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Direct Paper Metallization New Applications with Added Overt and
Covert Security Coding
Professor Nadir A.G. Ahmed
Idvac Ltd.Greenheys, Manchester Science Park
Pencroft Way, Manchester M15 6JJ, EnglandTel: +44(0)161 868 0088Email: [email protected]
www.idvac.co.uk
Company overview
Established in 2004Established in 2004 Private owned- independentPrivate owned- independent StrongStrong links with UK top links with UK top
universities.universities. Advanced Holographic ProductAdvanced Holographic Product
Development.Development. Process Retrofits.Process Retrofits. Feasibility Study.Feasibility Study. ConsultingConsulting Vacuum Training courses, PatentVacuum Training courses, Patent
search, etc.search, etc.
Advanced Materials
Development University LinksAdvanced Vacuum
Coating Processes
New Holographic Product
Advanced Laser
Etching Technology
Idvac Innovation
Advantages of Using Paper
Low Cost for Mass Production. Organic Substrate; Environmentally- Friendly;
Biodegradable, Recyclable. Flexible. Paper is porous, hydrophilic cellulose fibres; suitable
for many products including chemical sensors. Can be manufactured with different grades. Can be formed easily into different shapes. Fast inkjet printing for special products. Paper can be Hydrophobic by special treatment. Dielectric constant close to air; suitable for embedded
RFID.
Metallized Paper Market
Labelling Cigarette Wrap Product Decoration and Identification Smart Paper RFID Holographic
Types of Paper Metallization
Direct Metallization Paper is coated with primer then directly metallized
inside vacuum web metallizer.
Transfer Metallization Polymer film with a release layer is metallized then
metallization is transferred onto paper coated withadhesive.
Advantages & DisadvantagesDirect Metallization
Paper is metallized directly. More economical. Paper can be embossed before or after metallizing. Security coding can be added before or after metallizing. Can provide barrier properties to paper. Good for paper thickness up to 90gsm. Can be metallized with different materials. Can be laser etched for micro-coding
Paper
Base CoatEmbossingAluminium
Advantages & DisadvantagesTransfer Metallization
Good for thick paper board (>90gsm). More expensive; requires another carrier film. Requires extra de-lamination and adhesive Equipment. Release coat left on surface may affect laser etching.
Paper
PET
PrimerAdhesiveAluminiumRelease Coat
Delamination
Factors Affecting Direct Metallizing
Paper Quality Surface Roughness. Moisture Content. Thickness.
Metallizer Winding System Special design for paper thickness>90gsm. Possible web breaks.
Heat of Metallization Coating Thickness. Web Speed.
Vacuum Pressure High Vacuum . Fast Pumping Speed.
Security Elements in Holograms
Covert Overt Covert
UV Visible IR
UV pigments
UV fibres
Holograms
Colour Shift
Nanotext, Microtext
Demetallizing
Printed Security Codes
IR Ink
IR pigments
Examples of Embedded Coding
Paper
Base CoatEmbossingAluminium
Top Coat
Paper
Base CoatEmbossingOptical CoatingTop Coat
Covert Coding
Covert Coding
1
2
Requirements for Special Holographic Labels
Durable against Moisture. Durable against Special Chemicals. Durable Lustre. Embedded Security Coding.Example:Packaging of Detergent, Bottles, Chemicals, etc.Metallizing Materials:Chrome AlloyTransparent Oxide on top of Metallized Film
Colour Shift Using Vacuum Coatings
0
10
20
30
40
50
60
70
80
90
450 500 550 600 650 700 750 800
Wavelength, nm
Refl
ecta
nce %
(arb
it. valu
es)
Laser DeMet of Paper
Metallized Paper can be Laser DeMet
Can be used to etch Al, Cu, Ni and other materials
Low power Lasers focussed inside optical fibres are usedfor industrial applications.
Logos, characters and bar codes; size <0.1mm
Direct demetallizing with no mask requirement
Very fast demet speed.
Laser pulse within 10 µs with marking time<20ms
Can be installed on a web converting machine
Possible Metallization on Paper
Aluminium, Copper, Chrome Alloy, Nichrome, TinMetal Coatings
Oxides
Silicon Oxide, Metal Oxide
Sulphides
Zinc Sulphide
Examples of Smart Paper
Bioactive paper→ Biosensors. RFID Paper Tags→ UHF (860MHz-
955MHz). Photonic Paper→ Rewritable Paper
Display. Electrochemical Paper→ Thin Paper
Battery. Electronic Devices → Paper Transistor
The Next 20 Years
Environmental concern will increase demandfor paper as organic, biodegradable substrates.
More Integration of Holograms with smartdevices using paper as a substrate.
Advanced technologies of embedding covertcoding within paper fibres. This will includenano and laser technologies.
Developments of Smart Interactive PaperHolograms .
Conclusions
Paper is rediscovered as a unique material forlow cost security, diagnostic andenvironmental sensors.
Embossed paper can be directly metallizedwith different overt materials.
Covert coding can be embedded within paperholographic structure.
Smart holographic devices can be made onpaper substrate.