9326 d2Uv2 NodeB Product Description V2.0 Sep08

Alcatel-Lucent 9326 digital 2U

V2 Node B

Product Description

_________________________________________________________________________________________

Document Number: UMT/BTS/INF/024277 Document Issue: 02.00 / EN Document Status: Standard Date of Issue: 29/SEP/2008

_________________________________________________________________________________________

9326 DIGITAL 2U V2 NODE B PRODUCT DESCRIPTION SEPTEMBER 2008

Document Number: UMT/BTS/INF/024227 | Document Issue: 02.00 / EN | Document Status: Standard

Alcatel-Lucent Proprietary

See Notice on Page 2 2 / 33

Copyright 2008 by Alcatel-Lucent Technologies. All Rights Reserved.

About Alcatel-Lucent

Alcatel-Lucent (Euronext Paris and NYSE: ALU) provides solutions that enable service

providers, enterprises and governments worldwide, to deliver voice, data and video

communication services to end-users. As a leader in fixed, mobile and converged broadband

networking, IP technologies, applications, and services, Alcatel-Lucent offers the end-to-end

solutions that enable compelling communications services for people at home, at work and on

the move. For more information, visit Alcatel-Lucent on the Internet: http://www.alcatel-

lucent.com.

Notice

The information contained in this document is subject to change without notice. At the time

of publication, it reflects the latest information on Alcatel-Lucents offer, however, our policy

of continuing development may result in improvement or change to the specifications

described.

All the photos and drawings are not contractual and can change without notice.

Trademarks

The following trademarks are used throughout this document:

Alcatel-Lucent, Alcatel, Lucent Technologies and their respective logos are trademarks and

service marks of Alcatel-Lucent, Alcatel and Lucent Technologies.





CONTENTS

1 INTRODUCTION ................................................................................................6

1.1 OVERVIEW..................................................................................................... 6 1.2 SCOPE OF THIS DOCUMENT ..................................................................................... 6

2 PRODUCT OVERVIEW..........................................................................................7

2.1 TARGET CONTEXT ............................................................................................. 7 2.2 PHYSICAL OVERVIEW ........................................................................................... 7

2.2.1 Main Characteristics............................................................................... 7 2.2.2 Layout ............................................................................................... 8 2.2.3 External Dimensions ............................................................................... 9 2.2.4 Weight ............................................................................................... 9

3 PRODUCT DESCRIPTION .................................................................................... 10

3.1 ICCM-U .....................................................................................................11 3.1.1 ICCM-U Interfaces.................................................................................11 3.1.2 Dimensions .........................................................................................11 3.1.3 ICCM-U Face Plate ................................................................................12

3.2 CHANNEL ELEMENT MODULE (ICEM-U)........................................................................13 3.2.1 ICEM-U Interfaces .................................................................................13 3.2.2 Dimensions .........................................................................................13 3.2.3 ICEM-U Face Plate ................................................................................14

3.3 XCCM-U.....................................................................................................15 3.3.1 xCCM-U Interfaces ................................................................................15 3.3.2 Dimensions .........................................................................................16 3.3.3 xCCM-U Face Plate................................................................................16

3.4 CHANNEL ELEMENT MODULE (XCEM-U) .......................................................................16 3.4.1 xCEM-U Interfaces ................................................................................16 3.4.2 Dimensions .........................................................................................16 3.4.3 xCEM-U Face Plate ................................................................................17

3.5 RBP .........................................................................................................17 3.6 RUC.........................................................................................................18 3.7 POWER SYSTEM...............................................................................................18 3.8 CONTROL UNIT ...............................................................................................19 3.9 OPTIONS .....................................................................................................19 3.10 ENVIRONMENTAL AND REGULATORY REQUIREMENTS .........................................................19

3.10.1 General .............................................................................................19 3.10.2 Operation Temperature and Humidity.........................................................22 3.10.3 Acoustic Noise .....................................................................................22 3.10.4 Vibration ...........................................................................................22 3.10.5 Shock................................................................................................22 3.10.6 Ingress Protection.................................................................................22 3.10.7 Regulatory Requirements........................................................................22 3.10.8 Safety...............................................................................................22 3.10.9 EMC .................................................................................................23 3.10.10 Ecology..........................................................................................23

