ASE ASEK CSP-BGA (Sawing Type) Substrate Design Rev. :L Date : 04/13/04” Prepared : Damon_Hung

ASE

ASEK CSP-BGA (Sawing Type)

Substrate Design

Rev. :L

Date : 04/13/04”

Prepared : Damon_Hung

ASEContent

Necessary Data Of Substrate Design

Substrate Structure

Ring / Finger Placement & S/M Design Rule

Finger Design Rule

Bonding finger width, wire quantity and wire diameter design rule

Outer Layer Trace Design Rule & Finished Value

Inner Layer Trace Design Rule & Finished Value

Via Design Rule

Dimension of Solder Ball and Pad/SM Opening

Laminate Blind Via Design

ASE

Package type

Body size

Substrate layer number

Bond pad number of ground / power / signal

Staggered or inline pad design

Actual die size or estimated min./max. die size

Solder ball number, location and pitch

Assigned ground/power ring number or segment location

Bond finger number for each side of package

Net list (pad no., net-name, ball no.)

Power consumption (Thermal requirement)

Electrical requirement

Necessary Data Of Substrate Design

ASESubstrate Structure

2 Layer

4 Layer

Note :1. Copper Thickness is the sum if copper foil & copper plating2. Solder Mask Shift Tolerance : +/- 75 um3. Solder Mask Opening Tolerance (itself) : +/- 50 um4. Bow & Twist : 1 % substrate length

Description 0.21mm Substrate 0.26mm Substrate0.36mm Substrate(STD of LBGA) 0.56mm Substrate 0.17mm Substrate

0.12mmSubstrate

FinishedThickness 210 um +/- 40 um 260 um +/- 40 um 360 um +/- 40 um 560 um +/- 40 um 170 um +/- 40 um 120 um +/- 25 um

BT Resin 100 um +/- 30 um 150 um +/- 30 um 200 um +/- 30 um 400 um +/- 50 um 70 um Ref. 60 um Ref.Total CopperThickness

Nickel Plating 5~10 um. 5~10 um. 5~10 um. 5~10 um. 5~10 um. 5~10 um.

Gold Plating 0.5~1 um. 0.5~1 um. 0.5~1 um. 0.5~1 um. 0.5~1 um. 0.5~1 um.

Solder Mask 30 um +/-15 um. 30 um +/-15 um. 50 um +/- 15 um. 50 um +/- 15 um. 30 um +/-10 um. 15 um Min.

CopperThickness inThrough Hole

15 umMin.(Mechincal);10um Min.(Laser)


15 umMin.(Mechincal);10 umMin.(Laser)



15 umMin.(Mechincal);10 um Min.(Laser)

Depend on Min Finger/Trace Pitch; (Refer to Finger/Trace Design Rule)

Description 0.36mm Substrate 0.26mm Substrate 0.56mm Substrate

Finished Thickness 360 um +/- 40 um 260 um +/- 40 um 560 um +/- 40 um

BT Resin (1) & (3) 60 um +/- 15 um 40 um +/- 15 um 100 um +/- 30 um

BT Resin (2) 100 um +/- 30 um 60 um +/- 30 um 150 um +/- 30 um

Total Copper Thickness (1)& (4)

Total Copper Thickness (2)& (3) 15 um +/- 5 um 10 um +/- 5 um 32 um +/- 10 um

Nickel Plating 5~10 um. 5~10 um. 5~10 um.

Gold Plating 0.5~1 um. 0.5~1 um. 0.5~1 um.

Solder Mask 30 um +/- 15 um. 30 um +/- 15 um. 30 um +/- 15 um.

Copper Thickness inThrough Hole




Depend on Min Finger/Trace Pitch; (Refer to Finger/Trace Design Rule)

ASERing, Finger Placement & S/M Design Rule

UNIT : um

Normal Rule Special ruleA 838 700 min.B 330 280 min.C 350 200 min.D 250 200 min.E 300 200 min.F 140 135GHJ

K 15050

(Ring w/o S/Mopening)

L 500 min. 430 min.150 130 min.75 50 min.

RuleSymbol Description

Die edge to ground ring edgeGround ring width (S/M opening)

Ground to power ring spacingPower ring width

Finger lengthBond finger pitch

Finger spacing design valueFinger design value

Finger finished value (top width)

Min width of solder resisterSolder mask shift

Refer to Finger/Trace DesignRule

Ring to via land spacing

Die edge to finger edge (w/o ring)

ASE

Unit: mm

2-Side Wire bonding

4-Side Wire bonding

A

D

B

D

A

B

C

D

Ring, Finger Placement & S/M Design Rule

E

ASEASEFinger Design Rule and Finished Value

7

* The design value of finger is defined by finger top width.The top width value of this table can be manufactured by all suppliers and supplier didn’t need to do any compensation by themselves. The cycle time will be reduced.

