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LCD TVSERVICE MANUAL
CAUTIONBEFORE SERVICING THE CHASSIS,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LP92R
MODEL : 22LK230 22LK230-MA
North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in KoreaP/NO : MFL67263001 (1107-REV00)
North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in KoreaP/NO : MFL67263001 (1107-REV00)
North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in KoreaP/NO : MFL67263001 (1107-REV00)
North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in KoreaP/NO : MFL67263001 (1107-REV00)
LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 2 -
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ...................................................................................... 6
ADJUSTMENT INSTRUCTION ............................................................... 7
EXPLODED VIEW .................................................................................. 10
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in theSchematic Diagram and Exploded View.It is essential that these special safety parts should be replaced with the same components as recommended in this manual to preventShock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during theservicing of a receiver whose chassis is not isolated from the ACpower line. Use a transformer of adequate power rating as thisprotects the technician from accidents resulting in personal injuryfrom electrical shocks.
It will also protect the receiver and it's components from beingdamaged by accidental shorts of the circuitry that may beinadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposedmetallic parts of the cabinet, such as antennas, terminals, etc., tobe sure the set is safe to operate without damage of electricalshock.
Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect anelectrical jumper across the two AC plug prongs. Place the ACswitch in the on position, connect one lead of ohm-meter to the ACplug prongs tied together and touch other ohm-meter lead in turn toeach exposed metallic parts such as antenna terminals, phonejacks, etc. If the exposed metallic part has a return path to the chassis, themeasured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis thereading must be infinite.An other abnormality exists that must be corrected before thereceiver is returned to the customer.
Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitorbetween a known good earth ground (Water Pipe, Conduit, etc.)and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeterwith 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltagemeasurements for each exposed metallic part. Any voltagemeasured must not exceed 0.75 volt RMS which is corresponds to0.5 mA.In case any measurement is out of the limits specified, there ispossibility of shock hazard and the set must be checked andrepaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’sexposed METALLIC PARTS
Good Earth Groundsuch as WATER PIPE,CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Groundfor 1 second, Resistance must be less than 0.1*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15 uF
Ω
LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 4 -
CAUTION: Before servicing receivers covered by this servicemanual and its supplements and addenda, read and follow theSAFETY PRECAUTIONS on page 3 of this publication.NOTE: If unforeseen circumstances create conflict between thefollowing servicing precautions and any of the safety precautions onpage 3 of this publication, always follow the safety precautions.Remember: Safety First.
General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power
source before;a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.CAUTION: A wrong part substitution or incorrect polarityinstallation of electrolytic capacitors may result in anexplosion hazard.
2. Test high voltage only by measuring it with an appropriate highvoltage meter or other voltage measuring device (DVM,FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of itsassemblies.
4. Unless specified otherwise in this service manual, cleanelectrical contacts only by applying the following mixture to thecontacts with a pipe cleaner, cotton-tipped stick or comparablenon-abrasive applicator; 10 % (by volume) Acetone and 90 %(by volume) isopropyl alcohol (90 % - 99 % strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual, lubrication ofcontacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with whichreceivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of itselectrical assemblies unless all solid-state device heat sinks arecorrectly installed.
7. Always connect the test receiver ground lead to the receiverchassis ground before connecting the test receiver positivelead.Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in thisservice manual.CAUTION: Do not connect the test fixture ground strap to anyheat sink in this receiver.
Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged easilyby static electricity. Such components commonly are calledElectrostatically Sensitive (ES) Devices. Examples of typical ESdevices are integrated circuits and some field-effect transistors andsemiconductor "chip" components. The following techniquesshould be used to help reduce the incidence of componentdamage caused by static by static electricity.
1. Immediately before handling any semiconductor component orsemiconductor-equipped assembly, drain off any electrostaticcharge on your body by touching a known earth ground.Alternatively, obtain and wear a commercially availabledischarging wrist strap device, which should be removed toprevent potential shock reasons prior to applying power to theunit under test.
2. After removing an electrical assembly equipped with ESdevices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup orexposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESdevices.
4. Use only an anti-static type solder removal device. Some solderremoval devices not classified as "anti-static" can generateelectrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generateelectrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it.(Most replacement ES devices are packaged with leadselectrically shorted together by conductive foam, aluminum foilor comparable conductive material).
7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will beinstalled.CAUTION: Be sure no power is applied to the chassis or circuit,and observe all other safety precautions.
8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motion such asthe brushing together of your clothes fabric or the lifting of yourfoot from a carpeted floor can generate static electricitysufficient to damage an ES device.)
General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within therange or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composedof 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering techniquea. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it thereonly until the solder flows onto and around both thecomponent lead and the foil.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
d. Closely inspect the solder area and remove any excess orsplashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 5 -
IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) throughwhich the IC leads are inserted and then bent flat against thecircuit foil. When holes are the slotted type, the following techniqueshould be used to remove and replace the IC. When working withboards using the familiar round hole, use the standard techniqueas outlined in paragraphs 5 and 6 above.
Removal1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the soldermelts.
2. Draw away the melted solder with an anti-static suction-typesolder removal device (or with solder braid) before removing theIC.
Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and
solder it.3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as close as
possible to the component body.2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" withlong nose pliers to insure metal to metal contact then soldereach connection.
Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit
board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.
Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as
possible to diode body.2. Bend the two remaining leads perpendicular y to the circuit
board.3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and ifnecessary, apply additional solder.
Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.2. Securely crimp the leads of replacement component around
notch at stake top.3. Solder the connections.
CAUTION: Maintain original spacing between the replacedcomponent and adjacent components and the circuit board toprevent excessive component temperatures.
Circuit Board Foil RepairExcessive heat applied to the copper foil of any printed circuitboard will weaken the adhesive that bonds the foil to the circuitboard causing the foil to separate from or "lift-off" the board. Thefollowing guidelines and procedures should be followed wheneverthis condition is encountered.
At IC ConnectionsTo repair a defective copper pattern at IC connections use thefollowing procedure to install a jumper wire on the copper patternside of the circuit board. (Use this technique only on ICconnections).
1. Carefully remove the damaged copper pattern with a sharpknife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (ifused) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire andcarefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copperpattern and let it overlap the previously scraped end of the goodcopper pattern. Solder the overlapped area and clip off anyexcess jumper wire.
At Other ConnectionsUse the following technique to repair the defective copper patternat connections other than IC Pins. This technique involves theinstallation of a jumper wire on the component side of the circuitboard.
1. Remove the defective copper pattern with a sharp knife.Remove at least 1/4 inch of copper, to ensure that a hazardouscondition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the patternbreak and locate the nearest component that is directlyconnected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of thenearest component on one side of the pattern break to the leadof the nearest component on the other side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire is dressed so theit does not touch components or sharp edges.
LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 6 -
SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement.
1. Application rangeThis spec. sheet is applied to LCD TV used LP92R chassis.
2. SpecificationEach part is tested as below without special appointment.
1) Temperature: 25 ºC ± 5 ºC(77 ºF ± 9 ºF), CST: 40 ºC ± 5 ºC2) Relative Humidity : 65 % ± 10 %3) Power Voltage
: Standard input voltage(AC 100-240 V~, 50 / 60 Hz)* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followedeach drawing and specif ication by part number inaccordance with BOM.
