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Date: June, 2007 / Issue 1.0
Serv
ice M
an
ual
Mo
del : U
250/K
U250
Service ManualU250/KU250
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1. INTRODUCTION .............................. 51.1 Purpose................................................... 51.2 Regulatory Information............................ 5
2. PERFORMANCE...............................72.1 System Overview.....................................72.2 Usable environment .................................82.3 Radio Performance ..................................82.4 Current Consumption.............................142.5 RSSI BAR ..............................................142.6 Battery BAR ...........................................152.7 Sound Pressure Level............................162.8 Charging ................................................16
3. TECHNICAL BRIEF ........................173.1 General Description ...............................173.2 GSM Mode.............................................193.3 UMTS Mode...........................................233.4 LO generation and distribution circuits...253.5 Off-chip RF Components .......................253.6 Digital Baseband(DBB/MSM6245).........343.7 Block Diagram(MSM6245).....................363.8 Subsystem(MSM6245) ..........................373.9 Power Block ...........................................453.10 External memory interface ...................503.11 H/W Sub System..................................523.12 Main Features ......................................68
4. TROUBLE SHOOTING ...................734.1 RF Component.......................................734.2 SIGNAL PATH_UMTS RF .....................754.3 SIGNAL PATH_GSM RF .......................764.4 Checking VC-TCXO Block .....................774.5 Checking Front-End Module Block ........794.6 Checking UMTS Block ...........................814.7 Checking GSM Block .............................864.8 Checking Bluetooth Block ......................924.9 Power ON Troubleshooting....................944.10 Charger Troubleshooting .....................964.11 USB Troubleshooting...........................994.12 SIM Detect Troubleshooting ..............1004.13 Camera Troubleshooting ...................1024.14 Keypad Backlight Troubleshooting ....1054.15 Main LCD Troubleshooting ................106
4.16 Receiver Path ....................................1074.17 Headset path......................................1094.18 Speaker phone path...........................1114.19 Main microphone ...............................1134.20 Headset microphone..........................1154.21 Vibrator ..............................................117
5. DOWNLOAD..................................1195.1 U250/KU250 DOWNLOAD ..................119
5.1.1 Introduction ...................................1195.1.2 Downloading Procedure ...............1195.1.3 Troubleshooting Download Errors 1295.1.4 Caution .........................................133
6. BLOCK DIAGRAM........................1346.1 GSM & UMTS RF Block.......................1346.2 Interface Diagram ................................136
7. Circuit Diagram ............................143
8. pcb layout .....................................147
9. Calibration & RF Auto Test Program (Hot Kimchi)..................1499.1 Configuration of HOT KIMCHI .............1499.2 How to use HOT KIMCHI.....................152
10. Factory Test Mode .....................15410.1. Test Program Setting ........................15410.2. WCDMA Test Mode ..........................15510.3. GSM Test Mode................................156
11. EXPLODED VIEW &REPLACEMENT PART LIST ..... 157
11.1 EXPLODED VIEW ............................ 15711.2 Replacement Parts
<Mechanic component>.................... 159<Main component> ........................... 161
11.3 Accessory ......................................... 174
Table Of Contents
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1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download thefeatures of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,persons other than your company’s employees, agents, subcontractors, or person working on yourcompany’s behalf) can result in substantial additional charges for your telecommunications services.System users are responsible for the security of own system. There are may be risks of toll fraudassociated with your telecommunications system. System users are responsible for programming andconfiguring the equipment to prevent unauthorized use. The manufacturer does not warrant that thisproduct is immune from the above case but will prevent unauthorized use of commoncarriertelecommunication service of facilities accessed through or connected to it. The manufacturer will notbe responsible for any charges that resultfrom such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possiblycausing harm or interruption in service to the telephone network, it should disconnect telephoneservice until repair can be done. A telephone company may temporarily disconnect service as long asrepair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If thesechanges could reasonably be expected to affect the use of the phones or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the userto take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorizedagent. The user may not make any changes and/or repairs expect as specifically noted in this manual.Therefore, note that unauthorized alternations or repair may affect the regulatory status of the systemand may void any remaining warranty.
1. INTRODUCTION
1. INTRODUCTION
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by localregulatory agencies. In accordance with these agencies, you may be required to provide informationsuch as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightlydifferent.
G. Interference and Attenuation
A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference fromunsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.• Use a suitable, grounded soldering iron.• Keep sensitive parts in these protective packages until these are used.• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.
1. INTRODUCTION
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2. PERFORMANCE
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2.1 System Overview
2. PERFORMANCE
Item Specification
Shape GSM900/1800/1900 and WCDMA2100 - Bar type Handset
Size 110.9 X 46.7 X 15.6 mm
Weight Under 83 g (with 950mAh Battery)
Power 3.7 V normal, 950 mAh Li-Ion
Talk Time Over 200 min (WCDMA, Tx=12 dBm, Voice)
(with 950mAh) Over 180 min (GSM, Max Tx Power, Voice)
Standby Time Over 350 Hrs (WCDMA, DRX=1.28)
(with 950mAh) Over 450 Hrs (GSM, Paging period=9)
Antenna Internal type
LCD Main 1.76” TFT, QCIF, 262K
LCD Backlight White LED Back Light
Camera 1.3 Mega pixel + VGA Video Call Camera
Vibrator Yes ( Cylinder Type)
LED Indicator No
MIC Yes
Receiver Yes
Earphone Jack Yes (18 pin)
Connectivity Bluetooth, USB
External Memory Yes(Micro SD)
I/O Connect 18 Pin
2.2 Usable environment
1) Environment
2) Environment (Accessory)
* CLA : 12 ~ 24 V(DC)
2.3 Radio Performance
1) Transmitter - GSM Mode
* In case of DCS : [A] -> 1710, [B] -> 1785 * In case of PCS : [A] -> 1850, [B] -> 1910
2. PERFORMANCE
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Item Specification
Voltage 3.7 V(Typ), 3.2 V(Min), [Shut Down : 3.2 V]
Operation Temp -20 ~ +60°C
Storage Temp -20 ~ +70°C
Humidity 85 % (Max)
Reference Spec. Min Typ. Max Unit
TA Power Available power 100 220 240 Vac
No Item GSM DCS & PCS
100k~1GHz -39dBm9k ~ 1GHz -39dBm
MS allocated 1G~[A]MHz -33dBm
Channel1G~12.75GHz -33dBm
[A]M~[B]MHz -39dBm
Conducted [B]M~12.75GHz -33dBm
1 Spurious 100k~880MHz -60dBm 100k~880MHz -60dBm
Emission 880M~915MHz -62dBm 880M~915MHz -62dBm
Idle Mode915M~1GHz -60dBm 915M~1GHz -60dBm
1G~[A]MHz -50dBm 1G~[A]MHz -50dBm
[A]M~[B]MHz -56dBm [A]M~[B]MHz -56dBm
[B]M~12.5GHz -50dBm [B]M~12.5GHz -50dBm
2. PERFORMANCE
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* In case of DCS : [A] -> 1710, [B] -> 1785 * In case of PCS : [A] -> 1850, [B] -> 1910
No Item GSM DCS & PCS
30M ~ 1GHz -36dBm30M~1GHz -36dBm
MS allocated 1G~[A]MHz -30dBm
Channel1G ~ 4GHz -30dBm
[A]M~[B]MHz -36dBm
Radiated [B]M~4GHz -30dBm
2 Spurious 30M ~ 880MHz -57dBm 30M~880MHz -57dBm
Emission 880M ~ 915MHz -59dBm 880M~915MHz -59dBm
Idle Mode915M~1GHz -57dBm 915M~1GHz -57dBm
1G~[A]MHz -47dBm 1G~[A]MHz -47dBm
[A]M~[B]MHz -53dBm [A]M~[B]MHz -53dBm
[B]M~4GHz -47dBm [B]M~4GHz -47dBm
3 Frequency Error ±0.1ppm ±0.1ppm
4 Phase Error±5(RMS) ±5(RMS)
±20(PEAK) ±20(PEAK)
3dB below reference sensitivity 3dB below reference sensitivity
Frequency Error RA250 : ±200Hz RA250: ±250Hz
5 Under Multipath and HT100 : ±100Hz HT100: ±250Hz
Interference Condition TU50 : ±100Hz TU50: ±150Hz
TU3 : ±150Hz TU1.5: ±200Hz
0 ~ 100kHz +0.5dB 0 ~ 100kHz +0.5dB
200kHz -30dB 200kHz -30dB
250kHz -33dB 250kHz -33dB
Due to 400kHz -60dB 400kHz -60dB
Output RFmodulation 600 ~ 1800kHz -66dB 600 ~ 1800kHz -60dB
6 1800 ~ 3000kHz -69dB 1800 ~ 6000kHz -65dBSpectrum
3000 ~ 6000kHz -71dB ≥6000kHz -73dB
≥6000kHz -77dB
Due to400kHz -19dB 400kHz -22dB
Switching600kHz -21dB 600kHz -24dB
transient1200kHz -21dB 1200kHz -24dB
1800kHz -24dB 1800kHz -27dB
2. PERFORMANCE
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No Item GSM DCS & PCS
Frequency offset 800kHz
7 Intermodulation attenuation –Intermodulation product should
be Less than 55dB below the
level of Wanted signal
Power control Power Tolerance Power control Power Tolerance
Level (dBm) (dB) Level (dBm) (dB)
5 33 ±3 0 30 ±3
6 31 ±3 1 28 ±3
7 29 ±3 2 26 ±3
8 27 ±3 3 24 ±3
9 25 ±3 4 22 ±3
10 23 ±3 5 20 ±3
8 Transmitter Output Power 11 21 ±3 6 18 ±3
12 19 ±3 7 16 ±3
13 17 ±3 8 14 ±3
14 15 ±3 9 12 ±4
15 13 ±3 10 10 ±4
16 11 ±5 11 8 ±4
17 9 ±5 12 6 ±4
18 7 ±5 13 4 ±4
19 5 ±5 14 2 ±5
15 0 ±5
9 Burst timing Mask IN Mask IN
2. PERFORMANCE
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2) Transmitter - WCDMA Mode
No Item Specification
1 Maximum Output Power Class 3 : +24dBm(+1/-3dB)
2 Frequency Error ±0.1ppm
3 Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme
Adjust output(TPC command)
cmd 1dB 2dB 3dB
+1 +0.5/1.5 +1/3 +1.5/4.5
4 Inner Loop Power control in uplink 0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5
-1 -0.5/-1.5 -1/-3 -1.5/-4.5
Group (10 equel command group)
+1 +8/+12 +16/+24
5 Minimum Output Power -50dBm(3.84MHz)
Qin/Qout : PCCH quality levels
6 Out-of-synchronization handling of output power Toff@DPCCH/Ior : -22 -> -28dB
Ton@DPCCH/Ior : -24 -> -18dB
7 Transmit OFF Power -56dBm(3.84MHz)
8 Transmit ON/OFF Time Mask±25us
PRACH,CPCH,uplinlk compressed mode
±25us
9 Change of TFCPower varies according to the data rate
DTX : DPCH off
(minimize interference between UE)
10 Power setting in uplink compressed ±3dB(after 14slots transmission gap)
11 Occupied Bandwidth(OBW) 5MHz(99%)
-35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz,30k
12 Spectrum emission Mask-35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz,1M
-39-10*(∆f-7.5)dBc@∆f=7.5~8.5MHz,1M
-49dBc@∆f=8.5~12.5MHz,1M
3)Receiver - GSM Mode
2. PERFORMANCE
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No Item Specification
13 Adjacent Channel Leakage Ratio(ACLR)33dB@5MHz, ACP>-50dBm
43dB@10MHz, ACP>-50dBm
-36dBm@f=9~150KHz, 1K BW
-36dBm@f=50KHz~30MHz, 10K BW
-36dBm@f=30MHz~1000MHz, 100K BW
14Spurious Emissions -30dBm@f=1~12.5GHz, 1M BW
(*: additional requirement) (*)-41dBm@f=1893.5~1919.6MHz, 300K
(*)-67dBm@f=925~935MHz, 100K BW
(*)-79dBm@f=935~960MHz, 100K BW
(*)-71dBm@f=1805~1880MHz, 100K BW
15 Transmit Intermodulation-31dBc@5MHz,Interferer -40dBc
-41dBc@10MHz, Interferer -40dBc
16 Error Vector Magnitude (EVM)17.5%(>-20dBm)
(@12.2K, 1DPDCH+1DPCCH)
17 Transmit OFF Power-15dB@SF=4.768Kbps, Multi-code
transmission
No Item GSM DCS & PCS
1 Sensitivity (TCH/FS Class II) -105dBm -105dBm
2Co-Channel Rejection
C/Ic=7dB Storage -30 ~ +85(TCH/FS Class II, RBER, TU high/FH)
3 Adjacent Channel 200kHz C/Ia1=-12dB C/Ia1=-12dB
Rejection 400kHz C/Ia2=-44dB C/Ia2=-44dB
Wanted Signal :-98dBm 1st Wanted Signal :-96dBm 1st
4 Intermodulation Rejection interferer:-44dBm 2nd interferer:-44dBm 2nd
interferer:-45dBm interferer:-44dBm
5Blocking Response Wanted Signal :-101dBm Wanted Signal :-101dBm
(TCH/FS Class II, RBER) Unwanted : Depend on Frequency Unwanted : Depend on Frequency
2. PERFORMANCE
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4) Receiver - WCDMA Mode
No Item Specification
1 Reference Sensitivity Level -106.7 dBm(3.84 MHz)
-25dBm(3.84MHz)
2 Maximum Input Level -44dBm/3.84MHz(DPCH_Ec)
UE@+20dBm output power(Class3)
3 Adjacent Channel Selectivity (ACS)33dB
UE@+20dBm output power(Class3)
-56dBm/3.84MHz@10MHz
4 In-band Blocking UE@+20dBm output power(Class3)
-44dBm/3.84MHz@15MHz
UE@+20dBm output power(Class3)
-44dBm/3.84MHz@f=2050~2095 and
2185~2230MHz
UE@+20dBm output power(Class3)
-30dBm/3.84MHz@f=2025~2050 and
5 Out-band Blocking 2230~2255MHz
UE@+20dBm output power(Class3)
-15dBm/3.84MHz@f=1~2025 and
2255~12500MHz
UE@+20dBm output power(Class3)
6 Spurious Response-44dBm CW
UE@+20dBm output power(Class3)
-46dBm CW@10MHz
7 Intermodulation Characteristic -46dBm/3.84MHz@20MHz
UE@+20dBm output power(Class3)
-57dBm@f=9KHz~1GHz, 100K BW
8 Spurious Emissions -47dBm@f=1~12.5GHz, 1M BW
-60dBm@f=1920MHz~1980MHz, 3.84M BW
-60dBm@f=2110MHz~2170MHz, 3.84M BW
2. PERFORMANCE
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2.4 Current Consumption
1) U250/KU250 Current Consumption
(Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight off,Neighbor Cell off) (VT TestCondition : Speaker off, LCD backlight On)
2.5 RSSI BAR
Stand by Voice Call VT
WCDMAUnder 2.80 mA Under 290 mA Under 410mA
(DRX=1.28) (Tx=12dBm) (Tx=12dBm)
Under 2.12 mA Under 320 mA
GSM Paging=9 period (Max Tx Power)
Level Change WCDMA GSM
BAR 4 → 3 -85 ± 2 dBm -90 ± 2 dBm
BAR 3 → 2 -95 ± 2 dBm -95 ± 2 dBm
BAR 2 → 1 -106 ± 2 dBm -100 ± 2 dBm
BAR 1 → 0 -111 ± 2 dBm -106 ± 2 dBm
2.6 Battery BAR
2. PERFORMANCE
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Indication Standby
Bar 4 Over 3.83 ± 0.05V
Bar 4 → 3 3.82 ± 0.05V
Bar 3 → 2 3.73 ± 0.05V
Bar 2 → 1 3.68 ± 0.05V
Bar 1 → Empty 3.58 ± 0.05V
Low Voltage, 3.58± 0.05V (Stand-by) / 3.58 ± 0.05V (Talk)
Warning message+ Blinking [Interval : 3min(Stand-by) / 1min(Talk)]
Power Off 3.20 ± 0.05V
2. PERFORMANCE
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2.7 Sound Pressure Level
2.8 Charging
• Charging Method : CC & CV (Constant Current and Constant Voltage)
• Maximum Charging Voltage : 4.2 V
• Maximum Charging Current : 700 mA
• Normal Battery Capacity : 950 mAh
• Charging Time : Max 3 hours (except for trickle charging time)
• Full charging indication current (charging icon stop current) : 80 mA
• Cut-off voltage : 3.20 V
No Test Item Specification
1 Sending Loudness Rating (SLR) 8 ±3 dB
2 Receiving Loudness Rating (RLR)Nor -4 ± 3 dB
Max -15 ± 3 dB
3 Side Tone Masking Rating (STMR) Min 17 dB
4 Echo Loss (EL) Min 40 dB
5 Idle Noise-Sending (INS) Max -64 dBm0p
6 Idle Noise-Receiving (INR)Nor Under -47 dBPA
Max Under -36 dBPA
7 Sending Loudness Rating (SLR) 8±3dB
8 Receiving Loudness Rating (RLR)Nor -1 ±3 dB
Max -12 ±3 dB
9 Side Tone Masking Rating (STMR) Min 25 dB
10 Echo Loss (EL) Min 40 dB
11 Idle Noise-Sending (INS) Max -55 dBm0p
12 Idle Noise-Receiving (INR)Nor Under -45 dBPA
Max Under -40 dBPA
TDMA Noise
-. GSM : Power Level : 5
DCS/PCS : Power Level : 0
(Cell Power : -90 ~ -105 dBm)
13
-. Acoustic (Max Vol.)
MS/Headset SLR : 8 ± 3dB
MS/Headset RLR : -15 ± 3dB/-12
(SLR/RLR : Mid-value setting)
MS
Headset
MS and
HeadsetMax Under -62 dBm
3. TECHNICAL BRIEF
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3.1 General Description
The U250/KU250 supports UMTS-2100, GSM-900, DCS-1800, and PCS-1900 basedGSM/GPRS/UMTS. All receivers and the UMTS transmitter use the radio One1Zero-IF architecture toeliminate intermediate frequencies, directly converting signals between RF and baseband. The quad-band GSM transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loopthat translates the GMSK-modulated signal to RF.
UMTS (2100)GSM (900, 1800, 1900)Bluetooth
1. RTR6275 for GSM Txand WCDMA Tx
2. RTR6275 for GSM Rxand WCDMA Rx
3. Bluetooth RF module
4. PM6650 for powermanagement
1 QUALCOMM’s branded chipset that implements a Zero-IF radio architecture.
3. TECHNICAL BRIEF
[Fig 1.1] Block diagram of RF part
A generic, high-level functional block diagram of U250/KU250 is shown in Figure 1-1. One antennacollects base station forward link signals and radiates handset reverse link signals. The antennaconnects with receive and transmit paths through a FEM(Front End Module).
The UMTS receive path each include a LNA, a RF band-pass filter, and a downconverter that translatethe signal directly from RF-to-baseband using radioOne ZIF technique. The RFIC Rx analog basebandoutputs, for the receive chains, connect to the MSM IC. The UMTS and GSM Rx baseband outputsshare the same inputs to the MSM IC.
For the transmit chains, the RTR6275 IC directly translates the Tx baseband signals (from the MSMdevice) to an RF signal using an internal LO generated by integrated on-chip PLL and VCO. TheRTR6275 IC outputs deliver fairly high-level RF signals that are first filtered by Tx SAWs and thenamplified by their respective UMTS PA. The high- and low-band UMTS RF transmit signals emergefrom the RTR6275 transceiver.
In the GSM receive paths, the received RF signals are applied through their band-pass filters anddown-converted directly to baseband in the RTR6275 transceiver IC. These baseband outputs areshared with the UMTS receiver and routed to the MSM IC for further signal processing.
The GSM transmit paths employ one stage of up-conversion and, in order to improve efficiency.
1. The on-chip quadrature up-converter translates the GMSK-modulated signal to a constant envelopephase signal at RF;
2. The amplitude-modulated (AM) component is applied to the ramping control pin of power amplifierfrom a DAC within the MSM
U250/KU250 power supply voltages are managed and regulated by the PM6650 Power ManagementIC. This versatile device integrates all wireless handset power management, general housekeeping,and user interface support functions into a single mixed signal IC. It monitors and controls the externalpower source and coordinates battery recharging while maintaining the handset supply voltages usinglow dropout, programmable regulators.
The device’s general housekeeping functions include an ADC and analog multiplexer circuit formonitoring on-chip voltage sources, charging status, and current flow, as well as userdefined off-chipvariables such as temperature, RF output power, and battery ID. Various oscillator, clock, and countercircuits support IC and higher-level handset functions. Key parameters such as under-voltage lockoutand crystal oscillator signal presence are monitored to protect against detrimental conditions.
3. TECHNICAL BRIEF
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3. TECHNICAL BRIEF
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3.2 GSM Mode
3.2.1 GSM Receiver
The Dual-mode U250/KU250’s receiver functions are split among the three RFIC’s as follows:
• GSM-900, DCS-1800, and PCS-1900 UMTS-2100 modes use the RTR6275 IC only. Each mode hasindependent front-end circuits and down-converters, but they share common baseband circuits (withonly one mode active at a time). All receiver control functions are beginning with SBI2-controlledparameters.
RF Front end consists of antenna, antenna switch module(D5011) which includes three RX sawfilters(GSM900, DCS and PCS). The antenna switch module allows multiple operating bands andmodes to share the same antenna. In U250/KU250, a common antenna connects to one of six paths:1) UMTS-2100 Rx/Tx, 2) GSM-900 Rx, 3) GSM-900 Tx, 4) DCS-1800 Rx, and 5) DCS-1800 Tx, PCS-1900 Tx(High Band Tx’s share the same path), 6) PCS-1900 Rx. UMTS operation requiressimultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer thatseparates receive and transmit signals. The GSM900, DCS, and PCS operation is time divisionduplexed, so only the receiver or transmitter is active at any time and a frequency duplexer is notrequired.
2 The RFIC operating modes and circuit parameters are MSM-controlled through the proprietary 3-line Serial Bus Interface (SBI). The ApplicationProgramming Interface (API) is used to implement SBI commands. The API is documented in AMSS Software - please see applicable AMSSSoftware documentation for details.
[Table 1.1] Antenna Switch Module Control logic
GSM 1800 / GSM1900 RX
GSM 900 RX
GSM 900 TX / WCDMA
GSM 1800 / GSM 1900 TX
The GSM900, DCS, and PCS receiver inputs of RTR6275 are connected directly to the transceiverfront-end circuits(filters and antenna switch module). The GSM900, DCS, and PCS receiver inputs usedifferential configurations to improve common-mode rejection and second-order non-linearityperformance. The balance between the complementary signals is critical and must be maintained fromthe RF filter outputs all the way into the IC pins
Since GSM900, DCS, and PCS signals are time-division duplex (the handset can only receive ortransmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers -this is accomplished in the switch module.
The GSM900, DCS, and PCS receive signals are routed to the RTR6275 through band selection filtersand matching networks that transform single-ended 50-Ω sources to differential impedances optimizedfor gain and noise figure. The RTR input uses a differential configuration to improve second-order inter-modulation and common mode rejection performance. The RTR6275 input stages include MSM-controlled gain adjustments that maximize receiver dynamic range.
The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters.The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q)having passband and stopband characteristics suitable for GMSK processing. These filter circuitsinclude DC offset corrections. The filter outputs are buffered and passed on to the MSM6245 IC forfurther processing (an interface shared with the RFR6275 UMTS receiver outputs).
3. TECHNICAL BRIEF
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3. TECHNICAL BRIEF
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[Fig 1.2] RTR6275 RX feature
3.2.2 GSM Transmitter
The RTR6275 transmitter outputs(DA_HB2_OUT and DA_LB1_OUT)include on-chip output matchinginductors. The 50ohm output impedance is achieved by adding a series capacitor at the output pins.The capacitor value may be optimized for specific applications and PCB characteristics based on pass-band symmetry about the band center frequency, the suggested starting value is shown in Figure1.3.
The RTR6275 IC is able to support GSM 900 and GSM 1800/1900 mode transmitting. This designguideline shows a tri-band GSM application.
Both high-band and low band outputs are followed by resistive pads to ensure that the load presentedto the outputs remains close to 50ohm. The low-band GSM Tx path also includes a Tx-band SAW filterto remove noise-spurious components and noise that would be amplified by the PA and appear in theGSM Rx band
3. TECHNICAL BRIEF
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9191
6pF
100100
51
12pF 39
Ω
Ω
Ω
ΩΩ
Ω
[Fig 1.3] GSM Transmitter matching
3. TECHNICAL BRIEF
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3.3 UMTS Mode
3.3.1 Receiver
The UMTS duplexer receiver output is routed to LNA circuits within the RTR6275 device. The UMTS Rxinput is provided with an on-chip LNA that amplifies the signal before a second stage filter that providesdifferential downconverter. This second stage input is configured differentially to optimize second-orderintermodulation and common mode rejection performance. The gain of the UMTS frontend amplifier andthe UMTS second stage differential amplifier are adjustable, under MSM control, to extend the dynamicrange of the receivers. The second stage UMTS Rx amplifiers drive the RF ports of the quadrature RF-tobaseband downconverters. The downconverted UMTS Rx baseband outputs are routed to lowpassfilters having passband and stopband characteristics suitable for UMTS Rx processing. These filtercircuits allow DC offset corrections, and their differential outputs are buffered to interface shared withGSM Rx to the MSM IC. The UMTS baseband outputs are turned off when the RTR6275 isdownconverting GSM signals and on when the UMTS is operating.
3.3.2 Transmitter
The UMTS Tx path begins with differential baseband signals (I and Q) from the MSM device. Theseanalog input signals are amplified, filtered, and applied to the quadrature up-converter mixers. The up-converter output is amplified by multiple variable gain stages that provide transmit AGC control. TheAGC output is filtered and applied to the driver amplifier; this output stage includes an integratedmatching inductor that simplifies the external matching network to a single series capacitor to achievethe desired 50-Ω interface.