ASE-KRequest

min. range Pitch (um) Width Space Status Top +/- Tolerance Space (min) Status Top +/- Tolerance Space (min) Status Top +/- Tolerance Space (min)

15 15~23 105 70 35 Proto run 50 +/- 15 25 Proto run 55 +/- 15 25

15 15~23 110 75 35 Proto run 55 +/- 15 25 Proto run 60 +/- 15 25

15 15~23 115 80 35 Prodcution 60 +/- 15 25 Proto run 65 +/- 15 25

15 15~23 120 85 35 Production 65 +/- 15 25 Proto run 70 +/- 15 25







18 18~26 115 80 35 Production 55 +/- 20 30 Production 60 +/- 15 25 Proto run 65 +/- 15 25















22 22~30 120 85 35 Production 60 +/- 20 30 Production 70 +/- 20 30











27 27~35 145 107 38 Production 80 +/- 20 35 Production 85 +/- 20 3527 27~35 150 110 40 Production 85 +/- 20 35 Production 90 +/- 20 3527 27~35 155 115 40 Production 85 +/- 20 40 Production 90 +/- 20 4527 27~35 160 120 40 Production 90 +/- 20 40 Production 95 +/- 20 4527 27~35 165 120 45 Production 90 +/- 20 45 Production 100 +/- 20 4527 27~35 170 125 45 Production 95 +/- 20 45 Production 105 +/- 20 4527 27~35 175 130 45 Production 100 +/- 20 45 Production 110 +/- 20 4527 27~35 180 135 45 Production 105 +/- 20 45 Production 115 +/- 20 4527 27~35 185 140 45 Production 110 +/- 20 45 Production 120 +/- 20 45

Advanced Final Value after Manuafcturing(進階規格)

Option Process: Pre-plugging or SSE

Limitation Final Value after Manuafcturing(極限規格)

Option Process: SSE

Cu

Thickness

Bonding Finger

ASE-MaterialDesign

Normal Final Value after Manuafcturing (標準規格)

Option Process: Pre-plugging or SSE

ASEASE

8

Outer Layer Trace Design Rule and Finished Value

ASE-KRequest

min. range Pitch (um) Width Space Width Space Status Bottom +/- Tolernce Space (min) Status Bottom +/- Tolernce Space (min) Status Bottom +/- Tolernce Space (min)

15 15~23 80 45 35 42 38 Proto run 30 +/- 15 25 Proto run 35 +/- 15 2515 15~23 85 50 35 47 38 Proto run 35 +/- 15 25 Proto run 40 +/- 15 2515 15~23 90 55 35 52 38 Production 40 +/- 15 25 Proto run 45 +/- 15 2515 15~23 95 60 35 57 38 Production 45 +/- 15 25 Proto run 50 +/- 15 2515 15~23 100 62 38 60 40 Production 50 +/- 15 30 Proto run 55 +/- 15 3015 15~23 105 67 38 65 40 Production 55 +/- 15 30 Proto run 60 +/- 15 3015 15~23 110 72 38 70 40 Production 55 +/- 15 30 Proto run 60 +/- 15 3015 15~23 115 75 40 72 43 Production 60 +/- 15 35 Proto run 65 +/- 15 3515 15~23 120 80 40 77 43 Production 60 +/- 15 35 Proto run 65 +/- 15 3515 15~23 125 82 43 82 43 Production 65 +/- 15 40 Proto run 70 +/- 15 4018 18~26 90 55 35 52 38 Production 35 +/- 15 25 Production 40 +/- 15 25 Proto run 45 +/- 15 2518 18~26 95 60 35 57 38 Production 40 +/- 15 25 Production 45 +/- 15 25 Proto run 50 +/- 15 2518 18~26 100 62 38 60 40 Production 45 +/- 15 30 Production 50 +/- 15 30 Proto run 55 +/- 15 3018 18~26 105 67 38 65 40 Production 50 +/- 15 30 Production 55 +/- 15 30 Proto run 60 +/- 15 3018 18~26 110 72 38 70 40 Production 50 +/- 15 30 Production 55 +/- 15 30 Proto run 60 +/- 15 3018 18~26 115 75 40 72 43 Production 55 +/- 15 35 Production 60 +/- 15 35 Proto run 65 +/- 15 3518 18~26 120 80 40 77 43 Production 55 +/- 15 35 Production 60 +/- 15 35 Proto run 65 +/- 15 3518 18~26 125 82 43 82 43 Production 60 +/- 15 40 Production 65 +/- 15 40 Proto run 70 +/- 15 4018 18~26 130 87 43 87 43 Production 65 +/- 15 40 Production 70 +/- 15 40 Proto run 75 +/- 15 4018 18~26 135 92 43 92 43 Production 70 +/- 15 40 Production 75 +/- 15 40 Proto run 80 +/- 15 4018 18~26 140 95 45 95 45 Production 75 +/- 15 45 Production 80 +/- 15 45 Proto run 85 +/- 15 4518 18~26 145 100 45 100 45 Production 80 +/- 15 45 Production 85 +/- 15 45 Proto run 90 +/- 15 4518 18~26 150 105 45 105 45 Production 80 +/- 15 45 Production 85 +/- 15 45 Proto run 90 +/- 15 4518 18~26 155 110 45 110 45 Production 85 +/- 15 45 Production 90 +/- 15 45 Proto run 95 +/- 15 4518 18~26 160 115 45 115 45 Production 90 +/- 15 45 Production 95 +/- 15 45 Proto run 100 +/- 15 4518 18~26 165 120 45 120 45 Production 90 +/- 15 45 Production 95 +/- 15 45 Proto run 100 +/- 15 4518 18~26 170 125 45 125 45 Production 95 +/- 15 45 Production 100 +/- 15 45 Proto run 105 +/- 15 4518 18~26 175 130 45 130 45 Production 100 +/- 15 45 Production 105 +/- 15 45 Proto run 110 +/- 15 4518 18~26 180 135 45 135 45 Production 105 +/- 15 45 Production 110 +/- 15 45 Proto run 115 +/- 15 4522 22~30 100 62 38 60 40 Production 45 +/- 15 30 Production 50 +/- 15 3022 22~30 105 67 38 65 40 Production 50 +/- 15 30 Production 55 +/- 15 3022 22~30 110 72 38 70 40 Production 50 +/- 15 30 Production 60 +/- 15 3022 22~30 115 75 40 72 43 Production 55 +/- 15 35 Production 65 +/- 15 3522 22~30 120 80 40 77 43 Production 55 +/- 15 35 Production 65 +/- 15 3522 22~30 125 82 43 82 43 Production 60 +/- 15 40 Production 70 +/- 15 4022 22~30 130 87 43 87 43 Production 65 +/- 15 40 Production 75 +/- 15 4022 22~30 135 92 43 92 43 Production 70 +/- 15 40 Production 80 +/- 15 4022 22~30 140 95 45 95 45 Production 75 +/- 15 45 Production 85 +/- 15 4522 22~30 145 100 45 100 45 Production 80 +/- 15 45 Production 90 +/- 15 4522 22~30 150 105 45 105 45 Production 80 +/- 15 45 Production 95 +/- 15 4522 22~30 155 110 45 110 45 Production 85 +/- 15 45 Production 100 +/- 15 4522 22~30 160 115 45 115 45 Production 90 +/- 15 45 Production 105 +/- 15 4522 22~30 165 120 45 120 45 Production 90 +/- 15 45 Production 105 +/- 15 4527 27~35 140 95 45 95 45 Production 75 +/- 15 40 Production 80 +/- 15 4027 27~35 145 100 45 100 45 Production 80 +/- 15 40 Production 85 +/- 15 4027 27~35 150 105 45 105 45 Production 80 +/- 15 40 Production 90 +/- 15 4027 27~35 155 110 45 110 45 Production 85 +/- 15 40 Production 95 +/- 15 4027 27~35 160 115 45 115 45 Production 90 +/- 15 40 Production 100 +/- 15 4027 27~35 165 120 45 120 45 Production 90 +/- 15 40 Production 105 +/- 15 4027 27~35 170 125 45 125 45 Production 95 +/- 15 40 Production 110 +/- 15 4027 27~35 175 130 45 130 45 Production 95 +/- 15 40 Production 115 +/- 15 4027 27~35 180 135 45 135 45 Production 100 +/- 15 40 Production 120 +/- 15 40