5) The receiver must be operated for about 5 minutes prior tothe adjustment.
3. Test method1) Performance: LGE TV test method followed 2) Demanded other specification
- Safety: CE, IEC specification- EMC : CE, IEC
4. Model specificationNo. Item Specification Measurement Remark
1 Market Non-EU
2 Broadcasting system PAL/SECAM B/G/D/K, PAL I/II, NTSC-M
3 Available BAND PAL NTSC China(DK)
Channel VHF/UHF E2~C69 2~78 C1~C62
Cable S21~47 1~71 S1~S41
4. Receiving system Upper Heterodyne
5. Video Input PAL, SECAM, NTSC Rear (1EA)
6. AV Audio Output RF/AV/HDMI Audio Output Rear (1EA)
7. RGB Input S/W Upgrade Only Rear (1EA)
8. HDMI Input HDMI-DTV, Only PCM MODE Rear (1EA)
9. Audio Input (1EA) AV (1EA) L/R Input
5. HDMI Input(DTV)(HDMI DVI - Spec out)
No.Specification
Proposed RemarksResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out but display.
2 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4 720*480 31.47 59.94 27 SDTV 480P
5 720*480 31.5 60.00 27.027 SDTV 480P
6 720*576 31.25 50.00 27 SDTV 576P
7 1280*720 44.96 59.94 74.176 HDTV 720P
8 1280*720 45 60.00 74.25 HDTV 720P
9 1280*720 37.5 50.00 74.25 HDTV 720P
LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 7 -
ADJUSTMENT INSTRUCTION
1. Application RangeThis specification sheet is applied to all of the LCD TV, LP92Rchassis.
2. Specification(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolationtransformer will help protect test instrument.
(2) Adjustment must be done in the correct order.(3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relativehumidity if there is no specific designation.
(4) The input voltage of the receiver must keep AC 100-220V~, 50 / 60 Hz.
(5) The standard signal level is approved in 65 ± 1 dB µV.(6) The receiver must be operated for over 5 minutes prior to
the adjustment when module is in the circumstance ofabove 15 ºC.G In case of keeping module is in the circumstance of 0 °C,
it should be placed in the circumstance of above 15 °Cfor 2 hours.
G In case of keeping module is in the circumstance ofbelow -20 °C, it should be placed in the circumstance ofabove 15 °C for 3 hours.
3. Adjustment items3.1. PCB assembly adjustment items
(1) Download the MSTAR main software(IC604, Mstar ISP Utility)1) Using D/L Jig
(2) Input Tool-Option(3) Check SW Version.
3.2. SET assembly adjustment items(1) Input Area option(2) Adjustment of White Balance : Auto & Manual(3) Input Tool-Option/Area option(4) Preset CH information(5) Factoring Option Data input
4. PCB assembly adjustment method4.1. Mstar Main S/W program download4.1.1 Using D/L Jig
(1) Preliminary steps1) Connect the download jig to D-sub(JK302) jack or
P301(4P) Wafer.
(2) Download steps1) Execute ‘ISP Tool’ program, the main window(Mstar ISP
utility Vx.x.x) will be opened.2) Click the “Connect” button and confirm “Dialog Box”.
3) Click the “Config” button and Change speed.I2C Speed setting : 350 Khz ~ 400 Khz
1
Filexxx.bin
4) Read and write bin file.Click “(1)Read” tab, and then load download file(XXXX.bin) by clicking “Read”.
5) Click “(2)Auto” tab and set as below.6) Click “(3)Run”.7) After downloading, you can see the “4)Pass” message.
* If TV is Turn On, Check the updated SW Version andTool Option.
4.2. Input tool option.Adjust tool option refer to the BOM.- Tool Option Input : PCBA Check Process- Area Option Input : Set Assembly Process
After Input Tool Option and AC offBefore PCBA check, you have to change the Tool option andhave to AC off/on (Plug out and in)(If missing this process, set can operate abnormally)
(1) Profile : Must be changed the option value because beingdifferent with some setting value depend onmodule maker, inch and market.
(2) Equipment : Adjustment remote control(3) Adjustment method
- The input methods are same as other chassis.(Use IN-START key on the Adjustment remote control.)(If not changed the option, the input menu can differ themodel spec.)
Refer to Job Expression of each main chassis assembly(EBTxxxxxxxx) for Option value.
[Caution]- Don’t Press “IN-STOP” key after completing the function
inspection.- Don’t connect HDMI cable when downloading the EDID.If the cables are connected, Downloading of EDID couldbe failed.
4.3. EDID Data- EDID D/L method: The EDID data is automatically saved.* 22LK230
4.5. Check SW Version(1) Method
1) Push In-star key on Adjustment remote control.2) SW Version check
Check “Main : Vx.xx” - LK230
- 8 - LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved. Only for training and service purposes
1
Filexxx.bin
1
Filexxx.bin
** HDMI : 256Bytes
0 1 2 3 4 5 6 7 8 9 A B C D E F
0 0 FF FF FF FF FF FF 0 1E 6D 1 0 1 1 1 1
10 1 15 1 3 80 30 1B 78 0A F3 30 A4 54 46 96 26
20 0F 49 4B 20 0 0 1 1 1 1 1 1 1 1 1 1
30 1 1 1 1 1 1 1 1D 0 72 51 D0 1E 20 6E 28
40 55 0 E0 0E 11 0 0 1A 1 1D 0 BC 52 D0 1E 20
50 B8 28 55 40 E0 0E 11 0 0 1E 0 0 0 FD 0 31
60 3D 0F 2E 8 0 0A 20 20 20 20 20 20 0 0 0 FC
70 0 4C 47 20 54 56 0A 20 20 20 20 20 20 20 1 A2
80 2 3 1D 72 23 9 7 7 4A 6 7 15 16 2 3 11
90 12 84 93 83 1 0 0 65 3 0C 0 10 0 8C 0A D0
A0 8A 20 E0 2D 10 10 3E 96 0 E0 0E 11 0 0 18 8C
B0 0A A0 20 51 20 18 10 18 7E 23 0 E0 0E 11 0 0
C0 98 8C 0A D0 90 20 40 31 20 0C 40 55 0 E0 0E 11
D0 0 0 18 8C 0A A0 14 51 F0 16 0 26 7C 43 0 E0
E0 18 11 0 0 0 0 0 0 0 0 0 0 0 0 0 0
F0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 14
- 9 - LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. SET assembly adjustment method5.1. Input Area-Option
(1) Profile : Must be changed the Area option value becausebeing different of each Country’s Language andsignal Condition.
(2) Equipment : Adjustment remote control.(3) Adjustment method
- The input methods are same as other chassis.(Use IN-START key on the Adjustment remote control.)
Refer to Job Expression of each main chassis assembly(EBTxxxxxxxx) for Option value.
5.2. Adjustment of White Balance- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.- Principle : To adjust the white balance without the saturation,
Fix the one of R/G/B gain to 192 (default data)and decrease the others.