The RTR6275 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairlyhigh-level signals that are filtered and applied to the PA. Transmit power is delivered from the duplexerto the antenna through the switch module. The transceiver LO synthesizer is contained within theRTR6275 IC with the exception of the off-chip loop filter components and the VC-TCXO. This providesa simplified design for multimode applications. The PLL circuits include a reference divider, phasedetector, charge pump, feedback divider, and digital logic generator.
UMTS Tx using PLL1, the LO generation and distribution circuits create the necessary LO signals fordifferent frequency converters. The UMTS transmitter also employs the ZIF architecture to translate thesignal directly from baseband to RF. This requires FLO to equal FRF, and the RTR6275 IC designachieves this without allowing FVCO to equal FRF.The RTR6275 IC is able to support UMTS 2100/1900 and UMTS 850 mode transmitting. This designguideline shows only UMTS 2100 applications.
3. TECHNICAL BRIEF
- 24 -
[Figure 1.4] RTR6275 IC functional block diagram
WCDMA_2100_TX
WCDMA_2100_RX
3.4 LO generation and distribution circuits
The integrated LO generation and distribution circuits are driven by internal VCOs to support variousmodes to yield highly flexible quadrature LO outputs that drive all GSM and UMTS band upconvertersand downconverters; with the help of these LO generation and distribution circuits, zero-IF architectureis employed in all GSM and UMTS band receivers and transmitters to translate the signal directly fromRF to baseband and from baseband to RF.
Two fully functional fractional-N synthesizers, including VCOs and loop filters, are integrated within theRTR6275 IC. The first synthesizer (PLL1) creates the transceiver LOs that support the UMTS2100/1900/1800 transmitter, and all four GSM band receivers and transmitters including: GSM 850,GSM 900, GSM 1800, and GSM 1900. The second synthesizer (PLL2) provides the LO for the UMTS2100/1900/1800 receiver. An external TCXO input signal is required to provide the synthesizerfrequency reference to which the PLL is phase and frequency locked. The RTR6275 IC integratesmost of PLL loop filter components on-chip except two off-chip loop filter series capacitors, andsignificantly reduces off-chip component requirement. With the integrated fractional-N PLLsynthesizers, the RTR6275 has the advantages of more flexible loop bandwidth control, fast lock time,and low-integrated phase error
3.5 Off-chip RF Components
3.5.1 WCDMA PAM (U103: WS2512-TR1G)
The UMTS PA output power is monitored by l power detector circuits(U100 : RTR6275) .This detector voltage can be used for transmitter calibration and monitor to meet RF system
3. TECHNICAL BRIEF
- 25 -
[Figure 1.5] WCDMA PAM, Duplexer, Coupler
20dB
Rev_1.0
Rev.B
Rev_1.0
Rev.D
WCDMA
7dB
0.5pL125
FL102EFCH1950TDF1
2
G1
3
G2
5G3 1
IN
4O1
U102
CP0402A1950DNTR
50O
HM
4 3C
OU
P2
IN
1O
UT
L4041.8nH
45
31
NAL122
KRX102UTR100
2
1pC165
3.3p
C162
C15915p
R122130
R11
951
1.5pC154
4 1RXTX
2
FL104
ACMD-7602
ANT3
PGND
130R121
0.1uC170
4.7uC155
47R120
2
RFOUT8
1VCC1VCC2
10
4VCONT
5VREF
WS2512_TR1G U103
11BGND
GND13
GND267
GND3
9GND4 RFIN
0.5pC164
100pC192
C15815p
1nHL123
10nHC157
+VPWR
PA_R0
+VPWR
PWR_DET
PA_ON
VREG_TCXO_2.85V
3.5.2 VCTCXO (X100 : DSA321SCE-19.2M)
The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides thereference frequency for all RFIC synthesizers as well as clock generation functions within theMSM6245 IC. The oscillator frequency is controlled by the MSM6245 IC.TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain controlTX_AGC_ADJ. A two-pole RC lowpass filter is recommended on this control line.
The PM6650 IC controls the handset power-up sequence, including a special VCTCXO warm-upinterval before other circuits are turned on. This warm-up interval (as well as other TCXO controllerfunctions) is enabled by the MSM TCXO_EN line . The PM6650 IC VREG_TCXO regulated outputvoltage is used to power the VCTCXO and is enabled before most other regulated outputs.Any GSM mode power control circuits within the MSM6245 IC require a reference voltage for properoperation and sufficient accuracy. Connecting the PM6650 IC REF_OUT directly to the MSM6245 ICGSM_PA_PWR_CTL_REF provides this reference. This sensitive analog signal needs a 0.1 •ÏF lowfrequency filter near to MSM side, and isolate from digital logic and clock traces with ground on bothsides, plus ground above and below if routed on internal layers.
3.5.3 Front-End Module (U500 : D5011)
This equipment uses a single antenna to support all handset operating modes, with an antenna switchmodule select the operating frequency and band. UMTS operation requires simultaneous receptionand transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive andtransmit signals. The active connection is MSM-selected by three control lines (GPIO[9], GPIO[10]).Two GPIO are programmed to be ANT_SEL0_N, ANT_SEL1_N) respectively.
3. TECHNICAL BRIEF
- 26 -
GSM 1800 / GSM1900 RX
GSM 900 RX
GSM 900 TX / WCDMA
GSM 1800 / GSM 1900 TX
[Table 1.2] Front End Module control logic
3. TECHNICAL BRIEF
- 27 -
3.5.4 PMIC Functional Block Diagram (U300 : PM6650-2M)
• Input power management
- Valid external supply attachment and removal detection- Supports unregulated (closed-loop) external charger supplies and USB supplies as input power
sources- Supports lithium-ion main batteries- Trickle, constant current, constant voltage, and pulsed charging of the main battery- Supports coin cell backup battery (including charging)- Battery voltage detectors with programmable thresholds- VDD collapse protection- Charger current regulation and real-time monitoring for over-current protection- Charger transistor protection by power limit control- Control drivers for two external pass transistors and one external battery MOSFET - MOSFET is
optional- Voltage, current, and power control loops- Automated recovery from sudden momentary power loss
• Output voltage regulation
- One boost (step-up) switched-mode power supply (SMPS) for driving white LEDs and hostingUSBOTG
- Three buck (step-down) switched-mode power supplies that efficiently generate MSMC, MSME,and PA (or second MSMC) supply voltages
- Supports dynamic voltage scaling (DVS) for MSMC and PA- Eleven low dropout regulator circuits with programmable output voltages, implemented using three
different current ratings: 300 mA (two), 150 mA (six), and 50 mA (three). These can be used topower MSMA, MSMP, RFRX1, RFRX2, RFTX, SYNT, TCXO, WLAN, MMC, USB, and RUIMcircuits.
- All regulators can be individually enabled/disabled for power savings- Low power mode available on MSMA and MSMP regulators- All regulated outputs are derived from a common bandgap reference-close tracking
• Integrated handset-level housekeeping functions reduces external parts count, size, cost
- Analog multiplexer selects from 8 internal and up to 18 external inputs- Multiplexer output’s offset and gain are adjusted, increasing the effective ADC resolution- Adjusted multiplexer output is buffered and routed to an MSM device ADC- Dual oscillators - 32.768 kHz off-chip crystal and on-chip RC assures MSM device sleep clock- Crystal oscillator detector and automated switch-over upon lost oscillation- Real time clock for tracking time and generating associated alarms- On-chip adjustments minimize crystal oscillator frequency errors- Circuits control TCXO warm-up and synchronize, deglitch, and buffer the TCXO signal- TCXO buffer control for optimal QPH/catnap timing- Three-stage over-temperature protection (smart thermal control)
• Integrated handset-level user interfaces- Four programmable current sinks recommended as keypad backlight, LCD backlight, camera flash,
and general-purpose drivers- Vibration motor driver programmable from 1.2 to 3.1V in 100 mV increments- Speaker driver with programmable gain, turn-on time, and muting; differential operation (drives
external 8 Ω speakers with volume controlled 500 mW)
• IC-level interfaces- MSM device-compatible 3-line SBI for efficient initialization, status, and control- Supports the MSM device’s interrupt processing with an internal interrupt manager- Many functions monitored and reported through real-time and interrupt status signals- Dedicated circuits for controlled power-on sequencing, including the MSM device’s reset signal- Several events continuously monitored for triggering power-on/power-off sequences- Supports and orchestrates soft resets- USB-OTG transceiver for full-speed (12 Mb/s) and low speed (1.5 Mb/s) interfacing of the MSM
device to computers as a USB peripheral, or connecting the MSM device to other peripherals -RUIM level translators enable MSM device interfacing with external modules
• Twelve multi-purpose pins that can be configured as digital or analog I/Os, bi-directional I/Os, orcurrent sinks. Default functions support the RUIM level translators, power-on circuits, analogmultiplexer inputs, an LED driver, and a reference voltage buffer.
• Highly integrated functionality in a small package - 84-pin BCCS with a large center slug for electricalground, mechanical stability, and thermal relief
3. TECHNICAL BRIEF
- 28 -
[Figure 1.6] MSM6245 Interface
3. TECHNICAL BRIEF
- 29 -
[Figure1.7] PM6650 Block Diagram
3.5.5 GSM PAM (U101 : SKY77318)
The SKY77318 is an extremely small (6 x 6 mm), GSM PAM for handset applications. This modulehas been optimized for excellent efficiency and Pout while maintaining high GSM/GPRS efficiency.The small size and high performance is achieved with high-reliability GaAs HBT technology.With 50Ω and output, no external matching or bias components are required. The module incorporatestwo highly-integrated GaAs power amplifier die with a BiCMOS controller.Each amplifier has three gain stages with on-die inter-stage matching implemented with a high Qpassives technology for optimal performance. The CMOS controller implements a fully integratedpower control within the module for GSM operations, and serves as the GPRS operations. Thiseliminates the need for any external couplers, power detectors, current sensing etc., to assure theoutput power level. The module has Tx enable and band select inputs. Module construction is a low-profile overmolded land-grid array on laminate.
3. TECHNICAL BRIEF
- 30 -
[Figure 1. 8] GSM PAM Schematic
GSM_PA_BAND MODE
8.86dB
HIGH
Rev.D
EGSM
GSM
DCS/PCS
Rev.1.0
LOW
7.5dB
C1360.01u
10nHL116
L406 2.7nH
100pC438
C124100p
100o
hm
R11
4
NA
5.6pC441
1.5nHL403
L11518nH
100ohm
100ohmR113
R117
100o
hm
R10
7
C15315p
3
G2
5G3 1
IN
4O1
R11
091
EFCH897MTDB1
FL101
2
G1
C1230.01u
39
R112
L1115.6nH
68pC139C137
NA
C1340.01u
GN
D3
9G
ND
410
GN
D5
GN
D6
12
GN
D7
13
GN
D8
14
GN
D9
16
21P_GND
19RSVD_GND
VA
PC
20 17V
BA
TT
2V
CC
1A
6V
CC
1B
BS1
DCS_PCS_IN315
DCS_PCS_OUT
EGSM_IN4
EGSM_OUT11
ENABLE18
GN
D1
5
GN
D2
78
SKY77318
U101
C14915p 10
0ohm
R11
5
91R
111
C12133u
C138NA
R108
51
GSM_TX
DCS_PCS_TX
+VPWR
GSM_PA_BAND
GSM_PA_EN
GS
M_P
A_R
A
3. TECHNICAL BRIEF
- 31 -
3.5.6 UMTS Duplexer(FL104:ACMD-7602)
A UMTS duplexer splits a single operating band into receive and transmit paths. Importantperformance requirements include;
• Insertion loss. this component is also in the receive and transmit paths ; In the U250/KU250 typicallosses : UMTS2100_ Tx = 1.2 dB, UMTS2100_ Rx = 1.4 dB
• Out-of-band rejection or attenuation. the duplexer provides input selectivity for the receiver, outputfiltering for the transmitter, and isolation between the two. Rejection levels for both paths arespecified over a number of frequency ranges. Two Tx-to-Rx isolation levels are critical to receiverperformance:
• Rx-band isolation. the transmitter is specified for out-of-band noise falling into the Rx band. Thisnoise leaks from the transmit path into the receive path, and must be limited to avoid degradingreceiver sensitivity. The required Rx-band isolation depends on the PA out of-band noise levels andRx-band losses between the PA and LNA. Minimum duplexer Rx band isolation value is about 51 dB.
• Tx-band isolation. the transmit channel power also leaks into the receiver. In this case, the leakage isoutside the receiver passband but at a relatively high level. It combines with Rx band jammers tocreate cross-modulation products that fall in-band to desensitize the receiver. The required Tx-bandisolation depends on the PA channel power and Tx-band losses between the PA and LNA. Minimumduplexer Tx-band isolation value is about 58dB.
• Passband ripple. the loss of this fairly narrowband device is not flat across its passband. Passbandripple increases the receive or transmit insertion loss at specific frequencies, creating performancevariations across the band.s channels, and should be controlled.
• Return loss. minimize mismatch losses with typical return losses of 10 dB or more (VSWR <2:1).
• Power handling. high power levels in the transmit path must be accommodated without degradedperformance. The specified level depends on the operating band class and mobile station class (perthe applicable standard), as well as circuit losses and antenna EIRP. Several duplexer characteristicsdepend upon its source and load impedances. QUALCOMM strongly recommends an isolator beused between the UMTS PA and duplexer to assure proper performance.
3.5.7 UMTS Rx RF filter (FL103 : EFCH2140TDE1)
• Frequency range : 2110 ~ 2170MHzAn RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not ascritical as losses before the LNA. The most important parameters of this component include:
• Out-of-band rejection or attenuation levels, usually specified to meet these conditions:
- FFar out-of-band signals - ranging from DC up to the first band of particular concern and from thelast band of particular concern to beyond three times the highest passband frequency.
- Tx-band leakage - the transmitter channel power, although attenuated by the duplexer, stillpresents a cross-modulation threat in combination with Rx-band jammers. The RF filter mustprovide rejection of this Tx-band leakage.
- Other frequencies of particular concern . bands known to include other wireless transmitters thatmay deliver significant power levels to the receiver input.
3. TECHNICAL BRIEF
- 32 -
Table 1.3 WCDMA Rx SAW Filter Specification
3. TECHNICAL BRIEF
- 33 -
3.5.8 Bluetooth (M100 : LBRQ-2B43A)
The MSM6245 includes BT baseband embedded BT 1.1 compliant baseband core, so the otherbluetooth components are an bluetooth RF module and Antenna. Figure1.9 shows the bluetoothsystem architecture in the U250/KU250.
[Figure1.9] Bluetooth system architecture
MSM6245
Bluetooth
baseband
3.6 Digital Baseband(DBB/MSM6245)
3.6.1 General Description
A. Features(MSM6245)
• Support for multimode operation - tri-band WCDMA (UMTS), quad-band GSM/GPRS/EDGE
• Support for WCDMA (UMTS) uplink data rate up to 384 kbps
• High-performance ARM926EJ-S running at up to 225 MHz
• ARM Jazelle Java hardware acceleration for faster Java-based games and other applets
• QDSP4000 high-performance DSP cores
• Integrated Bluetooth 1.2 baseband processor for wireless connectivity to peripherals
• Qcamera™ with 30 fps QCIF viewfinder resolution, and support for 2 MP camera sensors
• Direct interface to digital camera module with video front end (VFE) image processing
• True 3D graphics for advanced wireless gaming
• SecureMSM v2.0 includes support for Open Mobile Alliance (OMA) DRM v2.0, SIM-lock and IMEIintegrity. Support for Q-fuse. Only trusted boot is supported
• Audio that is on par with portable music players
• Vocoder support (AMR, FR, EFR, HR)
• Advanced 14 x 14 mm, 0.5 mm pitch, 409-pin lead-free CSP packaging technology
• SD/SDIO hardware support
3. TECHNICAL BRIEF
- 34 -
3. BB Technical Description
3. TECHNICAL BRIEF
- 35 -
Front End
Module
Duplexer
RTR6275WCDMA
PAM
MSM6245
WCDMA TX SAW
WCDMA RX SAW
PM6650-2M
GSMPAM
GSM TX SAW
COUPLER
VCTCXO
BluetoothRF Module
U-SIM
1.3M CAM
USB
MIC
SPK/RCV
KEYPAD
NAND, SDRAMFLASH
MAIN LCD
VGA CAM
GSM900 Rx
GSM1800 Rx
GSM1900 Rx
GSM900 Tx
GSM1800/1900 Tx
AntSW Logic
WCDMA2100 Tx
WCDMA2100 Rx
GSMVCO
WCDMAVCO
HDET
GSM Block
WCDMA Block
Figure 1.10 Simplified Block Diagram
3. TECHNICAL BRIEF
- 36 -
3.7 Block Diagram(MSM6245)
MSM6245
CONNECTIVITY
CAMERAPROCESSING(Default 8bit
Interface)
GRAPHICS
VIDEO
AUDIO
DUAL MEMORY BUS
Modem QDSP 4000
PLL
QDSP 4000ARM 926ejsWith Jazelle
UMTS, WCDMA
BT 1.2processor
Rx ADC
Tx DAC
MP3, AAC, EVRC, QCELP
AMR, CMX, MIDI
EBI 1 EBI 2
Open GL ES3D, 2D
MPEG-4H.263, H.264
Key
pad
I/F
US
B
UA
RT
1
UA
RT
2 / R
UIM
1
UA
RT
3 / P
MIC
SB
I
Camera 1.3MI/O
Co
nn
NAND Flash512Mbit
SDRAM512Mbit
LCD(1.76inch)
PM6650
GSM/GPRS/EDGEprocessor
JTA
G
RF SBI
GPIO
USIM
US B
VGA camera
Figure 1.11 Simplified Block Diagram of MSM6245
3. TECHNICAL BRIEF
- 37 -
3.8 Subsystem(MSM6245)
3.8.1. ARM Microprocessor Subsystem
The MSM6245 device uses an embedded ARM926EJ-S microprocessor. This microprocessor,through the system software, controls most of the functionality for the MSM, including control of theexternal peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a Genericsingle-wire serial bus interface (SSBI) the ARM926EJ-S configures and controls the functionality of theRTR6275, RFR6275 and PM6650 devices.
3.8.2. WCDMA R99 features
The MSM6245 device supports release 99 June 2004 of the W-CDMA FDD standard, including thefollowing features: All modes and data rates for W-CDMA frequency division duplex (FDD), with the following
restrictions: The downlink supports the following specifications:
- Up to four physical channels, including the broadcast channel (BCH), if present- Up to three dedicated physical channels (DPCHs)- Spreading factor (SF) range support from 4 to 256- The following transmit diversity modes are supported:
Space time transmit diversity (STTD) Time-switched transmit diversity (TSTD) Closed-loop feedback transmit diversity (CLTD)
The uplink supports the following specifications: The uplink provides the following UE support:
- One physical channel, eight TrCH, and 16 TrBks starting at any frame boundary- A maximum data rate of 384 kbps
Full SF range support from 4 to 256 SMS (CS and PS) PS data rate - 384 kbps DL / 384 kbps UL CS data rate - 64 kbps DL / 64 kbps UL AMR (all rates)
3. TECHNICAL BRIEF
- 38 -
3.8.3. GSM features
The following GSM modes and data rates are supported by the MSM6245 device hardware. Supportmodes conform to release '99 specifications of the sub-feature. Voice features
FR EFR AMR HR A5/1, A5/2, and A5/3 ciphering
Circuit-switched data features 9.6k 14.4k Fax Transparent and non-transparent modes for CS data and fax No sub-rates are supported.
3.8.4. GPRS features
Packet switched data (GPRS) DTM (Simple Class A) operation Multi-slot class 12 data services CS schemes: CS1, CS2, CS3, and CS4 GEA1, GEA2, and GEA3 ciphering
Maximum of four Rx timeslots per frame
3.8.5. EDGE features
EDGE E2 power class for 8 PSK DTM (simple Class A), multi-slot class 12 Downlink coding schemes - CS 1-4, MCS 1-9 Uplink coding schemes - CS 1-4, MCS 1-9 BEP reporting SRB loopback and test mode B 8-bit, 11-bit RACH PBCCH support 1 phase/2 phase access procedures Link adaptation and IR NACC, extended UL TBF.
3. TECHNICAL BRIEF
- 39 -
3.8.6. MSM6245 device audio processing features
Integrated wideband stereo CODEC 16-bit DAC with typical 88 dB dynamic range Supports sampling rates up to 48 kHz on the speaker path and 16 kHz on the microphone path
VR- Voice mail + voice memo Acoustic echo cancellation Audio AGC Audio Codecs: AMR-NB, AAC, AAC Plus, Enhanced AAC Plus, Windows Audio v9, Real Audio 8
(G2) Internal vocoder supporting AMR, FR, EFR, and HR
3.8.7. MSM6245 microprocessor subsystem
Industry standard ARM926EJ-S embedded microprocessor subsystem 16 kB instruction and 16 kB data cache Instruction set compatible with ARM7TDMI® ARM version 5TEJ instructions Higher performance 5 stage pipeline, Harvard cached architecture Higher internal CPU clock rate with on-chip cache
Java hardware acceleration Enhanced memory support
75 MHz and 90 MHz bus clock for SDRAM 32-bit SDRAM Dual memory buses separating the high-speed memory subsystem (EBI1) from low-speed
peripherals (EBI2) such as LCD panels 1.8 memory interface support for EBI1 and 1.8 V or 2.6 V memory interface support EBI2 NAND FLASH memory interface
- 8/16-bit data I/O width NAND flash support- 1- or 4-bit ECC- 512-byte/2KB page-size support- 2 chip selects supported for NAND Flash
Boot from NAND Low-power SDRAM (LP-SDRAM) interface
Internal watchdog and sleep timers
3.8.8. Supported interface features
USB On-the-Go core supports both slave and host functionality Three universal asynchronous receiver transmitter (UART) serial ports USIM controller (via UART) Integrated 4-bit secure digital (SD) controller for SD and Mini SD cards Parallel LCD interface General-purpose I/O pins External keypad interface
3. TECHNICAL BRIEF
- 40 -
3.8.9. Supported multimedia features
Provide additional general purpose MIPS by using: Two QDSP4000s Dedicated hardware accelerators and compression engines
Improve Java, BREW, and game performance Integrated Java and 2D/3D graphics accelerator with Sprite engine
Enable various accessories via USB host connectivity. Integrated USB host controller functionality
Enable compelling visual and audio applications.
QcameraTM
High-quality digital camera processing, supporting CCD or CMOS image sensors up to 2MP 30 fps QCIF viewfinder
QtvTM
Audio and video decoder that supports VOD, MOD and Broadcast multimedia services. Audio codecs supported: AMR-NB, AMR-WB, AMR-WB+, AAC, AAC Plus, Enhanced AAC Plus,
Windows® Media Audio v9, RealAudio® v8 Integrated stereo wideband codec for music/digital clips CMX Video codecs supported: MPEG-4, H.263, H.264, Windows Media® v9 and RealNetworks® v10
Video telephony services: QvideophoneTM
A two-way mobile video conferencing solution that delivers 15 fps @ QCIF, 64kbps Video codecs supported: MPEG-4 and H.263 Audio codecs supported: AMR-NB.
QcamcorderTM
Real time mobile video encoder Video codecs supported: MPEG-4, H.263.H.264 Audio codecs supported: AMR-NB Recording performance: 15 fps @ QCIF, 192 kbps
CMXTM (MIDI and still image, animation, text, LED/vibrate support) 72 simultaneous polyphonic tones 44 kHz sampling rate 512 kB wave table Support of universal file formats
Standard MIDI Format (SMF) SP-MIDI SMAF Audio playback (MA-2, MA-3, MA-5) XMF/OLS MFi (requires Docomo license)
3. TECHNICAL BRIEF
- 41 -
PNG decoder Pitch bend range support LED/vibrate support Scalable Vector Graphics (SVG- Tiny 1.1 + SVG Tiny 1.2) MLZ decoder Integrated PNG/SAF A.T.
Note:1. At this time, only 32-bit SDRAM is supported on the MSM6245 device. There are potential MIPSissues when running Bluetooth and video telephony concurrently with any other memory configuration.16-bit SDRAM and NOR FLASH are currently being evaluated and documentation will be updatedaccrdingly in the next revision.
Table 1-1 Summary of MSM6245 device features
3. TECHNICAL BRIEF
- 42 -
Table 1-2 Description of RF configurations
3. TECHNICAL BRIEF
- 43 -
3.8.10. Stereo Wideband CODEC
The MSM6245 device integrates a wideband voice/audio CODEC into the mobile station modem(MSM). The CODEC supports two differential microphone inputs, one differential earphone output, onesingle-ended earphone output, and a differential analog auxiliary interface.The CODEC integrates the microphone and earphone amplifiers into the MSM6245 device, reducingthe external component count to just a few passive components.The microphone (Tx) audio path consists of a two-stage amplifier with the gain of the second stage setexternally. The Rx/Tx paths are designed to meet the ITU-G.712 requirements for digital transmissionsystems.
3.8.11. Vocoder Subsystem
The MSM6245 device’s QDSP4000 supports AMR,FR,EFR and HR. In addition, the QDSP4000 hasmodules to support DTMF tone generation, DTMF tone detection, Tx/Rx volume controls, Tx/Rxautomatic gain control (AGC), Rx Automatic Volume Control (AVC), ear seal echo canceller (ESEC),Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable, 13-tap, Type-I, FIR,Tx/Rx compensation filters. The MSM6245 device’s integrated ARM9TDMI processor downloads thefirmware into the QDSP4000 and configures QDSP4000 to support the desired functionality.
3.8.12. ARM Microprocessor subsystem
The MSM6245 device uses an embedded ARM926EJ-S microprocessor. This microprocessor,through the system software, controls most of the functionality for the MSM device, including control ofthe external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through ageneric single serial bus interface (SSBI) the ARM926EJ-S configures and controls the functionality ofthe RFR6275, RTR6275, and PM6650 devices.