4 EVOLIUM INTEGRATION .................................................................................... 24

4.1 MAXIMUM GSM CONFIGURATION SUPPORTED....................................................................25 4.1.1 Indoor...............................................................................................25 4.1.2 Outdoor.............................................................................................25

5 POWER SUPPLY UNITS INTEGRATION .................................................................... 26

5.1 MAIN CHARACTERISTICS .......................................................................................27





6 APPENDIX A: RELATED READING.......................................................................... 29

6.1 EMC DOCUMENTS ............................................................................................29 6.2 SAFETY DOCUMENTS ..........................................................................................29 6.3 ENVIRONMENTAL DOCUMENTS .................................................................................29 6.4 POWER SUPPLY ...............................................................................................30 6.5 SITE SPECIFICATION ...........................................................................................30 6.6 ECOLOGY.....................................................................................................30 6.7 GSM ENGINEERING DOCUMENTS ...............................................................................30 6.8 POWER SUPPLY UNITS DOCUMENTS ............................................................................30

7 APPENDIX B: PUBLICATION HISTORY..................................................................... 31

8 APPENDIX C: GLOSSARY & ACRONYMS................................................................... 32

8.1 GLOSSARY....................................................................................................32 8.2 ACRONYMS ...................................................................................................32





LIST OF FIGURES

Figure 1 - Shelf Overview (1) ................................................................................................... 7 Figure 2 Layout (1) ............................................................................................................. 8 Figure 3 back view (1) ......................................................................................................... 8 Figure 4 - External Dimensions (1)............................................................................................. 9 Figure 5 - d2U in Node B ......................................................................................................10 Figure 6 - iCCM-U adaptation for V2 form factor ..........................................................................12 Figure 7 - iCCM-U Face Plate .................................................................................................12 Figure 8 - iCEM-U adaptation for V2 form factor ..........................................................................14 Figure 9 - iCEM-U face plate..................................................................................................14 Figure 10 - xCCM-U Face Plate ...............................................................................................16 Figure 11 - xCEM-U face plate................................................................................................17 Figure 12 - RBP Front View ...................................................................................................17 Figure 13 - RUC face plate(1) .................................................................................................18 Figure 14 - Air Flow............................................................................................................19 Figure 15 - d2U in Restricted Environment.................................................................................20 Figure 16 - d2U in Unrestricted Environment ..............................................................................21 Figure 17 d2U integration within MBI5 ....................................................................................24 Figure 18 Small Outdoor Power Supply unit ..............................................................................26 Figure 19 Medium Outdoor Power Supply unit ...........................................................................27

LIST OF TABLES

Table 1 - Weight of Main Items ............................................................................................... 9 Table 2 - Power Consumptions ...............................................................................................18 Table 3 Indoor GSM Cabinets ...............................................................................................25 Table 4 Outdoor GSM Cabinets .............................................................................................26





1 INTRODUCTION

1.1 Overview

This document describes the specifications of the Alcatel-Lucent 9326 digital 2U V2 Node B

(d2U V2) for iModules and xModules.

For more information on feature availability, please refer to the Feature Planning Guide,

Baselines and Release Notes.

1.2 Scope of this Document

The Alcatel-Lucent d2U Product Description covers the high level description of the digital

base station, as well as a description of the main modules. Alcatel-Lucent has a full portfolio

of UMTS Node B, including:

- the macro range (9311 Macro Node B Indoor, 9311 Macro Node B Outdoor),

- the 9326 digital 2U V2 Node B (d2U V2) and associated Remote Radio Heads (9341 RRH20-

21, 9341 RRH40-21, 9341 RRH40-08, 9341 RRH40-19, 9341 RRH40-AWS and future) or Radio

Compact Node B (rCompact),,

- the 9313 Micro Node B,

- the 9314 Pico Node B.

This document only covers the d2U V2 equipped with iModules (iCCM-U and iCEM-U) adapted

to the V2 rack form factor and the xModules (xCCM-U and xCEM-U).