- Adjustment mode : Three modes - Cool / Medium / Warm(Medium data is automatically calibrated by the Cool data)
- Required Equipment1) Remote control for adjustment 2) Color Analyzer : CA100+ or CA-210 or same product
- LCD TV(ch : 9)(should be used in the calibrated ch by CS-1000)
3) Auto W/B adjustment instrument(only for auto adjustment)
5.2.1. Connecting diagram of equipment for measuring(For Automatic Adjustment)
* LP92A Support I2C Interface For ADC/DDC Adjustment.
(1) Enter the adjustment mode of DDC- 22 Set command delay time : 50 ms- Enter the DDC adjustment mode at the same time heat-
run mode when pushing the power on by power only key.- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heat-run pattern display)
(2) Release the DDC adjustment mode- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode- Release the Adjust mode when receiving the aging off
command(WB 00 FF) from adjustment equipment.- Need to transmit the aging off command to TV set after
finishing the adjustment.- Check DDC adjust mode release by exit key and release
DDC adjust mode)
(3) Enter the adjust mode of white balance- Enter the white balance adjustment mode with aging
command (F3, 00, 00)
(4) Release the adjust mode of white balance- Release the white balance adjustment mode with aging
command(F3, 00, FF)
* Luminance min value is 150cd in the Cool/Medium/Warmmode(For LCD)
5.2.2. Adjustment of White Balance (for Manual adjustment)(1) Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000(2) Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.(3) For manual adjustment, it is also possible by the following
sequence.1) Select white pattern of heat-run by pressing “POWER
ON” key on remote control for adjustment then operateheat run longer than 15 minutes. (If not executed thisstep, the condition for W/B may be different.)
2) Push “Exit” key.3) Change to the AV mode by remote control.4) Input external pattern (85 % white pattern)5) Push the ADJ key two time(entering White Balance
mode) -> Enter “04 13” (Password)6) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) usingD/E(CH +/-) key on R/C..
7) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.8) Adjust three modes all (Cool/ Medium/ Warm) : Fix the
one of R/G/B gain and change the others.9) When adjustment is completed, Exit adjustment mode
using EXIT key on R/C.
* CASEFirst adjust the coordinate far away from the target value(x, y).1) x, y > target
i) Decrease the R, G. 2) x, y < target
i) First decrease the B gain, ii) Decrease the one of the others.
3) x > target, y < targeti) First decrease B, so make y a little more than the target.ii) Adjust x value by decreasing the R
4) x < target, y > targeti) First decrease B, so make x a little more than the target.ii) Adjust x value by decreasing the G
(4) Standard color coordinate and temperature when using theCA100+ or CA210 equipment(Small size inch’s color coordinate is different from others,So use below table.)
To check the Coordinates of White Balance, you have tomeasure at the below conditions.Picture Mode : User 1Dynamic Contrast : OffDynamic Colour : Off(If you miss the upper condition, the coordinates of W/Bcan be lower than the spec.)
Coordinate Mode
x y Temp uv∆
Cool 0.280 ± 0.002 0.283 ± 0.002 9,300 K 0.000
Medium 0.290 ± 0.002 0.295 ± 0.002 8,000 K 0.000
Warm 0.308 ± 0.002 0.319 ± 0.002 6,500 K 0.000
- 10 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
300
200
530
540
401
400
900
510
120
LV1
910
810
A2
A10
820
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. Theseparts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components asrecommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
[AV]
MNT_ROUT
CVBS_LIN
D10230V
R104
10K
R10112K
R103
10K
D10730V
CVBS_RIN
MUTE_LINE
R10212K
MNT_LOUT
CVBS_VIN
R11075
D10830V
D10130V
MUTE_LINE
C10510uF16V
C10410uF16V
C106560pF50V
READY
C107560pF50V
READY
R128
1K
R127
1KC103
5600pF50V
C1025600pF
50V
R109220K
R108220K
JK101PPJ234-03
5A[RD1]O-SPRING
6A[RD1]E-LUG
4A[RD1]CONTACT
7B[WH1]E-LUG-S
5B[WH1]O-SPRING
7C[RD2]E-LUG-S
5C[RD2]O-SPRING
4C[RD2]CONTACT
5D[WH2]O-SPRING
4E[YL]CONTACT
5E[YL]O-SPRING
6E[YL]E-LUG
16.5V_AOUT
R114
47
FOR DEBUG
Q101ISA1530AC1
FOR DEBUGE BC
R106
220
FOR DEBUG
R111470
FOR DEBUG
R11268
FOR DEBUG
JP101MNT_VOUT_T
ZD101SD05ZD102SD05
Q105MMBT3904(NXP)
EB C
Q106MMBT3904(NXP)
EBC
Q102MMBT3904(NXP)
FOR DEBUGE
BC
Q103MMBT3904(NXP)
EB C
Q104MMBT3904(NXP)
EBC
INPUT
INPUT
EAX64207701 2011/5/6
1 7
POP NOISE
POP NOISE
AV IN/OUT
GAIN X 4
FOR DEBUG
Copyright © 2011 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TXCE3+
TXCE3-
TXCLKE+
TXCLKE-
TXCE2+
TXCE2-
TXCE1+
TXCE1-
TXCE0+
TXCE0-
LED_KEY
L203MBW3216-501TF
500-ohm
LED_POWER
ST_5V
3.3V_M
IR
KEY1
5V_LCD
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCLKE+,TXCLKE-
C206100pF50V
READY
C20547pF50V
READY
C209100pF50V
READY
C208100pF50V
C204100pF50V
READY
C2030.1uF50V
C2020.1uF50V
READY
C2010.1uF50V
C2070.1uF50V
C212100pF50V
READYKEY2
ST_3.3V
R20310K
R2064.7K
P20112507WR-08L
1KEY1
2KEY2
3GND
4+ST_5V
5GND
6IR
7LED_KEY
8LED_POWER
9
R2300
JEIDA
P204
FF10001-30
130
229
328
427
526
625
724
823
922
1021
1120
1219
1318
1417
1516
1615
1714
1813
1912
2011
2110
229
238
247
256
265
274
283
292
301
31
.
