MSP430 Hardware Tools (Rev. W)

MSP430 Hardware Tools

User's Guide

Literature Number: SLAU278WMay 2009–Revised October 2015

Contents

Preface ........................................................................................................................................ 91 Get Started Now! ................................................................................................................ 12

1.1 Kit Contents, MSP-TS430xx .............................................................................................. 131.2 Kit Contents, MSP-FET430xx ............................................................................................ 151.3 Kit Contents, MSP-FET.................................................................................................... 151.4 Kit Contents, MSP-FET430UIF........................................................................................... 151.5 Kit Contents, MSP-FET430PIF ........................................................................................... 151.6 Kit Contents, eZ430-F2013 ............................................................................................... 151.7 Kit Contents, eZ430-T2012 ............................................................................................... 151.8 Kit Contents, eZ430-RF2500 ............................................................................................. 161.9 Kit Contents, eZ430-RF2500T............................................................................................ 161.10 Kit Contents, eZ430-RF2500-SEH ....................................................................................... 161.11 Kit Contents, eZ430-Chronos-xxx........................................................................................ 161.12 Kit Contents, FET430F6137RF900 ...................................................................................... 171.13 Kit Contents, EM430Fx1x7RF900 ....................................................................................... 171.14 Hardware Installation, MSP-FET ......................................................................................... 181.15 Hardware Installation, MSP-FET430UIF ................................................................................ 181.16 Hardware Installation, MSP-FET430PIF ................................................................................ 191.17 Hardware Installation, MSP-TS430xxx, MSP-FET430Uxx, FET430F6137RF900, EM430Fx1x7RF900 ....... 191.18 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSPEXP430F5529........... 191.19 Important MSP430 Documents on the Web ............................................................................ 19

2 Design Considerations for In-Circuit Programming ................................................................ 202.1 Signal Connections for In-System Programming and Debugging ................................................... 212.2 External Power ............................................................................................................. 252.3 Bootloader (BSL) ........................................................................................................... 25

A Frequently Asked Questions and Known Issues .................................................................... 26A.1 Hardware FAQs ............................................................................................................ 27A.2 Known Issues ............................................................................................................... 29

B Hardware........................................................................................................................... 30B.1 MSP-TS430D8.............................................................................................................. 32B.2 MSP-TS430PW14.......................................................................................................... 35B.3 MSP-TS430L092 ........................................................................................................... 38B.4 MSP-TS430L092 Active Cable ........................................................................................... 41B.5 MSP-TS430PW20.......................................................................................................... 44B.6 MSP-TS430PW24.......................................................................................................... 47B.7 MSP-TS430RGE24A ...................................................................................................... 50B.8 MSP-TS430DW28.......................................................................................................... 53B.9 MSP-TS430PW28.......................................................................................................... 56B.10 MSP-TS430PW28A ........................................................................................................ 59B.11 MSP-TS430RHB32A....................................................................................................... 62B.12 MSP-TS430DA38 .......................................................................................................... 65B.13 MSP-TS430QFN23x0...................................................................................................... 68B.14 MSP-TS430RSB40......................................................................................................... 71B.15 MSP-TS430RHA40A....................................................................................................... 74

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B.16 MSP-TS430DL48........................................................................................................... 77B.17 MSP-TS430RGZ48B....................................................................................................... 80B.18 MSP-TS430RGZ48C ...................................................................................................... 83B.19 MSP-TS430PM64 .......................................................................................................... 86B.20 MSP-TS430PM64A ........................................................................................................ 89B.21 MSP-TS430PM64D ........................................................................................................ 92B.22 MSP-TS430PM64F ........................................................................................................ 95B.23 MSP-TS430RGC64B ...................................................................................................... 98B.24 MSP-TS430RGC64C..................................................................................................... 101B.25 MSP-TS430RGC64USB ................................................................................................. 105B.26 MSP-TS430PN80 ......................................................................................................... 109B.27 MSP-TS430PN80A ....................................................................................................... 112B.28 MSP-TS430PN80USB ................................................................................................... 115B.29 MSP-TS430PZ100........................................................................................................ 119B.30 MSP-TS430PZ100A ...................................................................................................... 122B.31 MSP-TS430PZ100B ...................................................................................................... 125B.32 MSP-TS430PZ100C...................................................................................................... 128B.33 MSP-TS430PZ100D...................................................................................................... 131B.34 MSP-TS430PZ5x100..................................................................................................... 134B.35 MSP-TS430PZ100USB .................................................................................................. 137B.36 MSP-TS430PZ100AUSB ................................................................................................ 141B.37 MSP-TS430PEU128...................................................................................................... 145B.38 EM430F5137RF900 ...................................................................................................... 148B.39 EM430F6137RF900 ...................................................................................................... 152B.40 EM430F6147RF900 ...................................................................................................... 156B.41 MSP-FET .................................................................................................................. 160

B.41.1 Features ......................................................................................................... 160B.41.2 Release Notes .................................................................................................. 160B.41.3 Schematics ...................................................................................................... 163B.41.4 Layout............................................................................................................ 168B.41.5 LED Signals ..................................................................................................... 168B.41.6 JTAG Target Connector ....................................................................................... 169B.41.7 Specifications ................................................................................................... 171B.41.8 MSP-FET Revision History.................................................................................... 171

B.42 MSP-FET430UIF.......................................................................................................... 172B.42.1 MSP-FET430UIF Revision History ........................................................................... 177

B.43 MSP-FET430PIF.......................................................................................................... 178

C Hardware Installation Guide ............................................................................................... 180C.1 Hardware Installation ..................................................................................................... 181

Revision History ........................................................................................................................ 186

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List of Figures2-1. Signal Connections for 4-Wire JTAG Communication................................................................. 222-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx,

MSP430G2xx, and MSP430F4xx Devices.............................................................................. 232-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by All MSP430 SBW-Capable

Devices That are Not Part of F2xx, G2xx, F4xx Families............................................................. 24B-1. MSP-TS430D8 Target Socket Module, Schematic .................................................................... 32B-2. MSP-TS430D8 Target Socket Module, PCB ........................................................................... 33B-3. MSP-TS430PW14 Target Socket Module, Schematic ................................................................ 35B-4. MSP-TS430PW14 Target Socket Module, PCB ....................................................................... 36B-5. MSP-TS430L092 Target Socket Module, Schematic.................................................................. 38B-6. MSP-TS430L092 Target Socket Module, PCB......................................................................... 39B-7. MSP-TS430L092 Active Cable Target Socket Module, Schematic.................................................. 41B-8. MSP-TS430L092 Active Cable Target Socket Module, PCB......................................................... 42B-9. MSP-TS430PW20 Target Socket Module, Schematic ................................................................ 44B-10. MSP-TS430PW20 Target Socket Module, PCB ....................................................................... 45B-11. MSP-TS430PW24 Target Socket Module, Schematic ................................................................ 47B-12. MSP-TS430PW24 Target Socket Module, PCB ....................................................................... 48B-13. MSP-TS430RGE24A Target Socket Module, Schematic ............................................................. 50B-14. MSP-TS430RGE24A Target Socket Module, PCB .................................................................... 51B-15. MSP-TS430DW28 Target Socket Module, Schematic ................................................................ 53B-16. MSP-TS430DW28 Target Socket Module, PCB ....................................................................... 54B-17. MSP-TS430PW28 Target Socket Module, Schematic ................................................................ 56B-18. MSP-TS430PW28 Target Socket Module, PCB ....................................................................... 57B-19. MSP-TS430PW28A Target Socket Module, Schematic .............................................................. 59B-20. MSP-TS430PW28A Target Socket Module, PCB (Red) .............................................................. 60B-21. MSP-TS430RHB32A Target Socket Module, Schematic ............................................................. 62B-22. MSP-TS430RHB32A Target Socket Module, PCB .................................................................... 63B-23. MSP-TS430DA38 Target Socket Module, Schematic ................................................................. 65B-24. MSP-TS430DA38 Target Socket Module, PCB ........................................................................ 66B-25. MSP-TS430QFN23x0 Target Socket Module, Schematic ............................................................ 68B-26. MSP-TS430QFN23x0 Target Socket Module, PCB ................................................................... 69B-27. MSP-TS430RSB40 Target Socket Module, Schematic ............................................................... 71B-28. MSP-TS430RSB40 Target Socket Module, PCB ...................................................................... 72B-29. MSP-TS430RHA40A Target Socket Module, Schematic ............................................................. 74B-30. MSP-TS430RHA40A Target Socket Module, PCB .................................................................... 75B-31. MSP-TS430DL48 Target Socket Module, Schematic ................................................................. 77B-32. MSP-TS430DL48 Target Socket Module, PCB ........................................................................ 78B-33. MSP-TS430RGZ48B Target Socket Module, Schematic ............................................................. 80B-34. MSP-TS430RGZ48B Target Socket Module, PCB .................................................................... 81B-35. MSP-TS430RGZ48C Target Socket Module, Schematic ............................................................. 83B-36. MSP-TS430RGZ48C Target Socket Module, PCB .................................................................... 84B-37. MSP-TS430PM64 Target Socket Module, Schematic................................................................. 86B-38. MSP-TS430PM64 Target Socket Module, PCB........................................................................ 87B-39. MSP-TS430PM64A Target Socket Module, Schematic............................................................... 89B-40. MSP-TS430PM64A Target Socket Module, PCB ...................................................................... 90B-41. MSP-TS430PM64D Target Socket Module, Schematic............................................................... 92B-42. MSP-TS430PM64D Target Socket Module, PCB...................................................................... 93B-43. MSP-TS430PM64F Target Socket Module, Schematic ............................................................... 95

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B-44. MSP-TS430PM64F Target Socket Module, PCB ...................................................................... 96B-45. MSP-TS430RGC64B Target Socket Module, Schematic............................................................. 98B-46. MSP-TS430RGC64B Target Socket Module, PCB .................................................................... 99B-47. MSP-TS430RGC64C Target Socket Module, Schematic ........................................................... 102B-48. MSP-TS430RGC64C Target Socket Module, PCB .................................................................. 103B-49. MSP-TS430RGC64USB Target Socket Module, Schematic........................................................ 105B-50. MSP-TS430RGC64USB Target Socket Module, PCB............................................................... 106B-51. MSP-TS430PN80 Target Socket Module, Schematic ............................................................... 109B-52. MSP-TS430PN80 Target Socket Module, PCB ...................................................................... 110B-53. MSP-TS430PN80A Target Socket Module, Schematic.............................................................. 112B-54. MSP-TS430PN80A Target Socket Module, PCB..................................................................... 113B-55. MSP-TS430PN80USB Target Socket Module, Schematic.......................................................... 115B-56. MSP-TS430PN80USB Target Socket Module, PCB ................................................................. 116B-57. MSP-TS430PZ100 Target Socket Module, Schematic .............................................................. 119B-58. MSP-TS430PZ100 Target Socket Module, PCB ..................................................................... 120B-59. MSP-TS430PZ100A Target Socket Module, Schematic ............................................................ 122B-60. MSP-TS430PZ100A Target Socket Module, PCB ................................................................... 123B-61. MSP-TS430PZ100B Target Socket Module, Schematic ............................................................ 125B-62. MSP-TS430PZ100B Target Socket Module, PCB ................................................................... 126B-63. MSP-TS430PZ100C Target Socket Module, Schematic ............................................................ 128B-64. MSP-TS430PZ100C Target Socket Module, PCB ................................................................... 129B-65. MSP-TS430PZ100D Target Socket Module, Schematic ............................................................ 131B-66. MSP-TS430PZ100D Target Socket Module, PCB ................................................................... 132B-67. MSP-TS430PZ5x100 Target Socket Module, Schematic ........................................................... 134B-68. MSP-TS430PZ5x100 Target Socket Module, PCB .................................................................. 135B-69. MSP-TS430PZ100USB Target Socket Module, Schematic......................................................... 137B-70. MSP-TS430PZ100USB Target Socket Module, PCB................................................................ 138B-71. MSP-TS430PZ100AUSB Target Socket Module, Schematic....................................................... 141B-72. MSP-TS430PZ100AUSB Target Socket Module, PCB .............................................................. 142B-73. MSP-TS430PEU128 Target Socket Module, Schematic ............................................................ 145B-74. MSP-TS430PEU128 Target Socket Module, PCB ................................................................... 146B-75. EM430F5137RF900 Target Board, Schematic ....................................................................... 148B-76. EM430F5137RF900 Target board, PCB............................................................................... 149B-77. EM430F6137RF900 Target Board, Schematic ....................................................................... 152B-78. EM430F6137RF900 Target Board, PCB .............................................................................. 153B-79. EM430F6147RF900 Target Board, Schematic ....................................................................... 156B-80. EM430F6147RF900 Target Board, PCB .............................................................................. 157B-81. MSP-FET Top View ...................................................................................................... 161B-82. MSP-FET Bottom View .................................................................................................. 161B-83. MSP-FET USB Debugger, Schematic (1 of 5)........................................................................ 163B-84. MSP-FET USB Debugger, Schematic (2 of 5)........................................................................ 164B-85. MSP-FET USB Debugger, Schematic (3 of 5)........................................................................ 165B-86. MSP-FET USB Debugger, Schematic (4 of 5)........................................................................ 166B-87. MSP-FET USB Debugger, Schematic (5 of 5)........................................................................ 167B-88. MSP-FET USB Debugger, PCB (Top) ................................................................................. 168B-89. MSP-FET USB Debugger, PCB (Bottom) ............................................................................. 168B-90. JTAG Connector Pinout.................................................................................................. 169B-91. Pin States After Power-Up............................................................................................... 170B-92. MSP-FET430UIF USB Interface, Schematic (1 of 4) ................................................................ 172

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B-93. MSP-FET430UIF USB Interface, Schematic (2 of 4) ................................................................ 173B-94. MSP-FET430UIF USB Interface, Schematic (3 of 4) ................................................................ 174B-95. MSP-FET430UIF USB Interface, Schematic (4 of 4) ................................................................ 175B-96. MSP-FET430UIF USB Interface, PCB ................................................................................. 176B-97. MSP-FET430PIF FET Interface Module, Schematic................................................................. 178B-98. MSP-FET430PIF FET Interface Module, PCB........................................................................ 179C-1. Windows XP Hardware Wizard ......................................................................................... 181C-2. Windows XP Driver Location Selection Folder........................................................................ 182C-3. Device Manager Using USB Debug Interface using VID/PID 0x2047/0x0010 ................................... 183C-4. Device Manager Using USB Debug Interface with VID/PID 0x0451/0xF430 ..................................... 184C-5. Device Manager Using USB Debug Interface With VID/PID 0x0451/0xF432 .................................... 185

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List of Tables1-1. Individual Kit Contents, MSP-TS430xx .................................................................................. 13B-1. MSP-TS430D8 Bill of Materials .......................................................................................... 34B-2. MSP-TS430PW14 Bill of Materials....................................................................................... 37B-3. MSP-TS430L092 Bill of Materials ........................................................................................ 40B-4. MSP-TS430L092 JP1 Settings ........................................................................................... 42B-5. MSP-TS430L092 Active Cable Bill of Materials ........................................................................ 43B-6. MSP-TS430PW20 Bill of Materials....................................................................................... 46B-7. MSP-TS430PW24 Bill of Materials....................................................................................... 49B-8. MSP-TS430RGE24A Bill of Materials (BOM) .......................................................................... 52B-9. MSP-TS430DW28 Bill of Materials ...................................................................................... 55B-10. MSP-TS430PW28 Bill of Materials ...................................................................................... 58B-11. MSP-TS430PW28A Bill of Materials..................................................................................... 61B-12. MSP-TS430RHB32A Bill of Materials ................................................................................... 64B-13. MSP-TS430DA38 Bill of Materials ....................................................................................... 67B-14. MSP-TS430QFN23x0 Bill of Materials .................................................................................. 70B-15. MSP-TS430RSB40 Bill of Materials ..................................................................................... 73B-16. MSP-TS430RHA40A Bill of Materials ................................................................................... 76B-17. MSP-TS430DL48 Bill of Materials ....................................................................................... 79B-18. MSP-TS430RGZ48B Bill of Materials ................................................................................... 82B-19. MSP-TS430RGZ48C Bill of Materials ................................................................................... 85B-20. MSP-TS430PM64 Bill of Materials....................................................................................... 88B-21. MSP-TS430PM64A Bill of Materials ..................................................................................... 91B-22. MSP-TS430PM64D Bill of Materials ..................................................................................... 94B-23. MSP-TS430PM64F Bill of Materials (BOM) ............................................................................ 97B-24. MSP-TS430RGC64B Bill of Materials.................................................................................. 100B-25. MSP-TS430RGC64C Bill of Materials ................................................................................. 104B-26. MSP-TS430RGC64USB Bill of Materials .............................................................................. 107B-27. MSP-TS430PN80 Bill of Materials...................................................................................... 111B-28. MSP-TS430PN80A Bill of Materials.................................................................................... 114B-29. MSP-TS430PN80USB Bill of Materials ................................................................................ 117B-30. MSP-TS430PZ100 Bill of Materials .................................................................................... 121B-31. MSP-TS430PZ100A Bill of Materials................................................................................... 124B-32. MSP-TS430PZ100B Bill of Materials................................................................................... 127B-33. MSP-TS430PZ100C Bill of Materials .................................................................................. 130B-34. MSP-TS430PZ100D Bill of Materials .................................................................................. 133B-35. MSP-TS430PZ5x100 Bill of Materials.................................................................................. 136B-36. MSP-TS430PZ100USB Bill of Materials ............................................................................... 139B-37. MSP-TS430PZ100AUSB Bill of Materials ............................................................................. 143B-38. MSP-TS430PEU128 Bill of Materials .................................................................................. 147B-39. EM430F5137RF900 Bill of Materials................................................................................... 150B-40. EM430F6137RF900 Bill of Materials................................................................................... 154B-41. EM430F6147RF900 Bill of Materials................................................................................... 158B-42. UART Backchannel Implementation ................................................................................... 160B-43. UART Backchannel Activation Commands............................................................................ 161B-44. MSP Target BSL Activation Commands............................................................................... 162B-45. MSP-FET LED Signals................................................................................................... 168B-46. JTAG Connector Pin State by Operating Mode ...................................................................... 169

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B-47. Specifications.............................................................................................................. 171B-48. MSP-FET Revision History .............................................................................................. 171C-1. USB VIDs and PIDs Used in MSP430 Tools.......................................................................... 181

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PrefaceSLAU278W–May 2009–Revised October 2015

Read This First

About This ManualThis manual describes the hardware of the TI MSP-FET430 Flash Emulation Tool (FET). The FET is theprogram development tool for the MSP430™ ultra-low-power microcontroller. Both available interfacetypes, the parallel port interface and the USB interface, are described.

How to Use This ManualRead and follow the instructions in Chapter 1. This section lists the contents of the FET, providesinstructions on installing the hardware and according software drivers. After you see how quick and easy itis to use the development tools, TI recommends that you read all of this manual.

This manual describes the setup and operation of the FET but does not fully describe the MSP430™microcontrollers or the development software systems. For details of these items, see the appropriate TIdocuments listed in Section 1.19.

This manual applies to the following tools (and devices):• MSP-FET430PIF (debug interface with parallel port connection, for all MSP430 flash-based devices)• MSP-FET430UIF (debug interface with USB connection, for all MSP430 flash-based devices)• MSP-FET (successor to MSP-FET430UIF, debug interface with USB connection, for all MSP430

devices)• eZ430-F2013 (USB stick form factor interface with attached MSP430F2013 target, for all

MSP430F20xx, MSP430G2x01, MSP430G2x11, MSP430G2x21, and MSP430G2x31 devices)• eZ430-T2012 (three MSP430F2012 based target boards)• eZ430-RF2500 (USB stick form factor interface with attached MSP430F2274 and CC2500 target, for

all MSP430F20xx, MSP430F21x2, MSP430F22xx, MSP430G2x01, MSP430G2x11, MSP430G2x21,and MSP430G2x31 devices)

• eZ430-RF2500T (one MSP430F2274 and CC2500 target board including battery pack)• eZ430-RF2500-SEH (USB stick form factor interface with attached MSP430F2274 and CC2500 target

and solar energy harvesting module)• eZ430-Chronos-xxx (USB stick form factor interface with CC430F6137 based development system

contained in a watch. Includes <1 GHz RF USB access point)

Stand-alone target-socket modules (without debug interface) named as MSP-TS430TSxx.

Tools named as MSP-FET430Uxx contain the USB debug interface (MSP-FET430UIF) and the respectivetarget socket module MSP-TS430TSxx, where 'xx' is the same for both names. The following tools containalso the USB debug interface (MSP-FET430UIF):

• FET430F5137RF900 (for CC430F513x devices in 48-pin RGZ packages) (green PCB)• FET430F6137RF900 (for CC430F612x and CC430F613x devices in 64-pin RGC packages) (green

PCB)

These tools contain the most up-to-date materials available at the time of packaging. For the latestmaterials (data sheets, user's guides, software, application information, and so on), visit the TI MSP430website at www.ti.com/msp430 or contact your local TI sales office.

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Information About Cautions and Warnings www.ti.com

Information About Cautions and WarningsThis document may contain cautions and warnings.

CAUTIONThis is an example of a caution statement.

A caution statement describes a situation that could potentially damage yoursoftware or equipment.

WARNINGThis is an example of a warning statement.A warning statement describes a situation that could potentiallycause harm to you.

The information in a caution or a warning is provided for your protection. Read each caution and warningcarefully.