3.8.13. Mode Select and JTAG Interfaces
The mode pins to the MSM6245 device determine the overall operating mode of the ASIC. The optionsunder the control of the mode inputs are Native mode, which is the normal subscriber unit operation,ETM mode, which enables the built-in trace mode, and test mode for factory testing. The MSM6245device meets the intent of the ANSI/IEEE 1149.1A-1993 feature list. The JTAG interface can be usedto test digital interconnects between devices within the mobile station during manufacture.
3. TECHNICAL BRIEF
- 44 -
3.8.14. General-Purpose Input/Output Interface
The MSM62450 device has general-purpose bidirectional input/output pins. Some of the GPIO pinshave alternate functions supported on them. The alternate functions include USB interface, additionalRAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The functionof these pins is documented in the various software releases.
3.8.15. UART
The MSM6245 device employs three UARTs. UART1 has dedicated pins while UART2 and UART3share multiplexed pins.
3.8.16. USB
The MSM6245 device integrates a universal serial bus (USB) controller that supports bothunidirectional and bidirectional transceiver interfaces. The USB controller acts as a USB peripheralcommunicating with the USB host. MSM6245 supports the 3-wire functionality.
3. TECHNICAL BRIEF
- 45 -
3.9 Power Block
3.9.1. General
MSM6245, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power ofMSM6245, MSM memory, RF block, Bluetooth, USIM and TCXO. Major power components are :
3.9.2. PM6650
The PM6650 device (Figure 1-1) integrates all wireless handset power management. The powermanagement portion accepts power from all the most common sources - battery, external charger,adapter, coin cell back-up - and generates all the regulated voltages needed to power the appropriatehandset electronics. It monitors and controls the power sources, detecting which sources are applied,verifying that they are within acceptable operational limits, and coordinates battery and coin cellrecharging while maintaining the handset electronics supply voltages.
Eight programmable output voltages are generated using low dropout voltage regulators, all derivedfrom a common trimmed voltage reference. A dedicated controller manages the TCXO warm-up andsignal buffering, and key parameters (under-voltage lockout and crystal oscillator signal presence) aremonitored to protect against detrimental conditions.
MSM device controls and statuses the PM6650 IC using Single Serial Bus Interface (SSBI)supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interfacecircuit monitors multiple trigger events and controls the power-on sequence.
3. TECHNICAL BRIEF
- 46 -
Figure 1.12 PM6650 Functional Block Diagram
3. TECHNICAL BRIEF
- 47 -
3.9.3. Charging control
A programmable charging block in PM6650 is used for battery charging. It is possible to set limits forthe charging current. The external supply typically connects directly to pin (VCHG). The voltage on thispin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied ornot. For additional accuracy or to capture variations over time, this voltage is routed internally to thehousekeeping ADC via the analog multiplexer. PM6650 circuits monitor voltages at VCHARGER andICHARGE pins to determine which supply should be used and when to switch between the twosupplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of thepass transistor respectively.
Figure 1.13 U250/KU250 Battery Bar Display(Stand By Condition)
4.2V~3.82V100~70 (%)
3.81V~3.74V69~45 (%)
3.73V~3.69V44~20 (%)
3.68V~3.59V19~3 (%)
3.58V~3.20V2~0 (%)
Trickle Charging
Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is providedby the PM6650 IC, The trickle charger is on-chip programmable current source that supplies currentfrom VDD to pin (VBAT). Trickle charging can be used for lithium-ion and nickelbased batteries, with itsperformance specified below (3.2V). The charging current is set to 80mA.
3. TECHNICAL BRIEF
- 48 -
Parameter Min Typ Max Unit
Trickle Current 60 80 100 mA
3. TECHNICAL BRIEF
- 49 -
Constant Current Charging
The PM6650 IC supports constant current charging of the main battery by controlling the charger passtransistor and the battery transistor. The constant current charging continues until the battery reachesits target voltage, 4.2V.
Constant Voltage Charging
Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end ofconstant voltage charging is commonly detected 10% of the full charging current.
• Charging Method : CC & CV (Constant Current & Constant Voltage)
• Maximum Charging Voltage : 4.2V
• Maximum Charging Current : 600mA
• Nominal Battery Capacity : 950mAh
• Charger Voltage : 5.1V
• Charging time : Max 3h (Except time trickle charging)
• Full charge indication current (icon stop current) : 100mA
• Low battery POP UP : Idle - 3.58V, Dedicated(GSM/WCDMA) - 3.58V
• Low battery alarm interval : Idle - 3 min, Dedicated - 1min
• Cut-off voltage : 3.20V
3.10 External memory interface
The MSM6245 device was designed to provide two distinct memory interfaces. EBI1 was targeted forsupporting high speed synchronous memory devices. EBI2 was targeted towards supporting slowerasynchronous devices such as LCD, NAND flash, SDRAM, etc.
• EBI1 Features
- 16 bit static and dynamic memory interface
- 32 bit dynamic memory interface
- 24 bits of address for static memory devices which can support up to 32MBytes on each chip select
- Synchronous burst memories supported (burst NOR, burst PSRAM)
- Synchronous DRAM memories supported
- Byte addressable memory supporting 8 bit, 16 bit and 32 bit accesses
- Pseudo SRAM (PSRAM) memory support
• EBI2 Features
- Support for asynchronous FLASH and SRAM(16bit & 8bit).
- Interface support for byte addressable 16bit devices (UB_N & LB_N signals).
- Support for 8 bit/16bit wide NAND flash.
- Support for parallel LCD interfaces, port mapped of memory mapped(18 or 16 bit).
• 512Mb NAND(8bit) flash memory + 512Mb SDRAM (32bit)
3. TECHNICAL BRIEF
- 50 -
Interface Spec
Device Part Name Maker Read Access Time Write Access Time
FLASH HYC0UEH0MF3P hynix 60 ns 60 ns
SDRAM HYC0UEH0MF3P hynix 7 ns 7 ns
Table#1. External memory interface
3. TECHNICAL BRIEF
- 51 -
MSM6245
SDRAM
512Mb
NAND
512Mb
(64MB)
DATA[31:0]
ADDRESS[14:0]
WE*
CS*
CAS*
RAS*
CLK_EN
CLK
DQM[3:0]
NAND_CS*
NAND_RE*
NAND_WE*
NAND_CLE
NAND_WP*
NAND_ALE
NAND_READY
DATA[7:0]
EBI1 EBI2
Figure 1.14 Simplified Block Diagram of Memory Interface
3.11 H/W Sub System
3.11.1. RF Interface
A. RTR6275(WCDMA_Tx, GSM_Tx/Rx)MSM6245 controls RF part(RTR6275) using these signals.
• SBST : SSBI I/F signals for control Sub-chipset
• PA_ON1 : Power AMP on RF part
• RX0_I/Q_M/P,TX_I/Q_M/P : I/Q for T/Rx of RF
• TX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifier
• DAC_REF : Reference input to the MSM Tx data DACs
3. TECHNICAL BRIEF
- 52 -
Figure 1.15 Schematic of RF Interface of MSM6245
Close to MSM
RF
XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77
UART2_DP_RX_DATA_GPIO89H6
UART3_RFR_N_GPIO87L25
D16TCK
F19TCXO_EN_GPIO94
TDID15
A17TDO
F15TMS
L13TRK_LO_ADJ
TRST_NH15
TX_AGC_ADJH13
H12TX_ON_GRFC10
SYNTH0_GP_PDM0_GPIO92F18
H16RTCK
H18SBST1_GPIO93
F17PA_ON0
Q_IM_CH0AA25
W23Q_IM_CH1
Q_IP_CH0Y25
V23Q_IP_CH1
Q_OUTB12
Q_OUT_NA12
I_IM_CH0AB25
I_IM_CH1V25
I_IP_CH0AC25
I_IP_CH1W25
B13I_OUT
A13I_OUT_N
D17
GRFC0_GPIO3B8
GRFC1_AUX_SBDT_GPIO4A8
GRFC2_GPIO5D9
GRFC3_GPIO6F10
H10GRFC4_AUX_SBCK_GPIO7GRFC5_AUX_SBST_GPIO8
D11
T23GRFC7_GPIO10GRFC8_GPIO11
B4
T19GRFX6_GPIO9
GP_PDM1_PA_RAN_GE0H17
GP_PDM2_PA_RAN_GE1
DAC_REFF12
BT_DATA_GPIO20
BT_SBCK_GPIO23E26
E25BT_SBDT_GPIO22
BT_SBST_GPIO24F23
H21BT_TX_RX_N_GPIO21
K19AUX_PCM_CLK_GRFC14_GPIO80AUX_PCM_DIN_GRFC13_GPIO14
N21
G4AUX_PCM_DOUT_GRFC12_GPIO103
J8AUX_PCM_SYNC_GRFC11_GPIO102
BT_CLK_GPIO25G23
R19
33nF
C24
6R2132K
TX_AGC_ADJ
PA_R0
RCV_EN_N
SPK_AMP_EN
GSM_PA_ENGSM_PA_BAND
ANT_SEL1ANT_SEL0
LCD_IF_MODE_1
RX_QMRX_QPRX_IMRX_IP
PA_ON
TRK_LO_ADJTCXO_EN
TX_ON
BT_SBSTBT_SBCK
BT_TX_RX_NBT_DATA
BT_SBDT
BT_CLK
DAC_REF
TX_QMTX_QPTX_IMTX_IP
3. TECHNICAL BRIEF
- 53 -
B. the others
• TRK_LO_ADJ : TCXO(19.2M) Control
• PA_ON : WCDMA(2100) TX Power Amp Enable
• ANT_SEL[0-2] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx)
• GSM_PA_BAND : GSM/DCS-PCS Band Selection of Power Amp
• GSM_PA_RAMP : Power Amp Gain Control of APC_IC
• GSM_PA_EN : Power Amp Gain Control Enable of APC_IC
3.11.2. MSM Sub System
3.11.2.1. USIM Interface
SIM interface scheme is shown in Figure.
And, there control signals are followed
• USIM_CLK : USIM Clock
• USIM_Reset : USIM Reset
• USIM_Data : USIM Data T/Rx
3.11.2.2. UART Interface
UART signals are connected to MSM GPIO through IO connector with 115200 bps speed.
3. TECHNICAL BRIEF
- 54 -
Figure 1.16 SIM Interface
Table. UART Interface
MSM6245PM6650 USIM
USIM CLK
USIM Reset
USIM Data USIM Data
USIM Reset
USIM CLK
VREG_UIM 2.85V
GPIO_Map Name Note
GPIO_96 UART_RXD Data_Rx
GPIO_95 UART_TXD Data_Tx
3. TECHNICAL BRIEF
- 55 -
3.11.2.3. USB
The MSM6245 device contains a Universal Serial Bus (USB) interface to provide an efficientinterconnect between the mobile phone and a personal computer (PC). The USB interface of theMSM6245 was designed to comply with the definition of a peripheral as specified in USB Specification,Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USBSpecification, Revision 2.0. The USB Specification Revision 1.1 defines two speeds of operation,namely low-speed (1.5 Mbps) and full-speed (12 Mbps), both of which are supported by theMSM6245.
Table. USB Signal Interface
Figure 1.17 Schematic of USB block(MSM6245 Side & PM6650 Side)
Name Note
USB_DAT Data to/from MSM
USB_SE0 Data to/from MSM
USB_OE_N Out-Put Enable of Transceiver
USB_VBUS USB_Power From Host(PC)
USB_D+ USB Data+ to Host
USB_D- USB Data- to Host
G6
UA
RT
2_D
P_T
X_D
AT
A_G
PIO
88E
4
F4
UA
RT
2_R
FR
_N_G
PIO
91
L23
UA
RT
3_C
TS
_N_G
PIO
86U
AR
T3_
DP
_RX
_DA
TA
_GP
IO85
M21
M19
UA
RT
3_D
P_T
X_D
AT
A_G
PIO
84
N26
US
B_D
AT
_VP
US
B_O
E_T
P_N
N25
N23
US
B_S
E0_
VM
UA
RT
2_C
TS
_N_G
PIO
90
MM
C_C
LK_S
DC
C_C
LK_G
PIO
31M
16
H14
MM
C_C
MD
_GP
IO30
MM
C_D
AT
A_S
DC
C_D
AT
0_G
PIO
32L1
4
D6
GP
IO40
GP
IO42
D7
MM
C_C
LKM
MC
_DA
TA
MM
C_C
MD
US
IM_C
LK
PM
_IN
T_N
PS
_HO
LD
US
IM_D
AT
AU
SIM
_RS
T_N
US
B_S
E0
US
B_D
AT
US
B_O
E_N
1608
R309 2.2K
16USB_VBUS
17USB_DAT
18USB_D_P
19USB_SE0
20USB_D_M
21GP1_DRV_N(
22LC
DD
RV
N
12VREG_5V
13USB_OE_N
14VSW_5V
15USB_CTL_N
C336 4.7u
USB_D+USB_SE0
USB_D-
USB_OE_N
USB_VBUSUSB_CTL_N
USB_DAT
3.11.3 HKADC(House Keeping ADC)
The MSM6245 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended todigitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RFpower levels. The MSM6245 device has six analog input pins which are multiplexed to the input of theinternal HKADC.
3. TECHNICAL BRIEF
- 56 -
Figure 1.18 MSM6245 HKADC Block diagram
Table. HKADC channel table
Channel Signal Note
HKADC0 AMUX_OUT RF PAM Temperature Check
HKADC1 VBATT_SENSE Battery voltage level
HKADC2 NC NC
HKADC3 NC NC
HKADC4 PCB_Rev_ADC PCB Version Check
HKADC5 Battery_THERM Battery Temperature Check
3. TECHNICAL BRIEF
- 57 -
3.11.4. Key Pad
There are 23 main key buttons in Figure.
Shows the Keypad circuit. ‘END’ Key is connected to PMIC(PM6650).
Table. Key Matrix Mapping Table
Figure 1.19 Main Keypad Circuit
Figure 1.20 END Keypad Circuit
COL0 COL1 COL2 COL3 COL4
ROW(0) - CLR MENU
ROW(1) 1 2 3 LEFT UP
ROW(2) 4 5 6 OK RIGHT
ROW(3) 7 8 9 SEND SEARCH
ROW(4) * 0 # DOWN BACK
7
HOT3
4
2
8
1
6
9
HOT4
5
0
3
KEY MAP
OK
UP401 LEFT
405404
400
SEARCH
HOT400
403
SND
BACK
406
R42
3
100K
407
DN
MENU
408
RIGHT
100K
2 4 6 8
1 3 5 7
RA
400
HOT401
CLR
402
409
KEY_ROW(4)
KEY_ROW(3)
KEY_ROW(2)
KEY_ROW(1)
KEY_ROW(0)
KEY_COL(0)KEY_COL(1)KEY_COL(2)
KEY_COL(4)KEY_COL(3)
VREG_MSMP_2.7V
END
END
PM_ON_SW_N
3.11.5 Camera Interface
U250/KU250 Installed a 1.3M Pixel and 0.3Mega Camera. Below figure shows the camera socket typeconnector and camera I/F signal.
3. TECHNICAL BRIEF
- 58 -
Figure 1.21 Camera Socket Type Connector
VT_CAMERA_CONNECTOR
REV_1.0
REV_1.0
MEGA CAMERA CONNECTORCAMERA
REV_1.0
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
FL408
ICVE21184E150R500FR
5G
110
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
ICVE21184E150R500FR
FL407
5G
110
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
4INOUT_A4
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
ICVE21184E150R500FR
FL406
C41
310
p
P131314
P14P15
15
P16
1617P
17P
181819
P19
P22
P20
20
3P3P4
45
P5
P6
6 7P
7P
88 9
P9
CN404
GND1
GND2
GN
D3
GN
D4
GND5
GND6GN
D7
GN
D8
1P1
P10
10
11P11
12P12
R437 20
NA
C44
9
0R436
10p
C41
5
NA
C44
8
EV
L14K
0220
0V
A43
0
0.1u
FC
411
C42
4N
A
1uC
412
C41
40.
1u
VSYNC1918
HSYNC
7MCLK
20PCLK
PG
ND
132 31
PG
ND
2P
GN
D3
30 29P
GN
D4
PG
ND
528 27
PG
ND
6P
GN
D7
26 25P
GN
D8
9RESETB
11SCKSDA
10
STANDBY12
14V
DD
IO
AG
ND
16
AG
ND
217 16
AV
DD
22D0D1
2324
D2D3
12
D4D5
34
D6D7
5
8D
GN
D1
DG
ND
215 21
DG
ND
3
DV
DD
13
MEGA_CAM_PWR_DOWN
I2C_SDAI2C_SCL
MEGA_CAM_RESET_N
CAM_VSYNC_OUTCAM_HSYNC_OUT
VREG_CAM_AVDD_2.8V
CN403
VREG_CAM_DVDD_1.8VVREG_CAM_AVDD_2.8V
CAM_PCLK
CAM_MCLK
COMMON_CAM_MCLK
CAM_PCLK
CAM_DATA_OUT(3)CAM_DATA_OUT(2)
CAM_DATA_OUT(0)
CAM_DATA_OUT(4) CAM_DATA_OUT(5)
CAM_DATA_OUT(6)CAM_DATA_OUT(7)
CAM_HSYNC_OUT
I2C_SDA
VGA_CAM_RESET_N
VREG_CAM_DVDD_1.5V
CAM_DATA_OUT(1)
CAM_DATA(6)
CAM_DATA_OUT(0)
CAM_DATA_OUT(2)
CAM_DATA_OUT(5)
CAM_DATA_OUT(3)CAM_DATA_OUT(4)
CAM_DATA_OUT(1)
CAM_DATA_OUT(7)CAM_DATA_OUT(6)
COMMON_CAM_MCLK
I2C_SCL
CAM_VSYNC_OUT
CAM_DATA(1)CAM_DATA(2) CAM_DATA_OUT(2)
CAM_DATA(3)
CAM_DATA(5)CAM_DATA(4)
CAM_DATA_OUT(3)
CAM_DATA_OUT(5)
CAM_DATA(0)CAM_DATA_OUT(1)CAM_DATA_OUT(0)
CAM_DATA_OUT(4)
CAM_DATA(7)CAM_VSYNCCAM_HSYNC
CAM_DATA_OUT(6)CAM_DATA_OUT(7)CAM_VSYNC_OUTCAM_HSYNC_OUT
3. TECHNICAL BRIEF
- 59 -
The MEGA Camera module is connected to socket type connector with 24 pin (F95M08). Its interfaceis dedicated camera interface port in MSM6245. The camera port supply 24.576MHz master clock tocamera module and receive 49.152MHz pixel clock (15fps), vertical sync signal, horizontal sync signal,reset signal and 8bits data from camera module. The camera module is controlled by I2C port fromMSM6245.
Table. Interface between MEGA Camera Module and MAIN PCB (in camera module)
Pixel Clock (49.152M)OCAM_PCLK20
Vertical SyncO CAM_VSYNC_OUT19
Horizontal SyncO CAM_HSYNC_OUT18
GNDGNDGND17
GNDGNDGND15
AVDDIVREG_CAM_AVDD_2.8V16
GNDGNDGND21
DataOCAM_DATA_OUT(5)3
DataOCAM_DATA_OUT(6)4
DataOCAM_DATA_OUT(7)5
GNDGNDGND6
MCLK7
GNDGNDGND8
Camera reset signalIMEGA_CAM_RESET_N9
I2C_SDA10
VDDIOIVREG_CAM_AVDD_2.8V14
DVDDIVREG_CAM_DVDD_1.8V13
Camera power downIMEGA_CAM_PWR_DN12
I2C_SCL11
DataOCAM_DATA_OUT(4)2
DataOCAM_DATA_OUT(3)1
NotePortNameNo
DataOCAM_DATA_OUT(0)22
DataOCAM_DATA_OUT(1)23
DataOCAM_DATA_OUT(2)24
I Master Clock(24.576M)
O I2C Data
O I2C Clock
3. TECHNICAL BRIEF
- 60 -
The VGA Camera module is connected to socket type connector with 20 pin (CLE9120-2761E). Itsinterface is dedicated camera interface port in MSM6245. The camera port supply 24.576MHz masterclock to camera module and receive 12.288MHz pixel clock (15fps), vertical sync signal, horizontalsync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from MSM6245.
Camera I/O PowerIVREG_AVDD_2.8V20
Camera I/O PowerIVREG_AVDD_2.8V19
Camera reset signalI VGA_CAM_RESET_N18
I2C ClockII2C_SCL17
GNDGNDGND15
I2C DataI I2C_SDA16
GNDGNDGND3
Clock for Camera Data Out(12.288M)OCAM_PCLK4
DataOCAM_DATA(0)5
DataOCAM_DATA(1)6
DataO CAM_DATA(2)7
DataOCAM_DATA(3)8
DataOCAM_DATA(4)9
DataOCAM_DATA(5)10
Horizontal SyncOCAM_HSYNC14
Vertical SyncOCAM_VSYNC13
DataOCAM_DATA(7)12
DataOCAM_DATA(6)11
Master Clock(24.576M)ICAM_MCLK2
DVDDIVREG_CAM_DVDD_1.8V1
NotePortNameNo
Table. Interface between VGA Camera Module and MAIN PCB (in camera module)
3. TECHNICAL BRIEF
- 61 -
3.11.6 Keypad Light
There are 8 Blue LEDs in Main key backlight circuit, which are driven by KYDB_BACKLIGHT line fromPM6650.
Figure 1.22 Schematic of KEY back light circuit (KEY side)
KEY_BACK_LIGHT LED(8EA)
REV_B : EDLH0013501 --> EDLH0006001
R418
100ohm
100ohm
R415100ohm
R411
R413 100ohm
LD408 LEBB-S14H
LEBB-S14HLD405
LD406 LEBB-S14H
R414100ohm
LD400 LEBB-S14H
100ohm
R417
LD404 LEBB-S14HLEBB-S14HLD403
100ohmR416
LEBB-S14HLD402
R419 100ohm
LEBB-S14HLD407
+VPWR
KYBD_BACKLIGHT
3. TECHNICAL BRIEF
- 62 -
3.11.7. LCD Module (NM176CN1 : Tovis)
- The NM176CN1 model is a Color TFT Main supplied by Tovis. This LCD Module has a 1.76 inchdiagonally measured active display area with 176(RGB)X220 resolution. each pixel is divided intoRed, Green and Blue sub-pixels and dots which are arranged in vertical stripes.
* Features
- Display mode(Main LCD) : Normally White, Transmissive TN mode 265K colors.
- LCD Driver IC: NT3916 (NOVATEK).
- 16 bit CPU interface Parallel
3.11.8. Display & LCD FPC Interface
LCD module is connected to LCD KEY FPCB with 35 pin (XF2B-3545-31A / OMROM) The LCDmodule is controlled by 16-bit EBI2 in MSM6245.
LCD CONNECTOR
INS
TP
AR
PLW
0501
H-L
FD
402
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
ICVE21184E150R500FR
FL401
3334
35
45
67
89
2
2021
2223
2425
2627
2829
3
3031
32
CN400
1
1011
1213
1415
1617
1819
C40
90.
1u
5
G2
10INOUT_A1
1
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
FL400
ICVE21184E150R500FR
G1
INOUT_A33
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
FL402
ICVE21184E150R500FR
5G
110
G2
1INOUT_A1
INOUT_A22
EV
L14K
0220
0
VA
410
FL403G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
ICVE21184E150R500FR
10G
2
1INOUT_A1
INOUT_A22
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
ICVE21184E150R500FR
FL405
5G
1
EV
L14K
0220
0
VA
409
EBI2_DATA(7)
EBI2_DATA(5)EBI2_DATA(4)
EBI2_DATA(6)
WLED_1
WLED_3
VREG_LCD_2.8V
LCD_ADSLCD_CS_N
LCD_RESET_N
LCD_VSYNC
LCD_IF_MODE_0LCD_IF_MODE_1
EBI2_DATA(13)
EBI2_DATA(15)
EBI2_DATA(11)
EBI2_DATA(9)
EBI2_DATA(14)
EBI2_DATA(12)
EBI2_DATA(0)
EBI2_DATA(2)EBI2_DATA(3)
EBI2_DATA(1)
EBI2_DATA(8)
EBI2_DATA(10)
EBI2_WE_NEBI2_OE_N
WLED_PWR
WLED_2
LCD_MAKER_ID
Figure 1.23 Interface between LCD Module and MAIN PCB.
3. TECHNICAL BRIEF
- 63 -
3.11.8.1. Audio Signal Processing & Interface
Audio signal processing is divided uplink path and downlink path. The uplink path amplifies the audiosignal from MIC and converts this analog signal to digital signal and then transmits it to DBB Chip(MSM6245). This transmitted signal is reformed to fit in GSM & WCDMA frame format and delivered toRF Chipset. The downlink path amplifies the signal from DBB chip (MSM6245) and outputs it toreceiver (or speaker).
The receive path can be directed to either one of two earphone amplifiers or the auxiliary output. Theoutputs earphone1 (EAR1OP, EAR1ON) and auxiliary out (LINE_P, LINE_N) are differential outputs.Earphone2 (HPH_L, HPH_R) is a single-ended output stage designed to drive a headset speaker.
The microphone interface consists of two differential microphone inputs, one differential auxiliary inputand a two-stage audio amplifier.
