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20038 Page 1 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
2005/05/29
David Deng
20038
BATTERY COVER
20038 Page 2 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
1. Plastic Material Introduction --------------------------------------------------------------- 3
2. Product Model Introduction---------------------------------------------------------- 4
3. Cooling System Design --------------------------------------------------------------- 5
4. Feed System Design ----------------------------------------------------------------6
5. Analysis Indication ---------------------------------------------------7
6. Processing Conditions ---------------------------------------------------------8
7. Analysis Results -------------------------------------------- 9~27
8. Conclusions & Suggestions -------------------------------------------------------------- 28
Contents
20038 Page 3 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
PP POLYPROPYLENES CM1171 Taiwan PP VI(245)84 OCT-08-2002 JUL93
1. Conductivity 0.170000 W/m/ deg.C 8. Ejection temperature 93.000000 deg.C 2. Specific heat 3100.000000 J/kg/ deg.C 9. Min. melt temperature 200.000000 deg.C 3. Melt density 774.7500000 kg/cu.m 10. Max. melt temperature 280.000000 deg.C4. Max. shear stress 0.260000 MPa 11. Min. mold temperature 20.000000 deg.C 5.Max. shear rate 24000.000000 1/s 12. Max. mold temperature 80.000000
deg.C
Material introduction
20038 Page 4 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
210
Product model introduction
Max. contour dimension(mm) Thickness distribution
Thickness distribution is not even. Min. wall thickness is about 0.64mm, Max. wall thickness is about 5.00mm. As shown below the plot, the blue is the thinner region, and the red is the thicker region(include injection and cooling system).
87
51
20038 Page 5 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
Cooling system have 20 circuits. Core have 12 circuits and cavity have 8 circuits.
Cooling System Design
Cooing networkØ10
20038 Page 6 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
Feed System Design
The mold is cold feed system, two cavities, one banana gate. The dimension of the gate is shown in top plot.
9
Gate location
Ø 4.15Ø 8
124
16
Ø 5
2
2.2
Gate
20038 Page 7 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
Moldflow CAE analysis includes Flow,Cooling and Warp
results,aimed to optimize the feed system, the cooling
system of the mold.
Analysis Indication
20038 Page 8 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
Mold temperature: 50.00 deg.C
Melt temperature: 230.00 deg.C
Injection time ﹕ 3.8 sec
Total Volume (cavity): 170.00 cu.cm
Part Volume : 165.00 cu.cm
Sprue/runner/gate volume: 5.00 cu.cm
Total Weight : 137.4 g
Runner Weight ﹕ 3. 5 g
Circuit Inlet Temp : 25.0 deg.C
MPa
30
10 s
Processing Conditions
Filling Conditions:
Cooling Conditions:
Packing profile:
Pressure [MPa] Time [sec]
30 0.0
30 10.0
20038 Page 9 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
Best Gate LocationBest Gate Location
The best gate location lie in the marked region.
It is difficult to design mold, so can’t be accepted in fact.
Gate Analysis Results\
20038 Page 10 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
Flow Analysis Results\ Fill TimeFill Time
Click for animation
Fill time is about 3.8sec, and the filling pattern is satisfied. The marked region is filled last.The below plot is the scene of filling 99%(V/P switch over).
20038 Page 11 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
Fill TimeFill Time
Click for animation
Fill time is about 3.8sec, and the filling pattern is satisfied. The marked region is filled last.The below plot is the scene of filling 99%(V/P switch over).
Flow Analysis Results\
20038 Page 12 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
Injection PressureInjection Pressure
Max. injection pressure is 33 Mpa (V/P switch over).
Flow Analysis Results\
20038 Page 13 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
Injection PressureInjection Pressure
The pressure drop in runner system is about 24MPa, which is 72.7% of injection pressure.
The below plot is the pressure distribution of filling 99%(V/P switch over).
Flow Analysis Results\
20038 Page 14 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
Flow Front TemperatureFlow Front Temperature
The flow front temperature is from 221 to 230.6 deg.C, and the distribution is not very uniform. The minimum temperature is shown in the marked region.Pay attention to the weldlines in this area.
Flow Analysis Results\
Gate
20038 Page 15 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
Weld LinesWeld Lines
Main weld lines are shown as red lines.
Gate
Pay more attention to the weldlines in this area.
Flow Analysis Results\
20038 Page 16 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
Air TrapsAir Traps
Air traps locations are shown by small pink balls. Most of them lie in the last filling or the interface area, so can be vented easily.
Gate
Flow Analysis Results\
20038 Page 17 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
Sink IndexSink Index
Pay attention to the Sink Mark in marked region.
Gate
Flow Analysis Results\
20038 Page 18 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
Clamp Force(Max.=61.3Ton)
Clamp Clamp ForceForce
Variation curve of pressure&clamp force in cycle time shown by above figure.
Clamp Force Centroid locates
in the center of mold.
Flow Analysis Results\
20038 Page 19 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
Temp difference(Max.=0.23 deg.C)
Coolant Coolant TempTemp
Coolant temp difference is very small,so the number of circuits is enough.
Cool Analysis Results\
20038 Page 20 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
Temp (part)Temp (part)
The distribution of temp is not very uniform.
Pay more attention for the cooling in marked region.
Cool Analysis Results\
20038 Page 21 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
Cool Analysis Results\ Temp (part)Temp (part)
Pay more attention for the cooling in marked region.
20038 Page 22 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
Click for animation.
Frozen Time(part)Frozen Time(part)Cool Analysis Results\
20038 Page 23 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
The frozen time is non-uniform.
The frozen time of most area is about 23 S, 6.1S in gate area.
Cool Analysis Results\ Frozen Time(part)Frozen Time(part)
Pay more attention for the cooling in marked region.
20038 Page 24 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
The frozen time of gate is about 6.45S,less than the frozen time of most area in the part,which will do harm to packing.
Design larger gate.
Cool Analysis Results\ Frozen Time(gate)Frozen Time(gate)
20038 Page 25 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
X DeflectionX Deflection
The X direction belongs to natural shrinkage basically.
Warp Analysis Results
20038 Page 26 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
Y DeflectionY Deflection
Deflection in Y direction is shown in the left plot, belongs to natural shrinkage basically.
Warp Analysis Results
20038 Page 27 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
Z DeflectionZ DeflectionWarp Analysis Results
Deflection in Z direction is uniform. 0.58
Gate0.42 0.41
20038 Page 28 2005/05/29
MOLDFLOW ANALYSIS REPORT
CYPRESS CHINA CAE/CAD/CAM TECH CENTER
Conclusions&Suggestions
From the above analysis:
Some weld lines maybe affect the strength of molding part, and air traps are vented easily.
The packing effect is the main cause of sink mark,deflection. Deflection is very uniform,improve packing will get small deflection.
The distribution of temp is not very uniform.
Suggestions:
To use baffle,bubbler and inserts to improve cooling effect.
To design larger gate.