Innovative Solutions for Automotive Applications and beyond · Corporate Profile Electronic Materials Innovative Solutions for Decorated IME ... UV Dielectrics with best in class

Innovative Solutions for Automotive Applications and beyond

IMSE Innovation Day, Tactotek, Oulu, Finland

Sept 18, 2018

Frank Eirmbter, Business Development Manager

Erika Rebrosova, Electronic Materials Technology Manager

Sun Chemical/DIC Corporate Profile

Electronic Materials

Innovative Solutions for

Decorated IME

Our Presence in

Automotive Applications

IMSE - Lessons Learned

Outline

3Copyright © 2018 Sun Chemical Corporation.

The world’s leading producer of inks, coatings and pigments

Sun Chemical’s global presence, combined with our parent

company DIC Corporation, allows for the delivery of local

service and support customized to your market.

Employees

Countries

Subsidiaries

900 Megatons

of ink/year


Sun Chemical Advanced Materials Groupby Product Groups

Printing Inks & Coatings

Performance Pigments

Advanced Materials

Polymers Compounds

Liquid Compounds

Solid

Compounds

Application Materials

Fine Chemicals

(Non-Pigment)

Sun Chemical’s global presence, combined with advanced technologies and products from Sun & DIC, allows for the delivery of local service and support with

Resins for Auto

Coatings,

Adhesive Resins

Electronic

Materials

Molding

Resins, LDS

for MID

PSA Tapes

and Foams

Products for

automotive

applications

High-Tech

Graphics

High

performance

pigments for

automotive

paints


High Performance Pigments

Ultrafine-pigment technology is a significant advancement in transparency, chroma and

strength that allows formulators to develop fresh metallic colors unachievable with conventional high performance pigments.

Sun Chemical’s innovative and proprietary milling

technologies make available both liquid and solid

dispersions to produce vibrant color in a variety of base

materials including UV, water, solvent and eco-solvent

applications.


High Performance Graphics

Products for high tech automotive applications

• In-Mold Decorated Parts

• Graphic Overlays

• Clusters and Dials

• Nameplates

• Membrane and Capacitive Touch Switches

Features• Formable

• IML/IMD, compatible with IME inks

• Panel display inks used for automotive and

appliance applications, pass OEM specifications

• Transparent ink systems for window

applications

• UV curable hard coats, formable

• Designed for use with digital inks

• Special non yellowing whites and clears

• Special bending and color matching systems for

matching Hi-Tech colors, non Pantone OEM

colors

• Solvent based

• UV-Curable

• Now also UV-LED curable

high tech graphics!


DaiTac® Tapes Automotive Interior and Electronics Applications

1 2 3

4

567

8

Wide range of tapes from single and double coated PSA tapes,

through electrically and thermally conductive to low VOC & low

odor technologies, and beyond.


PPS Molding Resin

8

① Thermo-Inlet for Engine and HV cooling system （Z-650-T6), Electric Water Pump Body

② Intelligent Power Module （Z-650-S1）, Electric Flow Sensor （Z-650-B2), Film Condenser Body

③ Generator Motor Insulator （Z-650-B2）

④ Drive Motor Insulator⑤ Battery (Now NiMH type → Li-ion type: Gasket, Holder）

Other PPS Applications (Ignition Coil, ECU, Sensors,…)

Toyota Prius

DIC Corp. has 27% global market share,

majority goes into Automotive Applications

DIC’s customized PPS products are designed to replace metals and thermosetting polymers in vehicles, powertrain, coolant system and electrical/electronic components where alternatives to metal have been a problem.


Electronic Materials

LTCC materials for

oxygen sensors and

other hybrid

electronics

Materials for rigid and flexible PCB

Materials for printed electronics

• Solvent based conductive and insulating inks

• High performance conductors

• UV-Curable and UV-LED dielectricsSolder masks, legend inks, etch and plating resists

Innovation

In-mold Electronics

Integrating 2D printed electronics inside

3-dimensional (3D) electronic devices with conventional components to

create smart surfaces through molded structures in one part.

In-mold Decoration

Printed Electronics


• UV curable or Solvent based IMD inks

• Electronics inks for circuitry

• Adhesion promoter as needed

Label Printing

• Printing of ECA

• Assembly of LEDs and other state components for circuitry

• Trimming/punching

Component assembly

• High pressure forming or vacuum thermoforming to give a desired 3D form.