(+16.5dB)
Figure 1.24 Audio Interface Detailed Diagram(MSM6245)
3. TECHNICAL BRIEF
- 64 -
MSM6245 CODEC pins
MSM pin W18
(CODEC VSS)
AUDIO
Place near
Near to MSM
10%
C201 47p
F25SDCC_DAT1_GPIO99
SDCC_DAT2_GPIO100M25
M26
AF
20M
IC1N
AE
20M
IC1P
MIC
2NA
F21
AF
22M
IC2P
T15
MIC
BIA
S
AC
21LI
NE
_L_I
NLI
NE
_L_I
PA
C22
LIN
E_O
NA
C18
AC
17LI
NE
_OP
LIN
E_R
_IN
AC
20
AC
19LI
NE
_R_I
P
W17
HP
H_L
HP
H_R
AA
17
HP
H_V
RE
FA
A19
AE
18E
AR
1ON
AF
18E
AR
1OP
AA
20C
CO
MP
AU
XIN
AF
19
AU
XIP
AE
19
AA
18A
UX
OU
T
220n
36R
202
C20
3
10pC204
220n
C20
2
C21
122
n
C2120.1u
22n
C21
047pC200
LIN
E_N
LIN
E_P
MIC
2N
MIC
1NM
IC1P
MIC
2P
HP
H_R
HP
H_L
RC
V-
RC
V+
MIC
BIA
S
Figure 1.25 Audio part schematics
Figure 1.26 Audio part schematics
I/O CONNECTOR
R40
21M
C4000.1u
C401 33u
100K
R40
5 100ohmR406
U400NCS2200SQ2T2G
2GND
1OUT
VCC
5
3 VIN+
VIN-4
R403
51K
89
19
2
21
34567
CN401HSEJ-18S04-25R
1
33uC402 R407 100ohm
R404
10K
R400
2.2K
R401
5.1K
MIC2N
VBATT
MIC2P
MICBIASVREG_MSMP_2.7V
HPH_L
USB_D-EAR_SENSE_N
USB_D+
VREG_MSMP_2.7V
HOOK_KEY
HPH_R
3. TECHNICAL BRIEF
- 65 -
REV_B
AUDIOSELECT_SPK&RCV
R422 10
R42110
VA
412
EV
L14K
0220
0VA
414
EV
L14K
0220
0
3COM1
9COM2
6GND
IN14
IN28
5NC1
NC27
NO12
NO2101
VCC
U401NLAS5223BMNR2G
0.01uC410 SPK_RCV+
RCV_EN_NSPK_RCV-
RCV-
RCV+
SPK-
SPK++VPWR
REV_B : EDTY0008606 --> EDTY0008601
MIC
REV_B : SUMY0010301 --> SUMY0003802
C42
139
p
C42
039
p
C419 0.1u
D40
3
PS
D05
-LF
INS
TP
AR
PS
D05
-LF
D40
4
INS
TP
AR
2.2KR424
47pC417
R42
52.
2K
12
OB4-15L42-C33LMIC400
C418 0.1u
10uC416
MICBIAS
MIC1P
MIC1N
Figure 1.27 Audio part schematics
3. TECHNICAL BRIEF
- 66 -
Audio part schematics
REV_C : 20K --> 3K
Audio AMP
REV_E : For Antenna Radiation
5.6KR430
C423
C4281u
0.1uR427 1KR429 1K
C431NA
C422 0.1u
2
4INMINP
3
OUTA5
8OUTB
VM7
VP6
1_SD
NCP2890DMR2
U402BYPASS
5600
pC
426
RCVP
10uC425
C42
910
00p
R4285.6K
RCVN
C43
010
00p
R426
20K
100nHL402
L401 100nH
C42
7560
0p
R431
20K
SPK_RCV+
SPK_RCV-
LINE_PLINE_N
+VPWR
SPK+
SPK_AMP_EN SPK-
3. TECHNICAL BRIEF
- 67 -
3.11.8.2. Audio Mode
There are three audio modes (Voice call, speaker phone, MIDI/MP3).
Audio & Sound Main Component
There are 6 main components in U250/KU250.
Table. Audio Mode
Table. Audio main component list
Headset MP3Headset
Headset MIDI BellHeadset
Speaker MP3Loud Mode
MP3
Speaker MIDI BellLoud Mode
MIDI
Speaker PhoneLoud Mode
Headset Voice CallHeadset
Speaker PhoneLoud ModeSpeaker phone
Receiver Voice Call
Description
Receiver Mode
Voice Call
DeviceMODE
Speaker/ReceiverEMS1810TPSpeaker/Receiver4
-42 dB microphoneOB4-15L42-C33LMIC400MIC5
Ear jackRMBLGG080STSBEar jack6
Dual Analog SwitchNLAS5223BMNR2GU401Analog Switch3
1W Audio Amp
Base-Band Modem
Note
NCP2890DMR2
MSM6245
Maker Part No.
U402
U201
Design No.
Audio amp
MSM6245
Component
2
1
3. TECHNICAL BRIEF
- 68 -
3.12 Main Features
1. LG-U250/KU250 Main features
- Bar Type
- WCDMA(2100) + GSM Tri-Band (900/1800/1900)
- Color LCD (Main:262K TFT, 1.76”)
- Dual Camera (1.3Mega + VGA(0.3M))
- 1810 speaker/receiver
- Stereo Headset
- Speaker phone (in GSM and WCDMA)
- MP3/AAC decoder and play
- MPEG4 encoder/decoder and play/save
- JPEG en/decoder
- Supports Bluetooth, USB
- 950 mAh (Li-Ion)
3. TECHNICAL BRIEF
- 69 -
2. U250/KU250 Main Component
Main board (Bottom)Main board (Top)
Logic /Audio
RF
Bluetooth
Logic
3. TECHNICAL BRIEF
- 70 -
RF
U101
X100
SW100
FL101
U103
U100
FL104
U500
Reference Description Reference Description
SW100 Ant. Switch module FL104 W2100 Duplex
U500 Front End module U103 WCDMA PAM
U101 GSM PAM X100 VCTCXO
FL101 GSM SAW BT module
U100 RTR6275
3. TECHNICAL BRIEF
- 71 -
Logic / Audio
Reference Description Reference Description
BAT300 Backup Battery CN401 MMI connector (18pin)
U303 1.3M Cam. LDO CN403 1.3M Cam. Connector
U402 Audio AMP
CN401
CN403
BAT300
U402
U303
3. TECHNICAL BRIEF
- 72 -
Logic
U201
U301
U300
J300
CN400
S300
Reference Description Reference Description
U201 MSM6245_A U300 PMIC
U301 Memory MCP J300 U-SIM socket
CN400 Main To LCD Connector S300 T-FLASH socket
4. TROUBLE SHOOTING
- 73 -
4.1 RF Component
4. TROUBLE SHOOTING
LGM
C
4. TROUBLE SHOOTING
- 74 -
BlockDiagram
BlockRef. Name
UMTS
Part Name Function Comment
4. TROUBLE SHOOTING
- 75 -
4.2 SIGNAL PATH_UMTS RF
Common Tx/Rx
UMTX 2100 Tx/Rx
UMTX 2100 Tx
UMTX 2100 Rx
Tx I/Q
LO
RX I/Q
4.3 SIGNAL PATH_GSM RF
4. TROUBLE SHOOTING
- 76 -
Common Tx/Rx
GSM900 Tx
PCS Rx
Tx I/Q
LO
RX I/Q
DCS/PCS Tx
EGSM900 RX
DCS RX
4. TROUBLE SHOOTING
- 77 -
4.4 Checking VC-TCXO Block
The reference frequency (19.2MHz) from X100 (VC-TCXO) is used in UMTSTX part, GSM part and BB part.
TCXO
2 4
VCC
5
TC7SH04FUU104
GND
3
100pC185
0.1u
C18
1
R124100ohm
1000
pC
182
R128 100K
C18
30.
01u
1000p
C186
DSA321SCE-19.2MX100
GND2
5NC1NC2
67NC3NC4
8
OUTPUT3
4VCC
1VCONT
19.2MHz
0.01uC188C187 1000p
VREG_TCXO_2.85V
TRK_LO_ADJ
TCXO_BT
VR
EG
_BT
_2.8
5VTCXO_PM
RTR6275_TCXO
TP2
TP1
TP3
TP4
Schematic of the VC-TCXO Block
Test Point of the VC-TCXO Block
TP1
TP4
TP3
TP2
4. TROUBLE SHOOTING
- 78 -
Check C312 of PMIC (U300)
Check R213 of MSM (U201)
T
4. TROUBLE SHOOTING
- 79 -
4.5 Checking Front-End Module Block
Rev.D
Rev.B
Rev.C
R1011KR1001K
L108
15nH
C11710p
C11033p
2114
GSM18001900_TX
GSM1800_RX11
GSM1800_RX22
GSM1900_RX134
GSM1900_RX2
GSM900_RX156
GSM900_RX2
16GSM900_TX
VDD19
WCDMA21009
AN
T11
CTRL118
CTRL222
7GND1
GND1023
GND28
GND310
GND412
GND51315
GND617
GND7GND8
20
GND9
U500
D5011
33pC109
VREG_RF_SMPS
ANT_SEL1ANT_SEL0
ANT_SEL0
ANT_SEL1
TP1
Schematic of the Front-End Module Block
Test Point of the Front-End Module Block
TP1
4. TROUBLE SHOOTING
- 80 -
Logic Table of the FEM
TP1 VREG RF SMPS
GSM 1800 / GSM1900 RX
GSM 900 RX
GSM 900 TX / WCDMA
GSM 1800 / GSM 1900 TX
4. TROUBLE SHOOTING
- 81 -
4.6 Checking UMTS Block
4.6.1 Checking Tx level
TP1
TP2
TP3
TP4
Rev.D
1pC437
ANT101
NAL101
56pC101
ANTG1
G2RF
SW100
KMS-507
100nHL102
ANT102
C45022p
11
U500
C102NA
20dB
Rev_1.0
Rev.B
Rev_1.0
Rev.D
WCDMA
7dB
0.5pL125
FL102EFCH1950TDF1
2
G1
3
G2
5G3 1
IN
4O1
U102
CP0402A1950DNTR
50O
HM
4 3C
OU
P2
IN
1O
UT
L4041.8nH
45
31
NAL122
KRX102UTR100
2
1pC165
3.3p
C162
C15915p
R122130
R11
951
1.5pC154
4 1RXTX
2
FL104
ACMD-7602
ANT3
PGND
130R121
0.1uC170
4.7uC155
47R120
2
RFOUT8
1VCC1VCC2
10
4VCONT
5VREF
WS2512_TR1G U103
11BGND
GND13
GND267
GND3
9GND4 RFIN
0.5pC164
100pC192
C15815p
1nHL123
10nHC157
+VPWR
PA_R0
+VPWR
PWR_DET
PA_ON
VREG_TCXO_2.85V
For testing, Max power of UMT 2100 is needed.
TP1
TP2
TP3
TP4
4. TROUBLE SHOOTING
- 82 -
4. TROUBLE SHOOTING
- 83 -
4.6.2 Checking UMTS PAM Control Block
• PAM control signal1. PWR_DET : UMTS Tx Power Detected value (Check R120)
2. TX_AGC_ADJ : UMTS RTR6275 Tx Amp Gain Control
3. VREG_TCXO_2.85V : UMTS PAM enable (C170) (about 2.85V)
4. +VPWR : UMTS PAM Main Voltage ( 3V < +VPWR < 4.2V)
5. PA_ON : Turns the PA on and off
6. PA_R0 : Control signals that step the active PA mode and bias
PWR_DET
VREG_TCXO_2.85 +VPWR
4. TROUBLE SHOOTING
- 84 -
4.6.3 Checking RF Rx Level
TP1
TP2
TP4
TP3Vbias
R D
1pC437
ANT101
NAL101
56pC101
ANTG1
G2RF
SW100
KMS-507
100nHL102
ANT102
C45022p
U500
C102NA
Rev.D
20dB
Rev_1.0
Rev.B
Rev.D
Rev_1.0
Rev.D
Rev.D
WCDMA
7dB
L4104.7nH
0.5pL125
L40810nH
C156100p
FL102EFCH1950TDF1
2
G1
3
G2
5G3 1
IN
4O1
U102
CP0402A1950DNTR
50O
HM
4 3C
OU
P2
IN
1O
UT
L4041.8nH
45
31
NAL122
KRX102UTR100
2
1pC165
C4452.2p
L4114.7nH
2.2p
C161
3.3p
3
O2
4
C162
EFCH2140TDE1
FL103
G1
2
G2
5
IN1
O1
C15915p
C17410p
R122130
R11
951
1.5pC154
C4442.2p4 1
RXTX
2
FL104
ACMD-7602
ANT3
PGND
L4094.7nH
130R121
L1211nH
0.1uC170
4.7uC155
47R120
2
RFOUT8
1VCC1VCC2
10
4VCONT
5VREF
WS2512_TR1G U103
11BGND
GND13
GND267
GND3
9GND4 RFIN
0.5pC164
L1281.8nH
100pC192
L4072.7nH
C15815p
1nHL123
10nHC157
+VPWR
PA_R0
VDD_RX
+VPWR
PWR_DET
PA_ON
VREG_TCXO_2.85V
TP1
TP2
TP3
Vbias
TP4
4. TROUBLE SHOOTING
- 85 -
4. TROUBLE SHOOTING
- 86 -
4.7 Checking GSM Block
1
32
4. TROUBLE SHOOTING
- 87 -
4.7.1 Checking RF Tx level
4.7.2 Schematic of RF Tx level
TP1
TP2
TP3
Rev.D
Rev.D
Rev.C
R1011K
10nHL116
R1001K
100pC438
C124100p
5.6pC441
L108
15nH
1.5nHL403
L11518nH
100o
hm
R10
7
C1230.01u
C11710p
56pC101
68pC139C137
NA
ANTG1
G2RF
SW100
KMS-507
C1340.01u
GN
D3
9G
ND
410
GN
D5
GN
D6
12
GN
D7
13
GN
D8
14
GN
D9
16
21P_GND
19RSVD_GND
VA
PC
20 17V
BA
TT
2V
CC
1A
6V
CC
1B
BS1
DCS_PCS_IN315
DCS_PCS_OUT
EGSM_IN4
EGSM_OUT11
ENABLE18
GN
D1
5
GN
D2
78
SKY77318
U101
100nHL102
C12133u
C110
C138
33p
NA
2114
GSM18001900_TX
GSM1800_RX11
GSM1800_RX22
GSM1900_RX134
GSM1900_RX2
GSM900_RX156
GSM900_RX2
16GSM900_TX
VDD19
WCDMA21009
AN
T11
CTRL118
CTRL222
7GND1
GND1023
GND28
GND310
GND412
GND51315
GND617
GND7GND8
20
GND9
U500
D5011
C102NA
33pC109
GS
M_P
A_R
AM
P
ANT_SEL1ANT_SEL0
TP1
TP2
TP3
4.7.3 Checking RF Tx level
4. TROUBLE SHOOTING
- 88 -
4. TROUBLE SHOOTING
- 89 -
4.7.4 Checking PAM Block
TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.2V < Vramp < 1.6V
TP2. GSM_PA_EN : Power Amp Enable
(Power ON : higher than 1.25V , Power OFF : lower than 0.4V)
TP3. GSM_PA_BAND : Power Amp Band Selection Control
(GSM Mode : -0.2V < VBS < 0.4V , DCS/PCS Mode : 1.25V < VBS < 3.0V)
TP4. +VPWR : PAM Supply Voltage Vcc higher than 3.0V
Schematic of GSM PAM Block
TP1
TP2 TP3
TP4
Rev.D
EGSM
C1360.01u
10nHL116
100pC438
4p 1.5nH
L403
100ohm
100ohmR113
R117
100o
hm
R10
7
C15315p
EFC
FL1
C1230.01u
68pC139
C1340.01u
GN
D3
9G
ND
410
GN
D5
GN
D6
12
GN
D7
13
GN
D8
14
GN
D9
16
21P_GND
19RSVD_GND
VA
PC
20 17V
BA
TT
2V
CC
1A
6V
CC
1B
BS1
DCS_PCS_IN315
DCS_PCS_OUT
EGSM_IN4
EGSM_OUT11
ENABLE18
GN
D1
5
GN
D2
78
SKY77318
U101
C14915p
C12133u
C138NA
+VPWR
GSM_PA_BAND
GSM_PA_EN
GS
M_P
A_R
AM
P
TP2
TP4
TP3
TP1
4.7.5 Checking RF Rx Block
Schematic of GSM900/DCS/PCS Rx Block
4. TROUBLE SHOOTING
- 90 -
TP1. DCS RX INPUT
TP2. PCS RX INPUT
TP3. GSM RX INPUT
TP1
TP2
TP3
Rev.C
Rev.D
EGSM
DCS
Rev.C
PCS
R1011K
NAC191
C442 5.6p
10nH
5p
L116
R1001K
C440
L406 2.7nHC124100p
NAC120
0.5pC190
C105NA
5pC439
NAC116
1.5nHL403
L11518nH
C1230.01u
L1115.6nH
100nHL102
C12133u
5.6pC443C11033p
2114
GSM18001900_TX
GSM1800_RX11
GSM1800_RX22
GSM1900_RX134
GSM1900_RX2
GSM900_RX156
GSM900_RX2
16GSM900_TX
VDD19
WCDMA21009
AN
T11
CTRL118
CTRL222
7GND1
GND1023
GND28
GND310
GND412
GND51315
GND617
GND7GND8
20
GND9
U500
D5011
33pC109
2.7nHL405
+VPWR
GS
M_P
A_R
AM
P
ANT_SEL1ANT_SEL0
TP1
TP2
TP3
4. TROUBLE SHOOTING
- 91 -
4.8 Checking Bluetooth Block
Test Point of the Bluetooth Block
Test Point of the Bluetooth Block
Schematic of the Bluetooth Block
4. TROUBLE SHOOTING
- 92 -
TP1. VREG_BT_2.85V
TP2. VREG_MSMP_2.7V
TP3. TCXO_BT
TP4. BT ANT Output
TP1
TP2
TP3
TP4
BLUETOOTH
NAL126
1000pC171
R118
0
C16
9
NA
100p
C17
8
1uC172
C17
910
0p
ANT103
FEED
NC1
NC2
ACS2450HBAXX
C17
70.
1uF
SYNC_DET_TX_EN5
VCC_OUT3
14VDD_BAT
2VDD_INT
10VDD_MSM
7XTAL_IN
16A
NT
CLK_REF9
GN
D1
1
GN
D2
6
GN
D3
8
GN
D4
15
PG
ND
117
PG
ND
21819
PG
ND
3P
GN
D4
20
13RX_BB_TX_BB
11SBCKSBDT
12
4SBST
LBRQ-2B43A
M100
1000p C176
C173 2.2u
C18
02.
2u
0
R123BT_DATA
TCXO_BT
VREG_MSMP_2.7V
BT_CLKBT_SBCKBT_SBDT
BT_SBST
VREG_BT_2.85V
BT_TX_RX_N
TP4
TP1 TP3
TP2
4. TROUBLE SHOOTING
- 93 -
Start
TP1,TP2 Signals exits?
TP3 Is clock ok? 19.2M
TP4 Signals exits?
Change the Main board
Change the M100
NO
YES
YES
YES
NO Change the X100
NO
Change the Main board
4.9 Power ON Troubleshooting
Power On sequence of U250/KU250 is :
PWR key press → PM_ON_SW_N go to low, PM6650 KPDPWR_N (pin24) → PM6650 Power Up →
VREG_MSMC_1.2V, VREG_MSME_1.8V, VREG_MSMP_2.7V, VREG_MSMA_2.6V,
VREG_TCXO_2.85V power up and system reset assert to MSM6245 → Phone booting and
PS_HOLD assert to PMIC
4. TROUBLE SHOOTING
- 94 -
Start
Battery voltage. higher than 3.20V?
Key press?
VREG_MSMC_1.2V,VREG_MSMP_2.7V, VREG_MSME_1.8V, VREG_TCXO_2.85V, VREG_MSMA_2.6V power up?
Is clock ok?R306 : 19.2MX300 : 32.768Khz
Change the Main board
Change or charging the
Battery
Check the Key Dome
Change the Main board
Check the TXCO
NO
YES
YES
YES
YES
NO
NO
NO
4. TROUBLE SHOOTING
- 95 -
VREG_MSMP
VREG_MSMA
VREG_MSME
VREG_MSMC
X300 : 32.768Khz
R306 : 19.2Mhz
[U250/KU250 Main PCB BOTTOM]
4. TROUBLE SHOOTING
- 96 -
4.10 Charger Troubleshooting
Charging Procedure
- Connect TA or USB Cable
- Control the charging current by PM6650 IC
- Charging current flows into the battery
Troubleshooting Setup
- Connect TA and battery to the phone
Check Point
- Connection of TA or USB Cable
- Charging current path
- Battery
Troubleshooting Procedure
- Check the charger (TA or USB Cable) connector
- Check the charging current Path
- Check the battery
CHARGER
Differential lines, route as equal length as possible !! --> ICHARGE , ICHARGEOUT
G
S
SI3
493D
V-E
3
D1
D2
D3
D4
Q30
1
Q302QST4
3 B1
C1 C22
56 4
0.1
R313
2C2
56 4
QST4
B3C11
Q300
USB_VBUS
ICHARGEOUT
VBATT
BATT_FET_N
+VPWR
ICHARGE
CHG_CTL_N
+5V_PWR
USB_CTL_N
4. TROUBLE SHOOTING
- 97 -
[ Charger Troubleshooting Flow ]
Start
Check the pin and batteryConnect terminals of I/O connector
Connection OK? Change I/O connector
Is the TA (or USB Cable) voltage 5.1V (or 5.0V)?
Change TA (or USB Cable)
Is it charging properlyAfter turning on Q301(or Q302)
, Q302? END
Change the board
NO
Yes
NO
Yes
NO
Yes
4. TROUBLE SHOOTING
- 98 -
R313
Q301
Q302
Q300
[ Charging part ( Main PCB Front ) ]
4. TROUBLE SHOOTING
- 99 -
4. BB Trouble Shooting
4.11 USB Troubleshooting
USB Initial sequence of U250/KU250 is :USB connected to U250/KU250 power on → USB_VBUS(Q300) go to 5V → USB_D+ go to 3.3V →USB_DAT is triggered → USB work.
Start
Q400 pin 4 is 5V?
USB_D+ is 3.3V?
Change the Main board
Check Q300 (pin 4)
Check VA401
NO
YES
YES
NO
Cable is inserted?
YES
Insert cableNO
Power is on?
YES
Go to power on trouble shootingNO
4. TROUBLE SHOOTING
- 100 -
4.12 SIM Detect Troubleshooting
USIM Initial sequence of U250/KU250 is :USIM_CLK,USIM_RST,USIM_DATA triggered → VREG_UIM_2.85V go to 2.8V → USIM IF work
Start
Work well?
VREG_UIM_2.85V is 2.85V?USIM_P_CLK is run?
Change the Main board
End
Check J300
Yes
No
YES
NO
Re-insert the SIM card
Change SIM card
Work well? EndYes
No
4. TROUBLE SHOOTING
- 101 -
1 VREG_USIM_2.85V
2 USIM_P_RST_N
USIM_P_CLK3
7 USIM_P_DATA123
7 6 5
USIM
VA
302
EV
LC18
S02
003
VA
301
EV
L14K
0220
0
C35
30.
1usm
d_10
05h_
5_r
C35
2sm
d_10
05h_
5_r
33p
R317 15K
EV
LC18
S02
003
VA
300
6
CLK3
5GND1
GND29
10GND3 GND4
1211
GND5
IO7
2RST
4RSV1
8RSV2
1VCC
VPP
J300 HSSC-8P-18
L30256nH
VREG_USIM_2.85VUSIM_P_RST_NUSIM_P_CLKUSIM_P_DATA
Figure. USIM part schematics
4. TROUBLE SHOOTING
- 102 -
4.13 Camera Troubleshooting
Camera control signals are generated by MSM6245.
4.13.1 MEGA CAMERA
Start
Yes
NO
ENDCamera is OK?
Check the camera connector andreconnect the camera
Change the Main board
Camera is OK
Check the CAM_MCLK
Change the camera
Yes
Yes
NONO
NO
END
Yes
Change the Main board
Change the Main board
4. TROUBLE SHOOTING
- 103 -
4.13.2 VGA CAMERA
Start
Yes
NO
ENDCamera is OK?
Check the camera connector andreconnect the camera
Change the Main board
Camera is OK
Check the CAM_MCLK
Change the camera
Yes
Yes
NONO
NO
END
Yes
Change the Main board
Change the Main board
4. TROUBLE SHOOTING
- 104 -
C349
U303
U501
C348
C347
C350
C447
CAMERA LDO
REV_D
6BGND
2GND
NC5
STBY1
3VIN VOUT
4
BH15LB1WHFVU501
1uC348
1uC447
C3491u
1uC350
NC26
9P
GN
D
VIN1 8
VOUT1VOUT2
7
RT9011-MGPQWU303
2EN1
3EN2
5GNDNC1
4
1uC347
VREG_CAM_DVDD_1.5V
CAM_LDO_EN
+VPWR
VREG_CAM_DVDD_1.8VVREG_CAM_AVDD_2.8V+VPWR
CAM_LDO_EN
4. TROUBLE SHOOTING
- 105 -
4.14 Keypad Backlight Troubleshooting
Key Pad Back Light is on as below :Key pressing → KYBD_BACKLIGHT go to 0V → MAIN Key Backlight LED On
Figure.Keypad backlight LED part
Start
Change the Main board
Check battery NO
Yes
Yes
Key press
Change the Main board
Yes
NO
+VPWR is above 3.2V?
KYBD_BACKLIGHT is 0V ?
Backlight LED ON?
No
ENDYES
+VPWR
KEY_BACK_LIGHT LED(8EA)
REV_B : EDLH0013501 --> EDLH0006001
R418
100ohm
100ohm
R415100ohm
R411
R413 100ohm
LD408 LEBB-S14H
LEBB-S14HLD405
LD406 LEBB-S14H
R414100ohm
LD400 LEBB-S14H
100ohm
R417
LD404 LEBB-S14HLEBB-S14HLD403
100ohmR416
LEBB-S14HLD402
R419 100ohm
LEBB-S14HLD407
+VPWR
KYBD_BACKLIGHT
4. TROUBLE SHOOTING
- 106 -
4.15 Main LCD Troubleshooting
Main LCD control signals are generated by MSM6245. The signal path is :MSM6245 → CN400 → LCD Module
Start
GO to power on trouble shootingKey LED is on?
Change the LCD module
Yes
NO
Press END key
Disconnect and reconnectThe LCD connector
ENDLCD display OK?
No
Yes
ENDLCD display OK?
No
Yes
Change the Main board
4. TROUBLE SHOOTING
- 107 -
4.16 Receiver Path
MSM6245 EAR1ON/EAR1OP → R421,R422 → Analog Switch(U401) → Receiver
Start
Connect the phone to networkEquipment and setup call
Setup 1KHz tone out
NO
The sine wave appears at L401, L402?