Related Documentation From Texas InstrumentsMSP430 development tools documentation:MSP Debuggers User's Guide (SLAU647)

Code Composer Studio for MSP430 User's Guide (SLAU157)

Code Composer Studio v5.x Core Edition (CCS Mediawiki)

IAR Embedded Workbench for MSP430(tm) User's Guide (SLAU138)

IAR Embedded Workbench KickStart installer (SLAC050)

eZ430-F2013 Development Tool User's Guide (SLAU176)

eZ430-RF2480 Demonstration Kit User's Guide (SWRU151)

eZ430-RF2500 Development Tool User's Guide (SLAU227)

eZ430-RF2500-SEH Development Tool User's Guide (SLAU273)

eZ430-Chronos Development Tool User's Guide (SLAU292)

Spectrum Analyzer (MSP-SA430-SUB1GHZ) User's Guide (SLAU371)

MSP-EXP430F5529 Experimenter Board User's Guide (SLAU330)

MSP-EXP430F5438 Experimenter Board User's Guide (SLAU263)

MSP-EXP430G2 LaunchPad Experimenter Board User's Guide (SLAU318)

MSP Gang Programmer (MSP-GANG) User's Guide (SLAU358)

MSP430 Gang Programmer (MSP-GANG430) User's Guide (SLAU101)

MSP430 device user's guides:MSP430x1xx Family User's Guide (SLAU049)

MSP430x2xx Family User's Guide (SLAU144)



MSP430x5xx and MSP430x6xx Family User's Guide (SLAU208)

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www.ti.com If You Need Assistance

CC430 Family User's Guide (SLAU259)

MSP430FR57xx Family User's Guide (SLAU272)

MSP430FR58xx and MSP430FR59xx Family User's Guide (SLAU367)

If You Need AssistanceSupport for the MSP430 devices and the FET development tools is provided by the Texas InstrumentsProduct Information Center (PIC). Contact information for the PIC can be found on the TI website atwww.ti.com/support. The Texas Instruments E2E™ Community support forums for the MSP430 provideopen interaction with peer engineers, TI engineers, and other experts. Additional device-specificinformation can be found on the MSP430 website.

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http://e2e.ti.com/

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Chapter 1SLAU278W–May 2009–Revised October 2015

Get Started Now!

This chapter lists the contents of the FET and provides instruction on installing the hardware.

Topic ........................................................................................................................... Page

1.1 Kit Contents, MSP-TS430xx ................................................................................. 131.2 Kit Contents, MSP-FET430xx .............................................................................. 151.3 Kit Contents, MSP-FET ....................................................................................... 151.4 Kit Contents, MSP-FET430UIF.............................................................................. 151.5 Kit Contents, MSP-FET430PIF .............................................................................. 151.6 Kit Contents, eZ430-F2013................................................................................... 151.7 Kit Contents, eZ430-T2012................................................................................... 151.8 Kit Contents, eZ430-RF2500 ................................................................................ 161.9 Kit Contents, eZ430-RF2500T............................................................................... 161.10 Kit Contents, eZ430-RF2500-SEH ......................................................................... 161.11 Kit Contents, eZ430-Chronos-xxx ......................................................................... 161.12 Kit Contents, FET430F6137RF900 ........................................................................ 171.13 Kit Contents, EM430Fx1x7RF900.......................................................................... 171.14 Hardware Installation, MSP-FET ........................................................................... 181.15 Hardware Installation, MSP-FET430UIF ................................................................. 181.16 Hardware Installation, MSP-FET430PIF ................................................................. 191.17 Hardware Installation, MSP-TS430xxx, MSP-FET430Uxx, FET430F6137RF900,

EM430Fx1x7RF900 ............................................................................................. 191.18 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739,

MSPEXP430F5529 .............................................................................................. 191.19 Important MSP430 Documents on the Web............................................................ 19

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www.ti.com Kit Contents, MSP-TS430xx

1.1 Kit Contents, MSP-TS430xx• One READ ME FIRST document• One 32.768-kHz crystal from Micro Crystal (except MSP-TS430PW24)• One target socket module• A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092)• MSP430 device samples (see Table 1-1 for sample type)

Table 1-1. Individual Kit Contents, MSP-TS430xxPart Number Socket Type Supported Devices Included Devices Headers and Comment

MSP-TS430D8 8-pin D 1 x MSP430G2210ID and Two PCB 1×4-pin headers (twoMSP430G2210, MSP430G2230(green PCB) (TSSOP ZIF) 1 x MSP430G2230ID male and two female)

MSP430F20xx, MSP430G2x01,MSP-TS430PW14 14-pin PW Four PCB 1×7-pin headers (twoMSP430G2x11, MSP430G2x21, 2 x MSP430F2013IPW(green PCB) (TSSOP ZIF) male and two female)MSP430G2x31

Four PCB 1×7-pin headers (twomale and two female). A "Micro-MaTch" 10-pin female connector is

MSP-TS430L092 14-pin PW also present on the PCB whichMSP-TS430L092 2 x MSP430L092IPW(green PCB) (TSSOP ZIF) connects the kit with an 'ActiveCable' PCB; this 'Active Cable'PCB is connected by 14-pin JTAGcable with the FET430UIF

MSP-TS430PW20 20-pin PW MSP430FR2311IPW20, None. Free samples can Four PCB 1×12-pin headers (two(green PCB) (TSSOP ZIF) MSP430FR2311IPW16 be ordered in the TI Store. male and two female)

MSP-TS430PW24 24-pin PW Four PCB 1×12-pin headers (twoMSP430AFE2xx 2 x MSP430AFE253IPW(green PCB) (TSSOP ZIF) male and two female)

MSP-TS430RGE24A 24-pin RGE None. Free samples can Four PCB 1×6-pin headers (twoMSP430FR2433IRGE(red PCB) (QFN ZIF) be ordered in the TI Store. male and two female)

MSP430F11x1, MSP430F11x2,MSP430F12x, MSP430F12x2,MSP-TS430DW28 28-pin DW Four PCB 1×12-pin headers (twoMSP430F21xx 2 x MSP430F123IDW(green PCB) (SSOP ZIF) male and two female)Supports devices in 20- and 28-pin

DA packages

MSP430F11x1, MSP430F11x2,MSP-TS430PW28 28-pin PW Four PCB 1×12-pin headers (twoMSP430F12x, MSP430F12x2, 2 x MSP430F2132IPW(green PCB) (TSSOP ZIF) male and two female)MSP430F21xx

MSP430F20xx, MSP430G2xxx inMSP-TS430PW28A 28-pin PW Four PCB 1×12-pin headers (two14-, 20-, and 28-pin PW packages, 2 x MSP430G2452IPW20(red PCB) (TSSOP ZIF) male and two female)MSP430TCH5E in PW package

MSP-TS430RHB32A 32-pin RHB Eight PCB 1×8-pin headers (fourMSP430i204x 2 x MSP430i2041TRHB(red PCB) (QFN ZIF) male and four female)

2 x MSP430F2274IDAMSP-TS430DA38 38-pin DA MSP430F22xx, MSP430G2x44, Four PCB 1×19-pin headers (two2 x MSP430G2744IDA(green PCB) (TSSOP ZIF) MSP430G2x55 male and two female)2 x MSP430G2955IDA

MSP-TS430QFN23x0 40-pin RHA Eight PCB 1×10-pin headers (fourMSP430F23x0 2 x MSP430F2370IRHA(green PCB) (QFN ZIF) male and four female)

MSP-TS430RSB40 40-pin RSB Eight PCB 1×10-pin headers (fourMSP430F51x1, MSP430F51x2 2 x MSP430F5172IRSB(green PCB) (QFN ZIF) male and four female)

MSP-TS430RHA40A 40-pin RHA Eight PCB 1×10-pin headers (fourMSP430FR572x, MSP430FR573x 2 x MSP430FR5739IRHA(red PCB) (QFN ZIF) male and four female)

MSP-TS430DL48 48-pin DL Four PCB 2×12-pin headers (twoMSP430F42x0 2 x MSP430F4270IDL(green PCB) (TSSOP ZIF) male and two female)

MSP-TS430RGZ48B 48-pin RGZ Eight PCB 1×12-pin headers (fourMSP430F534x 2 x MSP430F5342IRGZ(blue PCB) (QFN ZIF) male and four female)

MSP-TS430RGZ48C 48-pin RGZ MSP430FR58xx and Eight PCB 1×12-pin headers (four2 x MSP430FR5969IRGZ(black PCB) (QFN ZIF) MSP430FR59xx male and four female)

MSP430F13x, MSP430F14x,MSP430F14x1, MSP430F15x,MSP430F16x, MSP430F16x1, TS Kit:MSP430F23x, MSP430F24x, 2 x MSP430F2618IPM;MSP-TS430PM64 64-pin PM Eight PCB 1×16-pin headers (fourMSP430F24xx, MSP430F261x, FET Kit:(green PCB) (QFP ZIF) male and four female)MSP430F41x, MSP430F42x, 2 x MSP430F417IPM and

MSP430F42xA, MSP430FE42x, 2 x MSP430F169IPMMSP430FE42xA, MSP430FE42x2,

MSP430FW42x

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Kit Contents, MSP-TS430xx www.ti.com

Table 1-1. Individual Kit Contents, MSP-TS430xx (continued)Part Number Socket Type Supported Devices Included Devices Headers and Comment

MSP-TS430PM64A 64-pin PM Eight PCB 1×16-pin headers (fourMSP430F41x2 2 x MSP430F4152IPM(red PCB) (QFP ZIF) male and four female)

MSP-TS430PM64D 64-pin PM Eight PCB 1×16-pin headers (fourMSP430FR413x, MSP430FR203x 2 x MSP430FR4133IPM(white PCB) (QFP ZIF) male and four female)

MSP-TS430PM64F 64-pin PM None. Free samples can Eight PCB 1×16-pin headers (fourMSP430FR6972(purple PCB) (QFP ZIF) be ordered in the TI Store. male and four female)

MSP-TS430RGC64B 64-pin RGC Eight PCB 1×16-pin headers (fourMSP430F530x 2 x MSP430F5310IRGC(blue PCB) (QFN ZIF) male and four female)

MSP430F522x, MSP430F521x,MSP-TS430RGC64C 64-pin RGC Eight PCB 1×16-pin headers (fourMSP430F523x, MSP430F524x, 2 x MSP430F5229IRGC(black PCB) (QFN ZIF) male and four female)MSP430F525x

2 x MSP430F5510IRGCMSP-TS430RGC64USB 64-pin RGC MSP430F550x, MSP430F551x, Eight PCB 1×16-pin headers (fouror(green PCB) (QFN ZIF) MSP430F552x male and four female)2 x MSP430F5528IRGC

MSP430F241x, MSP430F261x,MSP-TS430PN80 80-pin PN MSP430F43x, MSP430F43x1, Eight PCB 1×20-pin headers (four2 x MSP430FG439IPN(green PCB) (QFP ZIF) MSP430FG43x, MSP430F47x, male and four female)

MSP430FG47x

MSP-TS430PN80A 80-pin PN Eight PCB 1×20-pin headers (fourMSP430F532x 2 x MSP430F5329IPN(red PCB) (QFP ZIF) male and four female)

MSP-TS430PN80USB 80-pin PN Eight PCB 1×20-pin headers (fourMSP430F552x, MSP430F551x 2 x MSP430F5529IPN(green PCB) (QFP ZIF) male and four female)

MSP430F43x, MSP430F43x1,MSP-TS430PZ100 100-pin PZ Eight PCB 1×25-pin headers (fourMSP430F44x, MSP430FG461x, 2 x MSP430FG4619IPZ(green PCB) (QFP ZIF) male and four female)MSP430F47xx

MSP-TS430PZ100A 100-pin PZ Eight PCB 1×25-pin headers (fourMSP430F471xx 2 x MSP430F47197IPZ(red PCB) (QFP ZIF) male and four female)

MSP-TS430PZ100B 100-pin PZ Eight PCB 1×25-pin headers (fourMSP430F67xx 2 x MSP430F6733IPZ(blue PCB) (QFP ZIF) male and four female)

MSP-TS430PZ100C 100-pin PZ MSP430F645x, MSP430F643x, Eight PCB 1×25-pin headers (four2 x MSP430F6438IPZ(black PCB) (QFP ZIF) MSP430F535x, MSP430F533x male and four female)

MSP-TS430PZ100D 100-pin PZ MSP430FR698x(1), Eight PCB 1×25-pin headers (four2 x MSP430FR6989IPZ(white PCB) (QFP ZIF) MSP430FR688x(1) male and four female)

MSP-TS430PZ5x100 100-pin PZ MSP430F543x, MSP430BT5190, Eight PCB 1×25-pin headers (four2 x MSP430F5438IPZ(green PCB) (QFP ZIF) MSP430SL5438A male and four female)

MSP-TS430PZ100USB 100-pin PZ MSP430F665x, MSP430F663x, Eight PCB 1×25-pin headers (four2 x MSP430F6638IPZ(green PCB) (QFP ZIF) MSP430F563x male and four female)

MSP-TS430PZ100AUSB 100-pin PZ None. Free samples can Eight PCB 1×25-pin headers (fourMSP430FG662x, MSP430FG642x(blue PCB) (QFP ZIF) be ordered in the TI Store. male and four female)

Four PCB 1x26-pin headers (twoMSP430F677x, MSP430F676x,MSP-TS430PEU128 128-pin PEU male and two female) and fourMSP430F674x, MSP430F677x1, 2 x MSP430F67791IPEU(green PCB) (QFP ZIF) PCB 1x38-pin headers (two maleMSP430F676x1, MSP430F674x1 and two female)

See the device data sheets for device specifications. Device errata can be found in the respective deviceproduct folder on the web provided as a PDF document. Depending on the device, errata may also befound in the device bug database at www.ti.com/sc/cgi-bin/buglist.cgi.



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www.ti.com Kit Contents, MSP-FET430xx

1.2 Kit Contents, MSP-FET430xx• One READ ME FIRST document• One MSP-FET430UIF USB interface module. This is the unit that has a USB B-connector on one end

of the case, and a 2×7-pin male connector on the other end of the case.• One USB cable• One 32.768-kHz crystal from Micro Crystal, if the board has an option to use the quartz.• A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092)• One 14-Pin JTAG conductor cable• One small box containing two MSP430 device samples (See table for Sample Type)• One target socket module. To determine the devices used for each board and a summary of the board,

see Table 1-1. The name of MSP-TS430xx board can be derived from the name of the MSP-FET430xxkit; for example, the MSP-FET430U28A kit contains the MSP-TS430PW28A board.

Refer to the device data sheets for device specifications. Device errata can be found in the respectivedevice product folder on the web provided as a PDF document. Depending on the device, errata may alsobe found in the device bug database at www.ti.com/sc/cgi-bin/buglist.cgi.

1.3 Kit Contents, MSP-FET• One READ ME FIRST document• One MSP-FET interface module• One USB cable• One 14-conductor cable

1.4 Kit Contents, MSP-FET430UIF• One READ ME FIRST document• One MSP-FET430UIF interface module• One USB cable• One 14-conductor cable

1.5 Kit Contents, MSP-FET430PIF• One READ ME FIRST document• One MSP-FET430PIF interface module• One 25-conductor cable• One 14-conductor cable

NOTE: This part is obsolete and is not recommended to use in new design.

1.6 Kit Contents, eZ430-F2013• One QUICK START GUIDE document• One eZ430-F2013 development tool including one MSP430F2013 target board

1.7 Kit Contents, eZ430-T2012• Three MSP430F2012-based target boards



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Kit Contents, eZ430-RF2500 www.ti.com

1.8 Kit Contents, eZ430-RF2500• One QUICK START GUIDE document• One eZ430-RF2500 CD-ROM• One eZ430-RF2500 development tool including one MSP430F2274 and CC2500 target board• One eZ430-RF2500T target board• One AAA battery pack with expansion board (batteries included)

1.9 Kit Contents, eZ430-RF2500T• One eZ430-RF2500T target board• One AAA battery pack with expansion board (batteries included)

1.10 Kit Contents, eZ430-RF2500-SEH• One MSP430 development tool CD containing documentation and development software• One eZ430-RF USB debugging interface• Two eZ430-RF2500T wireless target boards• One SEH-01 solar energy harvester board• One AAA battery pack with expansion board (batteries included)

1.11 Kit Contents, eZ430-Chronos-xxx'433, '868, '915• One QUICK START GUIDE document• One ez430-Chronos emulator• One screwdriver• Two spare screws

eZ430-Chronos-433:– One 433-MHz eZ430-Chronos watch (battery included)– One 433-MHz eZ430-Chronos access pointeZ430-Chronos-868:– One 868-MHz eZ430-Chronos watch (battery included)– One 868-MHz eZ430-Chronos access pointeZ430-Chronos-915:– One 915-MHz eZ430-Chronos watch (battery included)– One 915-MHz eZ430-Chronos access point



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www.ti.com Kit Contents, FET430F6137RF900

1.12 Kit Contents, FET430F6137RF900• One READ ME FIRST document• One legal notice• One MSP-FET430UIF interface module• Two EM430F6137RF900 target socket modules. This is the PCB on which is soldered a CC430F6137

device in a 64-pin RGC package. A 2×7-pin male connector is also present on the PCB.• Two CC430EM battery packs• Four AAA batteries• Two 868-MHz or 915-MHz antennas• Two 32.768-kHz crystals• 18 PCB 2x4-pin headers• One USB cable• One 14-pin JTAG conductor cable

1.13 Kit Contents, EM430Fx1x7RF900• One READ ME FIRST document• One legal notice• Two target socket module

MSP-EM430F5137RF900: Two EM430F5137RF900 target socket modules. This is the PCB on whichis soldered a CC430F5137 device in a 48-pin RGZ package. A 2×7-pin male connector is also presenton the PCBMSP-EM430F6137RF900: Two EM430F6137RF900 target socket modules. This is the PCB on whichis soldered a CC430F6137 device in a 64-pin RGC package. A 2×7-pin male connector is also presenton the PCBMSP-EM430F6147RF900: Two EM430F6147RF900 target socket modules. This is the PCB on whichis soldered a CC430F6147 device in a 64-pin RGC package. A 2×7-pin male connector is also presenton the PCB

• Two CC430EM battery packs• Four AAA batteries• Two 868- or 915-MHz antennas• Two 32.768-kHz crystals• 18 PCB 2×4-pin headers



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Hardware Installation, MSP-FET www.ti.com

1.14 Hardware Installation, MSP-FETFollow these steps to install the hardware for the MSP-FET tool:1. Install the IDE (CCS or IAR) that you plan to use before connecting MSP-FET to PC. During IDE

installation, USB drivers are installed automatically. Make sure to use the latest IDE version, otherwisethe USB drivers might not be able to recognize the MSP-FET.

2. Connect the MSP-FET to a USB port on the PC with the provided USB cable.3. The following procedure applies to operation under Windows:

(a) After connecting to the PC, the MSP-FET should be recognized automatically, as the USB devicedriver has been already installed together with the IDE.

(b) If the driver has not been installed yet, the Found New Hardware wizard starts. Follow theinstructions and point the wizard to the driver files.

(c) The default location for CCS is c:\ti\ccsv6\ccs_base\emulation\drivers\msp430\USB_CDC.(d) The default location for IAR Embedded Workbench is <Installation Root>\Embedded Workbench

x.x\430\drivers\<Win_OS>.4. After connecting to a PC, the MSP-FET performs a self-test. If the self-test passes successfully, the

green LED stays on. For a complete list of LED signals, please refer to the MSP-FET chapter in thisdocument.

5. Connect the MSP-FET to a target board, such as an MSP-TS430xxx target socket module, with the14-conductor cable.

6. Make sure that the MSP430 device is securely seated in the socket and that its pin 1 (indicated with acircular indentation on the top surface) aligns with the "1" mark on the PCB.

1.15 Hardware Installation, MSP-FET430UIFFollow these steps to install the hardware for the MSP-FET430UIF tool:1. Install the IDE (CCS or IAR) you plan to use before connecting USB-FET interface to PC. The IDE

installation installs drivers automatically.2. Use the USB cable to connect the USB-FET interface module to a USB port on the PC. The USB FET

should be recognized, as the USB device driver is installed automatically. If the driver has not beeninstalled yet, the install wizard starts. Follow the prompts and point the wizard to the driver files.The default location for CCS is c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_CDC orc:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_FET_XP_XX, depending of firmware version ofthe tool.The default location for IAR Embedded Workbench is <InstallationRoot>\Embedded Workbench x.x\430\drivers\TIUSBFET\eZ430-UART or <InstallationRoot>\Embedded Workbench x.x\430\drivers\<Win_OS>, depending of firmware version of the tool.The USB driver is installed automatically. Detailed driver installation instructions can be found inAppendix C.

3. After connecting to a PC, the USB FET performs a self-test during which the red LED may flash forapproximately two seconds. If the self-test passes successfully, the green LED stays on.

4. Use the 14-conductor cable to connect the USB-FET interface module to a target board, such as anMSP-TS430xxx target socket module.

5. Ensure that the MSP430 device is securely seated in the socket, and that its pin 1 (indicated with acircular indentation on the top surface) aligns with the "1" mark on the PCB.

6. Compared to the parallel-port debug interface, the USB FET has additional features including JTAGsecurity fuse blow and adjustable target VCC (1.8 V to 3.6 V). Supply the module with up to 60 mA.



