Compelfest Jan 2014 - Компэл · Compelfest - Agenda •Technology ... to 4G form factor, including full GNSS (GPS & GLONASS) ... Pentaband HSDPA/HSUPA, up to LTE

1 Proprietary and Confidential

Compelfest – Jan 2014


Compelfest - Agenda

• Technology

– 2G + 3G review

– 4G (LTE)

– Frequencies, deployment, technology

– Advantages users and networks

– Voice, implementation and roll out

• Products

– Essential: HL series

– MC series

– Plug and play


Compelfest – Jan 2014 Technology overview


2G – GSM/GPRS/EDGE

• First digital mobile standard widely deployed and controlled by European Telecommunications Standards Institute (ETSI).

• Basic definitions of the technology are

– 2G – GSM

Used for voice calls, SMS, USSD.

– 2.5G – GPRS

Sits on top of GSM and provides packet switching capabilities for IP.

– 2.75G – EDGE

New modulation scheme but exactly the same radio characteristics and signalling as GSM, much higher data rates.


3G – UMTS

• New infrastructure, modulation and technology to 2G.

• The two co exist and interwork with each other

• All 3G units will fall back to 2G if 3G is not available i.e. voice calls will be handed over between the two, etc.

• There are levels again with 3G which are defined below, they are designed and deployed purely to give higher data rates

– 3G – Basic (384Kbps up and down).

– 3.5G – HSPA. High speed packet access, consists of HSDPA (21Mbps downlink) and HSUPA (5.76 Mbps uplink).

– 3.75G – HSPA+


• Fastest deployed mobile technology in history of wireless comms.

• LTE also known as E-UTRA.

• Super high data rates (in theory).

– 3GPP Release 8 - 100MBps downlink, 50Mbps uplink

– 3GPP Release 10 – Known as LTE Advanced – 1Gbps downlink, 500Mbps uplink, 100Mbps high speed mobile.

• Completely new modulation scheme (just like 3G was to 2G).

• All IP network, no circuit switching; circuit switching services need to be emulated over IP.

• Uses one of the PDP contexts that the chipset has available for a network attach.

• A lot (over 40) of different frequency bands, there is no universal band covering the globe.

• Up to 100Km cell radius (3G is less than 8Km, 2G 25Km)

Headlines about LTE


Moving to LTE holds a lot of advantages over the previous technologies

• More efficient usages of spectrum along with aggregating the existing bands owned by the network.

• Higher headline data rates, but more importantly, higher average rates across all users addressing their major capacity and user experience issues.

• Common core network across technologies.

• With 3GPP2 and release 9 and 10 CDMA is being brought into line enabling convergence of networks.

• Greater security over the air and across the core network.

– Mutual authentication (as in 3G).

– Integrity protection, stopping man in the middle attacks.

– 128 bit cyphering of all data traffic.

• Self Optimising Networks (SON). Very big feature.

– Automatic awareness of surround cells meaning very quick set up time.

– Instant redistribution of traffic between cells to enable more even distribution.

• Much lower latency on the link.

Advantages


Essential Modem Product Range Compelfest - 2014


Essential Modules Roadmap

2014 2015 2013

WS6318 (2G Dual Band)

LG

A

HL8548 (3G Penta Band)

HL6528 (2G Quad Band)

HL7xxx (4G LTE)

WS and HL Series Air Interfaces: 2G GPRS, 3G HSPA, 4G LTE

New HL Series: The smallest 2G

to 4G form factor, including full

GNSS (GPS & GLONASS)

LGA 22x23 mm

WS6318: Ultra-compact 2G

module, footprint compatible with

new AirPrime® HL series

LGA 15x18 mm

in development

HL8548: 3G HSPA Penta Band

• Samples January 2014

• SOP July 2014

HL6528: 2G GPRS Quad Band

• Samples October 2013

• SOP February 2014

Upcoming release dates


Key Benefits:

• Small and easy to use

• Easy upgrade path from 2G to 4G*

Reliable, essential M2M connectivity and proven

firmware widely deployed worldwide

Model Air Interface

HL6528 GSM/GPRS

HL8548 HSPA

WS6318 GSM/GPRS

AirPrime HL and WS Series:

Snap-in option

18 mm

HL Series / WS Series:

Air Interfaces: 2G (GSM/GPRS), 3G (HSDPA/HSUPA), 4G LTE

Packages: LGA solder-down design

Snap-in socket option to change modules at any time

Device Management: Ready-to-Use Firmware Upgrades

More features: Enhanced GNSS (GPS + GLONASS), Dual SIM/

dual standby technology for maximum network connectivity

Interfaces: USB, UARTs, Audio

ESSENTIAL

15 m

m

*HL 4G version in development

Ultra Compact Modules


One design for 2G, 3G, and 4G deployments

Flexible

• One standard form factor across deployments

• Choose between LGA solder-down and snap-in integration

• Enhanced GNSS (GPS + GLONASS)

• Quad-band GSM/GPRS/EDGE, Pentaband HSDPA/HSUPA, up to LTE

• Dual SIM, dual standby technology for maximum network

connectivity

2G 3G

4G


Protect your investment

Future-Proof

• Modules are pre-integrated with AirVantage® Management Services to

save you time and operating costs

– Design once and future-proof deployments with upgradable firmware

– Ready-to-use, multi-device upgrades streamline operations

Ready-to-Use

Firmware

Upgrades

2G 3G

4G


• Use one standard form factor across 2G, 3G, and 4G technologies

for reduced OEM development costs and easy migration path

• Scale your deployment to address:

– Different regions of the world

– Low-end and high-end devices

– Future technology migration paths

2G

3G

4G

Same form factor across HL Series

22 x 23 mm

Scalable

One size, one design, one footprint


Solder module

directly onto

the board

OR Solder the socket

to the board to allow

more flexibility

Swap modules at any

point in the production

or product life cycle:

2G, 3G or 4G

2G

3G

4G

2G, 3G or 4G

Industry’s first snap-in socket provides total flexibility

Innovative

Choose to solder down the module or select the socket option

to gain the flexibility to change modules at any time. Use

2G, 3G, 4G or a mix across your deployment.


Cellular

Dual Band GSM/GPRS

900/1800 MHz – GPRS Class 10

AirPrimeTM WS6318

M2M Essentials, smaller than ever

Physical Characteristics

Dimensions: 15.05 mm x 17.85 mm x 2.5 mm

(typical)

Industrial Grade

Temperature ranges:

-30°C to +70°C (operating class A)

-40°C to +85°C (operating class B)

Storage Temperature: -40°C to +85°C

Encapsulated LGA (64 pins)

I/O Interfaces & Voltage

Serial link: 2xUART (1x8-wire AT/data, 1x2-wire debug)

Network: SIM (1.8V/3V), Tx Burst, Module Ready

Audio: PCM, 1xMicro, 2xSpeakers

Digital: 8xGPIO, 2xPWM, Buzzer, On/Off, RTC,

32KHz, SIMPRES

Analog: 2xADC, 2.8V outputs

Key Features

Smaller than ever for ultimate integration thanks to its

innovative packaging technology

Digital and Analogic (1xMicro, 2xSpeakers 4/8/16 Ω)

Audio with advanced services (AEC/NR), DTMF and

voice-mixed DTMF detection/generation

Tone player from 1 to 4000 Hz

Embedded TCP/IP stack with FTP client

Network scan (w/o SIM) and Network monitoring (one

shot serving cell and neighbours cells display)

CMUX over UART

Extra emergency call numbers,

Development tools: WS series development kit,

Downloading tool, Traces tool, Xmodem

Availability

Mass Production: now

Approval and Certification

GCF-CC – February 2012 R&TTE – February 2012


MC series Products Compelfest – January 2014


MC Series: Air Interfaces: including 3G (HSPA+, EV-DO) and 4G (LTE) Package: PCI Express MiniCard – 52 pins Interface: USB, UARTs, Audio

17

AirPrime MC Series:Standard Mini PCI Form Factor

Key Benefits:

•Easy to integrate: Standard miniPCI form factor

with industrial specifications

•High-speed cellular connectivity with the latest

technologies

•Easy upgrade path to new network technologies

ESSENTIAL

4G LTE Market Leadership


Product MC8704/MC8705 MC8090/92 MC7700 MC7710 MC7750

Target Region WW WW USA (AT&T),

Japan, Canada Europe USA (VZW)

Qualcomm Chipset MDM8200A MDM6200 MDM9200 MDM9200 MDM9600

Radio Technology HSPA+

EDGE/GSM

HSPA+/

EDGE/GSM

LTE

DC HSPA+ HSPA+/GSM

EDGE

LTE

DC HSPA+ HSPA+/GSM/EDGE

LTE

EVDO RevA

CDMA 1x

Peak Downlink Rate 21.1 Mbps 14.4 Mbps (HSPA+) 100 Mbps (Dependent on carrier network support)