YES
NO
Can you hear the tone?
Change receiver
YESEND
Change the Main board
The sine wave appears at R421, R422?
Check the analog switchYES
NO
4. TROUBLE SHOOTING
- 108 -
R422
R421
U401
4. TROUBLE SHOOTING
- 109 -
4.17 Headset path
MSM6245 HPH_R, HPH_L → C402/C401 → R407/R406 → CN401 (MMI Connector)
Start
Connect the phone to networkequipment and setup call.
Setup 1KHz tone outand insert headset.
Can you hear the tone?
Change the Headset
YES
NO
END
Sine wave appears at R407/R406?
Change the Main board
YES
NO
4. TROUBLE SHOOTING
- 110 -
C401
C402
R406
C407
CN401
4. TROUBLE SHOOTING
- 111 -
4.18 Speaker phone path
MSM6245 LINE_P,LINE_N → R429/R427, C423/C422, R431/R426 → Audio AMP(U402) → AnalogSwitch(U401) → Speaker
Start
Connect the phone to networkequipment and setup callSetup 1KHz tone out
Sine wave appears at
R429/R427 and C423/C422 Change the Main boardNO
SPK_AMP_EN is 2.6V? Change the Main boardNO
YES
The sine wave appears at
SPK_RCV-,SPK_RCV+?
YES
NO
Change speaker
YES
Change the Main board
The sine wave appears at SPK+, SPK- ?
Change the Audio AmpNO
YES
And R431/R426 ?
Can you hear the tone?YES
NO
END
4. TROUBLE SHOOTING
- 112 -
Analog Switch
Audio Amp
SPK+
4. TROUBLE SHOOTING
- 113 -
4.19 Main microphone
MIC400 → MIC1P, MIC1N (MSM6245)
Start
MIC_BIAS(C416) is 1.8V
Change main boardNO
Make a call
Change the MICNO
YES
Change the Main board
Make sound to MIC
Work well? END
YESNO
YES
Sine wave appears atC418/C419?
4. TROUBLE SHOOTING
- 114 -
MIC400
C417
R424
4. TROUBLE SHOOTING
- 115 -
4.20 Headset microphone
Headset → C210/C211 → MIC2P, MIC2N (MSM6245)
Start
HOOK_KEY is detected?
Yes
END
Make a call
Change the MAIN board
MICBIAS is biased by 1.8V?
Change the Main board
Yes
OK
NO
NO
NO
Change the headset and retry
YES
Sine wave appears atC210/C211 ?
Change the headset or Main board and retry.
NO
Yes
Change the MAIN board
4. TROUBLE SHOOTING
- 116 -
Ear_Sense_N
MIC Input
4. TROUBLE SHOOTING
- 117 -
4.21 Vibrator
The Vibrator is connected between +VPWR and VIB_DRV_N (PM6650 25 pin).The Vibrator motor driver is an SBI-programmable voltage out that is reference to +VPWR.
Start
Operate the Vibrator
NO
Change vibrator or PM6650
Work well? EndYes
RB521S-30
D400
TP401L40056nH
TP400+VPWR
MOTOR_PWR-
4. TROUBLE SHOOTING
- 118 -
+VPWR
MOTOR_PWR-
5. DOWNLOAD
- 119 -
5.1 U250/KU250 DOWNLOAD
5.1.1 Introduction
LGMDP is a LGE application that allow users to download images from PC to handset. LGMDP is adownload tool with capabilities to upload image files to the handset. LGMDP is designed to be simpleto use and easy enough for the beginner to upload executable images to the handset. LGMDPsupports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed.Additionally, LGMDP allows multi downloading up to 9 handsets at the same time.
5.1.2 Downloading Procedure
• Connect the phone to your desktop PC using the USB cable and run the LGMDP application.
Before getting started, set up LGMDP preferences from the Preferences of the file menu the way
you want. Click on the File menu and select Preferences.
Play a success sound
It will be played a .wav file when the download has been completed. To enable this simply check
the box.
Always on Top
Check if LGMDP always appears at the top of the window so that user can monitor it all the time.
Automatically run Select Port When LGMDP starts
When LGMDP starts, it will automatically select Select Port button to download new image file.
5. DOWNLOAD
5. DOWNLOAD
- 120 -
5.1.2.1 Connecting to PC
• Click on the Select Port and then Select Port window will be pop up. Check if state shows Enablefor the port to be connected for downloading images. Then click on the Connect button. (The portnumber(COM7) shall be different from that of the port number in the snapshot.)
• The status Ready is displayed when the application is ready for downloading. While the images aretransmitted from PC to the handset, a progressive bar (Red box) indicating the degree oftransmission of data is displayed.
U250/KU250
5. DOWNLOAD
- 121 -
1) Image Folder indicates loot path where all image files are placed. To change location of the defaultimage path, select Browse… button. The edit box shows the file path where images are located.Please note that all images should be located in a selected folder.
2) Click on the Browse… button to select image files to be downloaded on the handset.
3) NV Backup/Restore: NV Backup/Restore always have to be done, and it is default selected option.Backup the NV data and restore the backed up NV data automatically.
4) Reset database & Contents:User related data including the setting data on the EFS is reset in the handset. The user contents inthe handset will be erased. If you want to reset all the user data back to the way they were beforeyou started downloading new images, check the option.Erase_EFS:The calibration data, user contents, media, and module are erased. Only calibration data is keptwhen NV backup/restore is checked. The user contents and file system physically are wiped out.
Keep All ContentsMaintain user data including WAP, AD, DRM, E-mail, Play lists, and images when downloading anew S/W images. User data stated above are maintained if this option is selected.
5) Additional Options:Display Information is defaultly not selected and user cannot choose. Override partition table is alsoalso defaultly not selected and user cannot choose.
6) Clear: Clearing all directory paths of images in the dialog.
7) Start: Starting downloading the selected individual image.
1)
2)
3) 6)4)5)
7)
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250 U250/KU250
U250/KU250
5.1.2.2 Choosing image files
• Select the image folder, where all the image files are located, by clicking on the Browse…. (Thefolder name shall be different from that of the folder name in the snapshot. The folder nameindicates the path where the image files are located.)
5. DOWNLOAD
- 122 -
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
5. DOWNLOAD
- 123 -
• Select the path on the Image Folder by clicking on the Browse..., then the LGMDP will automatically
load images accordingly. Also you can select images by manually. For instance, select the path of
AMSS Modem Image file by clicking on the Browse… button. The selected AMSS image will be
downloaded to the handset from the path directory in the PC. Make sure that you have chosen
correct file. In case of wrong AMSS Modem file is file is selected, the phone may not work.
(The file name shall be different from that of the file name in the snapshot.)
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250 U250/KU250
U250/KU250
• If NV restore is failed, then the NV Data(*.nv2) is erased permanently. In this case, choose the
desired NV file to be downloaded on the handset. To enable this simply check the box or select the
NV file from the LGMDP installation directory by clicking on the Browse… button.
• Click on the START button to start downloading. A summary of the selected images and option
information window will be displayed. Click on the No button if this is not the setting you are
downloading for. Otherwise click on the Yes button to continue downloading selected image file
with options.
5. DOWNLOAD
- 124 -
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250 U250/KU250
U250/KU250
NoYes
5. DOWNLOAD
- 125 -
• This message box informs that a new file for
NV backup will be created in the displayed
file name in the LGMDP installation
directory.
• Backing up NV data and backed up NV data
will be stored in the LGMDP installation
directory.
• Erasing the existing directories and files
before the Module image is downloaded.
• Downloading the AMSS modem image
5.1.2.3 Downloading
NV_U250/KU250
U250/KU250
U250/KU250
U250/KU250
5. DOWNLOAD
- 126 -
• Rebooting the handset and re-establishing
the connection
• Restoring NV data which backed up in the
Backing up process. User can also restore
NV data using NV Default image selection.
• Rebooting the handset and re-establishing
the connection
• Erasing the existing directories and files
before downloading the selected Media
image
U250/KU250
U250/KU250
5. DOWNLOAD
- 127 -
• Downloading Media image in progress
• Downloading Module image in progress
• Downloading process has completed
successfully
U250/KU250
U250/KU250
U250/KU250
5. DOWNLOAD
- 128 -
5.1.2.4 Tools
• Device Manager allows to monitor current hardware that is installed on your PC. Device Manager isdesigned to monitor USB connectivity and check where the COM has been installed . Select DeviceManager from the Tools of the file menu.
5. DOWNLOAD
- 129 -
5.1.3 Troubleshooting Download Errors
1) When the phone does not work after downloading has been completed.
2) Media Erasing Error
3) NV Restore Error
5.1.3.1 When the phone does not work
• Reboot the phone in the emergency mode (Simultaneously press 2, 5, and PWR red keys) andthen try to download all the images up to AMSS. In the emergency mode, you can not downloadmedia or module image.
The phone supports a special mode called emergency mode. In this mode, minimum units fordownloading is running so that users can download the images again in case of emergencysituation. (AMSS modem, Media, and Module images can not be running in this mode.)
5. DOWNLOAD
- 130 -
• The below dialog shows parameters of Select Port when phone is booted in Emergency mode.Click on the Connect button to continue.
• Choose Image file after clicking on the Browse… button. Make sure that you have chosen the rightimage file. After choosing valid images, then click on the Start button to start downloading selectedimages. The selected image will be downloaded to the handset from the path directory in the PC.After downloading images successfully, it will boot to normal mode.
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
5. DOWNLOAD
- 131 -
5.1.3.2 NV Restore Error
• Snapshot showing the NV Restore error. Next slide shows the remedial procedure to adopt.
• Connect the handset and Press the Connect button in the Select Port window. (Enable state in thewindow indicates that the Phone has been detected and is ready to download.)
U250/KU250
U250/KU250
U250/KU250
5. DOWNLOAD
- 132 -
• Click on Browse… . Select the LGMDP installation directory and a list of NV Backup files(*.nv2) willbe shown. These nv files were saved every time NV Backup option was selected, and the name ofthe nv file is determined based on the time when NV Backup was done. Choose the desired NV fileto be downloaded on the handset, and click on Start.
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250 U250/KU250
U250/KU250
5. DOWNLOAD
- 133 -
5.1.4 Caution
1) Multi-downloading using the USB hub is not recommendable.
2) If you see the message ‘cal mode’ after ‘completing download’, you must do NV restore
and image (media and module) download.
3) The NV data saved at LGMDP folder as following format.
4) Recommended that the Module and Media Image have to be downloaded at the same
time.
5) Erase EFS option will erase everything (media, module, nv items, and user data) in the
EFS area.
D:\LGMDP\004400-01-429926\_COM14_
LGMDP folder nameIMEI number Port number
6. BLOCK DIAGRAM
- 134 -
6.1 GSM & UMTS RF Block
6. BLOCK DIAGRAM
[Fig 2.1] U250/KU250 RF Functional Block Diagram
6. BLOCK DIAGRAM
- 135 -
[Table 2.1] RF Block Component
6. BLOCK DIAGRAM
- 136 -
6.2 Interface Diagram
6.2.1 RTR6275 & MSM6245 Interface Diagram
[Fig 2.2] RTR6275 & MSM6245 Interface Diagram
6. BLOCK DIAGRAM
- 137 -
6.2.2 Memory Interface
[Fig 2.3] Memory Interface Diagram
ADDRESS[14:0]
6. BLOCK DIAGRAM
- 138 -
6.2.3 USB,UART,SIM,JTAG Interface
[Fig 2.4] USB, UART, SIM, JTAG Interface
6. BLOCK DIAGRAM
- 139 -
Main RF signal
Control signal
Control signal Description Comment
UMTS PA_CTL signal
PA_R0 UMTS Tx High/Low Power Control
GSM PA_CTL signal
GSM_PA_BAND DCS or PCS /GSM Mode Selection
GSM_PA_EN Power Amp Gain Control Enable
GSM_PA_RAMP Power Amp Gain Control
ANT_SEL 0,1 Ant Switch Module Mode Selection
UMTS,
GSM900Tx/Rx,
DCS Tx/Rx,
PCS Tx/Rx
6. BLOCK DIAGRAM
- 140 -
6.2.4 Placement
*Top Side
LGM
C
6. BLOCK DIAGRAM
- 141 -
*Bottom Side
LGM
C
- 142 -
- 143 -
LGMC
Sign & Name
Sheets
Checked
Sheet/
Approved
Rev.D
1
2
GSM 1800/GSM 1900 TX
HIGH
F
E
LOW
Rev.D
Date
BLUETOOTH
REV_1.2
Rev.D
5
GSM_PA_BAND
D
14
MODE
F
DRAWING
GSM/EDGE
9
20dB
8.86dB
D
C
Designer
4
GSM 1800/GSM 1900 RX
TCXO
VTUNE-Connected directly to GND
A
6
LG Electronics Inc.7
KU250MODEL
LG Electronics Inc.
DRAWING
HIGH
LOW
(1%)
1
A
(1%)
5
C
Rev_1.0
Rev.B
Rev.B
Rev.B
Section
Rev.D
Rev_1.0
Rev.D
HIGH
D
Rev.C
Rev.C
Rev.D
Rev.D
Rev.D
HIGH
EGSM
WCDMA
ANT_SEL1
2
HIGH
DCS
Rev.C
LG(42)-A-5505-10:01
E
C
GSM
16
D
DCS/PCS
7dB
E
C
B
8
B
F
15
Rev.1.0
Rev.D
4
LOW
KANG. H. S
GSM 850/ GSM 900 RX
7.5dB
MAR. 07. 2007
LOW
GSM 850/GSM 900 TX/ WCDMA
LOW
E
R434 2.7
1/4
RF
NO.
PCS
3
ANT_SEL0
Rev.C
C15122p
NAL126
R1011K
1000pC171
C14
122
p
L4104.7nH
NA
C1501000p
C191
0.5pL125
C442 5.6p
100ohm
R116
C1360.01u
R118
0
10nH
5p
L116
R1001K
C440
0.1u
C14
3
L40810nH
2 4
VCC
5
L406 2.7nH
TC7SH04FUU104
GND
3
100pC438
C124100p
1p
100o
hm
R11
4
NA
C437
100p
C120
C185
C16
9
NA
C103180p
C156100p
FL102EFCH1950TDF1
2
G1
3
G2
5G3 1
IN
4O1
U102
CP0402A1950DNTR
50O
HM
4 3C
OU
P2
IN
1O
UT
C14
722
p10
0p
L404
C17
8
1.8nH
0.1u
C12
7
0.5pC190
2.7R433
5.6pC441
VDDA82028
VDDA9
VD
DM
17
VTUNE1518
VTUNE2
26WLNA_IN
29W
LNA
_OU
T
35W
MIX
_IN
NW
MIX
_IN
P34
ANT101
TX_IP51
52TX_QNTX_QP
53
VCONTROL56
4VDDA1
VDDA1041
VDDA1145
VDDA124748
VDDA13VDDA14
49
6VDDA2VDDA3
89
VDDA4VDDA5
1516
VDDA619
VDDA7
HB_RF_OUT244
43LB_RF_OUT1LB_RF_OUT2
42
PG
ND
57
40PWD_DET_IN
24RF_ON
13RX_IN
12RX_IP
RX_QN1110
RX_QPR_BIAS13
R_BIAS227
SBDT14
7TCXO
21TEST
TX_IN50
CAL_INN2322
CAL_INP
54DAC_REF
DCS_INN3938
DCS_INP
EGSM_INN3332
EGSM_INP
1ENV_LNNENV_LNP
255ENV_OUT
GCELL_INN30
GCELL_INP31
25G
ND
GPCS_INN3736
GPCS_INP
HB_RF_OUT146
RTR6275U100
45
31
NAL122
KRX102UTR100
2
1p
C12
9
C165
180p
0.1u
C113
C105NA
C14
422
u
C12
622
p
1uC172
C13
10.
1u
680R104
C1045p
180p
1000p
C439
C115NAC116
0.1u
C18
1
R124100ohm
L108
15nH
NAL101
C4452.2p
L4114.7nH
1.5nHL403
22uC122
2.2p
L11518nH
0.1u
C161
3.3p
C13
5
3
O2
4
C162
EFCH2140TDE1
FL103
G1
2
G2
5
IN1
O1
100ohm
100ohmR113
R117
100o
hm
R10
7
C106 8.2p
C153
1000
p
15p
C159C
182
15p
C107 6p
C17
9
C12
8
100p
22p
3
G2
5G3 1
IN
4O1
R11
091
EFCH897MTDB1
FL101
2
G1
C119 22p
C1230.01u
39
R112
C174
R128 100K
10p
C18
30.
01u
C11710p
R122130
56p
1000p
C186
C101
L1115.6nH
68pC139
3300p
R11
951
C114
1.5pC154
47nHL114
C4442.2p
C137NA
ANTG1
G2RF
12p
SW100
KMS-507
4 1RXTX
2
C112
FL104
ACMD-7602
ANT3
PGND
L4094.7nH
130R121
C14
0
C134
22p
0.01u
L1211nH
R105
GN
D3
9G
ND
410
GN
D5
GN
D6
12
GN
D7
13
GN
D8
14
GN
D9
16
21P_GND
19RSVD_GND
VA
PC
20 17V
BA
TT
2V
CC
1A
6V
CC
1B
5.1
BS1
DCS_PCS_IN315
DCS_PCS_OUT
EGSM_IN4
EGSM_OUT11
ENABLE18
GN
D1
5
GN
D2
78
ANT103
FEED
NC1
NC2
SKY77318
U101
100nHL102
ACS2450HBAXX
C149
12KR103
15p
ANT102
C17
7
C13
2
0.1u
F
SYNC_DET_TX_EN5
VCC_OUT3
14VDD_BAT
2VDD_INT
10VDD_MSM
7XTAL_IN
22p
16A
NT
CLK_REF9
GN
D1
1
GN
D2
6
GN
D3
8
GN
D4
15
PG
ND
117
PG
ND
21819
PG
ND
3P
GN
D4
20
13RX_BB_TX_BB
11SBCKSBDT
12
4SBST
LBRQ-2B43A
M100
0.1u
10R109
C170
4.7u
1000p C176
C155
12pC118
100o
hm
C45022p
R11
5
47R120
2
RFOUT8
1VCC1VCC2
10
4VCONT
5VREF
L120
47nH
WS2512_TR1G U103
11BGND
GND13
GND267
GND3
9GND4 RFIN
C18922p
91R
111
0.5pC164
C12133u
47nH
L119
5.6p
L1281.8nH
C443C110
C138
33p
100p
NA
C192
C173 2.2u
DSA321SCE-19.2MX100
GND2
5NC1NC2
67NC3NC4
8
OUTPUT3
4VCC
1VCONT
2114
GSM18001900_TX
GSM1800_RX11
GSM1800_RX22
GSM1900_RX134
GSM1900_RX2
GSM900_RX156
GSM900_RX2
16GSM900_TX
VDD19
WCDMA21009
19.2MHz
AN
T11
CTRL118
CTRL222
7GND1
GND1023
GND28
GND310
GND412
GND51315
GND617
GND7GND8
20
GND9
100p
U500
D5011
R106 5.1
C14
2
C102NA
L4072.7nH
C1520.01u
C18
02.
2u
33pC109
C15815p
1nHL123
2.7nHL405
C13
022
p
0.01uC188
0
R123
180p
R108
51
C108
C187 1000p
VREG_TCXO_2.85V
10nHC157
VREG_RF_SMPS
VREG_RF_SMPS
BT_DATA
TCXO_BT
VREG_MSMP_2.7V
TRK_LO_ADJ
+VPWR
PA_R0
VDD_RX
GSM_TX
VDD_RX
BT_CLKBT_SBCKBT_SBDT
BT_SBST
VREG_BT_2.85V
BT_TX_RX_N
GSM_TX
DCS_PCS_TX
VREG_RF_SMPS
+VPWR
+VPWR
DAC_REF
GSM_PA_BAND
GSM_PA_EN
GS
M_P
A_R
AM
P
PWR_DET
TCXO_BT
VR
EG
_BT
_2.8
5V
TCXO_PM
RTR6275_TCXO
PA_ON
VREG_TCXO_2.85V
TX_IM
TX_IP
TX_QM
TX_QP
TX_AGC_ADJ
VREG_SYNTH_2.6V
DCS_PCS_TX
VREG_MSMP_2.7V
ANT_SEL1ANT_SEL0
PWR_DET
TX_ON
RX_IMRX_IP
RX_QMRX_QP
SSBDT_RTR
RTR6275_TCXO
7. CIRCUIT DIAGRAM
U250/KU250
- 144 -
LGMC
VBATPWR
URXDUTXD
3G2.5G
GNDRXTX
UFLSON_SW
150K : 470K : 1.97V
Sheets
16-bit, NAND, Trusted
Native, ARM JTAG
MSM pin W18
DRAWING
NAME
A
KEYPAD
Designer
10
E
6
BOOT_MODE3 BOOT_MODE2 BOOT_MODE1
150K : 300K : 1.73V
PMIC_AUXIN[1]
9
Checked
(CODEC VSS)
14
D12(VDDA1) and F12(DAC_REF)
NO.
B
ADC
1 2
A
12
Near to B18 (VDD_PLL)
1%
150K : 68K : 0.81V
USB
3
16-bit, NAND, Normal
F
5
CLOCK
C
2
11
150K : 680K : 2.13V
10%
3
Place near
1 0 1
8
Sheet/
(Check CAM_DATA PINOUT !!!!)
150K : 10K : 0.016V
w18 (Analog VSS guard ring for CODEC)
LG(42)-A-5505-10:01
E
Change 32 bit
USIM
PMIC_AUXIN[2] - PA_THERM
4
HKADC[4] - PCB_Rev_ADC
SDRAM
MSM6280 Reference Rev.B : AA21 -> NC
AUDIO
SDRAM
MicroSD
HKADC[2] - HDET1
PMIC
MAR.07.2007
F
9
CAMERA
REV_B
Close to MSM
Place near
Near to MSM
(NA
ND
_BO
OT
_ER
R)
7
1
D
8
REV_B
B
15
1 1 1
MODEL
10%
DRAWING
HKADC 0 1 1
1005 0.1uF 16V +80/-20%
MSM pin AD26
F
150K : 47K : 0.62V
UART
2200p cap => place between
C
(VD
D_D
AC
_RE
F)
(PLLOUT_TEST)
13
C
150K : 750K : 2.17V
NAND & LCD
Section
D
HKADC[5] - VBATT_TEMP
150K : 100K : 1.04V
WDOG monitoring
5
(ADS signal for LCD)
(CAD : 10uF=>Input MSMA_2.6V)
MODE
HKADC[3] - TTY_ADC_DET
10%
RESET
DGPIOs
Sign & Name
HKADC(4):PCB_Rev_ADC
AC23: VSS_DIG
D
2012 10uF 6.3V +80/-20% Ceramic
E
LG Electronics Inc.
