DATA SHEET Maintenance/ (planed maintenance type, … · 2017. 5. 30. · ov10 ov9r ov11a dvdd3 dvdd4 r vrt ov7b ov7a ov9l osub avdd1 dc_det 2 ccdout avdd1 vrb dc_det 1 dc_det3 avss1

1Publication date: October 2008 SDB00165BEB

DATA SHEET

NN12081APart No.

Package Code No. MBGA111-P2-0808ACA

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NN12081A

2SDB00165BEB

ContentsOverview ………………………………………………….…………………………………………………………. 3

Features ………………………………………………….…………………………………………………………. 3

Applications ……….………………………………………………………………………………………………… 3

Package ……………………………………………………………………………………………………………. 3

Type …………………………………...……………………………………………………………………………. 3

Block Diagram ….………………………………………………………………………..………………………… 4

Pin Descriptions …………………..………………………………………………………………………………. 5

Absolute Maximum Ratings ……………………..……………..…………………………………………………. 9

Operating Supply Voltage Range …………..……………………………………………………………………. 9

Electrical Characteristics ………………….………………….………………….………………………………. 10

Electrical Characteristics (Reference values for design) ………………….………………….………………. 14

Technical Data …………………………………….………………….……………………………………………. 15

1. Serial data control of AFE function block ……………………………………………………………………. 15

2. Serial data control of timing generator block ……………………….………………………………………. 19

3. Recommended pulse timing and signal processing flow ……………………....……………………………. 29

4. Function tables of V-driver block ………...……………..….…………………………………………………. 30

5. I/O block circuit diagrams and Pin function descriptions ……….…………………………………………. 31

Usage Notes ……….…..…………………….………………….…………………………………………………. 37

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NN12081A

3SDB00165BEB

NN12081AAnalog front-end processing IC for digital cameras

OverviewNN12081A is a front-end processing IC which has the built-in CDS, GCA, ADC, TG and V-driver for digital cameras. This product has the built-in high programmability TG and 23-ch. V-driver circuit that generate the vertical and horizontal CCD-

driving pulses and support not only 3 : 1 and 4 : 1 interlace but also 6 : 1 interlace 9 pixels mixing driving for CCD's.

FeaturesAnalog front end (1) CDS maximum input range: 1.2 V (at total gain = –2 dB)

(2) Variable CDS gain: –2 dB, 0 dB, 3 dB, 6 dB(3) Variable GCA gain: 0 dB to 36 dB (linear characteristic at dB scale)

The gain is calculated based on A/D output with full scale = 1 V[p-p](the gain range is 6 dB to 42 dB based on A/D output with 2 V[p-p] full scale)

(4) 12-bit, 45 MHz ADC(5) Variable OB clamp level: 256 steps(6) Pixel settling: 99.9% (by 1 sampling)(7) PSRR: 50 dB

TG and H-driver (1) Complete programmable vertical clocks and horizontal clocks(2) 17 vertical clocks and 12 charge readout clocks(3) Precise phase control of high speed pulses(4) Electronic shutter function(5) Strobe and mechanical shutter function (6) Internal SSG function(7) H-driver (H1 to H4, HL) and RG-driver

V-driver (1) 23-ch. V-driver and 1-ch. SUB-driver

ApplicationsDigital still camerasApplicable image sensorsCCD sensors with horizontal clock up to 45 MHz and with vertical clock up to 23-ch.

Package111 pin fine pitch ball grid array package (BGA type)

TypeCMOS IC

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NN12081A

4SDB00165BEB

Block Diagram

Note) This block diagram is for explaining functions. The part of the block diagram may be omitted, or it may be simplified.

SERIAL

I/O

HDVD

DRVSSDRVDD

DVSS2

OV11BOV11L

OV10OV9R OV11A

DVDD3

DVDD4

R

VRT

OV7BOV9L OSUBOV7A

AVDD1

DC_DET 2

CCDOUT

AVDD1

VRB

DC_DET 1

DC_DET3

AVSS1

CCD timing generator

XI

AVSS1

CCD vertical driver

DVDD3

DVSS4

DVSS3DVSS3

OV11ROV12

VL

EXADCLK

EXDS2

EXDS1

VMSUB

D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11

RESET

DATA

DCLK

XO ClockGenerator

AVDD2

AVSS2

CS

DVSS2

DVSS2

DVDD1

DVDD2

DVDD2DVDD2

H1

H2

H3

STO

SUBSW1

SHUT

OV9BOV8OV9AOV7S

VL

CH

1to

CH

12

V1

to V

12, V

7S,

V9L

, V9R

, V

11L,

V11

R

SUB

, SU

BC

NT

CLR

DVSS2

J7

D4

K2

J2

K1

K8

L8

L7

K11

L11

K6

K7

L10

L6

L5

C1

E1

D1

D2

A2

B1

J5

K5

B7

L2E2B2

F9

C8

C2

J6

G3

J3

J1

H2

A9

D11

C11

B11

A7

B10A10

B8

D10C10

L9

H4

SSGSW

H4

HL

A11

A8

DVDD3E10

DVSS2F2

DVSS1F8

CLKO TEST1TEST2

TEST3

SUBSW2G2

DVDD2

DVSS2L1

H3

OV6OV2OV5B

OV1AOV1B

OV5AOV3BOV4OV3A

VHH H5VH J4VH D7

DS1

DS2

CPOB

PBLK

ADCLK

Analog front end

E8G10G

9J8K9E9G

11G8

K10J9D8

F11

J10

J11

D9

H9

H8

C9

H10

H11B

9

F10

E11 D5

C7

B6

C6

B5

C5

A6

A5

A4

B4

C4

A3

B3

C3

H1

G1

F1 L3 K4

L4 K3

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NN12081A

5SDB00165BEB

Pin Descriptions

Output

Input

Output

Output

Output

Output

Output

Output

Ground

Power supply

Output

Output

Output

Output

Output

Output

Power supply

Output

Output

Ground

Power supply

Output

Ground

Output

Power supply

Output

Ground

Output

Power supply

Power supply

Ground

Power supply

Input

Ground

Type

A/D outputD11C3

A/D outputD10B3

A/D outputD3C6

A/D outputD2B6

A/D outputD1C7

Digital driver power supply for signal processing blockDRVDDA6

A/D outputD5C5

A/D outputD4B5

A/D outputD7B4

A/D outputD6A4

Digital driver ground for signal processing blockDRVSSA5

A/D outputD8C4

A/D outputD9A3

Crystal oscillator input (FCK or 2FCK)XIA2

Crystal oscillator output (FCK or 2FCK) XOB1

A/D outputD0B7

Power supply for φHL driver and φR driverDVDD4A7

φHL pulse outputHLA8

φR pulse outputRA9

Ground for φHL driver and φR driverDVSS4B8

Power supply for φH1 to φH4 driverDVDD3A10

φH4 pulse outputH4A11

Ground for φH1 to φH4 driverDVSS3C10

φH3 pulse outputH3B11

Power supply for φH1 to φH4 driverDVDD3B10

φH2 pulse outputH2C11

Ground for φH1 to φH4 driverDVSS3D10

φH1 pulse outputH1D11

Power supply for φH1 to H4 driverDVDD3E10

Power supply for timing generator blockDVDD1F9

Ground for timing generator blockDVSS1F8

Analog power supply for signal processing blockAVDD1K11

CDS signal inputCCDOUTL11

Analog ground for signal processing blockAVSS1L10

DescriptionPin namePin No.

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NN12081A

6SDB00165BEB

Pin Descriptions (continued)