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www.ti.com Hardware Installation, MSP-FET430PIF

1.16 Hardware Installation, MSP-FET430PIFFollow these steps to install the hardware for the MSP-FET430PIF tools:1. Use the 25-conductor cable to connect the FET interface module to the parallel port of the PC. The

necessary driver for accessing the PC parallel port is installed automatically during CCS or IAREmbedded Workbench installation. Note that a restart is required after the CCS or IAR EmbeddedWorkbench installation for the driver to become active.

2. Use the 14-conductor cable to connect the parallel-port debug interface module to a target board, suchas an MSP-TS430xxx target socket module. Module schematics and PCBs are shown in Appendix B.

1.17 Hardware Installation, MSP-TS430xxx, MSP-FET430Uxx, FET430F6137RF900,EM430Fx1x7RF900Follow these steps to install the hardware for the MSP-FET430Uxx and MSP-TS430xxx tools:1. Follow steps 1 and 2 of Section 1.152. Connect the MSP-FET430PIF or MSP-FET430UIF debug interface to the appropriate port of the PC.

Use the 14-conductor cable to connect the FET interface module to the supplied target socket module.3. Ensure that the MSP430 device is securely seated in the socket and that its pin 1 (indicated with a

circular indentation on the top surface) aligns with the "1" mark on the PCB.4. Ensure that the two jumpers (LED and VCC) near the 2×7-pin male connector are in place. Illustrations

of the target socket modules and their parts are found in Appendix B.

1.18 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739,MSPEXP430F5529To install the eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-EXP430F5529 tools, followsteps 1 and 2 of Section 1.15

1.19 Important MSP430 Documents on the WebThe primary sources of MSP430 information are the device-specific data sheet and user's guide. TheMSP430 website (www.ti.com/msp430) contains the most recent version of these documents.

PDF documents describing the CCS tools (CCS IDE, the assembler, the C compiler, the linker, and thelibrarian) are in the msp430\documentation folder. A Code Composer Studio specific Wiki page (FAQ) isavailable, and the Texas Instruments E2E Community support forums for the MSP430 and CodeComposer Studio v5 provide additional help besides the product help and Welcome page.

PDF documents describing the IAR tools (Workbench C-SPY, the assembler, the C compiler, the linker,and the librarian) are in the common\doc and 430\doc folders. Supplements to the documents (that is, thelatest information) are available in HTML format in the same directories. A IAR specific Wiki Page is alsoavailable.



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Chapter 2SLAU278W–May 2009–Revised October 2015

Design Considerations for In-Circuit Programming

This chapter presents signal requirements for in-circuit programming of the MSP430.

Topic ........................................................................................................................... Page

2.1 Signal Connections for In-System Programming and Debugging ............................. 212.2 External Power................................................................................................... 252.3 Bootloader (BSL)................................................................................................ 25

20 Design Considerations for In-Circuit Programming SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback



www.ti.com Signal Connections for In-System Programming and Debugging

2.1 Signal Connections for In-System Programming and DebuggingMSP-FET430PIF, MSP-FET430UIF, MSP-GANG, MSP-GANG430, MSP-PRGS430With the proper connections, the debugger and an FET hardware JTAG interface (such as the MSP-FET430PIF and MSP-FET430UIF) can be used to program and debug code on the target board. Inaddition, the connections also support the MSP-GANG430 or MSP-PRGS430 production programmers,thus providing an easy way to program prototype boards, if desired.

Figure 2-1 shows the connections between the 14-pin FET interface module connector and the targetdevice required to support in-system programming and debugging for 4-wire JTAG communication.Figure 2-2 shows the connections for 2-wire JTAG mode (Spy-Bi-Wire). The 4-wire JTAG mode issupported on most MSP430 devices, except devices with low pin counts (for example, MSP430G2230).The 2-wire JTAG mode is available on selected devices only. See the Code Composer Studio for MSP430User's Guide (SLAU157) or IAR Embedded Workbench Version 3+ for MSP430 User's Guide (SLAU138)for information on which interface method can be used on which device.

The connections for the FET interface module and the MSP-GANG, MSP-GANG430, or MSP-PRGS430are identical. Both the FET interface module and MSP-GANG430 can supply VCC to the target board(through pin 2). In addition, the FET interface module, MSP-GANG, and MSP-GANG430 have a VCC-sense feature that, if used, requires an alternate connection (pin 4 instead of pin 2). The VCC-sense featuresenses the local VCC present on the target board (that is, a battery or other local power supply) andadjusts the output signals accordingly. If the target board is to be powered by a local VCC, then theconnection to pin 4 on the JTAG should be made, and not the connection to pin 2. This uses the VCC-sense feature and prevents any contention that might occur if the local on-board VCC were connected tothe VCC supplied from the FET interface module, MSP-GANG or the MSP-GANG430. If the VCC-sensefeature is not necessary (that is, if the target board is to be powered from the FET interface module, MSP-GANG, or MSP-GANG430), the VCC connection is made to pin 2 on the JTAG header, and no connectionis made to pin 4. Figure 2-1 and Figure 2-2 show a jumper block that supports both scenarios of supplyingVCC to the target board. If this flexibility is not required, the desired VCC connections may be hard-wired toeliminate the jumper block. Pins 2 and 4 must not be connected at the same time.

The connection to the JTAG connector RST pin of Figure 2-1 is required when programming or debugginga device that supports 2-wire JTAG communication, even when using 4-wire JTAG communication modeon these devices. However, this connection is optional on devices that do not support 2-wire JTAGcommunication. The MSP430 development tools and device programmers perform a target reset byissuing a JTAG command to gain control over the device. However, if this is unsuccessful, the RST signalof the JTAG connector may be used by the development tool or device programmer as an additional wayto assert a device reset.

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TDI/VPP

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TCK

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VCC

R1

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RST/NMI

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TCK

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MSP430Fxxx

C110 nF/2.2 nF

(see Notes B and E)

RST (see Note D)

Important to connect

Signal Connections for In-System Programming and Debugging www.ti.com

A If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used,make connection J2.

B The configuration of R1 and C1 for the RST/NMI pin depends on the device family. See the respective MSP430 familyuser's guide for the recommended configuration.

C The TEST pin is available only on MSP430 family members with multiplexed JTAG pins. See the device-specific datasheet to determine if this pin is available.

D The connection to the JTAG connector RST pin is required when programming or debugging a device that supports2-wire JTAG communication, even when using 4-wire JTAG communication mode on these devices. However, thisconnection is optional on devices that do not support 2-wire JTAG communication.

E When using a device that supports 2-wire JTAG communication in 4-wire JTAG mode, the upper limit for C1 shouldnot exceed 2.2 nF. This applies to both TI FET interface modules (LPT and USB FET).Some EVMs use a value of 1.1 nF to enable high-speed SBW communication.

Figure 2-1. Signal Connections for 4-Wire JTAG Communication



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R147 kΩ

C12.2 nF

(See Note B)

VCC

C210 µF

C30.1 µF

www.ti.com Signal Connections for In-System Programming and Debugging

A If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used,make connection J2.

B The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device duringJTAG access, and any capacitance that is attached to this signal may affect the ability to establish a connection withthe device. The upper limit for C1 is 2.2 nF when using current TI tools.Some EVMs use a value of 1.1 nF to enable high-speed SBW communication.

C R2 protects the JTAG debug interface TCK signal from the JTAG security fuse blow voltage that is supplied by theTEST/VPP pin during the fuse blow process. If fuse blow functionality is not needed, R2 is not required (populate 0 Ω)and do not connect TEST/VPP to TEST/SBWTCK.

Figure 2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx,MSP430G2xx, and MSP430F4xx Devices



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(See Note B)

J1 (see Note A)

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V /AV /DVCCCC CC

V /AV /DVSS SS SS

VCC

C210 µF

C30.1 µF

Signal Connections for In-System Programming and Debugging www.ti.com

A Make connection J1 if a local target power supply is used, or make connection J2 if the target is powered from thedebug or programming adapter.

B The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device duringJTAG access, and any capacitance that is attached to this signal may affect the ability to establish a connection withthe device. The upper limit for C1 is 2.2 nF when using current TI tools.Some EVMs use a value of 1.1 nF to enable high-speed SBW communication.

Figure 2-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by All MSP430 SBW-Capable Devices That are Not Part of F2xx, G2xx, F4xx Families

NOTE: On some Spy-Bi-Wire capable MSP430 devices, TEST/SBWTCK is very sensitive to risingsignal edges that can cause the test logic to enter a state where an entry sequence (either2‑wire or 4-wire) is not recognized correctly and JTAG access stays disabled. Unintentionaledges on SBWTCK can occur when the JTAG connector is connected to the target device.



http://www.ti.com


www.ti.com External Power

2.2 External PowerThe MSP-FET430UIF can supply targets with up to 60 mA through pin 2 of the 14-pin connector. Notethat the target should not consume more than 60 mA, even as a peak current, as it may violate the USBspecification. For example, if the target board has a capacitor on VCC more than 10 µF, it may causeinrush current during capacitor charging that may exceed 60 mA. In this case, the current should belimited by the design of the target board, or an external power supply should be used.

The VCC for the target can be selected between 1.8 V and 3.6 V in steps of 0.1 V. Alternatively, the targetcan be supplied externally. In this case, the external voltage should be connected to pin 4 of the 14-pinconnector. The MSP-FET430UIF then adjusts the level of the JTAG signals to external VCC automatically.Only pin 2 (MSP-FET430UIF supplies target) or pin 4 (target is externally supplied) must be connected;not both at the same time.

When a target socket module is powered from an external supply, the external supply powers the deviceon the target socket module and any user circuitry connected to the target socket module, and the FETinterface module continues to be powered from the PC through the parallel port. If the externally suppliedvoltage differs from that of the FET interface module, the target socket module must be modified so thatthe externally supplied voltage is routed to the FET interface module (so that it may adjust its outputvoltage levels accordingly). See the target socket module schematics in Appendix B.

The PC parallel port can source a limited amount of current. Because of the ultra-low-power requirementof the MSP430, a stand-alone FET does not exceed the available current. However, if additional circuitryis added to the tool, this current limit could be exceeded. In this case, external power can be supplied tothe tool through connections provided on the target socket modules. See the schematics and pictorials ofthe target socket modules in Appendix B to locate the external power connectors. Note that the MSP-FET430PIF is not recommended for new design.

2.3 Bootloader (BSL)The JTAG pins provide access to the memory of the MSP430 and CC430 devices. On some devices,these pins are shared with the device port pins, and this sharing of pins can complicate a design (orsharing may not be possible). As an alternative to using the JTAG pins, most MSP430Fxxx devicescontain a program (a "bootloader", formerly knows as the "bootstrap loader") that permits the flashmemory to be erased and programmed using a reduced set of signals. The MSP430 Programming Withthe Bootloader (BSL) User's Guide (SLAU319) describes this interface. See the MSP430 website for theapplication reports and a list of MSP430 BSL tool developers.

TI suggests that MSP430Fxxx customers design their circuits with the BSL in mind (that is, TI suggestsproviding access to these signals by, for example, a header).

See FAQ Hardware #10 for a second alternative to sharing the JTAG and port pins.



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Appendix ASLAU278W–May 2009–Revised October 2015

Frequently Asked Questions and Known Issues

This appendix presents solutions to frequently asked questions regarding the MSP-FET430 hardware.

Topic ........................................................................................................................... Page

A.1 Hardware FAQs.................................................................................................. 27A.2 Known Issues .................................................................................................... 29

26 Frequently Asked Questions and Known Issues SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback



www.ti.com Hardware FAQs

A.1 Hardware FAQs1. MSP430F22xx Target Socket Module (MSP-TS430DA38) – Important Information

Due to the large capacitive coupling introduced by the device socket between the adjacent signalsXIN/P2.6 (socket pin 6) and RST/SBWTDIO (socket pin 7), in-system debugging can disturb theLFXT1 low-frequency crystal oscillator operation (ACLK). This behavior applies only to the Spy-Bi-Wire(2-wire) JTAG configuration and only to the period while a debug session is active.Workarounds:• Use the 4-wire JTAG mode debug configuration instead of the Spy-Bi-Wire (2-wire) JTAG

configuration. This can be achieved by placing jumpers JP4 through JP9 accordingly.• Use the debugger option "Run Free" that can be selected from the Advanced Run drop-down

menu (at top of Debug View). This prevents the debugger from accessing the MSP430 devicewhile the application is running. Note that, in this mode, a manual halt is required to see if abreakpoint was hit. See the IDE documentation for more information on this feature.

• Use an external clock source to drive XIN directly.2. With current interface hardware and software, there is a weakness when adapting target boards

that are powered externally. This leads to an accidental fuse check in the MSP430 device. This isvalid for PIF and UIF but is seen most often on the UIF. A solution is being developed.Workarounds:• Connect the RST/NMI pin to the JTAG header (pin 11). LPT and USB tools are able to pull the

RST line, which also resets the device internal fuse logic.• Use the debugger option "Release JTAG On Go" that can be selected from the IDE drop-down

menu. This prevents the debugger from accessing the MCU while the application is running. Notethat in this mode, a manual halt is required to see if a breakpoint was hit. See the IDEdocumentation for more information on this feature.

• Use an external clock source to drive XIN directly.3. The 14-conductor cable that connects the FET interface module and the target socket module must

not exceed 8 inches (20 centimeters) in length.4. The signal assignment on the 14-conductor cable is identical for the parallel port interface and the

USB FET.5. To use the on-chip ADC voltage references, the capacitor must be installed on the target socket

module. See the schematic of the target socket module to populate the capacitor according to the datasheet of the device.

6. To use the charge pump on the devices with LCD+ Module, the capacitor must be installed onthe target socket module. See the schematic of the target socket module to populate the capacitoraccording to the data sheet of the device.

7. Crystals or resonators Q1 and Q2 (if applicable) are not provided on the target socket module.For MSP430 devices that contain user-selectable loading capacitors, see the device and crystal datasheets for the value of capacitance.

8. Crystals or resonators have no effect upon the operation of the tool and the CCS debugger orC-SPY (as any required clocking and timing is derived from the internal DCO and FLL).

9. On devices with multiplexed port or JTAG pins, to use these pin in their port capability:For CCS: "Run Free" (in Run pulldown menu at top of Debug View) must be selected.For C-SPY: "Release JTAG On Go" must be selected.

10. As an alternative to sharing the JTAG and port pins (on low pin count devices), consider usingan MSP430 device that is a "superset" of the smaller device. A very powerful feature of theMSP430 is that the family members are code and architecturally compatible, so code developed onone device (for example, one without shared JTAG and port pins) ports effortlessly to another(assuming an equivalent set of peripherals).

27SLAU278W–May 2009–Revised October 2015 Frequently Asked Questions and Known IssuesSubmit Documentation Feedback


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Hardware FAQs www.ti.com

11. Information memory may not be blank (erased to 0xFF) when the device is delivered from TI.Customers should erase the information memory before its first use. Main memory of packageddevices is blank when the device is delivered from TI.

12. The device current is higher then expected. The device current measurement may not be accuratewith the debugger connected to the device. For accurate measurement, disconnect the debugger.Additionally some unused pins of the device should be terminated. See the Connection of Unused Pinstable in the device's family user's guide.

13. The following ZIF sockets are used in the FET tools and target socket modules:• 8-pin device (D package): Yamaichi IC369-0082• 14-pin device (PW package): Enplas OTS-14-065-01• 14-pin package for 'L092 (PW package): Yamaichi IC189-0142-146• 24-pin package (PW package): Enplas OTS-24(28)-0.65-02• 28-pin device (DW package): Wells-CTI 652 D028• 28-pin device (PW package): Enplas OTS-28-0.65-01• 38-pin device (DA package): Yamaichi IC189-0382-037• 40-pin device (RHA package): Enplas QFN-40B-0.5-01• 40-pin device (RSB package): Enplas QFN-40B-0.4• 48-pin device (RGZ package): Yamaichi QFN11T048-008 A101121-001• 48-pin device (DL package): Yamaichi IC51-0482-1163• 64-pin device (PM package): Yamaichi IC51-0644-807• 64-pin device (RGC package): Yamaichi QFN11T064-006• 80-pin device (PN package): Yamaichi IC201-0804-014• 100-pin device (PZ package): Yamaichi IC201-1004-008• 128-pin device (PEU package): Yamaichi IC500-1284-009PEnplas: www.enplas.comWells-CTI: www.wellscti.comYamaichi: www.yamaichi.us

28 Frequently Asked Questions and Known Issues SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback


http://www.ti.com

http://www.enplas.com

http://www.wellscti.com/

http://www.yamaichi.us/


www.ti.com Known Issues

A.2 Known Issues

MSP-FET430UIF Current detection algorithm of the UIF firmware

Problem Description If high current is detected, the ICC monitor algorithm stays in a loop of frequentlyswitching on and off the target power supply. This power switching puts some MSP430devices such as the MSP430F5438 in a state that requires a power cycle to return thedevice to JTAG control.

A side issue is that if the UIF firmware has entered this switch on and switch off loop, itis not possible to turn off the power supply to the target by calling MSP430_VCC(0). Apower cycle is required to remove the device from this state.

Solution IAR KickStart and Code Composer Essentials that have the MSP430.dll version2.04.00.003 and higher do not show this problem. Update the software development toolto this version or higher to update the MSP-FET430UIF firmware.

MSP-FET430PIF Some PCs do not supply 5 V through the parallel port

Problem Description Device identification problems with modern PCs, because the parallel port often does notdeliver 5 V as was common with earlier hardware.1. When connected to a laptop, the test signal is clamped to 2.5 V.2. When the external VCC becomes less than 3 V, up to 10 mA is flowing in the adapter

through pin 4 (sense).

Solution Measure the voltage level of the parallel port. If it is too low, provide external 5 V to theVCC pads of the interface. The jumper on a the target socket must be switched toexternal power.

29SLAU278W–May 2009–Revised October 2015 Frequently Asked Questions and Known IssuesSubmit Documentation Feedback


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Appendix BSLAU278W–May 2009–Revised October 2015

Hardware

This appendix contains information relating to the FET hardware, including schematics, PCB pictorials,and bills of materials (BOMs). All other tools, such as the eZ430 series, are described in separate product-specific user's guides.

30 Hardware SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback



www.ti.com Appendix B

Topic ........................................................................................................................... Page

B.1 MSP-TS430D8 .................................................................................................... 32B.2 MSP-TS430PW14................................................................................................ 35B.3 MSP-TS430L092 ................................................................................................. 38B.4 MSP-TS430L092 Active Cable .............................................................................. 41B.5 MSP-TS430PW20................................................................................................ 44B.6 MSP-TS430PW24................................................................................................ 47B.7 MSP-TS430RGE24A ............................................................................................ 50B.8 MSP-TS430DW28................................................................................................ 53B.9 MSP-TS430PW28................................................................................................ 56B.10 MSP-TS430PW28A ............................................................................................. 59B.11 MSP-TS430RHB32A ............................................................................................ 62B.12 MSP-TS430DA38 ................................................................................................ 65B.13 MSP-TS430QFN23x0 ........................................................................................... 68B.14 MSP-TS430RSB40 .............................................................................................. 71B.15 MSP-TS430RHA40A ............................................................................................ 74B.16 MSP-TS430DL48 ................................................................................................ 77B.17 MSP-TS430RGZ48B ............................................................................................ 80B.18 MSP-TS430RGZ48C ............................................................................................ 83B.19 MSP-TS430PM64 ................................................................................................ 86B.20 MSP-TS430PM64A .............................................................................................. 89B.21 MSP-TS430PM64D .............................................................................................. 92B.22 MSP-TS430PM64F .............................................................................................. 95B.23 MSP-TS430RGC64B............................................................................................ 98B.24 MSP-TS430RGC64C .......................................................................................... 101B.25 MSP-TS430RGC64USB ...................................................................................... 105B.26 MSP-TS430PN80............................................................................................... 109B.27 MSP-TS430PN80A ............................................................................................ 112B.28 MSP-TS430PN80USB ........................................................................................ 115B.29 MSP-TS430PZ100 ............................................................................................. 119B.30 MSP-TS430PZ100A ........................................................................................... 122B.31 MSP-TS430PZ100B ........................................................................................... 125B.32 MSP-TS430PZ100C ........................................................................................... 128B.33 MSP-TS430PZ100D ........................................................................................... 131B.34 MSP-TS430PZ5x100 .......................................................................................... 134B.35 MSP-TS430PZ100USB ....................................................................................... 137B.36 MSP-TS430PZ100AUSB ..................................................................................... 141B.37 MSP-TS430PEU128 ........................................................................................... 145B.38 EM430F5137RF900 ........................................................................................... 148B.39 EM430F6137RF900 ........................................................................................... 152B.40 EM430F6147RF900 ........................................................................................... 156B.41 MSP-FET ......................................................................................................... 160B.42 MSP-FET430UIF ............................................................................................... 172B.43 MSP-FET430PIF................................................................................................ 178

31SLAU278W–May 2009–Revised October 2015 HardwareSubmit Documentation Feedback


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MSP-TS430D8 www.ti.com

B.1 MSP-TS430D8

Figure B-1. MSP-TS430D8 Target Socket Module, Schematic



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Jumper J4Open to disconnect LED

D1LED connected to P1.2

Orient Pin 1 of MSP430 device

14-pin connector for debuggingin Spy-Bi-Wire mode only

(4-Wire JTAG not available)

Jumper J6Open to measure current

Jumper J51-2 (int): Power supply from JTAG interface2-3 (ext): External power supply

Connector J3External power connectorJumper J5 to “ext”

www.ti.com MSP-TS430D8

Figure B-2. MSP-TS430D8 Target Socket Module, PCB



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MSP-TS430D8 www.ti.com

Table B-1. MSP-TS430D8 Bill of Materials

No. perPosition Ref Des Description Digi-Key Part No. CommentBoard1 J4, J6 2 2-pin header, male, TH SAM1035-02-ND place jumper on header2 J5 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-23 SBW 1 10-pin connector, male, TH HRP10H-ND4 J3 1 3-pin header, male, TH SAM1035-03-ND5 C8 1 2.2nF, CSMD0805 Buerklin 53 D 2926 C7 1 10uF, 10V, 1210ELKO 478-3875-1-ND7 R5 1 47K, 0805 541-47000ATR-ND8 C5 1 100nF, CSMD0805 311-1245-2-ND9 R2, R3 2 330R, 0805 541-330ATR-ND

DNP: headers enclosed with kit.10 J1, J2 2 4-pin header, TH SAM1029-04-ND Keep vias free of solder.10,1 J1, J2 1 4-pin socket, TH SAM1029-04-ND DNP: receptacles enclosed with kit.11 U1 1 SO8 Socket: Type IC369-0082 Manuf.: Yamaichi12 D1 1 red, LED 0603

DNP: enclosed with kit. Is supplied13 MSP430 2 MSP430G2210, MSP430G2230 by TIMSP-TS430D8 Rev.14 PCB 1 50,0mmx44,5mm 1.0



http://www.ti.com


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www.ti.com MSP-TS430PW14

B.2 MSP-TS430PW14

Figure B-3. MSP-TS430PW14 Target Socket Module, Schematic



http://www.ti.com



Orient Pin 1 of MSP430 device Jumper J6Open to measure current

Connector J3External power connectorJumper J5 to "ext"D1

LED connected to P1.0

Jumpers J7 to J12Close 1-2 to debug in Spy-Bi-Wire mode.Close 2-3 to debug in 4-wire JTAG mode.


