INDIANAPOLIS • AUGUST 29, 2019 ENVISION

REGISTER TODAY!Contact:

JOIN USFuture Electronics invites you to attend one of the mostadvanced hands-on interactive learning events in the region.Hear from technology specialists, learn about new technologies,products and meet with electronic component suppliers.

EVENT OVERVIEWWalk off the street and into a block diagram where you willhave the opportunity to walk through various technology areasin an open venue and see how technologies integrate together.

Walk through the Microcontroller, FPGA section right intothe power and power supply section. Wander through theinterconnect into a Bluetooth module, Lora, antenna andoff into the sensors, memory, circuit protection and switches.

Not just a event full of booths, but a technology layoutto boost your knowledge and see the experts in manydifferent technologies and how everything connects together.

The event will include over 12 technology classesincluding 2 hour hands on workshops as well as1 hour technology discussions.

Over 40 technology booths and more than 15 differenttechnologies laid out into the block diagram event.

Keynote speakers on stage during a delicious lunch whereyou can hear experts discussing technologies and wherethese are applicable and how they can help you.

WHERE

The IMMI Conference Center18880 N. East StreetWestfi eld, IN 46074

Date: Thursday, August 29th, 2019

RSVP: Register by August 23rd, 2019

AGENDADate: Thursday, August 29th, 2019

Registration: 8:00 a.m. to 8:30 a.m.

Seminars: 9:00 a.m. to 4:00 p.m. workshop and seminar shedule to be provided separatelyEngineering andSupplier booths: 8:30 a.m. to 4:30 p.m. detailed schedule to be provided separately

Keynote Speakers: 11:30 a.m. to 1:30 p.m.

Prize Drawings: On stage throughout the event

Meals: Bagels/muffi ns/fruit and coffee served in the morning

Lunch: 11:30 a.m. to 1:30 p.m.

Jason Bowden at [email protected] for event online at:https://futureelec.wufoo.com/forms/future-electronics-tech-day-indianapolis/

www.FutureElectronics.com

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INDIANAPOLIS • AUGUST 29, 2019

WALKING THROUGH THE BLOCK DIAGRAM

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SCHEDULES & SEMINAR DESCRIPTIONSWORKSHOPS

TIME ROOM 6 ROOM 19

9:00AM - 11:00AM STMicroelectronics ON Semiconductor

11:30AM - 1:30PM Lunch

2:00PM - 4:00PM NXP Microchip

SEMINARS

TIME ROOM 5 ROOM 18

9:00AM - 10:00AM Melexis Cypress

10:30AM - 11:30AM Murata Semtech

11:30AM - 1:30PM Lunch

1:30PM - 2:30PM Renesas Littelfuse

3:00PM - 4:00PM Epson Doug Diedrick

KEYNOTE SPEAKERS

11:30AM - 12:00PM ON Semiconductor

12:00PM - 12:30PM Microchip

12:30PM - 1:00PM STMicroelectronics

1:00PM - 1:30PM NXP

MURATA: IoT - Murata’s Wireless Module and Sensing SolutionsLearn how to create practical battery powered sensor applications using products from Murata, including Wi-Fi and BT modules, best-in-class high resolution sensors and batteries. Customers will learn how to implement real-time monitoring and data collection of their systems in the field, making their companies more efficient and cost effective. Murata modules enable world-class solutions for the transportation, industrial, medical, and energy IoT market space. The portfolio includes: actuators, shock, combo acceler-ation and gyro, inclinometer, barometric pressure, 3D AMR, rotary position, PIR, ultrasonic, thermistors and ballistocardiography (BCG) sensors, offering numerous options in supporting connected device measurement and control.

RENESAS: Energy Harvesting in Embedded Systems is Now a RealityExclusive SOTB technology (Silicon On Thin Buried Oxide) from Renesas breaks the previous trade-off between getting either low active current or low standby current consumption – previously you could only choose one. With SOTB, you get both. This is a recipe for very capable, extreme low power applications that run from harvested ambient energy – no batteries required. With integration of IDT sensor technology, a highly integrated system implementing humidity, position, gas, and flow can developed to meet unique IoT endeavors.