—

—

Ground

Power supply

—

—

—

Ground

Power supply

Input

Input

Input

Input

Power supply

Ground

Input / Output

Input / Output

Output

Output

Output

Output

Output

Ground

Power supply

Input / Output

Input / Output

Output

Input

Input

Input

Input

Ground

Power supply

Type

DC level stabilization 2DC_DET2L7

Analog ground for signal processing blockAVSS1K8

Test input 3 (normally set Low)TEST3K3

Master mode (internal VD/HD) or slave mode (external VD/HD) selectSSGSWL3

Power supply for IODVDD2L2

Power supply for signal processing blockAVDD2J5

Test input 1 (normally set Low)TEST1K4

Test input 2 (normally set Low)TEST2L4

Voltage reference (Bottom)VRBL6

Voltage reference (Top)VRTL5

Ground for signal processing blockAVSS2K5

DC level stabilization 3DC_DET3K6

Analog power supply for signal processing blockAVDD1K7

DC level stabilization 1DC_DET1L8

Ground for IO and VM of V-driverDVSS2L1

Data S/H pulse outputEXDS2J2

Pre-charge S/H pulse outputEXDS1K2

A/D converter clock output (or field index output)EXADCLKK1

Strobe trigger outputSTOJ3

SUB bias voltage control pulse output 1SUBSW1H2

Mechanical shutter control pulseSHUTJ1

SUB bias voltage control pulse output 2SUBSW2G2

Ground for IO and VM of V-driverDVSS2F2

Power supply for IODVDD2E2

Vertical sync pulse input / outputVDH1

Horizontal sync pulse input / outputHDG1

FCK clock outputCLKOF1

Data latch input for serial data communicationsCSE1

Clock input for serial data communicationsDCLKD1

Data input for serial data communicationsDATAD2

All clear inputCLRC1

Ground for IO and VM of V-driverDVSS2C2

Power supply for IODVDD2B2


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NN12081A

7SDB00165BEB


Ground for IO and VM of V-driverGroundDVSS2C8

Output

Output

Output

Output

Output

Output

Output

Output

Output

Output

Output

Output

Output

Output

Output

Output

Output

Output

Output

Output

Output

Output

Output

Output

Power supply

Ground

Power supply

Power supply

Power supply

Ground

Power supply

Type

(V-driver) φV2 transfer pulse outputOV2B9

(V-driver) φV9R transfer pulse outputOV9RG11

(V-driver) φV9L transfer pulse outputOV9LG8

(V-driver) φV11R transfer pulse outputOV11RG10

(V-driver) φV1A transfer pulse outputOV1AE11

(V-driver) φV1B transfer pulse outputOV1BF10

(V-driver) φV7S transfer pulse outputOV7SF11

(V-driver) φV8 transfer pulse outputOV8D8

(V-driver) φV10 transfer pulse outputOV10E9

(V-driver) φV12 transfer pulse outputOV12E8

(V-driver) φV6 transfer pulse outputOV6D9

(V-driver) φV4 transfer pulse outputOV4C9

(V-driver) φV11L transfer pulse outputOV11LG9

(V-driver) φV3A transfer pulse outputOV3AH11

(V-driver) φV3B transfer pulse outputOV3BH10

(V-driver) φV5A transfer pulse outputOV5AH8

(V-driver) φV5B transfer pulse outputOV5BH9

(V-driver) φV7A transfer pulse outputOV7AJ11

(V-driver) φV7B transfer pulse outputOV7BJ10

(V-driver) φV9A transfer pulse outputOV9AJ9

(V-driver) φV9B transfer pulse outputOV9BK10

(V-driver) φV11A transfer pulse outputOV11AK9

(V-driver) φV11B transfer pulse outputOV11BJ8

(V-driver) φSUB transfer pulse outputOSUBL9

(V-driver) Middle-level power supply for φSUB driverVMSUBJ7

Ground for IO and VM of V-driverDVSS2J6

(V-driver) High-level power supply for φSUB driverVHHH5

(V-driver) High-level power supplyVHJ4

(V-driver) Low-level power supplyVLH4

Ground for IO and VM of V-driverDVSS2G3

Power supply for IODVDD2H3


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NN12081A

8SDB00165BEB


(V-driver) High-level power supplyPower supplyVHD7

Output

—

—

—

—

—

—

—

—

Input

Power supply

Type

Middle level for SUB bias voltage control pulse outputMSUBSWG4

Pin connected to DVSS2 inside—F4

Pin connected to DVSS2 inside—F3

Pin connected to DVSS2 inside—E4

Pin connected to DVSS2 inside—E3

Pin connected to DVSS2 inside—D6

Pin connected to DVSS2 inside—D3

Pin connected to nothing insideN.C.H7

Pin connected to nothing insideN.C.H6

(V-driver) Reset inputRESETD4

(V-driver) Low-level power supplyVLD5


Note) 1. D3, D6, E3, E4, F3, F4 connect to DVSS2 inside.2. N.C. pins (H6, H7) do not connect to internal electric circuits. It is recommended to connect N.C. pins to the ground on PCB.

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NN12081A

9SDB00165BEB

Absolute Maximum Ratings

Operating Supply Voltage Range

V9.5 to 14.0VHSupply voltage 7

V9.5 to 16.0VHHSupply voltage 6

V1.65 to 3.6DRVDDSupply voltage 3

V2.7 to 3.6DVDD2Supply voltage 2

V1.65 to 1.95AVDD1,AVDD2, DVDD1

Supply voltage 1



V–7.0 to –4.5VLSupply voltage 8

VL + 2.0 to 5.0VMSUB

Range

VSupply voltage 9

NoteUnitSymbolParameter

*1V24VHH – VLSupply voltage 66

*1V3.9DVDD4Supply voltage 55


*1V3.9DRVDDSupply voltage 33


*1V22VH – VLSupply voltage 77

*1V2.0AVDD1, AVDD2,DVDD1

Supply voltage 11

*1V–7.5VLSupply voltage 88

*3°C– 50 to + 125TstgStorage temperature12

NoteUnitRatingSymbolParameterA No.

*3°C– 20 to + 75ToprOperating ambient temperature11

*2mW230.7PDPower dissipation10

*1V–5.5 to 6.0VMSUBSupply voltage 99

Note) *1: The range under absolute maximum ratings, power dissipation.*2: Power dissipation shows the value of only package at Ta = 75°C.

When using this IC, refer to the 6. Power dissipation (technical report) in the Usage Notes and use under the condition not exceeding the allowable value.

*3: Expect for the storage temperature and operating ambient temperature, all ratings are for Ta = 25°C.

Note) The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.

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NN12081A

10SDB00165BEB

—mA0.09—IVHHVHH dynamic current consumption —

*—No missing code—DNLA/D differential nonlinearity

—dB——32.5VIN = 15 mV[p-p]GGCA3Max. GCA gain14

—dB17.51614.5VIN = 50 mV[p-p]GGCA2Mid. GCA gain13

—dB0——VIN = 300 mV[p-p]GGCA1Min. GCA gain12

—LSB307255203VIN : No signalDOB2Max. output OB level11

—LSB520—VIN : No signalDOB1Min. output OB level10

—dB1.10–1.1VIN = 300 mV[p-p], 800 mV[p-p]GIDInput dynamic range9

Analog front end

—μA8——No load circuitIDDSTVHH , VH , VL static current consumption8

7

—mA0.36——SUB = Pulse (600 Hz, DVDD2, GND), CH1 to 12, V1 to 12, V7S, V9L, V9R, V11L, V11R = DVDD2, SUBCNT = GND, load circuit

IVL3VL dynamic current consumption6

—mA1.09——CH1 to 12 = Pulse (600 Hz, DVDD2 , GND), V1, V3, V5, V7, V9, V11 = GND, V2, V4, V6, V8, V10, V12, V7S, V9R, V9L, V11R, V11L, SUB = DVDD2 , SUBCNT = GND, load circuit


—mA0.24——IVHVH dynamic current consumption5

—dB1.80–3Ratio of 10 MHz XI to 45 MHz XIGCDSCDS sampling capability15

—mA11.9――

V1 to 12, V7S, V9R, V9L, V11R, V11L = Pulse (10 kHz, DVDD2, GND), CH1 to 12, SUB = DVDD2 , SUBCNT = GND, load circuit


—mA23——XI = 45 MHzIPOWDT

AVDD1, AVDD2, DVDD1 to DVDD4, DRVDD current consumption in power down mode

2

16

—V1.210.8VRT – VRBΔVRA/D reference voltage width17

Power dissipation

—mA126——XI = 45 MHzIVDDAVDD1, AVDD2, DVDD1 to DVDD4, DRVDD current consumption1

Limits

TypUnit

MaxNoteMin

ConditionsSymbolParameterB No.

Electrical Characteristics at AVDD1 = AVDD2 = DVDD1 = 1.8 V, DVDD2 = DVDD3 = DVDD4 = DRVDD = 3.0 V, VHH = 15.0 V, VH = 12.0 V, VL = –6.0 V, VMSUB = GNDNote) Ta = 25°C±2°C unless otherwise specified.

Note) *: The characteristic is reference value derived from the design of the IC and is not guaranteed by inspection.If a problem does occur related to this characteristic, we will respond in good faith to user concerns.

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NN12081A

11SDB00165BEB

Digital inputs and outputs

—VDVDD2—2.2

Digital pin: TEST1, TEST2, TEST3, SSGSW, VD, HD, CS, DCLK, DATA, CLR, EXDS1, EXDS2, XI, EXADCLK, RESET

VDIHHigh-level digital input voltage

—V0.5——IOL = +4 mADigital pin: EXDS1, EXDS2, EXADCLK, CLKO

V3OLLow-level output voltage 328

—V——DVDD2－0.5

IOH = –4 mADigital pin: EXDS1, EXDS2, EXADCLK, CLKO

V3OHHigh-level output voltage 327

—V0.5——

IOL = +2 mADigital pin: STO, SUBSW1, SUBSW2, MSUBSW, VD, HD

V2OLLow-level output voltage 226

—V——DVDD2－0.5

IOH = –2 mADigital pin: STO, SUBSW1, SUBSW2, MSUBSW, VD, HD

V2OHHigh-level output voltage 225

—V0.5——IOL = +2 mADigital pin: D0 to D11V1OLLow-level output voltage 124

—V——DRVDD－0.5

IOH = –2 mADigital pin: D0 to D11V1OHHigh-level output voltage 123

—kΩ110—10Digital pin: CLRRuPull-up resistance22

—kΩ110—10Digital pin: EXDS1, EXDS2, EXADCLKRd2Pull-down resistance 221

—kΩ110—10Digital pin: TEST1,TEST2, TEST3Rd1Pull-down resistance 120

—V0.8—VSS

Digital pin :TEST1, TEST2, TEST3, SSGSW, VD, HD, CS, DCLK, DATA, CLR, EXDS1, EXDS2, XI, EXADCLK, RESET

VDILLow-level digital input voltage19

18

Limits

TypUnit

MaxNoteMin


Electrical Characteristics at AVDD1 = AVDD2 = DVDD1 = 1.8 V, DVDD2 = DVDD3 = DVDD4 = DRVDD = 3.0 V, VHH = 15.0 V, VH = 12.0 V, VL = –6.0 V, VMSUB = GND (continued)Note) Ta = 25°C±2°C unless otherwise specified.

