HPC Facility Designing for next generation HPC systems Ram Nagappan Intel Final

HPC Facility: Designing for next generation HPC systems

Ramkumar Nagappan

System Architect

Technical Computing Group System Architecture and Pathfinding

Intel

May 11, 2015

6th European workshop on HPC centre infrastructures, Stockholm, Sweden

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Intel, Xeon and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.

*Other names and brands may be claimed as the property of others

Copyright © 2014 Intel Corporation. All rights reserved.

Notices

2

Optimization Notice Optimization Notice

Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice. Notice revision #20110804

* Other names and brands may be claimed as the property of others. Copyright © 2014 Intel Corporation. All rights reserved.

Agenda • Exponential Growth in Performance

• Trends • Cores & Threads • Power Efficiency • Process Improvement

• Integration to increase system performance

• I must need a huge datacenter –right? • Quick Survey • How many Square Meter/PFlop?

• Past, Present & Future

• Power Delivery Challenges in the Horizon

• Technologies to measure component/node power

• Summary

4

Exponential Growth in Performance Advancement in key areas to

reach Exascale: • Microprocessors • Fabrics • Memory • Software • Power Management • Reliability

5

Source:Top500.org

Trends: Cores and Threads per Chip

6

Source: SICS Multicore Day’ 14

7


8


9

More Integration

3+ TFLOPS1 In One Package

Parallel Performance & Density

On-Package Memory:

up to 16GB at launch

5X Bandwidth vs DDR47

Compute: Energy-efficient IA cores2

Microarchitecture enhanced for HPC3

3X Single Thread Performance vs Knights Corner4

Intel Xeon Processor Binary Compatible5

1/3X the Space6

5X Power Efficiency6

. . .

. . .

Integrated Fabric

Intel® Silvermont Arch. Enhanced for HPC

Processor Package

Source:SC’14

… Knights Landing (Next Generation Intel® Xeon Phi™ Products)

Jointly Developed with Micron Technology

System level benefits in cost, power, density, scalability & performance

Higher Performance & Density A formula for more performance….

advancements in CPU architecture

advancements in process technology

integrated in-package memory

integrated fabrics with higher speeds

switch and CPU packaging under one roof

all tied together with silicon photonics

= much higher performance & density

11








• Summary

12

I must need a huge data center – Right?

13

Quick Survey In what year, do you expect to see “rack” level performance exceed 1 PF? a) 2016

b) 2018

c) 2020

d) 2022

14

Note: 2018 is not an official Intel projection

Designing for the future What does “Large” mean?

A great example of reduced footprint with an equal performance:

15

Credit: Thanks to LRZ - Helmut Satzger for the video

https://www.youtube.com/watch?v=qirUUlXR6XQ

16

How many Sq mt Per PFlop? System Feature

LRZ Phase 1 Details

Year 2012 Performance Pflop/s

3.2

# of Nodes 9216 Power 2.3 MW Facility area for Compute Clusters

~546 sq mt

How many Sq mt Per PFlop

171

LRZ SuperMUC System

Source: lrz.de

How many Sq mt Per PFlop? System Feature

LRZ Phase 1 Details

LRZ Phase 2 Details

Year 2012 2015 Performance Pflop/s

3.2 3.2

# of Nodes 9216 3096 Power 2.3 MW 1.1 MW Facility area for Compute Clusters

~546 sq mt

~182 sq mt (*Estimated)


171 57

LRZ SuperMUC System

Source: lrz.de

Phase 2

Phase 1

How many Sq mt Per PFlop?

System Feature

LRZ Phase 1 Details

LRZ Phase 2 Details

Trinity Details

Year 2012 2015 FY 2015/16

Performance Pflop/S

3.2 3.2 42.2

# of Nodes 9216 3096 >19,000 (Haswell, KNL)

Power 2.3 MW 1.1 MW < 10 MW

Facility area for Compute Clusters

546 sq mt ~182 sq mt (*Estimated)

< 483 sq mt


171 57 11.4

LRZ SuperMUC System

Source: lrz.de trinity.lanl.gov

Phase 2

Phase 1

How many Sq mt Per PFlop?

System Feature

LRZ Phase 1 Details

LRZ Phase 2 Details

Trinity Details

Aurora Details

Year 2012 2015 FY 2015/16 2018

Performance Pflop/S

3.2 3.2 42.2 180

# of Nodes 9216 3096 (Haswell)

>19,000 (Haswell, KNL)

>50,000 KNH

Power 2.3 MW 1.1 MW < 10 MW 13 MW

Facility area for Compute Clusters

~546 sq mt ~182 sq mt (*Estimated)

< 483 sq mt ~279 sq mt

How many Sq mt Per PFlop 171 57 11.4 1.5

Source: lrz.de

LRZ SuperMUC System

Phase 2

Phase 1

Past 2015/16 Future

Note: not an official Intel projection

Significant improvement in Power efficiency

System Feature

LRZ Phase 1 Details

LRZ Phase 2 Details

Trinity Details

Aurora Details

Year 2012 2015 FY 2015/16

2018

Performance -Pflop/s

3.2 3.2 42.2 180

# of Nodes 9216 3096 >19,000 (Haswell, KNL)

>50,000

Power 2.3 MW 1.1 MW < 10 MW 13 MW

System Power Efficiency (GFlops/Watt)

1.4 2.9 4.2 13.8

LRZ SuperMUC System

Past 2015/16 Future

Source: lrz.de

Phase 2

Phase 1

Note: not an official Intel projection

33 PF (#1 now) System in 2018 timeframe

•What is the floor space and power required to build today’s No.1 System in Top 500 list in 2018?


