DESIGN QUALIFICATION TEST REPORT GFZ/PCB GFZ-20-01-G-10 …suddendocs.samtec.com/testreports/461870_report_rev_2_qua.pdf · Tracking Code: 461870_Report_Rev_2 Part #: GFZ-20-01-G-10-AD/MATING

Project Number: Design Qualification Test Report Tracking Code: 461870_Report_Rev_2

Requested by: Michael Menkhaus Date: 7/29/2015

Part #: GFZ-20-01-G-10-AD/ MATING PCB

Part description: GFZ/PCB Tech: Tony Wagoner

Test Start: 02/02/2015 Test Completed: 04/12/2015

Page 1 of 41

DESIGN QUALIFICATION TEST REPORT

GFZ/PCB

GFZ-20-01-G-10-AD/ MATING PCB

Tracking Code: 461870_Report_Rev_2 Part #: GFZ-20-01-G-10-AD/MATING PCB

Part description: GFZ/PCB

Page 2 of 41

REVISION HISTORY

DATE REV.NUM. DESCRIPTION ENG

4/8/2015 1 Initial Issue PC

5/13/2015 2 Add the 500 cycles LLCR data PC



Page 3 of 41

CERTIFICATION

All instruments and measuring equipment were calibrated to National Institute for Standards and Technology (NIST)

traceable standards according to IS0 10012-l and ANSI/NCSL 2540-1, as applicable.

All contents contained herein are the property of Samtec. No portion of this report, in part or in full shall be

reproduced without prior written approval of Samtec.

SCOPE To perform the following tests: Design Qualification test. Please see test plan.

APPLICABLE DOCUMENTS

Standards: EIA Publication 364

TEST SAMPLES AND PREPARATION 1) All materials were manufactured in accordance with the applicable product specification.

2) All test samples were identified and encoded to maintain traceability throughout the test sequences.

3) Parts not intended for testing LLCR are visually inspected and cleaned if necessary.

4) Any additional preparation will be noted in the individual test sequences.

5) Samtec Test PCBs used: PCB-105964-TST/PCB-105966-TST/PCB-106277-TST



Page 4 of 41

FLOWCHARTS



Page 5 of 41

FLOWCHARTS Continued



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Page 11 of 41

ATTRIBUTE DEFINITIONS The following is a brief, simplified description of attributes.

THERMAL SHOCK: 1) EIA-364-32, Thermal Shock (Temperature Cycling) Test Procedure for Electrical Connectors.

2) Test Condition 1: -55°C to +85°C

3) Test Time: ½ hour dwell at each temperature extreme

4) Number of Cycles: 100

5) All test samples are pre-conditioned at ambient.

6) All test samples are exposed to environmental stressing in the mated condition.

THERMAL: 1) EIA-364-17, Temperature Life with or without Electrical Load Test Procedure for Electrical Connectors.

2) Test Condition 4 at 105° C.

3) Test Time Condition B for 250 hours.

4) All test samples are pre-conditioned at ambient.


HUMIDITY: 1) Reference document: EIA-364-31, Humidity Test Procedure for Electrical Connectors.

2) Test Condition B, 240 Hours.

3) Method III, +25° C to + 65° C, 90% to 98% Relative Humidity excluding sub-cycles 7a and 7b.

4) All samples are pre-conditioned at ambient.


MECHANICAL SHOCK (Specified Pulse): 1) Reference document: EIA-364-27, Mechanical Shock Test Procedure for Electrical Connectors

2) Test Condition C

3) Peak Value: 100 G

4) Duration: 6 Milliseconds

5) Wave Form: Half Sine

6) Velocity: 12.3 ft/s

7) Number of Shocks: 3 Shocks / Direction, 3 Axis (18 Total)

VIBRATION: 1) Reference document: EIA-364-28, Vibration Test Procedure for Electrical Connectors

2) Test Condition V, Letter B

3) Power Spectral Density: 0.04 G² / Hz

4) G ‘RMS’: 7.56

5) Frequency: 50 to 2000 Hz

6) Duration: 2.0 Hours per axis (3 axis total)

NANOSECOND-EVENT DETECTION: 1) Reference document: EIA-364-87, Nanosecond-Event Detection for Electrical Connectors

2) Prior to test, the samples were characterized to assure the low nanosecond event being monitored will trigger

the detector.

3) After characterization it was determined the test samples could be monitored for 50 nanosecond events

MATING/UNMATING: 1) Reference document: EIA-364-13, Mating and Unmating Forces Test Procedure for Electrical Connectors.

2) The full insertion position was to within 0.003” to 0.004” of the plug bottoming out in the receptacle to

prevent damage to the system under test.

3) One of the mating parts is secured to a floating X-Y table to prevent damage during cycling.



