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ITRS Winter Conference 2012 Hsinchu, Taiwan
Work in Progress: Not for Distribution
1
2012 ITRS
Emerging Research Materials
[ERM]
December 5, 2012
C. Michael Garner, GNS/StanfordHiro Akinaga, AIST
Dan Herr, UNCG
ITRS Winter Conference 2012 Hsinchu, Taiwan
Work in Progress: Not for Distribution
2
2012 ERM ParticipantsHiro Akinaga AISTTsuneya Ando Tokyo Inst. Tech Nobuo Aoi PanasonicBernd Appelt ASEKoyu Asai RenesasYuji Awano Keio UnivDaniel-Camille Bensahel ST MicroKirill Bolotin Vanderbilt Univ.Bill Bottoms NanonexusGeorge Bourianoff IntelBernard Capraro IntelArantxa Maestre-Caro IntelJohn Carruthers Port. State Univ.
An Chen Global Foundry
Zhihong Chen IBM
Joy Cheng IBM
Byung Jin Cho KAISTLuigi Colombo TIGeraud Dubois IBM Catherine Dubourdieu Inst. Nanotech. de LyonNathan Fritz Intel
.
.
Michael Garner GNS/ Stanford Michael Goldstein IntelWilfried Haensch IBMDan Herr UNCG/JSNNChiaHua Ho NDLJim Hutchby SRCBerry Jonker NRLTed Kamins Stanford U.Leo Kenny IntelChoong-Un Kim UT ArlingtonSean King IntelAtsuhiro Kinoshita ToshibaPaul Kohl Ga TechBlanka Magyari-Kope Stanford U.Ming-Hsiu (Eric) Lee MacronixYao-Jen Lee NDLLiew Yun Fook A-StarTimothy E. Long VA TechPrashant Majhi IntelFrancois Martin LETIFumihiro Matsukura Tohoku U.Nobuyuki Matsuzawa SonyJennifer Mckenna Intel
Yoshiyuki Miyamoto AISTKei Noda Kyoto UniversityYaw Obeng NISTChris Ober Cornell UnivMatsuto Ogawa Kobe UniversityKatsumi Ohmori. TOKYutaka Ohno Nagoya UniversityTomas Palacios MITSamuel Pan TSMCEr-Xaun Ping AMATJoel Plawsky RPIDave Roberts NanteroTadashi Sakai ToshibaGurtej Sandhu MicronHideyki Sasaki Toshiba NanoanalysisShintaro Sato AISTAkihito Sawa AISTBarry Schechtman INSECSadasivan Shankar IntelMatt Shaw IntelTakahiro Shinada AISTMichelle Simmons UNSWKaushal Singh AMAT.
Satofumi Souma Koube UnivNaoyuki Sugiyama TorayShin-ichi Takagi U. of TokyoMasahiro Takemura NIMSKoki Tamura TOK AmericaYoshihiro Todokoro NAISTYasuhide Tomioka AISTLuan Tran TSMCPeter Trefonas DowMing-Jin Tsai ITRIWilman Tsai Intel Emanuel Tutuc UT Austin Ken Uchida Keio Univ.Kang Wang UCLAH.S. Philip Wong Stanford U.Dirk Wouters IMECWen-Li Wu NISTShigeru Yamada IbidenHiroshi Yamaguchi NTTToru Yamaguchi NTTFu-Liang Yang NDLHiroaki Yoda ToshibaVictor Zhirnov SRCPaul Zimmerman IntelEhrenfried Zschech Fraunhofer Inst.
ITRS Winter Conference 2012 Hsinchu, Taiwan
Work in Progress: Not for Distribution
3
2012 Key Messages
• 2011 ERM Chapter will not be updated in 2012• ERM is preparing for 2013 ITRS Rewrite• Aligning with iTWG New Requirements• Planning e-Workshops• Identifying potential material transitions• Identifying support capabilities needed• Significant Challenges for all Materials
ITRS Winter Conference 2012 Hsinchu, Taiwan
Work in Progress: Not for Distribution
4
Memory Materials
• Ferroelectric Memory• Nanoelectromechanical (NEMM)• Redox RAM• Mott Memory• Macromolecular • Molecular
ITRS Winter Conference 2012 Hsinchu, Taiwan
Work in Progress: Not for Distribution
5
Extending CMOS Logic Alternate Channel Materials
Alternate Channel Materials
-n-Ge & p-III-V
-Nanowires
-Graphene
-Carbon Nanotubes
III-V Heterostructures(L. Samuelson, Lund Univ.)
