36
LCD TV SERVICE MANUAL CAUTION BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL. CHASSIS : LP92R MODEL : 22LK230 22LK230-MA Printed in Korea P/NO : MFL67263001 (1107-REV00) Printed in Korea P/NO : MFL67263001 (1107-REV00) Printed in Korea P/NO : MFL67263001 (1107-REV00) North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com Internal Use Only Printed in Korea P/NO : MFL67263001 (1107-REV00)

22LK230-LP92R

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Page 1: 22LK230-LP92R

LCD TVSERVICE MANUAL

CAUTIONBEFORE SERVICING THE CHASSIS,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : LP92R

MODEL : 22LK230 22LK230-MA

North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com

Internal Use Only

Printed in KoreaP/NO : MFL67263001 (1107-REV00)

North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com

Internal Use Only

Printed in KoreaP/NO : MFL67263001 (1107-REV00)

North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com

Internal Use Only

Printed in KoreaP/NO : MFL67263001 (1107-REV00)

North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com

Internal Use Only

Printed in KoreaP/NO : MFL67263001 (1107-REV00)

Page 2: 22LK230-LP92R

LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 2 -

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ................................................................................. 3

SPECIFICATION ...................................................................................... 6

ADJUSTMENT INSTRUCTION ............................................................... 7

EXPLODED VIEW .................................................................................. 10

SCHEMATIC CIRCUIT DIAGRAM ..............................................................

Page 3: 22LK230-LP92R

LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 3 -

SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in theSchematic Diagram and Exploded View.It is essential that these special safety parts should be replaced with the same components as recommended in this manual to preventShock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during theservicing of a receiver whose chassis is not isolated from the ACpower line. Use a transformer of adequate power rating as thisprotects the technician from accidents resulting in personal injuryfrom electrical shocks.

It will also protect the receiver and it's components from beingdamaged by accidental shorts of the circuitry that may beinadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor,over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposedmetallic parts of the cabinet, such as antennas, terminals, etc., tobe sure the set is safe to operate without damage of electricalshock.

Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect anelectrical jumper across the two AC plug prongs. Place the ACswitch in the on position, connect one lead of ohm-meter to the ACplug prongs tied together and touch other ohm-meter lead in turn toeach exposed metallic parts such as antenna terminals, phonejacks, etc. If the exposed metallic part has a return path to the chassis, themeasured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis thereading must be infinite.An other abnormality exists that must be corrected before thereceiver is returned to the customer.

Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitorbetween a known good earth ground (Water Pipe, Conduit, etc.)and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeterwith 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltagemeasurements for each exposed metallic part. Any voltagemeasured must not exceed 0.75 volt RMS which is corresponds to0.5 mA.In case any measurement is out of the limits specified, there ispossibility of shock hazard and the set must be checked andrepaired before it is returned to the customer.

Leakage Current Hot Check circuit

1.5 Kohm/10W

To Instrument’sexposed METALLIC PARTS

Good Earth Groundsuch as WATER PIPE,CONDUIT etc.

AC Volt-meter

When 25A is impressed between Earth and 2nd Groundfor 1 second, Resistance must be less than 0.1*Base on Adjustment standard

IMPORTANT SAFETY NOTICE

0.15 uF

Ω

Page 4: 22LK230-LP92R

LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 4 -

CAUTION: Before servicing receivers covered by this servicemanual and its supplements and addenda, read and follow theSAFETY PRECAUTIONS on page 3 of this publication.NOTE: If unforeseen circumstances create conflict between thefollowing servicing precautions and any of the safety precautions onpage 3 of this publication, always follow the safety precautions.Remember: Safety First.

General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power

source before;a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.CAUTION: A wrong part substitution or incorrect polarityinstallation of electrolytic capacitors may result in anexplosion hazard.

2. Test high voltage only by measuring it with an appropriate highvoltage meter or other voltage measuring device (DVM,FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of itsassemblies.

4. Unless specified otherwise in this service manual, cleanelectrical contacts only by applying the following mixture to thecontacts with a pipe cleaner, cotton-tipped stick or comparablenon-abrasive applicator; 10 % (by volume) Acetone and 90 %(by volume) isopropyl alcohol (90 % - 99 % strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual, lubrication ofcontacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with whichreceivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of itselectrical assemblies unless all solid-state device heat sinks arecorrectly installed.

7. Always connect the test receiver ground lead to the receiverchassis ground before connecting the test receiver positivelead.Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in thisservice manual.CAUTION: Do not connect the test fixture ground strap to anyheat sink in this receiver.

Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged easilyby static electricity. Such components commonly are calledElectrostatically Sensitive (ES) Devices. Examples of typical ESdevices are integrated circuits and some field-effect transistors andsemiconductor "chip" components. The following techniquesshould be used to help reduce the incidence of componentdamage caused by static by static electricity.

1. Immediately before handling any semiconductor component orsemiconductor-equipped assembly, drain off any electrostaticcharge on your body by touching a known earth ground.Alternatively, obtain and wear a commercially availabledischarging wrist strap device, which should be removed toprevent potential shock reasons prior to applying power to theunit under test.

2. After removing an electrical assembly equipped with ESdevices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup orexposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ESdevices.

4. Use only an anti-static type solder removal device. Some solderremoval devices not classified as "anti-static" can generateelectrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generateelectrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it.(Most replacement ES devices are packaged with leadselectrically shorted together by conductive foam, aluminum foilor comparable conductive material).

7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will beinstalled.CAUTION: Be sure no power is applied to the chassis or circuit,and observe all other safety precautions.

8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motion such asthe brushing together of your clothes fabric or the lifting of yourfoot from a carpeted floor can generate static electricitysufficient to damage an ES device.)

General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropriate

tip size and shape that will maintain tip temperature within therange or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composedof 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-

bristle (0.5 inch, or 1.25 cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering techniquea. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F)b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.

6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it thereonly until the solder flows onto and around both thecomponent lead and the foil.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.

d. Closely inspect the solder area and remove any excess orsplashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

Page 5: 22LK230-LP92R

LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 5 -

IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) throughwhich the IC leads are inserted and then bent flat against thecircuit foil. When holes are the slotted type, the following techniqueshould be used to remove and replace the IC. When working withboards using the familiar round hole, use the standard techniqueas outlined in paragraphs 5 and 6 above.

Removal1. Desolder and straighten each IC lead in one operation by gently

prying up on the lead with the soldering iron tip as the soldermelts.

2. Draw away the melted solder with an anti-static suction-typesolder removal device (or with solder braid) before removing theIC.

Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and

solder it.3. Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as close as

possible to the component body.2. Bend into a "U" shape the end of each of three leads remaining

on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" withlong nose pliers to insure metal to metal contact then soldereach connection.

Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit

board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.

Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as

possible to diode body.2. Bend the two remaining leads perpendicular y to the circuit

board.3. Observing diode polarity, wrap each lead of the new diode

around the corresponding lead on the circuit board.4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and ifnecessary, apply additional solder.

Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow

stake.2. Securely crimp the leads of replacement component around

notch at stake top.3. Solder the connections.

CAUTION: Maintain original spacing between the replacedcomponent and adjacent components and the circuit board toprevent excessive component temperatures.

Circuit Board Foil RepairExcessive heat applied to the copper foil of any printed circuitboard will weaken the adhesive that bonds the foil to the circuitboard causing the foil to separate from or "lift-off" the board. Thefollowing guidelines and procedures should be followed wheneverthis condition is encountered.

At IC ConnectionsTo repair a defective copper pattern at IC connections use thefollowing procedure to install a jumper wire on the copper patternside of the circuit board. (Use this technique only on ICconnections).