Connector JTAGFor JTAG Tool

MSP-TS430PW14 www.ti.com

Figure B-4. MSP-TS430PW14 Target Socket Module, PCB



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Table B-2. MSP-TS430PW14 Bill of Materials

No. perPosition Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP2 C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND3 C3, C5 1 100nF, SMD0805 478-3351-2-ND DNP: C34 C8 0 2.2nF, SMD0805 DNP5 D1 1 green LED, SMD0603 475-1056-2-ND

DNP: Headers and receptaclesenclosed with kit. Keep vias free ofsolder6 J1, J2 0 7-pin header, TH

SAM1029-07-ND : HeaderSAM1213-07-ND : Receptacle

J3, J5, J7, Place jumpers on headers J5, J7, J8,7 J8, J9, J10, 8 3-pin header, male, TH SAM1035-03-ND J9, J10, J11, J12; Pos 1-2J11, J128 J4, J6 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header9 9 Jumper 15-38-1024-ND Place on: J5, J7-J12; Pos 1-2

14-pin connector, male,10 JTAG 1 HRP14H-NDTHMicro Crystal MS1V-T1K

12 Q1 0 Crystal 32.768kHz, C(Load) = DNP: keep vias free of solder12.5pF

13 R2, R3 2 330 Ω, SMD0805 541-330ATR-ND15 R5 1 47k Ω, SMD0805 541-47000ATR-ND16 U1 1 Socket: OTS-14-0.65-01 Manuf.: Enplas17 PCB 1 56 x 53 mm 2 layers

For example, 3MAdhesive Approximately 6mm width,18 4 Bumpons Part No. SJ- Apply to corners at bottom sideplastic feet 2mm height 530219 MSP430 2 MSP430F2013IPW DNP: enclosed with kit, supplied by TI



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MSP-TS430L092 www.ti.com

B.3 MSP-TS430L092

Figure B-5. MSP-TS430L092 Target Socket Module, Schematic



http://www.ti.com


Connector J3External power connector

Jumper JP3Open to measure current

Jumper JP1Write enable for EPROM

Orient pin 1 ofMSP430 device

www.ti.com MSP-TS430L092

Settings of the MSP-TS430L092 Target SocketFigure B-6 shows the PCB layout of the MSP-TS430L092 target socket. The following pinning isrecommended:• JP1 is write enable for the EPROM. If this is not set, the EPROM can only be read.• JP2 and JP3 connect device supply with boost converter. They can be opened to measure device

current consumption. For default operation, they should be closed.

Figure B-6. MSP-TS430L092 Target Socket Module, PCB



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MSP-TS430L092 www.ti.com

Table B-3. MSP-TS430L092 Bill of Materials

No. PerPos. Ref Des No. Description Digi-Key Part No. CommentBoard1 C1, C2 2 330nF, SMD06032 C5 1 100n, SMD06033 C6 1 10u, SMD08054 C10 1 100n, SMD06035 EEPROM1 1 M95512 SO08 (SO8) ST Micro M95160R Digikey: 497-8688-1-ND

DNP: headers and receptaclesenclosed with kit. Keep viasfree of solder.7 J1, J2 2 7-pin header, TH


8 J3 1 3-pin header, male, TH SAM1035-03-ND9 J4, J5 2 FE4L, FE4H 4 pol. Stiftreihe DNP; Keep vias free of solder.

Reichelt: MicroMaTch-11 J13 1 MICRO_STECKV_10 Connector: MM FL 10G12 JP1, JP2,JP3 3 2-pin header, male, TH SAM1035-02-ND place jumper on header15 L1 1 33uH, SMD0806 LQH2MCN330K02L Farnell: 151-555716 LED1, LED4 2 LEDCHIPLED_0603 Farnell: 168606517 Q2 1 BC817-16LT1SMD BC817-16LT1SMD SOT23-BEC18 R0, R6, R7 3 2K7, SMD060319 R1 1 1k, SMD060320 R2 1 47k, SMD0603

R4,R5, R8,21 6 10k, SMD0603R10, RC, RD22 RA 1 3.9k, SMD060323 RB 1 6.8k, SMD0603

14 Pin Socket - IC189-0142-24 U1 1 Manuf. Yamaichi146DNP: Enclosed with kit. Is22 MSP430 2 MSP430L092PWR supplied by TI.



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www.ti.com MSP-TS430L092 Active Cable

B.4 MSP-TS430L092 Active Cable

Figure B-7. MSP-TS430L092 Active Cable Target Socket Module, Schematic



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Connector JTAG

For JTAG Tool

JP2

JP1

MSP-TS430L092 Active Cable www.ti.com

Figure B-8 shows the PCB layout for the Active Cable. The following pinning is possible:• JP1 has two jumpers (Jumper 1 and Jumper 2) that can be set as shown in Table B-4.

Table B-4. MSP-TS430L092 JP1 Settings

Jumper 1 Jumper 2 DescriptionOff Off The active cable has no power and does not function.

The active cable receives power from target socket. For this option, theOff On target socket must have its own power supply.On Off The active cable receives power from the JTAG connector.

The JTAG connector powers the active cable and the target socket. ForOn On this option, the target socket must not have its own power source, as this

would cause a not defined state.

• JP2 is for reset. For the standard MSP-TS430L092, this jumper must be set. It sets the reset pin tohigh and can also control it. Without this jumper on the MSP-TS430L092, reset is set to zero.

Figure B-8. MSP-TS430L092 Active Cable Target Socket Module, PCB



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www.ti.com MSP-TS430L092 Active Cable

Table B-5. MSP-TS430L092 Active Cable Bill of Materials

No. PerPos. Ref Des Description Digi-Key Part No. CommentBoardC1, C3, C5,1 4 100nF, SMD0603C6

2 C2, C4 2 1uF, SMD08053 R1, R10 2 10K, SMD06034 R2 1 4K7, SMD0603

R5, R6, R7,5 4 100, SMD0603R96 R8 1 680k, SMD06037 R11, R15 2 1K, SMD06038 R12 0 SMD0603 DNP9 R13 0 SMD0603 DNP10 R14 1 0, SMD060311 IC1 1 SN74AUC1G04DBVR Manu: TI12 IC2, IC3, IC4 3 SN74AUC2G125DCTR Manu: TI

Reichelt: MicroMaTch-13 J2 1 MICRO_STECKV_10 Connector: MM FL 10GPut jumper on Position 1 and14 JP1 1 2x2 Header JP2Q 2. Do not mix direction.

15 JP2 1 2-pin header, male, TH SAM1035-02-ND place jumper on header16 JTAG 1 14-pin connector, male, TH HRP14H-ND

BC817-25LT1SMD, SOT23- Digi-Key: BC817-17 Q1 1 BEC 25LT1GOSCT-ND18 U1, U2 2 TLVH431IDBVR SOT23-5 Manu: TI



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DN

P

I2C

UA

RT

P1.3

Jum

pers

JP

3 to

JP

8C

lose 1

-2 to

debug in

Spy-B

i-Wire

mode.

Clo

se 2

-3 to

debug in

4-w

ire J

TA

G m

ode.

BS

LTool S

ele

ct:

Open =

BS

LC

onnecto

rC

losed =

JTA

G C

onnecto

r

DN

P

DN

P

12p

12p

GN

D

GN

D

33

0R

0R0R

GN

D

GN

D

1.1

nF

47

kG

ND

0R0R

QU

AR

Z5

10

0n

F

1uF/10V

gre

en

GN

D

EV

Q11

0R

DNP

DN

P

10

0n

FGN

D

10

k1

0k

33

0R

yello

w D

NP3

30

R

red D

NP

MS

P430F

R231X

IPW

20

SA

M1029-1

0-N

D/1

-10

SA

M1029-1

0-N

D/1

1-2

0

If exte

rnal s

upply

volta

ge:

rem

ove R

3 a

nd a

dd R

2 (0

Ohm

)

Ext_

PW

R

MS

P-T

S4

30

PW

20

Vcc

int

ext

DN

PD

NP

DN

P

JTA

G ->

SB

W ->

1.0

DN

P

P1

.3

Socket: E

npla

s O

TS

-20S

-0.6

5-0

07

PW

16

PW

20

DN

P

DN

P

Ta

rge

t so

cke

t bo

ard

for M

SP

43

0F

R2

31

x d

evic

es

1 3 5 7 9 11

13

2 4 6

12

148

10

JTA

G

C9

C8

R1

12

34

56

78

91

0

BS

L

R2R3

123

J2

1 2 3

J1

1 2

JP

1

12J

P9

C5

R4

1 2 3JP

3

1 2 3JP

4

1 2 3JP

5

1 2 3JP

6

1 2 3JP

7

1 2 3JP

8

R9R8

Q2

C11

C7

D1

SW

1

R1

3

TP2TP1

SW2

R1

4

C6

12

JP

13

12

JP

14

12

JP

15

123

JP

16

1 2

JP17

1 2

JP18

R7

R1

5

R5

12J

P2

D2

R6

12J

P10

D3

TP

3

P1.1

/UC

B0C

LK

/AC

LK

/C1/A

11

P1.0

/UC

B0S

TE

/SM

CLK

/C0/A

0/V

ER

EF

+2

TE

ST

/SB

WT

CK

3

RS

T/N

MI/S

BW

TD

IO4

DV

CC

5

DV

SS

6

P2.7

/TB

0C

LK

/XIN

7

P2.6

/MC

LK

/XO

UT

8

P2.5

/UC

B0S

OM

I/UC

B0S

CL

9

P2.4

/UC

B0S

IMO

/UC

B0S

DA

10

P1.2

/UC

B0S

IMO

/UC

B0S

DA

/TB

0T

RG

/OA

0-/A

2/V

ER

EF

-2

0

P1.3

/UC

B0S

OM

I/UC

B0S

CL/O

A0O

/A3

19

P1.4

/UC

A0S

TE

/TC

K/O

A0+

/A4

18

P1.5

//UC

A0C

LK

/TM

S/T

RI0

O/A

51

7

P1.6

/UC

A0R

XD

/UC

A0S

OM

I/TB

0.1

/TD

I/TC

LK

/TR

I0-/A

61

6

P1.7

/UC

A0T

XD

/UC

A0S

IMO

/TB

2.0

/TD

0/T

RI0

+/A

7/V

RE

F+

15

P2.0

/TB

1.1

/CO

14

P2.1

/TB

1.2

13

P2.2

/UC

B0S

TE

/TB

1C

LK

12

P2.3

/UC

B0C

LK

/TB

1T

RG

11

U1

J3

12345678910

J4

11

12

13

14

15

16

17

18

19

20

5 3 1246

JP

11

P1.0

P1.0

RS

T/N

MI

TM

ST

DI

VC

C

P1

.1

P1.1

TC

K/S

BW

TC

K

TD

O/S

BW

TD

IO

P1.5

/TM

S

P1.5

/TM

S

P1.4

/TC

KP1.4

/TC

K

P1.2

P1

.2

P1.2

XO

UT XO

UT

XIN

XIN

XTLGND

DV

CC

DV

CC

DVCC

DV

CC

DV

CC

DV

SS

DV

SS

TE

ST

/SB

WT

CK

1

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

RX

D/S

IMO

RX

D/S

IMO

TX

D/S

OM

I/SD

A

TX

D/S

OM

I/SD

A

SP

ICLK

/SC

L

SP

ICLK

/SC

L

TX

D/S

OM

I/SD

A1

PIN

14

PIN

14

PIN

15

PIN

15

PIN

15

PIN

15

PIN

16

PIN

16

PIN

16

TD

X

TD

X

RX

D

RX

D

P1.3

P1.3

IPW

16

IPW

20

1 2 3 4 5 6

1 2 3 4 5 6

Title

:

Da

te:

Pa

ge

1/1

MS

P-T

S4

30

PW

20

8/2

7/2

01

5 3

:37

:12

PM

A3

IH

GF

ED

CB

A AB

CD

EF

GH

I

File

:

Re

v.:


B.5 MSP-TS430PW20The development board MSP-TS430PW20 supports the MSP430FR231x FRAM devices in the 20-pin andthe 16-pin TSSOP packages. MSP430FR2311IPW20 devices are not included in the MSP-TS430PW20kit. Free samples can be ordered from the TI Store.




http://www.ti.com

http://www.ti.com/product/MSP430FR2311/samplebuy


141

2

101

2

JP

11



Jumpers JP9, JP2, JP10Open to disconnect LEDs

D1 to D3LEDs connected to P1.0 to P1.2


Jumper J1 to "ext"

Jumpers JP3 to JP8Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode


Connector BSLFor ToolBootloader


SW1Close to reset





http://www.ti.com




No. PerPos. Ref Des No. Description Digi-Key Part No. CommentBoard1 PCB 1 90.0 x 92.5 mm MSP-TS430PW20 Rev. 1.0 2 layers, green solder mask

JP1, JP9,2 JP13, JP14, 5 2-pin header, male, TH SAM1035-02-ND place jumper on header

JP153 JP17, JP18 2 2-pin header, male, TH SAM1035-02-ND place jumper on one pin only4 JP2, JP10 2 2-pin header, male, TH SAM1035-02-ND DNP, keep pads free of solder5 J1 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2

JP3, JP4, JP5,6 JP6, JP7, JP8, 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3

JP167 J2 1 3-pin header, male, TH SAM1035-03-ND

PW20: Place jumpers on pins 1-3 and 2-48 JP11 1 2x3pin header, male, TH SAM1034-03-ND PW16: Place jumpers on pins 3-5 and 4-6

9 R2, R8, R9 3 0R, 0805 541-0.0ATR-ND DNP10 R3, R13 2 0R, 0805 541-0.0ATR-ND11 C5 1 1.1nF, CSMD0805 490-1623-2-ND12 C7 1 1uF/10V, CSMD0805 490-1702-2-ND13 R7, R15 1 10k, 0805 541-10KATR-ND14 R4 1 47k, 0805 541-47KATR-ND15 C6, C11 2 100nF, CSMD0805 490-1666-1-ND16 C8, C9 2 12p, DNP, CSMD0805 BC1257TR-ND DNP17 R1 1 330R, 0805 541-330ATR-ND18 R5, R6 2 330R, 0805 541-330ATR-ND DNP19 R14 1 47k, 0805 541-47KATR-ND DNP20 SW2 1 EVQ-11L05R P8079STB-ND DNP, Keep vias free of solder21 SW1 1 EVQ-11L05R P8079STB-ND DNP, Keep vias free of solder

DNP: headers are enclosed with22 J3, J4 2 10-pin header, TH SAM1029-10-ND kit.

Keep vias free of solderDNP: Receptacles are enclosed

23 J3, J4 2 10-pin receptacle, TH SAM1213-10-ND with kit.Keep vias free of solder

24 TP1, TP2, TP3 3 Test point DNP, keep pads free of solder25 BSL 1 10-pin connector, male, TH HRP10H-ND26 JTAG 1 14-pin connector, male, TH HRP14H-ND27 IC1 1 Socket: OTS-20S-0.65-007 Manuf. Enplas

DNP: Free samples can be28 IC1 1 MSP430FR2311IPW20 ordered in the TI Store29 Q2 1 Crystal 4MHz Buerklin: 78D134 DNP: Crystal is enclosed with kit

MSV3V-T1R (32.768KHz /30 Q2 (1) 1 DNP: Crystal is enclosed with kit20ppm / 12.5pF)green LED, HSMG-C17031 D1 1 516-1434-1-ND Avago, Farnell 5790852DIODE0805

32 D3 1 red LED, DIODE0805 DNP33 D2 1 yellow LED, DIODE0805 DNP

Rubber stand34 4 Buerklin: 20H1724 apply to corners at bottom sideoff(1) One symbol in schematic; footprint supports two crystal types



http://www.ti.com

http://www.ti.com/product/MSP430FR2311/samplebuy



B.6 MSP-TS430PW24




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Jumper JP3Open to disconnect LED

Connector J5External power connectorJumper JP1 to "ext"


Jumper JP11-2 (int): Power supply from JTAG interface

2-3 (ext): External power supply






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No. perPosition Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP2 C5 1 2.2nF, SMD08053 C3, C7 2 10uF, 10V, SMD08054 C4, C6, C8 3 100nF, SMD0805 478-3351-2-ND5 D1 1 green LED, SMD0805 P516TR-ND

DNP: Headers and receptaclesSAM1029-07-ND6 J1, J2 0 12-pin header, TH enclosed with kit. Keep vias free ofSAM1213-07-ND solder. (Header and Receptacle)J5, JP1,

JP4, JP5, Place jumper on 1-2 of JP4-JP97 8 3-pin header, male, TH SAM1035-03-NDJP6, JP7, Place on 1-2 on JP1JP8, JP9

8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header9 9 Jumper 15-38-1024-ND see Pos 7 and 8

14-pin connector, male,10 JTAG 1 HRP14H-NDTH11 Q1 0 Crystal DNP: keep vias free of solder12 R1, R7 2 330 Ω, SMD0805 541-330ATR-ND

R5, R6, R8,13 2 0 Ohm, SMD0805 541-000ATR-ND DNP R5, R6R9,14 R4 1 47k Ohm, SMD0805 541-47000ATR-ND

Socket: OTS 24(28)-065-15 U1 1 Manuf.: Enplas02-0016 PCB 1 68.5 x 61 mm 2 layers

Adhesive Approximately 6mm width, for example, 3M Bumpons17 4 Apply to corners at bottom sideplastic feet 2mm height Part No. SJ-530218 MSP430 2 MSP430AFE2xx DNP: enclosed with kit, supplied by TI



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DN

P

Socket:

EN

PLA

S Q

FN

-24B

-0.5

-0.1

c

I2C

UA

RT

P1.3

P1.5

Jum

pers

JP

3 to

JP

8C

lose 1

-2 to

debug in

Spy-B

i-Wire

mode.

Clo

se 2

-3 to

debug in

4-w

ire J

TA

G m

ode.