2 PRODUCT OVERVIEW

2.1 Target Context

The d2U offers a cost-effective entry into the UMTS market for areas where site selection is

difficult. It is particularly suited for fast deployment in the user space of existing Node B or in

existing standard 19 inch racks. This Digital Node B can be used with the Radio cabinet (9332

rCompact) or Remote Radio Head (9341 RRH20-21, 9341 RRH40-21, 9341 RRH40-08, 9341

RRH40-19, 9341 RRH40-AWS and future).

2.2 Physical Overview

2.2.1 Main Characteristics

Figure 1 - Shelf Overview (1)

The d2U has been specifically designed for coverage within constrained environments:

Dense areas where site acquisition is difficult for a regular size macro Node B.

Easier site deployment due to its low volume: no need to add a base station on the

site, installation is possible within a user space.

It can be deployed in indoor environments (standard 19 inch rack or 2G Evolium

cabinets) and outdoor environments (2G Evolium cabinets or Power supply units).

This Digital Node B can be used with the Radio cabinet (rCompact) or Remote Radio

Head (9341 RRH20-21, 9341 RRH40-21, 9341 RRH40-08, 9341 RRH40-19, 9341 RRH40-

AWS and future).

This Digital Node B uses the same W-CDMA Module features, repackaged to 19 inch

dimensions (iCCM2, iCEM2-128, xCCM, xCEM, GPSAM, OIM). Note that the iCCM-U /

xCCM-U modules provide more functionality than (respectively) the iCCM/xCCM as they

also incorporate the functionality of the GPSAM and interface to remote radios (OIM).

(1) Photo not contractual.





2.2.2 Layout

The layout of the d2U is displayed in Figure 2 and 3.

Figure 2 Layout (1)

Figure 3 back view (1)

(1) Photos not contractual.

iCEM-U

iCCM-U

Fans (x2)

RUC

RBP

xCEM-U





2.2.3 External Dimensions

The external dimensions of the d2U are (HxWxD) 88.1mm (2U) x 482.6mm (19 inches) x

300mm as shown below.

Figure 4 - External Dimensions (1)

2.2.4 Weight

The weights of the main components are as follows:

Individual Weight System Shipping

Item lbs kg Qty lbs kg

19 inches subrack + RBP + RUC + Fans 11.9 5.4 1 11.9 5.4

Filler 3.75 1.7 2..0 3.75 1.7

iCCM-U/xCCM-U 2.2/2.58 1/1.17 1 2.58 1.17

iCEM-U/xCEM-U 2.2/3.3 1/1.5 1..3 9.9 4.5

Total (fully configured)





3 PRODUCT DESCRIPTION

Figure 5 - d2U in Node B

The d2U consists of four types of hardware boards:

CCM which controls OAM management, part of call processing and internal/external

data flow switching/combining, supporting external/internal alarm connectivity and

external synchronization reference interface. The two types of CCM boards are usable;

i.e. iCCM-U adapted to the V2 form factor and xCCM-U. A single CCM-U (either iCCM-U

or xCCM-U) can be used inside a d2U V2 Node B.

CEM, controls part of call processing and base band transmit/receive digital signal

processing. One, up to a maximum three, of these modules can be inserted in the

dNode B 2U V2. The two types of CEM boards are usable; i.e. iCEM-U adapted to the V2

form factor and xCEM-U. Mixed configurations are also supported.

RBP (user Rack Back Plane), supports all internal links between CCM-U and CEM-U

modules.

RUC (Rack User Commissioning), which supports all commissioning of non-volatile

memories, and fan alarms.

The d2U V2 can be added in the user space of any Node B or in a standard 19 inch indoor rack,

when the environmental conditions are compliant with the requirements detailed in the Site

Specification document [A10].

Sector

Sector

RF feeders

: -

RNC

d2U

i/xCCM-U i/xCEM-U Iub

RRH RRH RRH

RUC

-48VDC

LPPCM (Option)

EAM

Customer Alarms

or rCompact

(Option)

Sector

Sector

RRH ....