1. Carefully remove the damaged copper pattern with a sharpknife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (ifused) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire andcarefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copperpattern and let it overlap the previously scraped end of the goodcopper pattern. Solder the overlapped area and clip off anyexcess jumper wire.

At Other ConnectionsUse the following technique to repair the defective copper patternat connections other than IC Pins. This technique involves theinstallation of a jumper wire on the component side of the circuitboard.

1. Remove the defective copper pattern with a sharp knife.Remove at least 1/4 inch of copper, to ensure that a hazardouscondition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the patternbreak and locate the nearest component that is directlyconnected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of thenearest component on one side of the pattern break to the leadof the nearest component on the other side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire is dressed so theit does not touch components or sharp edges.

Page 6: 22LK230-LP92R

LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 6 -

SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement.

1. Application rangeThis spec. sheet is applied to LCD TV used LP92R chassis.

2. SpecificationEach part is tested as below without special appointment.

1) Temperature: 25 ºC ± 5 ºC(77 ºF ± 9 ºF), CST: 40 ºC ± 5 ºC2) Relative Humidity : 65 % ± 10 %3) Power Voltage

: Standard input voltage(AC 100-240 V~, 50 / 60 Hz)* Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followedeach drawing and specif ication by part number inaccordance with BOM.

5) The receiver must be operated for about 5 minutes prior tothe adjustment.

3. Test method1) Performance: LGE TV test method followed 2) Demanded other specification

- Safety: CE, IEC specification- EMC : CE, IEC

4. Model specificationNo. Item Specification Measurement Remark

1 Market Non-EU

2 Broadcasting system PAL/SECAM B/G/D/K, PAL I/II, NTSC-M

3 Available BAND PAL NTSC China(DK)

Channel VHF/UHF E2~C69 2~78 C1~C62

Cable S21~47 1~71 S1~S41

4. Receiving system Upper Heterodyne

5. Video Input PAL, SECAM, NTSC Rear (1EA)

6. AV Audio Output RF/AV/HDMI Audio Output Rear (1EA)

7. RGB Input S/W Upgrade Only Rear (1EA)

8. HDMI Input HDMI-DTV, Only PCM MODE Rear (1EA)

9. Audio Input (1EA) AV (1EA) L/R Input

5. HDMI Input(DTV)(HDMI DVI - Spec out)

No.Specification

Proposed RemarksResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)

1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out but display.

2 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)

3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz

4 720*480 31.47 59.94 27 SDTV 480P

5 720*480 31.5 60.00 27.027 SDTV 480P

6 720*576 31.25 50.00 27 SDTV 576P

7 1280*720 44.96 59.94 74.176 HDTV 720P

8 1280*720 45 60.00 74.25 HDTV 720P

9 1280*720 37.5 50.00 74.25 HDTV 720P

Page 7: 22LK230-LP92R

LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 7 -

ADJUSTMENT INSTRUCTION

1. Application RangeThis specification sheet is applied to all of the LCD TV, LP92Rchassis.

2. Specification(1) Because this is not a hot chassis, it is not necessary to use

an isolation transformer. However, the use of isolationtransformer will help protect test instrument.

(2) Adjustment must be done in the correct order.(3) The adjustment must be performed in the circumstance of

25 °C ± 5 °C of temperature and 65 % ± 10 % of relativehumidity if there is no specific designation.

(4) The input voltage of the receiver must keep AC 100-220V~, 50 / 60 Hz.

(5) The standard signal level is approved in 65 ± 1 dB µV.(6) The receiver must be operated for over 5 minutes prior to

the adjustment when module is in the circumstance ofabove 15 ºC.G In case of keeping module is in the circumstance of 0 °C,

it should be placed in the circumstance of above 15 °Cfor 2 hours.

G In case of keeping module is in the circumstance ofbelow -20 °C, it should be placed in the circumstance ofabove 15 °C for 3 hours.

3. Adjustment items3.1. PCB assembly adjustment items

(1) Download the MSTAR main software(IC604, Mstar ISP Utility)1) Using D/L Jig

(2) Input Tool-Option(3) Check SW Version.

3.2. SET assembly adjustment items(1) Input Area option(2) Adjustment of White Balance : Auto & Manual(3) Input Tool-Option/Area option(4) Preset CH information(5) Factoring Option Data input

4. PCB assembly adjustment method4.1. Mstar Main S/W program download4.1.1 Using D/L Jig

(1) Preliminary steps1) Connect the download jig to D-sub(JK302) jack or

P301(4P) Wafer.

(2) Download steps1) Execute ‘ISP Tool’ program, the main window(Mstar ISP

utility Vx.x.x) will be opened.2) Click the “Connect” button and confirm “Dialog Box”.

3) Click the “Config” button and Change speed.I2C Speed setting : 350 Khz ~ 400 Khz

1

Filexxx.bin

Page 8: 22LK230-LP92R

4) Read and write bin file.Click “(1)Read” tab, and then load download file(XXXX.bin) by clicking “Read”.

5) Click “(2)Auto” tab and set as below.6) Click “(3)Run”.7) After downloading, you can see the “4)Pass” message.

* If TV is Turn On, Check the updated SW Version andTool Option.

4.2. Input tool option.Adjust tool option refer to the BOM.- Tool Option Input : PCBA Check Process- Area Option Input : Set Assembly Process

After Input Tool Option and AC offBefore PCBA check, you have to change the Tool option andhave to AC off/on (Plug out and in)(If missing this process, set can operate abnormally)

(1) Profile : Must be changed the option value because beingdifferent with some setting value depend onmodule maker, inch and market.

(2) Equipment : Adjustment remote control(3) Adjustment method

- The input methods are same as other chassis.(Use IN-START key on the Adjustment remote control.)(If not changed the option, the input menu can differ themodel spec.)

Refer to Job Expression of each main chassis assembly(EBTxxxxxxxx) for Option value.

[Caution]- Don’t Press “IN-STOP” key after completing the function

inspection.- Don’t connect HDMI cable when downloading the EDID.If the cables are connected, Downloading of EDID couldbe failed.

4.3. EDID Data- EDID D/L method: The EDID data is automatically saved.* 22LK230

4.5. Check SW Version(1) Method

1) Push In-star key on Adjustment remote control.2) SW Version check

Check “Main : Vx.xx” - LK230

- 8 - LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved. Only for training and service purposes

1

Filexxx.bin

1

Filexxx.bin

** HDMI : 256Bytes

0 1 2 3 4 5 6 7 8 9 A B C D E F

0 0 FF FF FF FF FF FF 0 1E 6D 1 0 1 1 1 1

10 1 15 1 3 80 30 1B 78 0A F3 30 A4 54 46 96 26

20 0F 49 4B 20 0 0 1 1 1 1 1 1 1 1 1 1

30 1 1 1 1 1 1 1 1D 0 72 51 D0 1E 20 6E 28

40 55 0 E0 0E 11 0 0 1A 1 1D 0 BC 52 D0 1E 20

50 B8 28 55 40 E0 0E 11 0 0 1E 0 0 0 FD 0 31

60 3D 0F 2E 8 0 0A 20 20 20 20 20 20 0 0 0 FC

70 0 4C 47 20 54 56 0A 20 20 20 20 20 20 20 1 A2

80 2 3 1D 72 23 9 7 7 4A 6 7 15 16 2 3 11

90 12 84 93 83 1 0 0 65 3 0C 0 10 0 8C 0A D0

A0 8A 20 E0 2D 10 10 3E 96 0 E0 0E 11 0 0 18 8C

B0 0A A0 20 51 20 18 10 18 7E 23 0 E0 0E 11 0 0

C0 98 8C 0A D0 90 20 40 31 20 0C 40 55 0 E0 0E 11

D0 0 0 18 8C 0A A0 14 51 F0 16 0 26 7C 43 0 E0

E0 18 11 0 0 0 0 0 0 0 0 0 0 0 0 0 0

F0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 14

Page 9: 22LK230-LP92R

- 9 - LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved. Only for training and service purposes

5. SET assembly adjustment method5.1. Input Area-Option

(1) Profile : Must be changed the Area option value becausebeing different of each Country’s Language andsignal Condition.

