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DISKON-08001P 2008.03.10 CISFLEXCISFLEX TMTM
Additive Circuit Technology Additive Circuit Technology Roadmap for HDD SuspensionRoadmap for HDD Suspension
Speaker:
Hitoki KANAGAWA
Prepared by Y.OoyabuApproved by T.Visit (PhD)
NOTE; The contents of this data sheet are the exclusive property of NITTO DENKO Corp. Prior permission must be obtained for any use of these contents for purposes outside of that intend by NITTO DENKO Corp. Any question on this should be addressed to Product Development section, Printed Circuits Div., Electronic Materials Business Sector, of NITTO DENKO Corp. or local NITTO DENKO office
DISKON-08001P 2008.03.10 CISFLEXCISFLEX TMTM
NITTO Product portfolioNITTO Product portfolio
Protect Products Electrical Insulating Tape Double Coated Tape Sealing Materials Fibre Reinforced Plastics
Flexible Printed CircuitsCircuit technologyCircuit technology
TEMISH® Products
Medical Products
Wafer Tapes
DURATACK® labels
Moulding Compounds
Bandoliering Tapes Corrosion Protection
NITOFLON® TapesPolarising Films
With more than 4,000 products, Nitto is available to support EleWith more than 4,000 products, Nitto is available to support Electronics ctronics business with our products. In Flexible Printed Circuit divisionbusiness with our products. In Flexible Printed Circuit division we can we can support using Subtractive technology and Additive technology.support using Subtractive technology and Additive technology.
DISKON-08001P 2008.03.10 CISFLEXCISFLEX TMTM
LineLine--upup
Additive Circuit Technology
Additive Circuit Technology v.s HDD Roadmap
Capability of additive technology
Next challenges of additive technology
DISKON-08001P 2008.03.10 CISFLEXCISFLEX TMTM
Additive Circuit Technology
Additive Circuit Technology v.s HDD Roadmap
Capability of additive technology
Next challenges of additive technology
DISKON-08001P 2008.03.10 CISFLEXCISFLEX TMTM
Process comparison of both technologyProcess comparison of both technology
CuCu
CuCu
CuCu
CuCu
CuCu
CuCu
Important point is Additive is stack up, Subtractive is etch out.
PhotoPhoto--resist resist RemovingRemoving
PhotoPhoto--resist resist imagingimaging
PhotoPhoto--resist resist LaminationLamination
Copper PlatingCopper Plating
Copper PlatingCopper PlatingAdditive technologyAdditive technology Subtractive technologySubtractive technology
Photo resistPhoto resist
Copper PlatingCopper Plating
CuCu
Etching of Etching of Sputtered Seed Sputtered Seed LayerLayer
Polyimide filmPolyimide film
Sputter Seed Layer (submicron level)
SSTSSTPhotoPhoto--resist resist LaminationLamination
Etching of Etching of Plated Copper Plated Copper
PhotoPhoto--resist resist RemovingRemoving
PhotoPhoto--resist resist ImagingImaging
Plated CopperPlated CopperPolyimide filmPolyimide film
Sputter Seed Layer (submicron level)
SSTSST
CuCuPhoto resistPhoto resist
Etching of Etching of Sputtered Seed Sputtered Seed LayerLayer
DISKON-08001P 2008.03.10 CISFLEXCISFLEX TMTM
Advantages of additive ConductorsAdvantages of additive ConductorsAdditive Conductors
PolyimidePolyimide
CopperCopper
Subtractive Conductors
CrossCrosssectionsection
PolyimidePolyimide
CopperCopper
Top widthTop width
05
101520253035404550
Subtractive methodSubtractive methodCon
duct
orW
idth
(um
)
05
101520253035404550
Subtractive methodSubtractive methodCon
duct
orW
idth
(um
)
Additive methodAdditive method
05
101520253035404550
Subtractive methodSubtractive methodCon
duct
orW
idth
(um
)
05
101520253035404550
Subtractive methodSubtractive methodCon
duct
orW
idth
(um
)
Additive methodAdditive method
P r o d u c t L o t #
Subtractive technology leads to irregular conductor geometry at Subtractive technology leads to irregular conductor geometry at fine conductor line fine conductor line / spacing. This impacts:/ spacing. This impacts:
1)1) Impedance ControlImpedance Control2)2) Ability to achieve conductor lines with < 35 um pitch.Ability to achieve conductor lines with < 35 um pitch.