TraceCu

ThicknessDesign Value

(chip side)Design Value

(ball side)

Normal Final Value after Manuafcturing(標準規格)

Advanced Final Value after Manuafcturing(進階規格)


Option Process: Pre-plugging or SSE Option Process: Pre-plugging or SSE Option Process: SSE

ASEASE

9

Inner Layer Trace Design Rule and Finished Value

Cu THK Pitch (um) StaTus Width Space Bottom +/- TolernceSpace (min) Bottom +/- Tolernce Space (min)

13~23 100 Production 55 45 40 +/- 15 35 45 +/- 15 3513~23 105 Production 60 45 40 +/- 15 35 50 +/- 15 3513~23 110 Production 65 45 45 +/- 15 35 55 +/- 15 3513~23 115 Production 65 50 45 +/- 15 35 55 +/- 15 3513~23 120 Production 70 50 50 +/- 15 35 60 +/- 15 3513~23 125 Production 75 50 55 +/- 15 35 65 +/- 15 3513~23 130 Production 80 50 60 +/- 15 35 70 +/- 15 3513~23 135 Production 85 50 65 +/- 15 35 75 +/- 15 3513~23 140 Production 90 50 65 +/- 15 40 80 +/- 15 4013~23 145 Production 95 50 65 +/- 15 40 85 +/- 15 4013~23 150 Production 100 50 65 +/- 15 40 90 +/- 15 4030~40 125 Production 75 50 55 +/- 15 35 65 +/- 15 3530~40 130 Production 80 50 60 +/- 15 35 70 +/- 15 3530~40 135 Production 85 50 65 +/- 15 35 75 +/- 15 3530~40 140 Production 90 50 65 +/- 15 40 80 +/- 15 4030~40 145 Production 95 50 65 +/- 15 40 85 +/- 15 4030~40 150 Production 95 55 65 +/- 15 40 85 +/- 15 4030~40 155 Production 100 55 70 +/- 15 40 90 +/- 15 4030~40 160 Production 100 60 70 +/- 15 45 90 +/- 15 4530~40 165 Production 105 60 75 +/- 15 45 95 +/- 15 4530~40 170 Production 110 60 80 +/- 15 45 100 +/- 15 4530~40 175 Production 115 60 85 +/- 15 45 105 +/- 15 4530~40 180 Production 120 60 90 +/- 15 45 110 +/- 15 4530~40 185 Production 125 60 95 +/- 15 45 115 +/- 15 4530~40 190 Production 130 60 100 +/- 15 45 120 +/- 15 4530~40 195 Production 135 60 105 +/- 15 45 125 +/- 15 4530~40 200 Production 140 60 110 +/- 15 45 130 +/- 15 4565~75 190 Production 140 50 100 +/- 15 45 110 +/- 15 4565~75 195 Production 145 50 105 +/- 15 45 115 +/- 15 4565~75 200 Production 150 50 110 +/- 15 45 120 +/- 15 45