(2) Equipment : Adjustment remote control.(3) Adjustment method

- The input methods are same as other chassis.(Use IN-START key on the Adjustment remote control.)

Refer to Job Expression of each main chassis assembly(EBTxxxxxxxx) for Option value.

5.2. Adjustment of White Balance- Purpose : Adjust the color temperature to reduce the

deviation of the module color temperature.- Principle : To adjust the white balance without the saturation,

Fix the one of R/G/B gain to 192 (default data)and decrease the others.

- Adjustment mode : Three modes - Cool / Medium / Warm(Medium data is automatically calibrated by the Cool data)

- Required Equipment1) Remote control for adjustment 2) Color Analyzer : CA100+ or CA-210 or same product

- LCD TV(ch : 9)(should be used in the calibrated ch by CS-1000)

3) Auto W/B adjustment instrument(only for auto adjustment)

5.2.1. Connecting diagram of equipment for measuring(For Automatic Adjustment)

* LP92A Support I2C Interface For ADC/DDC Adjustment.

(1) Enter the adjustment mode of DDC- 22 Set command delay time : 50 ms- Enter the DDC adjustment mode at the same time heat-

run mode when pushing the power on by power only key.- Maintain the DDC adjustment mode with same condition

of Heat-run => Maintain after AC off/on in status of Heat-run pattern display)

(2) Release the DDC adjustment mode- Release the adjust mode after AC off/on or std-by off/on

in status of finishing the Hear-run mode- Release the Adjust mode when receiving the aging off

command(WB 00 FF) from adjustment equipment.- Need to transmit the aging off command to TV set after

finishing the adjustment.- Check DDC adjust mode release by exit key and release

DDC adjust mode)

(3) Enter the adjust mode of white balance- Enter the white balance adjustment mode with aging

command (F3, 00, 00)

(4) Release the adjust mode of white balance- Release the white balance adjustment mode with aging

command(F3, 00, FF)

* Luminance min value is 150cd in the Cool/Medium/Warmmode(For LCD)

5.2.2. Adjustment of White Balance (for Manual adjustment)(1) Color analyzer(CA100+, CA210) should be used in the

calibrated ch by CS-1000(2) Operate the zero-calibration of the CA100+ or CA-210,

then stick sensor to the module when adjusting.(3) For manual adjustment, it is also possible by the following

sequence.1) Select white pattern of heat-run by pressing “POWER

ON” key on remote control for adjustment then operateheat run longer than 15 minutes. (If not executed thisstep, the condition for W/B may be different.)

2) Push “Exit” key.3) Change to the AV mode by remote control.4) Input external pattern (85 % white pattern)5) Push the ADJ key two time(entering White Balance

mode) -> Enter “04 13” (Password)6) Stick the sensor to the center of the screen and select

each items (Red/Green/Blue Gain and Offset) usingD/E(CH +/-) key on R/C..

7) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.8) Adjust three modes all (Cool/ Medium/ Warm) : Fix the

one of R/G/B gain and change the others.9) When adjustment is completed, Exit adjustment mode

using EXIT key on R/C.

* CASEFirst adjust the coordinate far away from the target value(x, y).1) x, y > target

i) Decrease the R, G. 2) x, y < target

i) First decrease the B gain, ii) Decrease the one of the others.

3) x > target, y < targeti) First decrease B, so make y a little more than the target.ii) Adjust x value by decreasing the R

4) x < target, y > targeti) First decrease B, so make x a little more than the target.ii) Adjust x value by decreasing the G

(4) Standard color coordinate and temperature when using theCA100+ or CA210 equipment(Small size inch’s color coordinate is different from others,So use below table.)

To check the Coordinates of White Balance, you have tomeasure at the below conditions.Picture Mode : User 1Dynamic Contrast : OffDynamic Colour : Off(If you miss the upper condition, the coordinates of W/Bcan be lower than the spec.)

Coordinate Mode

x y Temp uv∆

Cool 0.280 ± 0.002 0.283 ± 0.002 9,300 K 0.000

Medium 0.290 ± 0.002 0.295 ± 0.002 8,000 K 0.000

Warm 0.308 ± 0.002 0.319 ± 0.002 6,500 K 0.000

Page 10: 22LK230-LP92R

- 10 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes

300

200

530

540

401

400

900

510

120

LV1

910

810

A2

A10

820

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. Theseparts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components asrecommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

Page 11: 22LK230-LP92R

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

[AV]

MNT_ROUT

CVBS_LIN

D10230V

R104

10K

R10112K

R103

10K

D10730V

CVBS_RIN

MUTE_LINE

R10212K

MNT_LOUT

CVBS_VIN

R11075

D10830V

D10130V

MUTE_LINE

C10510uF16V

C10410uF16V

C106560pF50V

READY

C107560pF50V

READY

R128

1K

R127

1KC103

5600pF50V

C1025600pF

50V

R109220K

R108220K

JK101PPJ234-03

5A[RD1]O-SPRING

6A[RD1]E-LUG

4A[RD1]CONTACT

7B[WH1]E-LUG-S

5B[WH1]O-SPRING

7C[RD2]E-LUG-S

5C[RD2]O-SPRING

4C[RD2]CONTACT

5D[WH2]O-SPRING

4E[YL]CONTACT

5E[YL]O-SPRING

6E[YL]E-LUG

16.5V_AOUT

R114

47

FOR DEBUG

Q101ISA1530AC1

FOR DEBUGE BC

R106

220

FOR DEBUG

R111470

FOR DEBUG

R11268

FOR DEBUG

JP101MNT_VOUT_T

ZD101SD05ZD102SD05

Q105MMBT3904(NXP)

EB C

Q106MMBT3904(NXP)

EBC

Q102MMBT3904(NXP)

FOR DEBUGE

BC

Q103MMBT3904(NXP)

EB C

Q104MMBT3904(NXP)

EBC

INPUT

INPUT

EAX64207701 2011/5/6

1 7

POP NOISE

POP NOISE

AV IN/OUT

GAIN X 4

FOR DEBUG

Copyright © 2011 LG Electronics. Inc. All rights reserved. Only for training and service purposes

LGE Internal Use Only

Page 12: 22LK230-LP92R

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

TXCE3+

TXCE3-

TXCLKE+

TXCLKE-

TXCE2+

TXCE2-

TXCE1+

TXCE1-

TXCE0+

TXCE0-

LED_KEY

L203MBW3216-501TF

500-ohm

LED_POWER

ST_5V

3.3V_M

IR

KEY1

5V_LCD

TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCLKE+,TXCLKE-

C206100pF50V

READY

C20547pF50V

READY

C209100pF50V

READY

C208100pF50V

C204100pF50V

READY

C2030.1uF50V

C2020.1uF50V

READY

C2010.1uF50V

C2070.1uF50V

C212100pF50V

READYKEY2

ST_3.3V

R20310K

R2064.7K

P20112507WR-08L

1KEY1

2KEY2

3GND

4+ST_5V

5GND

6IR

7LED_KEY

8LED_POWER

9

R2300

JEIDA

P204

FF10001-30

130

229

328

427

526

625

724

823

922

1021

1120

1219

1318

1417

1516

1615

1714

1813

1912

2011

2110

229

238

247

256

265

274

283

292

301

31

.