LITTELFUSE: Balancing Power Electronics Performance vs Cost in Today’s Designs• Solid State Relay – what’s possible with a board mounted device today

and new Latching relay technology• Mosfets – Trench/planar/linear/ultrajunction-benefits and solutions• IGBTs – Trench technology-where it makes sense vs SiC-power level

and applications discussion• SiC – Overview and mixed technology benefits• Diodes – SiC and Si-overview and use in inverter/PFC/input-output bridges• SCRs – The rugged older brother of IGBTs-what’s available and where

is it going

DOUG DIEDRICK: Supply ChainFuture Electronics has always been the supply chain leader with its custom supply chain solutions and bonded inventory programs. Future is serious about having the parts you need in the right quantities. Future’s new small packaging program is perfect for your small-batch (prototype, NPI and HMLV) production. Come see how Future invested in systems, inventory, and processes to provide cut tape and mini-reels of the highest quality in the industry. During this session we will:• Provide details on the small packaging program• Demonstration on how to search for and buy cut tape and mini-reels• Highlight some of the ongoing improvements to Future’s website

EPSON: Epson Crystals, Oscillators, Time Clocks and MicrosThe #1 worldwide producer of timing devices will provide an over view of their manufacturing capabilities and the latest product introductions. Mr. Paul Lee, Product Marketing Manager for Epson Timing Products will present a brief overview of the products and then specifics on Epson’s latest smaller size, lower power timing devices. Crystal, oscillators, TCXO, VCXO, real-time clocks and how to optimize the features in various applications.

SEMINARS:MELEXIS: Hall Effect Embedded SensorsThe use of sensors in embedded applications is growing. In every market, sensors enable new and exciting ways to improve quality, sustainability, and automation. In this presentation, we will discuss Hall Effect Technologies and their roles across these different markets. We will focus on the key technical aspects of using these technologies and how they can improve on existing implementations today.

CYPRESS: Designing BLE Mesh ProductsDescription: Session will include a technical overview of the BLE Mesh Protocol, detailed description of the Cypress devices used for BLE Mesh, overview of a typical Mesh firmware application, and a demonstration of provisioning and working with a BLE Mesh.

SEMTECH: LoRa – The DNA of IoTLoRa – The WW Standard for connecting sensors long range, low power, low cost. Next-Gen LORA is here with improved reach (miles), the lowest power, and secure networks for low data rate IoT communication. The LoRa ecosystem provides many choices for developing private Star topology network or access to one of the many LoRa public networks that have been established Worldwide. Come see how this compares to other wireless technologies, and see how easy a LoRa network is to implement. Discussion includes how to achieve unmatched receiver sensitivity, security, battery life and cost efficiency. Use case examples will be provided.

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WORKSHOP & KEYNOTE SPEAKER TOPICSWORKSHOPS (2 Hours, Hands-On)ON SEMICONDUCTOR: The Transition of Traditional AC Motors of Every Horse Power and Topology to More Efficient Electronically Controlled Commutated Motors, Including Brushless DC (BLDC) Motor Control for Low to Mid Horse Power as Well as Variable Frequency AC Motors for Higher Horse Power

This workshop will answer questions about what is the main difference between AC motors variations as well as DC motors and variations. This workshop will also answer questions on which technology is best suited to drive these motors to their highest efficiency, as well as to set design guide-line parameters for best cost/performance ratio. Many different topologies will be discussed and PROS and CONS of each will be highlighted. Notably, ON Semiconductor will point out that using only existing technology, we can accomplish HUGE energy efficiency savings in this arena as well as reducing footprint and overall size of motors as well as driver solutions.

MICROCHIP: Secure Cloud Edge ComputingSecurely collecting and controlling the physical world data. How do you secure the physical edge of the cloud? Allow us to show you what a secure Cloud Edge computing solution is and the possibilities of what you can do. We will also be showing how you can secure the physical world (IoT nodes) touchpoints as part of complete secure IoT solution.

NXP: NXP’s Arm Cortex-M MCU Portfolio This class will provide an overview of NXP’s broad and scalable MCU portfolio and give details on which product families are available for different markets and use cases. It will also give an overview of the unified tools, software and solutions that enable the portfolio, as well as a demo presentation across the MCU portfolio.

STMICROELECTRONICS: Developing with Sensors Made SimpleAbstract: Sensors are evolving and proliferating in Smart Systems. This session will look at the latest trends in sensors and how to use ST’s Ecosystem of the STM32CubeMX and the X-CUBE-MEMS1 software pack to start a new sensor design. You will learn how to set up the sensors, log sensors data and leverage embedded smart sensor functions.

KEYNOTE SPEAKERSON SEMICONDUCTOR: Electric Motors – Are We Setting the Right Priorities to Address our Energy Challenges

MICROCHIP: Why Security in an IoT World.

STMICROELECTRONICS: IoT Focusing on Intelligent Mode

NXP: NXP’s Portfolio and Which Technology Areas NXP Sees as a Focus

Documents

INDIANAPOLIS • AUGUST 29, 2019 ENVISION