ASE-K Request Design Value Adeveance Value after ManuafcturingFinal Value after Manuafcturing

ASEASE GPP+DOUBLE IMAGE PROCESS: Finger Design Rule and Finished Value

10


Cu+Ni+Au

ThicknessASE-K

Request

min. range Pitch (um) Width Space Status Top +/- Tolerance Space (min) Status Top +/- Tolerance Space (min)

15 27+/-12 105 67 38 Production 60 +/- 20 25 Proto run 60 +/- 15 25







18 30+/-12 140 95 45 Production 80 +/- 20 35

18 30+/-12 145 100 45 Production 85 +/- 20 35

18 30+/-12 150 105 45 Production 90 +/- 20 35

18 30+/-12 155 110 45 Production 95 +/- 20 35

18 30+/-12 160 110 50 Production 90 +/- 20 40

18 30+/-12 165 115 50 Production 95 +/- 20 40

18 30+/-12 170 120 50 Production 100 +/- 20 40

18 30+/-12 175 125 50 Production 105 +/- 20 40

18 30+/-12 180 130 50 Production 110 +/- 20 40

18 30+/-12 185 135 50 Production 115 +/- 20 40

GPP Design RuleBonding Finger

ASE-MaterialDesign

Normal Final Value after Manuafcturing (Mass-prouuction)

Option Process: GPP+Double Image

Limination Final Value after Manuafcturing(Proto-type)


ASEASE

11

GPP+DOUBLE IMAGE PROCESS: Outer Layer Trace Design Rule and Finished Value

ASE-KRequest

min. range Pitch (um) Width Space Width Space Status Bottom +/- Tolernce Space (min) Status Bottom +/- Tolernce Space (min)

15 27+/-12 80 45 35 45 35 Proto run 35 +/- 20 25 Proto run 35 +/- 15 2515 27+/-12 85 50 35 50 35 Proto run 40 +/- 20 25 Proto run 40 +/- 15 2518 30+/-12 90 47 43 47 43 Production 40 +/- 20 30 Proto run 40 +/- 15 3018 30+/-12 95 52 43 52 43 Production 45 +/- 20 30 Proto run 45 +/- 15 3018 30+/-12 100 57 43 57 43 Production 50 +/- 20 30 Proto run 50 +/- 15 3018 30+/-12 105 62 43 62 43 Production 55 +/- 20 30 Proto run 55 +/- 15 3018 30+/-12 110 67 43 67 43 Production 55 +/- 20 30 Proto run 55 +/- 15 3018 30+/-12 115 72 43 72 43 Production 60 +/- 20 30 Proto run 60 +/- 15 3018 30+/-12 120 77 43 77 43 Production 60 +/- 20 30 Proto run 60 +/- 15 3018 30+/-12 125 82 43 82 43 Production 65 +/- 20 30 Proto run 65 +/- 15 3018 30+/-12 130 87 43 87 43 Production 70 +/- 20 30 Proto run 70 +/- 15 3018 30+/-12 135 92 43 92 43 Production 75 +/- 20 30 Proto run 75 +/- 15 3018 30+/-12 140 97 43 97 43 Production 80 +/- 20 30 Proto run 80 +/- 15 3018 30+/-12 145 102 43 102 43 Production 85 +/- 20 30 Proto run 85 +/- 15 3018 30+/-12 150 107 43 107 43 Production 85 +/- 20 30 Proto run 85 +/- 15 3018 30+/-12 155 112 43 112 45 Production 85 +/- 20 3518 30+/-12 160 117 43 117 45 Production 90 +/- 20 3518 30+/-12 165 122 43 122 45 Production 90 +/- 20 3518 30+/-12 170 125 45 125 50 Production 95 +/- 20 4018 30+/-12 175 130 45 130 50 Production 95 +/- 20 4018 30+/-12 180 135 45 135 50 Production 100 +/- 20 40

Normal Final Value after Manuafcturing(Mass-production)


Trace

GPP Design Rule

Cu+Ni+Au



(ball side)

Limination Final Value after Manuafcturing(Proto-type)


ASESelective Gold Process: Finger Design Rule and Finished

Value


ASE-KRequest

min. range Pitch (um) Width Space Status Top +/- Tolerance Space (min) Status Top +/- Tolerance Space (min) Status Top +/- Tolerance Space (min)15 105 Proto run 65 7.5 25 Proto run 70 15 20

15 110 Proto run 70 7.5 25 Proto run 70 15 25

15 115 Proto run 75 10 25 Proto run 75 15 25

15 120 Production 80 10 25 Proto run 80 15 25







18 115 Production 75 20 25 Proto run 75 10 25 Proto run 70 15 30




18 135 Production 90 10 35 Production 85 10 35 Proto run 80 15 40











22 120 Production 92.5 12.5 15 Proto run 80 12.5 20

22 125 Production 92.5 12.5 20 Proto run 80 12.5 25

22 130 Production 92.5 12.5 25 Production 85 12.5 25









27 145 Production 105 15 25 Production 95 15 2527 150 Production 105 15 30 Production 95 15 3027 155 Production 110 15 30 Production 100 15 3027 160 Production 110 15 35 Production 105 15 3027 165 Production 115 15 35 Production 105 15 3527 170 Production 120 15 35 Production 110 15 3527 175 Production 125 15 35 Production 115 15 3527 180 Production 125 15 40 Production 115 15 4027 185 Production 130 15 40 Production 120 15 40