R2290

22"LGD/Tsinghua

ZD2005.6V

READY

ZD2045.6V

READY

ZD2055.6V

READY

ZD2015.6V

ZD2025.6V

READY

IR & LED

LVDS/IR_LED_KEY

HD(22")

LVDS/IR/KEY

EAX64207701 2011/5/6

2 7

Copyright © 2011 LG Electronics. Inc. All rights reserved. Only for training and service purposes

LGE Internal Use Only

Page 13: 22LK230-LP92R

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

B_TX0+

TXCLK-

B_TX0-

G_TX1-

R_TX2+

HPDCTL

G_TX1+

HDMI_5V_DET

HDMI_SCL

R_TX2-

Q3012SC3052

E

B

C

TXCLK+

HDMI_SDA

R323

10K

R30110K

READY R313

10K

R32110K

R3204.7K

R3021K

R311 5.6

R308 5.6

R309 5.6

R305 5.6

R310 5.6

R307 5.6

R306 5.6

R312 5.6

JK301YKF45-7058V

14

13

5

20

SHIELD

12

11

2

19

18

10

4

1

17

9

8

3

16

7

6

15

D30430V

D30330V

DSUB_SCL

DSUB_SDA

JK302

SPG09-DB-0106630TGA004Q

RED

1

GREEN

2

BLUE

3

GND_1

4

DDC_GND

5

RED_GND6

GREEN_GND7

BLUE_GND8

NC9

SYNC_GND10

GND_2

11

DDC_DATA12

H_SYNC13

V_SYNC14

DDC_CLOCK15

SHILED16

HD_5V

5V_M

R3294.7K

C3020.1uF50V

R3314.7K

D302ENKMC2838-T112

A1

C

A2HD_5V

R303 10

R304 10

C30433pFREADY

C30333pFREADY

C30533pFREADY

C30633pFREADY

HDMI

HDMI

HDMI/RGB

EAX64207701 2011/5/6

3 7

I2C Control

Copyright © 2011 LG Electronics. Inc. All rights reserved. Only for training and service purposes

LGE Internal Use Only

Page 14: 22LK230-LP92R

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

TUNER_SDA

TUNER_SCL

5V_TUNER

0.01uF

C401

50V

PRE-AMP

0.01uF

C409

50V

PRE-AMP

0.01uF

C414

50V

VIF2

VIF1

SIF2

SIF1

TU_AGC

D401 30V

R411680

PRE-AMP

0.01uFC404

50V

C4130.1uF16V

ONLY_MAC4170.1uF16V

ONLY_MA

R418

100

R423 12K

C41147pF50V

C41247pF50V

R415

47

R414

47

C4100.1uF16V

READY

C40710uF10V

L403K7257M

ONLY_TA

2SWITCHING_INPUT

1INPUT

5 OUTPUT2

4 OUTPUT1

3 CHIP_CARRIER

L4042.2uH

READY

L401PRE-AMP

820nH

R4324.7K

R4334.7K

5V_M 5V_M

L402-*1M9370M

ONLY_MA

2INPUT-GND

1INPUT

5 OUTPUT_2

4 OUTPUT_1

3 CHIP_CARRIER-GND

L403-*1M3953M

ONLY_MA

2INPUT-GND

1INPUT

5 OUTPUT_2

4 OUTPUT_1

3

CHIP_CARRIER-GND

Q401BFS17WPRE-AMP

E

B

C

R404

0

PRE-AMP(TA)

R41222

PRE-AMPR42722

READY

C75522pF50V

READY

R4440

READY

R4450

READY

L402K9362M

ONLY_TA(NO_SW)

2INPUT-GND

1INPUT

5 OUTPUT2

4 OUTPUT1

3 CHIP_CARRIER-GND

R417

10K

TU_SW_VIF

R429

0

TU_SW_VIF

R42410K

TU_SW_VIF

5V_M

5V_M

Q4032SC3875S(ALY)TU_SW_VIF

E

B

C

TU_CTL_VIF

D403

35VKDS114E(KEC)

TU_SW_VIF

R4253.3K

TU_SW_VIF

R4196.8K

TU_SW_VIF

5V_M

R4206.8K

TU_SW_VIF

R4300

NO_SW_VIF

R403

0

No PRE-AMP

5V_M

R4090

PRE-AMP

TU401TDTK-G701D

ONLY_TA

5B+[+5V]

11AIF-

2NC_2

10NC_6

4RF_AGC

1NC_1

9NC_5

8NC_4

3NC_3

7SCL

6SDA

12

SHIELD

TU401-*1TDTK-H701F

ONLY_MA

5B+[+5V]

11DIF[-]/AIF-

2NC_2

10NC_6

4RF_AGC

1NC_1

9NC_5

8NC_4

3NC_3

7SCL

6SDA

12

SHIELD

R410

220

PRE-AMP(TA)

R4061.5K

PRE-AMP

R407820

PRE-AMP

0.01uF

C415

50V

5V_M

R4216.8K

TU_SW_SIF

R4226.8K

TU_SW_SIF

R4163.3K

TU_SW_SIF

R443

10K

TU_SW_SIFQ4022SC3875S(ALY)TU_SW_SIF

E

B

CR43610K

TU_SW_SIF

5V_M

TU_CTL_SIF

5V_M R428

0

TU_SW_SIF

D402

35VKDS114E(KEC)

TU_SW_SIF

R4310

NO_SW_SIF

L402-*2K9653D

ONLY_TA(SW)

2SWITCHING_INPUT

1INPUT

5 OUTPUT_2

4 OUTPUT_1

3 INPUT-GND/CHIP_CARRIER_GND

Near the pin

NTSC

PAL(w/o NT)

L403 L402

K7257 K9653

TUNER

EAX64207701 2011/5/6

4 7

TUNER

M3953

Layout placement Close to Tuner

Close to Mstar ICLayout placement

PAL-BG,DK,I NTSC-M

High LowTU_CTL_VIF

M9370

Copyright © 2011 LG Electronics. Inc. All rights reserved. Only for training and service purposes

LGE Internal Use Only

Page 15: 22LK230-LP92R

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

R5374.7K

C5526800pF50V

MNT_L_AMP

MNT_LOUT

16.5V_AOUT

R542

5.6K

16.5V_AOUT

MNT_ROUT

C55633pF50V

16.5V_AOUT

R5466.8K

MNT_R_AMP

R538

1K

R5476.8K

R539

1K

C55333pF50V

R543

5.6K

R5364.7K

C5556800pF50V

C5500.01uF50V

C5540.1uF50V

C5510.1uF50V

R54112K

R54412K

C5430.33uF50V

C5160.01uF

R507 33

C5141000pF50V

READY

C5200.01uF

C5250.01uF

R5043.3

C5011000pFREADY

10uFC512

25VREADY

C50410uF10V

C5400.33uF50V

C547

0.047uF

I2S_SCK

C5291uF25V

R526

470

C5494.7uF10V

R52422K

C548

0.047uF

R508 33

AUAMP_SDA

C546 4700pF

C545

4700pF

R5161K

C5210.01uF

R510 100

C535 0.033uF50V

C50810uF10V

C5220.01uF

C50233pF

READY

C5180.01uF

JP504

JP503

+3.3V_DVDD

C5170.01uF

C50333pF

READY

I2S_MCLK

R511 100

R512 100

SW_RESET

AUAMP_SCL

C5390.33uF50V

L501

MLB-201209-0120P-N2120-ohm

IC501

TAS5709PHPR

1OUT_A

2PVDD_A_1

3PVDD_A_2

4BST_A

5GVDD_OUT_1

6SSTIMER

7OC_ADJ

8NC

9AVSS

10

PLL_FLTM

11

PLL_FLTP

12

VR_ANA

13AVDD

14TESTOUT

15MCLK

16OSC_RES

17DVSS_1

18VR_DIG

19PDN

20LRCLK

21SCLK

22SDIN

23SDA

24SCL

25

RESET

26

STEST

27

DVDD

28

DVSS_2

29

GND

30

AGND

31

VREG

32

GVDD_OUT_2

33

BST_D

34

PVDD_D_1

35

PVDD_D_2

36

OUT_D

37 PGND_CD_138 PGND_CD_239 OUT_C40 PVDD_C_141 PVDD_C_242 BST_C43 BST_B44 PVDD_B_145 PVDD_B_246 OUT_B47 PGND_AB_148 PGND_AB_2