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NN12081A

12SDB00165BEB

—Ω1 280——IOM1 = –1.0 mARONM2OVMiddle-level output ON resistance46

—Ω35——IOM1 = –10 mARONM1Middle-level output ON resistance38

—VVL + 0.1—VLIOL1 = 1 mAVOL1Low-level output voltage37

—VGND—GND –0.1IOM1 = –1 mAVOM1Middle-level output voltage36

V-driver (2-level output pins) OV2, OV4, OV6, OV8, OV10, OV12

—μA±5——VO = Hi-ZVHOLOutput leakage current35

—V0.5——IOL = +48 mADigital pin: H1, H2, H3, H4V6OLLow-level output voltage 634

—V——DVDD3－0.5

IOH = –48 mADigital pin: H1, H2, H3, H4V6OHHigh-level output voltage 633

—V0.5——IOL = +24 mADigital pin: R, HLV5OLLow-level output voltage 532

—V——DVDD4－0.5

IOH = –24 mADigital pin: R, HLV5OHHigh-level output voltage 531

—V0.5——IOL = +8 mADigital pin: SHUTV4OLLow-level output voltage 430

Digital inputs and outputs (continued)

—V——DVDD2－0.5

IOH = –8 mADigital pin: SHUTV4OHHigh-level output voltage 4

—Ω1 280——IOL1 = 1.0 mARONL2OVLow-level output ON resistance47

—VVL + 0.1—VLIOL1 = 0.1 mAVOL2OVLow-level output voltage45

—VGND—GND –0.1IOM1 = –0.1 mAVOM2OVMiddle-level output voltage44

V-driver (2-level output pins) OV9L, OV9R, OV11L, OV11R

—Ω60——IOL1 = 10 mARONL1OVLow-level output ON resistance43

—Ω60——IOM1 = –10 mARONM1OVMiddle-level output ON resistance42

—VVL + 0.1—VLIOL1 = 1 mAVOL1OVLow-level output voltage41

—VGND—GND –0.1IOM1 = –1 mAVOM1OVMiddle-level output voltage40

V-driver (2-level output pins) OV7S

—Ω35——IOL1 = 10 mARONL1Low-level output ON resistance39

29

Limits

TypUnit

MaxNoteMin



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NN12081A

13SDB00165BEB

—Ω50——IOL3 = 10 mARONL3Low-level output ON resistance

—VVMSUB—VMSU

B – 0.1IOM3 = –1 mAVOM32Middle-level output voltage

—Ω35——IOM2 = –10 mARONM22Middle-level output ON resistance

—VVHH—VHH –0.1IOHH3 = –1 mAVOHH3High-level output voltage56

V-driver (SUB output pins) OSUB

—Ω35——IOL2 = 10 mARONL2Low-level output ON resistance55

54

—Ω35——IOM2 = 10 mARONM21Middle-level output ON resistance53

—Ω58——IOH2 = –10 mARONH2High-level output ON resistance52


—VGND—GND –0.1IOM2 = –1 mAVOM22Middle-level output voltage50

—VGND + 0.1—GNDIOM2 = 1 mAVOM21Middle-level output voltage49

—VVH—VH –0.1IOH2 = –1 mAVOH2High-level output voltage48

63

—Ω40——IOM3 = –10 mARONM32Middle-level output ON resistance62

—Ω40——IOM3 = 10 mARONM31Middle-level output ON resistance61

—Ω78——IOHH3 = –10 mARONHH3High-level output ON resistance60


58

—VVMSUB + 0.1—VMSU

BIOM3 = 1 mAVOM31Middle-level output voltage57

V-driver (3-level output pins) OV1A, OV1B, OV3A, OV3B, OV5A, OV5B, OV7A, OV7B, OV9A, OV9B, OV11A, OV11B

Limits

TypUnit

MaxNoteMin



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NN12081A

14SDB00165BEB

TTML4Fall transition time

TPML4Fall propagation delay time82*ns10050—No load circuit

Low-level – Middle-levelTPLM4Rise propagation delay time81

V-driver (SUB output pin) OSUB

*ns1 000——Load circuit(VL = –7.5 V, VH = 9.5 V)TTHM3Fall transition time80

TTHM3Fall transition time79*ns650300—Load circuit

Middle-level – High-levelTTMH3Rise transition time78

TPHHL4Fall propagation delay time

TPMH3Rise propagation delay time

TTLM2Rise transition time70



V-driver (2-level output pins) OV9L, OV9R, OV11L, OV11R

TTML1Fall transition time67*ns450170—Load circuit

Low-level – Middle-levelTTLM1Rise transition time66



TTML3Fall transition time77*ns450170—Load circuit

Low-level – Middle-levelTTLM3Rise transition time76

*ns10050—No load circuitMiddle-level – High-levelTPHM3Fall propagation delay time75

74



V-driver (3-level output pins) OV1A, OV1B, OV3A, OV3B, OV5A, OV5B, OV7A, OV7B, OV9A, OV9B, OV11A, OV11B

*ns450170—Load circuitLow-level – Middle-levelTTML2Fall transition time71

*ns800300—Load circuitLow-level – High-level

TTLHH4Rise transition time87

*

TTHHL4Fall transition time

86

88

*

ns800300—Load circuitLow-level – Middle-level

TTLM4Rise transition time

84

85

ns10050—No load circuitLow-level – High-level

TPLHH4Rise propagation delay time

V-driver (2-level output pins) OV2, OV4, OV6, OV8, OV10, OV12, OV7S

83

Limits

TypUnit

MaxNoteMin


Note) *: Stipulated at 10% to 90%.

Electrical Characteristics (Reference values for design) at AVDD1 = AVDD2 = DVDD1 = 1.8 V, DVDD2 = DVDD3 = DVDD4 = DRVDD = 3.0 V, VHH = 15.0 V, VH = 12.0 V, VL = –6.0 V, VMSUB = GNDNote) Ta = 25°C±2°C unless otherwise specified.

The characteristics listed below are reference values for design of the IC and are not guaranteed by inspection.If a problem does occur related to these characteristics, Panasonic will respond in good faith to user concerns.

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NN12081A

15SDB00165BEB

Technical Data1. Serial data control of AFE function block

1) AFE setting, ADRS: 000h to 00Eh

—

0000000h

—Reserved for test (Do not use.)—[7 : 0]

0031st HSEQ / CS0 (High)Timing core frequencyTCFRQ[9 : 8]

1st HSEQ / CS0 (High)Timing core currentTCCRT[11 : 10]

——Reserved for test (Do not use.)—[27 : 12]

1st HSEQ / CS0 (Valid)NCLP2 valid / invalid settingS_NENACP[25]

1st HSEQ / CS3 (16 pixels)Number of operated clamp pixels for high speed clampNCLP2[15 : 13]

1st HSEQ / CS4 (32 pixels)Number of operated clamp pixels for normal clampNCLP1[12 : 10]

1st HSEQ / CS0 (1VD)Number of averages of rear clamp(Valid at Mode 3, Mode 4)NCLPV[17 : 16]

—

1st HSEQ / CS

1st HSEQ / CS

1st HSEQ / CS

1st HSEQ / CS

1st HSEQ / CS

1st HSEQ / CS

1st HSEQ / CS

1st HSEQ / CS

1st HSEQ / CS

1st HSEQ / CS

1st HSEQ / CS

CS

1st HSEQ / CS

1st HSEQ / CS

1st HSEQ / CS

Latch timing

0000000h

00370AAh

00800E4h

0 (Normal)

0

0

0

3 (TBD MHz)

0 (Mode 1)

2 (16T)

5 (32HD)

2 (4HD)

0 (1 mA)

0 (Normal)

0 (Normal)

0 (Normal)

80h (128LSB)

039h (+2.011 dB)

0 (–2 dB)

Default

For test (Set to 0)

ADC control (The recommended setting value is informed later)

CDS control (The recommended setting value is informed later)

Impedance setting for black level

CDS bias current

Clamp mode setting

Operation time length of rear clamp

Number of averages at rear clamp

Number of averages at front clamp

A/D output drive capability

A/D output disable / enable

A/D output test mode

AFE power save mode

Output OB level

GCA gain

CDS gain

Description

—

ADCCTRL

CDSCTRL

RSW

CDSI

CLPMODE

CPLEN

NAVRR

NAVRF

OUTDRV

NOE

TESTMODE

POWERDOWN

OBLEVEL

GCAGAIN

GCDS

Code

Invalid

—

[27 : 25]

[24 : 22]

[21 : 20]

[19 : 18]

[9 : 8]

[7 : 6]

[5 : 3]

[2 : 0]

[27 : 26]

[24]

[23 : 22]

[22 : 20]

[19 : 12]

[11 : 2]

[1 : 0]

bit

004

005-00E

002

001

ADRS

Note) 1. The register (ADRS: 000h to 010h) is not be transferred continuously.2. The register indicated to be 1st HSEQ / CS can set the application timing in SLAT2 register.3. Do not write in data in test function register (ADRS: 003h, 004h).