MODE2 MODE1 MODE0 ( Default Pull-Down)
150K : 150K : 1.30V
1%
6
Date
C
0 0 0
8-bit, NAND, Trusted
7
0.1uF
Jaykay KU250
MSM
2/4
8-bit, NAND, Normal
for VSS_THERMAL
LG Electronics Inc. REV_1.0
E
HKADC[0] - AMUX_OUT
0 0 1
HKADC[1] - VBATT_SENSE
16
RF
Approved
4
C230
C2321000p
1000pC222
C201
0.01u
47p
0.1uF
C225
C220
2200pC231
VD
D_E
F_U
SE
AE
17W
DO
G_E
N
H25WDOG_STB_SBCK1_GPIO0
WE
1_N
_SD
RA
M1_
WE
_NU
8
AF4WE2_N
W6
XM
EM
1_C
S_N
0
XMEM1_CS_N1_GPIO76AA1
XM
EM
1_C
S_N
2_S
DR
AM
1_C
S_N
0Y
4
Y6XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77
AA
2X
ME
M1_
HW
AIT
_N
K8
XM
EM
1_LW
AIT
_N_S
DR
AM
1_C
AS
_N
XMEM2_CS_N0W14
AC15XMEM2_CS_N1
XMEM2_CS_N2_GPIO35W15
XMEM2_CS_N3_GPIO36AA15
G6
UART2_DP_RX_DATA_GPIO89H6
UA
RT
2_D
P_T
X_D
AT
A_G
PIO
88E
4
F4
UA
RT
2_R
FR
_N_G
PIO
91
L23
UA
RT
3_C
TS
_N_G
PIO
86U
AR
T3_
DP
_RX
_DA
TA
_GP
IO85
M21
M19
UA
RT
3_D
P_T
X_D
AT
A_G
PIO
84
UART3_RFR_N_GPIO87L25
M6
UB
1_N
_SD
RA
M1_
DQ
M1
AF10UB2_N
N26
US
B_D
AT
_VP
US
B_O
E_T
P_N
N25
N19USB_RX_DATA_GPIO29
N23
US
B_S
E0_
VM
US
B_X
TA
L48_
INA
10
US
B_X
TA
L48_
OU
TB
10
R16
H23
SYNTH2_GPIO65B6
D16TCK
TC
XO
D18
F19TCXO_EN_GPIO94
TDID15
A17TDO
F15TMS
L13TRK_LO_ADJ
TRST_NH15
TX_AGC_ADJH13
H12TX_ON_GRFC10
UA
RT
1_C
TS
_N_G
PIO
97P
16
M23
UA
RT
1_D
P_R
X_D
AT
A_G
PIO
96L2
6U
AR
T1_
DP
_TX
_DA
TA
_GP
IO95
UA
RT
1_R
FR
_N_P
A_P
OW
ER
_CT
L_M
_GP
IO98
P21
UA
RT
2_C
TS
_N_G
PIO
90
K6
J1SDRAM1_D12
K4SDRAM1_D13SDRAM1_D14
L8SDRAM1_D15
L6
AB2SDRAM1_D2
D1SDRAM1_D3SDRAM1_D4
AB4SDRAM1_D5
J6SDRAM1_D6
G2
H4SDRAM1_D7SDRAM1_D8
P4
J4SDRAM1_D9
SLE
EP
_XT
AL_
INA
16
SLE
EP
_XT
AL_
OU
TB
16
SYNTH0_GP_PDM0_GPIO92F18
SY
NT
H1_
GP
IO41
RIN
GE
R_G
PIO
18
G1
RO
M1_
AD
V_N
_SD
RA
M1_
RA
S_N
RO
M1_
CLK
_SD
RA
M1_
CLK
AB
1
H16RTCK
SB
CK
L21
SB
DT
J23
SBDT1_GPIO1F26
H26
SB
ST
H18SBST1_GPIO93
F25SDCC_DAT1_GPIO99
SDCC_DAT2_GPIO100M25
M26SDCC_DAT3_GPIO101
SD
RA
M1_
CLK
_EN
N4
SDRAM1_D0E2
SDRAM1_D1D2
SDRAM1_D10J2
SDRAM1_D11
T21
NAND2_FLASH_READY_GPIO33T14
V2
OE
1_N
OE2_NAF7
F17PA_ON0
PA_ON1_GPIO2H11
PA
_PO
WE
R_C
TL
P25
Q_IM_CH0AA25
W23Q_IM_CH1
Q_IP_CH0Y25
V23Q_IP_CH1
Q_OUTB12
Q_OUT_NA12
F13
RE
SIN
_NF
11R
ES
OU
T_N
RE
SO
UT
_N_E
BI1
AA
4
L19
MD
DIH
_DA
TN
MD
DIH
_DA
TP
B20
A19
MD
DIH
_ST
BN
MD
DIH
_ST
BP
A20
AD2MDP_VSYNC_PRIMARY_GPIO105
MDP_VSYNC_SECONDA_GPIO104AE3
AF
20M
IC1N
AE
20M
IC1P
MIC
2NA
F21
AF
22M
IC2P
T15
MIC
BIA
S
MM
C_C
LK_S
DC
C_C
LK_G
PIO
31M
16
H14
MM
C_C
MD
_GP
IO30
MM
C_D
AT
A_S
DC
C_D
AT
0_G
PIO
32L1
4
Y23
MO
DE
0
U23
MO
DE
1M
OD
E2
KE
YS
EN
SE
3_N
_GP
IO47
KE
YS
EN
SE
4_N
_GP
IO48
U21
L2LB
1_N
_SD
RA
M1_
DQ
M0
AE10LB2_N_A2_0
AF14LCD_CS_N_GPIO38
LCD_EN_GPIO37AE13
AC
21LI
NE
_L_I
NLI
NE
_L_I
PA
C22
LIN
E_O
NA
C18
AC
17LI
NE
_OP
LIN
E_R
_IN
AC
20
AC
19LI
NE
_R_I
P
A23MDDIC_DATNMDDIC_DATP
A22
B23MDDIC_STBNMDDIC_STBP
B22
B19
Y21
AB
23H
KA
IN5
W17
HP
H_L
HP
H_R
AA
17
HP
H_V
RE
FA
A19
I2C
_SC
L_G
PIO
27N
16I2
C_S
DA
_GP
IO26
K21
I_IM_CH0AB25
I_IM_CH1V25
I_IP_CH0AC25
I_IP_CH1W25
B13I_OUT
A13I_OUT_N
KE
YS
EN
SE
0_N
_GP
IO62
R21
P19
KE
YS
EN
SE
1_N
_GP
IO63
D14
KE
YS
EN
SE
2_N
_GP
IO46
R23
D17
GRFC0_GPIO3B8
GRFC1_AUX_SBDT_GPIO4A8
GRFC2_GPIO5D9
GRFC3_GPIO6F10
H10GRFC4_AUX_SBCK_GPIO7GRFC5_AUX_SBST_GPIO8
D11
T23GRFC7_GPIO10GRFC8_GPIO11
B4
GRFC9_GPIO12D5
T19GRFX6_GPIO9
AD
26G
SM
_PA
_DA
C_R
EF
HK
AIN
0V
21
AA
23H
KA
IN1
HK
AIN
2W
21
V19
HK
AIN
3H
KA
IN4
GP
IO49
B7
GP
IO50
A7
GP
IO51
D10
GP
IO52
GP
IO53
L12
GP
IO64
F14
GPIO66F8
U6GPIO_67GPIO_68
V4
R11GPIO_69
E1GPIO_70GPIO_71
Y1
Y2GPIO_72
V6GPIO_73GPIO_74
W4
GP_PDM1_PA_RAN_GE0H17
GP_PDM2_PA_RAN_GE1
AF5
AC7D2_7
AA8D2_8
W9D2_9
DAC_REFF12
AE
18E
AR
1ON
AF
18E
AR
1OP
K26
GP
IO17
G21
GP
IO19
GPIO28A6
F7
GP
IO39
D6
GP
IO40
GP
IO42
D7
GPIO43H9
D8
GP
IO44
GP
IO45
A4
F9
E23
K23
CA
MIF
_PC
LK_G
PIO
82
B3
CA
MIF
_VS
YN
C_G
PIO
16
AA
20C
CO
MP
AC5D2_0D2_1
AF3
D2_10AC8
D2_11AE7
D2_12AA9
D2_13W10
AC9D2_14
AA10D2_15
AE4D2_2D2_3
AC6D2_4
AE5D2_5
AA7D2_6
BT_DATA_GPIO20
BT_SBCK_GPIO23E26
E25BT_SBDT_GPIO22
BT_SBST_GPIO24F23
H21BT_TX_RX_N_GPIO21
J21CAMCLK_PO_GP_MN_GPIO13
J25
CA
MIF
_DA
TA
0_G
PIO
83C
AM
IF_D
AT
A1_
GP
IO81
J26
CA
MIF
_DA
TA
2_A
UX
_TR
ST
_N_G
PIO
54D
21
C25
CA
MIF
_DA
TA
3_A
UX
_TC
K_G
PIO
55
D22
CA
MIF
_DA
TA
4_A
UX
_TM
S_G
PIO
56C
AM
IF_D
AT
A5_
AU
X_T
DI_
GP
IO57
J19
L15
CA
MIF
_DA
TA
6_A
UX
_TD
O_G
PIO
58
D20
CA
MIF
_DA
TA
7_G
PIO
59C
AM
IF_D
AT
A8_
GP
IO60
F16
CA
MIF
_DA
TA
9_G
PIO
61F
20
CA
MIF
_HS
YN
C_G
PIO
15
AA11
AC11A2_6A2_7
T12A2_8
W12
AA12A2_9
AU
XIN
AF
19
AU
XIP
AE
19
AA
18A
UX
OU
T
K19AUX_PCM_CLK_GRFC14_GPIO80AUX_PCM_DIN_GRFC13_GPIO14
N21
G4AUX_PCM_DOUT_GRFC12_GPIO103
J8AUX_PCM_SYNC_GRFC11_GPIO102
BO
OT
_MO
DE
AE
21
AE
22B
OO
T_M
OD
E2
BO
OT
_MO
DE
3A
D1
BT_CLK_GPIO25G23
R19
N1
A2_1AE9
A2_10AC12
A2_11AE12
AF12A2_12A2_13
AA13
AC13A2_14
W13A2_15
AE14A2_16A2_17
AC14
T13A2_18A2_19
AA14
A2_2AF9
A2_20_GPIO34AF13
W11A2_3A2_4
AC10A2_5
T1
T2A1_18A1_19
R8
A1_
2L4
A1_20T4
A1_21T6
A1_22T8
A1_
23_S
DR
AM
1_D
QM
2_G
PIO
78U
4
A1_
24_G
PIO
79V
1
A1_
25_S
DR
AM
1_D
QM
3_G
PIO
75V
8
A1_
3M
8
A1_
4M
4
N11
A1_
5A
1_6
N8
N6
A1_
7N
2A
1_8
A1_
9
MSM6245_A
U201-1
A1_
1L1
A1_
10P
1
P2
A1_
11P
6A
1_12
A1_
13P
8
P11
A1_
14
A1_15R4
R6A1_16A1_17
TP405
300K
R435
C2260.01u
33nF
C24
6
C227C2231000p 0.01u
C2130.01u
0.01uC218
2.2KR215
T26VSS_DIG_6VSS_DIG_7
G26
VSS_DIG_8D26
VSS_DIG_9A24
F1VSS_PAD1_0
K1VSS_PAD1_1VSS_PAD1_2
M1
VSS_PAD1_3R1
VSS_PAD1_4U1
AF6VSS_PAD2_0VSS_PAD2_1
AF11
VSS_PAD2_2AF15
R26VSS_PAD3_0
B17VSS_PAD3_1
A15VSS_PAD3_2
A9VSS_PAD3_3
VSSA4D19
P26VSSA5
U19VSSA6
V26VSSA7VSSA8
W16
VSSA9W18
AC23VSS_DIG
C1VSS_DIG_0
H1VSS_DIG_1
VSS_DIG_10A14
A11VSS_DIG_11
A5VSS_DIG_12
VSS_DIG_2W1
VSS_DIG_3AC1
AF8VSS_DIG_4
AF16VSS_DIG_5
B1
VS
S5
VSS50AF26
VS
S6
B2
B25
VS
S7
VS
S8
B26 D4
VS
S9
VSSA1A18
W26VSSA10
AB26VSSA11VSSA12
AC16
AC26VSSA13VSSA14
AD25
VSSA15AF23
AF24VSSA16
A21VSSA2VSSA3
D13
VS
S33
R14
R15
VS
S34
VS
S35
T11
T16
VS
S36
VS
S37
W8
VS
S38
W19
AA6VSS39
VS
S4
A26
VSS41AC4
AE1VSS43VSS44
AE2
AE25VSS45VSS46
AE26
AF1VSS47VSS48
AF2
AF25VSS49
VS
S19
M12
VS
S2
A2
M13
VS
S20
VS
S21
M14
M15
VS
S22
VS
S23
N12
N13
VS
S24
VS
S25
N14
N15
VS
S26
VS
S27
P12
P13
VS
S28
VS
S29
P14
A25
VS
S3
P15
VS
S30
VS
S31
R12
R13
VS
S32
VD
D_P
AD
3_0
R25
VD
D_P
AD
3_1
K25
B15
VD
D_P
AD
3_2
B9
VD
D_P
AD
3_3
A3
VD
D_P
AD
4_0
VD
D_P
LLB
18
A1
VS
S1
VS
S10
D23
VS
S11
F6
F21
VS
S12
H8
VS
S13
VS
S14
H19
VS
S15
K10 L1
1V
SS
16V
SS
17L1
6
M11
VS
S18
AC
2V
DD
_DIG
_3A
E8
VD
D_D
IG_4
AE
16V
DD
_DIG
_5V
DD
_DIG
_6T
25
G25
VD
D_D
IG_7
D25
VD
D_D
IG_8
VD
D_D
IG_9
B24
B21
VD
D_M
DD
I
VD
D_P
AD
1_0
F2
VD
D_P
AD
1_1
K2
M2
VD
D_P
AD
1_2
R2
VD
D_P
AD
1_3
U2
VD
D_P
AD
1_4
AE
6V
DD
_PA
D2_
0V
DD
_PA
D2_
1A
E11
VD
D_P
AD
2_2
AE
15
D12
VD
DA
1
VD
DA
10A
F17
P23
VD
DA
2V
DD
A3
U25
U26
VD
DA
4Y
26V
DD
A5
AA
26V
DD
A6
VD
DA
7A
E23
AE
24V
DD
A8
AA
16V
DD
A9
VD
D_D
IG_0
C2
VD
D_D
IG_1
H2
VD
D_D
IG_1
0B
14
B11
VD
D_D
IG_1
1B
5V
DD
_DIG
_12
W2
VD
D_D
IG_2
MSM6245_BU201-2
NCAA21
RESERVEDC26
1000pC238
C217
TP404
0.01uC221
C242
0.1uF
220n
0.1uF
36R
202
C20
3
0.01uC228
1000pC234
150K
R20
1
C2150.01u
TP406
10pR20
551
K
C204
0.1uFC219
51R
207
0.1uC247
220n
TP403
C20
2
0
R211
C21
122
n
TP200
C2160.1uF
R20
451
KC240
TP402
0.1uFC2331000p
C206
C212
10u
0.1u
0.1uFC209
C2391000p
C205
4
NC278
NC3
NC49
ON_SW5
RTS11
2RX
TX3
6VBAT
4.7u
UART
12CTS
10DSR
GND1
NC1
22n
C21
0
C2371000p
C2351000p
C2140.01u
0.01u
R20
951
K
C236
R20
6
NA
R214 2.2K
R2132K
R20
851
K
47pC200
0.01uC244
0.1uFC229
C2430.1u
SLE
EP
_CLK VREG_MSMP_2.7VVREG_MSMC_1.25V VREG_MSMA_2.6V
TX_AGC_ADJ
SDRAM_DATA(26)SDRAM_DATA(25)SDRAM_DATA(24)SDRAM_DATA(23)SDRAM_DATA(22)SDRAM_DATA(21)SDRAM_DATA(20)SDRAM_DATA(19)SDRAM_DATA(18)SDRAM_DATA(17)SDRAM_DATA(16)
LCD_VSYNCLCD_MAKER_ID
HOOK_KEY
LCD_LDO_EN
LCD_IF_MODE_0
PA_R0
VR
EG
_MS
MP
_2.7
V
LIN
E_N
LIN
E_P
VGA_CAM_RESET_N
RCV_EN_N
MIC
2N
SDRAM_DATA(0:31)
SD
RA
M_D
QM
(2)
SD
RA
M_D
QM
(3)
SDRAM_DATA(31)SDRAM_DATA(30)SDRAM_DATA(29)SDRAM_DATA(28)SDRAM_DATA(27)
USB_D+
REMOTE_PWR_ON
UART_RXDUART_TXD
VBATT
MIC
1NM
IC1P
MIC
2P
CA
M_L
DO
_EN
ME
GA
_CA
M_P
WR
_DO
WN
EA
R_S
EN
SE
_N
VR
EG
_MS
MP
_2.7
V
VR
EG
_MS
MP
_2.7
VV
BA
T_T
EM
P
SPK_AMP_EN
VREG_CAM_AVDD_2.8V
ME
GA
_CA
M_R
ES
ET
_N
MM
C_C
LKM
MC
_DA
TA
MM
C_C
MD
MM
C_C
D
USB_VBUSUSB_D-U
SIM
_CLK
PM
_IN
T_N
PS
_HO
LD
LCD
_BL_
CT
RL
GSM_PA_ENGSM_PA_BAND
ANT_SEL1ANT_SEL0
LCD_RESET_N
LCD_IF_MODE_1
CAM_MCLK
SS
BD
T_P
M
KE
Y_R
OW
(4)
KE
Y_R
OW
(3)
KE
Y_R
OW
(2)
KE
Y_R
OW
(1)
KE
Y_R
OW
(0)
KE
Y_C
OL(
4)K
EY
_CO
L(3)
KE
Y_C
OL(
2)K
EY
_CO
L(1)
KE
Y_C
OL(
0)
UA
RT
_TX
DU
AR
T_R
XD
US
IM_D
AT
AU
SIM
_RS
T_N
CA
M_H
SY
NC
CA
M_V
SY
NC
CA
M_D
AT
A(0
)C
AM
_DA
TA
(1)
CA
M_D
AT
A(2
)C
AM
_DA
TA
(3)
CA
M_D
AT
A(4
)C
AM
_DA
TA
(5)
CA
M_D
AT
A(6
)C
AM
_DA
TA
(7)
I2C
_SC
LI2
C_S
DA
US
B_S
E0
US
B_D
AT
US
B_O
E_N
SS
BD
T_R
TR
RX_QMRX_QPRX_IMRX_IP
GS
M_P
A_R
AM
P
PA_ON
TRK_LO_ADJTCXO_EN
TX_ON
BT_SBSTBT_SBCK
BT_TX_RX_NBT_DATA
BT_SBDT
BT_CLK
CA
M_P
CLK
AM
UX
_OU
TV
BA
T_S
EN
SE
GS
M_P
A_P
WR
_CT
L_R
EF
HP
H_R
HP
H_L
RC
V-
RC
V+
MIC
BIA
S
DAC_REF
TX_QMTX_QPTX_IMTX_IP
SD
RA
M_A
DD
R(3
)S
DR
AM
_AD
DR
(4)
SD
RA
M_A
DD
R(5
)S
DR
AM
_AD
DR
(6)
SD
RA
M_A
DD
R(7
)S
DR
AM
_AD
DR
(8)
SD
RA
M_A
DD
R(9
)S
DR
AM
_AD
DR
(10)
SD
RA
M_A
DD
R(1
1)S
DR
AM
_AD
DR
(12)
EBI2_OE_N
LCD_ADS
LCD_CS_N
NAND_CS_N
SD
RA
M_C
LK
VREG_MSME_1.8V
EBI2_DATA(14)EBI2_DATA(13)EBI2_DATA(12)EBI2_DATA(11)EBI2_DATA(10)EBI2_DATA(9)EBI2_DATA(8)EBI2_DATA(7)EBI2_DATA(6)EBI2_DATA(5)EBI2_DATA(4)EBI2_DATA(3)EBI2_DATA(2)EBI2_DATA(1)
SDRAM_ADDR(0:14)
SD
RA
M_A
DD
R(1
)S
DR
AM
_AD
DR
(2)
SDRAM_DATA(14)SDRAM_DATA(13)SDRAM_DATA(12)SDRAM_DATA(11)SDRAM_DATA(10)SDRAM_DATA(9)SDRAM_DATA(8)SDRAM_DATA(7)SDRAM_DATA(6)SDRAM_DATA(5)SDRAM_DATA(4)SDRAM_DATA(3)SDRAM_DATA(2)SDRAM_DATA(1)
EBI2_DATA(0:15)
EBI2_DATA(15)
SD
RA
M_D
QM
(1)
NAND_CLE
SD
RA
M_W
E_N
EBI2_WE_N
SD
RA
M_C
S_N
(0)
SD
RA
M_C
AS
_N
VREG_MSME_1.8V
DAC_REF
VREG_MSMA_2.6VSDRAM_DATA(15)
SD
RA
M_A
DD
R(1
3)S
DR
AM
_AD
DR
(14)
SD
RA
M_A
DD
R(0
)
EBI2_DATA(0)
SD
RA
M_D
QM
(0)
NAND_ALENAND_READY
RE
SIN
_NR
ES
OU
T_N
SD
RA
M_R
AS
_NS
DR
AM
_CLK
_EN
SDRAM_DATA(0)
TC
XO
_MS
M
7. CIRCUIT DIAGRAM
U250/KU250
- 145 -
LGMC
NAME
VDD_RF : 0.1uF
A
3
2 6
1608
4
13
VDD_ANA : 0.1uF
7
VDD_MSMC : 4.7uF
E
9
MCP(512Mb NAND + 512Mb 1 piece SDRAM)
5
15
Draw the Artwork_line thickly !!!!!
REV_B
1
C
1608 --->> USB_VBUS , FLASH_DRV_N , KPD_DRV_N , KEY_ON_SW_N , MOT_PWR-
LCD LDO
D
VDD_MAIN : 0.1uF
REV_D
REV_B
8
Checked
VDD_RUIM : 0.1uF
VDD_MSME : 4.7uF
Sign & Name
X16 SDRAM --> X32 SDRAM
D
F
A
LG Electronics Inc.
DRAWING
Approved
Power Line --> Route carefully!!!!!
D
1608
Check if it is LOW enable.
VDD_MSM : 0.1uF
1608
MAR.07.2007
8
2
E
B
LG(42)-A-5505-10:01
Artwork --> Place resistor and capacitor close to PM6650 !!
CAMERA LDO
E
REV_B
1%
MODEL
1
F
C
14
KU250
11
REV_C
REV_D
REV_B
REV_E
LG Electronics Inc.
9
Section
D
C
1608
4 7
USIM
B
REV_B
E
12
NO.
LCD BACKLIGHT
VDD_SPKR : 0.1uF
16
Date
10
PMIC VPWR BYPASS
5
1005
Designer
Sheet/
CHARGER
T-FLASH
C356Jaykay
MEM & POWER
3/4
MEMORY
1608
REV_1.0
Differential lines, route as equal length as possible !! --> ICHARGE , ICHARGEOUT
Sheets
VDD_WLAN : 0.1uF
DRAWING
6
F
C
3
1u
VA
302
EV
LC18
S02
003
NC
R31
510
0K
AAT3157ITP-T1U30510
C1+
C1-9
C2+7
C2-6
8CP
D112
D2D3
3
11EN_SET
4GND
IN5
12
C30
60.
1u
51K
R30
0
VA
301
6BGND
2GND
NC5
STBY1
3VIN VOUT
4
EV
L14K
0220
0
121KR303
BH15LB1WHFVU501
C35
3
EV
LC18
S02
003
VA
303
0.1u
smd_
1005
h_5_
r
C327 1u
1uC348
2.2u
C31
6
C30
10.
1u
C35
2sm
d_10
05h_
5_r
33p
100K
R30
1
0.1u C322
EV
LC18
S02
003
VA
305
C32
80.
1uF
4.7u
C30
8
0.1u
C30
7
C345
C33
2
1u
0.1u
F
0.1u
BAT300NBL414R-F9J
C34
3
R31
610
0K
R31
847
0K
G
S
1uC447
SI3
493D
V-E
3
D1
D2
D3
D4
C38
9
Q30
1
1u
4.7u
C357
10uC436
0
R314
C34
40.
1u
0.1u
F
C3491u
C31
9
C43522u
Q302QST4
3 B1
C1 C22
56 4
C32
90.
1uF
C34
1
OJ300
4.7u
0.1u
FC
317
R30751K
1uC350
R304
470K
S300
CD_DAT3_CS
CLK_SCLK
CMD_DI
DAT0_DO
DAT1_RSV
DAT2_RSV
GND
GND
VDD
VSS
SCHA1A0100
C30
30.
1u
0.1uC433
R30
2
100K
VA
304
EV
LC18
S02
003
2.2uC340
CE6
2GND1
5GND2
4NC
VDD1 3
VOUT
R309 2.2K
R1114D281D-TR-FU302
R317 15K
C3510.1u
C31
21u
C32
50.
1u
R305
C44633u
10K
1uC355
OJ303
EV
LC18
S02
003
VA
300
C32
10.
1uF
4.7uH
L305
VA
306
EV
LC18
S02
003
12p
C33
7
51K R308
L301
4.7u
Hsm
d_25
20h1
_6_r
1uC354
0.1u
C30
2
L10VSSQ2
M9VSSQ3
N10VSSQ4
C10VSSQ5
D9VSSQ6
E10VSSQ7
F9VSSQ8
G10VSSQ9
_CASH2
B6_CE
J2_CS
G2_RAS
B3_RE
_WEDK1
B7_WEN
C3_WP
VDDQ4N9
VDDQ5C9D10
VDDQ6VDDQ7
E9
VDDQ8F10
VDDQ9G9
B9VSS0VSS1
C1H9
VSS2J1
VSS3VSS4
P9
VSS5M2
VSSN0C5P6
VSSN1
J9VSSQ0
K10VSSQ1
NC7F3
NC8G1G5
NC9
R_BC6
B5VCC0
N5VCC1
B8VDD0VDD1
D1
VDD2H1H10
VDD3P8
VDD4M1
VDD5
VDDQ0J10K9
VDDQ1L9
VDDQ2VDDQ3
M10
NC11M4M7
NC12NC13
N4
NC14N7N8
NC15NC16
P1P2
NC17P3
NC18NC19
P4
H8NC2
NC20P5P10
NC21
NC3B1
NC4B2B10
NC5NC6
E5
G7DQ9
J8DQM0DQM1
G6
DQM2F8
DQM3E7
N1IO0IO1
N2N3
IO2M5
IO3IO4
P7
IO5M6N6
IO6IO7
M8
J7NC0
H7NC1
M3NC10
E6DQ22DQ23
F7F6
DQ24D5
DQ25E8
DQ26D6
DQ27D8
DQ28DQ29
D7
L7DQ3
C8DQ30
C7DQ31
K8DQ4
L8DQ5
K7DQ6DQ7
K5
DQ8K6
DNU6R10
L4DQ0
L5DQ1
DQ10J6
DQ11J5H6
DQ12H5
DQ13DQ14
J4
DQ15G3
DQ16G4F4
DQ17E4
DQ18DQ19
F5
L6DQ2
DQ20H3H4
DQ21
A6E1D3
A7E2
A8A9
D4
C4ALE
J3BA0
K2BA1
CKG8
CKEE3
B4CLE
DNU0A2
DNU1A9
DNU2A10
DNU3R1R2
DNU4R9
DNU5
HYC0UEH0MF3P-6SS0EU301
A0K4
A1L1
K3A10
F2A11A12
F1
A2L2L3
A3A4
C2
A5D2
81V
RE
G_S
YN
T
82A
MU
X_O
UT
83V
DD
_MA
IN
84V
RE
G_T
CX
O
85G
ND
_SLU
G
9PON_RESET_N
74S
PK
R_B
YP
75S
PK
R_O
UT
_P
76S
PK
R_I
N_P
77V
DD
_SP
KR
78S
PK
R_I
N_M
79S
PK
R_O
UT
_M
8FLSH_DRV_N
80R
EF
_OU
T(M
PP
8)
67V
RE
G_R
FR
X2
68C
BL0
PW
R_N
(MP
P3)
69V
RE
G_R
FR
X1
7BAT_FET_N
70A
MU
X_I
N1(
MP
P1)
71V
DD
_RF
72A
MU
X_I
N2(
MP
P2)
73V
RE
G_R
FT
X
6VBAT
60VCOIN
61REF_ISET
62REF_GND
63REF_BYP
64V
RE
G_W
LAN
65V
DD
_WLA
N
66C
BL1
PW
R_N
(MP
P4)
52VDD_MSM
53TCXO_OUT
54VDD_ANA
55TCXO_EN
56VREG_MSMA
57PS_HOLD
58TCXO_IN
59MSM_INT_N
45SLEEP_CLK
46XTAL_OUT
47SBDT
48VBACKUP
49SBCK
5ISNS_M
50VREG_MSMP
51SBST
38R
UIM
_CLK
(MP
P10
)39
VR
EG
_MM
C
4CHG_CTL_N
40R
UIM
_M_R
ST
(MP
P5)
41V
DD
_RU
IM42
VR
EG
_RU
IM
43RUIM_RST(MPP6)
44XTAL_IN
30R
UIM
_M_I
O(M
PP
11)
31V
SW
_MS
MC
32V
RE
G_M
SM
C33
VD
D_M
SM
C34
RU
IM_M
_CLK
(MP
P9)
35V
DD
_MS
ME
36V
RE
G_M
SM
E37
VS
W_M
SM
E
23K
PD
_DR
V_N
24K
PD
PW
R_N
25V
IB_D
RV
_N26
RU
IM_I
O(M
PP
12)
27V
SW
_PA
28V
RE
G_P
A29
VD
D_P
A
3ISNS_P
16USB_VBUS
17USB_DAT
18USB_D_P
19USB_SE0
2VCHG
20USB_D_M
21GP1_DRV_N(MPP7)
22LC
D_D
RV
_N
1ADC_BYP
10VREG_USB
11USB_ID
12VREG_5V
13USB_OE_N
14VSW_5V
15USB_CTL_N
NC26
9P
GN
D
VIN1 8
VOUT1VOUT2
7
PM6650-2MU300
RT9011-MGPQWU303
2EN1
3EN2
5GNDNC1
4
1000pC434
1uC
311
1uC346
0.1u
FC
320
R30651
C3231u
C33
5
OJ302
0.1u
OJ301
4.7u
C31
0
0.1u
FC
330
0.1
R313
smd_
1608
h_9_
r
C326
4.7u
smd_
2520
h1_6
_r
4.7u
HL3
00
C30
50.