C532

2200pF C536

0.033uF50V

C5240.01uF

I2S_WS

10uFC509

25V

JP502

R520200

1%

C523

0.01uF

C5440.33uF50V

R523

22K

C5260.1uF

C5380.033uF50V

R51918K

1%

R5063.3

R509 33

C5270.1uF

R5053.3

C5370.033uF50V

I2S_SDO

L504

MLB-201209-0120P-N2120-ohm

R513 100

10uFC510

25VREADY

+3.3V_DVDD

10uFC511

25V

R525

470

JP501

C5190.01uF

R5033.3

C5311uF25V

3.3V_M

16.5V_SAMP

16.5V_SAMP

3.3V_M

IC502

SN324

3 INPUT1+

2 INPUT1-

4 VCC

1 OUT1

6 INPUT2-

5 INPUT2+

7 OUT2 8OUT3

9INPUT3-

10INPUT3+

11GND

12INPUT4+

13INPUT4-

14OUT4

R5144.7K

R5154.7K

3.3V_M

P501SMAW250-H04R

1.

2

3

4

C5420.47uF50V

C5410.47uF50V

Q503MMBT3904(NXP)

E

B

C

Q502MMBT3904(NXP)

E

B

C

R5020

L506AD-9060

15uH2S

1S 1F

2F

L507AD-9060

15uH2S

1S 1F

2F

L508

MLB-201209-0120P-N2120-ohm

L509

MLB-201209-0120P-N2120-ohm

L510

MLB-201209-0120P-N2120-ohm

L511

MLB-201209-0120P-N2120-ohm

AUDIO

AMP:GAIN X 4

AUDIO

EAX64207701 2011/5/6

5 7

SPK_R-

This parts are Located on AVSS area.

SPK_L+

SPK_L-

SPK_R+

Separate DGND AND AVSS

PULL DOWN

Copyright © 2011 LG Electronics. Inc. All rights reserved. Only for training and service purposes

LGE Internal Use Only

Page 16: 22LK230-LP92R

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

TXCE3+

TXCE3-

TXCLKE+

TXCLKE-

TXCE2+

TXCE2-

TXCE1+

TXCE1-

TXCE0+

TXCE0-

L605

120-ohm

AVDD_AUSDM

CVBS_VIN

B_TX0-

TXCE

0+,T

XCE0

-,TX

CE1+

,TXC

E1-,

TXCE

2+,T

XCE2

-,TX

CE3+

,TXC

E3-,

TXCL

KE+,

TXCL

KE-

C619 0.047uF

MAIN_SCL

VIF1

AVDD_VIF

SW601JTP-1127WEM

DEBUG

1

2 4

3

L602

120-ohm

AVDD_VIF SPI_CZ

5V_M

C6080.1uF16V

AVDD

P1

3.3V_M

P_16.5V

AVDD_VIF

SPI_CLKFLASH_WP

HPDCTL

I2S_

WS

ST_5V

TXCLK+

C6150.1uF16V

CVBS_RIN

ST_3.3V

AVDD_VIF

Q601ISA1530AC1

3.3V_M

I2S_

MCLK

MAIN_SDA

SIF1

TXCLK-

D602KDS181

C634

4.7u

F

AVDDP1

AVDD_MPLLC6070.1uF16V

ST_3.3V

SPI_CZ

CVBS_LIN

G_TX1+

1.2V_VDDC_M8

R611

100

TU_AGC

AVDDP1

C60147uF25V

R610

100

R609

150

D603KDS181

C6060.1uF16V

L601120-ohm

SPI_DO

R622

100

AVDD

_ADC

R6281M

L603

120-ohm

C6040.1uF16V

SPI_DI

I2S_

SCK

VDDC

L604

120-ohm

G_TX1-

SPI_DI

AVDD_AUSDM

B_TX0+

SPI_CLK

3.3V_M

I2S_

SDO

SPI_DO

SIF2

C627 2.2uF

AVDD_MPLL

C628 2.2uF

AVDDP2

C6114.7uF10V

AVDD_ADC

AVDD_ADC

HWRESET

VDDC

VIF2

D601KDS181

AVDDP1

INV_

ON

X60114.31818MHz

C6520.1uF

C660

0.1uFC6580.1uF

C659

0.1u

F

C656

0.1u

F

C645 0.1uF

C6440.1uF

C661

0.1u

F

C648 0.1uF

C642 0.1uFREADY

C6510.1uF

C6410.1uF

C632

0.1u

F

R6891K

R6901K

READY

R6981K

R6991K

READY

R607

100

R681

100

R682

100

R642 200

AVDD

P1

AVDD

P1

MNT_L_AMP

MNT_R_AMP

R673

22DS

UB_S

DA

AVDD

P1

PANE

L_ST

ATUS

R671

100

IR

AVDD

P2

VDDC

KEY2

KEY1HDMI

_SCL

HDMI

_SDA

POWE

R_SW

HWRE

SET

AVDD_ADC

C620 0.047uF

C610100pF50V

C6460.1uF

C6660.1uF

R691

0

READY

C6020.01uF50V

0.01uFC654

50V

0.01uFC663

50V

0.01uFC664

50V

R60810K

R621

100R62433K

R672

4.7K

R668

4.7K

R666

4.7K

R6041K

R603

1K

R612

2KR61310K

3.3V_M

LED_

POWE

R

FLAS

H_WP

TUNE

R_SD

A

TUNE

R_SC

L

R615

22

R616

22

C667

0.1u

FRE

ADY

LED_

KEY

C665

0.1u

F

ST_3.3V

R663

4.7K

ST_3.3V

R633 68

R645

1K

R644

1K

R63233

MUTE

_LIN

E

100

R661

TU_SW_SIF

C65010uF10V

C64310uF10V

C64910uF10V

C63810uF10V

C61410uF10V

C633

10uF

C635

1uF

R665

100

R667

100

C612 27pF

C613 27pF

R684

100

C653

0.01

uF

L606

600

R625

5.6K

R648

4.7K

READ

YR6

4710

0RE

ADY

R646

22K

R643

22K

C636

0.01

uF

C637

0.01

uF

R6934.7K

READY

3.3V_M

R6924.7K

C6551uF10V

IC603MX25L1606EM2I-12G

3WP#/AGC

2SO/SIO1

4GND

1CS#

5SI/SIO0

6SCLK

7HOLD#

8VCC

R_TX2-

R_TX2+

DSUB_SCLR675 22

R674

4.7K

ST_3.3V

ST_3.3V

MAIN_SDA

MAIN_SCL

C6620.1uF16V

AUAMP_SCL

AUAMP_SDA

MUTE_LINER685 100

ST_3.3V

SW_RESET

R670100

A_DI

M

R669100

P_DI

M

C6310.1uF

VDDC

100

R651

READY

100

R649

HDMI

_5V_

DET

R6066.8K

TU_CTL_VIF

DDC_

CTL

R6144.7K

R617

22

3.3V_M

R655

100

R6580

READY

R618

22

MAIN_SCL

R653

0

READY

MAIN_SDA

C6030.1uF16V

DDC_CTL

R6024.7K

IC601AT24C64D-SSHM-T

3A2

2A1

4GND

1A0

5SDA

6SCL

7WP

8VCC

IC602CAT24C08WI-GT3-H-RECV(TV)

