Etch/Asher Stripper
SF6,O2,He Strip
17.PXL (ITO)
Sputter ITO Target Tkns : 500 Å
18.PHOTO •ITO Coater/ Developer
PR Tkns : 15,000 Å
CFM/Stripper ITO Echant Strip
PAS, PXLPAS, PXL6. 6. TFT TFT
GATE
GLASS
6. 6. TFT TFT TFT TFT
• n+a-Si Source a-Si a-Si Cr n+a-Si ..
6. 6. TFT TFT TFT TFT
GATE
SPACER
Pi /
(Ag)
Gap
Grinder/Grinder
Auto Probe
Laser Repair
7. Cell 7. Cell CELL CELL PROCESS PROCESS

Seal
(Fluidity) (Long Range Order) ()
•
•
•
15.1” : ML-9707-1
8. 8. CellCell Flow Flow SCRIBE/ SCRIBE/
GLASS
( TFT C/F Glass )
Break Table
Sorting All- Good 1 Panel Glass .
LOADLOAD UNLOADUNLOAD
Robot Robot
125 1kg/cm
•Break Table Align Scribe Break
< < SORTING >SORTING > G, A-F type T type 590*220 S type Scrab
PI PIN-HOLE Glass
8. 8. CellCell Flow Flow
Particle PI
<Air Knife><Air Knife> 1.05kg/cm2
0.9kg/cm2
#1 O3

PI(Polyimide) Mask Glass Rubbing .

Pin Hole
Load / UnloadLoad / Unload
# # PIPI ..
<PI >
* Buffer 1 Load, 2-7

.
C/F Glass
TFT Glass
*Ultra Sonic Clean
CST Load
* Air Particle *1 Rubbing Glass, CST Load
Rubbing Rubbing Particle Polymide .

[[CavitationCavitation Jet]Jet]
L o a d

Gap Seal . , Chamber

Dispenser A unit
• • PI •
< Seal >
•Seal ITO ITO Cr Ag ITO .
IR Seal .
8. 8. CellCell Flow Flow SealSeal
Load/Unload
Robot
Robot

*Buffer
1
17
Cell Gap ,
Glass .
Glass
<<Spacer Spacer >>
• 450 5g Spacer
(CCD)
( ) TFT (Vcom) Ag Dotting.
Load / Unload
[[DottingDotting ‘‘13.313.3X4X4’’ ]]
<<Dispenser Unit>Dispenser Unit> Nozzle N2 2.0-4.0kg/cm2
Table 30-100mm/sec
< < AgAg >> 12.1, 13.3X4, 15.1 10 13.3X2, 13.3X3, 14.1 12 22.0 16 18.1E2 26
2 Glass Align .
GAPGAP Seal Gap .
SealSeal Hot press Gap Seal .
Hot Press(heating)
Hot Press(heating)
<< Hot Press >Hot Press >
130 0.4kg/cm2
< < SealSeal >> 140 60
8. 8. CellCell Flow Flow
CH
•C/F SEAL
•TFT UV
TFT, C/F Cell Cell .
Robot
*OCR

<<Scribe Recipe>Scribe Recipe>
125 1kg/cm
* (Optical Character Reader) Glass ID
• Scribe/Break Table Scribe Breaking Bar .
Cell Chamber
( )
( )
N2Vent 30l/sec
N2 Glass
•CST Cell

(180 )
Dispenser Robot
< < >>
# # # Cell

1 2 3 4 5 6 7 8
Quick Drain Rinse
/ Panel Glass Chip .
8. 8. CellCell Flow Flow PanelPanel
< < Buffer >Buffer >
CSTCST ..
Panel
Gap Panel (Retardation) Gap
no
8. 8. CellCell Flow Flow / / GapGap
< < >>
Grinder
Load
Unload
Line Open Panel Shorting Bar Panel Edge Chip
[ [ Grinder Grinder ]] [ [ Grinder Grinder ]]
Shorting BarShorting Bar
< Shorting Bar >
Spark Tr Pad
Air Pad Chip
Panel R, G, B, Black, Cross Talk Pattern
Data Open : Data Line (R,G,B 1) Pattern
Gate Open : Gate Line
Data-Data Short : Data Line Data Line Short
Data-Gate Short : Data Line Gate Line Cross
Gate-Gate Short : Gate Line Gate Line Short
< < Line Defect >Line Defect >
< < Point Defect >Point Defect > : Black