Page 12 of 41

ATTRIBUTE DEFINITIONS Continued The following is a brief, simplified description of attributes

NORMAL FORCE (FOR CONTACTS TESTED IN THE HOUSING): 1) Reference document: EIA-364-04, Normal Force Test Procedure for Electrical Connectors.

2) The contacts shall be tested in the connector housing.

3) If necessary, a “window” shall be made in the connector body to allow a probe to engage and deflect the

contact at the same attitude and distance (plus 0.05 mm [0.002”]) as would occur in actual use.

4) The connector housing shall be placed in a holding fixture that does not interfere with or otherwise influence

the contact force or deflection.

5) Said holding fixture shall be mounted on a floating, adjustable, X-Y table on the base of the Dillon TC2,

computer controlled test stand with a deflection measurement system accuracy of 5.0 µm (0.0002”).

6) The nominal deflection rate shall be 5 mm (0.2”)/minute.

7) Unless otherwise noted a minimum of five contacts shall be tested.

8) The force/deflection characteristic to load and unload each contact shall be repeated five times.

9) The system shall utilize the TC2 software in order to acquire and record the test data.

10) The permanent set of each contact shall be measured within the TC2 software.

11) The acquired data shall be graphed with the deflection data on the X-axis and the force data on the Y-axis

and a print out will be stored with the Tracking Code paperwork.

TEMPERATURE RISE (Current Carrying Capacity, CCC): 1) EIA-364-70, Temperature Rise versus Current Test Procedure for Electrical Connectors and Sockets.

2) When current passes through a contact, the temperature of the contact increases as a result of I2R (resistive)

heating.

3) The number of contacts being investigated plays a significant part in power dissipation and therefore

temperature rise.

4) The size of the temperature probe can affect the measured temperature.

5) Copper traces on PC boards will contribute to temperature rise:

a. Self heating (resistive)

b. Reduction in heat sink capacity affecting the heated contacts

6) A de-rating curve, usually 20%, is calculated.

7) Calculated de-rated currents at four temperature points are reported:

a. Ambient

b. 85о C

c. 95о C

d. 115о C

8) Typically, neighboring contacts (in close proximity to maximize heat build up) are energized.

9) The thermocouple (or temperature measuring probe) will be positioned at a location to sense the maximum

temperature in the vicinity of the heat generation area.

10) A computer program, TR 803.exe, ensures accurate stability for data acquisition.

11) Hook-up wire cross section is larger than the cross section of any connector leads/PC board traces, jumpers,

etc.

12) Hook-up wire length is longer than the minimum specified in the referencing standard.



Page 13 of 41


LLCR: 1) EIA-364-23, Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets.

2) A computer program, LLCR 221.exe, ensures repeatability for data acquisition.

3) The following guidelines are used to categorize the changes in LLCR as a result from stressing

a. <= +5.0 mOhms: ----------------------------- Stable

b. +5.1 to +10.0 mOhms: ---------------------- Minor

c. +10.1 to +15.0 mOhms: -------------------- Acceptable

d. +15.1 to +50.0 mOhms: -------------------- Marginal

e. +50.1 to +2000 mOhms: ------------------- Unstable

f. >+2000 mOhms: ----------------------------- Open Failure

GAS TIGHT: To provide method for evaluating the ability of the contacting surfaces in preventing penetration of harsh

vapors which might lead to oxide formation that may degrade the electrical performance of the contact

system.

1) EIA-364-23, Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets.


3) The following guidelines are used to categorize the changes in LLCR as a result from stressing

a. <= +5.0 mOhms: ---------------------------- Stable

b. +5.1 to +10.0 mOhms: --------------------- Minor

c. +10.1 to +15.0 mOhms: ------------------- Acceptable

d. +15.1 to +50.0 mOhms: ------------------- Marginal

e. +50.1 to +2000 mOhms: ------------------ Unstable

f. >+2000 mOhms: ---------------------------- Open Failure

4) Procedure:

a. Reference document: EIA-364-36, Test Procedure for Determination of Gas-Tight Characteristics

for Electrical Connectors, Sockets and/or Contact Systems.

b. Test Conditions:

i. Class II--- Mated pairs of contacts assembled to their plastic housings.

ii. Reagent grade Nitric Acid shall be used of sufficient volume to saturate the test chamber

iii. The ratio of the volume of the test chamber to the surface area of the acid shall be 10:1.

iv. The chamber shall be saturated with the vapor for at least 15 minutes before samples are

added.

v. Exposure time, 55 to 65 minutes.

vi. The samples shall be no closer to the chamber walls than 1 inches and no closer to the

surface of the acid than 3 inches.

vii. The samples shall be dried after exposure for a minimum of 1 hour.

viii. Drying temperature 50о C

ix. The final LLCR shall be conducted within 1 hour after drying.



Page 14 of 41


INSULATION RESISTANCE (IR): To determine the resistance of insulation materials to leakage of current through or on the surface of these

materials when a DC potential is applied.