DISKON-08001P 2008.03.10 CISFLEXCISFLEX TMTM
Additive Circuit Technology
Additive Circuit Technology v.s HDD Roadmap
Capability of additive technology
Next challenges of additive technology
DISKON-08001P 2008.03.10 CISFLEXCISFLEX TMTM
HDD TrendHDD Trend
0.0
0.5
1.0
1.5
2.0
2.5
3.0
2005 2006 2007 2008 2009 2010
Tran
smis
sion
Freq
uenc
y[G
Hz]
Server Frequency[GHz] 3.5" Frequency[GHz]2.5" Frequency[GHz]
Transmission FrequencyTransmission Frequency
Signal Grounding Required Signal Grounding Required RoadmapRoadmap-- ArealAreal Density Continues to be Density Continues to be
enabled by PMR !enabled by PMR !-- Lower flyLower fly--height require low height require low gimbalgimbal
stiffness stiffness -- High frequency transmission circuitHigh frequency transmission circuit
Additive is a Must!!Additive is a Must!!
050
100150200250300350400450
2004 2005 2006 2007 2008 2009 2010
Are
al D
ensi
ty[G
b/in
2]
0
5
10
15
Fly
heig
ht[n
m]
Areal Density[Gb/in2] Flyheight[nm]
Fly height and Fly height and ArealAreal densitydensity
1.00E+07
1 .00E+08
1 .00E+09
1 .00E+10
1 .00E+11
1 .00E+12
1 .00E+13
1985 1990 1995 2000 2005 2010 2015
Year
Are
al D
ensi
ty [
bit/
inch
1010MM
11TT
100100GG
1010GG
11GG
100100MM
Are
al
Are
al D
ensi
ty[b
it/in
chD
ensi
ty[b
it/in
ch22 ]]
ADGR:60%
ADGR:100%
LongitudinalLongitudinalMediaMedia
GMR HeadGMR Head
AdvancedAdvancedGMR HeadGMR Head
PerpendicularPerpendicularMediaMedia
TMR/PMRTMR/PMRHeadHead
ADGR:30%
Thin Film HeadThin Film Head
MR HeadMR Head
1.00E+07
1 .00E+08
1 .00E+09
1 .00E+10
1 .00E+11
1 .00E+12
1 .00E+13
1985 1990 1995 2000 2005 2010 2015
Year
Are
al D
ensi
ty [
bit/
inch
1010MM
11TT
100100GG
1010GG
11GG
100100MM
Are
al
Are
al D
ensi
ty[b
it/in
chD
ensi
ty[b
it/in
ch22 ]]
1 .00E+07
1 .00E+08
1 .00E+09
1 .00E+10
1 .00E+11
1 .00E+12
1 .00E+13
1985 1990 1995 2000 2005 2010 2015
Year
Are
al D
ensi
ty [
bit/
inch
1010MM
11TT
100100GG
1010GG
11GG
100100MM
Are
al
Are
al D
ensi
ty[b
it/in
chD
ensi
ty[b
it/in
ch22 ]]
1 .00E+07
1 .00E+08
1 .00E+09
1 .00E+10
1 .00E+11
1 .00E+12
1 .00E+13
1985 1990 1995 2000 2005 2010 2015
Year
Are
al D
ensi
ty [
bit/
inch
1010MM
11TT
100100GG
1010GG
11GG
100100MM
Are
al
Are
al D
ensi
ty[b
it/in
chD
ensi
ty[b
it/in
ch22 ]]
ADGR:60%ADGR:60%
ADGR:100%ADGR:100%
LongitudinalLongitudinalMediaMedia
GMR HeadGMR Head
AdvancedAdvancedGMR HeadGMR Head
PerpendicularPerpendicularMediaMedia
TMR/PMRTMR/PMRHeadHead
ADGR:30%ADGR:30%ADGR:30%
Thin Film HeadThin Film Head
MR HeadMR Head
1.00E+07
1 .00E+08
1 .00E+09
1 .00E+10
1 .00E+11
1 .00E+12
1 .00E+13
1985 1990 1995 2000 2005 2010 2015
Year
Are
al D
ensi
ty [
bit/
inch
1010MM
11TT
100100GG