R2290
22"LGD/Tsinghua
ZD2005.6V
READY
ZD2045.6V
READY
ZD2055.6V
READY
ZD2015.6V
ZD2025.6V
READY
IR & LED
LVDS/IR_LED_KEY
HD(22")
LVDS/IR/KEY
EAX64207701 2011/5/6
2 7
Copyright © 2011 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
B_TX0+
TXCLK-
B_TX0-
G_TX1-
R_TX2+
HPDCTL
G_TX1+
HDMI_5V_DET
HDMI_SCL
R_TX2-
Q3012SC3052
E
B
C
TXCLK+
HDMI_SDA
R323
10K
R30110K
READY R313
10K
R32110K
R3204.7K
R3021K
R311 5.6
R308 5.6
R309 5.6
R305 5.6
R310 5.6
R307 5.6
R306 5.6
R312 5.6
JK301YKF45-7058V
14
13
5
20
SHIELD
12
11
2
19
18
10
4
1
17
9
8
3
16
7
6
15
D30430V
D30330V
DSUB_SCL
DSUB_SDA
JK302
SPG09-DB-0106630TGA004Q
RED
1
GREEN
2
BLUE
3
GND_1
4
DDC_GND
5
RED_GND6
GREEN_GND7
BLUE_GND8
NC9
SYNC_GND10
GND_2
11
DDC_DATA12
H_SYNC13
V_SYNC14
DDC_CLOCK15
SHILED16
HD_5V
5V_M
R3294.7K
C3020.1uF50V
R3314.7K
D302ENKMC2838-T112
A1
C
A2HD_5V
R303 10
R304 10
C30433pFREADY
C30333pFREADY
C30533pFREADY
C30633pFREADY
HDMI
HDMI
HDMI/RGB
EAX64207701 2011/5/6
3 7
I2C Control
Copyright © 2011 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TUNER_SDA
TUNER_SCL
5V_TUNER
0.01uF
C401
50V
PRE-AMP
0.01uF
C409
50V
PRE-AMP
0.01uF
C414
50V
VIF2
VIF1
SIF2
SIF1
TU_AGC
D401 30V
R411680
PRE-AMP
0.01uFC404
50V
C4130.1uF16V
ONLY_MAC4170.1uF16V
ONLY_MA
R418
100
R423 12K
C41147pF50V
C41247pF50V
R415
47
R414
47
C4100.1uF16V
READY
C40710uF10V
L403K7257M
ONLY_TA
2SWITCHING_INPUT
1INPUT
5 OUTPUT2
4 OUTPUT1
3 CHIP_CARRIER
L4042.2uH
READY
L401PRE-AMP
820nH
R4324.7K
R4334.7K
5V_M 5V_M
L402-*1M9370M
ONLY_MA
2INPUT-GND
1INPUT
5 OUTPUT_2
4 OUTPUT_1
3 CHIP_CARRIER-GND
L403-*1M3953M
ONLY_MA
2INPUT-GND
1INPUT
5 OUTPUT_2
4 OUTPUT_1
3
CHIP_CARRIER-GND
Q401BFS17WPRE-AMP
E
B
C
R404
0
PRE-AMP(TA)
R41222
PRE-AMPR42722
READY
C75522pF50V
READY
R4440
READY
R4450
READY
L402K9362M
ONLY_TA(NO_SW)
2INPUT-GND
1INPUT
5 OUTPUT2
4 OUTPUT1
3 CHIP_CARRIER-GND
R417
10K
TU_SW_VIF
R429
0
TU_SW_VIF
R42410K
TU_SW_VIF
5V_M
5V_M
Q4032SC3875S(ALY)TU_SW_VIF
E
B
C
TU_CTL_VIF
D403
35VKDS114E(KEC)
TU_SW_VIF
R4253.3K
TU_SW_VIF
R4196.8K
TU_SW_VIF
5V_M
R4206.8K
TU_SW_VIF
R4300
NO_SW_VIF
R403
0
No PRE-AMP
5V_M
R4090
PRE-AMP
TU401TDTK-G701D
ONLY_TA
5B+[+5V]
11AIF-
2NC_2
10NC_6
4RF_AGC
1NC_1
9NC_5
8NC_4
3NC_3
7SCL
6SDA
12
SHIELD
TU401-*1TDTK-H701F
ONLY_MA
5B+[+5V]
11DIF[-]/AIF-
2NC_2
10NC_6
4RF_AGC
1NC_1
9NC_5
8NC_4
3NC_3
7SCL
6SDA
12
SHIELD
R410
220
PRE-AMP(TA)
R4061.5K
PRE-AMP
R407820
PRE-AMP
0.01uF
C415
50V
5V_M
R4216.8K
TU_SW_SIF
R4226.8K
TU_SW_SIF
R4163.3K
TU_SW_SIF
R443
10K
TU_SW_SIFQ4022SC3875S(ALY)TU_SW_SIF
E
B
CR43610K
TU_SW_SIF
5V_M
TU_CTL_SIF
5V_M R428
0
TU_SW_SIF
D402
35VKDS114E(KEC)
TU_SW_SIF
R4310
NO_SW_SIF
L402-*2K9653D
ONLY_TA(SW)
2SWITCHING_INPUT
1INPUT
5 OUTPUT_2
4 OUTPUT_1
3 INPUT-GND/CHIP_CARRIER_GND
Near the pin
NTSC
PAL(w/o NT)
L403 L402
K7257 K9653
TUNER
EAX64207701 2011/5/6
4 7
TUNER
M3953
Layout placement Close to Tuner
Close to Mstar ICLayout placement
PAL-BG,DK,I NTSC-M
High LowTU_CTL_VIF
M9370
Copyright © 2011 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R5374.7K
C5526800pF50V
MNT_L_AMP
MNT_LOUT
16.5V_AOUT
R542
5.6K
16.5V_AOUT
MNT_ROUT
C55633pF50V
16.5V_AOUT
R5466.8K
MNT_R_AMP
R538
1K
R5476.8K
R539
1K
C55333pF50V
R543
5.6K
R5364.7K
C5556800pF50V
C5500.01uF50V
C5540.1uF50V
C5510.1uF50V
R54112K
R54412K
C5430.33uF50V
C5160.01uF
R507 33
C5141000pF50V
READY
C5200.01uF
C5250.01uF
R5043.3
C5011000pFREADY
10uFC512
25VREADY
C50410uF10V
C5400.33uF50V
C547
0.047uF
I2S_SCK
C5291uF25V
R526
470
C5494.7uF10V
R52422K
C548
0.047uF
R508 33
AUAMP_SDA
C546 4700pF
C545
4700pF
R5161K
C5210.01uF
R510 100
C535 0.033uF50V
C50810uF10V
C5220.01uF
C50233pF
READY
C5180.01uF
JP504
JP503
+3.3V_DVDD
C5170.01uF
C50333pF
READY
I2S_MCLK
R511 100
R512 100
SW_RESET
AUAMP_SCL
C5390.33uF50V
L501
MLB-201209-0120P-N2120-ohm
IC501
TAS5709PHPR
1OUT_A
2PVDD_A_1
3PVDD_A_2
4BST_A
5GVDD_OUT_1
6SSTIMER
7OC_ADJ
8NC
9AVSS
10
PLL_FLTM
11
PLL_FLTP
12
VR_ANA
13AVDD
14TESTOUT
15MCLK
16OSC_RES
17DVSS_1
18VR_DIG
19PDN
20LRCLK
21SCLK
22SDIN
23SDA
24SCL
25
RESET
26
STEST
27
DVDD
28
DVSS_2
29
GND
30
AGND
31
VREG
32
GVDD_OUT_2
33
BST_D
34
PVDD_D_1
35
PVDD_D_2
36
OUT_D
37 PGND_CD_138 PGND_CD_239 OUT_C40 PVDD_C_141 PVDD_C_242 BST_C43 BST_B44 PVDD_B_145 PVDD_B_246 OUT_B47 PGND_AB_148 PGND_AB_2
C532
2200pF C536
0.033uF50V
C5240.01uF
I2S_WS
10uFC509
25V
JP502
R520200
1%
C523
0.01uF
C5440.33uF50V
R523
22K
C5260.1uF
C5380.033uF50V
R51918K
1%
R5063.3
R509 33
C5270.1uF
R5053.3
C5370.033uF50V
I2S_SDO
L504
MLB-201209-0120P-N2120-ohm
R513 100
10uFC510
25VREADY
+3.3V_DVDD
10uFC511
25V
R525
470
JP501
C5190.01uF
R5033.3
C5311uF25V
3.3V_M
16.5V_SAMP
16.5V_SAMP
3.3V_M
IC502
SN324
3 INPUT1+
2 INPUT1-
4 VCC
1 OUT1
6 INPUT2-
5 INPUT2+
7 OUT2 8OUT3
9INPUT3-
10INPUT3+
11GND
12INPUT4+
13INPUT4-
14OUT4
R5144.7K
R5154.7K
3.3V_M
P501SMAW250-H04R
1.