-48VDC power supply





3.1 ICCM-U

The iCCM-U board provides the following features:

Network interfaces : 8 E1/T1 (Iub connectivity),

o 16x16 PCM Switch

o ATM TC Layer

o 1 IMA groups,

Internal interfaces (HSSL) for iCEM-U boards,

Base band samples routing and summing,

ATM plane support,

CPU power to manage the Node B terminated flows,

Node B synchronization,

O&M functions,

Simple drop and insert functions.

GPSAM features, by collecting the information about the state of the d2U (alarms,

inventory and commissioning);

OIM features to support up to three optical links.

3.1.1 ICCM-U Interfaces

2 x Ethernet debug ports, 1 x 10BT and 1 x 10/100 BT;

2 RS232 debug ports;

3 HSSL/CPRI interfaces with SFP connection;

10MHz output reference clock based on the OVCXO 52fc, sinus wave 10dBm PPS in

connector;

1 RS485 GPS/UCPS link;

7 segment display showing the synchronization mode;

1 Ethernet backhaul port with SFP connection;

1 RJ45 port for external alarms

Various LED indications.

3.1.2 Dimensions

The iCCM-U is a 21mm face plate board. PCB dimensions are 389.6mm x 223.6mm. It is

mandatory to add an adaptation board at the back of the module and to change the front

plate to be compatible with the V2 form factor. Once modified the Code of the module is

changed.





Figure 6 - iCCM-U adaptation for V2 form factor

3.1.3 ICCM-U Face Plate

Figure 7 - iCCM-U Face Plate

Leds

2x

Ethernet

Extracting

hole

PCM

E1/T1

3 Optical

SFP cages

Alarm

GPS

Synchro

10MHz

ref

100Bfx

SFP cages

New face

plate

Adaptation board

to be added to the

iCCM-U module





3.2 Channel Element Module (ICEM-U)

The iCEM-U board can be divided in three main functional blocks:

The Interface & Control Unit (ICU);

The Base Band Unit 1 (BBU1);

The Base Band Unit 2 (BBU2) for more processing power.

With the following functional split:

The ICU (Interface and Control Unit) performs:

The physical data interface functions for the entire CEM;

The call processing functions (NBAP) of the CEM;

The OAM functions of the CEM;

Base Band signal processing of some common channels.

The BBU (Base Band Unit) performs :

All transmit and receive base band signal processing functions: layer 1 functions of

the UMTS radio network.

3.2.1 ICEM-U Interfaces

1 x Ethernet debug port 1 x 10/100 BT;

1 RS232 debug port, on the same connector as Ethernet;

Multiple synchronization signals (from/to PDCP_RX, U2_TX FPGA);


3.2.2 Dimensions

The iCEM-U is a 21mm face plate board. PCB dimensions are 389.6mm x 223.6mm. It is

mandatory to add an adaptation board at the back of the module and to change the front

plate to be compatible with the V2 form factor. Once modified the Code of the module is

changed.





Figure 8 - iCEM-U adaptation for V2 form factor

3.2.3 ICEM-U Face Plate

Figure 9 - iCEM-U face plate

Leds

Ethernet Synchro

Extracting

hole

New face

plate

Adaptation board

to be added to the

iCEM-U module





3.3 xCCM-U

The xCCM-U is an enhanced version of the iCCM-U. It provides increased processing

capabilities to adapt the Node B to the evolution of the last mile connectivity using state of

the art hardware and software components. The xCCM-U board is composed of a main board

and an MDA (Media Dependent Adaptor), allowing for future evolutions and support of

additional backhauling options.

The xCCM-U board provides the following features:

Network interfaces :

o 8 E1/T1 (ATM Iub connectivity) 4 on mother board, 4 on MDA

16x16 PCM Switch

ATM TC Layer

2 IMA groups (optional feature),

o 1 FE (Fast Ethernet) port (IP Iub connectivity)

Internal interfaces (HSSL) for iCEM-U/xCEM-U boards,

Base band samples routing and summing,

ATM plane support,

CPU power to manage the Node B terminated flows,

Node B synchronization,

O&M functions,

Simple drop and insert functions.

GPSAM features, by collecting the information about the state of the d2U (alarms,

inventory and commissioning);

OIM features to support up to six optical links.