: PXL

Loading
Auto Probe Panel Laser
< < Line Defect >Line Defect > Data Open : Repair Line
Data-Gate Short : Repair Line Data Line Cutting
Gate-Gate Short : Short Cutting Data-Data Short : Short Cutting Gate Open : Repair
: Laser
Gate Pixel Short
[Data Open] [Gate-Data Short]
Glass

*Black Matrix
Over Coating
C/F C/F PROCESSPROCESS9. 9. C/F C/F

(PARA-A)

46
LoadUnload
C/F Process O3 Brush, DI, , .
< < >>
400rpm
< < >> Tact time 45 1300mm/min 1055mm
CST 1000mm

< < >>
100-600rpm Line Shower
* (+) (-) .
NeutralEtch3 Etch2 Etch1
DMSO
< < >> Tact time 45 1300mm/min 1055mm
CST 1000mm
Black Matrix Black Matrix
R.G.B B/M Sputtering Photo, Etch, Strip .
< < Etch/Strip Etch/Strip >>

Shower Air
Knife Oven
( )
< < >> Tact time 40 Oven 220 Oven 40
Coating, Exposure, Develop C/F Red,Green, Blue 3 .
< < PHOTO PHOTO >>
Coating
Load
Unload
Nozzle
• .

< < >>
* Particle * Color * *
51
* O3 / Brush / DI Rinse /
Pre Depo Clean * PDCLN DI / Brush / Mega *Depo Particle Sonic / O3
B/M * SPUTTER Cr Target ( Cr ) *R,G,B Contrast
Pre Photo Clean * PPCLN DI / Brush / CJ * PR

B/M Photo *B/M Coater / / PR Developer / Oven
B/M *Mask
Etch / Strip *Photo PR Open W/ E , Stripper Cr Etchant / Strip , B/M
B/M *B/M BM
11. 11. C/F C/F / / BMBM
MaterialMaterial
Pre Photo Clean * PPCLN DI / Brush / CJ * CFPR
RED Photo *RED Coater / / Oven RED / Developer
RED *C/F (Mask)
GREEN Photo *GREEN Coater / / Oven GREEN / Developer
G *C/F (Mask)
BLUE Photo *BLUE Coater / / Oven BLUE / Developer
B *C/F (Mask)
* & Repair Repair
COLORCOLOR11. 11. C/F C/F
MaterialMaterial
Pre Depo Clean * PDCLN DI / Brush / O3 *Depo Particle / Mega Sonic
ITO *TFT SPUTTER ITO Target
*C/F
* Dry Cleaner
MaterialMaterial MaterialMaterial
ITOITO//11. 11. C/F C/F
12. 12. MODULEMODULE MODULE MODULE PROCESSPROCESS
Screen Print
••
Surface Mount Technology SMD(Surface Mount Device)
•• SMTSMT
• Cost Down . • . • , , , . • . • .
•• SMTSMT
. . Land
Cost
, , . ,
13. 13. ModuleModule FlowFlow SMTSMT
• Load PCB UNIT
< Flow >
PCB Align() PCB Arm Printer Load
Screen Printer

Visual TesterRouterWelding
Load Unload
Align.
< Flow >
Back-up Pin/ Jig Setting Metal Mask Setting Squeegee
Cream Solder
Bare PCB
Metal Mask
: , , Flux : , , ,
< < SQUEEGEE >SQUEEGEE >
• : Metal Mask : Solder Cream . :
• : Metal Mask .

< < Metal Mask >Metal Mask >
• PCB Land S/C Pattern Mask • : Stainless, Ni • : Etching, Laser, Additive
, . • 0.1sec/ chip .
< Flow >
Cassette feeder Setting Setting Cassette Setting
•• Oven , Cream solder PCB
< Flow >
< < >>
• : 150 (30 -60) . • Pre Heat : 150 (45-75) Adietic Acid . • : 200 (20-40) Powder . • Reflow : 225 (10-20) . • : (60-120) Flux Coating.
• RouterRouter Thill PCB . ( Particle Air Gun(Brush) Vacuum Clear
PCB . )
•Unload PCB PANEL Glass Cassette .
•Visual Tester .
< Flow >
• , . Print PCB Repair Zone
< Flow >
XY Table
< < Flow >Flow >
••Repair Zone Repair Zone X-ray
< < Flow >Flow >
< Flow >
FPC Film FPC hole PCB hole
••WeldingWelding FPC(Flexible Printed Circuit)
• Input Source Gate Source FPC, .
• Oscilloscope , .
• (Panel)
Cell Panel Knife, Brush, DI Shower, Panel Particle(Glass Chip, , )
13. 13. ModuleModule FlowFlow TABTAB
Pol Tab