3A2

2NC_2

4VSS

1NC_1

5SDA

6SCL

7WP

8VCC

PANE

L_ON

MNT_VOUT_T

OLPR687 100OLP

R6964.7K

R6974.7K

3.3V_M

R695 100

R694 100

R626 100

R627 100

R650 100TU_SW_VIF

R619

100

100

R654

100

R656

R664

100

R660

100

R631 33

R630 33

R6010

READY

IC604

LGE7873-LF

1RXA2N

2RXA2P

3AVSS_1

4AVDD_1

5BIN0

6GIN0M

7GIN0

8SOGIN0

9RIN0

10VSYNC0

11AVDD_ADC

12CVBS0

13VCOM0

14CVBSOUT

15AVSS_ADC

16AVDD_2

17XTAL_OUT

18XTAL_IN

19AVSS_2

20AVSS_3

21AVDD_3

22AVDD_VIF_1

23AVSS_VIF_1

24VIFIP

25VIFIM

26SIFIM

27SIFIP

28AVSS_VIF_2

29VR27

30AVDD_VIF_2

31TAGC

32AVDD_4

33LINE_IN_0L

34LINE_IN_0R

35LINE_IN_1L

36LINE_IN_1R

37AUCOM

38AUVRM

39

AUVRP

40

AUVAG

41

AVSS_4

42

LINE

_OUT

_0L

43

LINE

_OUT

_0R

44

VDDC_1

45

GND_1

46

VDD_1

47

GPIOB[12]

48

GPIOB[11]

49

GPIOB[10]

50

GPIOB[9]

51

GPIOB[8]

52

GPIOB[3]

53

GPIOB[2]

54

GPIOB[1]

55

GPIOB[0]

56

VDD_2

57

GND_2

58

PWM3

59

PWM2

60

PWM1

61

PWM0

62

TESTPIN

63

VDD_3

64

ALE

65 RDZ66 WRZ67 AD[3]68 AD[2]69 AD[1]70 AD[0]71 SPI_DO72 SPI_DI73 SPI_CZ74 SPI_CK75 GPIOD[1]76 GPIOD[0]77 VDDC_278 VSS_179 LVB3N80 LVB3P81 LVBCLKN82 LVBCLKP83 LVB2N84 LVB2P85 LVB1N86 LVB1P87 LVB0N88 LVB0P89 VDD_490 LVA3N91 LVA3P92 LVACLKN93 LVACLKP94 LVA2N95 LVA2P96 LVA1N97 LVA1P98 LVA0N99 LVA0P

100 GND_3101 AVDD_5102 DDCA_CLK1

03

DDCA_DAT

104

INT

105

IRIN

106

SAR2

107

SAR1

108

SAR0

109

VDD_5

110

DDCD_SCL

111

DDCD_SDA

112

RESET

113

WAKEUP

114

AUSDO

115

AUSCK

116

AUWS

117

AUMCKO

118

VDD_6

119

VSS_2

120

VDDC_3

121

RXACN

122

RXACP

123

RXA0N

124

RXA0P

125

AVDD_6

126

RXA1N

127

RXA1P

128

HOTP

LUG

C62233pF

READY

C62133pFREADY

C62433pFREADY

C62333pFREADY

C62533pFREADY

R620

100

C6404.7uF10V

TU_C

TL_S

IF

R6590

R662

0

R683

0

R676

0

R686

0

EAX64207701

MARIA8 128PIN

SERIAL FLASH 2M

MAIN(MARIA8)

2011/5/6

6 7

EEPROM(A0)

Seperate with IC ground

Close to IC as close as possible

RESET

10k=>6.8k,Park

HDCP EEPROM(A8)

Closed IC

Closed IC

Closed IC

Closed IC

Closed IC

Closed IC

Closed IC

Closed IC

Clos

ed I

C

Clos

ed I

CCl

osed

IC

Clos

ed I

C

Clos

ed I

CClos

ed I

C

Clos

ed I

C

Clos

ed I

CClos

ed I

C

Clos

ed I

C Clos

ed I

C

Clos

ed I

C

Clos

ed I

C

Clos

ed I

C

Clos

ed I

C

Copyright © 2011 LG Electronics. Inc. All rights reserved. Only for training and service purposes

LGE Internal Use Only

Page 17: 22LK230-LP92R

THERMAL

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

C70447uF25V

0.01uFC708

50V

5V_M

C70510uF16V

L702

500

P_16.5V

P_16.5V

R711

4.7K

R715

1K

5V_LCD

P_5VP_DIM

R729

10K

R73422K

R7123K

P_5V

R7351.6K

C7062.2uF16V

POWER_SW

C7120.1uF50V

P_5V

L703

120-ohm

0.01uFC748

50V

C7310.1uF50V

16.5V_SAMP

0.01uFC737

50V

5V_M

R706

0

READY

P_5V

L708

120-ohm

MLB-201209-0120P-N2

R713

10K

R73233K

R725

10K

C70368uF35V

P_16.5V

C7012.2uF16V

READY

R72710K

READY

ST_5V

R709-*1

1K

DC_DIM

0.01uFC709

50V

A_DIM

R709

100

PWM_DIM

PANEL_ON

C7191uF25V

C7211uF25V

C7020.47uF25V

R728

10K

C745100uF16V

0.01uFC707

50V

L701

120-ohm

L705

120-ohm

INV_ON

16.5V_AOUTST_3.3V

C7141uF25V

READY

IC701AP2121N-3.3TRE1

1

GND

2 VOUT3VINST_5V

1.2V_VDDC_M8

C7230.1uF50V

3.3V_M

IC704AZ1085S-3.3TR/E1

1

ADJ/GND

2 OUTPUT3INPUT

5V_M

0.01uFC713

25V

C73410uF10V

C73310uF10V

10uFC710

10V

0.01uFC711

50V

R7166.2K

3.3V_M

R75610K

R75510K

READY

PANEL_STATUS

ST_3.3V

R764

10K

R76510K

R7494.7K

R7474.7K

R7524.7K

5V_TUNER

110R759

READY

IC706AP1117EG-13

READY

1

ADJ/GND

2 OUT3IN

C7430.1uF16V

READYC74110uF16V

READYC74010uF16V

READY

R757330

READY

R75410K

ST_3.3V

Q705AO4813

EBK60706901

3S1

2G2

4G1

1S2

5 D1_1

6 D1_2

7 D2_1

8 D2_2

C775

0.01uF50V

C7800.1uF16V

R78575K1/8W1%

C7763300pF

50V

C77110uF10V

R7827.5K

1/16W 5%

IC702SN1007054RTER

1VIN_1

3GND_1

7COMP

9 SS

10 PH_1

11 PH_2

12 PH_3

13

BOOT

14

PWRGD

15

EN

16

VIN_3

5AGND

8RT/CLK

6VSENSE

4GND_2

2VIN_2 17

EP[GND]

