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Memory Devices May be classified as: ROM; Flash; SRAM; DRAM. Connections: Address; Data; Selection; Control.

Memory Devices May be classified as: ROM; Flash; SRAM; DRAM. Connections: Address; Data; Selection; Control

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Page 1: Memory Devices  May be classified as: ROM; Flash; SRAM; DRAM.  Connections: Address; Data; Selection; Control

Memory Devices May be classified

as: ROM; Flash; SRAM; DRAM.

Connections: Address; Data; Selection; Control.

Page 2: Memory Devices  May be classified as: ROM; Flash; SRAM; DRAM.  Connections: Address; Data; Selection; Control

ROM – Read Only Memory Combinational logic

circuit. Non volatile type. Some do not think

ROM is a memory device.

Others like to think the information is stored into the device in manufacturing.

Page 3: Memory Devices  May be classified as: ROM; Flash; SRAM; DRAM.  Connections: Address; Data; Selection; Control

ROM Application A 4X4 multiplier

may be designed by using a ROM whose inputs are defined as the multiplicand and the multiplier and the address they decode stores the product.

Page 4: Memory Devices  May be classified as: ROM; Flash; SRAM; DRAM.  Connections: Address; Data; Selection; Control

8X4 Diode ROM Word line.

Each output of the decoder.

Bit line. Each resistor

terminated line. What are the

functions of the resistors and the diodes?

Address 5 (A2A1A0 = 101) has the value 2 stored in it.

Page 5: Memory Devices  May be classified as: ROM; Flash; SRAM; DRAM.  Connections: Address; Data; Selection; Control

8X4 Diode ROM Notice that ROW3_L

does not contain diodes, thus creating sneaky paths.

Now address 5’s output is modified by the new paths created by the absence of diodes in ROW3_L.

Page 6: Memory Devices  May be classified as: ROM; Flash; SRAM; DRAM.  Connections: Address; Data; Selection; Control

128X1 ROM 3 to 8 decoder

selects the word line.

16X1 multiplexer selects the bit line.

Matrix of 23 X 24 locations.

Page 7: Memory Devices  May be classified as: ROM; Flash; SRAM; DRAM.  Connections: Address; Data; Selection; Control

ROM General Structure Row decoder selects the

word lines. Column multiplexers

selects the bit lines. CS_L selects the device

for operation. It is also used as a power down input.

OE_L enables the output buffer.

Page 8: Memory Devices  May be classified as: ROM; Flash; SRAM; DRAM.  Connections: Address; Data; Selection; Control

ROM Timing

tAA – Access time from address. tACS – Access time from chip select. tOE – Output enable time. tOZ – Output disable time. tOH – Output hold time.

Page 9: Memory Devices  May be classified as: ROM; Flash; SRAM; DRAM.  Connections: Address; Data; Selection; Control

Read/Write Memory RWM – Read/write memory are memory

arrays to which data may be written to or read from.

RAM – Random access memory are memory arrays whose time to read or write data is independent of the data location. SRAM – data written to memory does not change

unless overwritten or power is shut off. DRAM – Data written to memory needs to be

refreshed periodically. Data will be lost if it is not refreshed, it is overwritten or power is shut off.

Page 10: Memory Devices  May be classified as: ROM; Flash; SRAM; DRAM.  Connections: Address; Data; Selection; Control

Static RAM Volatile. Two access operations:

Read: Address provided; OE_L and CS_L asserted; Data is read from memory

cell at the address provided and made available at DOUT.

Write: Address provided; WE_L and CS_L asserted; Data is written to the

memory cell at the address provided.

Page 11: Memory Devices  May be classified as: ROM; Flash; SRAM; DRAM.  Connections: Address; Data; Selection; Control

8X4 Static RAM Each cell is

composed of a D latch and a NOR gate.

The array has a decoder to select the word line.

The output is buffered.

Page 12: Memory Devices  May be classified as: ROM; Flash; SRAM; DRAM.  Connections: Address; Data; Selection; Control

SRAM Read Timing

tAA – Access time from address. tACS – Access time from chip select. tOE – Output enable time. tOZ – Output disable time. tOH – Output hold time.

Page 13: Memory Devices  May be classified as: ROM; Flash; SRAM; DRAM.  Connections: Address; Data; Selection; Control

SRAM Write Timing

tAS – Address setup time before write. tAH – Address hold time after write. tCSW – Chip select setup before end of write. tWP – Write pulse width. tDS – Data setup time before end of write. tDH – Data hold time after end of write.

Page 14: Memory Devices  May be classified as: ROM; Flash; SRAM; DRAM.  Connections: Address; Data; Selection; Control

Address Decoding Addresses must be decoded to properly

select a memory chip or port. This decoded signal will select specific

devices that will communicate with the processor through the data and control buses.

Several different methods may be used in address decoding: Gates; Decoders: ROMs; PLDs.

Page 15: Memory Devices  May be classified as: ROM; Flash; SRAM; DRAM.  Connections: Address; Data; Selection; Control

Address Decoding

Page 16: Memory Devices  May be classified as: ROM; Flash; SRAM; DRAM.  Connections: Address; Data; Selection; Control

Address Decoding