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NN12081A

16SDB00165BEB

–2 dB (Default)00

0 dB10

1

1

bit 1

3 dB0

6 dB1

CDS gainbit 0

18.062 dB0000000001

36.053 dB0111111111

2.011 dB (Default)1001110000

1

0

0

0

bit 11

1

0

0

0

bit 10

1

0

0

0

bit 9

1

0

0

0

bit 8

1

0

0

0

bit 7

1

0

0

0

bit 6

1

0

0

0

bit 5

1

0

0

0

bit 4

0 dB00

0.035 dB10

1

1

bit 3

0.071 dB0

36.088 dB1

GCA gainbit 2

Ideal GCA gain (dB) = (20 log 64) × (N / 1 024)* Total gain = CDS gain (ADRS: 001h bit 0, bit 1 setting values) + GCA gain (ADRS: 001h bit 2 to bit 11 setting values)* The total gain is calculated based on A/D output with FS = 1 V[p-p].

GCDS (ADRS: 001h bit 1 to bit 0): CDS gain setting

GCAGAIN (ADRS: 001h bit 11 to bit 2): GCA gain setting

OBLEVEL (ADRS: 001h bit 19 to bit 12): Output OB level setting

Technical Data (continued)1. Serial data control of AFE function block (continued)

2) AFE registers

1

0

0

0

1

0

bit 12

1

1

0

1

0

0

bit 13

1

1

0

0

0

0

bit 14

1

1

0

0

0

0

bit 15

1

1

0

0

0

0

bit 16

1

1

0

0

0

0

bit 17

1

1

0

0

0

0

bit 18

1

1

1

0

0

0

bit 19

128 LSB (Default)

254 LSB

0 LSB

1 LSB

2 LSB

255 LSB

OB level

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NN12081A

17SDB00165BEB

POWERDOWN (ADRS: 001h bit 21 to bit 20): AFE power save mode setting

Normal00

10

1

1

bit 21

Stand-by0

Power down1

Modebit 20

Normal0

Hi-Z1

Modebit 24

Normal00

Test signal 1 (Code of OBLEVEL register)10

1

1

bit 23

Test signal 2 (D11 to D0 = AAAh)0

Test signal 3 (D11 to D0 = 555h)1

Modebit 22

NOE (ADRS: 001h bit 24): A/D output disable / enable setting

TESTMODE (ADRS: 001h bit 23 to bit 22): A/D output test mode


2) AFE registers (continued)

1 mA00

2 mA10

1

1

bit 27

3 mA0

4 mA1

Drive capabilitybit 26

OUTDRV (ADRS: 001h bit 27 to bit 26): A/D output drive capability

CDSI [3]

CDSI [2]

CDSI [1]

CDSI [0]

Mode

up to TBD MHz

up to TBD MHz

up to TBD MHz

up to TBD MHz

Reference value

00

10

1

1

bit 19

0

1

bit 18

CDSI (ADRS: 002h bit 19 to bit 18): Inside bias current setting for CDS

RSW (ADRS: 002h bit 21 to bit 20): Impedance setting for black levelNote) Please set this register to "0".

RSW [0]00

RSW [1]10

1

1

bit 21

RSW [2]0

RSW [3]1

Drive capabilitybit 20

S_NENACP (ADRS:001h bit25): NCLP2 Valid / Invalid setting

NCLP2 (ADRS: 002h bit15 to 13) Invalid

NCLP2 (ADRS: 002h bit15 to 13) Valid0

1

Modebit 25

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NN12081A

18SDB00165BEB

NCLAMP (ADRS: 002h bit 7 to bit 0): Clamp loop constant

Mode 4(Recommended at narrow CPOB width)

Mode 3(Recommended at narrow CPOB width)

Mode 2

Mode 1 (Default)

Mode

Front: 1HDRear: 1VD

Front: 1HDRear: 1VD

1HD

1HD

Operated cycle

PBLK

PBLK

After the CPOB

PBLK

Clamp timing

NCLP1 (bit 12 to bit 10) setting period11

CPOB width period00

NCLP1 (bit 12 to bit 10) setting period10

1

bit 9

32 pixels from the front edge of CPOB0

Number of operated pixelsbit 8

Note) Do not write in data in test function register (ADRS: 003h, 004h).

8T10

16T (Default)01

1

0

bit 7

4T0

32T1

Mode (CPLEN)Operation time

length of front clampbit 6

8HD110

4HD010

2HD100

1HD000

1

1

0

0

bit4

32HD (Default)

11

01

1

1

bit 5

16HD0

1

Mode (NAVRR)Number of averages

at rear clampbit 3

32 pixels (Default)Don't care

Don't care1

16 pixels110

1

0

0

bit 11

2 pixels00

4 pixels10

0

bit 12

8 pixels0

NCLP1 : Valid at Mode 2, Mode 4Number of operated pixelsbit 10

CLPMODE (ADRS: 002h bit 9 to bit 8): Clamp mode setting

NCLP1 (ADRS: 002h bit 12 to bit 10): Number of operated pixels for normal clamp


2) AFE registers (continued)

8HD110

4HD (Default)010

2HD100

1HD000

1

1

0

0

bit1

32HD

11

01

1

1

bit 2

16HD0

1

Mode (NAVRF)Number of averages

at front clampbit 0

8VD11

1

0

0

bit 17

1VD (Default)0

2VD1

4VD0

NCLPV: Valid at Mode 3, Mode 4Number of averagesbit 16

NCLPV (ADRS: 002h, bit 17, bit 16):Number of averages of rear clamp

32 pixelsDon't careDon't care1

16 pixels (Default)110

1

0

0

bit 14

2 pixels00

4 pixels10

0

bit 15

8 pixels0

Number of operated pixelsbit 13

It sets up the operation period of high-speed pull-in CPOB clampset in ADRS 024h. Set the value lower than the high-speed pull-in CPOB width (ACPWD: ADRS 024h, bit 23). Setting S_NENACP(ADRS: 001h, bit 25) = "1" makes this function invalid and makes NCLP1 (ADRS: 002h, bit 12 to bi10) valid in the operation mode of high-speed pull-in CPOB clamp as well as the normal CPOB clamp.

NCLP2 (ADRS: 002h, bit 15 to bit 13):Number of operated pixels for high speed clampMain

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ce/

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NN12081A

19SDB00165BEB

CS2-bitRatio of dividing frequency between master clock and internal operating clockFCKSEL[19 : 18]

CS1-bitSSG synchronous clock switchSYNCSEL[26]

CSVDWD + 1 to 4 095Default VD period setting of inside SSG(Default 16HD)VDINIT[11 : 0]

—00FCSHDWD × 64 + 1

to 16 383Default HD period setting of inside SSG(Default 256T)HDINIT[25 : 12]

1st HSEQ6-bit × 4Mode register 1MODE1[23 : 0]—011

1st HSEQ6-bit × 4Mode register 2MODE2[23 : 0]—012

CS1-bitHD/VD output phase 180° to CLKOHVPHASE[13]

1st HSEQ / CS12-bitCH pulse inhibitCHDEL[27 : 16]

CS1-bitTiming core resetTCRST[23]

CS1-bitSerial data transfer methodSLAT1[20]

CS1-bitFCK resetFCKRST[22]

1st HSEQ / CS6-bitInternal SSG mode VD width (1H steps)VDWD[5 : 0]

—013

1st HSEQ / CS6-bitInternal SSG mode HD width (64T steps)HDWD[11 : 6]

CS1-bitHD/VD polarityHVPOL[12]

CS1-bitSSG resetSSGRST[25]

1-bit

1-bit

1-bit

2-bit

3-bit

Range

CSSerial data application timingSLAT2[21]

CSSoftware resetSOFTRST[24]

CSTG output enableENTGOUT[27]

CSPower savePWSV[2 : 0]

—010

CSMonitor pin controlEXOUT[4 : 3]

Latch timingDescriptionCodebit(SRAM)ADRS

Note) 1. The register (ADRS: 000h to 010h) is not be transferred continuously.2. The register indicated to be 1st HSEQ / CS can set the application timing in SLAT2 register.