3.3.1 xCCM-U Interfaces

2 x E1 connectors (4E1s each, one on mother board, one on MDA)

1 x 100 BT connector for SiteLAN or debug

1 x 100BT connector for IP Iub backhaul

3 CPRI interfaces with SFP connection

3 CPRI or HSSL interfaces with SFP connection

10MHz output reference clock based on the OVCXO 52fc, sinus wave 10dBm PPS in

connector;

1 RS485 GPS/UCPS link

1 RJ45 port for external alarms

Two LEDs (one green, one red) are used to indicate the status of the module

One bi-color LED (green or red) is used to indicate the activity status of the board

Twelve tri-colour LEDs are used to indicate the status of synchronisation and of E1

links.





3.3.2 Dimensions

The ixCCM-U is a 21mm face plate board. PCB dimensions are 389.6mm x 273.0mm.

3.3.3 xCCM-U Face Plate

Figure 10 - xCCM-U Face Plate

3.4 Channel Element Module (xCEM-U)

The two main functional elements of the xCEM-U are:

The base-band units (BBU), which perform all of the base-band signal processing

functionality for each of the UMTS channels supported, and,

The interface and control unit (ICU), which provides the data, control and timing

interfaces to the Base Station. It also performs xCEM-U control and management

functions.

Compared to the previous CEM generations, the xCEM-U provides:

High capacity on a single board (capacity of iCEM-U doubled)

Support of R99, HSDPA and HSUPA on a single board

Support of 6 cells and 2 frequencies

High flexibility in board configuration

Future capacity increase via Multi-mode BBU through optimized software only.

Future proof architecture with upgrade capability towards HSPA+ and LTE

3.4.1 xCEM-U Interfaces

1 x Ethernet debug port 1 x 10/100 BT;

1 RS232 debug port, on the same connector as Ethernet;

Multiple synchronization signals (from/to PDCP_RX, U2_TX FPGA);


3.4.2 Dimensions

The xCEM-U is a 21mm face plate board. PCB dimensions are 389.6 mm x 273 mm.

Leds Extracting

hole PCM

E1/T1

6 Optical

SFP cages Alarm

GPS

Synchro

10MHz

ref 2x

Ethernet





3.4.3 xCEM-U Face Plate

Figure 11 - xCEM-U face plate

3.5 RBP

The d2U V2 houses one iCCM-U modified or xCCM-U and up to three iCEM-U modified and/or

xCEM-U. The Rack Back Plane (RBP) is part of the d2U and allows the signalling

interconnections between the CCM-U and the CEM-U modules inserted within the digital shelf.

The backplane board also gives a power supply to the CCM-U and CEM-U modules. The

transmitted signals are:

Base Band links : HSSL between CCM-U and CEM-U;

-48V power supply;

Dallas bus for remote inventory;

Presence detect for modules.

The RBP has also its own signals:

Dallas bus for remote inventory;

Backplane identification;

Module slot identification.

Figure 12 - RBP Front View

Leds Ethernet Synchro Extracting

hole

Hight frequenciesconnection

Power connectors for CEM-U

Digital connector

Power connectorfor CCM-U

Imput Power connector

Hight frequenciesconnection

Power connectors for CEM-U

Digital connector

Power connectorfor CCM-U

Imput Power connector





3.6 RUC

The Rack User Commissioning (RUC) manages the following functionalities:

Power filtering,

Current limitation,

Commissioning,

Inventory,

Fan alarms report and power supply,

DC power supply connectivity,

Figure 13 - RUC face plate(1)

(1) Photo not contractual.

3.7 Power System

The d2U operates with -48 VDC power supply in accordance with [A9].

The nominal DC voltage range is 40,5VDC to -57VDC. Within the nominal voltage range, the

d2U operates at full performance. The d2U will not suffer any irreversible damage when

powered within an abnormal voltage within the range -0 VDC to -40,5 VDC and -57VDC to -60

VDC.

Configuration Max DC power

Consumption

Typ DC power

Consumption

iCCM-U + 1 iCEM-U 107W 90W



xCCM-U + 1 xCEM-U 167W 145W



Table 2 - Power Consumptions

Power

filter

Alarms





3.8 Control Unit

Two fans are integrated to the digital shelf to cool the boards. As shown, the cooling air path

within the shelf is:

1. Air enters on the right side of the shelf;

2. The air is drawn through the shelf to cool boards;

3. It is exhausted on the left side of the shelf.

Figure 14 - Air Flow

3.9 Options

Several options are supported by the product:

Number of CEM-U (from one to three). In case some CEM-U are not used, they have to

be replaced by fillers.

