High frequency applications are gettingmore attractive thanks to two mainadvances that have developed and spreadthe technology in several segments,including consumer, industrial, andautomotive. The advances are in silicontechnology, including RFCMOS andBiCMOS, and in packaging includingAntennae-on/in-Packages (AoPs/AiPs) andSystem-in-Packages (SiPs). Today, highfrequency technology can be found on themarket either used for communication in5G technology or for Human MachineInteraction (HMI). This report analyzes theHMI technology integrated in the latestflagship smartphone from Google, thePixel 4XL.

Using a chipset coupling two componentsfrom different companies, thesmartphone has various HMI features.These include answering phones with aswipe through the air and turning thevolume up and down with squeeze androtation of the hand. Many gestures canbe implemented thanks to a 60 GHz radarsensor from Infineon and a Digital SignalProcessing (DSP) from Knowles, whichhave finally made this possible on asmartphone.

The radar sensor relies on Infineon’sAutomotive radar knowledge and latest0.13 µm SiGe technology development, itsB11HFC process. Using AoP technology,the radar features one Tx and three Rxchannels directly on top of the MonolithicMicrowave Integrated Circuit (MMIC). Theradar sensor captures and follows the

hand gesture. The DSP, integrated in theSystem-on-Chip component from Knowles,processes received data are like soundwave signals.

The report includes a full investigation ofthe DSP component and the radar sensor.It features a detailed study of thestructure of the AoP and of the newimplementation of the SiGe BiCMOStechnology, including die analysis, processand a PCB cross-section. It contains acomplete cost analysis and a selling priceestimation of the system. Finally, itfeatures a technical comparison with theprevious generation of SiGe transistor,process name B7HFC200, from Infineonand the direct-ToF sensor fromSTMicroelectronics, model VL6168X and acost comparison with the AoP systemfrom Texas Instruments, modelAWR1843AoP.

COMPLETE TEARDOWN WITH

• Detailed photos and cross-sections

• Precise measurements

• Material analysis

• Manufacturing process flow

• Supply chain evaluation

• Manufacturing cost analysis

• Estimated sales price

• Physical comparison with d-ToFVL6180X from STM

• Cost comparison with the AWR1843AoP from TI

Deep dive into the first Human Machine Interaction (HMI) system with Infineon’s60 GHz Radar On-Chip AoP BGT60TR13C and Knowles’ DSP IA8508.

REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT

Title: Google Pixel 4XL Gesture Recognition Chipset

Pages: 173

Date: April 2020

Format: PDF & Excel file

Price: EUR 3,990

Reference: SP20519

Infineon’s Radar Technology and Knowles’ Machine Learning drive Google Pixel 4XL Gesture Recognition

IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY

TABLE OF CONTENTS

Overview/Introduction

Company Profile and Radar and HMI Technology

Google Pixel 4XL Teardown

Market Analysis

Physical Analysis

• Physical analysis methodology

• Module analysis

Module view: Dimensions, marking, integration and block diagram

• DSP Component and Antenna-on-Package analysis

Package view and dimensions

AoP Package X-Ray: overall view, PCB routing, antenna structure and cross-sections

Package opening and cross-section: Dimensions and RDL/PCB

Package process analysis

• DSP and MMIC die analysis

Die view and dimensions

MMIC RF Block IDs: VCO, ADC and Rx/Txchannel

Die delayering and main block IDs

Die process and cross-section

MMIC SiGe transistor, doping structure and CMOS integration

Physical Analysis Comparison

• Infineon’s B7HFC200 vs. B11HFC

• STM VL6180X vs. IFX BGT60TR13C

Manufacturing Process Flow

• Die fabrication unit: DSP, MMIC

• BiCMOS process flow

• DSP and AoP packaging fabrication unit

Cost Analysis

• Overview of the cost analysis

• Supply chain description

• Yield hypotheses

• Die cost analyses: DSP, MMIC

Front-end cost

Wafer and die costs

• Package Cost Analysis

DSP and AoP package cost

AoP cost by process step

• Final test and Component cost

Estimated Price Analysis for the DSP IA8508 and the Radar Sensor BGT60TR13C

Cost Analysis Comparison

• IFX BGT60TR13C vs. TI AWR1843AoP

AUTHORS

INFINEON'S RADAR TECHNOLOGY AND KNOWLES' MACHINE LEARNING DRIVE GOOGLE PIXEL 4xl GESTURE RECOGNITION

RELATED REPORTS

Dr. Stéphane Elisabeth has joined System Plus Consulting's team in 2016. He has a deep knowledge of Materials characterizations and Electronics systems. He holds an Engineering Degree in Electronics and Numerical Technology, and a PhD in Materials for Microelectronics.

Guillaume Chevalier has joined System Plus Consulting in early 2018 to perform physical analyses. He holds a two-year university degree in technology of physical measurements and instrumentation technics.

Qualcomm’s First 5G mmWave Chipset: SDX50M and QTM052A study from modem to antenna of the very first compact-form 5G millimeter-wave chipset for handset applications.September 2020 - EUR 3,990*

Texas Instruments AWR1843AoP 77/79 GHz Radar ChipsetWorld’s first 76-81 GHz automotive single-chip radar in a System-on-Chip device with integrated Antenna-on-Package.August 2019 - EUR 3,990*

Acconeer A111 60 GHz Pulsed Coherent RadarRadar chip in Antenna-in-Package configuration.April 2019 - EUR 3,990*

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