ADRS: 00Fh to 013h

Technical Data (continued)2. Serial data control of timing generator block

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NN12081A

20SDB00165BEB

CS1-bitReverse transfer delay 0.5T stepsHLBLK[23]

CS4-bitReverse transfer delay 0.5T stepsREVDLY[27 : 24]

CS4-bitH1 drive capabilityH1DRV[3 : 0]

—014




CS3-bitHL drive capabilityHLDRV[18 : 16]

CS3-bitR drive capabilityRDRV[22 : 20]

CS6-bitH1 ↑ phaseH1RISE[5 : 0]

—015CS6-bitH1 ↓ phaseH1FALL[11 : 6]


CS6-bitH2 ↓ phaseH2FALL[23 : 18]


—016CS6-bitH3 ↓ phaseH3FALL[11 : 6]


CS6-bitH4 ↓ phaseH4FALL[23 : 18]

CS6-bitHL ↑ phaseHLRISE[5 : 0]

—017CS6-bitHL ↓ phaseHLFALL[11 : 6]

CS6-bitR ↑ phaseRRISE[17 : 12]

CS6-bitR ↓ phaseRFALL[23 : 18]

CS6-bitDS1 ↑ phaseDS1RISE[5 : 0]

—018CS6-bitDS1 ↓ phaseDS1FALL[11 : 6]

CS6-bitDS2 ↑ phaseDS2RISE[17 : 12]

CS6-bitDS2 ↓ phaseDS2FALL[23 : 18]

CS6-bitADCLK ↑ phaseADCRISE[5 : 0]

—019CS6-bitADCLK ↓ phaseADCFALL[11 : 6]

Range Latch timingDescriptionCodebit(SRAM)ADRS

ADRS: 014h to 019h

Technical Data (continued)2. Serial data control of timing generator block (continued)

Mainten

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NN12081A

21SDB00165BEB

1st HSEQ / CS1 to 4 0951st MSUBSW toggle lineMSUBSW_LN1[11 : 0]—02B1st HSEQ / CS8 to 16 3831st MSUBSW toggle positionMSUBSW_TOG1[25 : 12]—1st HSEQ / CS1 to 4 0952nd MSUBSW toggle lineMSUBSW_LN2[11 : 0]—02C1st HSEQ / CS8 to 16 3832nd MSUBSW toggle positionMSUBSW_TOG2[25 : 12]—1st HSEQ / CS1-bitSUBCNT toggle linked CH enableSUBCNTSPEN[0]—02D1st HSEQ / CS0 to 63SUBCNT fall timing linked CHSUBCNTSPT1[6 : 1]—1st HSEQ / CS0 to 63SUBCNT rise timing linked CHSUBCNTSPT2[12 : 7]—

1st HSEQ / CS1 to 4 0952nd SUBSW2 toggle lineSUBSW2_LN2[11 : 0]—02A1st HSEQ / CS8 to 16 3832nd SUBSW2 toggle positionSUBSW2_TOG2[25 : 12]—

1st HSEQ / CS8 to 16 3831st SUBSW2 toggle positionSUBSW2_TOG1[25 : 12]—

——Don’t care—[25 : 24]—

—1 to 127High-speed pull-in CPOB stepsNACPOUT[22 : 16]——1-bitHigh-speed pull-in CPOB widthACPWD[23]—

1st HSEQ / CS1-bitMSUBSW polarityMSUBPOL[18]—

Invalid (These register are skipped at SLAT1 = 0.)02E to 040——Don’t care—[27 : 26]—

1st HSEQ / CS1 to 4 0951st SUBSW2 toggle lineSUBSW2_LN1[11 : 0]—029

1st HSEQ / CS1-bitSHUT polaritySHUTPOL[16]—1st HSEQ / CS16-bitTrigger enableTRGEN[15 : 0]—01A

1st HSEQ / CS1 to 4 0954th SUBSW1 toggle lineSUBSW1_LN4[11 : 0]—0281st HSEQ / CS8 to 16 3834th SUBSW1 toggle positionSUBSW1_TOG4[25 : 12]—

1st HSEQ / CS1 to 4 0951st SHUT toggle lineSHUTLN1[11 : 0]—0201st HSEQ / CS8 to 16 3831st SHUT toggle positionSHUTTOG1[25 : 12]—1st HSEQ / CS1 to 4 0952nd SHUT toggle lineSHUTLN2[11 : 0]—0211st HSEQ / CS8 to 16 3832nd SHUT toggle positionSHUTTOG2[25 : 12]—

8 to 16 3831 to 4 0958 to 16 3831 to 4 0958 to 16 3831 to 4 095

1 to 151 to 4 0958 to 16 3831 to 4 0958 to 16 3831 to 4 095

8 to 16 3831 to 4 0958 to 16 3831 to 4 0951 to 16 3838 to 16 3831 to 16 3838 to 16 3831 to 4 0951 to 4 095

1-bit

Range

1st HSEQ / CS1st HSEQ / CS1st HSEQ / CS1st HSEQ / CS1st HSEQ / CS1st HSEQ / CS

1st HSEQ / CS1st HSEQ / CS1st HSEQ / CS1st HSEQ / CS1st HSEQ / CS1st HSEQ / CS

1st HSEQ / CS1st HSEQ / CS1st HSEQ / CS1st HSEQ / CS1st HSEQ / CS1st HSEQ / CS1st HSEQ / CS1st HSEQ / CS1st HSEQ / CS1st HSEQ / CS

1st HSEQ / CS

Latch timing

SUB toggle position 2 (Last line)SUBTOG2[13 : 0]—01DSUB width 2 (Last line)SUBWD2[27 : 14]—

2nd SUBSW1 toggle lineSUBSW1_LN2[11 : 0]—0262nd SUBSW1 toggle positionSUBSW1_TOG2[25 : 12]—3rd SUBSW1 toggle lineSUBSW1_LN3[11 : 0]—0273rd SUBSW1 toggle positionSUBSW1_TOG3[25 : 12]—

High-speed pull-in CPOB output lineACPLN[11 : 0]—024Number of lines of high-speed pull-in CPOB outputNACPLN[15 : 12]—

1st SUBSW1 toggle lineSUBSW1_LN1[11 : 0]—0251st SUBSW1 toggle positionSUBSW1_TOG1[25 : 12]—

1st STO toggle lineSTOLN1[11 : 0]—0221st STO toggle positionSTOTOG1[25 : 12]—2nd STO toggle lineSTOLN2[11 : 0]—0232nd STO toggle positionSTOTOG2[25 : 12]—

1st SUBCNT toggle lineSUBCNTLN1[11 : 0]—01E1st SUBCNT toggle positionSUBCNTTOG1[25 : 12]—2nd SUBCNT toggle lineSUBCNTLN2[11 : 0]—01F2nd SUBCNT toggle positionSUBCNTTOG2[25 : 12]—

SUB toggle position 1SUBTOG1[13 : 0]—01CSUB width 1SUBWD1[27 : 14]—

STO polaritySTOPOL[17]—

SUB output start lineSUBON[11 : 0]—01BNumber of SUB output linesNSUBOUT[23 : 12]—

DescriptionCodebit(SRAM)ADRS

ADRS: 01Ah to 040h


Mainten

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NN12081A

22SDB00165BEB

ADRS: 041h to 100h


CS2-bitPAT#1 pattern type (00 : VPAT, 01: HPAT, 1X: CHPAT)VHTYP1[10 : 9]—

Invalid (These register are skipped at SLAT1 = 0.)080 to 10F

——————07F

CS0 to 255Number of PAT#1 stepsNSTEP1[7 : 0][ADRS1]041

CS1-bitPAT#1 pattern type (Step width: 0 = fixed, 1 = variable)PTYP1[8]—

↓

8-bit

Range

CSPAT#1 ADRS[ADRS1]——

Latch timingDescriptionCodebit(SRAM)ADRS

17-bitVPAT#2 output pulse polarity (n + 1)VPOL (n + 1)[16 : 0][+n]

0 to 1 023VPAT#2 STEP width (n + 1)VSTEP (n + 1)[27 : 18]

6-bitVPAT#1 output pulse polarity ((n + 1) × 3 / 2)VPOL ( (n + 1) × 3/2)[5 : 0][+ (n + 1) (even) ]

11-bitVPAT#1 output pulse polarity ((n + 1) × 3 / 2)VPOL ( (n + 1) × 3/2)[27 : 17]

17-bitVPAT#1 output pulse polarity ((n + 1) × 3 / 2 + 1)VPOL ( (n + 1) × 3/2 + 1 )[22 : 6]

↓

17-bitVPAT#2 output pulse polarity 1VPOL(1)[16 : 0][ADRS2]

0 to 1 023VPAT#2 STEP width 1VSTEP(1)[27 : 18]

17-bitVPAT#2 output pulse polarity 2VPOL(2)[16 : 0][+1]




17-bitVPAT#1 output pulse polarity 1VPOL(1)[16 : 0][ADRS1]

0 to 1 023VPAT#1 STEP widthVSTEP[27 : 18]


11-bitVPAT#1 output pulse polarity 3 (11-bit)VPOL(3)[27 : 17]

6-bitVPAT#1 output pulse polarity 3 (6-bit)VPOL(3)[5 : 0][+2]

17-bitVPAT#1 output pulse polarity 4VPOL(4)[22 : 6]

↓

17-bitVPAT#1 output pulse polarity ((n + 1) × 3 / 2 – 1)VPOL ( (n + 1) × 3/2 – 1)[16 : 0][+ n (odd) ]

RangeDescriptionCodebit(Pattern RAM)

VPAT / HPAT / CHPAT register

V-Pattern setting

Step width fixed patternPTYP = 0

Step width variable patternPTYP = 1

Note) Overwrite at the time of rewriting.