External alarms kit (16 external alarms can be managed by the d2U) - requires 1U

additional free space.

PCM Lightning Protection kit - requires 1U additional free space.

Standard standalone Installation cables.

Specifics kit for the integration in GSM Evolium cabinets.

3.10 Environmental and Regulatory Requirements

3.10.1 General

The cabinet is designed to operate under climatic condition described by [A5], Class 3.2,

except for:

High temperature: +65C;

Icy conditions;

High absolute humidity: 36g/m3.





The d2U is manufactured according to WEEE (Waste of Electrical and Electronic Equipment)

and RoHS (Restriction of Hazardous Substances) recommendations.

3.10.1.1 d2U in restricted environment

The environmental boundary conditions for d2U standalone deployment are:

Air inlet and outlet shall be free of any blockage across the full height of the

module (see figures below in green)

Maximum inlet (right hand side) air temperature of +60 C

Pressure drop generated by the air inlet and outlet shall not be greater than

5 Pa @ 120m3/h

Air inlet and

outlet

Figure 15 - d2U in Restricted Environment





3.10.1.2 d2U in unrestricted environment

The environmental boundary conditions for d2U standalone deployment are:

Air inlet and outlet shall be free of any blockage across the full height of the module

(see below in green)

Maximum inlet (right hand side) air temperature of +65 C

Pressure drop generated by the air inlet and outlet shall not be greater than 5 Pa @

120m3/h

Figure 16 - d2U in Unrestricted Environment

Air inlet and

outlet 40 40





3.10.2 Operation Temperature and Humidity

The total operational temperature range of the d2U is 5C/+65C.

The rack shall be compatible with sitting at locations where the surrounding air may have a

high moisture content as describe by [A5]:

Relative humidity: +8% to +100%

Absolute humidity: 0.03 g/m3 to 36 g/m3

3.10.3 Acoustic Noise

The maximum d2U sound power levels emitted in accordance with [A7] are the following:

LwAd = 56 dB(A) at 25C

3.10.4 Vibration

Once fully installed, the d2U meets the requirements of [A6], class 3M5.

3.10.5 Shock

Once fully installed, the d2U meets the requirements of [A6], class 3M5.

3.10.6 Ingress Protection

The d2U shelf is weather resistant to prevent ingress of rain, snow, dust, and other solid

foreign objects to a minimum level of IP20 as specified by [A4].

3.10.7 Regulatory Requirements

For Europe, the standards mentioned below are part of mandatory standards to obtain CE

Mark under European EMC directive 89/336/EEC and new European EMC Directive

2004/108/EC.

3.10.8 Safety

The d2U is designed to meet the following Safety Regulatory standards:

For European deployment: [A3].

For North America deployment: [A16] and [A17].

For deployment in others countries or regions: [A2].





3.10.9 EMC

The d2U meets the following EMC standards:

For European deployment: [A1].

For North America deployment: [A18].

For deployment in others countries or regions: [A19].

3.10.10 Ecology

The cabled cabinet is compliant to WEEE [A11] and RoHS [A12] directives.





4 EVOLIUM INTEGRATION

Integration of the d2U is possible in the following GSM cabinets (MBI5, CIDE, CIMA, MBO1,

MBO2, MBO1E, MBO2E, COME, CODE). Nevertheless, because the d2U is integrated in one of

the subrack in MBI5 - MBO1 and MBO1E, the modules initially in this subrack must be moved to

other positions and single-TRX may be replaced by Twin-TRX in order to maintain the previous

number of carriers. For more information, please refer to Engineering document [A13].

Figure 17 d2U integration within MBI5

D2U

GSM

Modules





4.1 Maximum GSM configuration supported

The maximum GSM configurations supported when the d2U is integrated in the 2G cabinets are

the followings.