Peak Uplink Rate 5.76 Mbps 5.76 Mbps (HSPA+) 50 Mbps (Dependent on carrier network support)

Frequency Band

N/A N/A

LTE:

AT&T/CAN:

700(B17), AWS(B4)

DoCoMo: 2100 MHz

LTE:

2100(B1),1800(B3),

2600(B7),900(B8),

800(B20)

LTE:

700(B13)

UMTS/HSPA+

850/900/1900/2100 MHz

UMTS/HSPA+

800/850/1900/2100 MHz

UMTS/HSPA+:

850/1900/2100MHz

UMTS/HSPA+:

900/2100MHz

CDMA1x

EVDO Rev A:

800 (BC0)

1900 (BC1)

Quad-Band EDGE/GPRS/GSM Quad-Band EDGE/GPRS/GSM Quad-Band EDGE/GPRS/GSM Tri-Band EDGE/GPRS/GSM N/A

Form Factor

Dimensions 51x30x4.5 mm 51x30x4.5 mm PCIe Mini Card (51x30x4.5mm)

Voice Capabilities MC8704: PCM PCM No No No

GPS

Standalone, Xtra

Assisted Yes

Standalone, Xtra

Assisted,

Standalone, Xtra

Assisted, Standalone

Host Software Linux SDK Linux SDK Linux QMI SDK Linux QMI SDK Linux QMI SDK

Temperature -25°C to +75°C -40°C to +85°C -25°C to +60°C -25°C to +60°C -25°C to +60°C

Commercial Availability NOW! NOW! NOW! NOW! NOW!

Industrial Temp:

In Planning:

Subject to change:

Mini card Line-up


Product MC7355 MC7305 MC7354 MC7304

(was MC7804)

MC7350

(was MC7800)

MC7350-L

(was MC7800-L ) MC7330

Target Region North America

(multi operator)

Europe, Australia,

New Zealand

North America

(multi operator)

Europe, Australia,

New Zealand

USA

(Verizon, Sprint)

USA

(Verizon)

Japan

(NTT Docomo)

Qualcomm Chipset MDM9615 MDM9215 MDM9615 MDM9215 MDM9615 MDM9215 MDM9215

Radio Technology

LTE

DC HSPA+

HSPA+/

GSM/EDGE/

CDMA EVDO/1x

LTE

DC HSPA+

HSPA+/

GSM/EDGE

LTE

DC HSPA+

HSPA+/

GSM/EDGE/

CDMA EVDO/1x

Also Avail. with CDMA

disabled for

ATT/Canada

(Replacing MC7802)

LTE

DC HSPA+

HSPA+/

GSM/EDGE

LTE

EVDO RevA

CDMA 1x LTE Only

LTE

DC HSPA+/HSPA+/

GSM/EDGE

Peak Downlink Rate 100 Mbps (Dependent on carrier network support)

Peak Uplink Rate 50 Mbps (Dependent on carrier network support)

Frequency Band

LTE:

1900(B2), AWS(B4)

850(B5),700 (B13),

700(B17), 1900(B25)

LTE:

2100(B1),1800(B3),

2600(B7),900(B8),

800(B20)

LTE:

1900(B2), AWS(B4)

850(B5),700 (B13),

700(B17), 1900(B25)

LTE:

2100(B1),1800(B3),

2600(B7),900(B8),

800(B20)

LTE:

AWS(B4), 700(B13)

1900PCS(B25)

LTE:

AWS(B4), 700(B13)

LTE

2100 (B1), 850

(B19), 1500 (B21)

UMTS/HSPA+:

2100(B1), 1900(B2),

AWS(B4),850(B5),

900(B8)

CDMA EVDO/1x: BC0,

BC1, BC10

UMTS/HSPA+:

2100(B1),1900(B2)

850(B5),800(B6), 900(B8)

UMTS/HSPA+:

2100(B1), 1900(B2),

AWS(B4),850(B5),

900(B8)

CDMA EVDO/1x: BC0,

BC1, BC10

UMTS/HSPA+:

2100(B1),1900(B2)

850(B5),800(B6),

900(B8)

CDMA 1x

EVDO Rev A:

BC0,BC1,BC10

NA

UMTS/HSPA+

2100 (B1), 850 (B5)

850 (B6), 850 (B19)