Thickness

Cu + Ni/Au Bonding FingerNormal Final Value after Manuafcturing

(標準規格)Advanced Final Value after Manuafcturing

(進階規格)

ASE

ASE-KRequest

min. range Pitch (um) Width Space Width Space Status Bottom +/- Tolernce Space (min) Status Bottom +/- Tolernce Space (min) Status Bottom +/-10 80 Proto run 35 +/- 10 30 40 +/-10 85 Proto run 40 +/- 10 30 45 +/-10 90 Production 40 +/- 10 35 45 +/-10 95 Production 45 +/- 10 35 50 +/-10 100 Production 45 +/- 10 40 50 +/-10 105 Production 50 +/- 10 40 55 +/-10 110 Production 50 +/- 10 45 55 +/-10 115 Production 55 +/- 10 45 60 +/-10 120 Production 55 +/- 10 50 60 +/-10 125 Production 60 +/- 10 50 65 +/-

12 90 Production 42 +/- 15 35 Proto run 45 +/- 12 35 45 +/-12 95 Production 47 +/- 15 35 Proto run 50 +/- 12 35 50 +/-12 100 Production 47 +/- 15 40 Production 50 +/- 12 40 50 +/-12 105 Production 52 +/- 15 40 Production 55 +/- 12 40 55 +/-12 110 Production 52 +/- 15 45 Production 55 +/- 12 45 55 +/-12 115 Production 57 +/- 15 45 Production 60 +/- 12 45 60 +/-12 120 Production 57 +/- 15 50 Production 60 +/- 12 50 60 +/-12 125 Production 62 +/- 15 50 Production 65 +/- 12 50 65 +/-12 130 Production 62 +/- 15 55 Production 65 +/- 12 55 65 +/-12 135 Production 67 +/- 15 55 Production 70 +/- 12 55 70 +/-12 140 Production 67 +/- 15 60 Production 70 +/- 12 60 70 +/-12 145 Production 72 +/- 15 60 Production 75 +/- 12 60 75 +/-12 150 Production 72 +/- 15 65 Production 75 +/- 12 65 75 +/-12 155 Production 77 +/- 15 65 Production 80 +/- 12 65 80 +/-12 160 Production 77 +/- 15 70 Production 80 +/- 12 70 80 +/-12 165 Production 82 +/- 15 70 Production 85 +/- 12 70 85 +/-12 170 Production 82 +/- 15 75 Production 85 +/- 12 75 85 +/-12 175 Production 87 +/- 15 75 Production 90 +/- 12 75 90 +/-12 180 Production 87 +/- 15 80 Production 90 +/- 12 80 90 +/-

15 100 Production 45 +/- 15 35 Proto run 48 +/- 15 3515 105 Production 50 +/- 15 35 Proto run 53 +/- 15 3515 110 Production 50 +/- 15 40 Production 53 +/- 15 4015 115 Production 55 +/- 15 40 Production 58 +/- 15 4015 120 Production 55 +/- 15 45 Production 58 +/- 15 4515 125 Production 60 +/- 15 45 Production 63 +/- 15 4515 130 Production 60 +/- 15 50 Production 63 +/- 15 5015 135 Production 65 +/- 15 50 Production 68 +/- 15 5015 140 Production 65 +/- 15 55 Production 68 +/- 15 5515 145 Production 70 +/- 15 55 Production 73 +/- 15 5515 150 Production 70 +/- 15 60 Production 73 +/- 15 6015 155 Production 75 +/- 15 60 Production 78 +/- 15 6015 160 Production 75 +/- 15 65 Production 78 +/- 15 6515 165 Production 80 +/- 15 65 Production 83 +/- 15 6518 140 Production 60 +/- 15 50 Production 63 +/- 15 5018 145 Production 65 +/- 15 50 Production 68 +/- 15 5018 150 Production 65 +/- 15 55 Production 68 +/- 15 5518 155 Production 70 +/- 15 55 Production 73 +/- 15 5518 160 Production 70 +/- 15 60 Production 73 +/- 15 6018 165 Production 75 +/- 15 60 Production 78 +/- 15 6018 170 Production 75 +/- 15 65 Production 78 +/- 15 6518 175 Production 80 +/- 15 65 Production 83 +/- 15 6518 180 Production 80 +/- 15 70 Production 83 +/- 15 70

Cu Trace



(ball side)

Normal Final Value after Manuafcturing

(標準規格)

Advanced Final Value after Manuafcturing

(進階規格)

Limitation Final Value after Manuafcturing

(極限規格)

Selective Gold Process :: Outer Layer Trace Design Rule and Finished Value

ASEFinger Design Rule for Multi Bond (Double Bond,Triple Bond

and Four Bond)

14

(手指的設計和金線線徑，以及多 bond時手指的設計方式。)

◎ Enlarge 8 corner finger width to 150um (8個角落的手指加寬至 150um)