BS

LTool S

ele

ct:

Open =

BS

LC

onnecto

rC

losed =

JTA

G C

onnecto

r

DN

P

DN

P

DN

P

DN

P

GN

D

GN

D

33

0R

0R0R

GN

D

GN

D

1.1

nF

47

kG

ND0R 0R

QU

AR

Z5

10

0n

F

1uF/10V

gre

en

GN

D

EV

Q11

0R

DNP

DN

P

10

0n

F

GN

D1

0k

10

k

MS

P430F

R2433IR

GE

SA

M1029-0

6-N

D1-6

SAM1029-06-ND7-12

SA

M1029-0

6-N

D13-1

8

SAM1029-06-ND19-24

33

0R

yello

w D

NP3

30

R

red D

NP

If exte

rnal s

upply

volta

ge:

rem

ove R

3 a

nd a

dd R

2 (0

Ohm

)

Ext_

PW

R

MS

P-T

S4

30

RG

E2

4A

Vcc

int

ext

DN

PD

NP

DN

P

JTA

G ->

SB

W ->

1.0

DN

P

P1

.3

Ta

rge

t So

cke

t Bo

ard

for M

SP

43

0F

R2

43

3 d

evic

e

1 3 5 7 9 11

13

2 4 6

12

148

10

JTA

G

C9

C8

R1

12

34

56

78

91

0

BS

L

R2R3

123

J2

1 2 3

J1

1 2

JP

1

12J

P9

C5

R4

1 2 3JP

3

1 2 3JP

4

1 2 3JP

5

1 2 3JP

6

1 2 3JP

7

1 2 3JP

8

R9 R8

Q2

C11

C7

D1

SW

1

R1

3

TP2TP1

SW2

R1

4

C6

12

JP

13

12

JP

14

12

JP

15

123

JP

16

1 2

JP17

1 2

JP18

R7

R1

5

RS

T/N

MI/S

BW

TD

IO1

TE

ST

/SB

WT

CK

2

P1.4

/UC

A0T

XD

/UC

A0S

IMO

/TA

1.2

/TC

K/A

43

P1.5

/UC

A0R

XD

/UC

A0S

OM

I/TA

1.1

/TM

S/A

54

P1.6

/UC

A0C

LK

/TA

1C

LK

/TD

I/TC

LK

/A6

5

P1.7

/UC

A0S

TE

/SM

CLK

/TD

O/A

76

P2.3

13

P3.1

/UC

A1S

TE

14

P2.4

/UC

A1C

LK

15

P2.5

/UC

A1R

XD

/UC

A1S

OM

I16

P2.6

/UC

A1T

XD

/UC

A1S

IMO

17

DV

SS

18

P1.0/UCB0STE/TA0CLK/A07

P1.1/UCB0CLK/TA0.1/A18

P1.2/UCB0SIMO/UCB0SDA/TA0.2/A29

P1.3/UCB0SOMI/UCB0SCL/MCLK/A310

P2.2/ACLK11

P3.012

P2.719

P3.220

P2.0/XOUT21

P2.1/XIN22

DVSS23

DVCC24

IC1

123456

J3

7

8

9

10

11

12

J4

13

14

15

16

17

18

J5

192021222324

J6

R5

12J

P2

D2

R6

12J

P10

D3

TP

3P1.0

P1.0

RS

T/N

MI

TM

ST

DI

VC

C

P1.1

P1

.1 TC

K/S

BW

TC

K

TD

O/S

BW

TD

IO

P1.7

/TD

O

P1.7

/TD

O

P1.5

/TM

S

P1.5

/TM

S

P1.5

/TM

S

P1.4

/TC

K

P1.4

/TC

K

P1.4

/TC

K

P1.6

/TD

I

P1.6

/TD

I

P1.2

P1.2

P1

.2

XO

UT

XOUT

XIN

XIN

XTLGNDD

VC

C

DV

CC

DVCC

DVCC

DV

CC

DV

SS

DV

SS

DVSS

TE

ST

/SB

WT

CK

1

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

RX

D/S

IMO

RX

D/S

IMO

TX

D/S

OM

I/SD

A

TX

D/S

OM

I/SD

A

SP

ICLK

/SC

L

SP

ICLK

/SC

LS

PIC

LK

/SC

L1

SPICLK/SCL1

SP

ICLK

/SC

L1

TX

D/S

OM

I/SD

A1

1 2 3 4 5 6

1 2 3 4 5 6

Title

:

Da

te:

Pa

ge

1/1

MS

P-T

S4

30

RG

E2

4A

4/2

8/2

01

5 3

:52

:36

PM

A3

IH

GF

ED

CB

A AB

CD

EF

GH

I

File

:

Re

v.:

MSP-TS430RGE24A www.ti.com

B.7 MSP-TS430RGE24A

Figure B-13. MSP-TS430RGE24A Target Socket Module, Schematic



http://www.ti.com


Connector JTAGFor JTAG tool

Connector BSLFor bootloader tool




Jumper J1 to “ext”


www.ti.com MSP-TS430RGE24A

Figure B-14. MSP-TS430RGE24A Target Socket Module, PCB



http://www.ti.com


MSP-TS430RGE24A www.ti.com

Table B-8. MSP-TS430RGE24A Bill of Materials (BOM)

No. perPosition Ref Des Description Digi-Key Part No. CommentBoard"MSP-TS430RGE24A" Rev.1 PCB 1 90.0 x 92.5 mm 2 layers, red solder mask1.0

JP1, JP9,2 JP13, JP14, 5 2-pin header, male, TH SAM1035-02-ND place jumper on header

JP153 JP17, JP18 2 2-pin header, male, TH SAM1035-02-ND place jumper on one pin only

DNP, keep pads free of4 JP2, JP10 2 2-pin header, male, TH SAM1035-02-ND solder5 J1 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2

JP3, JP4,JP5, JP6,6 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3JP7, JP8,

JP167 J2 1 3-pin header, male, TH SAM1035-03-ND8 R2, R8, R9 3 0R, 0805 541-0.0ATR-ND DNP9 R3, R13 2 0R, 0805 541-0.0ATR-ND10 C5 1 1.1nF, CSMD0805 490-1623-2-ND11 C7 1 1uF/10V, CSMD0805 490-1702-2-ND12 R7, R15 1 10k, 0805 541-10KATR-ND13 R4 1 47k, 0805 541-47KATR-ND14 C6, C11 2 100nF, CSMD0805 490-1666-1-ND15 R1 1 330R, 0805 541-330ATR-ND16 R5, R6 2 330R, 0805 541-330ATR-ND DNP17 R14 1 47k, 0805 541-47KATR-ND DNP18 C8, C9 2 DNP, CSMD0805 DNP

DNP, Keep vias free of19 SW2 1 EVQ-11L05R P8079STB-ND solder. Lacon: 1251459DNP, Keep vias free of20 SW1 1 EVQ-11L05R P8079STB-ND solder, Lacon: 1251459DNP: headers enclosed in

21 J3, J4, J5, J6 4 6-pin header, TH SAM1029-06-ND kit.Keep vias free of solder.DNP: receptacles enclosed in

22 J3, J4, J5, J6 4 6-pin receptacle, TH SAM1213-06-ND kit.Keep vias free of solder.

TP1, TP2, DNP, keep pads free of23 3 Test pointTP3 solder24 BSL 1 10-pin connector, male, TH HRP10H-ND25 JTAG 1 14-pin connector, male, TH HRP14H-ND26 IC1 1 Socket:QFN-24B-0.5-0.1c Manuf. Enplas

DNP: Free samples can be27 IC1 1 MSP430FR2433IRGER ordered in the TI StoreDNP: MS3V-TR1 DNP: Micro Crystal, enclosed28 Q2 1 depends on application(32,768kHz/ 20ppm/12,5pF) in kit. Keep vias free of soldergreen LED, HSMG-C17029 D1 1 516-1434-1-ND Avago, Farnell 5790852DIODE0805

30 D3 1 red (DNP), DIODE0805 DNP31 D2 1 yellow (DNP), DIODE0805 DNP

Rubber stand Apply to corners at bottom32 4 Buerklin: 20H1724off side



http://www.ti.com


ML

14

LE

D3

12

pF

12

pF

GN

D

GND

10

0n

F

56

0R

ML

10

JP

1Q

JP

1Q

10

uF

/10

V

50

K1

0n

F

0R

0R

0R

-

-0R

-

U1

SO

CK

28

DW

F1

23

FE

14

HF

E1

4L

0R

GN

D

rem

ove

R8

an

d a

dd

R9

(0 O

hm

)

If exte

rna

l su

pp

ly v

olta

ge

:re

mo

ve

R11

an

d a

dd

R1

0 (0

Oh

m)

SM

D-F

oo

tprin

t

So

cke

t:Y

am

aic

hi

2.0

MS

P-T

S4

30

DW

28

Ta

rge

t So

cke

t DW

28

Typ

e: IC

18

9-0

28

2-0

42

If exte

rna

l su

pp

ly v

olta

ge

:

R1

, C1

, C2

no

t asse

mb

led

no

t asse

mb

led

1 3 5 7 9 11

13

2 4 6

12

148

10

JTA

G

D1

C2

C1

C5

R3

BO

OT

ST

12

34

56

78

91

0

1 2

J5

J4

12

C7

R5

C8

R6

R7

R8

R9

R1

0

R11

R1

12345678910

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

TS

T1

VC

C2

P2

.53

VS

S4

XO

UT

5

XIN

6

RS

T7

P2

.08

P2

.19

P2

.21

0P

2.3

19

P2

.42

0P

1.0

21

P1

.12

2P

1.2

23

P1

.32

4P

1.4

25

P1

.52

6P

1.6

27

P1

.72

8

P3

.011

P3

.11

2

P3

.21

3

P3

.31

4P

3.4

15

P3

.51

6P

3.6

17

P3

.71

8

U2

15

16

17

18

19

20

21

22

23

24

25

26

27

28

J2

J1

12345678910

11

12

13

14

R2

123

J3

Q1

QUARZ3

P1

.0

P1

.0

P1

.3

P1

.3

P1

.2

P1

.2

P1

.1

P1

.1R

ST

/NM

I

RS

T/N

MI

RS

T/N

MIRS

T/N

MI

RS

T/N

MI

TC

K

TC

K

TC

K

TM

S

TM

S

TM

S

TD

I

TD

I

TD

I

TD

O

TD

O

TD

O

XO

UT

XO

UT

VC

C

GN

D

GN

D

GN

D

P2

.3

P2

.3

P2

.4

P2

.4

XIN

XIN

P2

.5

P2

.5

P2

.2

P2

.2P

2.1

P2

.1

P2

.0

P2

.0

TS

T/V

PP

TS

T/V

PP

TS

T/V

PP

P3

.0

P3

.0

P3

.1

P3

.1

P3

.2

P3

.2

P3

.3

P3

.3

P3

.7

P3

.7

P3

.6

P3

.6

P3

.5

P3

.5

P3

.4

P3

.4

VC

C4

30

Ext_

PW

R

Da

te:

11

/14

/20

06

1:2

6:0

4 P

MS

he

et:

1/1 R

EV

:

TIT

LE

:

Do

cu

me

nt N

um

be

r:

MS

P-T

S4

30

DW

28

+

VC

C4

30

www.ti.com MSP-TS430DW28

B.8 MSP-TS430DW28

Figure B-15. MSP-TS430DW28 Target Socket Module, Schematic



http://www.ti.com



Orient Pin 1 ofMSP430 device



Remove R8 and jumper R9



Connector BOOTSTFor Bootloader Tool

MSP-TS430DW28 www.ti.com

Figure B-16. MSP-TS430DW28 Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430DW28

Table B-9. MSP-TS430DW28 Bill of Materials

No. perPosition Ref Des Description Digi-Key Part No. CommentBoardDNP: C1, C2, Cover holes while1 C1, C2 0 12pF, SMD0805 soldering

2 C5 1 100nF, SMD08053 C7 1 10uF, 10V Tantal Elko B4 C8 1 10nF SMD08055 D1 1 LED3 T1 3mm yellow RS: 228-4991

Micro Crystal MS1V-T1K6 Q1 0 QUARZ, Crystal 32.768kHz, C(Load) = DNP: Cover holes while soldering

12.5pFDNP: Headers and receptaclesenclosed with kit. Keep vias free ofsolder.7 J1, J2 2 14-pin header, TH male: Header: ReceptacleDNP: Headers and receptaclesenclosed with kit. Keep vias free ofsolder.7.1 2 14-pin header, TH female: Header: Receptacle

8 J3 1 3-Pin Connector, male9 J4, J5 2 2-Pin Connector, male With jumper10 BOOTST 0 ML10, 10-Pin Conn., m RS: 482-115 DNP, Cover holes while soldering11 JTAG 1 ML14, 14-Pin Conn., m RS: 482-121

R1, R2, R6,12 R7, R8,R9, 4 0R, SMD0805 DNP: R1, R2, R9, R10

R10, R1113 R3 1 560R, SMD080514 R5 1 47K, SMD0805

Yamaichi: IC189-0282-15 U1 1 SOP28DW socket 04216 U2 0 TSSOP DNP



http://www.ti.com


12pF

12pF

GN

D

GN

D

100nF

33

0R

10uF

/10V

-

0R

GN

D

GN

D

gre

en

2.2

nF

47

kG

ND

0R

0R

33

0R

MS

P430F

12xx

If exte

rnal s

upply

volta

ge:

rem

ove R

11 a

nd a

dd R

10 (0

Ohm

)

3.1

MS

P-T

S4

30

PW

28

:

OT

S-2

8-0

.65-0

1S

ocket: E

npla

s

Vcc

int

ext

Targ

et S

ocket B

oard

for M

SP

430

's in

PW

28 p

ackage

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

JTA

G ->

SB

W ->

JTA

G-M

ode s

ele

ctio

n:

4-w

ire J

TA

G: S

et ju

mpers

JP

4 to

JP

9 to

positio

n 2

-32-w

ire "S

pyB

iWire

": Set ju

mpers

JP

4 to

JP

9 to

positio

n 1

-2

DN

P

1 3 5 7 9 11

13

2 4 6

12

148

10

JTA

G

C2C1

C4

R1

12

34

56

78

91

0

BO

OT

ST

C3

R2

R3

123

J5

JP

1

1 2 3

JP

2

1 212J

P3

D1

C5

R4

JP

4

1 2 3

JP

5

1 2 3

JP

6

1 2 3

JP

7

1 2 3

JP

8

1 2 3

JP

9

1 2 3

R5

R6

21

Q1

R7

J1

12345678910

11

12

13

14

J2

1 2 3 4 5 6 7 8 91

011

12

13

14

U1 TS

T1

VC

C2

P2

.53

VS

S4

XO

UT

5

XIN

6

RS

T7

P2

.08

P2

.19

P2

.21

0P

2.3

19

P2

.42

0P

1.0

21

P1

.12

2P

1.2

23

P1

.32

4P

1.4

25

P1

.52

6P

1.6

27

P1

.72

8

P3

.011

P3

.11

2

P3

.21

3

P3

.31

4P

3.4

15

P3

.51

6P

3.6

17

P3

.71

8

P1.0

P1.0

RS

T/N

MI

TM

ST

DI

VC

C

GN

D

GN

D

VC

C430

VC

C430

P2.0

P1.1

P1.1

P3.3

P3.2

P3.1

P3.0

P2.2

P2.2

XIN

/P2.6

XIN

/P2.6

XO

UT

/P2.7

XO

UT

/P2.7

P2.1

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

P3.4

P3.5

P3.6

P3.7

P2.3

P2.4

P1.2

P1.3

P1.4

/TC

K

P1.4

/TC

K

P1.5

/TM

S

P1.5

/TM

S

P1.6

/TD

I

P1.6

/TD

I

P1.7

/TD

O

P1.7

/TD

O

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

P2.5

TC

K/S

BW

TC

K

TD

O/S

BW

TD

IO

XT

LG

ND

Ext_

PW

R

+


B.9 MSP-TS430PW28




http://www.ti.com







Jumper JP4 to JP9:Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode




Connector J5External power connectorJumper JP1 to “ext”





http://www.ti.com



Table B-10. MSP-TS430PW28 Bill of Materials (1)

No. perPos. Ref Des Description Digi-Key Part No. CommentBoardDNP: C1, C2 , Cover holes1 C1, C2 0 12pF, SMD0805 while soldering

2 C3 1 10uF, 10V Tantal Elko B3 C4 1 100nF, SMD08054 C5 0 2.2nF, SMD0805 DNP5 D1 1 LED green SMD0603

Micro Crystal MS1V-T1K DNP: Cover holes and6 Q1 0 QUARZ, Crystal 32.768kHz, C(Load) = neighboring holes while

12.5pF solderingDNP: Headers andreceptacles enclosed withkit.Keep vias free of solder.7 J1, J2 2 14-pin header, TH male: Header: ReceptacleDNP: headers andreceptacles enclosed withkit.Keep vias free of solder.7.1 2 14-pin header, TH female: Header: Receptacle

8 J5, IP1 1 3-Pin Connector , maleJP1, JP4,JP5, JP6,8a 7 3-Pin Connector , male Jumper on Pos 1-2JP7, JP8,

JP99 JP2, JP3 2 2-Pin Connector , male with Jumper

DNP: Cover holes while10 BOOTST 0 ML10, 10-Pin Conn. , m RS: 482-115 soldering11 JTAG 1 ML14, 14-Pin Conn. , m RS: 482-12112 R1, R7 2 330R, SMD0805

R2, R3, R5,12 0 0R, SMD0805 DNPR614 R4 1 47K, SMD080515 U1 1 SOP28PW socket Enplas: OTS-28-0.65-01

(1) PCB 66 x 79 mm, two layers; Rubber stand off, four pieces



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JTAG Mode selection:

4-wire JTAG: Set jumpers J4 to J9 to position 2-3

2-wire "SpyBiWire": Set jumpers J4 to J9 to position 2-1

www.ti.com MSP-TS430PW28A

B.10 MSP-TS430PW28A

Figure B-19. MSP-TS430PW28A Target Socket Module, Schematic



http://www.ti.com












MSP-TS430PW28A www.ti.com

Figure B-20. MSP-TS430PW28A Target Socket Module, PCB (Red)

NOTE: For bootloader use, the BSL connector and only one of the resistors R2 or R3 need to bepopulated. If the board is supplied internally, R3 (0 Ω) must be assembled. If the board issupplied externally, R2 (0 Ω) must be assembled, and R3 must be removed.



http://www.ti.com


www.ti.com MSP-TS430PW28A

Table B-11. MSP-TS430PW28A Bill of Materials

No. perPosition Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP2 C5 1 2.2nF, SMD08053 C3 1 10uF, 10V, SMD08054 C4, C6, 2 100nF, SMD0805 478-3351-2-ND5 D1 1 green LED, SMD0805 P516TR-ND

DNP: Headers and receptacles6 J1, J2 0 14-pin header, TH enclosed with kit. Keep vias free of

solder: (Header and Receptacle)J5, JP1,

JP4, JP5, Place jumper on 1-2 of JP4-JP9 Place7 8 3-pin header, male, TH SAM1035-03-NDJP6, JP7, on 1-2 on JP1JP8, JP9

8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header9 9 Jumper 15-38-1024-ND see Pos 7 an 8

14-pin connector, male,10 JTAG 1 HRP14H-NDTH11 BOOTST 0 DNP Keep vias free of solder

Micro Crystal MS3V12 Q1 0 Crystal 32.768kHz, C(Load) = DNP: keep vias free of solder

12.5pF13 R1, R7 2 330 Ω, SMD0805 541-330ATR-ND

R2, R3,R5,14 0 0 Ohm, SMD0805 541-000ATR-ND DNP R2, R3,R5, R6R6,15 R4 1 47k Ω, SMD0805 541-47000ATR-ND16 U1 1 Socket: OTS-28-0.65-01 Manuf.: Enplas17 PCB 1 63.5 x 64.8 mm 2 layers

Adhesive Approximately 6mm width, for example, 3M Bumpons18 4 Apply to corners at bottom sideplastic feet 2mm height Part No. SJ-530219 MSP430 2 MSP430G2553IPW28 DNP: enclosed with kit, supplied by TI



http://www.ti.com


DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

GN

D

0R

330R

2.2

nF

PWR3

GN

D

GN

D

0R

47K

470nF

100nF

100nF

10uF

GN

D

GND

20k/0

.1%

10k

10k

10k

10k

GN

DAV

SS

AVSS

10k

10k

10k

10k

GN

D

SA

M1

02

9-0

8-N

D1

-8

SA

M1

02

9-0

8-N

D9

-16

MS

P4

30

I20

40

TR

HB

QF

N11

T0

32

-00

3

SA

M1

02

9-0

8-N

D1

7-2

41

7-2

4

SA

M1

02

9-0

8-N

D2

5-3

2

1.0

for M

SP

43

0i2

04

0

MS

P4

30

:Ta

rge

t-So

cke

tM

SP

-TS

43

0R

HB

32

A

DN

P

<-

SB

W

<-

JTA

G

Vcc

int

ext

So

cke

t:Ya

ma

ich

iQ

FN

11

T0

32

-00

3

1 3 5 7 9 11 13

2 4 6

12

148

10

JTA

GR1

R3

C8

J51

2

3

JP

112

1

2

JP

2

R4

123

JP

4123

JP

9123

JP

8123

JP

7123

JP

6123 JP

5

R5

D1

C9

1 2 3

JP

3

C14

C13

C12

R2

R6

R8

R9

R10

R11

R12

R13

R14

12345678

J1

910

1112

13

14

15

16

J2

A0.0

+1

A0.0

-2

A1.0

+3

A1.0

-4

A2.0

+5

A2.0

-6

A3.0

+7

A3.0

-8

VR

EF

9

AV

SS

10

RO

SC

11

DV

SS

12

VC

C13

VC

OR

E14

P2.3

/VM

ON

IN28

P2.2

/TA

1.2

27

P2.1

/TA

1.1

26

P2.0

/TA

1.0

/CLK

IN25

P1.7

/UC

B0S

DA

/UC

B0S

IMO

/TA

1C

LK

24

P1.6

/UC

B0S

CL/U

CB

0S

OM

I/TA

0.2

23

P1.5

/UC

B0C

LK

/TA

0.1

22

P1.4

/UC

B0S

TE

/TA

0.0

21

P1

.3/U

CA

0T

XD

/UC

A0S

IMO

/TA

0C

LK

/TD

O/T

DI

20

P1.2

/UC

A0R

XD

/UC

A0S

OM

I/AC

LK

/TD

I/TC

LK

19

P1.1

/UC

A0C

LK

/SM

CLK

/TM

S18

P1.0

/UC

A0S

TE

/MC

LK

/TC

K17

TE

ST

/SB

WT

CK

16

RS

T/N

MI/S

BW

TD

IO15

U1

P2.4

/TA

1.0

29

P2.5

/TA

0.0

30

P2.6

/TA

0.1

31

P2.7

/TA

0.2

32

17

18

19

20

21

22

23

24

J3

25

26

27

28

29

30

31

32

J4

TM

S

TM

S

TD

I

TD

I

TD

O

TD

O

TD

O

VC

C

GN

D

GN

D

P1

.4

P1

.4

DV

CC

DV

CC

DV

CC

AV

SS

M

M

I

I

O

O

RS

T/N

MI

RS

T/N

MI

TC

K

TC

K

TC

KC

CT

ES

T/S

BW

TC

K

TE

ST

/SB

WT

CK

VC

OR

E

A0

.0+

A0

.0-

A1

.0+

A1

.0-

VR

EF

RO

SC

RS

T

RS

T

RS

T

A2

.0+

A2

.0-

A3

.0+

A3

.0-

P1

.5P

1.6

P1

.7

P2

.0P

2.1

P2

.2P

2.3

P2

.4P

2.5

P2

.6P

2.7

MSP-TS430RHB32A www.ti.com

B.11 MSP-TS430RHB32A

Figure B-21. MSP-TS430RHB32A Target Socket Module, Schematic



http://www.ti.com





Connector J5External power connectorJumper JP3 to “ext”


Jumper JP4 to JP9Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode

Jumper JP31-2 (int): Power supply from JTAG interface2-3 (ext): External power supply


P1

.4

14

1

2

GN

D

GN

D

VC

C

12

3

123

15

8

916

17

24

20

25 3230

Vccext int

MS

P-T

S4

30

RH

B3

2A

Re

v.:1

.0R

oH

S

SBWJTAG

1

Cu

rr.M

ea

s.

