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R. R. Ward and R. K. Kirschman GPD Optoelectronics Corp., Salem, New Hampshire, U.S.A. M. D. Jhabvala NASA Goddard Space Flight Center, Greenbelt, Maryland, U.S.A. R. S. Babu Ball Aerospace & Technologies Corp., Boulder, Colorado, U.S.A. D. V. Camin and V. Grassi Physics Department of the University and INFN, Milan, Italy
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Development of Ge JFETsfor
Deep-Cryogenic Preamplifiers
SPIE - Astronomical Telescopes and Instrumentation
Hawai’i, August 2002
R. R. Ward and R. K. KirschmanGPD Optoelectronics Corp., Salem, New Hampshire, U.S.A.
M. D. JhabvalaNASA Goddard Space Flight Center, Greenbelt, Maryland, U.S.A.
R. S. BabuBall Aerospace & Technologies Corp., Boulder, Colorado, U.S.A.
D. V. Camin and V. GrassiPhysics Department of the University and INFN, Milan, Italy
ASTRO-E Preamp Assembly
~1.2 K
~120 K
~18 K
The Problem
• Sensor at ~1 K, Preamplifier at ~100 K
• Long Wires– Parasitic capacitance and resistance– Microphonics– EMI pickup
• Heat Transfer to Sensor
• Extra Power
• Mechanical Complexity
A Solution
• A Transistor That Can Operate at ~1 K
A Solution
• A Transistor That Can Operate at ~1 K
• We Proposed the Ge JFET (Junction Field-Effect Transistor)
Technical Goals for Ge JFETs
• Operate at Any Temperature, ~1 – 300 K
• Very Low Low-Frequency Noise– Equal to best Si JFETs at optimum temp (~120 K)
• High Input Resistance/Low Input Current
• Tailorable Input Capacitance
• Low Power
• Integrable
• Available, Standard and Custom
Why Ge?
• Ge JFETs Operate Well to Lowest Temperatures (~1 K)
• Both n-Channel and p-Channel JFETs
• Texas Instruments Ge JFET
• Ge Is an Elemental Semiconductor
• Ge Technology Is Sufficiently Developed
S Gf D
N Epitaxial LayerP+ ImplantN+ Implant
Gb
P+ Ge Substrate
Passivation
Au-Sb Ti-Au
Backside Metalization (Au)
Ge JFET Cross-Section (n-channel)
~1 mm
Ge JFETs
Conduction vs Temperature
0
0.5
1
1.5
2
2.5
3
3.5
0 50 100 150 200 250 300
Temperature, T (K)
Si JFET (U310)
Si JFET (2N4416)
I (300)dss
dss
I (T)
Conduction vs Temperature
0
0.5
1
1.5
2
2.5
3
3.5
0 50 100 150 200 250 300
Temperature, T (K)
Si JFET (U310)
Si JFET (2N4416)
I (300)dss
dss
I (T)
Ge JFET, Vds = 0.5 V
Conduction vs Temperature
0
0.5
1
1.5
2
2.5
3
3.5
0 50 100 150 200 250 300
Temperature, T (K)
Si JFET (U310)
Ge JFET, Vds = 1.0 V
Si JFET (2N4416)
I (300)dss
dss
I (T)
Ge JFET, Vds = 0.5 V
DC Characteristics
DC Characteristics - 4 K
0
2
4
6
8
10
12
0 1 2 3 4 5
Drain-source voltage, Vds (V)
Vgs = 0 V
Vgs = -1.0 V
DC Characteristics
0
2
4
6
8
10
-2 -1.5 -1 -0.5 0 0.5
Gate-source voltage, Vgs (V)
300 K
77 K
4 K
10-13
10-11
10-9
10-7
10-5
10-3
10-1
-10 -8 -6 -4 -2 0
Gate-source voltage, Vgs (V)
Ig, 77 & 4 KId, 77 K
Ig, 300 K
Id, 4 KId, 300 K
DC Characteristics
Noise Characteristics
Noise Voltage - 77 K
1
10
100
1000
1 10 100 1000 104 105
Frequency (Hz)
518B, 520B, 807B, 809B
Id = 330 uA, Vds = 1.2 V
Noise Voltage vs Power - 77 K
1
10
100
1 10 100 1000 104 105
Frequency (Hz)
A54G 77 K
1.2 V x 17 uA (20 uW)
1.2 V x 1 mA (1.2 mW)
1.2 V x 330 uA (400 uW)
1
10
100
10 100 1000
10 100 1000
1 Hz
1, 10, 100 kHz
100 Hz
10 Hz
Power (ID x 1.2 V) (uW)
ID-1/4
Drain current, ID (uA)
Noise Voltage vs Power - 77 K
1
10
100
1000
1 10 100 1000 104 105
Frequency (Hz)
40 K
24 K
Noise Voltage vs Temperature
1
10
100
1000
0 50 100 150 200
Temperature (K)
100 kHz
1 Hz
100 Hz1 kHz
10 Hz
10 kHz
Noise Voltage vs Temperature
Noise Voltage - 4 K
1
10
100
1000
1 10 100 1000 104 105
Frequency (Hz)
n-channel
p-channel
Summary
• Successfully Fabricated Ge JFETs, n- and p-Channel
• Provided Evaluation Ge JFETs to Potential Users
• DC Characteristics Good at All Temperatures down to 4 K
• Turn-On Threshold at 4 K (T<~20 K)
• Achieved Low Noise down to ~30 K
• Noise Higher than Desired at 4 K
Plans
• Adjust Parameters to Extend Low Noise to ~1 K
• Reduce Noise at All Cryogenic Temperatures– Match that of Si JFETs at higher temperature
• For Both n- and p-Channel