2
3
4
C5420.47uF50V
C5410.47uF50V
Q503MMBT3904(NXP)
E
B
C
Q502MMBT3904(NXP)
E
B
C
R5020
L506AD-9060
15uH2S
1S 1F
2F
L507AD-9060
15uH2S
1S 1F
2F
L508
MLB-201209-0120P-N2120-ohm
L509
MLB-201209-0120P-N2120-ohm
L510
MLB-201209-0120P-N2120-ohm
L511
MLB-201209-0120P-N2120-ohm
AUDIO
AMP:GAIN X 4
AUDIO
EAX64207701 2011/5/6
5 7
SPK_R-
This parts are Located on AVSS area.
SPK_L+
SPK_L-
SPK_R+
Separate DGND AND AVSS
PULL DOWN
Copyright © 2011 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TXCE3+
TXCE3-
TXCLKE+
TXCLKE-
TXCE2+
TXCE2-
TXCE1+
TXCE1-
TXCE0+
TXCE0-
L605
120-ohm
AVDD_AUSDM
CVBS_VIN
B_TX0-
TXCE
0+,T
XCE0
-,TX
CE1+
,TXC
E1-,
TXCE
2+,T
XCE2
-,TX
CE3+
,TXC
E3-,
TXCL
KE+,
TXCL
KE-
C619 0.047uF
MAIN_SCL
VIF1
AVDD_VIF
SW601JTP-1127WEM
DEBUG
1
2 4
3
L602
120-ohm
AVDD_VIF SPI_CZ
5V_M
C6080.1uF16V
AVDD
P1
3.3V_M
P_16.5V
AVDD_VIF
SPI_CLKFLASH_WP
HPDCTL
I2S_
WS
ST_5V
TXCLK+
C6150.1uF16V
CVBS_RIN
ST_3.3V
AVDD_VIF
Q601ISA1530AC1
3.3V_M
I2S_
MCLK
MAIN_SDA
SIF1
TXCLK-
D602KDS181
C634
4.7u
F
AVDDP1
AVDD_MPLLC6070.1uF16V
ST_3.3V
SPI_CZ
CVBS_LIN
G_TX1+
1.2V_VDDC_M8
R611
100
TU_AGC
AVDDP1
C60147uF25V
R610
100
R609
150
D603KDS181
C6060.1uF16V
L601120-ohm
SPI_DO
R622
100
AVDD
_ADC
R6281M
L603
120-ohm
C6040.1uF16V
SPI_DI
I2S_
SCK
VDDC
L604
120-ohm
G_TX1-
SPI_DI
AVDD_AUSDM
B_TX0+
SPI_CLK
3.3V_M
I2S_
SDO
SPI_DO
SIF2
C627 2.2uF
AVDD_MPLL
C628 2.2uF
AVDDP2
C6114.7uF10V
AVDD_ADC
AVDD_ADC
HWRESET
VDDC
VIF2
D601KDS181
AVDDP1
INV_
ON
X60114.31818MHz
C6520.1uF
C660
0.1uFC6580.1uF
C659
0.1u
F
C656
0.1u
F
C645 0.1uF
C6440.1uF
C661
0.1u
F
C648 0.1uF
C642 0.1uFREADY
C6510.1uF
C6410.1uF
C632
0.1u
F
R6891K
R6901K
READY
R6981K
R6991K
READY
R607
100
R681
100
R682
100
R642 200
AVDD
P1
AVDD
P1
MNT_L_AMP
MNT_R_AMP
R673
22DS
UB_S
DA
AVDD
P1
PANE
L_ST
ATUS
R671
100
IR
AVDD
P2
VDDC
KEY2
KEY1HDMI
_SCL
HDMI
_SDA
POWE
R_SW
HWRE
SET
AVDD_ADC
C620 0.047uF
C610100pF50V
C6460.1uF
C6660.1uF
R691
0
READY
C6020.01uF50V
0.01uFC654
50V
0.01uFC663
50V
0.01uFC664
50V
R60810K
R621
100R62433K
R672
4.7K
R668
4.7K
R666
4.7K
R6041K
R603
1K
R612
2KR61310K
3.3V_M
LED_
POWE
R
FLAS
H_WP
TUNE
R_SD
A
TUNE
R_SC
L
R615
22
R616
22
C667
0.1u
FRE
ADY
LED_
KEY
C665
0.1u
F
ST_3.3V
R663
4.7K
ST_3.3V
R633 68
R645
1K
R644
1K
R63233
MUTE
_LIN
E
100
R661
TU_SW_SIF
C65010uF10V
C64310uF10V
C64910uF10V
C63810uF10V
C61410uF10V
C633
10uF
C635
1uF
R665
100
R667
100
C612 27pF
C613 27pF
R684
100
C653
0.01
uF
L606
600
R625
5.6K
R648
4.7K
READ
YR6
4710
0RE
ADY
R646
22K
R643
22K
C636
0.01
uF
C637
0.01
uF
R6934.7K
READY
3.3V_M
R6924.7K
C6551uF10V
IC603MX25L1606EM2I-12G
3WP#/AGC
2SO/SIO1
4GND
1CS#
5SI/SIO0
6SCLK
7HOLD#
8VCC
R_TX2-
R_TX2+
DSUB_SCLR675 22
R674
4.7K
ST_3.3V
ST_3.3V
MAIN_SDA
MAIN_SCL
C6620.1uF16V
AUAMP_SCL
AUAMP_SDA
MUTE_LINER685 100
ST_3.3V
SW_RESET
R670100
A_DI
M
R669100
P_DI
M
C6310.1uF
VDDC
100
R651
READY
100
R649
HDMI
_5V_
DET
R6066.8K
TU_CTL_VIF
DDC_
CTL
R6144.7K
R617
22
3.3V_M
R655
100
R6580
READY
R618
22
MAIN_SCL
R653
0
READY
MAIN_SDA
C6030.1uF16V
DDC_CTL
R6024.7K
IC601AT24C64D-SSHM-T
3A2
2A1
4GND
1A0
5SDA
6SCL
7WP
8VCC
IC602CAT24C08WI-GT3-H-RECV(TV)
3A2
2NC_2
4VSS
1NC_1
5SDA
6SCL
7WP
8VCC
PANE
L_ON
MNT_VOUT_T
OLPR687 100OLP
R6964.7K
R6974.7K
3.3V_M
R695 100
R694 100
R626 100
R627 100
R650 100TU_SW_VIF
R619
100
100
R654
100
R656
R664
100
R660
100
R631 33
R630 33
R6010
READY
IC604
LGE7873-LF
1RXA2N
2RXA2P
3AVSS_1
4AVDD_1
5BIN0
6GIN0M
7GIN0
8SOGIN0
9RIN0
10VSYNC0
11AVDD_ADC
12CVBS0