4.1.1 Indoor

DC AC Cabinet

Initial Final with

Single TRX Final with

Twin TRX Initial Final with


Twin TRX

Up to 12 8 12 Up to 12 8 12

Up to 6/6 4/4 6/6 Up to 6/6 4/4 6/6

MBI5

Up to 4/4/4 3/3/3 4/4/4 Up to 4/4/4 3/3/3 wo BATS 4/4/4

Up to 12 8 12 Up to 8 8 wo BATS

Up to 6/6 4/4 6/6 Up to 2/2 2/2 wo BATS

Medi G4 (CIDE)

Up to 4/4/4 3/3/3 4/4/4 Up to 2/2/2 2/2/2 wo BATS

Up to 12 8 12

Up to 6/6 4/4 6/6

Medi G3 (CIMA)

Up to 4/4/4 3/3/3 4/4/4

Table 3 Indoor GSM Cabinets

4.1.2 Outdoor

Cabinet Initial Final with


Twin TRX

Up to 8 4 8

Up to 4/4 2/2 4/4

G4 Evol MBO1E

Up to 2/2/2 1/1/1 2/2/2

Up to 12

Up to 6/6

G4 Evol MBO2E

Up to 4/4/4

No change

Up to 8 4 8

Up to 4/4 2/2 4/4

G4 MBO1

Up to 2/2/2 1/1/1 2/2/2

Up to 12

Up to 6/6

G4 MBO2

Up to 4/4/4

No change





Up to 12

Up to 6/6

G4 Medi COME

Up to 4/4/4

No change

Up to 12

Up to 6/6

G4 Medi CODE

Up to 4/4/4

No change

Table 4 Outdoor GSM Cabinets

5 POWER SUPPLY UNITS INTEGRATION

Integration of the d2U V2 is possible in the Small and Medium Outdoor Power supply unit. For

more information, please refer to Small d2U Outdoor Power Supply unit Product description

[A14] and Medium d2U Outdoor Power Supply unit Product description [A15].

Figure 18 Small Outdoor Power Supply unit

d2U

PCM LP

External Alarm module

Power Unit

Batteries

Controller

Rectifiers

Inputs / Outputs





Figure 19 Medium Outdoor Power Supply unit

5.1 Main characteristics

The main characteristic of the Outdoor Power supply units are the followings:

Small Medium

Dimensions (HxWxD)

- w/o plinth

- With Plinth

740x581x586mm

890x581x586mm

N/A

1500x820x700mm

Net Weight with plinth 66 kg 174kg

Ingress Protection IP55 IP55

Operating temperature range -40C+50C (+55C

under conditions)

-40C+50C (+55C

under conditions)

Number of RRH supported by the

PSU

Up to 3 Up to 6

User space 4U (d2U room) 8U + 5U (Top d2U

room)

d2U

PCM LP

External Alarm module

Power Unit

Batteries

Inputs / Outputs

User space or

Second battery





Supported options - PCM LP or RETA

- Ext Alarms

- PCM LP or RETA

- Ext Alarms

- 7705 SAR

- 2nd battery shelf or

Microwave

Battery back up time - Up to 2 hours for

d2U + 3 RRH

- Up to 8 hours for

d2U + 3 RRH





6 APPENDIX A: RELATED READING

For further information please refer to:

6.1 EMC Documents

[A1] ETSI EN 300 386: Electromagnetic compatibility and Radio spectrum Matters (ERM);

Telecommunication network equipment; ElectroMagnetic Compatibility (EMC)

requirements.

[A18] 47 CFR Part 15 - RADIO FREQUENCY DEVICES

[A19] CISPR 22 - Limits and methods of measurement of radio disturbance characteristics

of information technology equipment

6.2 Safety Documents

[A2] IEC 60950-1 Information Technology Equipment Safety Part1: General

Requirements, Ed.1 2001.

[A3] EN 60950-1 Information Technology Equipment Safety Part1: General

Requirements, Ed.1 2001.

[A16] CAN/CSA C22.2 No.60950-01 Information Technology Equipment Safety Part1:

General Requirements

[A17] UL 60950-1 Information Technology Equipment Safety Part1: General

Requirements

6.3 Environmental Documents

[A4] IEC 60529 Degrees of Protection Provided by Enclosure, (IP code) Ed.2.1 2001.