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NN12081A

23SDB00165BEB


1 to 15Number of HPAT#2 toggles (n + 1)NHTOG (n + 1)[21 : 18]

1 to 15HPAT#2 toggle width (n + 1)HSTEP (n + 1)[17 : 14]

1-bitHPAT#2 reverse transfer ON/OFF (n + 1)ENREV (n + 1)[27]

HON (n) + 3 to 16 383HPAT#2 toggle position (n + 1)HON (n + 1)[13 : 0][+n]

HON (2n) + 3 to 16 383HPAT#1 toggle position (n × 2 + 1)HON (2n + 1)[27 : 14]

↓

HON (2n – 1) + 3 to 16 383HPAT#1 toggle position (n × 2)HON (2n)[13 : 0][+n]

PBLKON + 9 to 16 383HPAT#1 toggle position 1HON(1)[13 : 0][ADRS1]

1 to 15HPAT#1 toggle width 1HSTEP[17 : 14]

1 to 15Number of HPAT#1 toggles 1NHTOG[21 : 18]

1bitHPAT#1 Reverse transfer mode ON/OFF 1ENREV[27]

HON1 + 3 to 16 383HPAT#1 toggle position 2HON(2)[13 : 0][+1]

HON2 + 3 to 16 383HPAT#1 toggle position 3HON(3)[27 : 14]


HON4 + 3 to 16 383HPAT#1 toggle position 5HON(5)[27 : 14]

↓


1 to 15HPAT#2 toggle width 2HSTEP(2)[17 : 14]

1 to 15Number of HPAT#2 toggles 2NHTOG(2)[21 : 18]

1-bitHPAT#2 reverse transfer ON/OFF 2ENREV(2)[27]

1 to 15HPAT#2 toggle width 1HSTEP(1)[17 : 14]

1-bit

1 to 15

PBLKON + 9 to 16 383

Range

HPAT#2 reverse transfer ON/OFF 1ENREV(1)[27]

HPAT#2 toggle position 1HON(1)[13 : 0][ADRS2]

Number of HPAT#2 toggles 1NHTOG(1)[21 : 18]

DescriptionCodebit(Pattern RAM)

H-pattern setting

Step width fixed patternPTYP = 0

Step width variable patternPTYP = 1

Note) 1. Overwrite at the time of rewriting.2. The data can be distinguished any of HPAT, VPAT or CHPAT in VHPAT setting when it is written in the registers. However, it is necessary to

set up the pattern ID correctly in HSEQ register because this VHPAT setting is not recognized while operating.

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NN12081A

24SDB00165BEB

CHPAT registerThe data in these registers is applied by MODE register (ADRS 011h, 012h) setting or VD. When the data can be changed, the MODE register should be set before 1HD in 1st HSEQ. Then the data is applied from this 1st HSEQ. When the data can be changed but the MODE register cannot be set, the data will be applied in the next VD.


12-bitCHPAT#1 output pulse polarity (n + 1)CHPOL (n + 1)[11 : 0][+n]

0 to 1 023CHPAT#1 STEP width (n + 1)CHSTEP (n + 1)[27 : 18]

↓

12-bitCHPAT#1 output pulse polarity 1CHPOL(1)[11 : 0][ADRS1]

0 to 1 023CHPAT#1 STEP width 1CHSTEP(1)[27 : 18]

12-bitCHPAT#1 output pulse polarity 2CHPOL(2)[11 : 0][+1]


12-bitCHPAT#1 output pulse polarity 3CHPOL(3)[11 : 0][+2]


RangeDescriptionCodebit(Pattern RAM)

Step width variable patternPTYP = X(Regardless of the PTYP setting)

Note) Overwrite at the time of rewriting.

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NN12081A

25SDB00165BEB

The data in these registers is latched at 4T after 28-bit in the data block is transferred, and the data is applied from the HSEQ after 2HD.

HSEQ register


Note) *: When the serial data is transfer, it is latched at CS ↑ and the data is applied from next HSEQ.

—6-bitHSEQ#1 5th VPAT IDVIDE1[23:18]

HSEQ *HSEQ#1 1st to 9th VPAT setting(See the next page.)[27 : 0]

015 to

01D

115 to

11D

—4-bit——[27 : 24]

—4-bit——[27 : 24]

—0 to 255HSEQ#1 CPOB widthCPOBWD1[21 : 14]

—4-bitNumber of HSEQ#1 HPAT repeatsHRPTA1[16 : 13]

—0 to 255HSEQ#1 HD multi-cycle settingNMULT1[21 : 14]

—6-bitHSEQ#1 HPAT IDHIDA1[27 : 22]

HSEQ *0 to 8 191HSEQ#1 PBLK ON positionPBLKON1[12 : 0]01E11E

—0 to 16 383HSEQ#1 PBLK OFF positionPBLKOFF1[27 : 14]

HSEQ *0 to 8 191HSEQ#1 CPOB ON positionCPOBON1[12 : 0]01F11F

—6-bitHSEQ#1 7th VPAT IDVIDG1[11 : 6]

—6-bitHSEQ#1 9th VPAT IDVIDI1[23 : 18]

—6-bitHSEQ#1 4th VPAT IDVIDD1[17:12]

—6-bitHSEQ#1 3rd VPAT IDVIDC1[11:6]

—13-bit (0 to 8 191)HSEQ#1 H-transfer period (HD)HWD1[12 : 0]012112

HSEQ *14-bitHSEQ#1 HPAT repeat cycleHPLENA1[13 : 0]011111

—14-bit (0 to 16 383)HSEQ#1 H-transfer ON position (T)HON1[27 : 14]

—6-bitHSEQ#1 1st VPAT IDVIDA1[22 : 17]

—5-bit——[27 : 23]

6-bit

6-bit

6-bit

0 to 16 383

Range

—

HSEQ *

HSEQ *

HSEQ *

Latch timing

HSEQ#1 HD periodHLEN1[13 : 0]010110

HSEQ#1 2nd VPAT IDVIDB1[5 : 0]013113

HSEQ#1 6th VPAT IDVIDF1[5 : 0]014114

HSEQ#1 8th VPAT IDVIDH1[17 : 12]

DescriptionCodebitSRAMADRS(hex)

UserADRS(hex)

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NN12081A

26SDB00165BEB

The data in these registers is latched at 4T after 28-bit in the data block is transferred, and the data is applied from the HSEQ after 2HD.

HSEQ register (continued)


Note) *: When the serial data is transfer, it is latched at CS ↑ and the data is applied from next HSEQ.

—0 to 4 095Number of HSEQ#1 8th VPAT repeatsVRPTH1[27 : 16]

—0 to 3HSEQ#1 8th VPAT start lineVPSTLNH1[15 : 14]

HSEQ *0 to 16 383HSEQ#1 8th VPAT positionVPOSH1[13 : 0]01C11C

HSEQ *0 to 16 383HSEQ#1 9th VPAT positionVPOSI1[13 : 0]01D11D

—0 to 4 095Number of HSEQ#1 7th VPAT repeatsVRPTG1[27 : 16]

—0 to 3HSEQ#1 7th VPAT start lineVPSTLNG1[15 : 14]

HSEQ *0 to 16 383HSEQ#1 7th VPAT positionVPOSG1[13 : 0]01B11B

—0 to 3HSEQ#1 9th VPAT start lineVPSTLNI1[15 : 14]

—0 to 3HSEQ#1 6th VPAT start lineVPSTLNF1[15 : 14]

HSEQ *0 to 16 383HSEQ#1 6th VPAT positionVPOSF1[13 : 0]01A11A

—0 to 4 095Number of HSEQ#1 9th VPAT repeatsVRPTI1[27 : 16]

—0 to 4 095Number of HSEQ#1 6th VPAT repeatsVRPTF1[27 : 16]

—0 to 4 095Number of HSEQ#1 1st VPAT repeatsVRPTA1[27 : 16]

—0 to 3HSEQ#1 1st VPAT start lineVPSTLNA1[15 : 14]

HSEQ *0 to 16 383HSEQ#1 2nd VPAT positionVPOSB1[13 : 0]016116

HSEQ *0 to 16 383HSEQ#1 1st VPAT positionVPOSA1[13 : 0]015115

—0 to 4 095Number of HSEQ#1 5th VPAT repeatsVRPTE1[27 : 16]

0 to 3

0 to 16 383

0 to 4 095

0 to 3

0 to 16 383

0 to 4 095

0 to 3

0 to 16 383

0 to 4 095

0 to 3

Range

—

HSEQ *

—

—

HSEQ *

—

—

HSEQ *

—

—

Latch timing

HSEQ#1 5th VPAT positionVPOSE1[13 : 0]019119

HSEQ#1 5th VPAT start lineVPSTLNE1[15 : 14]

HSEQ#1 4th VPAT start lineVPSTLND1[15 : 14]

Number of HSEQ#1 4th VPAT repeatsVRPTD1[27 : 16]

HSEQ#1 3rd VPAT positionVPOSC1[13 : 0]017117

HSEQ#1 3rd VPAT start lineVPSTLNC1[15 : 14]

HSEQ#1 2nd VPAT start lineVPSTLNB1[15 : 14]

Number of HSEQ#1 2nd VPAT repeatsVRPTB1[27 : 16]

Number of HSEQ#1 3rd VPAT repeatsVRPTC1[27 : 16]

HSEQ#1 4th VPAT positionVPOSD1[13 : 0]018118

DescriptionCodebitSRAMADRS(hex)

UserADRS(hex)

• ADRS: 115h to 11Dh: 1st to 9th VPAT setting

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NN12081A

27SDB00165BEB


—0 to 16 383VSEQ#2 2nd CHPAT start timing (T)CHPOSB2[27 : 14]

VSEQ *0 to 16 383VSEQ#2 1st CHPAT start timing (T)CHPOSA2[13 : 0]022122

—0 to 4 095VSEQ#2 2nd CPOB output periodVCPLNB2[23 : 12]

VSEQ *0 to 4 095VSEQ#2 2nd CPOB output start lineVCPONB2[11 : 0]02F12F

—4-bit——[27 : 24]

—0 to 4 095VSEQ#2 1st CPOB output periodVCPLN2[23 : 12]

VSEQ *0 to 2 047VSEQ#2 1st CPOB output start lineVCPON2[10 : 0]02E12E

—4-bit——[27 : 24]

—0 to 4 095VSEQ#2 2nd VBLK OFF periodVBLKLNB2[23 : 12]

VSEQ *0 to 4 095VSEQ#2 2nd VBLK OFF position (Valid start line)VBLKOFFB2[11 : 0]02D12D

—4-bit——[27 : 24]

—4-bit——[27 : 24]

—5-bit——[27 : 23]

VSEQ *0 to 2 047VSEQ#2 1st VBLK OFF position (Valid start line)VBLKOFF2[10 : 0]02C12C

—0 to 4 095VSEQ#2 1st VBLK OFF periodVBLKLN2[23 : 12]

—4-bit——[27 : 24]

25-bit

0 to 4 095

6-bit

6-bit

0 to 2 047

0 to 4 095

Range

VSEQ *VSEQ#2 1st to 9th HSEQ setting(See the next page.)