1u
6
C3392.2u
CLK3
5GND1
GND29
10GND3 GND4
1211
GND5
IO7
2RST
4RSV1
8RSV2
1VCC
VPP
TP308
J300 HSSC-8P-18
12p
C33
4
C33
8
0.01
u
0.1u
C30
4
1u
C32
4
C347
smd_
1608
h_9_
r
12p
4.7u
C33
3
22uC358
C31
80.
1uF
32.768KHz
1 2
34
L302
MC-146_7pF
X300
56nH
C336 4.7u
100K
R38
02
C2
56 4
C33
10.
1uF
QST4
B3C11
Q300
VREG_CAM_DVDD_1.5V
CAM_LDO_EN
EBI2_OE_N
+VPWR
VREG_MSMP_2.7V
VREG_MSME_1.8V
VREG_MSME_1.8V
PM_ON_SW_N+VPWR
VREG_USIM_2.85V
+VPWR
VREG_RF_SMPS
PS_HOLD
SDRAM_DATA(20)
SDRAM_DATA(29)
SDRAM_DATA(27)
SDRAM_DATA(31)
SDRAM_DATA(0:31)
SDRAM_DQM(2)SDRAM_DQM(3)
NAND_READY
SDRAM_DATA(30)
LCD_BL_CTRL
+5V_PWR
EBI2_DATA(1)
EBI2_DATA(0:7)EBI2_DATA(0)
EBI2_DATA(2)
EBI2_DATA(4)
EBI2_DATA(6)
SDRAM_DATA(15)
SDRAM_DATA(9)
SDRAM_DATA(13)
SDRAM_DATA(7)
SDRAM_DATA(12)
SDRAM_DATA(5)
SDRAM_DATA(11)
SDRAM_DATA(22)
SDRAM_DATA(18)
SDRAM_DATA(24)
SDRAM_DATA(4)
SDRAM_DATA(14)
SDRAM_ADDR(3)
VREG_MSMP_2.7V
VREG_USIM_2.85V
LCD_LDO_EN
VREG_LCD_2.8V
SDRAM_DATA(21)
SDRAM_DATA(23)
SDRAM_DATA(25)SDRAM_DATA(26)
SDRAM_DATA(28)
EBI2_DATA(7)
EBI2_DATA(5)
EBI2_DATA(3)
SDRAM_ADDR(9)
SDRAM_ADDR(5)
SDRAM_ADDR(8)SDRAM_ADDR(7)
SDRAM_ADDR(11)
SDRAM_ADDR(0)
NAND_CLENAND_ALE
SDRAM_WE_NSDRAM_CS_N(0)
RESOUT_N
SDRAM_DATA(6)
SDRAM_DATA(2)
SDRAM_DATA(8)
WLED_1WLED_2WLED_3
+VPWR
VREG_CAM_DVDD_1.8VVREG_CAM_AVDD_2.8V
USIM_P_RST_NUSIM_P_CLK
WLED_PWR
+VPWR
+VPWRCAM_LDO_EN
SDRAM_ADDR(1)
VBATT
VREG_MSMA_2.6V
VR
EG
_MS
MC
_1.2
5V
VREG_MSMP_2.7V
USIM_P_DATAMMC_CD
MMC_CLK
MMC_CMD
MMC_DATA
VREG_MMC_3.0V
TCXO_MSM+VPWR
+VPWRTCXO_EN
PM_INT_N
VR
EG
_BT
_2.8
5V+
VP
WR
+V
PW
R
+V
PW
R
GS
M_P
A_P
WR
_CT
L_R
EF
VR
EG
_SY
NT
H_2
.6V
AM
UX
_OU
T+
VP
WR
VR
EG
_TC
XO
_2.8
5V
USB_D+USB_SE0
USB_D-
KYBD_BACKLIGHT
MOTOR_PWR-USIM_P_DATA
USIM_DATAUSIM_CLK
VR
EG
_MS
ME
_1.8
V
USIM_P_CLK
VREG_MMC_3.0V
USIM_RST_N
USIM_P_RST_N
USB_VBUS
ICHARGEOUT
SLEEP_CLK
SSBDT_PM
VREG_MSMP_2.7V
TCXO_PM
REMOTE_PWR_ON
ICHARGECHG_CTL_N
ICHARGEOUT
BATT_FET_N
RESIN_N
USB_OE_N
USB_VBUSUSB_CTL_N
USB_DAT
SDRAM_CAS_NSDRAM_RAS_N
SDRAM_CLK_ENSDRAM_CLK
NAND_CS_N
SDRAM_DATA(16)SDRAM_DATA(17)
SDRAM_DATA(19)
VBATT
BATT_FET_N
+VPWR
ICHARGE
CHG_CTL_N
+5V_PWR
USB_CTL_N
SDRAM_DATA(1)SDRAM_DATA(0)
SDRAM_DATA(3)
SDRAM_DATA(10)
SDRAM_DQM(0)SDRAM_DQM(1)
SDRAM_ADDR(2)
SDRAM_ADDR(4)
SDRAM_ADDR(6)
SDRAM_ADDR(10)
SDRAM_ADDR(12)
SDRAM_ADDR(0:12)
SDRAM_ADDR(14)SDRAM_ADDR(13)
EBI2_WE_N
7. CIRCUIT DIAGRAM
U250/KU250
- 146 -
LGMC
D
REV_B : EDTY0008606 --> EDTY0008601
LG Electronics Inc.
VT_CAMERA_CONNECTOR
REV_B
F
Sheet/
2
5
1
B
E
MIC
Sign & Name
15
DRAWING
7
HOT3
A
7
D
MODEL
4
REV_1.0
REV_C : 20K --> 3K
2
E
REV_1.24
Sheets
REV_B
D
LG Electronics Inc.
LG(42)-A-5505-10:01
B
16
NAME
Audio AMP
I/O CONNECTOR
REV_B : SUMY0010301 --> SUMY0003802
VBAT
Section
DRAWING
12
KEY_BACK_LIGHT LED(8EA)
3 9
C
REV_1.0
KU250
2
4
8
VBAT_GND
11
1
9
LCD CONNECTOR
A
13
Checked
7
6
LCD/CAMERA
E
REV_1.0
Date
6
9
F
8
E
HOT4
F
AUDIO
1
MEGA CAMERA CONNECTOR
5
REV_E : For Antenna Radiation
REV_B : Change Pin Description
Jaykay
KEY / MMI
4/4
CAMERAREV_B : EDLH0013501 --> EDLH0006001
KEYS
0
14
REV_1.0Designer
63
SELECT_SPK&RCV
10
Approved
MAR.07.2007
3
C
5
NO.
D
C
8
END
KEY MAP
INS
TP
AR
PLW
0501
H-L
FD
402
C42
139
p
OK
R418
100ohm
C42
039
p
R40
21M
5.6KR430
UP
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
401
FL408
ICVE21184E150R500FR
5G
110
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
RB521S-30
D400
100ohm
R415
C4000.1u
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
ICVE21184E150R500FR
FL401
47n
C40
3
R422 10
ICVE21184E150R500FR
FL407
5G
110
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
4INOUT_A4
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
LEFT
C423
C4281u
0.1u
405
R427 1K
TP401
100ohm
R411
C419 0.1u
3334
35
45
67
89
EV
L14
K02
200
VA
490
2
2021
2223
2425
2627
2829
3
3031
32
CN400
1
1011
1213
1415
1617
1819
R42110
R413 100ohm
C401 33u
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
ICVE21184E150R500FR
FL406
R429 1K
404
80.6K
R410
400
NTS104B
G134
G2
1IN
2OUT
C40
7
FL404
47p
C41
310
p
0.1u
FC
404
R40
9
680K
LD408
C40
9
LEBB-S14H
0.1u
LEBB-S14HLD405
SEARCH
HOT400
100K
R408
470K
R40
5
EV
L14K
0220
0V
A40
7
403
D40
1S
D12
T1G
LD406 LEBB-S14H
100ohmR406
D40
3
PS
D05
-LF
INS
TP
AR
R414100ohm
PS
D05
-LF
D40
4
INS
TP
AR
C431NA
U400NCS2200SQ2T2G
2GND
1OUT
VCC
5
3 VIN+
VIN-4
R403
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
51K
FL400
ICVE21184E150R500FR
G1
C422 0.1u
SND
89
131415161718
19
2
20
21
22
34567
CN401HSEJ-18S04-25R
1
101112
P131314
P14P15
15
P16
1617P
17P
181819
P19
P22
P20
20
3P3P4
45
P5
P6
6 7P
7P
88 9
P9
CN404
GND1
GND2
GN
D3
GN
D4
GND5
GND6GN
D7
GN
D8
1P1
P10
10
11P11
12P12
C10
05X
7R1H
471K
T
C43
247
0p
BACK
LD400 LEBB-S14H
2.2KR424
VA
405
47pC417
EV
L14K
0220
0
EV
L14K
0220
0V
A40
2
33uC402
100ohm
406
R417
R42
3
100K
4
R407 100ohm
CN402
123
EV
L14K
0220
0V
A40
4
R437 20
NA
C44
9
VA
412
EV
L14K
0220
0
0R436
10p
C41
5
END
R42
52.
2K
407
DN
VA
414
EV
L14K
0220
0
MENU
LD404
L40056nH
2
4INMINP
3
OUTA5
8OUTB
VM7
VP6
1_SD
LEBB-S14H
12
NCP2890DMR2
U402BYPASS
5600
p
OB4-15L42-C33LMIC400
C42
6
VA
408
EV
L14K
0220
0
408
EV
LC18
S02
003
VA
400
RCVP
RIGHT
NA
C44
8
100K
2 4 6 8
1 3 5 7
RA
400
47p
C40
8
R404
10K
3COM1
9COM2
6GND
IN14
IN28
5NC1
NC27
NO12
NO2101
VCC
LEBB-S14H
U401NLAS5223BMNR2G
LD403
EV
L14K
0220
0
10uC425
VA
403
C42
910
00p
R428
EV
L14K
0220
0V
A43
0
EV
LC18
S02
003
5.6K
INOUT_A33
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
VA
401
FL402
ICVE21184E150R500FR
5G
110
G2
1INOUT_A1
INOUT_A22
HOT401
EV
L14K
0220
0
VA
410
RCVN
0.1u
FC
411
1uC
406
C43
0
R400
2.2K
1000
p
R426
20K
100nHL402
L401 100nH
C418 0.1u
C42
7560
0p
100ohm
TP400
R416
C42
4N
A
FL403G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
ICVE21184E150R500FR
10u
CLR
C416
0.01uC410
1uC
412
R431
20K
10G
2
1INOUT_A1
INOUT_A22
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
ICVE21184E150R500FR
FL405
5G
1
R401
5.1K
402
0.01
uC
405
C41
40.
1u
EV
L14K
0220
0
VA
409
LEBB-S14HLD402
R419 100ohm
409
VSYNC19
LEBB-S14HLD407
18HSYNC
7MCLK
20PCLK
PG
ND
132 31
PG
ND
2P
GN
D3
30 29P
GN
D4
PG
ND
528 27
PG
ND
6P
GN
D7
26 25P
GN
D8
9RESETB
11SCKSDA
10
STANDBY12
14V
DD
IO
AG
ND
16
AG
ND
217 16
AV
DD
22D0D1
2324
D2D3
12
D4D5
34
D6D7
5
8D
GN
D1
DG
ND
215 21
DG
ND
3
DV
DD
13
MEGA_CAM_PWR_DOWN
I2C_SDAI2C_SCL
MEGA_CAM_RESET_N
CAM_VSYNC_OUTCAM_HSYNC_OUT
PM_ON_SW_N
VREG_CAM_AVDD_2.8V
CN403
SPK_RCV+
KEY_ROW(4)
KEY_ROW(3)
KEY_ROW(2)
KEY_ROW(1)
KEY_ROW(0)
KEY_COL(0)KEY_COL(1)KEY_COL(2)
KEY_COL(4)KEY_COL(3)
REMOTE_PWR_ON
+VPWR
KYBD_BACKLIGHT
VREG_CAM_DVDD_1.8VVREG_CAM_AVDD_2.8V
CAM_PCLK
CAM_MCLK
COMMON_CAM_MCLK
MIC2N
SPK_RCV-
+VPWR
SPK_RCV+
RCV_EN_NSPK_RCV-
VBAT_TEMP
VBATT
MIC2P
LINE_P
CAM_PCLK
LINE_N
CAM_DATA_OUT(3)CAM_DATA_OUT(2)
CAM_DATA_OUT(0)
CAM_DATA_OUT(4) CAM_DATA_OUT(5)
CAM_DATA_OUT(6)CAM_DATA_OUT(7)
CAM_HSYNC_OUT
I2C_SDA
VGA_CAM_RESET_N
VREG_CAM_DVDD_1.5V
+VPWR
SPK+
SPK_AMP_EN
EBI2_DATA(7)
EBI2_DATA(5)EBI2_DATA(4)
EBI2_DATA(6)
WLED_1
WLED_3
VREG_LCD_2.8V
LCD_ADSLCD_CS_N
LCD_RESET_N
LCD_VSYNC
LCD_IF_MODE_0LCD_IF_MODE_1
CAM_DATA_OUT(1)
RCV-
RCV+
SPK-
SPK++VPWR
EBI2_DATA(13)
EBI2_DATA(15)
EBI2_DATA(11)
EBI2_DATA(9)
EBI2_DATA(14)
EBI2_DATA(12)
CAM_DATA(6)
CAM_DATA_OUT(0)
CAM_DATA_OUT(2)
CAM_DATA_OUT(5)
CAM_DATA_OUT(3)CAM_DATA_OUT(4)
CAM_DATA_OUT(1)
CAM_DATA_OUT(7)CAM_DATA_OUT(6)
COMMON_CAM_MCLK
I2C_SCL
CAM_VSYNC_OUT
MICBIAS
MIC1P
MIC1N
SPK-
MICBIASVREG_MSMP_2.7V
VBAT_SENSE
CAM_DATA(1)CAM_DATA(2) CAM_DATA_OUT(2)
CAM_DATA(3)
CAM_DATA(5)CAM_DATA(4)
CAM_DATA_OUT(3)
CAM_DATA_OUT(5)
CAM_DATA(0)CAM_DATA_OUT(1)CAM_DATA_OUT(0)
CAM_DATA_OUT(4)
CAM_DATA(7)CAM_VSYNCCAM_HSYNC
CAM_DATA_OUT(6)CAM_DATA_OUT(7)CAM_VSYNC_OUTCAM_HSYNC_OUT
HPH_L
USB_D-
USB_VBUSUART_TXDUART_RXD
EAR_SENSE_N
+5V_PWR
USB_D+
VREG_MSMP_2.7V
VREG_MSMP_2.7V
MOTOR_PWR-
VREG_MSMP_2.7V
HOOK_KEY
EBI2_DATA(0)
EBI2_DATA(2)EBI2_DATA(3)
EBI2_DATA(1)
EBI2_DATA(8)
EBI2_DATA(10)
EBI2_WE_NEBI2_OE_N
WLED_PWR
WLED_2
LCD_MAKER_ID
HPH_R
7. CIRCUIT DIAGRAM
U250/KU250
- 147 -
LGMC
8. PCB LAYOUT
U25
0/K
U25
0
- 148 -
LGMC
8. PCB LAYOUT
U25
0/K
U25
0
9. Calibration & RF Auto Test Program (Hot Kimchi)
- 149 -
9. Calibration & RF Auto Test Program (Hot Kimchi)
9.1 Configuration of HOT KIMCHI
9.1.1 Configuration of directory
Cm_Grut
Debug
Common dll_serialat
Log
LG_CL_009.dll
Auto
Cal
CalAuto: Directory
: File
C:
At_Serial_Cmd.xml
Diag_NV6250_RevB.dll
Diag_NV.dll
Diag_NV6275.dll
DLL_E5515CD.DLL
DLL_PwrControlD.dll
LG_CL_011.dll
Dll_SerialATD.dll
PwrSupply_Cmd.xml
KU250
KU250
KU250
9. Calibration & RF Auto Test Program (Hot Kimchi)
- 150 -
Hot_Kimchi
Model
Debug
KU250
: Directory
: File
image
Log
Log
AutoSetup_110.xml
Cal_Setup_Test.xml
Ezlooks.xml
LG_RfCal_Q3G6280N_Polar_006.dll
Procedure_KU250_103.xml
script_auto_001.xml
script_cal_003.xml
Spec_3GPP_030.xml
LG_RfTest_E5515C_211.dll
ComLMPLib_11.dll
Dll_EzLooksMQ_004.dll
GuiTk115d.dll
HK_25.exe
ijl11.dll
SBCmd.xml
ShieldBox_DllD.dll
QMSL_MSVC6R.dll
9. Calibration & RF Auto Test Program (Hot Kimchi)
- 151 -
Result
UI
Auto
image
: Directory
: File
Cal
CalAuto
result.bmp
LG_UI_Ad6500_002.dll
KU250
KU250
KU250
LG_UI_EmKU250_001.dll
LG_UI_Qu6250_003.dll
LG_UI_Qu6275_004.dll
dll,ocx
MFCO42D.DLL
MSVCP60D.DLL
(Win98)MFCD DLL COPY.bat
(Win2000)MFCD DLL COPY.bat
(WinXP)MFCD DLL COPY.bat
MFC42D.DLL
MFCD42D.DLL
MFCN42D.DLL
Vsflex7L.ocx
vsflex7l_ocx_regist.bat
MSVCRTD.DLL
1. _New_HK_0808.reg
9. Calibration & RF Auto Test Program (Hot Kimchi)
- 152 -
9.2 How to use HOT KIMCHI
* Procedure
1. Click “Logic Operation” of “SETTING” menu bar
2. Select “UART Port” that PC can communicate with the phone
3. Select “LOGIC MODE” that you want
- Logic Mode -> 1: Calibration Only
➀
➁➂
9. Calibration & RF Auto Test Program (Hot Kimchi)
- 153 -
* Procedure
4. Select the model name “U250/KU250”
5. Click “Start” button
KU250
Select "U250/KU250"
Click "Start"
➃
➄
10. Factory Test Mode
- 154 -
10.1. Test Program Setting
1) Open “LG FTM GUI”
2) Click “Options >> Port Settings”
3) Select Com Port and click “OK”
10. Factory Test Mode
10. Factory Test Mode
- 155 -
10.2. WCDMA Test Mode
1) Click “Tools >> FTM GUI WCDMA”
2) Select “FTM” Mode
3) Select RF Frequencies, insert “9750” in “Uplink chan” and push “Enter”. Then “2140” is
written at Rx UHF automatically.
4) For Deciding to “TX AGC”, insert 380 as a maximum value . And then WCDMA Power is
decided.
5) To set PA Range, select ON in R1 for High power mode or select ON in R0 for Low power
mode.
6) Depending on a situation, Click “Tx On” or “Tx Off”.
7) Set Rx mode. Click LNA Range, 0~4.
8) Click “Get IM2” and “Get Rx AGC”. Confirm the value.
Channel Select Tx Control Rx Control
10. Factory Test Mode
- 156 -
10.3. GSM Test Mode
1) To switch GSM Mode, Select Mode -> GSM mode at menu commands
2) Select RF Mode, Click “GSM” or “GSM1800” or “GSM1900”
3) Write wanted channel. We usually set “1”
4) For Deciding to “PA DAC Value”, insert 14300 as a maximum value
5) Click “Tx On” or “Tx Off”.
6) SET RX mode. Click LNA Range, 0~4.