[A5] ETS 300 019-2-3 Equipment Engineering (EE); Environmental conditions and

environmental tests for telecommunications equipment; part 2-3: classification of

environmental conditions stationary use at weather protected locations: class 3.2,

except for:

High temperature: +65 C,

Condition of icing

High absolute humidity (36g/m3)

[A6] ETS 300 019-1-3, Environmental Engineering (EE); Environmental conditions and

environmental tests for telecommunications equipment; Part 1-3: Classification of

environmental conditions; Stationary use at weather protected locations.

[A7] ISO 7779 Acoustic: Measurement of Airborne Noise emitted by computers and

business equipment.





6.4 Power Supply

[A9] ETS 300 132-2 Power supply interface at the input to telecommunications

equipment; Part 2: Operated by direct current (DC).

6.5 Site Specification

[A10] IM 06-0406 UMTS dNode B 2U Site Specification.

6.6 Ecology

[A11] Directive 2002/96/EC of 27 January 2002 on waste electrical and electronic

equipment (WEEE)

[A12] 2002/95/EC Directive 2002/95/EC of 27 January 2003 on the restriction of the use of

certain hazardous substances in electrical and electronic equipment (RoHS)

6.7 GSM Engineering documents

[A13] Engineering rules for configuration (TBD)

6.8 Power Supply Units documents

[A14] Small S6 Outdoor enclosure (MIFR)

[A15] Medium Outdoor enclosure (TBD)





7 APPENDIX B: PUBLICATION HISTORY

29/FEB/2008

Issue 01.00/EN, Preliminary

Creation

11/APR/2008


New Photos

Weight updated

21/APR/2008


Power consumptions updated

29/SEP/2008

Issue 02.00/EN, Standard

Main characteristics of the Small and Medium Power Supply units

Minors corrections





8 APPENDIX C: GLOSSARY & ACRONYMS

8.1 Glossary

Node B A logical node responsible for UMTS radio transmission/reception in one or more cells

to/from the User Equipment.

Iub Interface between a Node B and an RNC.

8.2 Acronyms

This section provides a list of the terms and acronyms used within this document.

1111 ---- 10101010 2U 3.5 inch

3GPP Third Generation Partnership

Project

A A A A ---- EEEE ATM Asynchronous Transfer Mode

BBU Base Band Unit

BTS Base Station Transceiver

Subsystem

CCM Alpha version of iCCM

CEM Alpha version of iCEM

CPRI Common Public Radio Interface

DBP Digital Back Plane

dBTS Digital BTS

DC Direct Current (Power source)

E1 Standard European PCM link

nickname

EMC Electro-Magnetic Compatibility

EMI Electro-Magnetic Interference

G G G G O O O O GPS Global Positioning System

GPSAM GPS/Alarm Module

GPxOIM GPSAM + Xoim

GSM Global System for Mobile

HSDPA High Speed Downlink Packet

Access

HSSL High Speed Serial Link

HW Hardware

ICCM-U Specific module with function of

GPSAM, CCM and OIM

ICEM-U Specific Icem128 module

ICU Interface Control Unit

IEC International Electro-technical

Committee

IMA Inverse Multiplexing for ATM

IP Ingress Protection

ISO International Standards

Organization

OAM Operation Administration and

Maintenance

OEM Original Equipment

Manufacturer

OIM Optical Interface Module





P P P P ---- Z Z Z Z PCM Pulse Code Modulation

RBP Rack Back Plane

rBTS Radio BTS

RNC Radio Network Controller for

UMTS

RoHS Restriction of Hazardous

Substance

RRH Remote Radio Head

RUC Rack User Commissioning

SFP Small Form-factor Pluggable

SW Software

T1 Standard US PCM system

(1.544Mbit/s)

UL Underwriters Laboratories

UMTS Universal Mobile

Telecommunication System

UTRAN UMTS Terrestrial Radio Access

Network

WEEE Waste Electrical and Electronic

Equipment

xCCM-U 2nd generation of CCM module

with function of GPSAM, xCCM

and OIM

xCEM-U Specific xCEM module with 256

channel elements