[24 : 0]023 to02B

123 to12B

VSEQ *VSEQ#2 1st CHPAT IDCHIDA2[5 : 0]021121

—VSEQ#2 2nd CHPAT IDCHIDB2[11 : 6]

—VSEQ#2 1st CHPAT start line (HSTART basis)CHSTLN2[23 : 12]

VSEQ *VSEQ#2 VD periodVLEN2[11 : 0]020120

—VSEQ#2 1st HSEQ start positionHSTART2[22 : 12]

Latch timingDescriptionCodebitSRAM ADRS

User ADRS

Ex.) When ADRS: 120h to 12Fh (ID = 2) is assigned to VSEQVSEQ register

Note) *: When the serial data is transferred, the data in these registers is latched in pattern memory at 3T after 28-bit in the data block is transferred. And it is applied from VSEQ which is changed before or after HSTART-1HD.

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NN12081A

28SDB00165BEB

VSEQ *6-bitVSEQ#2 9th HSEQ ID (ODD)HSIDOI2[5 : 0]02B12B

—6-bitVSEQ#2 9th HSEQ ID (EVEN)HSIDEI2[11 : 6]—0 to 4 095Number of VSEQ#2 9th HSEQ linesHSLNI2[23 : 12]—1-bitVSEQ#2 9th HSEQ blanking settingHSBLKI2[24]—3-bit——[27 : 25]

—3-bit——[27 : 25]—1-bitVSEQ#2 7th HSEQ blanking settingHSBLKG2[24]—0 to 4 095Number of VSEQ#2 7th HSEQ linesHSLNG2[23 : 12]—6-bitVSEQ#2 7th HSEQ ID (EVEN)HSIDEG2[11 : 6]

VSEQ *6-bitVSEQ#2 7th HSEQ ID (ODD)HSIDOG2[5 : 0]029129

—3-bit——[27 : 25]

—3-bit——[27 : 25]

—3-bit——[27 : 25]

—3-bit——[27 : 25]

—3-bit——[27 : 25]

—1-bitVSEQ#2 6th HSEQ blanking settingHSBLKF2[24]

—1-bitVSEQ#2 5th HSEQ blanking settingHSBLKE2[24]

—1-bitVSEQ#2 4th HSEQ blanking settingHSBLKD2[24]

—1-bitVSEQ#2 3rd HSEQ blanking settingHSBLKC2[24]

—1-bitVSEQ#2 2nd HSEQ blanking settingHSBLKB2[24]

—1-bitVSEQ#2 1st HSEQ blanking settingHSBLKA2[24]

—6-bitVSEQ#2 6th HSEQ ID (EVEN)HSIDEF2[11 : 6]VSEQ *6-bitVSEQ#2 6th HSEQ ID (ODD)HSIDOF2[5 : 0]028128

—0 to 4 095Number of VSEQ#2 6th HSEQ linesHSLNF2[23 : 12]

3-bit1-bit0 to 4 0956-bit6-bit

3-bit

0 to 4 0956-bit6-bit





Range

—Number of VSEQ#2 8th HSEQ linesHSLNH2[23 : 12]—VSEQ#2 8th HSEQ blanking settingHSBLKH2[24]———[27 : 25]

VSEQ *VSEQ#2 5th HSEQ ID (ODD)HSIDOE2[5 : 0]027127—VSEQ#2 5th HSEQ ID (EVEN)HSIDEE2[11 : 6]—Number of VSEQ#2 5th HSEQ linesHSLNE2[23 : 12]

VSEQ *VSEQ#2 4th HSEQ ID (ODD)HSIDOD2[5 : 0]026126—VSEQ#2 4th HSEQ ID (EVEN)HSIDED2[11 : 6]—Number of VSEQ#2 4th HSEQ linesHSLND2[23 : 12]

VSEQ *VSEQ#2 3rd HSEQ ID (ODD)HSIDOC2[5 : 0]025125—VSEQ#2 3rd HSEQ ID (EVEN)HSIDEC2[11 : 6]—Number of VSEQ#2 3rd HSEQ linesHSLNC2[23 : 12]

VSEQ *VSEQ#2 2nd HSEQ ID (ODD)HSIDOB2[5 : 0]024124—VSEQ#2 2nd HSEQ ID (EVEN)HSIDEB2[11 : 6]—Number of VSEQ#2 2nd HSEQ linesHSLNB2[23 : 12]

VSEQ *VSEQ#2 1st HSEQ ID (ODD)HSIDOA2[5 : 0]023123—VSEQ#2 1st HSEQ ID (EVEN)HSIDEA2[11 : 6]—Number of VSEQ#2 1st HSEQ linesHSLNA2[23 : 12]

———[27 : 25]

VSEQ *VSEQ#2 8th HSEQ ID (ODD)HSIDOH2[5 : 0]02A12A—VSEQ#2 8th HSEQ ID (EVEN)HSIDEH2[11 : 6]

Latch timingDescriptionCodebitSRAM ADRSUser ADRS


• ADRS: 123h to 12Bh: 1st to 9th HSEQ settingVSEQ register (continued)

Note) *: When the serial data is transferred, the data in these registers is latched in pattern memory at 3T after 28-bit in the data block is transferred. And it is applied from VSEQ which is changed before or after HSTART-1HD.

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NN12081A

29SDB00165BEB

tOD

Note) The above values are reference values for designing and not guaranteed.

——1.2—tAD_s1ns—7.3—tOD

ns——6tDS2_w2

ns——6tDS1_w124.6

Min

ns——tcp

UnitMaxTypSymbol

CCDOUT

DS1

DS2

D11 to D0

ADCLK

D11 to D0

ADCLK(at ADCRISE = 0)

CLKO

tAD

The timing at default state istAD: CLKO ↑ to ADCLK ↑ = 22 × T/48 (T = 1/fck)

The data output timing can be set by the built-in clock generator in (1/48)T steps.

Technical Data (continued)3. Recommended pulse timing and signal processing flow

tODtAD_s1

N N + 1 N + 2 N + 3 N + 9 N + 10 N + 11

tcp

tDS1_w1

tDS2_w2

1 2 93 1110

N – 1 N N + 1N – 10 N – 9 N – 8

8

N – 2N – 11 N – 7

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NN12081A

30SDB00165BEB

1) OverviewV-driver is controlled by RESET pin and the internal input pulses of the built-in timing generator.

2) Function table

Technical Data (continued)4. Function tables of V-driver block

(3) SUB driver block(1) Input block

VLVMLow

xxHigh

OSUBOVxxRESET

High

VHHLow

Low

VMSUBHighLow

VLHigh

OSUBSUBCNTSUB

(2) Vertical driver block

<2-level transfer pulse signals> <3-level transfer pulse signals>

OV6V6

OV12V12

OV10V10

OV8V8

OV4V4

GNDLow

VLHigh

V2 OV2

GNDLow

VLHighHigh

OV11BCH12CH12

OV11AV11

CH11CH11

Low

High

V9

V7

V5

V3

V1

OV9ACH9CH9

OV7BCH8CH8

OV7ACH7CH7

OV5ACH5CH5

OV3BCH4CH4

OV3ACH3CH3

OV1BCH2CH2

OV9BCH10CH10

OV5BCH6CH6

CH1

Low

CH1

VH

VL

OV1A

OV9RV9R

OV11RV11R

OV11LV11L

OV9LV9L

GNDLow

VLHigh

V7S OV7SMain

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NN12081A

31SDB00165BEB

SSGSWDATADCLK

CS

L3,D2,D1,E1

CLRC1

TEST1TEST2TEST3

K4,L4,K3

STOSHUTCLKO

J3,J1,F1

Internal circuitPin namePin No.

Technical Data (continued)5. I/O block circuit diagrams and Pin function descriptionsNote) The characteristics listed below are reference values based on the IC design and are not guaranteed.