A. Geim, Manchester U.
Assess
Materials Performance
Gate materials
Contacts
Interfaces
MOS
-Identify Novel Metrology & Modeling Needs
D. Zhou, USC
ITRS Winter Conference 2012 Hsinchu, Taiwan
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6
Beyond CMOS LogicMaterials & Interfaces
Assess• Ferromagnetic Materials, Dilute Magnetic Semiconductors• Complex Metal Oxides• Strongly Correlated Electron State Materials (FE, FM, FE & FM)• Molecules• Interfaces
Spin StateFerroelectric
Polarization
Negative Capacitance FET•Individual or Collective
Charge Based States Other Than Charge Only
ITRS Winter Conference 2012 Hsinchu, Taiwan
Work in Progress: Not for Distribution
7
ERM Device Material e-Workshops
• Redox RAM Materials• Deterministic and Conformal Doping• Nanoscale Contact Resistivity• Carbon Electronics (Nanotubes and Graphene)• Spin Materials & Out of Plane MTJ Materials• Strongly Correlated Electron Materials• Modeling of Complex Transition Metal Oxide
Properties
ITRS Winter Conference 2012 Hsinchu, Taiwan
Work in Progress: Not for Distribution
8
Lithography Materials
• Continuing evaluation of novel resist for 193i and EUV• LER Rectification to reduce LER and improve line CD control• Contact/Via Rectification to reduce size and improve CD control • Pattern Density Multiplication for high density smaller features
Ruiz, et. al.
Science, 2008
Contact/Via Rectification
Density Multiplication
LER Rectification
Stoykovich, et. al.
Macromolecules, 2010
ITRS Winter Conference 2012 Hsinchu, Taiwan
Work in Progress: Not for Distribution
9
Survey on DSA
• Contact rectification and pattern density multiplication had the highest support
• Most industry responders had plans to evaluate DSA
ITRS Winter Conference 2012 Hsinchu, Taiwan
Work in Progress: Not for Distribution
10
Interconnect Materials
Via
Wire
Via
Wire
InterconnectsUltra-thin Barrier Layers (sub 2nm)• NH2 terminated Self Assembled Monolayers (SAM)• GrapheneUltra low κ ILD•Integration must be a significant focusNovel Interconnects & Vias•Graphene, Carbon Nanotubes, Nanocomposites
Workshops•Ultralow k ILD: Completed
•Ultrathin Cu Barrier Layers: Completed
ITRS Winter Conference 2012 Hsinchu, Taiwan
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11
Assembly & Packagee-Workshops
• Residue Free Adhesives• Insulating polymers with high in plane thermal
conductivity [3-5 W/m-K]• Electrically conductive flexible adhesive contact
material for heterogeneous integration• <200C process temperature photopatternable
dielectric interposer• Nanosolders with high electrical and thermal
conductivity• Novel EMI shielding materials (graphene, CNT, etc.)
ITRS Winter Conference 2012 Hsinchu, Taiwan
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12
Hexagon of Assembly Material Requirements
• Highly coupled Material Properties• Apply novel materials to achieve optimal performance
CTE
ModulusFracture
Toughness
Functional
Properties
Moisture
ResistanceAdhesion
Examples
Thermal Interface Mat.
Mold Compound
Underfill
Adhesives
Epoxy
CTE depends on volume fraction
ITRS Winter Conference 2012 Hsinchu, Taiwan
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13
ESH Challenges• Materials needed to overcome significant
technical challenges– Low energy processes and new materials for low
energy integrated circuits– Few materials can meet requirements– Some materials have known hazards or
uncharacterized ESH properties– Stimulate ESH research in uncharacterized materials– Good risk management methods for materials ESH
in Research, Development & Manufacturing – Lifecycle Assessment & Management – Efficient use of materials
ITRS Winter Conference 2012 Hsinchu, Taiwan
Work in Progress: Not for Distribution
14
Summary
• 2011 ERM Chapter will not be updated in 2012• ERM is preparing for 2013 ITRS Rewrite• Aligning with iTWG New Requirements• Planning e-Workshops• Significant Challenges for all Materials
ITRS Winter Conference 2012 Hsinchu, Taiwan
Work in Progress: Not for Distribution
15
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