1010GG
11GG
100100MM
Are
al
Are
al D
ensi
ty[b
it/in
chD
ensi
ty[b
it/in
ch22 ]]
ADGR:60%
ADGR:100%
LongitudinalLongitudinalMediaMedia
GMR HeadGMR Head
AdvancedAdvancedGMR HeadGMR Head
PerpendicularPerpendicularMediaMedia
TMR/PMRTMR/PMRHeadHead
ADGR:30%
Thin Film HeadThin Film Head
MR HeadMR Head
1.00E+07
1 .00E+08
1 .00E+09
1 .00E+10
1 .00E+11
1 .00E+12
1 .00E+13
1985 1990 1995 2000 2005 2010 2015
Year
Are
al D
ensi
ty [
bit/
inch
1010MM
11TT
100100GG
1010GG
11GG
100100MM
Are
al
Are
al D
ensi
ty[b
it/in
chD
ensi
ty[b
it/in
ch22 ]]
1 .00E+07
1 .00E+08
1 .00E+09
1 .00E+10
1 .00E+11
1 .00E+12
1 .00E+13
1985 1990 1995 2000 2005 2010 2015
Year
Are
al D
ensi
ty [
bit/
inch
1010MM
11TT
100100GG
1010GG
11GG
100100MM
Are
al
Are
al D
ensi
ty[b
it/in
chD
ensi
ty[b
it/in
ch22 ]]
1 .00E+07
1 .00E+08
1 .00E+09
1 .00E+10
1 .00E+11
1 .00E+12
1 .00E+13
1985 1990 1995 2000 2005 2010 2015
Year
Are
al D
ensi
ty [
bit/
inch
1010MM
11TT
100100GG
1010GG
11GG
100100MM
Are
al
Are
al D
ensi
ty[b
it/in
chD
ensi
ty[b
it/in
ch22 ]]
ADGR:60%ADGR:60%
ADGR:100%ADGR:100%
LongitudinalLongitudinalMediaMedia
GMR HeadGMR Head
AdvancedAdvancedGMR HeadGMR Head
PerpendicularPerpendicularMediaMedia
TMR/PMRTMR/PMRHeadHead
ADGR:30%ADGR:30%ADGR:30%
Thin Film HeadThin Film Head
MR HeadMR Head
ArealAreal Density TrendsDensity Trends
DISKON-08001P 2008.03.10 CISFLEXCISFLEX TMTM
Roadmap CircuitRoadmap Circuit
1 5 0 Gb/in2 3 0 0 Gb/in2 6 0 0 Gb/in2 1 2 0 0 Gb/in2 2 4 0 0 Gb/in2
R e a d
W r i t e
7 5 Gb/in2
Low Fly height, High Speed Data TransmissionLow Fly height, High Speed Data Transmission
Perpendicular Perpendicular recordingrecording
Patterned Patterned media recodingmedia recoding Heat assisted magnetic Heat assisted magnetic
recordingrecordingTFCTFC Dual Stage ActuatorDual Stage Actuator
TMR HeadTMR Head CPP HeadCPP Head
1 5 0 Gb/in2 3 0 0 Gb/in2 6 0 0 Gb/in2 1 2 0 0 Gb/in2 2 4 0 0 Gb/in2
R e a d
W r i t e
7 5 Gb/in2
Low Fly height, High Speed Data TransmissionLow Fly height, High Speed Data Transmission
Perpendicular Perpendicular recordingrecording
Patterned Patterned media recodingmedia recoding Heat assisted magnetic Heat assisted magnetic
recordingrecordingTFCTFC Dual Stage ActuatorDual Stage Actuator
TMR HeadTMR Head CPP HeadCPP Head
1. Miniaturization(4 6 8~11trace)Finer Line and Space by Additive technology
2. High Frequency signal(Electrical performance)Ground Plane by Additive technology
Write and Read technologyWrite and Read technology
Requirement for CircuitRequirement for Circuit
DISKON-08001P 2008.03.10 CISFLEXCISFLEX TMTM
Nitto RoadmapNitto Roadmap