13VCOM0
14CVBSOUT
15AVSS_ADC
16AVDD_2
17XTAL_OUT
18XTAL_IN
19AVSS_2
20AVSS_3
21AVDD_3
22AVDD_VIF_1
23AVSS_VIF_1
24VIFIP
25VIFIM
26SIFIM
27SIFIP
28AVSS_VIF_2
29VR27
30AVDD_VIF_2
31TAGC
32AVDD_4
33LINE_IN_0L
34LINE_IN_0R
35LINE_IN_1L
36LINE_IN_1R
37AUCOM
38AUVRM
39
AUVRP
40
AUVAG
41
AVSS_4
42
LINE
_OUT
_0L
43
LINE
_OUT
_0R
44
VDDC_1
45
GND_1
46
VDD_1
47
GPIOB[12]
48
GPIOB[11]
49
GPIOB[10]
50
GPIOB[9]
51
GPIOB[8]
52
GPIOB[3]
53
GPIOB[2]
54
GPIOB[1]
55
GPIOB[0]
56
VDD_2
57
GND_2
58
PWM3
59
PWM2
60
PWM1
61
PWM0
62
TESTPIN
63
VDD_3
64
ALE
65 RDZ66 WRZ67 AD[3]68 AD[2]69 AD[1]70 AD[0]71 SPI_DO72 SPI_DI73 SPI_CZ74 SPI_CK75 GPIOD[1]76 GPIOD[0]77 VDDC_278 VSS_179 LVB3N80 LVB3P81 LVBCLKN82 LVBCLKP83 LVB2N84 LVB2P85 LVB1N86 LVB1P87 LVB0N88 LVB0P89 VDD_490 LVA3N91 LVA3P92 LVACLKN93 LVACLKP94 LVA2N95 LVA2P96 LVA1N97 LVA1P98 LVA0N99 LVA0P
100 GND_3101 AVDD_5102 DDCA_CLK1
03
DDCA_DAT
104
INT
105
IRIN
106
SAR2
107
SAR1
108
SAR0
109
VDD_5
110
DDCD_SCL
111
DDCD_SDA
112
RESET
113
WAKEUP
114
AUSDO
115
AUSCK
116
AUWS
117
AUMCKO
118
VDD_6
119
VSS_2
120
VDDC_3
121
RXACN
122
RXACP
123
RXA0N
124
RXA0P
125
AVDD_6
126
RXA1N
127
RXA1P
128
HOTP
LUG
C62233pF
READY
C62133pFREADY
C62433pFREADY
C62333pFREADY
C62533pFREADY
R620
100
C6404.7uF10V
TU_C
TL_S
IF
R6590
R662
0
R683
0
R676
0
R686
0
EAX64207701
MARIA8 128PIN
SERIAL FLASH 2M
MAIN(MARIA8)
2011/5/6
6 7
EEPROM(A0)
Seperate with IC ground
Close to IC as close as possible
RESET
10k=>6.8k,Park
HDCP EEPROM(A8)
Closed IC
Closed IC
Closed IC
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Closed IC
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Closed IC
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CCl
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IC
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Copyright © 2011 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C70447uF25V
0.01uFC708
50V
5V_M
C70510uF16V
L702
500
P_16.5V
P_16.5V
R711
4.7K
R715
1K
5V_LCD
P_5VP_DIM
R729
10K
R73422K
R7123K
P_5V
R7351.6K
C7062.2uF16V
POWER_SW
C7120.1uF50V
P_5V
L703
120-ohm
0.01uFC748
50V
C7310.1uF50V
16.5V_SAMP
0.01uFC737
50V
5V_M
R706
0
READY
P_5V
L708
120-ohm
MLB-201209-0120P-N2
R713
10K
R73233K
R725
10K
C70368uF35V
P_16.5V
C7012.2uF16V
READY
R72710K
READY
ST_5V
R709-*1
1K
DC_DIM
0.01uFC709
50V
A_DIM
R709
100
PWM_DIM
PANEL_ON
C7191uF25V
C7211uF25V
C7020.47uF25V
R728
10K
C745100uF16V
0.01uFC707
50V
L701
120-ohm
L705
120-ohm
INV_ON
16.5V_AOUTST_3.3V
C7141uF25V
READY
IC701AP2121N-3.3TRE1
1
GND
2 VOUT3VINST_5V
1.2V_VDDC_M8
C7230.1uF50V
3.3V_M
IC704AZ1085S-3.3TR/E1
1
ADJ/GND
2 OUTPUT3INPUT
5V_M
0.01uFC713
25V
C73410uF10V
C73310uF10V
10uFC710
10V
0.01uFC711
50V
R7166.2K
3.3V_M
R75610K
R75510K
READY
PANEL_STATUS
ST_3.3V
R764
10K
R76510K
R7494.7K
R7474.7K
R7524.7K
5V_TUNER
110R759
READY
IC706AP1117EG-13
READY
1
ADJ/GND
2 OUT3IN
C7430.1uF16V
READYC74110uF16V
READYC74010uF16V
READY
R757330
READY
R75410K
ST_3.3V
Q705AO4813
EBK60706901
3S1
2G2
4G1
1S2
5 D1_1
6 D1_2
7 D2_1
8 D2_2
C775
0.01uF50V
C7800.1uF16V
R78575K1/8W1%
C7763300pF
50V
C77110uF10V
R7827.5K
1/16W 5%
IC702SN1007054RTER
1VIN_1
3GND_1
7COMP
9 SS
10 PH_1
11 PH_2
12 PH_3
13
BOOT
14
PWRGD
15
EN
16
VIN_3
5AGND
8RT/CLK
6VSENSE
4GND_2
2VIN_2 17
EP[GND]
R784
22K1%
C779100pF50V
C773
0.1uF16V
R783
24K
1%
C7720.1uF16V
C7740.1uF
16V
R781330K1/10W 5%
C77722uF10V
C77822uF10V
R78010K
C7490.1uF16V
READY
R741
100K
C76010uF25V
R772
3.9K
C7630.1uF
16V
C764