• What is the floor space and power required to build today’s No.1 System in Top 500 list in 2018 • Based on earlier projections/estimations

• Very High Density • Facility area for Compute Clusters is ~50 Sq mt

• Power – ~2.4 MW

Very High Density





• If we assume lower rack density • 50% lower rack density – High Density

• Facility area for Compute Clusters is 100 Sq mt

Very High Density

High Density





• If we assume lower rack density • 50% lower rack density – High Density

• Facility area for Compute Clusters is 100 Sq mt

• 75% lower rack density – High to Medium Density • Facility area for Compute Clusters is 200 Sq mt

Do we still need a large data center?

High Density

Very High Density

Medium Density

I must need a huge data center – Right?

26

• Facility area for Compute Cluster does not have to be huge.

• Don’t forget • If Storage is going to be large then

you will need additional floor space. • If you are going to be using Xeon

instead of Xeon Phi then you may need additional floor space.

High Density Data center - Challenges • Performance density

• PF / rack – smaller HPC floor space

• Weight density

• 500 lbs/sf ~ 2500 kg/m2 – Likely needed

• Power density

• >100 kW / rack fed with 480Vac or 400Vac feeds

• Pipe size

• ~40 mm to/from each rack

• Ratios – Raised Floor vs Infrastructure Space

• m2/m2 < 1

27








• Summary

28

Power Delivery Challenges in the horizon Maximum Power Cap • Ex: 10 MW

• Several reasons • Peak Shedding

• Reduction in renewable energy

Power rate of change • Ex: Hourly or Fifteen minute average in platform power should not

exceed by X MW.

Controlled Power Ramp up/down

Power Monitoring at Component, Node, Rack/Cabinet, System

29

How to measure node/Component power?

30

Intel Xeon/Phi Component Level Energy Measurement

31

RAPL (Running Average Power Limit) to Monitor and Limit – CPU and Memory Power

Intel® Node Manager Power Telemetry

• Total platform power

• Individual CPU, Memory and Xeon Phi power domains

Thermal Telemetry

• Inlet & Outlet Airflow temperature

• Volumetric Airflow

Utilization Telemetry

• Aggregate Compute Utilization per sec

• CPU, Memory and I/O Utilization Metrics

Power Controls

• Power limit during operation

• Power limit during boot

BMC

Intel® Node Manager Firmware embedded in PCH’s “Manageability Engine”

Console (e.g. Intel DCM)

Xeon

Xeon

PCH (ME)

SUMMARY • Trends

• Continuous growth in Cores & Threads

• Continuous & significant improvement in Power Efficiency

• More Integration to improve performance and efficiency

• Designing for the future

• It’s going to be Large! kg/rack, kW/rack, perf/rack, power ramps and peak, pipe sizes, m2/m2

• It may get Smaller! Cluster footprint

• Power Challenges in the horizon

• Power Limiting, Power rate of change

• Technologies to measure component and Node power

33

34

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm

Intel, Intel Xeon, Intel Xeon Phi™, Intel® Atom™ are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States or other countries.

Copyright © 2014, Intel Corporation

*Other brands and names may be claimed as the property of others.

Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase.The cost reduction scenarios described in this document are intended to enable you to get a better understanding of how the purchase of a given Intel product, combined with a number of situation-specific variables, might affect your future cost and savings. Nothing in this document should be interpreted as either a promise of or contract for a given level of costs.

Intel® Advanced Vector Extensions (Intel® AVX)* are designed to achieve higher throughput to certain integer and floating point operations. Due to varying processor power characteristics, utilizing AVX instructions may cause a) some parts to operate at less than the rated frequency and b) some parts with Intel® Turbo Boost Technology 2.0 to not achieve any or maximum turbo frequencies. Performance varies depending on hardware, software, and system configuration and you should consult your system manufacturer for more information.

*Intel® Advanced Vector Extensions refers to Intel® AVX, Intel® AVX2 or Intel® AVX-512. For more information on Intel® Turbo Boost Technology 2.0, visit http://www.intel.com/go/turbo

All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice.

Optimization Notice

Intel’s compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors.

These optimizations include SSE2®, SSE3, and SSSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not

manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel

microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.

Notice revision #20110804

Legal Disclaimer

* Other names and brands may be claimed as the property of others. Copyright © 2014 Intel Corporation. All rights reserved. 35

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HPC Facility Designing for next generation HPC systems Ram Nagappan Intel Final