Mass Production levelMass Production levelPrototypes levelPrototypes levelSample production levelSample production level
CQ1 CQ2 CQ3 CQ4 CQ1 CQ2 CQ3 CQ4 CQ1 CQ2 CQ3 CQ420092007 2008
SST thickness18 um
15 um
Items
Grounding Pad
Grounding Plane
Trace Widthand
Spacing
20 /20 um
15 /15 um
Min. 8um
Conductorthickness
Min. 12um
Min. 10um
DISKON-08001P 2008.03.10 CISFLEXCISFLEX TMTM
Additive Circuit Technology
Additive Circuit Technology v.s HDD Roadmap
Capability of additive technology
Next challenges of additive technology
DISKON-08001P 2008.03.10 CISFLEXCISFLEX TMTM
Nitto Additive capabilityNitto Additive capability
2007 2008 200920062005
30/30um30/30um30/30um20/20um20/20um20/20um
15/15um15/15um15/15um
1999 2000 2001 2002 2003 2004
Hair(100um)Hair(100um)
Line/Space40/40um
Line/SpaceLine/Space40/40um40/40um
Trace width history of SUSPENSION
Pitch 30um 25um 20umLine 15um 12um 12um 10um
Space 15um 18um 13um 10um
Cross section
Nitto Technology
NittoNitto’’s finer trace capability using Additive technology covers entires finer trace capability using Additive technology covers entireSUSPENSION trace width requirement!!!SUSPENSION trace width requirement!!!
DISKON-08001P 2008.03.10 CISFLEXCISFLEX TMTM
Cu Ground PlaneCu Ground Plane
SSTSST
Cu GND PlaneCu GND Plane
CuCu
Field coupling to the ground plane.Field coupling to the ground plane.
Ground Plane(SST)
CuCu
PolyimidePolyimide
++ --
Electric Field CouplingElectric Field CouplingSSTSST
CuCu
SST Ground Plane
Cu Ground Plane
SST Cu
Conductivity(S/m)
1.1*106 5.8*108
-- Ground Plane has current due to electric field coupling. These Ground Plane has current due to electric field coupling. These current current leads to power loss.leads to power loss.
-- Power loss is reduced if conductivity of ground layer is high.Power loss is reduced if conductivity of ground layer is high.Cu Ground Plane is most feasible solution for minimizing LOSSES.Cu Ground Plane is most feasible solution for minimizing LOSSES.
DISKON-08001P 2008.03.10 CISFLEXCISFLEX TMTM
Cross section of actual sampleCross section of actual sample
SST
Cu Ground Plane
Trace
Cu Ground Plane
Trace(15um)
Space(15um)
Base PISkin PI
SSTSSTPolyimidePolyimide
TraceTrace
Cu Ground Plane
TraceTrace
Skin Polyimide
Basic structureBasic structure--11 Basic structureBasic structure--22
SST etching is available SST etching is available due to Skin PIdue to Skin PI
Nitto has PI coating technology which enable us to make SST holeNitto has PI coating technology which enable us to make SST hole under the under the Cu Ground Plane. It is a Must for efficient Impedance control.Cu Ground Plane. It is a Must for efficient Impedance control.