JTA

G

R1

R3

C8

J5

JP

1

JP

2

R4

JP

4

JP

9

JP

8

JP

7

JP

6

JP

5

R5

D1

C9

JP

3

C1

4

C13

C12

R2

R6

R8

R9

R10

R11

R12

R13

R14

J1

J2

U1

J3

J4

12

3

12

3

12

3

12

3

12

3

www.ti.com MSP-TS430RHB32A

Figure B-22. MSP-TS430RHB32A Target Socket Module, PCB



http://www.ti.com


MSP-TS430RHB32A www.ti.com

Table B-12. MSP-TS430RHB32A Bill of Materials

No. perPos. Ref Des Description Digi-Key Part No. CommentBoard1 PCB 1 76.9 x 67.6 mm MSP-TS430RHB32A Rev. 1 2 layers, red solder mask2 D1 1 green LED, DIODE0805 P516TR-ND3 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND place jumper on header4 JP3, JP4, 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2

JP5, JP6, (SBW)JP7, JP8,JP9

5 R1, R4 2 0R, 0805 541-0.0ATR-ND6 C8 1 2.2nF, CSMD0805 490-1628-2-ND DNP7 R6, R8, R9, 8 10k, 0805 311-10KARTR-ND DNP

R10, R11,R12, R13,R14

8 C12 1 10uF, CSMD0805 445-1371-2-ND9 R2 1 20k/0.1%, 0805 P20KDACT-ND10 R5 1 47K, 0805 311-47KARTR-ND11 C13, C14 2 100nF, CSMD0805 311-1245-2-ND12 R3 1 330R, 0805 541-330ATR-ND13 C9 1 470nF, CSMD0805 445-1357-2-ND14 J1, J2, J3, J4 1 8-pin header, TH SAM1029-08-ND DNP: headers and

receptacles, enclosed withkit.Keep vias free of solder.

15 J1, J2, J3, J4 1 8-pin receptable, TH SAM1213-08-ND DNP: headers andreceptacles, enclosed withkit.Keep vias free of solder.

16 JTAG 1 14-pin connector, male, TH HRP14H-ND17 U1 1 Socket QFN11T032-003 Manuf.: Yamaichi18 U1 1 MSP430i2041TRHB DNP: enclosed with kit.

Is supplied by TI19 J5 1 3-pin header, male, TH SAM1035-03-ND20 Rubber stand 4 Buerklin: 20H1724 apply to corners at bottom

off side



http://www.ti.com


12

pF

12

pF

GN

D

GN

D

10

0n

F

560R

10

uF

/10

V

47k

10nF

-

0R

GN

D

MS

P4

30

F2

27

4ID

A

GN

D330R

GN

D

ye

llow

If exte

rna

l su

pp

ly v

olta

ge

:re

mo

ve

R11

an

d a

dd

R1

0 (0

Oh

m)

IC1

89

-03

82

-03

7

So

cke

t:

4-w

ire J

TA

G:

2-w

ire "S

pyB

iWire

":

JTA

G-M

od

e s

ele

ctio

n:

Se

t jum

pe

rs J

P4

to J

P9

to p

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www.ti.com MSP-TS430DA38

B.12 MSP-TS430DA38

Figure B-23. MSP-TS430DA38 Target Socket Module, Schematic



http://www.ti.com


Orient pin 1 of MSP430 device



Jumper JP1 to "ext"








MSP-TS430DA38 www.ti.com

Figure B-24. MSP-TS430DA38 Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430DA38

Table B-13. MSP-TS430DA38 Bill of Materials

No. perPos. Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP2 C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND3 C5 1 100nF, SMD0805 478-3351-2-ND4 C8 0 2.2nF, SMD0805 DNP5 D1 1 green LED, SMD0603 475-1056-2-ND

DNP: headers andreceptacles enclosed withkit.Keep vias free of solder.6 J1, J2 0 19-pin header, TH


"J3, JP1, Place jumpers on headersJP4, JP5,7 8 3-pin header, male, TH SAM1035-03-ND JP1, JP4,JP5, JP6, JP7, JP8,JP6, JP7, JP9; Pos 1-2JP8, JP9"8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header9 9 Jumper 15-38-1024-ND Place on: JP1 - JP9; Pos 1-210 JTAG 1 14-pin connector, male, TH HRP14H-ND

DNP: Keep vias free of11 BOOTST 0 10-pin connector, male, TH solderMicro Crystal MS1V-T1K DNP: Keep vias free of12 Q1 0 Crystal 32.768kHz, C(Load) = solder12.5pF

13 R1, R3 2 330 Ω, SMD0805 541-330ATR-ND14 R10, R11 0 0 Ω, SMD0805 541-000ATR-ND DNP15 R5 1 47k Ω, SMD0805 541-47000ATR-ND16 U1 1 Socket: IC189-0382--037 Manuf.: Yamaichi17 PCB 1 67 x 66 mm 2 layers

Adhesive for example, 3M Bumpons Apply to corners at bottom18 4 ~6mm width, 2mm heightPlastic feet Part No. SJ-5302 sideDNP: enclosed with kit19 MSP430 2 MSP430F2274IDA supplied by TI



http://www.ti.com


MSP-TS430QFN23x0 www.ti.com

B.13 MSP-TS430QFN23x0

Figure B-25. MSP-TS430QFN23x0 Target Socket Module, Schematic



http://www.ti.com











www.ti.com MSP-TS430QFN23x0

Figure B-26. MSP-TS430QFN23x0 Target Socket Module, PCB




http://www.ti.com


MSP-TS430QFN23x0 www.ti.com

Table B-14. MSP-TS430QFN23x0 Bill of Materials

No. perPos. Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP2 C3 1 10uF, 10V, Tantal Size B 511-1463-2-ND3 C4 1 100nF, SMD0805 478-3351-2-ND4 C5 1 10nF, SMD0805 478-1383-2-ND5 D1 1 green LED, SMD0603 475-1056-2-ND

DNP: headers andreceptacles enclosed withkit.Keep vias free of solder.6 J1, J2, J3, J4 0 10-pin header, TH


Place jumper on header JP1;7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND Pos 1-2.8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header9 3 Jumper 15-38-1024-ND Place on: JP1, JP2, JP310 JTAG 1 14-pin connector, male, TH HRP14H-ND


13 R1 1 330 Ω, SMD0805 541-330ATR-ND14 R2, R3 0 0 Ω, SMD0805 541-000ATR-ND DNP15 R4 1 47k Ω, SMD0805 541-47000ATR-ND16 U1 1 Socket: QFN-40B-0.5-01 Manuf.: Enplas17 PCB 1 79 x 66 mm 2 layers

Adhesive for example, 3M Bumpons Apply to corners at bottom18 4 ~6mm width, 2mm heightPlastic feet Part No. SJ-5302 sideDNP: enclosed with kit19 MSP430 2 MSP430F2370IRHA supplied by TI



http://www.ti.com


www.ti.com MSP-TS430RSB40

B.14 MSP-TS430RSB40

Figure B-27. MSP-TS430RSB40 Target Socket Module, Schematic



http://www.ti.com









Connector BOOTSTFor ToolBootloader



MSP-TS430RSB40 www.ti.com

Figure B-28. MSP-TS430RSB40 Target Socket Module, PCB




http://www.ti.com


www.ti.com MSP-TS430RSB40

Table B-15. MSP-TS430RSB40 Bill of Materials

No. PerPos. Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP: C1, C2

C3, C7, C10,2 3 10uF, 10V, SMD 0805 445-1371-1-ND DNP C12C12C4, C6, C8,3 3 100nF, SMD0805 311-1245-2-ND DNP C11C11

4 C5 1 2.2nF, SMD08055 C9 1 470nF, SMD08056 D1 1 green LED, SMD0805 P516TR-ND

DNP: headers and receptaclesenclosed with kit. Keep viasfree of solder.7 J1, J2, J3, J4 4 10-pin header, TH: Header: ReceptacleDNP: headers and receptaclesenclosed with kit. Keep viasfree of solder.7.1 4 10-pin header, TH: Header: Receptacle

JP1, JP4,JP5, Jumper: 1-2 on JP1, JP10; 2-38 JP6, JP7, JP8, 9 3-pin header, male, TH SAM1035-03-ND on JP4-JP9JP9, J5, JP109 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND place jumper on header10 JTAG 1 14-pin connector, male, TH HRP14H-ND11 BOOTST 0 10-pin connector, male, TH DNP. Keep vias free of solder

QFN-40B-0.4_12 U1 1 EnplasENPLAS_SOCKETMicro Crystal MS3V-T1R DNP: Q1. Keep vias free of13 Q1 0 Crystal 32.768kHz, C(Load) = 12.5pF solder

Place on: JP1, JP2, JP3, JP4,15 10 Jumper 15-38-1024-ND JP5, JP6, JP7, JP8, JP9, JP1016 R1,R7 2 330R SMD0805

R2, R3, R5,17 R6, R8, R9, 3 0R SMD0805 DNP R2, R3, R5, R6

R1018 R4 1 47k SMD0805

DNP: enclosed with kit. Is19 MSP430 2 MSP430F5132 supplied by TIRubber stand select appropriate; for example,20 4 apply to corners at bottom sideoff Buerklin: 20H1724



http://www.ti.com


MSP-TS430RHA40A www.ti.com

B.15 MSP-TS430RHA40A

Figure B-29. MSP-TS430RHA40A Target Socket Module, Schematic



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www.ti.com MSP-TS430RHA40A

Figure B-30. MSP-TS430RHA40A Target Socket Module, PCB



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MSP-TS430RHA40A www.ti.com

Table B-16. MSP-TS430RHA40A Bill of Materials

No. perPosition Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP: C1, C22 C5 0 2.2nF, SMD0805 DNP C123 C3, C7 2 10uF, 10V, SMD0805 5 DNP C114 C4, C6 2 100nF, SMD0805 478-3351-2-ND5 C9 1 470nF, SMD08056 D1 1 green LED, SMD0805 P516TR-ND

DNP: headers and receptacles enclosedwith kit. Keep vias free of solder.J1, J2, J3,7 4 10-pin header, THJ4 : Header: ReceptacleDNP: headers and receptacles enclosedwith kit. Keep vias free of solder.

7.1 4 10-pin header, TH : Header: Receptacle

J5, JP1,JP4, JP5, Place jumper on 1-2 of JP4-JP9; Place8 8 3-pin header, male, TH SAM1035-03-NDJP6, JP7, on 1-2 on JP1JP8, JP9

9 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND place jumper on header10 9 Jumper 15-38-1024-ND see Pos 8 an 9

14-pin connector, male,11 JTAG 1 HRP14H-NDTH10-pin connector, male,12 BOOTST 0 DNP. Keep vias free of solderTH

13 U1 1 Socket: QFN-40B-0.5-01 Manuf.: EnplasMicro Crystal MS3V-T1R

14 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1. Keep vias free of solder12.5pF

15 R1,R7 2 330R SMD0805 541-330ATR-NDR2, R3, R5,16 2 0 Ohm, SMD0805 541-000ATR-ND DNP:R2, R3, R5, R6R6, R8, R9,

17 R4 1 47k SMD080518 PCB 1 79 x 66 mm 2 layers

select appropriate; forRubber19 4 example, Buerklin: apply to corners at bottom sidestand off 20H172420 MSP430 2 MSP430N5736IRHA DNP: enclosed with kit. Is supplied by TI



http://www.ti.com


ML

14

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:11/1

4/2

006 1

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4 P

MS

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1/1 R

EV

:

TIT

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www.ti.com MSP-TS430DL48

B.16 MSP-TS430DL48

Figure B-31. MSP-TS430DL48 Target Socket Module, Schematic



http://www.ti.com







Jumper JP2 to "ext"




MSP-TS430DL48 www.ti.com

Figure B-32. MSP-TS430DL48 Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430DL48

Table B-17. MSP-TS430DL48 Bill of Materials

No. perPos. Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP2 C4, C7 2 10uF, 10V, Tantal Size B 511-1463-2-ND3 C3, C5 2 100nF, SMD0805 478-3351-2-ND4 C8 1 10nF, SMD0805 478-1383-2-ND5 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND

DNP: Headers andreceptacles enclosed withkit.Keep vias free of solder.6 J1, J2 0 24-pin header, TH


Place jumper on header JP1;7 J3, JP1, JP2 2 3-pin header, male, TH SAM1035-03-ND Pos 1-2. DNP: JP28 J4, J5 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header9 3 Jumper 15-38-1024-ND Place on: JP1, J4, J510 JTAG 1 14-pin connector, male, TH HRP14H-ND


13 R3 1 560 Ω, SMD0805 541-560ATR-NDR4, R6, R7,14 2 0 Ω, SMD0805 541-000ATR-ND DNP: R6, R7R12

15 R5 1 47k Ω, SMD0805 541-47000ATR-ND16 U1 1 Socket: IC51-1387 KS-15186 Manuf.: Yamaichi17 PCB 1 58 x 66 mm 2 layers

Adhesive for example, 3M Bumpons Apply to corners at bottom18 4 ~6mm width, 2mm heightPlastic feet Part No. SJ-5302 sideDNP: Enclosed with kit19 MSP430 2 MSP430F4270IDL supplied by TI



http://www.ti.com


MSP-TS430RGZ48B www.ti.com

B.17 MSP-TS430RGZ48B

Figure B-33. MSP-TS430RGZ48B Target Socket Module, Schematic



http://www.ti.com











www.ti.com MSP-TS430RGZ48B

Figure B-34. MSP-TS430RGZ48B Target Socket Module, PCB

NOTE: For bootloader use, the BSL connector and only one of the resistors R10 or R11 must bepopulated. If the board is supplied internally, R11 (0 Ω) must be assembled. If the board issupplied externally, R10 (0 Ω) must be assembled, and R11 must be removed.



http://www.ti.com


MSP-TS430RGZ48B www.ti.com

Table B-18. MSP-TS430RGZ48B Bill of Materials

No. perPosition Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP2 C3, C4 0 47pF, SMD0805 DNP3 C6, C7, C12 3 10uF, 6.3V, SMD0805

C5, C11,4 4 100nF, SMD0805 311-1245-2-NDC13, C145 C8 1 2.2nF, SMD08056 C9 1 470nF, SMD0805 478-1403-2-ND7 D1 1 green LED, SMD0805 P516TR-ND

SAM1029-12-ND DNP: Headers and receptaclesJ1, J2, J3,8 0 12-pin header, TH (Header) SAM1213-12- enclosed with kit. Keep vias free ofJ4 ND (Receptacle) solder:9 J5 1 3-pin header, male, TH

JP3, JP5, place jumpers on pins 2-3 on JP5, JP6,JP6, JP7,10 7 3-pin header, male, TH SAM1035-03-ND JP7, JP8, JP9, JP10 place jumpers onJP8, JP9, pins 1-2 on JP3,JP1011 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header12 9 Jumper 15-38-1024-ND See Pos. 10and Pos. 11

14-pin connector, male,13 JTAG 1 HRP14H-NDTH10-pin connector, male,14 BOOTST 0 "DNP Keep vias free of solder"TH

Micro Crystal MS3V-T1R15 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1 Keep vias free of solder

12.5pFQ2: 4MHz Buerklin:16 Q2 0 Crystal DNP: Q2 Keep vias free of solder78D134http://www.ettinger.de/Art_Insulating17 0 Insulating disk to Q2 Detail.cfm?ART_ARTNUMdisk to Q2 =70.08.121

18 R3, R7 2 330 Ω, SMD0805 541-330ATR-NDR1, R2, R4,

R6, R8,19 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12R9,R10,R11, R12

20 R5 1 47k Ω, SMD0805 541-47000ATR-NDSocket: QFN11T048-21 U1 1 Manuf.: Yamaichi008_A101121_RGZ48

22 PCB 1 81 x 76 mm 2 layersAdhesive Approximately 6mm width, for example, 3M Bumpons23 4 Apply to corners at bottom sideplastic feet 2mm height Part No. SJ-5302

24 MSP430 2 MSP430F5342IRGZ DNP: enclosed with kit, supplied by TI



http://www.ti.com


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13_PJ.1_TDI13

14_PJ.2_TMS14

15_PJ.3/TCK15

16_P4.016

17_P4.117

18_P4.218

19_P4.319

20_P2.520

21_P2.621

22_TEST/SBWTCK22

23_RST/SBWTDIO23

24_P2.024

25_P

2.1

25

26_P

2.2

26

27_P

3.4

27

28_P

3.5

28

29_P

3.6

29

30_P

3.7

30

31_P

1.6

31

32_P

1.7

32

33_P

4.4

33

34_P

4.5

34

35_P

4.6

35

36_D

VS

S36

37_DVCC 3738_P2.7 3839_P2.3 3940_P2.4 40

41_AVSS 4142_HFXIN 42

43_HFXOUT 4344_AVSS 4445_LFXIN 45

46_LFXOUT 4647_AVSS 4748_AVCC 48

U1

SW

1

R13

TP2TP1

SW2

R14

P1.0

P1.0

RS

T/N

MI

TM

ST

DI

VC

C

GN

D

P1.1

P1.1

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IORST/SBWTDIO

TC

K/S

BW

TC

K

TD

O/S

BW

TD

IO

PJ.0

/TD

O

PJ.0

/TD

O

PJ.2

/TM

S

PJ.2/TMS

PJ.3

/TC

K

PJ.3/TCK

PJ.1

/TD

I

PJ.1/TDI

P1.2

P1.2

P2.0

P2.0

P2.1

P2.1

P1.3

P1.3

P1.4

P1.5

AVCC

AV

CC

AVSS

AV

SS

AVSS

AVSS

LF

XO

UT

LF

XIN

LF

GN

DH

FG

ND

HF

XO

UT

HF

XIN

P2.4P2.3P2.7DVCC

DV

CC

DV

CC

DVCC

DV

SS

DV

SS

P4.6

P4.5

P4.4

P1.7

P1.6

P3.7

P3.6

P3.5

P3.4

P2.2

P2.6P2.5P4.3P4.2P4.1P4.0

P4.7

P3.3

P3.2

P3.1

P3.0

TE

ST

/SB

WT

CK

1

TE

ST

/SB

WT

CK

1

TEST/SBWTCK

TE

ST

/SB

WT

CK

www.ti.com MSP-TS430RGZ48C

B.18 MSP-TS430RGZ48C

Figure B-35. MSP-TS430RGZ48C Target Socket Module, Schematic



http://www.ti.com



Connector J2External power connectorJumper J1 to "ext"


Switch SW1Device reset

LEDs connected toP1.0, P1.1, P1.2 viaJP9, JP10, JP11(only D1 assembled)




Jumper J11-2 (int): Power supply from JTAG interface


Jumper JP2Analog/digital power

Switch SW2Connected to P1.3

HF ands LF oscillators with capacitorsand resistors to connect pinheads

1

Vccext

int

Vcc

GND

GND

JTAG

SBW

5

10

1520

25

30

35

40 45

RESET

Ext.Pwr.