1) PROCEDURE:

a. Reference document: EIA-364-21, Insulation Resistance Test Procedure for Electrical Connectors.

b. Test Conditions:

i. Between Adjacent Contacts or Signal-to-Ground

ii. Electrification Time 2.0 minutes

iii. Test Voltage (500 VDC) corresponds to calibration settings for measuring resistances.

2) MEASUREMENTS:

3) When the specified test voltage is applied (VDC), the insulation resistance shall not be less than 5000

megohms.

DIELECTRIC WITHSTANDING VOLTAGE (DWV): To determine if the sockets can operate at its rated voltage and withstand momentary over potentials due to

switching, surges, and other similar phenomenon. Separate samples are used to evaluate the effect of

environmental stresses so not to influence the readings from arcing that occurs during the measurement

process.

1) PROCEDURE:

a. Reference document: EIA-364-20, Withstanding Voltage Test Procedure for Electrical Connectors.

b. Test Conditions:

i. Between Adjacent Contacts or Signal-to-Ground

ii. Barometric Test Condition 1

iii. Rate of Application 500 V/Sec

iv. Test Voltage (VAC) until breakdown occurs

2) MEASUREMENTS/CALCULATIONS

a. The breakdown voltage shall be measured and recorded.

b. The dielectric withstanding voltage shall be recorded as 75% of the minimum breakdown voltage.

c. The working voltage shall be recorded as one-third (1/3) of the dielectric withstanding voltage (one-

fourth of the breakdown voltage).



Page 15 of 41

RESULTS

Temperature Rise, CCC at a 20% de-rating CCC for a 30°C Temperature Rise---------------1.3 A per contact with 10 contacts (10x1) powered

CCC for a 30°C Temperature Rise---------------1.0 A per contact with 20 contacts (10x2) powered




Mating/Unmating Forces: Thermal Aging Group GFZ-20-01-G-10-AD/ MATING PCB

Initial

o Mating

Min -------------------------------------- 16.09 Lbs

Max -------------------------------------- 19.98 Lbs

After Thermal

o Mating

Min -------------------------------------- 16.99 Lbs

Max -------------------------------------- 22.14 Lbs

Mating/Unmating Forces: Mating/Unmating Durability Group GFZ-20-01-G-10-AD/ MATING PCB

Initial

o Mating

Min -------------------------------------- 28.69 Lbs

Max -------------------------------------- 33.98 Lbs

After 25 Cycles

o Mating

Min -------------------------------------- 23.18 Lbs

Max -------------------------------------- 26.98 Lbs

After 50 Cycles

o Mating

Min -------------------------------------- 23.54 Lbs

Max -------------------------------------- 27.08 Lbs

After 75 Cycles

o Mating

Min -------------------------------------- 23.67 Lbs

Max -------------------------------------- 29.59 Lbs

After 100 Cycles

o Mating

Min -------------------------------------- 23.74 Lbs

Max -------------------------------------- 29.26 Lbs

After Humidity

o Mating

Min -------------------------------------- 20.47 Lbs

Max -------------------------------------- 23.00 Lbs



Page 16 of 41

RESULTS Continued

Mating/Unmating Forces: Mating/Unmating Basic Group GFZ-40-01-G-10-AD/ MATING PCB

Initial

o Mating

Min -------------------------------------- 51.82 Lbs

Max -------------------------------------- 58.84 Lbs

After 25 Cycles

o Mating

Min -------------------------------------- 49.56 Lbs

Max -------------------------------------- 56.83 Lbs

After 50 Cycles

o Mating

Min -------------------------------------- 49.61 Lbs

Max -------------------------------------- 57.30 Lbs

After 75 Cycles

o Mating

Min -------------------------------------- 49.59 Lbs

Max -------------------------------------- 56.73 Lbs

After 100 Cycles

o Mating

Min -------------------------------------- 49.96 Lbs

Max -------------------------------------- 57.04 Lbs

Normal force: Signal pin at 0.0150 Inch deflections

Initial

o Min ------------------------------------------------- 56.70 gf Set ----- 0.0010 Inch

o Max ------------------------------------------------ 61.50 gf Set ----- 0.0014 Inch

Thermal

o Min ------------------------------------------------- 54.30 gf Set ----- 0.0019 Inch

o Max ------------------------------------------------ 59.60 gf Set ----- 0.0024 Inch



Page 17 of 41

RESULTS Continued

Insulation Resistance minimums, IR

Pin to Pin

Initial

o Mated ------------------------------------------------ 45000 Meg Ω ------------------------ Passed

Thermal


Humidity


Row to Row

Initial


Thermal


Humidity


Dielectric Withstanding Voltage minimums, DWV Minimums

o Breakdown Voltage ---------------------------------- 687 VAC

o Test Voltage ------------------------------------------- 520 VAC

o Working Voltage ------------------------------------- 170 VAC

Pin to Pin

Initial DWV -------------------------------------------------- Passed

Thermal DWV ----------------------------------------------- Passed

Humidity DWV ---------------------------------------------- Passed

Row to Row

Initial DWV -------------------------------------------------- Passed

Thermal DWV ----------------------------------------------- Passed

Humidity DWV ---------------------------------------------- Passed



Page 18 of 41

RESULTS Continued

LLCR Gas Tight (192 LLCR test points)