R784

22K1%

C779100pF50V

C773

0.1uF16V

R783

24K

1%

C7720.1uF16V

C7740.1uF

16V

R781330K1/10W 5%

C77722uF10V

C77822uF10V

R78010K

C7490.1uF16V

READY

R741

100K

C76010uF25V

R772

3.9K

C7630.1uF

16V

C764

47uF16V

C7684700pF50V

D701

40V

SMAB34

R74227K

C76522uF10V

IC703TPS54331D

3EN

2VIN

4SS/TR

1BOOT

5VSENSE

6COMP

7GND

8PH

C7620.022uF16V

C7660.1uF50V C769

0.1uF50V

READY

C76747pF50V

C7610.1uF50V

L7096.8uH

P_16.5V

R771

20K

R770

499

1%

R7401

READYC75047uF16V

READY

R73310K

P703

SMAW200-12

116.5V

216.5V

3GND

4GND

55V

65V

7GND

8OLP

9Inverter_ON

10PWM_Dim

11A.Dim

12NC

OLP

R7364.7K

5V_M

L706

120-ohm

DCDC_5V_TUNER

R70110K

FOR DEBUGR7031.2K

FOR DEBUG

ST_5V 5V_M

LD701SAM2333

FOR DEBUG

R7431

R7451

L7113.6uH

LQH88PN3R6N38K

Q704MMBT3904(NXP)

E

B

C

Q706MMBT3904(NXP)E

B

C

Q703MMBT3904(NXP)

E

B

C

2SC3875SQ701

12

3

100uFC729

16V

C71847uF16V

READY

EAX64207701

MULTI VOLTAGE

Power

**Switch 12V:P12V, P5V -> 5V_12V_LCD

PANEL

**Switch 5V:P5V -> 5V_M

7 7

STAND_BY VOLTAGE

POWER

2011/5/6

MAX 300mA

OUT:3.3VMAX 3A

OUT:1.27V

TUNER VOLTAGE

**DC-DC CONVERTER 16.5V->5V_TUNER

R1

Vout=0.8*(1+R1/R2)3A

R2

5V_M -> 1.2V_VDDC_M8, 3.3V_M

16.5V TO 5V DCDC CONVERTER

PARK

Power indicator

Copyright © 2011 LG Electronics. Inc. All rights reserved. Only for training and service purposes

LGE Internal Use Only

Page 18: 22LK230-LP92R
Page 19: 22LK230-LP92R

Module (HD) Speaker

RF/AVHDMI

Digital Inputs Analog Inputs

Audio Amplifier(Digital)

TAS5709PHPRMSTAR(MARIA8)LGE7873

BIG-BANG Revision (MSTAR)

Analog AUDIO out

[ DESIGN CONCEPT ]

Module (HD) Speaker

RF/AV/COMPONENTHDMI

Digital Inputs Analog Inputs

Audio Amplifier(Digital)NPT3200LMSTAR

(MARIA8)LGE7871

BIG-BANG (MSTAR)

Hotel speaker out

Option

Page 20: 22LK230-LP92R

Spec TV Minimalist & Value Maximizers

Maria8 (HD) Maria8-Revision (HD)

Main Chip MSTAR Maria8(LGE7871) MSTAR Maria8(LGE7873)

Module WXGA WXGA

PSU PSU (19”/22” Lips) PSU (22” Lips)

PCB Size 206 x 90.5 (2 Layer) 130 x 103 (2 Layer)

PIP N N

1080p input support N (Support up to 720p for Component/HDMI ) N (Support up to 720p for Component/HDMI )

1080p Panel support N N

AV Output X (Only Support AV Audio Output) X (Only Support AV Audio Output)

Hotel Speaker Out Optional X

HDMI 1EA 1EA

Component 1EA X

AV 1EA 1EA

S-Video X X

RGB_PC X X

RS-232 X X

USB (Function) X X

USB(D/L SVC) X X

Tuner 1EA 1EA

Spec. Comparison

Page 21: 22LK230-LP92R

Item Detailed Item BigBang BigBang-Revision

UI OSD Font Type GUI Font Type GUI

Setup Program Edit Favorite Channel: supports 8 favorite channel

Favorite Channel: supports 8 favorite channel

Picture Picture Mode Vivid/Standard/Cinema(In Vivid/Standard/Cinema, Each items support User Mode)

Vivid/Standard/Cinema(In Vivid/Standard/Cinema, Each items support User Mode)

Advanced Control

Picture Mode value can be changed for all mode

Picture Mode value can be changed for all mode

Audio Sound Mode Standard/Music/Cinema

(In Standard/Music/Cinema,

Support Treble & Bass setting for all input)

Standard/Music/Cinema

(In Standard/Music/Cinema,

Support Treble & Bass setting for all input)

Clear Voice Not Support Not Support

Input Input List appearance in vertical box Input List appearance in vertical box

PIP Not Available Not Available

UI Comparison

Page 22: 22LK230-LP92R

[ BLOCK DIAGRAM ]

POWER BOARD

SIF SAWK9362M

Sound AMPTAS5709PH

IC501 ]

((

((

Module

JK201

Aud

io In

Vid

eo In

AudioOut

MST7873KM

VIF SAWK7257M

5

4

67

10 11

Tuner SDATuner SCL

TUNER

RF_AGC

B+

AIF+ AIF-

1

1Input

Input

45

45

IR/KEY

ST_5V 18

14.31818Mhz

2627

2524

IC603Serial Flash

2M

IC601EEPROM

24C64

IC602HDCP24C08

IC703DCDC

Converter

IC604

46Low PassFILTER

1

3936

P501

Aud

io In

OP-AMPIC502

x4 Gain

3635

P703 P204

Aud

io L

-Out

8 9 10 11

79~88

17

12 42 43

Aud

io R

-Out

HDMISCL/SDA

114115 116 117 70 69

Audio_SCL

Audio_SDA

LVDSOutputP

Dim

Inv.

ON

OLP

A D

im

P_16.5V

ST_3.3V

S_AMP_16.5V

A_OUT_16.5V

VIF_12V

P_16.5V

Tuner_5V

P_5V

IC7013.3V REG

Q705DUAL FET

AO4813

Main_5V IC7043.3V REG

Main_3.3V

IC702DCDC

Main_1.2V

A_OUT_16.5V

23 24

15202122

I2S_MCLKI2S_WSI2S_SCKI2S_SDO

D-SUBSCL/SDA

102 103

P201

52 106107105

IR

KE

YLe

d_K

eyLe

d_P

ower

66 55 58 59

5049

4

67

68

Main SDAMain SCL

110 111

74727371

SPI_CLKSPI_DISPI_CZSPI_DO

S_AMP_19V2 3

LCD

_5V

Page 23: 22LK230-LP92R

[ POWER FLOW DIAGRAM(1) ]

P_16.5V

P_5V 5V_LCD

3.3V_M

16V_S-Amp

5V_TUNERIC703

1A

1A

TPS54331D

SMAW200-11P703

A.Dim

1

2

3

4

5

6

7

8

9

10

11

5V

5V

GND

GND

NC

NC

Inverter_On

19V

19V

PWM_Dim

IC707

1A

16V_A-Out

12V_VIFAS7812ADTR-E1

IC7061A

AO4813(Switching)

5V_M

ST_5VIC701

ST_3.3V

IC7021.2V_VDDC_M8

IC704

5.13V /

16.2V /

4.98V /

1.33V /

3.42V /

3.42V /

12.3V /

5.08V /

16.1V /

16.1V /

5.09V /DCDC

LDO

LDO

DCDC

Vol Reg

DCDC

Q705 L708

L703

L203

L701

L702

4 : VCC

IC501 : TAS5709------------------------2 : PVDD_A_1, 3 : PVDD_A_213 : AVDD27 : DVDD34 : PVDD_D135 : PVDD_D240 : PVDD_C141 : PVDD_C244 : PVDD_B_1, 45 : PVDD_B_2