GOLD WIRE DIAMETER BOND QTY MIN. FINGER WIDTH / MIN. LENGTH

/TARGET LENGTH（UM）BACK UP 1 BACK UP 2

1 BOND 110 / 280 / 330

2 BONDS 220 / 280 / 330 110 / 406 / 458 ≧ 1.2 mils

3；4 BONDS 330 / 280 / 330；440 / 280 / 330 220 / 406 / 458 110 / 533 / 610

1 BOND 105 / 280 / 330

2 BONDS 210 / 280 / 330 105 / 406 / 458 1.1 mils

3；4 BONDS 315 / 280 / 330；420 / 280 / 330 210 / 406 / 458 105 / 533 / 610

1 BOND 100 / 280 / 330

2 BONDS 200 / 280 / 330 100 / 406 / 458 1.0 mils

3；4 BONDS 300 / 280 / 330；400 / 280 / 330 200 / 406 / 458 100 / 533 / 584

1 BOND 95 / 280 / 330

2 BONDS 190 / 280 / 330 95 / 406 / 458 0.9 mils

3；4 BONDS 285 / 280 / 330；380 / 280 / 330 190 / 406 / 458 95 / 533 / 584

1 BOND 90 / 280 / 330

2 BONDS 180 / 280 / 330 90 / 406 / 458 0.8 mils

3；4 BONDS 270 / 280 / 330；360 / 280 / 330 180 / 406 / 458 90 / 533 / 594

Bonding finger width, wire quantity and wire diameter design rule

ASEInner Layer Trace Design Rule and Finished Value

Cu Remark

THK Pitch (um) StaTus Width Space Bottom+/- Tolernce Space (min) Bottom +/- Tolernce Space (min)

13~23 100 Production 55 45 40 +/- 15 35 45 +/- 15 35

13~23 105 Production 60 45 40 +/- 15 35 50 +/- 15 35

13~23 110 Production 65 45 45 +/- 15 35 55 +/- 15 35

13~23 115 Production 65 50 45 +/- 15 35 55 +/- 15 35

13~23 120 Production 70 50 50 +/- 15 35 60 +/- 15 35

13~23 125 Production 75 50 55 +/- 15 35 65 +/- 15 35

13~23 130 Production 80 50 60 +/- 15 35 70 +/- 15 35

13~23 135 Production 85 50 65 +/- 15 35 75 +/- 15 35

13~23 140 Production 90 50 65 +/- 15 40 80 +/- 15 40

13~23 145 Production 95 50 65 +/- 15 40 85 +/- 15 40

13~23 150 Production 100 50 65 +/- 15 40 90 +/- 15 40

30~40 125 Production 75 50 55 +/- 15 35 65 +/- 15 35

30~40 130 Production 80 50 60 +/- 15 35 70 +/- 15 35

30~40 135 Production 85 50 65 +/- 15 35 75 +/- 15 35

30~40 140 Production 90 50 65 +/- 15 40 80 +/- 15 40

30~40 145 Production 95 50 65 +/- 15 40 85 +/- 15 40

30~40 150 Production 95 55 65 +/- 15 40 85 +/- 15 40

30~40 155 Production 100 55 70 +/- 15 40 90 +/- 15 40

30~40 160 Production 100 60 70 +/- 15 45 90 +/- 15 45

30~40 165 Production 105 60 75 +/- 15 45 95 +/- 15 45

30~40 170 Production 110 60 80 +/- 15 45 100 +/- 15 45

30~40 175 Production 115 60 85 +/- 15 45 105 +/- 15 45

30~40 180 Production 120 60 90 +/- 15 45 110 +/- 15 45

30~40 185 Production 125 60 95 +/- 15 45 115 +/- 15 45

30~40 190 Production 130 60 100 +/- 15 45 120 +/- 15 45

30~40 195 Production 135 60 105 +/- 15 45 125 +/- 15 45

30~40 200 Production 140 60 110 +/- 15 45 130 +/- 15 4565~75 190 Production 140 50 100 +/- 15 45 110 +/- 15 4565~75 195 Production 145 50 105 +/- 15 45 115 +/- 15 4565~75 200 Production 150 50 110 +/- 15 45 120 +/- 15 45

When Sub.Thicks.>=0.61

mm

ASE-K RequestDesignValue Adeveance Value after ManuafcturingFinal Value after Manuafcturing


mm


mm

ASE

ASE Vias Design Rule

Normal Design

Nomal Rule Special Rule Risk Rule Nomal Rule Special Rule Risk RuleA Via land to land pad spacing 70 50 40 100 75 50B Via land to trace/shape spacing 70 50 40 100 75 50C Substrate edge to via pad 100 Min 150 MinD Substrate edge to trace/shape 100 Min 150 Min

E Trace to trace pitchF Trace to trace spacingG Trace bottom widthH Via hole 200 150 100 200 150 100J Via land H + 200 H + 150 H + 130 H + 200 H + 150 H + 130

Padless DesignA Via to Via spacing 250 200 180B Via to trace/shape spacing 200 150 125 200 150 125J No Land (no trace connection) H + 0 H + 0 H + 0

Symbol Description

Refer to trace design rule Refer to trace design rule

Outer Layer Inner Layer

ASE

SOLDER BALL SIZE

φ 300 φ 400 φ 450 φ 500 φ 600 φ 760

BALL LAND375 (Ball Pitch=500)400 (Ball Pitch≧ 650) 500 550 550 550 750

Solder Opening 275 350 400 400 400 600

Dimension of Solder Ball and Pad/SM Opening

ASEThe space from ball to package edge

ASEASE

20

Laminate Blind Via DesignLaminate Blind Via DesignLaminate Blind Via DesignLaminate Blind Via Design

ASEASE

Substrate Structure

21

1+2+1 Layer

Finger Design Rule and Finished Value : same as Laminate PTH design.