Initial --------------------------------------------------------------- 18.90 mOhms Max

Gas-Tight

o <= +5.0 mOhms ---------------------------------- 192 Points ------------------------- Stable

o +5.1 to +10.0 mOhms ----------------------------------- 0 Points ------------------------- Minor

o +10.1 to +15.0 mOhms --------------------------------- 0 Points ------------------------- Acceptable

o +15.1 to +50.0 mOhms --------------------------------- 0 Points ------------------------- Marginal

o +50.1 to +2000 mOhms --------------------------------- 0 Points ------------------------- Unstable

o >+2000 mOhms ------------------------------------------ 0 Points ------------------------- Open Failure

LLCR Thermal Aging (192 LLCR test points)


Thermal Aging


o +5.1 to +10.0 mOhms --------------------------------- 10 Points ------------------------- Minor





LLCR Durability (192 LLCR test points) Initial --------------------------------------------------------------- 15.46 mOhms Max

Durability, 100 Cycles







Thermal







Humidity









Page 19 of 41

RESULTS Continued

LLCR Shock & Vibration (192 LLCR test points)


Shock &Vibration







Mechanical Shock & Random Vibration: o Shock

No Damage ---------------------------------- ---------------------------------- Pass

50 Nanoseconds ----------------------------- ---------------------------------- Pass

o Vibration

No Damage ---------------------------------- ---------------------------------- Pass

50 Nanoseconds ----------------------------- ---------------------------------- Pass

LLCR Extended life (192 LLCR test points)

250 cycles Initial --------------------------------------------------------------- 17.57 mOhms Max








Thermal







Humidity









Page 20 of 41

RESULTS Continued









Thermal







Humidity


o +5.1 to +10.0 mOhms --------------------------------- 10 Points ------------------------- Minor





1000 cycles









Thermal







Humidity









Page 21 of 41

RESULTS Continued









Thermal







Humidity









Page 22 of 41

DATA SUMMARIES

TEMPERATURE RISE (Current Carrying Capacity, CCC):

1) High quality thermocouples whose temperature slopes track one another were used for temperature

monitoring.

2) The thermocouples were placed at a location to sense the maximum temperature generated during testing. 3) Temperature readings recorded are those for which three successive readings, 15 minutes apart, differ less

than 1° C (computer controlled data acquisition).

4) Adjacent contacts were powered:

a. Linear configuration with 10 adjacent conductors/contacts powered

461870

10 (10x1) Contacts in Series

Part Numbers: GFZ-40-01-G-10-AD / Mating Boards

3.03.0

2.42.4

1.9

1.51.5

1.6

1.3 0.90.9

0.7

0.0

0.6

1.2

1.8

2.4

3.0

3.6

20 40 60 80 100 120 140

Ambient Temperature (°C)

Max

imu

m C

urr

en

t, A

mp

s p

er

Co

nta

ct

Base Curve Derated 20 % Measured Current RT Peak Amp RT Derated Amp 85°C Peak Amp

85°C Derated Amp 95°C Peak Amp 95°C Derated Amp 115°C Peak Amp 115°C Derated Amp Limit

125°C

Limit

Room Temp= 22.1°C

Current Rating per Contact (30 Deg. Rise, 20% Derated) = 1.3 Amps



Page 23 of 41

DATA SUMMARIES Continued

461870



0

10

20

30

40

50

60

0 0.5 1 1.5 2

Current (Amps)

Te

mp

era

ture

Ris

e (

°C a

bo

ve a

mb

ien

t)

Actual 20% Derated



Page 24 of 41


b. Linear configuration with 20 adjacent conductors/contacts powered

461870



2.32.3

1.81.8

1.4

1.11.1

1.2

1.0 0.70.7

0.5

0.0

0.6

1.2

1.8

2.4

3.0

20 40 60 80 100 120 140


Maxim

um

Cu

rren

t, A

mp

s p

er

Co

nta

ct



125°C

Limit

Room Temp= 22.2°C


461870



0

10

20

30

40

50

60

0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8

Current (Amps)

Tem

pera

ture

Ris

e (

°C a

bo

ve a

mb

ien

t)

Actual 20% Derated



Page 25 of 41


c. Linear configuration with 30 adjacent conductors/contacts powered

461870



1.91.9

1.51.5

1.2

1.01.0

1.0

0.8 0.60.6

0.5

0.0

0.4

0.8

1.2

1.6

2.0

2.4

20 40 60 80 100 120 140


Max

imu

m C

urr

en

t, A

mp

s p

er

Co

nta

ct



125°C

Limit

Room Temp= 22.4°C


461870



0

10

20

30

40

50

60

0 0.2 0.4 0.6 0.8 1 1.2 1.4

Current (Amps)