47uF16V
C7684700pF50V
D701
40V
SMAB34
R74227K
C76522uF10V
IC703TPS54331D
3EN
2VIN
4SS/TR
1BOOT
5VSENSE
6COMP
7GND
8PH
C7620.022uF16V
C7660.1uF50V C769
0.1uF50V
READY
C76747pF50V
C7610.1uF50V
L7096.8uH
P_16.5V
R771
20K
R770
499
1%
R7401
READYC75047uF16V
READY
R73310K
P703
SMAW200-12
116.5V
216.5V
3GND
4GND
55V
65V
7GND
8OLP
9Inverter_ON
10PWM_Dim
11A.Dim
12NC
OLP
R7364.7K
5V_M
L706
120-ohm
DCDC_5V_TUNER
R70110K
FOR DEBUGR7031.2K
FOR DEBUG
ST_5V 5V_M
LD701SAM2333
FOR DEBUG
R7431
R7451
L7113.6uH
LQH88PN3R6N38K
Q704MMBT3904(NXP)
E
B
C
Q706MMBT3904(NXP)E
B
C
Q703MMBT3904(NXP)
E
B
C
2SC3875SQ701
12
3
100uFC729
16V
C71847uF16V
READY
EAX64207701
MULTI VOLTAGE
Power
**Switch 12V:P12V, P5V -> 5V_12V_LCD
PANEL
**Switch 5V:P5V -> 5V_M
7 7
STAND_BY VOLTAGE
POWER
2011/5/6
MAX 300mA
OUT:3.3VMAX 3A
OUT:1.27V
TUNER VOLTAGE
**DC-DC CONVERTER 16.5V->5V_TUNER
R1
Vout=0.8*(1+R1/R2)3A
R2
5V_M -> 1.2V_VDDC_M8, 3.3V_M
16.5V TO 5V DCDC CONVERTER
PARK
Power indicator
Copyright © 2011 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
Module (HD) Speaker
RF/AVHDMI
Digital Inputs Analog Inputs
Audio Amplifier(Digital)
TAS5709PHPRMSTAR(MARIA8)LGE7873
BIG-BANG Revision (MSTAR)
Analog AUDIO out
[ DESIGN CONCEPT ]
Module (HD) Speaker
RF/AV/COMPONENTHDMI
Digital Inputs Analog Inputs
Audio Amplifier(Digital)NPT3200LMSTAR
(MARIA8)LGE7871
BIG-BANG (MSTAR)
Hotel speaker out
Option
Spec TV Minimalist & Value Maximizers
Maria8 (HD) Maria8-Revision (HD)
Main Chip MSTAR Maria8(LGE7871) MSTAR Maria8(LGE7873)
Module WXGA WXGA
PSU PSU (19”/22” Lips) PSU (22” Lips)
PCB Size 206 x 90.5 (2 Layer) 130 x 103 (2 Layer)
PIP N N
1080p input support N (Support up to 720p for Component/HDMI ) N (Support up to 720p for Component/HDMI )
1080p Panel support N N
AV Output X (Only Support AV Audio Output) X (Only Support AV Audio Output)
Hotel Speaker Out Optional X
HDMI 1EA 1EA
Component 1EA X
AV 1EA 1EA
S-Video X X
RGB_PC X X
RS-232 X X
USB (Function) X X
USB(D/L SVC) X X
Tuner 1EA 1EA
Spec. Comparison
Item Detailed Item BigBang BigBang-Revision
UI OSD Font Type GUI Font Type GUI
Setup Program Edit Favorite Channel: supports 8 favorite channel
Favorite Channel: supports 8 favorite channel
Picture Picture Mode Vivid/Standard/Cinema(In Vivid/Standard/Cinema, Each items support User Mode)
Vivid/Standard/Cinema(In Vivid/Standard/Cinema, Each items support User Mode)
Advanced Control
Picture Mode value can be changed for all mode
Picture Mode value can be changed for all mode
Audio Sound Mode Standard/Music/Cinema
(In Standard/Music/Cinema,
Support Treble & Bass setting for all input)
Standard/Music/Cinema
(In Standard/Music/Cinema,
Support Treble & Bass setting for all input)
Clear Voice Not Support Not Support
Input Input List appearance in vertical box Input List appearance in vertical box
PIP Not Available Not Available
UI Comparison
[ BLOCK DIAGRAM ]
POWER BOARD
SIF SAWK9362M
Sound AMPTAS5709PH
IC501 ]
((
((
Module
JK201
Aud
io In
Vid
eo In
AudioOut
MST7873KM
VIF SAWK7257M
5
4
67
10 11
Tuner SDATuner SCL
TUNER
RF_AGC
B+
AIF+ AIF-
1
1Input
Input
45
45
IR/KEY
ST_5V 18
14.31818Mhz
2627
2524
IC603Serial Flash
2M
IC601EEPROM
24C64
IC602HDCP24C08
IC703DCDC
Converter
IC604
46Low PassFILTER
1
3936
P501
Aud
io In
OP-AMPIC502
x4 Gain
3635
P703 P204
Aud
io L
-Out
8 9 10 11
79~88
17
12 42 43
Aud
io R
-Out
HDMISCL/SDA
114115 116 117 70 69
Audio_SCL
Audio_SDA
LVDSOutputP
Dim
Inv.