Finger Design Rule for Multi Bond (Double Bond, Triple Bond and Four Bond) : same as Laminate PTH design.

Description 0.36mm Substrate (Special)Finished Thickness 360 um +/- 40 umBT Resin (1) & (3) 60 um +/- 15 umBT Resin (2) 100 um +/- 30 um

Total Copper Thickness (1) & (4)Depend on Min Finger/Trace Pitch(Refer to Finger/Trace Design Rule)

Total Copper Thickness (2) & (3) 22 um +/- 4 umNickel Plating 5 um Min.Gold Plating 0.5 um Min.Solder Mask 30+/-15 um.Copper Thickness in ThroughHole 15 um Min.(Mechincal);10 um Min.(Laser)

ASE

Design Rule by Laser via - Outer layerDesign Rule by Laser via - Outer layer

44

44

11

33

4 4 22

44

4 4

4

PrototypeProduction

Blind Via Diameter

Trace width

Blind Via land diameter

Space

Item#

1234

<Unit : um>

80

Via +150

50

70

50

40 40

Via +130

22

ASE

Design Rule by Laser via - Inner layerDesign Rule by Laser via - Inner layer

44

44

11

33

4 4 22

44

4 4

4

PrototypeProduction

Blind Via Diameter

Trace width

Blind Via land diameter

Space

Item#

1234

<Unit : um>

80

Via +180

50

70

50

45 40

Via +150

23

ASE

Design Rule by Buried-Via(Inner Layer)Design Rule by Buried-Via(Inner Layer)

44

44

11

33

4 4 22

44

4 4

4

PrototypeProduction

PTH Diameter

Trace width

PTH land diameter

Space

Item#

1234

<Unit : um>

150

50

100

50

45

40

Via +150Via +200

24

ASEASE

25

GENERAL LF/TF WIRE GENERAL LF/TF WIRE BOND DESIGN RULEBOND DESIGN RULE

GENERAL LF/TF WIRE GENERAL LF/TF WIRE BOND DESIGN RULEBOND DESIGN RULE

ASE

1.0 Wire Selection Rule

1.1 Max wire length is 150 mils(3810 um) 1.2 Wire diameter depends on bond pad pitch and finger pitch.

Bond Pad Pitch, Bond Pad Opening, Max Wire Length, Gold Wire, and Finger Pitch relationship

IN-Line Pitch Staggered PitchFinger

Top WidthMin. FingerTop Width

B.P.O.≧ 80(um) 30um(1.2mil) MWL<3810um(150mil) 150um 92.5 +/- 22.5 um 70um

80>B.P.O.≧ 70(um) 30um(1.2mil) MWL<3810um(150mil) 150um 92.5 +/- 22.5 um 70um












45>B.P.O.≧ 40(um) 18um(0.7mil) MWL<2540um(100mil) 130um 70 +/- 25 um 45um

40≦ L.P.< 50(um) 20≦ L.P.< 25(um) 45>B.P.O.≧ 40(um) 18um(0.7mil) MWL<2540um(100mil) 130um 70 +/- 25 um 45um

Min. FingerPitch

(Design)

Final Value after Manufacturing

L.P.≧ 80(um) L.P.≧ 40(um)

Bond Pad PitchBond PadOpening

Wire DiameterMax. Wire Length

for BGA PKG

50≦ L.P.< 60(um) 25≦ L.P.< 30(um)

70≦ L.P.< 80(um) 35≦ L.P.< 40(um)

60≦ L.P.< 70(um) 30≦ L.P.< 35(um)

ASE

1.3 For Stagger Bond Pad Layout（ Stagger Bond Pad wire diameter depend on finger pitch） . 1.3.1 Finger pitch >=140 um, Wire diameter choose 1.0 mils. Max wire length is 3556 um (140 mils). 1.3.2 Finger pitch < 140 um, Wire diameter choose 0.9 mils. Max wire length is 3302 um (130 mils).1.4 Special definition：When pad pitch > 100 um and Max wire length < 130 mil, 0.9 mils gold wire is allowed for cost down.

Note : Control wires length the same as possible in the four sides. (No matter the inner and outer finger)

ASE

2.0 Wire Layout Design Rule

Distance of wires criteria ,Cross Pad and finger criteria control .