Tem

pera

ture

Ris

e (

°C a

bo

ve a

mb

ien

t)

Actual 20% Derated



Page 26 of 41


d. Linear configuration with 40 adjacent conductors/contacts powered

461870



1.71.7

1.41.4

1.1

0.90.9

0.9

0.7 0.50.5

0.4

0.0

0.4

0.8

1.2

1.6

2.0

2.4

20 40 60 80 100 120 140


Max

imu

m C

urr

en

t, A

mp

s p

er

Co

nta

ct



125°C

Limit

Room Temp= 22.3°C


461870



0

10

20

30

40

50

60

0 0.2 0.4 0.6 0.8 1 1.2

Current (Amps)

Tem

pera

ture

Ris

e (

°C a

bo

ve a

mb

ien

t)

Actual 20% Derated



Page 27 of 41


e. Linear configuration with all adjacent conductors/contacts powered

461870

400 (All Power) (10x40) Contacts in Series


0.90.9

0.70.7

0.5

0.40.4

0.5

0.4 0.30.3

0.2

0.0

0.2

0.4

0.6

0.8

1.0

1.2

20 40 60 80 100 120 140


Maxim

um

Cu

rren

t, A

mp

s p

er

Co

nta

ct



125°C

Limit

Room Temp= 22.6°C


461870

400 (All Power)(10x40) Contacts in Series


0

5

10

15

20

25

30

35

40

45

50

0 0.1 0.2 0.3 0.4 0.5 0.6

Current (Amps)

Tem

pera

ture

Ris

e (

°C a

bo

ve a

mb

ien

t)

Actual 20% Derated



Page 28 of 41


Mating\Unmating Force: Thermal Aging Group GFZ-20-01-G-10-AD/ MATING PCB

Initial After Thermals

Mating Unmating Mating Unmating

Newtons

Force (Lbs) Newtons Force (Lbs) Newtons Force (Lbs) Newtons Force (Lbs)

Minimum 71.55 16.09 0.00 0.00 75.55 16.99 0.00 0.00

Maximum 88.89 19.98 0.00 0.00 98.47 22.14 0.00 0.00

Average 79.17 17.80 0.00 0.00 89.51 20.12 0.00 0.00

St Dev 5.55 1.25 0.00 0.00 6.69 1.50 0.00 0.00

Count 8 8 8 8 8 8 8 8

Mating\Unmating Force: Mating\Unmating Durability Group GFZ-20-01-G-10-AD/ MATING PCB

Initial After 25 Cycles


Newtons Force (Lbs) Newtons Force (Lbs) Newtons Force (Lbs) Newtons Force (Lbs)

Minimum 127.61 28.69 0.00 0.00 103.08 23.18 0.00 0.00

Maximum 151.12 33.98 0.00 0.00 120.01 26.98 0.00 0.00

Average 134.81 30.31 0.00 0.00 114.90 25.83 0.00 0.00

St Dev 7.91 1.78 0.00 0.00 5.52 1.24 0.00 0.00

Count 8 8 8 8 8 8 8 8

After 50 Cycles After 75 Cycles



Minimum 104.70 23.54 0.00 0.00 105.28 23.67 0.00 0.00

Maximum 120.44 27.08 0.00 0.00 131.63 29.59 0.00 0.00

Average 115.09 25.87 0.00 0.00 117.02 26.31 0.00 0.00

St Dev 5.19 1.17 0.00 0.00 7.49 1.68 0.00 0.00

Count 8 8 8 8 8 8 8 8

After 100 Cycles After Humidity



Minimum 105.59 23.74 0.00 0.00 91.06 20.47 0.00 0.00

Maximum 130.15 29.26 0.00 0.00 102.30 23.00 0.00 0.00

Average 117.16 26.34 0.00 0.00 97.34 21.88 0.00 0.00

St Dev 7.13 1.60 0.00 0.00 3.91 0.88 0.00 0.00

Count 8 8 8 8 8 8 8 8



Page 29 of 41


Mating\Unmating Force: Mating\Unmating Basic Group GFZ-40-01-G-10-AD/ MATING PCB

Initial 25 Cycles



Minimum 230.51 51.82 0.00 0.00 220.46 49.56 0.00 0.00

Maximum 261.74 58.84 0.00 0.00 252.80 56.83 0.00 0.00

Average 254.11 57.13 0.00 0.00 244.35 54.94 0.00 0.00

St Dev 10.18 2.29 0.00 0.00 10.54 2.37 0.00 0.00

Count 8 8 8 8 8 8 8 8

50 Cycles 75 Cycles



Minimum 220.68 49.61 0.00 0.00 220.59 49.59 0.00 0.00

Maximum 254.89 57.30 0.00 0.00 252.35 56.73 0.00 0.00

Average 245.55 55.20 0.00 0.00 245.59 55.21 0.00 0.00

St Dev 10.79 2.43 0.00 0.00 10.55 2.37 0.00 0.00

Count 8 8 8 8 8 8 8 8

100 Cycles

Mating Unmating

Newtons Force (Lbs) Newtons Force (Lbs)