Quad-Band

EDGE/GPRS/GSM

Quad-Band

EDGE/GPRS/GSM

Quad-Band

EDGE/GPRS/GSM

Quad-Band

EDGE/GPRS/GSM

BC0,BC1,BC10

NA

Quad-Band

EDGE/GPRS/ GSM

Form Factor

Dimensions 51x30x2.7 mm

Voice Capabilities No No VoLTE / CSFB

(network dependent)

VoLTE / CSFB

(network dependent)

VoLTE / CSFB

(network dependent) No No

GPS Standalone, Xtra, Assisted, Glonas

Host Software Windows 7, 8

Linux QMI SDK Windows 7, 8

Linux QMI SDK

Windows 7, 8

Linux QMI SDK

Windows 7, 8

Linux QMI SDK

Windows 7, 8

Linux QMI SDK

Windows 7, 8

Linux QMI SDK

Windows 7, 8

Linux QMI SDK

Temperature -40 to +85C

Commercial Availability Now Now Q4-2013 Q4-2013 Q4-2013 Q4-2013 Q3-2013

New for M2M Now for M2M Re-named LTE Minicard Lineup


Compelfest – January 2014

Plug and play products


FX Series snap shot

Product FX EDGE

FXT009 Product FXTE02

Chipset Q2687RD Compatibility FXT009

Dimensions 89 x 60 x 30mm Dimensions 35.7 x 58mm

Air Interface GSM/GPRS/EDGE

850-900-1800-1900 Main Interface Ethernet

Peak Downlink Rate 237kbps

Peak Uplink Rate 118kbps

Programmable Open AT

Rx Diversity No

Voice Capabilities Yes

GPS No

Automotive grade No Automotive grade No

Temp Range

(Operating Class B) -30°C+75°C

Temp Range

(Operating Class B) 0°C+65°C

Commercial

Availability Now

Commercial

Availability Now


FX Series X-cards

FXTE02: Ethernet

• 10BASE-T IEEE 802.3 Compatible

• Integrated MAC address

• Receiver and collision squelch

• Supports Full and Half-Duplex modes

• OpenAT Internet Library

Several other 3rd party cards which can be

bought in

• CAN

• GPS

• RS-485

• M-BUS

• ZigBee

• 433, 868 and 915 MHz high speed

• 433, 868 and 915 MHz narrowband long

range

• Dual Serial/GPS

Interfaces

Dimensions

Certifications

Warranty

10-way Socket + RJ45 Dongle

PCB 58x37.5mm

R&TTE, GCF-CC, CE, FCC, PTCRB

1-Year


GL Series

• Programmable Industrial modem offers

quad-band GPRS connectivity

• Small form factor for easy integration

• Value Priced

Features:

Specifications: (All)

• Supports GSM and GPRS

• Powered over USB (USB version)

• Small and robust casing for usage

integrated designs

• AT commands interpreter

• Fully programmable C/C++ ARM9

processor (Open AT® OS)

• AirVantage Cloud Platform enabled

Options:

Firmware

Processor

Memory

LED

Interfaces

Antenna

GPS

Dimensions

Certifications

Ruggedness

Warranty

Open AT 2.x

ARM 946, 32-bit, 104Mhz processor

4MB Flash/2MB RAM

Network

RS232 (GL6100), USB (GL6110)

FME type RF connector

N/A

67mm x 51.5mm x 23.5mm

R&TTE, GCF-CC, CE, FCC/IC,

NCC (GL6110), PTCRB

Industrial (-30°C + 75°C)

1-Year

Technology

Module

Bands/Modes

Quad band GSM/GPRS

WMP100RD

850/900/1800/1900, GPRS Class 10

Highlights:


GL Series snap shot

Product GL6100 GL6100 GL6100SM4

Chipset WMP100RD

Dimensions 67 x 51.5 x 23.5mm

Air Interface GSM/GPRS

850-900-1800-1900

Peak Downlink Rate

Peak Uplink Rate

Programmable Open AT

Rx Diversity No No No

Voice Capabilities No No No

GPS No No No

Automotive grade No No No

Temp Range (Operating Class B) -30°C+75°C -30°C+75°C -30°C+75°C

Commercial Availability Now Now Now

Documents

Compelfest Jan 2014 - Компэл · Compelfest - Agenda •Technology ... to 4G form factor, including full GNSS (GPS & GLONASS) ... Pentaband HSDPA/HSUPA, up to LTE