• Trimming

3D forming

• Fusing the label with injected plastic

Injection molding • Flex tail or header

connection

• PCB or FPC attachment

• Inspection and testing

Final Assembly

Process Flow for Decorated IME and Material Requirements

Close collaboration with partners and understanding of each process step is critical to execute

projects successfully

Compatibility with

substrate/other inks

Compatibility with

substrate/other inks

Fast dryingFast drying

CTECTE

Compatibility with SMT

process

Compatibility with SMT

process

FormabilityFormabilityCost effectiveCost effective

Thermal conductivity Thermal conductivity

Electrical

conductivity/insulation

properties

Electrical

conductivity/insulation

properties

Gate wash resistanceGate wash resistance

Adhesion to resinAdhesion to resinNo outgassingNo outgassing

PrintabilityPrintability

ReliabilityReliability

Environmental

stability

Environmental

stability


Products for Injection Molded Electronics

Material Group Function Products Features

Graphic inks Decoration/information

DecoMold™ UV, Sun

Hytech™, FlexiForm™, MTG™

Series and more

Thermoformable SB and UV IMD inks for first surface and

second surface molding, ~700 blending colors, matte, glossy

and textured

Barrier layerTo planarize the surface

between IMD and IME inks SunTronic™ CXT-0826C

SB Clear planarizing layer, recommended for UV IMD

graphic labels

Silver

conductive ink

Interconnects, antenna,

electrodes

SunTronic™ Gen1 IME Silvers

AST6400, AST6500, AST6510

Gen2 silvers CXT-0820

product series

Range of silvers to deliver customizable conductivity and

formability, excellent gate wash resistance, compatible with

TC inks/film (PEDOT:PSS and CNT)

Carbon

conductive ink

Interconnects, resistors,

inhibitor of silver migration,

contact pads for connectors

SunTronic™ GST4500,

GST4210

Formable and highly effective pad overprinting for reliable

header connection

Dielectric inks

Cross-over insulation,

protective overcoat for long

elongation areas

SunTronic™ DSU4700,

DSU4800 and CXT-0826

(Clear, Blue, Green colors)

UV Dielectrics with best in class thermoformability and gate

wash resistance. SB dielectric with unmatched

thermoformability

Tie coat/

Adhesion primer

Adhesion promoter

between applique/label and

injection resin

CXT-0382, CXT-0384, DMU-

700For adhesion to co-polyester, PVC, PE, PP resins and others

Why Sun Chemical: Full solution provider from Graphic inks to electronic materials. Well embedded with IMD and

automotive value chains and existing strong partnerships with IMSE developers.

Lessons Learned


Printing a High Quality Label for IMSE

Understanding of compatibility of electronic inks with graphic inks is critical for circuit design

and maximize performance and reliability of printed circuitry.

• In general, UV IMD inks are advantageous for

their long screen life, reliable printing and fast

drying. They are VOC free, but may require

very specific care when UV curing.

• Solvent based IMD inks are often used for

their reliable adhesion to wider range of

molding resins, but their processing can be

difficult (screen life and very long drying times

required to prevent outgassing and

delamination). 0

20

40

60

80

100

120

140

160

180

PC Substrate/IME

Silver

PC Substrate/UV

IMD ink/IME Silver

PC Substrate/UV

IMD ink/Barrier

ink/IME Silver

PC Substrate/SB IMD

ink/IME Silver

Sh

ee

t R

esi

stiv

ity

[m

Oh

ms/

sq/m

il]

Graphic layers become a SUBSTRATE

for electronic inks


Black ink\AST6510\DSU4700

AST6510

Cracking

beyond 6

mm draw

0

100

200

300

400

500

600

700

0 2 4 6 8 10 12

Form

ing

(m

Ω/s

q)

draw depth of round tool (mm)

IME Cond Silver on PC

Black graphic ink under

IME Silver

Black graphic ink under

and UV IME Dielectric

over IME Silver

Effect of Ink Stack Design on Forming (AccuForm High Pressure Forming)

Forming of inks overprinted with Sun Chemical’s UV IME dielectric layer form to

deeper draws without cracking.


Gen2 IME Silvers CXT-0820 series

Pigment Silver

Binder Thermoplastic

Viscosity (Brookfield CAP @

25°C) 80 - 90 Poise

Sheet Resistivity,

mΩ/sq/mil15-100* mΩ/sq/mil

Typical Thickness

325 tpi SS mesh

400 tpi SS mesh

13-15 microns

9-11 microns

*sheet resistivity can be customized based on 3D formability

requirements.

Expanding offerings for customizable solution for printed components with excellent

gate wash resistance even for the toughest molding conditions


Telegraphing (ghosting)

• Shows after high pressure forming

• Using Male tool - high pressure of

forming pushing out the circuit to

show on top surface

• Complex topography of multilayer

structures

• Difference in hardness and thermal

behavior of IMD and IME inks.

Esthetics can be improved via ink stack design and processing.

Front surface view Back surface view

Optimized

stack

Optimized

stack


Gate Wash – fan gate (molding with PC resin)

Changing Ink Stacks Same ink stack, optimized ink processing

Correct ink stack and optimization of ink processing is critical for reliable molding

Optimized

Gate design

Maximizing circuit performance via proper positioning of critical components, optimizing

tooling, injection gate design and molding conditions for more reliable molding

Early engagement with experienced partners enables

successful execution of your IMSE projects

It takes a village!

And beyond...


[email protected]

[email protected]

Documents

Innovative Solutions for Automotive Applications and beyond · Corporate Profile Electronic Materials Innovative Solutions for Decorated IME ... UV Dielectrics with best in class