IC502 : Audio Amp

IC501 : TAS5709PHPR

1, 2, 3, 4, 5

P204 : HD

8 : VCC

IC602 : HDCP EEPROM

8 : VCC

IC603 : Serial Flash

8 : VCC

IC601 : EEPROM

TU401 : TDTK-G701D(B+)

IF Pre-amp

IC604 : MST7873KM44 , 77, 120

4 : ST_5V

IC604 : MST7873KM-----------------------------4 : AVDD_ADC11 : AVDD_ADC16 : AVDD_MPLL21 : AVDD_VIF22 : AVDD_VIF30 : AVDD_VIF32 : AVDD_AUSDM44 : VDDC_146 : AVDDP160 : PWM161 : PWM263 : AVDDP1 77 : VDDC_289 : AVDDP1101 : AVDDP1109 : AVDDP2118 : AVDDP1120 : VDDC_3125 : AVDD_ADC

4, 11, 21, 22, 30, 46,60, 61, 63, 89, 101, 118, 125

2, 3, 34, 35, 40, 41, 44, 45,

16, 32, 109,

5 : Tuner B+

P201 : IR + LED13, 27

IC501 : Audio Amp

5.11V /

Page 24: 22LK230-LP92R

[ POWER FLOW DIAGRAM (2) ]

16.5V_AOUT Audio Amp

IC502

4 : VCC

6 : INPUT2-

7 : OUT2

1 : OUT1

4 : INPUT1-R541

C553

R544

C556

C550

R539

R539

MNT_R OUT

Q503

C555R537

MNT_R OUTR536 C552

Q502

Sound AmpIC501TAS5709PHPR

2 : PVDD_A_13 : PVDD_A_244 : PVDD_B_145 : PVDD_B_240 : PVDD_C_141 : PVDD_C_216.5V_SAMP34 : PVDD_D_135 : PVDD_D_2

C511 C523

C516 C509

C525

C523

3.3V_MHDCP EEPROM(A8)IC602 (CAT24C08WI-GT3-H-RECV)

L602

L504

8 : VCC

M-Star ICIC604 (MST7873KM)

8 : VCC7 : HOLD

Serial Flash 2MIC603 (MX25L1606EM2I-12G)

46 : AVDDP1(56,63,89,101,109,118)

4 : AVDD_ADC (11,125)21 : AVDD_VIF (22,30)32 : AVDD_AUSDMST_3.3V

R691(Ready)

27 : DVDD

60 : PWM161 : PWM0

13 : AVDD

Sound AmpIC501 (TAS5709PHPR)

EEPROM(A0)IC601 (AT24C64D-SSHM-T)8 : VCC

L501 + 3.3V

3 : A27 : WP

R602

R614

C603 (0.1uF/16V)

C504

3 : AGCR608(10K)

C638

C508

R698(1K)

R689(1K)

C602 (0.01uF/50V)

Page 25: 22LK230-LP92R

2. PLUG DownLoad JIG to PC with USB Cable, then JIG RED LED on.

1. Unzip H5 Mstar Program.zip file to HDD

RGB(D-Sub) Cable to VSC(H5 TV)

USB Cable to PC

Move Switch to the Left-end

&Right RED LED On

PLUG USB Cable

ISP Program Download Method

[ ISP METHOD ]

Page 26: 22LK230-LP92R

3. After a few seconds later, new HardWare setup wizard window will pop up. – Ignore this

window (No Need to push anything).

You’ll see this window several times until finishing install DownLoad Program, but no need

to push anything for this window.

After finishing Installation, this window will be disappeared.

4. Execute Setup.exe in DB07-6 driver directory.(The location of directory can be different.)

Double Click !

Page 27: 22LK230-LP92R

5. Push Next(5-1), Select appropriate Directory Path and Push Next(5-2), and Push Next(5-3).

6. While installation, Warning Windows pop up, then push continue.

(5-1) Click ! (5-2) Click ! (5-3) Click !

(6-2) Click ! (6-3) Click !

(6-4) Click ! (6-5) Click !

Page 28: 22LK230-LP92R

7. After a minute, install will be finished.

(7-1) Click !

(7-2) Click !

8. Make a ISP_tool.exe short cut to desktop.

(8-1) Right Click !

(8-2) Fix the cursor to send(N) !

(8-3) Click “Make a short cut to desktop” !

Page 29: 22LK230-LP92R

3. Click the “Connect” button and confirm “Dialog Box”

1. Connect the download jig to D-sub (RGB) jack

2. Execute ‘ISP Tool’ program, the main window (M star ISP utility Vx.x.x) will be opened

S/W ISP Method

Page 30: 22LK230-LP92R

4. Click the “Config.” button and Change speed, I2C Speed setting : 350Khz~400Khz

5. Read and write bin file, Click “(1)Read” tab, and then load download file(XXXX.bin) by clicking “Read”.

Page 31: 22LK230-LP92R

6. Click “(2)Auto” tab and set as below

7. Click “(3)Run”.

8. After downloading, you can see the “(4)Pass” message.

Page 32: 22LK230-LP92R

No power(LED indicator off)

Check 5V of Power B/D

Change Power B/D

Pass

Check Voltage of P201#4St_5V

Check P201 Connector

Change LED Assy

: [A] PROCESS

Fail

Fail

Pass

Pass

Check LED Assy

Change Main B/D

Fail

[ TROUBLE SHOOTING GUIDE ]

Page 33: 22LK230-LP92R

No Raster [B]: Process

Check LED statusOn Display Unit

Repeat A PROCESS

Pass

Fail

Check Output of Q705 Change Q705Fail

Change Inverter ConnectorOr InverterFail

Pass

Fail

Pass

Change ModuleFail

Check LVDS Cable

Pass

Check Panel Link Cable Or Module

Change Panel Link CableOr Module

Check Inverter ConnectorOr Inverter

Pass

Page 34: 22LK230-LP92R

No Raster on COMPONENT Signal

Check Input source Cable And Jack

Pass

Re-soldering or Change the defect part

Pass

Check the Input/OutputOf IC604 Fail

Re-soldering or Change the defect part

Repeat [A], & [B] Process

Check The Input/OutputOf JK101 Fail

Pass

No Raster on HDMI Signal

Check Input source Cable And Jack

Pass

Check the Input/OutputOf JK301 Fail

Re-soldering or Change the defect part

Pass

Pass

Fail

Pass

Check EDID state in SVC ModeFail

Re-Download software

Pass

Check the Input/OutputOf IC602 Fail

Re-soldering or Change the defect part

Pass

Pass

Check the Input/OutputOf IC604 Fail

Re-soldering or Change the defect part

Repeat [A], & [B] Process

Page 35: 22LK230-LP92R

No Raster On AV Signal No Signal On TV(RF) Signal

Check Input source Cable And Jack

Pass

Check Input source Cable And Jack

Pass

Check The Input/OutputOf JK101

Pass

Re-soldering or Change the defect part

Pass

Fail

Pass

Repeat [A], & [B] Process

Check the Input/OutputOf IC604 Fail

Re-soldering or Change the defect part

Pass

Check The Input/OutputOf TU401

Pass

Re-soldering or Change the defect partFail

Check the Input/OutputOf IC703 Fail

Re-soldering or Change the defect part

Repeat [A], & [B] Process

Check the Input/OutputOf L402,L403 Fail

Re-soldering or Change the defect part

Pass

Pass

Page 36: 22LK230-LP92R

No Sound

Check The Input Sourse

Check The Input/OutputOf IC501

Re-soldering or Change the defect partFail

Pass

Pass

Check The Speaker Change Speaker Fail

Check The Speaker Wire

Pass

Change The Source InputFail