7) Click “RX ON”
Tx Power Control Rx Gain ControlChannel Control
- 157 -
1
2
3
45 6
78
12
13
15
16
1718
1920 22
2829 30
31
3235
34
33
36
2324 25
26 27
37
14
1110
9
11. EXPLODED VIEW & REPLACEMENT PART LIST
11.1 EXPLODED VIEW
- 158 -
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 159 -
11.2 Replacement Parts<Mechanic component>
Note: This Chapter is used for reference, Part orderis ordered by SBOM standard on GCSC
LevelLocation
No.Description Part Number Spec Color Remark
1 IMT,BAR/FLIP TIMT0000614 Black
2 AAAY00 ADDITION AAAY0219401 Black
3 MCJA00 COVER,BATTERY MCJA0040601 MOLD, PC LUPOY SC-1004A, , , , , Without Color 36
2 APAY00 PACKAGE APAY0095904 U250 HIT Packing(P/Label66-Angle-9501) Without Color
3 BSEA00 SUPPLEMENTARY PART BSEA0003901 PACKING-LIST ENVELOPE
2 APEY00 PHONE APEY0394202 Black
3 ACGK00 COVER ASSY,FRONT ACGK0085601 Without Color
4 MCCC00 CAP,EARPHONE JACK MCCC0043601 COMPLEX, (empty), , , , , Without Color 10
4 MCCG00 CAP,MULTIMEDIA CARD MCCG0007601 COMPLEX, (empty), , , , , Without Color 4
4 MCJK00 COVER,FRONT MCJK0069301 MOLD, PC LUPOY SC-1004A, , , , , Without Color 5
5 MICE00 INSERT,NUT MICE0000601 COMPLEX, (empty), , , , , Without Color
5 MICE01 INSERT,NUT MICE0000701 COMPLEX, (empty), , , , , Without Color
4 MFBC00 FILTER,SPEAKER MFBC0029401 COMPLEX, (empty), , , , , Without Color 6
4 MFBZ00 FILTER MFBZ0002801 COMPLEX, (empty), , , , , Without Color 9
4 MHGJ00 HOLDER,SPEAKER MHGJ0001701 COMPLEX, (empty), , , , , Black 7
4 MKAZ00 KEYPAD MKAZ0035901 COMPLEX, (empty), , , , , Without Color 11
4 MPBG00 PAD,LCD MPBG0058301 COMPLEX, (empty), 1.2, , , , Without Color 12
4 MPBT00 PAD,CAMERA MPBT0039101 COMPLEX, (empty), 1.2, , , , Without Color 8
4 MTAB00 TAPE,PROTECTION MTAB0160501 COMPLEX, (empty), , , , , Without Color 1
4 MTAB01 TAPE,PROTECTION MTAB0160601 COMPLEX, (empty), , , , , Without Color 13
4 MTAD00 TAPE,WINDOW MTAD0065801 COMPLEX, (empty), 0.2, , , , Without Color 3
4 MWAC00 WINDOW,LCD MWAC0077201 COMPLEX, (empty), 1.0, , , , Without Color 2
3 ACGM00 COVER ASSY,REAR ACGM0087501 Without Color
4 ENZY00 CONNECTOR,ETC ENZY0019701 4 PIN,3.0 mm,ETC , ,H=5.8 24
4 MCCF00 CAP,MOBILE SWITCH MCCF0042501 COMPLEX, (empty), , , , , Black 29
4 MCJN00 COVER,REAR MCJN0065501 MOLD, PC LUPOY SC-1004A, , , , , Without Color 28
4 MHGZ00 HOLDER MHGZ0028701 COMPLEX, (empty), , , , , Black 22
4 MLAB00 LABEL,A/S MLAB0001102 C2000 USASV DIA 4.0 White 27
4 MLAN00 LABEL,QUALCOMM MLAN0000603 White,95C Transparent
4 MPBH00 PAD,MIKE MPBH0029101 COMPLEX, (empty), , , , , Black 26
4 MPBN00 PAD,SPEAKER MPBN0039001 CUTTING, NS, , , , , Black 18
4 MPBZ00 PAD MPBZ0186001 COMPLEX, (empty), , , , , Without Color 19
4 MPBZ01 PAD MPBZ0186801 COMPLEX, (empty), , , , , Without Color 25
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 160 -
LevelLocation
No.Description Part Number Spec Color Remark
4 MTAB01 TAPE,PROTECTION MTAB0178301 COMPLEX, (empty), , , , , Without Color 32
4 MTAD00 TAPE,WINDOW MTAD0065901 COMPLEX, (empty), 0.2, , , , Without Color 30
4 MWAE00 WINDOW,CAMERA MWAE0024501 COMPLEX, (empty), 1.0, , , , Without Color 31
4 SJMY00 VIBRATOR,MOTOR SJMY0007903 3 V,0.85 A,4*8 ,Height 5.8T Cylinder ,; ,3V , , ,11000 , , , , 23
4 SNGF00 ANTENNA,GSM,FIXED SNGF00231023.0 ,-2 dBd, ,EGSM+DCS+PCS+W-BAND I, INTERNAL ,;,QUAD ,-2.0 ,50 ,3.0
20
3 MLAA00 LABEL,APPROVAL MLAA0042001 COMPLEX, (empty), , , , , Without Color 34
6 MCBA00 CAN,SHIELD MCBA0017101 COMPLEX, (empty), , , , , Without Color
6 MPBZ00 PAD MPBZ0179301 COMPLEX, (empty), 0.6t, , , , Without Color 16
5 ADCA00 DOME ASSY,METAL ADCA0064001 Without Color 14
5 MTAZ00 TAPE MTAZ0186301 COMPLEX, (empty), 0.1, , , , Without Color
5 MLAZ00 LABEL MLAZ0038301 PID Label 4 Array Without Color
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 161 -
LevelLocation
No.Description Part Number Spec Color Remark
3 GMEY00 SCREW MACHINE,BIND GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK Without Color 33
3 SAFY00 PCB ASSY,MAIN SAFY0196602 15
4 SAFB00 PCB ASSY,MAIN,INSERT SAFB0072901
5 ACKA00 CAN ASSY,SHIELD ACKA0002101 Without Color 17
5 SUMY00 MICROPHONE SUMY0010301 FPCB ,-42 dB,4*1.5T ,Standard Holder
5 SUSY00 SPEAKER SUSY0026801ASSY ,8 ohm,88 dB, mm,wire 15mm ,; , , , , , ,18*10*3T,WIRE
5 SVCY00 CAMERA SVCY0014401CMOS ,MEGA ,1.3M, Magnachip(1/4"), 8x8x5t, SocketType
5 SVCY01 CAMERA SVCY0014301 CMOS ,VGA ,Socket type
5 SVLM00 LCD MODULE SVLM0025001MAIN ,176*220 (1.76") ,34*46.7*2.5(T) ,262k ,TFT ,TM,NT3916(Novatek) ,NTSC:60%
4 SAFF00 PCB ASSY,MAIN,SMT SAFF0117802
5 SAFC00PCB ASSY,MAIN,SMTBOTTOM
SAFC0088501
6 ANT103 ANTENNA,GSM,FIXED SNGF00260013.0 ,-2.0 dBd, ,Bluetooth, SMD, 8.0*2.0*1.2 ,; ,SINGLE ,-2.0 ,50 ,3.0
6 BAT300 BATTERY,CELL,LITHIUM SBCL00017012 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67,phi 4.8, Pb-Free
6 C101 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C103 CAP,CERAMIC,CHIP ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C104 CAP,CERAMIC,CHIP ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C106 CAP,CHIP,MAKER ECZH0000846 8.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C107 CAP,CERAMIC,CHIP ECCH0000107 6 pF,50V,D,NP0,TC,1005,R/TP
6 C108 CAP,CERAMIC,CHIP ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C109 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C110 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C112 CAP,CHIP,MAKER ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C113 CAP,CERAMIC,CHIP ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C114 CAP,CERAMIC,CHIP ECCH0000149 3.3 nF,50V,K,X7R,HD,1005,R/TP
6 C115 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C117 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C118 CAP,CHIP,MAKER ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C119 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C121 CAP,TANTAL,CHIP,MAKER ECTZ000560333 uF,10V ,M ,L_ESR ,2125 ,R/TP ,; , ,[empty] ,[empty] ,,[empty] , ,[empty] ,[empty] ,[empty] ,[empty]
6 C122 CAP,CERAMIC,CHIP ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP
11.2 Replacement Parts<Main component>
Note: This Chapter is used for reference, Part orderis ordered by SBOM standard on GCSC
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 162 -
LevelLocation
No.Description Part Number Spec Color Remark
6 C123 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C124 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C126 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C127 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C128 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C129 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C130 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C131 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C132 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C134 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C135 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C136 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C139 CAP,CHIP,MAKER ECZH0000844 68 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C140 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C141 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C142 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C143 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C144 CAP,CERAMIC,CHIP ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP
6 C147 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C149 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
6 C150 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C151 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C152 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C153 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
6 C154 CAP,CHIP,MAKER ECZH0000802 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C155 CAP,TANTAL,CHIP ECTH0002202 4.7 uF,10V ,M ,STD ,1608 ,R/TP
6 C156 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C157 INDUCTOR,CHIP ELCH0001427 2.2 nH,S ,1005 ,R/TP ,Pb Free
6 C158 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
6 C159 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
6 C161 CAP,CERAMIC,CHIP ECCH0000901 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C162 CAP,CERAMIC,CHIP ECCH0000180 3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C164 CAP,CERAMIC,CHIP ECCH0000101 .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C165 CAP,CERAMIC,CHIP ECCH0000101 .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C170 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C171 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C172 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 163 -
LevelLocation
No.Description Part Number Spec Color Remark
6 C173 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6 C174 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C176 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C177 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6 C178 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C179 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C180 CAP,CERAMIC,CHIP ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP
6 C181 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C182 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C183 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C185 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C186 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C187 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C188 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C189 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C190 CAP,CERAMIC,CHIP ECCH0000101 .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C192 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C200 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
6 C201 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
6 C202 CAP,CHIP,MAKER ECZH0001211 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP
6 C203 CAP,CHIP,MAKER ECZH0001211 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP
6 C204 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C205 CAP,TANTAL,CHIP,MAKER ECTZ0004701 4.7 uF,6.3V ,M ,STD ,1608 ,R/TP
6 C206 CAP,TANTAL,CHIP ECTH0003701 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
6 C209 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6 C210 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
6 C211 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
6 C212 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C213 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C214 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C215 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C216 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6 C217 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C218 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C219 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6 C220 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6 C221 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 164 -
LevelLocation
No.Description Part Number Spec Color Remark
6 C222 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C223 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C225 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C226 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C227 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C228 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C229 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6 C230 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6 C231 CAP,CERAMIC,CHIP ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP
6 C232 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C233 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C234 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C235 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C236 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C237 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C238 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C239 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C240 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6 C242 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6 C243 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C244 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C246 CAP,CERAMIC,CHIP ECCH0000161 33 nF,16V,K,X7R,HD,1005,R/TP
6 C247 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C301 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C302 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C303 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C304 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C305 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C306 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C307 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C308 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP
6 C310 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP
6 C311 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C312 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C316 CAP,CERAMIC,CHIP ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP
6 C317 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6 C318 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 165 -
LevelLocation
No.Description Part Number Spec Color Remark
6 C319 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6 C320 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6 C321 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6 C322 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C323 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C324 CAP,CHIP,MAKER ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C325 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C326 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C327 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C328 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6 C329 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6 C330 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6 C331 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6 C332 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6 C333 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C334 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C335 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C336 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP
6 C337 CAP,CHIP,MAKER ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C338 CAP,CHIP,MAKER ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C339 CAP,CERAMIC,CHIP ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP
6 C340 CAP,CERAMIC,CHIP ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP
6 C341 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C343 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C344 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C345 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C346 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C347 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C348 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C349 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C350 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C351 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C352 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C353 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C354 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C355 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C356 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 166 -
LevelLocation
No.Description Part Number Spec Color Remark
6 C357 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C358 CAP,CERAMIC,CHIP ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP
6 C389 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C400 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C401 CAP,TANTAL,CHIP ECTH0004402 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP
6 C402 CAP,TANTAL,CHIP ECTH0004402 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP
6 C403 CAP,CERAMIC,CHIP ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP
6 C404 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6 C405 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C406 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C407 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
6 C408 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
6 C409 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C410 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C411 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6 C412 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C413 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C414 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C415 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C416 CAP,TANTAL,CHIP ECTH0003701 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
6 C417 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
6 C418 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C419 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C420 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C421 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C422 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C423 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C425 CAP,TANTAL,CHIP ECTH0001902 10 uF,10V ,M ,L_ESR ,1608 ,R/TP
6 C426 CAP,CERAMIC,CHIP ECCH0000152 5.6 nF,25V,K,X7R,HD,1005,R/TP
6 C427 CAP,CERAMIC,CHIP ECCH0000152 5.6 nF,25V,K,X7R,HD,1005,R/TP
6 C428 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C429 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C430 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C432 CAP,CHIP,MAKER ECZH0001121 470 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
6 C433 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C434 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C435 CAP,TANTAL,CHIP ECTH0001903 22 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 167 -
LevelLocation
No.Description Part Number Spec Color Remark
6 C436 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
6 C437 CAP,CHIP,MAKER ECZH0000802 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C438 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C439 CAP,CHIP,MAKER ECZH0000806 5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C440 CAP,CHIP,MAKER ECZH0000806 5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C441 CAP,CERAMIC,CHIP ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C442 CAP,CERAMIC,CHIP ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C443 CAP,CERAMIC,CHIP ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C444 CAP,CERAMIC,CHIP ECCH0000901 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C445 CAP,CERAMIC,CHIP ECCH0000901 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C446 CAP,TANTAL,CHIP,MAKER ECTZ000560333 uF,10V ,M ,L_ESR ,2125 ,R/TP ,; , ,[empty] ,[empty] ,,[empty] , ,[empty] ,[empty] ,[empty] ,[empty]
6 C447 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C450 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 CN400 CONNECTOR,FFC/FPC ENQY0010901 35 PIN,0.3 mm,ETC , ,H=1.2
6 CN401 CONNECTOR,I/O ENRY0006401 18 PIN,0.4 mm,ANGLE , ,H=2.5, Reverse Type
6 CN403 CONN,SOCKET ENSY0020101 24 PIN,ETC , ,0.9 mm,
6 D400 DIODE,SWITCHING EDSY0011901EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,IR=30uA(VR=10V)
6 D401 DIODE,TVS EDTY0007401 SMD ,12 V,350 W,R/TP ,
6 D402 DIODE,TVS EDTY0008610 SOD-523 ,5 V,250 W,R/TP ,PB-FREE
6 D403 DIODE,TVS EDTY0008601 SOD-323 ,6 V,400 W,R/TP ,PB-FREE
6 D404 DIODE,TVS EDTY0008601 SOD-323 ,6 V,400 W,R/TP ,PB-FREE
6 FL101 FILTER,SAW SFSY0030201897.5 MHz,1.4*1.1*0.6 ,SMD ,Pb-free_SAW_GSM900_Tx
6 FL102 FILTER,SAW SFSY00311011950 MHz,1.4*1.1*0.62 ,SMD ,RF Filter for WCDMA2Ghz ,; ,1950 ,1.4*1.1*0.62 ,SMD ,P/TR
6 FL103 FILTER,SAW SFSY00312012140 MHz,1.4*1.1*0.62 ,SMD ,2110M~2170M, IL 2.0,5pin, U-B, 50-100_10, WCDMA BAND I Rx ,; ,2140,1.4*1.1*0.62 ,SMD ,R/TP
6 FL104 DUPLEXER,IMT SDMY00013011950 MHz,2140 MHz,1.6 dB,2.0 dB,53 dB,44dB,3.0*2.5*1.2 ,SMD ,FBAR, WCDMA duplexer ,; ,2140,44 ,1950 ,53 ,2.0 ,1.6 ,3.0X2.5X1.2 ,DUAL ,SMD ,R/TP
6 FL400 FILTER,EMI/POWER SFEY0007103SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),Pb-free
6 FL401 FILTER,EMI/POWER SFEY0007103SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),Pb-free
6 FL402 FILTER,EMI/POWER SFEY0007103SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),Pb-free
6 FL403 FILTER,EMI/POWER SFEY0007103SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),Pb-free
6 FL404 FILTER,EMI/POWER SFEY0006001 SMD ,
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 168 -
LevelLocation
No.Description Part Number Spec Color Remark
6 FL405 FILTER,EMI/POWER SFEY0007103SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),Pb-free
6 FL406 FILTER,EMI/POWER SFEY0007103SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),Pb-free
6 FL407 FILTER,EMI/POWER SFEY0007103SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),Pb-free
6 FL408 FILTER,EMI/POWER SFEY0007103SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),Pb-free
6 J300 CONN,SOCKET ENSY0019201 8 PIN,ETC ,8Pin ,2.54 mm,Korean 8Pin Stopper UIM
6 L102 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP ,
6 L108 INDUCTOR,CHIP ELCH0001031 15 nH,J ,1005 ,R/TP ,PBFREE
6 L111 INDUCTOR,CHIP ELCH0004718 5.6 nH,S ,1005 ,R/TP ,
6 L114 INDUCTOR,CHIP ELCH0003813 47 nH,J ,1005 ,R/TP ,COIL TYPE
6 L115 INDUCTOR,CHIP ELCH0001032 18 nH,J ,1005 ,R/TP ,PBFREE
6 L116 INDUCTOR,CHIP ELCH0001041 10 nH,S ,1005 ,R/TP ,PBFREE
6 L119 INDUCTOR,CHIP ELCH0003813 47 nH,J ,1005 ,R/TP ,COIL TYPE
6 L120 INDUCTOR,CHIP ELCH0003813 47 nH,J ,1005 ,R/TP ,COIL TYPE
6 L121 INDUCTOR,CHIP ELCH0005020 1 nH,S ,1005 ,R/TP ,
6 L123 INDUCTOR,CHIP ELCH0005020 1 nH,S ,1005 ,R/TP ,
6 L125 INDUCTOR,CHIP ELCH0001410 12 nH,J ,1005 ,R/TP ,Pb Free
6 L128 INDUCTOR,CHIP ELCH0005010 1.8 nH,S ,1005 ,R/TP ,
6 L300 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
6 L301 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
6 L302 INDUCTOR,CHIP ELCH0001550 56 nH,J ,1608 ,R/TP ,
6 L305 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
6 L400 INDUCTOR,CHIP ELCH0003825 56 nH,J ,1005 ,R/TP ,chip inductor,PBFREE
6 L401 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP ,
6 L402 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP ,
6 L403 INDUCTOR,CHIP ELCH0001033 1.5 nH,S ,1005 ,R/TP ,PBFREE
6 L404 INDUCTOR,CHIP ELCH0005010 1.8 nH,S ,1005 ,R/TP ,
6 L405 INDUCTOR,CHIP ELCH0005002 2.7 nH,S ,1005 ,R/TP ,
6 L406 INDUCTOR,CHIP ELCH0005002 2.7 nH,S ,1005 ,R/TP ,
6 L407 INDUCTOR,CHIP ELCH0005002 2.7 nH,S ,1005 ,R/TP ,
6 L408 INDUCTOR,CHIP ELCH0001041 10 nH,S ,1005 ,R/TP ,PBFREE
6 L409 INDUCTOR,CHIP ELCH0001035 4.7 nH,S ,1005 ,R/TP ,PBFREE
6 L410 INDUCTOR,CHIP ELCH0001035 4.7 nH,S ,1005 ,R/TP ,PBFREE
6 L411 INDUCTOR,CHIP ELCH0001035 4.7 nH,S ,1005 ,R/TP ,PBFREE
6 M100 MODULE,ETC SMZY0012601 4.5x3.2x1.2 Bluetooth RF Module
6 Q300 TR,BJT,PNP EQBP0009901 TSMT6 ,0.5 W,R/TP ,Vceo=-12V, Ic=-3A, hFE=270~680
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 169 -
LevelLocation
No.Description Part Number Spec Color Remark
6 Q301 TR,FET,P-CHANNEL EQFP0004701TSOP6 ,1.5 W,20 V,-5 A,R/TP ,P-CHANNEL 20-V(D-S)MOSFET, Pb free
6 Q302 TR,BJT,PNP EQBP0009901 TSMT6 ,0.5 W,R/TP ,Vceo=-12V, Ic=-3A, hFE=270~680
6 R100 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
6 R101 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
6 R103 RES,CHIP,MAKER ERHZ0000212 12 Kohm,1/16W ,F ,1005 ,R/TP
6 R104 RES,CHIP,MAKER ERHZ0000310 680 ohm,1/16W ,F ,1005 ,R/TP
6 R105 RES,CHIP,MAKER ERHZ0003801 5.1 ohm,1/16W ,J ,1005 ,R/TP
6 R106 RES,CHIP,MAKER ERHZ0003801 5.1 ohm,1/16W ,J ,1005 ,R/TP
6 R107 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 R108 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP
6 R109 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R110 RES,CHIP,MAKER ERHZ0000517 91 ohm,1/16W ,J ,1005 ,R/TP
6 R111 RES,CHIP,MAKER ERHZ0000517 91 ohm,1/16W ,J ,1005 ,R/TP
6 R112 RES,CHIP,MAKER ERHZ0000473 39 ohm,1/16W ,J ,1005 ,R/TP
6 R113 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 R114 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 R115 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 R116 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 R117 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 R118 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
6 R119 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP
6 R120 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP
6 R121 RES,CHIP,MAKER ERHZ0000415 130 ohm,1/16W ,J ,1005 ,R/TP
6 R122 RES,CHIP,MAKER ERHZ0000415 130 ohm,1/16W ,J ,1005 ,R/TP
6 R123 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
6 R124 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 R128 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R201 RES,CHIP,MAKER ERHZ0000222 150 Kohm,1/16W ,F ,1005 ,R/TP
6 R202 RES,CHIP,MAKER ERHZ0000469 36 ohm,1/16W ,J ,1005 ,R/TP
6 R204 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
6 R205 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
6 R207 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP
6 R208 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
6 R209 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
6 R211 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
6 R213 RES,CHIP,MAKER ERHZ0000437 2 Kohm,1/16W ,J ,1005 ,R/TP
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 170 -
LevelLocation
No.Description Part Number Spec Color Remark
6 R214 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
6 R215 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
6 R300 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
6 R301 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R302 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R303 RES,CHIP,MAKER ERHZ0004201 121000 ohm,1/16W ,F ,1005 ,R/TP
6 R304 RES,CHIP,MAKER ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP
6 R305 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
6 R306 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP
6 R307 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
6 R308 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
6 R309 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
6 R313 RES,CHIP ERHY0008602 0.1 ohm,1/4W ,J ,2012 ,R/TP
6 R314 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
6 R315 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R316 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R317 RES,CHIP,MAKER ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP
6 R318 RES,CHIP,MAKER ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP
6 R380 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R400 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
6 R401 RES,CHIP,MAKER ERHZ0000530 5.1 Kohm,1/16W ,J ,1005 ,R/TP
6 R402 RES,CHIP,MAKER ERHZ0000407 1000 Kohm,1/16W ,J ,1005 ,R/TP
6 R403 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
6 R404 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
6 R405 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R406 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 R407 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 R408 RES,CHIP,MAKER ERHZ0000288 470 Kohm,1/16W ,F ,1005 ,R/TP
6 R409 RES,CHIP,MAKER ERHZ0000537 680000 ohm,1/16W ,F ,1005 ,R/TP
6 R410 RES,CHIP,MAKER ERHZ0000318 80.6 Kohm,1/16W ,F ,1005 ,R/TP
6 R421 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R422 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R424 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
6 R425 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
6 R426 RES,CHIP,MAKER ERHZ0000438 20 Kohm,1/16W ,J ,1005 ,R/TP
6 R427 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
6 R428 RES,CHIP,MAKER ERHZ0000499 5600 ohm,1/16W ,J ,1005 ,R/TP
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 171 -
LevelLocation
No.Description Part Number Spec Color Remark
6 R429 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
6 R430 RES,CHIP,MAKER ERHZ0000499 5600 ohm,1/16W ,J ,1005 ,R/TP
6 R431 RES,CHIP,MAKER ERHZ0000438 20 Kohm,1/16W ,J ,1005 ,R/TP
6 R433 RES,CHIP ERHY0013101 2.7 ohm,1/16W ,J ,1005 ,R/TP
6 R434 RES,CHIP ERHY0013101 2.7 ohm,1/16W ,J ,1005 ,R/TP
6 R435 RES,CHIP,MAKER ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP
6 R436 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
6 R437 RES,CHIP,MAKER ERHZ0000435 20 ohm,1/16W ,J ,1005 ,R/TP
6 RA400 RES,ARRAY,R ERNR0000404 100 Kohm,100 Kohm,8 PIN,J ,1/16W ,SMD ,R/TP
6 S300 CONN,SOCKET ENSY00135018 PIN,ETC ,PUSH-PUSH TYPE / RECTANGULAR ,1.1mm,TRANS FLASH SOCKET / EXTERNAL MEMORYCARD SOCKET
6 SW100 CONN,RF SWITCH ENWY0003301 ,SMD ,0.4 dB,
6 TR100 TR,BJT,ARRAY EQBA0000601 UMT5 ,.2 W,R/TP ,
6 U100 IC EUSY0300501QFN ,56 PIN,R/TP ,GSM, WCDMA Single RFTransceiver, 8X8X0.9
IC EUSY0300502QFN ,56 PIN,R/TP ,chartered,GSM, WCDMA Single RFTransceiver, 8X8X0.9 ,; ,IC,Tx/Rx
6 U101 PAM SMPY0014001 35.5 dBm,56 %, A, dBc, dB,6x6x1.15 ,SMD ,Tri Band
6 U102COUPLER,RFDIRECTIONAL
SCDY0003403-18 dB,-.25 dB,-33 dB,1.0*0.58*0.35 ,SMD ,1920M ~1980M, 4pin, Pb Free , ,[empty] , , ,SMD ,R/TP
6 U103 PAM SMPY0014201 28 dBm,40 %,465 mA,-44 dBc,26.5 dB,4x4x1.1 ,SMD ,
6 U104 IC EUSY0073401 SSOP5-P-0.65A ,5 PIN,R/TP ,INVERTER, Pb Free
6 U201 IC EUSY0318401 CSP ,409 PIN,R/TP ,WEDGE Baseband Platform
6 U300 IC EUSY0306302 BCCS ,84 PIN,R/TP ,7x7, MSMC(1.2V), pbfree
6 U301 IC EUSY0332001FBGA ,137 PIN,ETC ,512M(64Mx8)NAND+512M(16Mx32) SDRAM , ,IC,MCP
6 U302 IC EUSY0232812 SON1612-6 ,6 PIN,R/TP ,2.8V, 150mA LDO
6 U303 IC EUSY0319001WDFN-8L ,8 PIN,R/TP ,300mA/300mA 2.8V/1.8V DualLDO
6 U305 IC EUSY0238702TSOPJW-12 ,12 PIN,R/TP ,3PORT ChargePump(AAT2154 Low cost version)
6 U400 IC EUSY0250501SC70 ,5 PIN,R/TP ,Comparator, pin compatible toEUSY0077701
6 U401 IC EUSY0300101WQFN ,10 PIN,R/TP ,Small package Dual SPDT analogSwitch, PB-Free
6 U402 IC EUSY0176401 MICRO8 ,8 PIN,R/TP ,1W AUDIO AMPLIFIER
6 U500 FILTER,SEPERATOR SFAY0007402900.1800 ,1900.2100 , dB, dB, dB, dB,ETC ,1800GSMQuad, WCDMA2100 FEM, 5.4X4.0X1.2, Improved D5006
6 U501 IC EUSY0223001HVSOF5 ,5 PIN,R/TP ,150mA CMOS LDO WITHOUTPUT CONTROL / 1.5V
6 VA300 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005
6 VA301 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 172 -
LevelLocation
No.Description Part Number Spec Color Remark
6 VA302 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005
6 VA303 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005
6 VA304 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005
6 VA305 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005
6 VA306 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005
6 VA400 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005
6 VA401 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005
6 VA402 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005
6 VA403 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005
6 VA404 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005
6 VA405 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005
6 VA407 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005
6 VA408 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005
6 VA409 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005
6 VA410 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005
6 VA412 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005
6 VA414 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005
6 VA430 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005
6 VA490 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005
6 X100 VCTCXO EXSK000570319.2 MHz,1.5 PPM,40 pF,SMD ,3.2*2.5*0.9 , ,; , ,1.5PPM,2.8V ,3.2 ,2.5 ,0.9 , ,SMD ,P/TP
6 X300 X-TAL EXXY0004601.032768 MHz,20 PPM,7 pF,65000 ohm,SMD ,6.9*1.4*1.3,
5 SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0087801
6 CN404 CONN,SOCKET ENSY0020001
6 LD400 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
6 LD402 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
6 LD403 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
6 LD404 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
6 LD405 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
6 LD406 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
6 LD407 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
6 LD408 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
6 R411 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 R413 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 R414 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 R415 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 R416 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 173 -
LevelLocation
No.Description Part Number Spec Color Remark
6 R417 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 R418 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 R419 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 R423 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 SPFY00 PCB,MAIN SPFY0147601 FR-4 ,1.0 mm,BUILD-UP 8 ,
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 174 -
11.3 Accessory Note: This Chapter is used for reference, Part orderis ordered by SBOM standard on GCSC
LevelLocation
No.Description Part Number Spec Color Remark
3 SBPL00 BATTERY PACK,LI-ION SBPL00905013.7 V,950 mAh,1 CELL,PRISMATIC ,KU250 EuropeBATT, IP, Pb-Free ,; ,3.7 ,950 ,0.2C ,PRISMATIC,50x34x55 , ,BLACK ,Innerpack ,Europe Label
Black 35
3 SSAD00 ADAPTOR,AC-DC SSAD0024501
100-240V ,5060 Hz,5.1 V,.7 A,CE ,AC-DC ADAPTOR ,;,85Vac~264Vac ,5.1V +0.15V, -0.2V ,700mA ,5060 ,,WALL 2P ,I/O CONNECTOR ,
ADAPTOR,AC-DC SSAD0024502
100-240V ,5060 Hz,5.1 V,0.7 A,CE ,AC-DC ADAPTOR ,;,5.1V +0.15V, -0.2V ,5.1V ,700mA ,5060 , ,WALL 2P ,I/OCONNECTOR ,
ADAPTOR,AC-DC SSAD0024503100-240V ,5060 Hz,5.2 V,0.7 A,CE ,AC-DC ADAPTOR ,;,85Vac~264Vac ,5.2±0.3V ,700mA ,5060 , ,WALL 2P ,I/OCONNECTOR ,
ADAPTOR,AC-DC SSAD0024504100-240V ,5060 Hz,5.1 V,.7 A,CE ,AC-DC ADAPTOR ,;,85Vac~264Vac ,5.1V(+0.15V, -0.2V) ,700mA ,5060 ,,WALL 2P ,I/O CONNECTOR ,
Note
Note