DVDD2 DVSS2

Pin C2Pin F2Pin L1Pin G3Pin J6Pin C8

Pin B2Pin E2Pin L2Pin H3

DVDD2 DVSS2



DVDD2 DVSS2



DVDD2 DVSS2



Pin J3, J1, F1

Pin K4,L4,K3

Pin C1

Pin L3,D2,D1,E1

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NN12081A

32SDB00165BEB

RHL

A9,A8

EXADCLK EXDS1EXDS2

K1,K2,J2

VDHD

SUBSW1SUBSW2MSUBSW

H1,G1,H2,G2,G4


Technical Data (continued)5. I/O block circuit diagrams and Pin function descriptions (continued)Note) The characteristics listed below are reference values based on the IC design and are not guaranteed.

DVDD2 DVSS2



DVDD2 DVSS2



DVDD4 DVSS4

Pin B8Pin A7

Pin H1,G1,H2,G2,G4

Pin K1,K2,J2

Pin A9,A8

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NN12081A

33SDB00165BEB

H1H2H3H4

D11,C11,B11,A11

D0D1D2D3D4D5D6D7D8D9D10D11

B7,C7,B6,C6,B5,C5,A4,B4,C4,A3,B3,C3

XOB1

XIA2



DVDD2 DVSS2



DVDD2 DVSS2



DRVDD DRVSS

Pin A6 Pin A5

Pin A2

Pin B1

Pin B7, C7,B6, C6,B5, C5,A4, B4,C4, A3,B3, C3

DVDD3 DVSS3

Pin D10Pin C10

Pin E10Pin B10Pin A10

Pin D11,C11,B11,A11

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type)

NN12081A

34SDB00165BEB

DC_DET2L7

DC_DET3K6

VRTVRB

L5,L6



AVDD1 AVSS1

Pin K11Pin K7

Pin L10Pin K8

AVDD1 AVSS1

Pin K11Pin K7

Pin L10Pin K8

AVDD1 AVSS1

Pin K11Pin K7

Pin L10Pin K8

Pin L5, L6

Pin K6

Pin L7

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type)

NN12081A

35SDB00165BEB

CCDOUTL11

DC_DET1L8



AVDD1 AVSS1

Pin K11Pin K7

Pin L10Pin K8

AVDD1 AVSS1

Pin K11Pin K7

Pin L10Pin K8

Pin L8

Pin L11

Mainten

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type)

NN12081A

36SDB00165BEB

OSUBL9

OV11BOV11AOV9BOV9AOV7BOV7AOV5BOV5AOV3BOV3AOV1BOV1A

J8,K9,

K10,J9,

J10,J11,H9,H8,

H10,H11,F10,E11

OV11LOV11ROV9LOV9ROV7SOV12OV10OV8OV6OV4OV2

G9,G10,G8,

G11,F11,E8,E9,D8,D9,C9,B9

RESETD4



Pin G9, G10, G8, G11, F11, E8, E9, D8, D9, C9, B9

DVSS2 VH

VL

Pin J8, K9, K10, J9, J10, J11, H9, H8, H10, H11, F10, E11

VMSUB VHH

VL

DVDD2 DVSS2



Pin D4

Pin L9

VL

DVSS2

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Special attention and precaution in using1. This IC is intended to be used for general electronic equipment [Analog front-end processing IC for digital cameras].

Consult our sales staff in advance for information on the following applications:• Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may

directly jeopardize life or harm the human body.• Any applications other than the standard applications intended.

(1) Space appliance (such as artificial satellite, and rocket)(2) Traffic control equipment (such as for automobile, airplane, train, and ship)(3) Medical equipment for life support(4) Submarine transponder(5) Control equipment for power plant(6) Disaster prevention and security device(7) Weapon(8) Others: Applications of which reliability equivalent to (1) to (7) is required

2. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might smoke or ignite.

3. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In addition, refer to the Pin Description (Page 6 to Page 9) for the pin configuration.

4. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as a solder-bridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during transportation.

5. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin –VCC short (power supply fault), output pin – GND short (ground fault), or output-to-output-pin short (load short) . And, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and smoke emission will depend on the current capability of the power supply.

6. When using the LSI for new models, verify the safety including the long-term reliability for each product.7. When the application system is designed by using this LSI, be sure to confirm notes in this book.

Be sure to read the notes to descriptions and the usage notes in the book.

Usage Notes

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NN12081A

38SDB00165BEB

0 ms or more

DVSS2 (GND)

VHH

VDC

(a) (b)VL

VMSUB

DVDD2 × 0.9

VH

Time

DVSS2 (GND)

VHH

VDC

VL 0 ms or more

(a) (b)VMSUB

DVDD2 × 0.9

VH

Time

Usage Notes (continued)

1. Power-on / power-off sequence(1) Power-on sequence

Follow the CCD power-on procedure to turn on the IC.The V-driver power-on sequence should be as the figure below indicates. After applying the DVDD2 voltages, wait until DVDD2 goes over 90%, and then apply the VHH, VH, VL and VMSUB voltages. If the DVDD2 voltage is not applied to the IC first, the internal logic will be unstable, through currents will flow in the output drivers, and then the IC will be broken down.It is recommended that RESET pin be set to Low after VHH, VH, VL and VMSUB are applied until they rise completely.

(2) Power-off sequenceFollow the CCD power-off procedure to turn off the IC.The V-driver power-off sequence should be as the figure below indicates. After shutting off the VHH,VH,VL and VMSUBvoltages, shut off the DVDD2 voltages. If the DVDD2 voltage is not shut off last, the internal logic will be unstable, through currents will flow in the output drivers and then the IC will be broken down. It is recommended that the RESET pin be set to Low after VHH, VH, VL and VMSUB voltages are shut off and they fall completely.

2. When SUB driver is not used:(1) Connect VMSUB to GND.(2) No connection for OSUB.

3. Middle-level voltage of V-driver is connected to DVSS2 inside.

4. About bypass capacitorConnect bypass capacitors to each of power supply pins as close as possible to the IC pins.Use capacitors of 0.1 μF or more for these bypass capacitors.

5. OthersTake notice of the following items to prevent the IC from damage.(1) Avoid the short-circuit of V-driver output pins to power supply, otherwise the IC may be damaged.(2) Avoid the short-circuit of V-driver output pins to the ground, otherwise the IC may be damaged.(3) Avoid the short-circuit of V-driver output pins to output pin, otherwise the IC may be damaged.(4) Avoid reverse insertion or mounting of the IC, otherwise the IC may be damaged.

Attention and precaution in using

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NN12081A

39SDB00165BEB

Usage Notes (continued)

6. Power dissipation (technical report)Attention and precaution in using (continued)

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7. Power dissipation (supplementary explanation)

Package

Semiconductor element

Rth (j-c)

Rth (c-a)

Rth (j-a)

Ta

Tc

Tj

PWB

[Definition of each temperature and thermal resistance]Ta : Ambient air temperature

* The temperature of the air is defined at the position where the convection, radiation, etc. don’t affect the temperature value, and it is separated from the heating elements.

Tc : It is the temperature near the center of a package surface. The package surface is defined at the opposite side if the PWB. Tj : Semiconductor element surface temperature (Junction temperature)

Rth (j-c) : The thermal resistance (difference of temperature of per 1 Watts) between a semiconductor element junction part and the package surface

Rth (c-a) : The thermal resistance (difference of temperature of per 1 Watts) between the package surface and the ambient airRth (j-a) : The thermal resistance (difference of temperature of per 1 Watts) between a semiconductor element junction part and the

ambient air.

[Supplementary information of PWB to be used for measurement]The supplement of PWB information for power dissipation data (technical report) are shown below.

FR-44-layer4-layer

FR-41-layerGlass-epoxy

Resin materialTotal layerIndication

[Notes about power dissipation (Thermal resistance) ]Power dissipation values (Thermal resistance) depend on the conditions of the surroundings, such as specification of PWB and a

mounting condition, and a ambient temperature. (Power dissipation (Thermal resistance) is not a fixed value.)The Power dissipation value (Technical report) is the experiment result in specific conditions (evaluation environment of SEMI

standard conformity), and keep in mind that Power dissipation values (Thermal resistance) depend on circumference conditionsand also change.

[Experiment environment] Power dissipation (technical report) is a result in the experiment environment of SEMI standard conformity.(Ambient air temperature (Ta) is 25°C.)

Definition image

[ Definition formula ]

Rth (j-a) = Tj – Ta

P(°C/W)

Rth (c-a) = Tc – Ta

P(°C/W)

Rth (j-c) = Tj – Tc

P(°C/W)

Tj = {Rth (j-c) + Rth (c-a) } × P + Ta

= Rth (j-a) × P + Ta

P: Power (W)

= Rth (j-c) + Rth (c-a)

Usage Notes (continued)Attention and precaution in using (continued)

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Request for your special attention and precautions in using the technical information andsemiconductors described in this book

(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed.

(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book.

(3)The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications:� Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support

systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-ucts may directly jeopardize life or harm the human body.� Any applications other than the standard applications intended.

(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.

(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment.

Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.

(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.

(7)This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.

20080805

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Documents

DATA SHEET Maintenance/ (planed maintenance type, … · 2017. 5. 30. · ov10 ov9r ov11a dvdd3 dvdd4 r vrt ov7b ov7a ov9l osub avdd1 dc_det 2 ccdout avdd1 vrb dc_det 1 dc_det3 avss1