DISKON-08001P 2008.03.10 CISFLEXCISFLEX TMTM
Sample : Nitto Test CouponLine and Space :30/30umEquipment :VNA, TDR
Sample : Nitto Test CouponLine and Space :30/30umEquipment :VNA, TDR
Measurement result(transmission characteristic)Measurement result(transmission characteristic)
0
20
40
60
80
100
120
140
160
180
200
-10 0 10 20 30 40 50 60 70Distance from Probing Point [mm]
Diff
eren
tial I
mpe
danc
e [Ω
]
w/o GND planeGND Plane-Sample1GND Plane-Sample2GND Plane-Sample3
Cu GND PlaneCu GND Plane
w/o Cu GND Planew/o Cu GND Plane
Time Domain Time Domain ReflectmetoryReflectmetory
-14
-12
-10
-8
-6
-4
-2
0
0 2 4 6 8 10
Frequency [GHz]
Sdd2
1(T
rans
mis
sion
Cha
ract
eris
tic) [
dB]
w/o GND-Plane GND-Plane-Sample-1GND-Plane-Sample2 GND Plane-Sample3
Cu GND PlaneCu GND Plane
w/o Cu GND Planew/o Cu GND Plane
SS--ParameterParameter
Cu Ground Plane shows Cu Ground Plane shows 1)1) Improved signal transmission.Improved signal transmission.2)2) Better impedance control.Better impedance control.
DISKON-08001P 2008.03.10 CISFLEXCISFLEX TMTM
Additive Circuit Technology
Additive Circuit Technology v.s HDD Roadmap
Capability of additive technology
Next challenges of additive technology
DISKON-08001P 2008.03.10 CISFLEXCISFLEX TMTM
Next challenges of additive technology Next challenges of additive technology
Better
SubtractiveSubtractive
AdditiveAdditive
High conductivity by pure Copper platingHigh conductivity by pure Copper platingFiner Line and SpacingFiner Line and Spacing
Better mechanical propertyBetter mechanical property
Rob
ustn
ess
Rob
ustn
ess
Product Design
Product Design
flexibilityflexibility
Better
Product PerformanceProduct Performance
DISKON-08001P 2008.03.10 CISFLEXCISFLEX TMTM
Stress Relaxation of Copper Foil Stress Relaxation of Copper Foil
Rolled Annealed
Electrodeposited
It has been well established that Electrodeposited Copper is not as strong as Rolled Annealed Copper due to the difference in grain structure and defect concentrations
H.D. Merchant, Gould Electronics, 1997
DISKON-08001P 2008.03.10 CISFLEXCISFLEX TMTM
Nitto Denko High strength CopperNitto Denko High strength Copper
Nitto Denko has been developing new process technology to produce high strength high performance electrodeposited copper to meet the Fine Line / Spacing of HDD roadmap and the robustness requirement
ConventionalED Cu
High StrengthED Cu
Stra
in R
elax
atio
n (%
)
DISKON-08001P 2008.03.10 CISFLEXCISFLEX TMTM
Nitto Denko High strength CopperNitto Denko High strength Copper
Conventional ED copper w/o Conventional ED copper w/o Cover PI after 30 Cover PI after 30 minsmins TestTest
High Strength ED copper w/o High Strength ED copper w/o Cover PI after 30 Cover PI after 30 minsmins TestTest
0.0%
2.5%
5.0%
7.5%
10.0%
Trac
e D
amag
e [%
]
10min 20min 30min 10min 20min 30min
Conventional ED Cu High strength ED Cu
ConditionConditionSample: Conventional ED Copper,
High Strength ED CopperTime: 10min/20min/30minFrequency: 132kHz
By exposing copper trace to ultrasonic DI water cleaning, conventional ED copper begins to show cavitation damages after 20 mins while high strength ED copper shows no damages even after 30 mins.
DISKON-08001P 2008.03.10 CISFLEXCISFLEX TMTM
ConclusionConclusion
• Nitto Denko 30 um fine line / spacing Additive Technology is ready to enable the most demanding HDD roadmap in the market. We are the only supplier of multi-layer conductor line to serve high frequency transmission rate.
• Higher robustness is required for additive technology associated with electrodeposited copper. Nitto Denko believes that our recent development of high strength copper will meet the most demanding mechanical requirement needed to continuously support the HDD roadmap.
DISKON-08001P 2008.03.10 CISFLEXCISFLEX TMTM
Thank you very much for your attention.Thank you very much for your attention.