Minimum 222.24 49.96 0.00 0.00

Maximum 253.73 57.04 0.00 0.00

Average 246.48 55.41 0.00 0.00

St Dev 10.43 2.35 0.00 0.00

Count 8 8 8 8



Page 30 of 41


Mating\Unmating Force Comparison

Mating/Unmating Data for 20 and 40 Position GFZ/Mating PCB

0.00

10.00

20.00

30.00

40.00

50.00

60.00

20 Pos. 40 Pos.

Number of Terminals per Row

Fo

rce (

lbs

)

Mating (Initial) Mating (100 Cycles)



Page 31 of 41


Normal force:

Initial Deflections in inches Forces in Grams

0.0015 0.0030 0.0045 0.0060 0.0075 0.0090 0.0105 0.0120 0.0135 0.0150 SET

Averages 7.60 14.02 20.67 27.23 33.68 39.88 45.80 51.03 55.34 58.93 0.0012

Min 6.00 12.10 18.80 25.20 31.70 38.30 43.90 49.10 53.20 56.70 0.0010

Max 8.30 16.30 23.90 30.70 37.10 43.30 49.30 54.30 58.20 61.50 0.0014

St. Dev 0.914 1.365 1.468 1.624 1.602 1.590 1.605 1.548 1.468 1.465 0.0002

Count 12 12 12 12 12 12 12 12 12 12 12

After

Thermals Deflections in inches Forces in Grams

0.0015 0.0030 0.0045 0.0060 0.0075 0.0090 0.0105 0.0120 0.0135 0.0150 SET

Averages 0.13 6.78 13.40 20.08 26.76 33.33 39.79 46.09 52.14 57.26 0.0021

Min 0.00 5.00 10.90 17.40 23.80 30.40 37.00 43.20 49.10 54.30 0.0019

Max 0.50 8.00 14.80 21.60 28.60 35.30 41.90 48.20 54.40 59.60 0.0024

St. Dev 0.231 1.021 1.334 1.486 1.646 1.793 1.906 2.058 2.221 2.285 0.0002

Count 8 8 8 8 8 8 8 8 8 8 8

Normal Force - Average Initial vs Average Thermal

0.0

7.6

14.0

20.7

27.2

33.7

39.9

45.8

51.0

55.3

58.9

0.0

6.8

13.4

20.1

26.8

33.3

39.8

46.1

52.1

57.3

0

10

20

30

40

50

60

70

0 0.002 0.004 0.006 0.008 0.01 0.012 0.014 0.016

Deflection-Inches

Fo

rce-G

ram

s

Average Initial Normal Force

Average Normal Force after Thermals



Page 32 of 41


INSULATION RESISTANCE (IR):

Pin to Pin

Mated Unmated Unmated

Minimum GFZ/PCB GFZ PCB

Initial 45000 Not Tested Not Tested

Thermal 45000 Not Tested Not Tested

Humidity 45000 Not Tested Not Tested

Row to Row

Mated Unmated Unmated

Minimum GFZ/PCB GFZ PCB

Initial 45000 Not Tested Not Tested

Thermal 45000 Not Tested Not Tested

Humidity 45000 Not Tested Not Tested

DIELECTRIC WITHSTANDING VOLTAGE (DWV):

Voltage Rating Summary

Minimum GFZ/PCB

Break Down Voltage 687

Test Voltage 515

Working Voltage 170

Pin to Pin

Initial Test Voltage Passed

After Thermal Test Voltage Passed

After Humidity Test Voltage Passed

Row to Row

Initial Test Voltage Passed

After Thermal Test Voltage Passed

After Humidity Test Voltage Passed



Page 33 of 41


LLCR Durability: 1) A total of 192 points were measured.



4) The following guidelines are used to categorize the changes in LLCR as a result from stressing.

a. <= +5.0 mOhms: ---------------------------- Stable

b. +5.1 to +10.0 mOhms: --------------------- Minor



e. +50.1 to +2000 mOhms ------------------- Unstable


LLCR Measurement Summaries by Pin Type

Date 2/11/2015 3/12/2015 3/23/2015 4/2/2015

Room Temp (Deg C) 22 22 22 22

Rel Humidity (%) 36 36 36 35

Technician Tony

Wagoner Tony

Wagoner Tony Wagoner Tony

Wagoner

mOhm values Actual Delta Delta Delta

Initial 100 Cycles Therm Shck Humidity

Pin Type 1: Signal

Average 13.05 0.71 1.44 1.74

St. Dev. 0.68 0.71 0.59 0.62

Min 11.86 0.01 0.05 0.16

Max 15.46 4.53 3.42 3.55

Summary Count 192 192 192 192

Total Count 192 192 192 192

LLCR Delta Count by Category

Stable Minor Acceptable Marginal Unstable Open

mOhms <=5 >5 & <=10 >10 & <=15 >15 & <=50 >50 & <=1000 >1000

100 Cycles 192 0 0 0 0 0

Therm Shck 192 0 0 0 0 0

Humidity 192 0 0 0 0 0



Page 34 of 41


LLCR Thermal Aging:

1) A total of 192 points were measured.




a. <= +5.0 mOhms: ----------------------------- Stable

b. +5.1 to +10.0 mOhms: ---------------------- Minor



e. +50.1 to +2000 mOhms: ------------------- Unstable



Date 3/16/2015 3/30/2015

Room Temp (Deg C) 22 22

Rel Humidity (%) 36 36

Technician Tony Wagoner Tony Wagoner


Initial Thermal

Pin Type 1: Signal

Average 14.11 1.70

St. Dev. 1.02 1.59

Min 11.79 0.05

Max 18.67 8.09

Summary Count 192 192

Total Count 192 192



mOhms <=5 >5 & <=10 >10 & <=15 >15 & <=50 >50 & <=1000 >1000

Thermal 182 10 0 0 0 0



Page 35 of 41


LLCR Gas Tight:

1) A total of 192 points were measured.




a. <= +5.0 mOhms: ----------------------------- Stable

b. +5.1 to +10.0 mOhms: ---------------------- Minor

c. +10.1 to +15.0 mOhms: --------------------- Acceptable


e. +50.1 to +2000 mOhms: -------------------- Unstable

f. >+2000 mOhms: ------------------------------ Open Failure


Date 1/29/2015 1/30/2015





Initial Acid Vapor

Pin Type 1: Signal

Average 13.98 0.41

St. Dev. 1.13 0.43

Min 11.89 0.00

Max 18.90 3.47


Total Count 192 192



mOhms <=5 >5 & <=10 >10 & <=15 >15 & <=50 >50 & <=1000 >1000

Acid Vapor 192 0 0 0 0 0



Page 36 of 41


LLCR Shock &Vibration: 1). A total of 192 points were measured.

2). EIA-364-23, Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets.

3). The following guidelines are used to categorize the changes in LLCR as a result from stressing.

a. <= +5.0 mOhms: ---------------------------- Stable

b. +5.1 to +10.0 mOhms: --------------------- Minor



e. +50.1 to +2000 mOhms -------------------- Unstable



Date 2/2/2015 2/5/2015





Initial Shock-Vib

Pin Type 1: Signal

Average 13.28 0.51

St. Dev. 0.73 0.33

Min 12.04 0.00

Max 15.65 2.39


Total Count 192 192



mOhms <=5 >5 & <=10 >10 & <=15 >15 & <=50 >50 & <=1000 >1000

Shock-Vib 192 0 0 0 0 0

Nanosecond Event Detection:

Contacts tested 60

Test Condition C, 100g's, 6ms, Half-Sine

Shock Events 0

Test Condition V-B, 7.56 rms g

Vibration Events 0

Total Events 0

Shock and Vibration Event Detection Summary



Page 37 of 41


LLCR Extended life: 1) A total of 192 points were measured.