ON
OLP
A D
im
P_16.5V
ST_3.3V
S_AMP_16.5V
A_OUT_16.5V
VIF_12V
P_16.5V
Tuner_5V
P_5V
IC7013.3V REG
Q705DUAL FET
AO4813
Main_5V IC7043.3V REG
Main_3.3V
IC702DCDC
Main_1.2V
A_OUT_16.5V
23 24
15202122
I2S_MCLKI2S_WSI2S_SCKI2S_SDO
D-SUBSCL/SDA
102 103
P201
52 106107105
IR
KE
YLe
d_K
eyLe
d_P
ower
66 55 58 59
5049
4
67
68
Main SDAMain SCL
110 111
74727371
SPI_CLKSPI_DISPI_CZSPI_DO
S_AMP_19V2 3
LCD
_5V
[ POWER FLOW DIAGRAM(1) ]
P_16.5V
P_5V 5V_LCD
3.3V_M
16V_S-Amp
5V_TUNERIC703
1A
1A
TPS54331D
SMAW200-11P703
A.Dim
1
2
3
4
5
6
7
8
9
10
11
5V
5V
GND
GND
NC
NC
Inverter_On
19V
19V
PWM_Dim
IC707
1A
16V_A-Out
12V_VIFAS7812ADTR-E1
IC7061A
AO4813(Switching)
5V_M
ST_5VIC701
ST_3.3V
IC7021.2V_VDDC_M8
IC704
5.13V /
16.2V /
4.98V /
1.33V /
3.42V /
3.42V /
12.3V /
5.08V /
16.1V /
16.1V /
5.09V /DCDC
LDO
LDO
DCDC
Vol Reg
DCDC
Q705 L708
L703
L203
L701
L702
4 : VCC
IC501 : TAS5709------------------------2 : PVDD_A_1, 3 : PVDD_A_213 : AVDD27 : DVDD34 : PVDD_D135 : PVDD_D240 : PVDD_C141 : PVDD_C244 : PVDD_B_1, 45 : PVDD_B_2
IC502 : Audio Amp
IC501 : TAS5709PHPR
1, 2, 3, 4, 5
P204 : HD
8 : VCC
IC602 : HDCP EEPROM
8 : VCC
IC603 : Serial Flash
8 : VCC
IC601 : EEPROM
TU401 : TDTK-G701D(B+)
IF Pre-amp
IC604 : MST7873KM44 , 77, 120
4 : ST_5V
IC604 : MST7873KM-----------------------------4 : AVDD_ADC11 : AVDD_ADC16 : AVDD_MPLL21 : AVDD_VIF22 : AVDD_VIF30 : AVDD_VIF32 : AVDD_AUSDM44 : VDDC_146 : AVDDP160 : PWM161 : PWM263 : AVDDP1 77 : VDDC_289 : AVDDP1101 : AVDDP1109 : AVDDP2118 : AVDDP1120 : VDDC_3125 : AVDD_ADC
4, 11, 21, 22, 30, 46,60, 61, 63, 89, 101, 118, 125
2, 3, 34, 35, 40, 41, 44, 45,
16, 32, 109,
5 : Tuner B+
P201 : IR + LED13, 27
IC501 : Audio Amp
5.11V /
[ POWER FLOW DIAGRAM (2) ]
16.5V_AOUT Audio Amp
IC502
4 : VCC
6 : INPUT2-
7 : OUT2
1 : OUT1
4 : INPUT1-R541
C553
R544
C556
C550
R539
R539
MNT_R OUT
Q503
C555R537
MNT_R OUTR536 C552
Q502
Sound AmpIC501TAS5709PHPR
2 : PVDD_A_13 : PVDD_A_244 : PVDD_B_145 : PVDD_B_240 : PVDD_C_141 : PVDD_C_216.5V_SAMP34 : PVDD_D_135 : PVDD_D_2
C511 C523
C516 C509
C525
C523
3.3V_MHDCP EEPROM(A8)IC602 (CAT24C08WI-GT3-H-RECV)
L602
L504
8 : VCC
M-Star ICIC604 (MST7873KM)
8 : VCC7 : HOLD
Serial Flash 2MIC603 (MX25L1606EM2I-12G)
46 : AVDDP1(56,63,89,101,109,118)
4 : AVDD_ADC (11,125)21 : AVDD_VIF (22,30)32 : AVDD_AUSDMST_3.3V
R691(Ready)
27 : DVDD
60 : PWM161 : PWM0
13 : AVDD
Sound AmpIC501 (TAS5709PHPR)
EEPROM(A0)IC601 (AT24C64D-SSHM-T)8 : VCC
L501 + 3.3V
3 : A27 : WP
R602
R614
C603 (0.1uF/16V)
C504
3 : AGCR608(10K)
C638
C508
R698(1K)
R689(1K)
C602 (0.01uF/50V)
2. PLUG DownLoad JIG to PC with USB Cable, then JIG RED LED on.
1. Unzip H5 Mstar Program.zip file to HDD
RGB(D-Sub) Cable to VSC(H5 TV)
USB Cable to PC
Move Switch to the Left-end
&Right RED LED On
PLUG USB Cable
ISP Program Download Method
[ ISP METHOD ]
3. After a few seconds later, new HardWare setup wizard window will pop up. – Ignore this
window (No Need to push anything).
You’ll see this window several times until finishing install DownLoad Program, but no need
to push anything for this window.
After finishing Installation, this window will be disappeared.
4. Execute Setup.exe in DB07-6 driver directory.(The location of directory can be different.)
Double Click !
5. Push Next(5-1), Select appropriate Directory Path and Push Next(5-2), and Push Next(5-3).
6. While installation, Warning Windows pop up, then push continue.
(5-1) Click ! (5-2) Click ! (5-3) Click !
(6-2) Click ! (6-3) Click !
(6-4) Click ! (6-5) Click !
7. After a minute, install will be finished.
(7-1) Click !
(7-2) Click !
8. Make a ISP_tool.exe short cut to desktop.
(8-1) Right Click !
(8-2) Fix the cursor to send(N) !
(8-3) Click “Make a short cut to desktop” !
3. Click the “Connect” button and confirm “Dialog Box”
1. Connect the download jig to D-sub (RGB) jack
2. Execute ‘ISP Tool’ program, the main window (M star ISP utility Vx.x.x) will be opened
S/W ISP Method
4. Click the “Config.” button and Change speed, I2C Speed setting : 350Khz~400Khz
5. Read and write bin file, Click “(1)Read” tab, and then load download file(XXXX.bin) by clicking “Read”.
6. Click “(2)Auto” tab and set as below
7. Click “(3)Run”.
8. After downloading, you can see the “(4)Pass” message.
No power(LED indicator off)
Check 5V of Power B/D
Change Power B/D
Pass
Check Voltage of P201#4St_5V
Check P201 Connector
Change LED Assy
: [A] PROCESS
Fail
Fail
Pass
Pass
Check LED Assy
Change Main B/D
Fail
[ TROUBLE SHOOTING GUIDE ]
No Raster [B]: Process
Check LED statusOn Display Unit
Repeat A PROCESS
Pass
Fail
Check Output of Q705 Change Q705Fail
Change Inverter ConnectorOr InverterFail
Pass
Fail
Pass
Change ModuleFail
Check LVDS Cable
Pass
Check Panel Link Cable Or Module
Change Panel Link CableOr Module
Check Inverter ConnectorOr Inverter
Pass
No Raster on COMPONENT Signal
Check Input source Cable And Jack
Pass
Re-soldering or Change the defect part
Pass
Check the Input/OutputOf IC604 Fail
Re-soldering or Change the defect part
Repeat [A], & [B] Process
Check The Input/OutputOf JK101 Fail
Pass
No Raster on HDMI Signal
Check Input source Cable And Jack
Pass
Check the Input/OutputOf JK301 Fail
Re-soldering or Change the defect part
Pass
Pass
Fail
Pass
Check EDID state in SVC ModeFail
Re-Download software
Pass
Check the Input/OutputOf IC602 Fail
Re-soldering or Change the defect part
Pass
Pass
Check the Input/OutputOf IC604 Fail
Re-soldering or Change the defect part
Repeat [A], & [B] Process
No Raster On AV Signal No Signal On TV(RF) Signal
Check Input source Cable And Jack
Pass
Check Input source Cable And Jack
Pass
Check The Input/OutputOf JK101
Pass
Re-soldering or Change the defect part
Pass
Fail
Pass
Repeat [A], & [B] Process
Check the Input/OutputOf IC604 Fail
Re-soldering or Change the defect part
Pass
Check The Input/OutputOf TU401
Pass
Re-soldering or Change the defect partFail
Check the Input/OutputOf IC703 Fail
Re-soldering or Change the defect part
Repeat [A], & [B] Process
Check the Input/OutputOf L402,L403 Fail
Re-soldering or Change the defect part
Pass
Pass
No Sound
Check The Input Sourse
Check The Input/OutputOf IC501
Re-soldering or Change the defect partFail
Pass
Pass
Check The Speaker Change Speaker Fail
Check The Speaker Wire
Pass
Change The Source InputFail