< < PolPol >>
• Display Pol .
••
Panel , Film Panel /
Film

Panel
PVA (Poly Vinyl Alcohol) PVA (Poly Vinyl Alcohol)
TACTAC AdhesiveAdhesive Panel SPV (Surface Protective Vinyl)SPV (Surface Protective Vinyl) Film
< < NPF POL(NPF POL()) >>
••TabTab
Pol Drive IC ACF(Anistopic Conductive Film) TCP Film Panel Pad
< < Flow > Flow >
TCP ACF
••TAB TAB
TAB Bonding Zone Module Line
< < >>
•Line Defect Short / Open •Pol , , Tray • Cell / TFT •Pol •TAB Misalign Tab Bonding Tab Pad Glass Pad Align
Line Defect
••( ( Auto Clave)Auto Clave)
Pol Pol Glass Pol
• Chamber Heat Transfer.

••
PCB Bonding LCM(Liquid Crystal Module) Display
< < >>
•PCB Bonding Signal Display / •SMT Display •Flicker
••PCBPCB BondingBonding
Source Gate , Drive Ass’y ACF PCB
Panel
Panel
ACF
TCP
B/L Board Ass’y B/L .
•• Back Light Back Light
B/L Board Ass’y . Back Back LightLight
PCBPCB
FPCFPC
TABTAB
B/L
B/L
< Back Light >
6/7
(1) (1) LampLamp Inverter CCFL(Cold Cathod Fluorescent Lamp)
. HCFL(Hot Cathod Fluorescent Lamp) . (2) (2) Lamp housingLamp housing
Lamp . ,, Film Ag Film .
(3) (3) Light guide(Light guide()) (PMMA) Injection Molding Casting , Pattern(Dot,Shibo,V-cut) .
(4) (4) REFLECTOR(REFLECTOR()) (PET) .
(5) (5) Diffuser(Diffuser()) (PET) .
(6) (6) Bottom Prism(Bottom Prism()) (PET) Prism . 3M BEFII 1 Diffuser 1.55 .
(7) (7) Top Prism(Top Prism()) Bottom Prism Bottom Prism 1.33 . Prism Cross X Y .
(8) (8) Diffuser(ProtectorDiffuser(Protector, , )) (4) Diffuser Prism Film . Diffuser Top Prism Prism .
(9) (9) LCD PanelLCD Panel LCD Panel ,Color Filter ,Polarizer Lamp , 8% Panel .
(10) (10) Monitor Diffuser 2~3 Diffuser DBEF .
13. 13. ModuleModule FlowFlow
•• ((Soldering)Soldering)
< < >>
• Soldering . • PCB Flux FPC Flux .
•• Top CaseTop Case
Top Case
• FPC(Flexible Printed Circuit) Soldering Source PCB Gate PCB Flux .
Top CaseTop Case
•• ((ScrewScrew ))
< < MODELMODEL >>
••LM151X2 2LM151X2 2 ••LM133X3 2LM133X3 2 ••LM121S1 2LM121S1 2 ••LM121S2 2LM121S2 2 ••LM121SB 3 LM121SB 3
• Bowl Feeder Screw Screw Delay
•• ((Forming)Forming)
Top Case Panel .
• Forming Source Gate . , Panel B/L .
• Soldering • 45 20 .
• Aging
( 50, 4) .
[ Aging Chamber ] [ Panel Assembly ]
••
2 Pattern Panel .
•• ( . 20EA/ Sample .)
OQC .
••
OQC .
•• / T/C LCM Tape
LCM Label , POLFilm Shield Cover
••
MNT B/T Source Gate PCB

Documents

1. TFT LCD 8. CELL Flow