PWR

DVCCAVCC

TCK TMS TDI TDO

RST/SBWTDIO TEST/SBWTCK

GND

GND

P1

.3

14

1

2

10

1

2

12

3

123

123

123

123

123

123

QFN11T048-008 A101121

Clamshell

MSP-TS430RGZ48CRev. 1.2 RoHS

Q2

Q1

P1

.0

P1

.1

P1

.2

JTA

G

C2

C1

C4

R1

BO

OT

ST

R2

R3

J2

J1

JP

1

JP

9

C5

R4

JP3JP4JP5JP6JP7JP8

R5

R6

R7

C3

C6

C7

D1

R1

0JP

10

D2

R11

JP

11

D3

R1

2

JP

2

C8

C9

R8

R9

U1

SW

1

R1

3

TP2

TP1

SW

2

R1

4

MSP-TS430RGZ48C www.ti.com

Figure B-36. MSP-TS430RGZ48C Target Socket Module, PCB

NOTE: LFOSC and HFOSC pins are swapped at SV1.42_HFXIN (pin 42) → SV1 (pin 7)43_HFXOUT (pin 43) → SV1 (pin 6)45_LFXIN (pin 45) → SV1 (pin 10)46_LFXOUT (pin 46) → SV1 (pin 9)



http://www.ti.com


www.ti.com MSP-TS430RGZ48C

Table B-19. MSP-TS430RGZ48C Bill of MaterialsNumber

Pos Ref Des Per Description Digi-Key Part Number CommentBoard

1 SV1, SV2, SV3, 4 12-pin header, TH DNP: headers and receptacles enclosed with kit.SV4 Keep vias free of solder.

SAM1029-12-ND : Header

: Receptacle

1.1 SV1, SV2, SV3, 4 12-pin receptable, TH DNP: headers and receptacles enclosed with kit.SV4 Keep vias free of solder.

: Header

SAM1213-12-ND : Receptacle

2 JP1, JP2, JP9 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header

3 JP10, JP11 2 2-pin header, male, TH SAM1035-02-ND DNP

4 J1, JP3, JP4, JP5, 7 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3JP6, JP7, JP8

5 J2 1 3-pin header, male, TH SAM1035-03-ND

6 JP1, JP2, JP9, J1, 10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP9, J1, JP3, JP4, JP5, JP6,JP3, JP4, JP5, JP6, JP7, JP8JP7, JP8

7 R2, R3, R5, R6, R8, 9 DNP, 0805 DNPR9, R10, R11, R14

8 R12, R13, R7 3 0R, 0805 541-000ATR-ND

9 C5 1 1.1nF, CSMD0805 490-1623-2-ND

10 C3, C7 2 1uF, 10V, CSMD0805 490-1702-2-ND

11 R4 1 47k, 0805 541-47000ATR-ND

12 C4, C6 2 100nF, CSMD0805 311-1245-2-ND

13 R1 1 330R, 0805 541-330ATR-ND

14 C1, C2, C8, C9 4 DNP, CSMD0805 DNP

15 SW1, SW2 2 EVQ-11L05R P8079STB-ND DNP

16 BOOTST 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder

17 JTAG 1 14-pin connector, male, TH HRP14H-ND

18 Q1 1 DNP: MS3V-TR1 (32768kHz, depends on application Micro Crystal, DNP, enclosed in kit, keep vias free of20ppm, 12.5pF) solder

19 Q2 1 DNP, Christal depends on application DNP, keep vias free of solder

20 U1 1 Socket: QFN11T048-008 Manuf.: YamaichiA101121-001

20.1 U1 1 MSP430FR5969IRGZ DNP: enclosed with kit. Is supplied by TI.

21 D1 1 green LED, DIODE0805 P516TR-ND

22 D3 1 red (DNP), DIODE0805 DNP

23 D2 1 yellow (DNP), DIODE0805 DNP

24 TP1, TP2 2 Testpoint DNP, keep pads free of solder

25 Rubber stand off 4 Buerklin: 20H1724 apply to corners at bottom side

26 PCB 1 79.6 x 91.0 mm MSP-TS430RGZ48C 2 layers, black solder maskRev. 1.2



http://www.ti.com


ML

14

LED3

0R

12

pF

12

pF

12

pF

12

pF

GN

D

GND

0R

100nF

56

0R

ML

10

JP1Q

JP

1Q

10uF/6,3V

10uF/10V

47K10nF

0R

0R

0R

-

-

0R

-

0R

0R

FE

16

-1-1

FE16-1-2

FE

16

-1-3

FE16-1-4

PWR3

GN

DG

ND

-

MS

P6

4P

M

not assembled

not a

ssem

ble

d

not a

ssem

ble

d

not a

ssem

ble

d

enhancement

reserved forfuture

JTA

G

1 3 5 7 9 11

13

2 4 6

12

148

10

D1

R2

C2

C1

C3

C4

R1

C5

R3

BO

OT

ST

12

34

56

78

91

0

J71 2

J6

12

C6

C7

R5C8

R6

R7

R8

R9

R10

R11

R12

R13

R14

12345678910

11

12

13

14

15

16

J1

J2

17181920212223242526272829303132

J3

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49505152535455565758596061626364

J4

J5123

R4

Q1

LFXTCLK

XTCLK

U2

DV

CC

234567XIN

XO

UT

10

11

12

13

14

15

16

17181920212223242526272829303132

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

4950515253

TDOTDI

TMSTCKRST

596061

AVSSDVSSAVCC

RS

T/N

MI

TC

KT

MS

TD

IT

DO

VC

C

Da

te:

3/1

4/2

00

6 1

0:4

6:3

0A

MS

he

et:

1/1 R

EV

:

TIT

LE

:

Do

cu

me

nt N

um

be

r:

MS

P-T

S4

30

PM

64

+

+

1

MS

P-T

S4

30

PM

64

Ta

rge

t So

cke

t PM

64

Ya

ma

ich

iIC

51

-06

44

-80

7

So

cke

t:

1.2

for F

14

x a

nd

F4

1x

Op

en

J6

if LC

D

is c

on

ne

cte

d

If exte

rna

l su

pp

ly v

olta

ge

:re

mo

ve

R8

an

d a

dd

R9

(0 O

hm

)

If exte

rna

l su

pp

ly v

olta

ge

:re

mo

ve

R11

an

d a

dd

R1

0 (0

Oh

m)

Fo

r BS

Lu

sa

ge

ad

d:

R6

R7

R1

3 R

14

MS

P4

30

F1

4x : 0

0 o

pe

n o

pe

nM

SP

43

0F

41

x : o

pe

n o

pe

n 0

0

MSP-TS430PM64 www.ti.com

B.19 MSP-TS430PM64

NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not bemade.

Figure B-37. MSP-TS430PM64 Target Socket Module, Schematic



http://www.ti.com


Connector J5External power connectionRemove R8 and jumper R9

D1LED connected to pin 12






www.ti.com MSP-TS430PM64

Figure B-38. MSP-TS430PM64 Target Socket Module, PCB



http://www.ti.com


MSP-TS430PM64 www.ti.com

Table B-20. MSP-TS430PM64 Bill of Materials

No. perPos. Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP

DNP: Only recommendation.1.1 C3, C4 0 47pF, SMD0805 Check your crystal spec.2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND DNP: C63 C5 1 100nF, SMD0805 478-3351-2-ND4 C8 1 10nF, SMD0805 478-1383-2-ND5 C9 1 470nF, SMD0805 478-1403-2-ND6 D1 1 green LED, SMD0805 P516TR-ND

DNP: Headers and receptaclesenclosed with kit.Keep vias freeof solder.7 J1, J2, J3, J4 0 16-pin header, TH


8 J5 1 3-pin header, male, TH SAM1035-03-ND9 J6, J7 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header11 2 Jumper 15-38-1024-ND Place on: J6, J712 JTAG 1 14-pin connector, male, TH HRP14H-ND13 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder

Q1: Micro Crystal MS1V-T1K14 Q1, Q2 0 Crystal DNP: Keep vias free of solder32.768kHz, C(Load) = 12.5pF15 R3 1 330 Ω, SMD0805 541-330ATR-ND

R1, R2, R4,R6, R7, R8, DNP: R4, R6, R7, R9, R10,16 3 0 Ω, SMD0805 541-000ATR-NDR9, R10, R11, R11, R12, R13, R14

R12, R13, R1417 R5 1 47k Ω, SMD0805 541-47000ATR-ND18 U1 1 Socket: IC51-0644-807 Manuf.: Yamaichi19 PCB 1 78 x 75 mm 2 layers

Rubber20 4 select appropriate Apply to corners at bottom sidestandoffMSP430F2619IPM DNP: Enclosed with kit supplied21 MSP430 22 MSP430F417IPM by TI



http://www.ti.com


0R

12

pF

12

pF

GN

D

GN

D

0R

10

0n

F

33

0R

10

uF

/6.3

V

0R

0R

0R

0R

PWR3

GN

D

47

k

2.2

nF

33

0R

GN

D

GN

D

10

0n

F

GN

D

0R

0R

MS

P-T

S4

30

PM

64

ATa

rge

t So

cke

t

DN

P

Yam

aic

hi

IC51-0

644-8

07

Socket:

DN

P

1.1

for F

41

52

Open J

P1 if L

CD

is c

onnecte

d

JTA

G ->

SB

W ->

DN

P

DN

P

DN

P

DN

PD

NP

DN

PD

NP

Vccext

int

TE

ST

/SB

WT

CK

RS

T/S

BW

TD

IOP

7.0

/TD

OP

7.1

/TD

IP

7.2

/TM

SP

7.3

/TC

K

AD

D L

CD

-CA

P!

DN

PDN

P

JTA

G

1 3 5 7 9 11

13

2 4 6

12

148

10

R2

C2

C1 R

1

C5

R3

BO

OT

ST

12

34

56

78

91

0

C6

R1

0R

11

R1

3R

14

12345678910

11

12

13

14

15

16

J1

17181920212223242526272829303132

J2

J3

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49505152535455565758596061626364

J4

J5123

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32313029282726252423222120191817

16 12345678911

12

13

14

15

10

64636261605958575655545352515049

21

Q1

R4

C3

1 2 3JP

4JP

5

1 2 3

JP

6

1 2 3

JP

7

1 2 3

JP

8

1 2 3

R6

JP

9

1 2 3

12

JP

1

JP

2

1 2

JP

3

1 2 3

D1

C4R

5

R7

RS

T/N

MI

TM

ST

DI

VC

C

GN

D XT

LG

ND

TC

K/S

BW

TC

K

TD

O/S

BW

TD

IO

VC

C430

VC

C430

VC

C430

P5.1

P5.1 A

VC

C

AV

CC

AV

SS

AV

SS

P1.0

P1.1

XIN

XO

UT

A

AA

B

BB

C

C

D

D

E

E

F

F

Da

te:

3/2

9/2

011

3:0

7:0

2 P

MS

he

et:

1/1 R

EV

:

TIT

LE

:

Do

cu

me

nt N

um

be

r:

MS

P-T

S4

30

PM

64

A

+

TE

ST

/SB

WT

CK

RS

T/S

BW

TD

IO

If supplie

d lo

cally

: popula

te R

10 (0

R), re

move R

11

If supplie

d b

y in

terfa

ce: p

opula

te R

11 (0

R), re

move R

10

www.ti.com MSP-TS430PM64A

B.20 MSP-TS430PM64A

Figure B-39. MSP-TS430PM64A Target Socket Module, Schematic



http://www.ti.com











MSP-TS430PM64A www.ti.com

Figure B-40. MSP-TS430PM64A Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430PM64A

Table B-21. MSP-TS430PM64A Bill of Materials

Pos. Ref Des No. per Board Description Digi-Key Part No. Comment1 C1, C2, 0 12pF, SMD0805 DNP2 C3 0 2.2nF, SMD0805 DNP3 C6, 1 10uF, 10V, Tantal Size B 511-1463-2-ND4 C4, C5 2 100nF, SMD0805 478-3351-2-ND5 D1 1 green LED, SMD0805 P516TR-ND

DNP: Headers and receptaclesenclosed with kit. Keep viasfree of solder.6 J1, J2, J3, J4 0 16-pin header, TH


J5, JP3, JP4,7 JP5, JP6, JP7, 8 3-pin header, male, TH SAM1035-03-ND

JP8, JP98 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header9 2 Jumper 15-38-1024-ND Place on: J6, J710 JTAG 1 14-pin connector, male, TH HRP14H-ND11 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder

Micro Crystal MS1V-T1K12 Q1 0 Crystal DNP: Keep vias free of solder32.768kHz, C(Load) = 12.5pF13 R3, R6 2 330 Ω, SMD0805 541-330ATR-ND

R1, R2, R5, DNP: R5, R7, R9, R10, R11,14 R7, R9, R10, 2 0 Ω, SMD0805 541-000ATR-ND R13, R14R11, R13, R1415 R4 1 47k Ω, SMD0805 541-47000ATR-ND16 U1 1 Socket: IC51-0644-807 Manuf.: Yamaichi17 PCB 1 78 x 75 mm 4 layers

Rubber stand18 4 select appropriate Apply to corners at bottom sideoffDNP: Enclosed with kit19 MSP430 2 MSP430F4152IPM supplied by TI



http://www.ti.com


DN

P

DN

PD

NP

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

Socket:

Yam

aic

hi IC

51-0

644-8

07

12pF

12pF

100nF

33

0R

47

K

1.1nF

QUARZ5

10uF

/10V

0R

0R

LE

D_G

reen

33

0R

LE

D_G

reen

33

0R

LE

D_G

reen

EV

Q11

EV

Q11

MS

P430F

R413xIP

M / M

SP

430F

R203xIP

M

0R

0R

10

0n

F

10

0n

F

10

0n

F

10

0n

F

Ext_

PW

R

Vcc

ext

int

to m

easure

supply

curre

nt

JTA

G ->

SB

W ->

JTA

G-M

ode s

ele

ctio

n:

4-w

ire J

TA

G: S

et ju

mpers

J4 to

J9 to

positio

n 2

-32-w

ire "S

pyB

iWire

": Set ju

mpers

JP

4 to

JP

9 to

positio

n 2

-1

DN

P

DN

P

BS

LT

XB

SLR

X

MS

P-T

S430P

M64D

Targ

et S

ocket B

oard

for M

SP

430F

R413xIP

M a

nd M

SP

430F

R203xIP

M

1.0

Disconnect JP3 andJP4 before BSL use.

1 3 5 7 9 11

13

2 4 6

12

148

10

JTA

G

C2

C1

C4

R1

R4

C5

123

J5

12J

P3

1 2

JP

2

JP

1

1 2 3

JP

10

1 2 3

JP

9

1 2 3

JP

8

1 2 3

JP

7

1 2 3

JP

6

1 2 3

JP

5

1 2 3

Q1

C3

12

34

56

78

91

0

BS

LR

10

R11

D1

R5

D2

R6

D3

SW

1

SW

2

P4

.7/R

13

1

P4

.6/R

23

2

P4

.5/R

33

3

P7.5/L5 59

DV

SS

8

DV

CC

9

TE

ST

/SB

WT

CK

111

RS

T/N

MI/S

BW

TD

IO1

0

P1.0/UCA0TXD/UCA0SIMO/A024P1.1/UCA0RXD/UCA0SOMI/A123P1.2/UCA0CLK/A222P1.3/UCA0STE/A321P1.4/MCLK/TCK/A420P1.5/TA0CLK/TMS/A519P1.6/TA0.2/TDI/TCLK/A618P1.7/TA0.1/TDO/A717

P7.1/L1 63

P7.2/L2 62

P7.3/L3 61

P7.4/L4 60

P7.0/L0 64

P4

.4/L

CD

C2

4

P4

.3/L

CD

C1

5

P4

.2/X

OU

T6

P4

.1/X

IN7

P4

.0/T

A1

.11

2

P8

.3/T

A1

.21

3

P8

.2/T

A1

CL

K1

4

P5.5/L3727

P5.4/L3628

P5.3/UCB0SOMI/UCB0SCL/L3529

P5.2/UCB0SIMO/UCB0SDA/L3430

P5.1/UCB0CLK/L3331

P5.0/UCB0STE/L3232

P3.0/L8 56

P3.1/L9 55

P3.2/L10 54

P3.3/L11 53

P3.4/L12 52

P3.5/L13 51

P3.6/L14 50

P3.7/L15 49

P6

.0/L

16

48

P6

.1/L

17

47

P6

.2/L

18

46

P6

.3/L

19

45

P6

.4/L

20

44

P6

.5/L

21

43

P2

.0/L

24

40

P2

.1/L

25

39

P2

.2/L

26

38

P2

.3/L

27

37

P2

.4/L

28

36

P2

.5/L

29

35

P2

.6/L

30

34

P2

.7/L

31

33

P8

.1/A

1C

LK

/A9

15

P8

.0/S

MC

LK

/A8

16

P5.6/L3826P5.7/L3925

P6

.6/L

22

42

P6

.7/L

23

41

P7.6/L6 58

P7.7/L7 57

U1

12345678910

11

12

13

14

15

16

J1

17181920212223242526272829303132

J2

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

J3

49505152535455565758596061626364

J4

R2

R3

C6

C7

C8

C9

TP2TP1

12J

P4

XO

UT

XO

UT

GND

GND

GN

D

XIN

XIN

VC

C

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

TC

K

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

VC

C430

VC

C430

P1.4

/TC

K

P1.4/TCK

P1.5

/TM

S

P1.5/TMS

P1.6

/TD

I

P1.6/TDI

P1.7

/TD

O

P1.7/TDO

TD

O/S

BW

TD

IO

RS

T/N

MI

TM

ST

DI

P1.0

P1.0

P1.0

P1.1

P1.1

P1.1

P1.2

P1.2

P1.3

P1.3

P4.7

P4.7

P4.6

P4.6

P4.5

P4.5

P4.4

P4.4

P4.3

P4.3

BS

LIn

terfa

ce

1 2 3 4 5 6

1 2 3 4 5 6

Tite

l:

Datu

m:

Seite

1/1

MS

P-T

S430P

M64D

9/3

/2014 3

:08:1

8 P

MA

3

IH

GF

ED

CB

A AB

CD

EF

GH

I

File

:

Rev.:

MSP-TS430PM64D www.ti.com

B.21 MSP-TS430PM64D

Figure B-41. MSP-TS430PM64D Target Socket Module, Schematic



http://www.ti.com


P1.2

P1.1

P1.0

P1.3

RESET

VCCint

ext

JTAG->

SBW->

MS

P-T

S4

30

PM

64

DR

ev.

1.0

Ro

HS

Cu

rr.

Me

as. GND

GND

Disconnect JP3 andJP4 before BSL use!

14

1

2

GND

GND

VCC

12

3

12

3

12

3

12

3

12

3

12

3

12

3

10

1

2

IC51-0644-807

Clamshell

116

510

32 17202530

33

48

35

40

45

49 6455 60

JTA

G

C2

C1

C4

R1

R4 C5

J5

JP3

JP

2JP

1

JP

10

JP

9

JP

8

JP

7

JP

6

JP

5

Q1

C3

BS

L

R10

R11

D1

R5 D2

R6 D3

SW

1S

W2U1

J1

J2

J3

J4

R2

R3

C6

C7

C8

C9

TP2

TP1

JP4


Jumper JP1 to "ext"










www.ti.com MSP-TS430PM64D

Figure B-42. MSP-TS430PM64D Target Socket Module, PCB




http://www.ti.com


MSP-TS430PM64D www.ti.com

Table B-22. MSP-TS430PM64D Bill of Materials

No. perPos. Ref Des Description Digi-Key Part No. CommentBoard1 PCB 1 90x96 mm MSP-TS430PM64D Rev. 1.0 2 layers, 90x96mm, white solder

mask2 BSL 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder3 D1 1 Green LED, HSMG-C170, 516-1434-1-ND Avago, Farnell 5790852

DIODE08054 D2, D3 2 LED, DIODE0805 DNP5 JP2, JP3, 3 2-pin header, male, TH SAM1035-02-ND place jumper on header

JP46 JP1, JP5, 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3 (JTAG)

JP6, JP7,JP8, JP9,JP10

7 R1 1 330R, 0805 541-330ATR-ND8 R5, R6 2 330R, 0805 541-330ATR-ND DNP9 R2, R3, 4 0R, 0805 541-0.0ATR-ND DNP

R10, R1110 R4 1 47K, 0805 311-47KARTR-ND11 C1, C2 2 12pF, CSMD0805 709-1169-2-ND12 C3 1 10uF/10V, CSMD0805 445-1371-2-ND13 C4 1 100nF, CSMD0805 311-1245-2-ND14 C6, C7, 4 100nF, CSMD0805 311-1245-2-ND DNP

C8, C915 C5 1 1.1nF, CSMD0805 490-1623-2-ND16 J1, J2, J3, 1 16-pin header, TH SAM1029-16-ND DNP: headers and receptacles,

J4 enclosed with kit. Keep vias freeof solder.

17 J1, J2, J3, 1 16-pin receptable, TH SAM1213-16-ND DNP: headers and receptacles,J4 enclosed with kit. Keep vias free

of solder.18 JTAG 1 14-pin connector, male, TH HRP14H-ND19 U1 1 Socket IC51-0644-807 Manuf.: Yamaichi20 U1 2 MSP430FR4133IPM DNP: enclosed with kit. Is

supplied by TI.21 J5 1 3-pin header, male, TH SAM1035-03-ND22 Q1 1 Microcrystal 32768Hz, MS3V-T1R

(32.768kHz, 20ppm, 12.5pF)23 SW1, SW2 2 Panasonic EVQ11 P8079STB-ND DNP, Lacon: 125145924 Rubber 4 Buerklin: 20H1724 apply to corners at bottom side

stand off



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DN

P

Socket:

Yam

aic

hi C

51-0

644-8

07

I2C

UA

RT

P1.7

P2.1

Jum

pers

JP

3 to

JP

8C

lose 1

-2 to

debug in

Spy-B

i-Wire

mode.

Clo

se 2

-3 to

debug in

4-w

ire J

TA

G m

ode.