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1. If wire B wire A, wire B can't cross adjacent bonding pad of wire A≦ (當 wireB 的線長小於等於 wireA 時， wireB 不可橫跨相鄰 wireA 的鋁墊 )

2. If wire C wire B, wire C can cross adjacent bonding pad of wire B, but need to ≧ have one wire diameter space between wire C and wire B. (當 wire C 的線長大於 wire B 的線長時， wire C 可以橫跨 wire B 的鋁墊，但wire C 和 wire B 之間需有一倍線徑的距離。 ) Same finger layer or same ring layer is equal to the same wire length. ( 同弧的手指或同一 ring 視為相同線長 )

C

B A

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3. Cross adjacent Finger : not allowed. ( 銲線不可橫跨同排相鄰的手指 ) 4. Wire to wire distance > 1 wire diameter (Min). ( 線與線間距 >1 倍線徑 )5. Finger (Inner/Outer) direction must be parallel to wire direction as possible. The max angle θ < ± 15°. ( 手指方向儘可能與金線平行，如不行時必須控制在 15 度內。 )

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θ θ 0°

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Note 5 : When two dies use same substrate, the single finger could be bond different wire for different die.The Finger direction must be set the center of the angle which make up by the different wire. ( 當同一基板套用不同 Die 時 , 單一手指可能被不同 die 的線連接 , 此手指方向必須坐落在兩線夾角的中間 )

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6. Trace can not exposed in the front of finger. Straight trace from the edge of the Solder mask > 150um. (Trace 不可在 Finger 前端露鍍金 . Finger 前端的 Trace 必須在拒銲劑邊界 150 um後才能轉彎 )

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7. Follow select wire table (1.1) choose finger Pitch. ( 請依據表 1.1 來選擇 finger pitch)8. For product which is fine pitch or the max wire length over 120 mils, all corner’s 1st （ 2nd） fingers must have 2（ 1.5） times finger pitch than normal finger pitch. ( 一般 finger pitch 的選擇請依照線長線徑的選擇表。針對 Fine Pitch 及線長超過 120 mils 的產品，各角落第 1 個（第 2 個） finger 的 pitch 必須有一般 finger pitch 2（ 1.5）倍的距離。）

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Wire Alignment of inner and outer finger. ( For both single and staggered pad )

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9. distance between Inner finger and adjacent wire >1 wire diameter (Min). ( 內手指的兩側與相鄰長線之距離必須 >1 倍線徑 )

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Wire angle of inner finger ( 內手指線之角度 ) 10. For Fine pitch product (BPP<=60um), the shorter wire of the front finger angle (Non-include the Power/Ground Ring) must equal or less than the calculated value from the formula which W/B project team provided. ( 針對 Fine Pitch 產品 (BPP<=60um), 前手指線 ( 不含 Power/Ground Ring) 其最小角度必須依 W/B 專案組所提供之公式計算出。 )

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Inner pad wires cross outer pad wires rules ( 內鋁墊線需跨外鋁墊線之規則 ) 11. If C is small than 800um, the cross point must be smaller than half of inner pad wire length. ( 當前後手指 Pitch 小於 800um 時，交叉點必須小於內層鋁墊金線的一半。 ) 12. If C is larger or equal to 800um, the cross point can be larger than half of inner pad wire length. ( 當前後手指 Pitch 大於等於 800um 時，此時交叉點可以大於等於內層鋁墊金線一半。 )A

B C

A

B C

7. If C < 800um, B < A/2 8. If C >= 800um, B can be > A/2

Note: Don’t let wires cross each other as possible as you can, even the wires are in different pad level. ( 即使是不同鋁墊層的線，也儘可能不要讓線彼此交錯。 )

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3. Device Design Rule

Pad Size Layout

PAD Size

Device Size

ITEM DESCRIPTION DIMENSION(MIN) Unit(mil)

APAD SIZE OVER THE

DEVICE SIZE17 mil

A

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4 Ground/ Power Ring Rule

Bonding ring width/space design rule

POWER3GROUND POWER1 POWER2

17 mils A B CD

GROUND RING ( A ) POWER RING ( C )

GENERAL RULE 330 UM 250 UM 200 UM

SPECIAL RULE 280 UM 200 UM 150 UM

130 MIL

MINIMUM TOP WIDTH (DESIGN VALUE)DESIGN VALUE

MINIMUM SPACE BETWEENRIND AND RING ( B )

( WITHOUT S/M )

MAXIMUM WIRE LENGTH OFPOWER RING ( D )( WITHOUT S/M)

If bonding rings without S/M cover between, the length of wire which bond to outermost ring must <= 130 mil.(若 ring和 ring 間不蓋上 S/M 時，則打至 ring 的線長不得大於 130mil)

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5.Finger Layout Rule

Loop typeInline type

In-line Finger Rule

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Stagger Finger Rule

Outer finger and Inner finger relation rule (without S/M cover)( 前後手指相關規則 )(無 S/M 蓋上時 )

X: Finger pitch between Inner finger and outer finger (X direction) (X: 前手指到外手指線中心之 X 方向距離 )

Y: Space between Inner finger and Outer finger (Y direction) (Y: 前、後手指之 Y 方向距離 )

If Y <300um, should let X> (Finger top width) + (Wire diameter)( 如果 Y 小於 300um， X 必須大於手指 top width 加上線徑 )

If Y 300um, may let X no limit ≧( 如果 Y 大於等於 300um ，則 X 不限制 )

X

Y

Outer finger

Inner finger

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6.Solder Mask Design Rule

A

BC

ITEM DESCRIPTION DIMENSION(MIN)

A Opening edge width 100um

B Overlap finger 25um

CBond finger metal to edge of

package keep out100um

D Min width of solder mask 150um

D

Note: Cover solder mask as possible If the solder mask cover area (D) larger then 150um ( 如果拒銲劑可覆蓋寬度 (D) 大於 150um ，則儘可能的覆蓋拒銲劑。 )

Documents

ASE ASEK CSP-BGA (Sawing Type) Substrate Design Rev. :L Date : 04/13/04” Prepared : Damon_Hung