a. <= +5.0 mOhms: ---------------------------- Stable

b. +5.1 to +10.0 mOhms: --------------------- Minor



e. +50.1 to +2000 mOhms ------------------- Unstable


250 cycles


Date 2/2/2015 2/4/2015 2/16/2015 3/2/2015


Rel Humidity (%) 35 35 36 36

Technician Tony

Wagoner Tony

Wagoner Tony Wagoner Tony

Wagoner



Pin Type 1: Signal

Average 13.84 0.49 1.17 1.45

St. Dev. 0.79 0.45 0.68 1.00

Min 12.27 0.00 0.02 0.01

Max 17.57 2.46 3.76 9.88


Total Count 192 192 192 192



mOhms <=5 >5 & <=10 >10 & <=15 >15 & <=50 >50 & <=1000 >1000

250 Cycles 192 0 0 0 0 0

Therm Shck 192 0 0 0 0 0

Humidity 191 1 0 0 0 0



Page 38 of 41


500 cycles


Date 4/16/2015 4/17/2015 4/27/2015 5/12/2015


Rel Humidity (%) 38 38 35 43

Technician Tony Wagoner Tony Wagoner Tony Wagoner Tony Wagoner



Pin Type 1: Signal

Average 14.48 1.16 2.57 2.99

St. Dev. 1.20 0.98 1.15 1.17

Min 12.32 0.03 0.06 0.53

Max 18.98 6.77 7.85 7.72


Total Count 192 192 192 192



mOhms <=5 >5 & <=10 >10 & <=15 >15 & <=50 >50 & <=1000 >1000

500 Cycles 190 2 0 0 0 0

Therm Shck 185 7 0 0 0 0

Humidity 182 10 0 0 0 0

1000 cycles


Date 2/6/2015 2/10/2015 2/24/2015 3/9/2015


Rel Humidity (%) 36 35 36 36

Technician Tony Wagoner Tony Wagoner Tony Wagoner Tony Wagoner



Pin Type 1: Signal

Average 13.74 0.69 1.74 1.77

St. Dev. 1.44 0.89 1.33 1.53

Min 11.61 0.01 0.01 0.01

Max 20.66 7.06 8.26 11.37


Total Count 192 192 192 192



mOhms <=5 >5 & <=10 >10 & <=15 >15 & <=50 >50 & <=1000 >1000

1000 Cycles 191 1 0 0 0 0

Therm Shck 186 6 0 0 0 0

Humidity 184 7 1 0 0 0



Page 39 of 41


2500 cycles


Date 2/2/2015 2/6/2015 2/16/2015 3/2/2015


Rel Humidity (%) 35 35 36 36

Technician Tony

Wagoner Tony Wagoner Tony Wagoner Tony

Wagoner



Pin Type 1: Signal

Average 12.98 0.42 0.98 1.38

St. Dev. 0.62 0.39 0.61 0.61

Min 11.60 0.00 0.01 0.04

Max 15.51 2.34 3.13 3.46


Total Count 192 192 192 192



mOhms <=5 >5 & <=10 >10 & <=15 >15 & <=50 >50 & <=1000 >1000

2500 Cycles 192 0 0 0 0 0

Therm Shck 192 0 0 0 0 0

Humidity 192 0 0 0 0 0



Page 40 of 41

EQUIPMENT AND CALIBRATION SCHEDULES

Equipment #: TCT-07

Description: Automated Test Stand

Manufacturer: Chatillon/Lloyd

Model: LF Plus

Serial #: LF1310

Accuracy: See Manual

… Last Cal: 11/14/2014, Next Cal: 11/14/2015

Equipment #: HPT-01

Description: Hipot Safety Tester

Manufacturer: Vitrek

Model: V73

Serial #: 019808

Accuracy: … Last Cal: 05/15/2014, Next Cal: 05/15/2015

Equipment #: MO-04

Description: Multimeter /Data Acquisition System

Manufacturer: Keithley

Model: 2700

Serial #: 0798688


… Last Cal: 09/11/2014, Next Cal: 09/11/2015

Equipment #: PS-02

Description: Power Supply

Manufacturer: Hewlett-Packer

Model: 6033A

Serial #: N/A


… Last Cal: NOT CALIBRATED

Equipment #: MO-11

Description: Switch/Multimeter

Manufacturer: Keithley

Model: 3706

Serial #: 120169


… Last Cal: 09/11/2014, Next Cal: 09/11/2015

Equipment #: THC-05

Description: Temperature/Humidity Chamber (Chamber Room)

Manufacturer: Thermotron

Model: SM-8-3800

Serial #: 05 23 00 02


… Last Cal: 11/14/2014, Next Cal: 05/31/2015



Page 41 of 41

EQUIPMENT AND CALIBRATION SCHEDULES

Equipment #: TSC-01

Description: Vertical Thermal Shock Chamber

Manufacturer: Cincinnati Sub Zero

Model: VTS-3-6-6-SC/AC

Serial #: 10-VT14993


… Last Cal: 06/30/2014, Next Cal: 06/30/2015

Equipment #: OV-05

Description: Forced Air Oven, 5 Cu. Ft., 120 V (Chamber Room)

Manufacturer: Sheldon Mfg.

Model: CE5F

Serial #: 02008008

Accuracy: +/- 5 deg. C

… Last Cal: 02/18/2015, Next Cal: 02/18/2016

Equipment #: SVC-01

Description: Shock & Vibration Table

Manufacturer: Data Physics

Model: LE-DSA-10-20K

Serial #: 10037


… Last Cal: 04/22/2014, Next Cal: 04/22/2015

Equipment #: ACLM-01

Description: Accelerometer

Manufacturer: PCB Piezotronics

Model: 352C03

Serial #: 115819


… Last Cal: 07/18/2014, Next Cal: 07/18/2015

Equipment #: ED-03

Description: Event Detector

Manufacturer: Analysis Tech

Model: 32EHD

Serial #: 1100604


… Last Cal: 10/31/2014, Next Cal: 10/31/2015

Documents

DESIGN QUALIFICATION TEST REPORT GFZ/PCB GFZ-20-01-G-10 …suddendocs.samtec.com/testreports/461870_report_rev_2_qua.pdf · Tracking Code: 461870_Report_Rev_2 Part #: GFZ-20-01-G-10-AD/MATING