BS

LTool S

ele

ct:

Open =

BS

LC

onnecto

rC

losed =

JTA

G C

onnecto

r

DN

P

DN

P

GN

D

GN

D

100nF

33

0R

0R0R

GN

D

GN

D

1.1

nF

47

kG

ND

0R 0R

QU

AR

Z5

1uF

/10V

100nF

1uF/10V

gre

en

DN

P

yello

w (D

NP

) DN

P

red (D

NP

)

0R

GN

DD

NP

DN

P

0R0R

QUARZ5

EV

Q11

0R

DNP

DN

P

100nF

GN

D

100nF

GN

D

4u7

GN

D

MS

P4

30

FR

69

7X

PM

/RG

C

SAM1129-16-ND

SA

M1129-1

6-N

D

SAM1129-16-ND

SA

M1129-1

6-N

D

10

k1

0k

If exte

rna

l su

pp

ly v

olta

ge

:re

mo

ve

R3

an

d a

dd

R2

(0 O

hm

)

Ext_

PW

R

MS

P-T

S4

30

PM

64

F

Vcc

int

ext

DN

PD

NP

DN

P

JTA

G ->

SB

W ->

DN

P

DN

P

1.0

DN

P

DN

PD

NP

connectio

n b

y v

ia

Ta

rge

t So

cke

t Bo

ard

for M

SP

43

0F

R6

97

x/6

87

x d

evic

es

1 3 5 7 9 11

13

2 4 6

12

148

10

JTA

G

C9

C8

C4

R1

12

34

56

78

91

0

BS

L

R2R3

123

J2

1 2 3

J1

1 2

JP

1

12J

P9

C5

R4

1 2 3JP

3

1 2 3JP

4

1 2 3JP

5

1 2 3JP

6

1 2 3JP

7

1 2 3JP

8

R9 R8

Q2

C3

C11

C7

D1

R1

0

12J

P10

D2

R11

12J

P11

D3

R1

2

1 2

JP

2

C1

C2

R6R5

Q1

SW

1

R1

3

TP2TP1

SW2

R1

4

C10

C6

C15

P4

.3/U

CA

0S

OM

I/UC

A0

RX

D/U

CB

1S

TE

/S4

1

P1

.4/U

CB

0C

LK

/UC

A0

ST

E/T

A1

.0/S

32

P1

.5/U

CB

0S

TE

/UC

A0

CL

K/T

A0

.0/S

23

P1

.6/U

CB

0S

IMO

/UC

B0

SD

A/T

A0

.1/S

14

P1

.7/U

CB

0S

OM

I/UC

B0

SC

L/T

A0

.2/S

05

R3

3/L

CD

CA

P6

P6

.0/R

23

7

P6

.1/R

13

/LC

DR

EF

8

P6

.2/C

OU

T/R

03

9

P6

.3/C

OM

01

0

P6

.4/T

B0

.0/C

OM

1/S

30

11

P6

.5/T

B0

.1/C

OM

2/S

29

12

P6

.6/T

B0

.2/C

OM

3/S

28

13

P3

.0/U

CB

1C

LK

/TA

3.2

/S2

71

4

P3

.1/U

CB

1S

IMO

/UC

B1

SD

A/T

A3

.3/S

26

15

P3

.2/U

CB

1S

OM

I/UC

B1

SC

L/T

A3

.4/S

25

16

DVSS117

DVCC118

TEST/SBWTCK19

RST/NMI/SBWTDIO20

PJ.0/TDO/TB0OUTH/SMCLK/SRSCG121

PJ.1/TDI/TCLK/MCLK/SRSCG022

PJ.2/TMS/ACLK/SROSCOFF23

PJ.3/TCK/COUT/SRCPUOFF24

P3.3/TA1.1/TB0CLK/S2425

P3.4/UCA1SIMO/UCA1TXD/TB0.0/S2326

P3.5/UCA1SOMI/UCA1RXD/TB0.1/S2227

P3.6/UCA1CLK/TB0.2/S2128

P3.7/UCA1STE/TB0.3/S2029

P2.3/UCA0STE/TB0OUTH/S1930

P2.2/UCA0CLK/TB0.4/RTCCLK/S1831

P2.1/UCA0SOMI/UCA0RXD/TB0.5/DMAE0/S1732

P2

.0/U

CA

0S

IMO

/UC

A0

TX

D/T

B0

.6/T

B0

CL

K/S

16

33

P7

.0/T

A0

CL

K/S

15

34

P7

.1/T

A0

.0/S

14

35

P7

.2/T

A0

.1/S

13

36

P7

.3/T

A0

.2/S

12

37

P7

.4/S

MC

LK

/S11

38

DV

SS

239

DV

CC

240

P1

.3/T

A1

.2/A

3/C

341

P1

.2/T

A1

.1/T

A0

CL

K/C

OU

T/A

2/C

242

P1

.1/T

A0

.2/T

A1

CL

K/C

OU

T/A

1/C

1/V

RE

F+

/VE

RE

F+

43

P1

.0/T

A0

.1/D

MA

E0

/RT

CC

LK

/A0

/C0

/VR

EF

-/VE

RE

F-

44

P9

.4/A

12

/C1

245

P9

.5/A

13

/C1

346

P9

.6/A

14

/C1

447

P9

.7/A

15

/C1

548

AVCC149

AVSS150

PJ.4/LFXIN51

PJ.5/LFXOUT52

AVSS253

PJ.7/HFXOUT54

PJ.6/HFXIN55

AVSS356

P5.7/UCA1STE/TB0CLK/S1057

P4.4/UCB1STE/TA1CLK/S958

P4.5/UCB1CLK/TA1.0/S859

P4.6/UCB1SIMO/UCB1SDA/TA1.1/S760

P4.7/UCB1SOMI/UCB1SCL/TA1.2/S661

DVSS362

DVCC363

P4.2/UCA0SIMO/UCA0TXD/UCB1CLK/S564

U1

12345678910

11

12

13

14

15

16

J3

17181920212223242526272829303132

J433

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

J5

49505152535455565758596061626364

J6

12

JP

13

12

JP

14

12

JP

15

123

JP

16

1 2

JP17

1 2

JP18

R7

R1

5

P1.0

P1.0

RS

T/N

MI

TM

ST

DI

VC

C

GN

D

P1.1

P1.1

TC

K/S

BW

TC

K

TD

O/S

BW

TD

IO

PJ.0

/TD

O

PJ.0/TDO

PJ.2

/TM

S

PJ.2/TMS

PJ.3

/TC

K

PJ.3/TCK

PJ.1

/TD

I

PJ.1/TDI

P1.2

P1.2

P1.3

P1.3

AV

CC

AVCC

AV

SS

AVSS

AVSS

AVSS

HF

XO

UT

HF

XIN

HF

GN

D

LF

XIN

LF

XO

UT

DV

CC

DV

CC

DVCC

DVCC

DV

CC

DVCC

DV

CC

DV

CC

DV

SS

DVSS

DV

SS

DVSS

TE

ST

/SB

WT

CK

1

TE

ST

/SB

WT

CK

TEST/SBWTCK

TE

ST

/SB

WT

CK

LC

DC

AP

LC

DC

AP

RST/SBWTDIO

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

ST

E

ST

E

RX

D/S

IMO

RX

D/S

IMO

TX

D/S

OM

I/SD

A

TX

D/S

OM

I/SD

A

SP

ICLK

/SC

L

SP

ICLK

/SC

LS

PIC

LK

/SC

L1

SP

ICLK

/SC

L1

RX

D/S

IMO

1

RXD/SIMO1

TX

D/S

OM

I/SD

A1

P1.6

P1.6

P2.0

P2.0

LF

GN

D

1 2 3 4 5 6

1 2 3 4 5 6

Title

:

Da

te:

Pa

ge

1/1

MS

P-T

S4

30

PM

64

F

10

/20

/20

14

4:3

8:5

3 P

MA

3

IH

GF

ED

CB

A AB

CD

EF

GH

I

File

:

Re

v.:

www.ti.com MSP-TS430PM64F

B.22 MSP-TS430PM64F

Figure B-43. MSP-TS430PM64F Target Socket Module, Schematic



http://www.ti.com


1412

1012

IC51-0644-807

Clamshell

15

10

15

202530

35

40

45

50 55 60

R1

C11

D1

R1

0D

2

R11

D3

U1

J3

J4

J5

J6

R7

R15



LEDs connected toP1.0, P1.1, P1.2 from

JP9, JP10, JP11(only D1 assembled)





HF and LF oscillators with capacitorsand resistors to connect pinheads


Connector BSLFor Bootloader

Jumper JP1, JP2Open to measure

digital or analog current


BSL Tool SelectJumper JP13 to JP15Open = BSL ConnectorClose = JTAG Connector

Close JP17 and JP18to enable BSL pullups

BSL Interface SelectJumper J16

Close 1-2 for I CClose 2-3 for UART

2

Jumper Configuration UART BSL Configuration I C BSL Configuration2

JP17 and JP18 Open Close

JP16 Close 2-3 (UART) Close 1-2 (I2C)

This target board supports UART or I C BSL configuration. To select the configuration to use, set thejumpers as shown in the following table.

2

MSP-TS430PM64F www.ti.com

Figure B-44. MSP-TS430PM64F Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430PM64F

Table B-23. MSP-TS430PM64F Bill of Materials (BOM)

NumberPos. Ref Des per Description DigiKey Part Number Comment

Board1 PCB 1 90.0 x 92.5 mm MSP-TS430PM64F Rev. 1.0 2 layers, purple solder mask

JP1, JP2, JP9,2 6 2-pin header, male, TH SAM1035-02-ND place jumper on headerJP13, JP14, JP15,3 JP17, JP18 2 2-pin header, male, TH SAM1035-02-ND place jumper on header's pin1 only4 JP10, JP11 2 2-pin header, male, TH SAM1035-02-ND DNP, keep pads free of solder5 J1 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2

JP3, JP4, JP5, JP6,6 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3JP7, JP8, JP167 J2 1 3-pin header, male, TH SAM1035-03-ND8 R2, R5, R6, R8, R9 5 0R, 0805 541-0.0ATR-ND DNP9 R3, R12, R13 3 0R, 0805 541-0.0ATR-ND10 C5 1 1.1nF, CSMD0805 490-1623-2-ND11 C3, C7 2 1uF/10V, CSMD0805 490-1702-2-ND12 C15 1 4u7, CSMD0805 445-1370-1-ND DNP13 R7, R15 1 10k, 0805 541-10KATR-ND14 R4 1 47k, 0805 541-47KATR-ND15 C4, C6, C10, C11 4 100nF, CSMD0805 490-1666-1-ND16 R1 1 330R, 0805 541-330ATR-ND17 R10, R11 2 330R, 0805 541-330ATR-ND DNP18 R14 1 47k, 0805 541-47KATR-ND DNP19 C1, C2, C8, C9 4 DNP, CSMD0805 DNP20 SW2 1 EVQ-11L05R P8079STB-ND DNP, Lacon: 125145921 SW1 1 EVQ-11L05R P8079STB-ND DNP, Lacon: 1251459

DNP: headers enclosed with kit.22 J3, J4, J5, J6 4 16-pin header, TH SAM1029-16-ND Keep vias free of solder.DNP: receptacles enclosed with kit.23 J3, J4, J5, J6 4 16-pin receptacle, TH SAM1213-16-ND Keep vias free of solder.

24 TP1, TP2 2 Testpoint DNP, keep pads free of solder25 BSL 1 10-pin connector, male, TH HRP10H-ND26 JTAG 1 14-pin connector, male, TH HRP14H-ND27 U1 1 Socket:IC51-0644-807 Manuf. Yamaichi

DNP: enclosed with kit.28 U1 2 MSP430FR6972IPMR Is supplied by TI.DNP: MS3V-TR1 Micro Crystal, DNP, enclosed in kit,29 Q1 1 depends on application(32,768kHz/ 20ppm/12,5pF) keep vias free of solder

30 Q2 1 DNP, Crystal depends on application DNP, keep vias free of soldergreen LED, HSMG-C17031 D1 1 516-1434-1-ND Avago, Farnell 5790852DIODE0805

32 D3 1 red (DNP), DIODE0805 DNP33 D2 1 yellow (DNP), DIODE0805 DNP34 Rubber stand off 4 Buerklin: 20H1724 apply to corners at bottom side



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MSP-TS430RGC64B www.ti.com

B.23 MSP-TS430RGC64B

Figure B-45. MSP-TS430RGC64B Target Socket Module, Schematic



http://www.ti.com



Connector J5External power connectorJumper JP3 to "ext"Jumpers JP5 to JP10

Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode


If the system shouldbe supplied from LDOI (J6),close JP4 and set JP3 to "ext"







www.ti.com MSP-TS430RGC64B

Figure B-46. MSP-TS430RGC64B Target Socket Module, PCB




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MSP-TS430RGC64B www.ti.com

Table B-24. MSP-TS430RGC64B Bill of Materials

No. perPos. Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP2 C3, C4 0 47pF, SMD0805 DNP3 C6, C7, C10 3 10uF, 6.3V, SMD0805

C5, C11,4 C13, C14, 5 100nF, SMD0805 311-1245-2-ND

C155 C8 1 2.2nF, SMD08056 C9 1 470nF, SMD0805 478-1403-2-ND7 C16 1 4.7uF, SMD08058 C17 1 220nF, SMD08059 D1 1 green LED, SMD0805 P516TR-ND

SAM1029-16-ND (Header) DNP: Headers and receptacles enclosed10 J1, J2, J3, J4 0 16-pin header, TH SAM1213-16-ND with kit. Keep vias free of solder:(Receptacle)11 J5 , J6 2 3-pin header, male, TH

JP3, JP5, place jumpers on pins 2-3 on JP5, JP6,JP6, JP7,12 7 3-pin header, male, TH SAM1035-03-ND JP7, JP8, JP9, JP10 place jumpers onJP8, JP9, pins 1-2 on JP3,JP10JP1, JP2,13 3 2-pin header, male, TH SAM1035-02-ND Place jumper on headerJP4

14 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 1315 JTAG 1 14-pin connector, male, TH HRP14H-ND16 BOOTST 0 10-pin connector, male, TH "DNP Keep vias free of solder"



20 R3, R7 2 330 Ω, SMD0805 541-330ATR-NDR1, R2, R4,

R6, R8,21 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12R9,R10, R11,R12

22 R5 1 47k Ω, SMD0805 541-47000ATR-NDSocket: QFN11T064-006-23 U1 1 Manuf.: YamaichiN-HSP

24 PCB 1 85 x 76 mm 2 layersAdhesive Approximately 6mm width, for example, 3M Bumpons25 4 Apply to corners at bottom sideplastic feet 2mm height Part No. SJ-5302

26 D3,D427 MSP430 2 MSP430F5310 RGC DNP: enclosed with kit, supplied by TI



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www.ti.com MSP-TS430RGC64C

B.24 MSP-TS430RGC64CThe MSP-TS430RGC64C target board has been designed with the option to operate with the targetdevice DVIO input voltage supplied via header J6 (see Figure B-47). This development platform does notsupply the 1.8-V DVIO rail on board and it MUST be provided by external power supply for proper deviceoperation. For correct JTAG connection, programming, and debug operation, it is important to follow thisprocedure:1. Make sure that the VCC and DVIO voltage supplies are OFF and that the power rails are fully

discharged to 0 V.2. Enable the 1.8-V external DVIO power supply.3. Enable the 1.8-V to 3.6-V VCC power supply (alternatively, this supply can be provided from the MSP-

FET430UIF JTAG debugger interface).4. Connect the MSP-FET430UIF JTAG connector to the target board.5. Start the debug session using IAR or CCS IDE.

For more information on debugging the MSP4and MSP430F525x, see the device-specific data sheets(MSP430F522x: SLAS718; MSP430F525x: SLAS903) and Designing with MSP430F522x andMSP430F521x Devices (SLAA558).

For debugging of devices (MSP430F524x and MSP430F523x) without use of the DVIO power domain,short JP4 with the jumper.



http://www.ti.com

http://www.ti.com/lit/pdf/SLAS718

http://www.ti.com/lit/pdf/SLAS903

http://www.ti.com/lit/pdf/SLAA558


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23 P1.5/TA0.4

24 P1.6/TA1CLK/CBOUT

25 P1.7/TA1.0

26 P2.0/TA1.1

27 P2.1/TA1.2

28 P2.2/TA2CLK/SMCLK

29 P2.3/TA2.0

30 P2.4/TA2.1

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32 P2.6/RTCCLK/DMAE0

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55BSLEN

56RST/NMI

57P5.2/XT2IN

58P5.3/XT2OUT

59TEST/SBWTCK

60PJ.0/TDO

61PJ.1/TDI/TCLK

62PJ.2/TMS

63PJ.3/TCK

64RSTDVCC/SBWTDIO

65 THERMAL_1

66 THERMAL_2

67 THERMAL_3

68 THERMAL_4

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SS

MSP-TS430RGC64C www.ti.com

Figure B-47. MSP-TS430RGC64C Target Socket Module, Schematic



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Connector J5External power connector for DVCCSet jumper JP3 to "ext"

IMPORTANT NOTE:Rev1.0 of the board does not haveconnection from pin 4 of BOOTST topin 64 of MCU. To use BSL, these pinsshould be connected by a wire.




Jumper JP4For F524x devices, close.For F522x, F523x, and F525x devices,close only if one power supply is usedfor VCC and DVIO, and if VCC is nothigher then 1.98 V. Otherwise, supplyDVIO over J6.Do not close if VCC > 1.98 V, as it maydamage the chip.

Connector J6External power connectorto supply DVIO





2-3 (ext): External power supplyJumper JP1Open to measure current

www.ti.com MSP-TS430RGC64C

Figure B-48. MSP-TS430RGC64C Target Socket Module, PCB




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MSP-TS430RGC64C www.ti.com

Table B-25. MSP-TS430RGC64C Bill of MaterialsItem Qty Reference Value Description Comment Supplier No.

1 0 C1, C2 12pF CAP, SMD, Ceramic, 0805 DNP C1 C2

2 0 C3, C4 CAP, SMD, Ceramic, 0805 DNP C3 C4

4 3 C5, C7, C10 10uF CAP, SMD, Ceramic, 0805

5 5 C8 C6 C13-15 100nF CAP, SMD, Ceramic, 0805 Digi-Key: 311-1245-2-ND

5 5 C8 2.2nF CAP, SMD, Ceramic, 0805

6 1 C9 470nF CAP, SMD, Ceramic, 0805 Digi-Key: 478-1403-2-ND

7 1 C16 4.7uF CAP, SMD, Ceramic, 0805

8 1 D1 Green LED LED, SMD, 0805

DNP: headers andreceptacles enclosed withPin header 1x16: Grid: 100mil9 4 J1-J4 16-pin header kit. Keep vias free of solder.(2.54 mm) : Header SAM1029-16-ND: Receptacle SAM1213-16-ND

Pin header 1x3: Grid: 100mil (2.5410 2 J5, J6 3-pin header, male, TH SAM1035-03-NDmm)

JP5, JP6, JP7, Pinheader 1x3: Grid: 100mil (2.5411 3-pin header, male, TH place jumpers on pins 2-3 SAM1035-03-NDJP8, JP9, JP10 mm)

Pin header 1x3: Grid: 100mil (2.5412 JP3 3-pin header, male, TH place jumper on pins 1-2 SAM1035-03-NDmm)

Pin header 1x2; Grid: 100mil (2.5413 JP1, JP2, JP4 2-pin header, male, TH place jumper on header SAM1035-02-NDmm)

Place on: JP1, JP2, JP3,14 10 Jumper JP4, JP5, JP6, JP7, JP8, 15-38-1024-ND

JP9, JP10

Header, THD, Male 2x7 Pin,15 1 JTAG 2x7Pin,Wanne HRP14H-NDWanne, 100mil spacing

Header, THD, Male 2x5 Pin,16 0 BOOTST 2x5Pin,Wanne DNPWanne, 100mil spacing

17 1 Q1 26MHz/ASX53 CRYSTAL, SMD, 5x3MM, 26MHz Only Kit.

18 0 Q2 26MHz/ASX53 CRYSTAL, SMD, 5x3MM, 26MHz 300-8219-1-ND

19 1 D3 LL103A DIODE, SMD, SOD123, Schottky Buerklin: 24S3406

20 2 R3, R7 330 Ohm, SMD0805 541-330ATR-ND

21 1 R5 47k Ohm, SMD0805 RES, SMD, 0805, 1/8W, x% 541-47000ATR-ND

R1, R2, R4, R6, DNP: R6, R8, R9, R10,22 R8, R9, R10, 0 Ohm, SMD0805 RES, SMD, 0805, 1/8W, x% 541-000ATR-NDR11,R12R11, R12

23 1 U1 Socket: QFN11T064-006-N-HSP Manuf.: Yamaichi

IC, MCU, SMD, 9.15x9.15mm24 2 MSP430 MSP430F5229IRGCR Thermal Pad with Socket

apply to corners at bottom25 4 Rubber stand off Rubber stand off Buerklin: 20H1724side

26 1 PCB 84 x 76 mm 84 x 76 mm



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www.ti.com MSP-TS430RGC64USB

B.25 MSP-TS430RGC64USBDue to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; forexample, to run the MCU at 3.0 V, set it to 3.3 V.

Figure B-49. MSP-TS430RGC64USB Target Socket Module, Schematic



http://www.ti.com


141

2

GN

D

GN

D

VC

C

12

3

12

3

12

3

12

3

12

3

12

3

123

123

4964

11

6

3217

33

48

QFN11T064-006

Clamshell

Vccext int

MSP-TS430RGC64USBRev.: 1.4 RoHS

SBW ->

JTAG ->

1

JTA

G

R2

C2C1

C3

C4

R1

C5

R3

+

C6

+C

7

C8

J5

JP

1

JP

2

R4

JP

5

JP

6

JP

7

JP

8

JP

9

JP

10

R7R

5

C11C1

2

D1

C9

C1

3

C1

0

R6

R8

R9

R1

2

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B1

R3

3

C3

5

C36

R3

4R

35

R3

6

C39

D2

IC7

C4

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33

C3

8

JP4

LE

D3

S1

S2

R1

3 LE

D1

R1

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S3

R1

0

C1

4

R11

D3

D4

J4

J1

J2

J3

U1

Q1

Q2






USB1USB connector





MSP-TS430RGC64USB www.ti.com

Figure B-50. MSP-TS430RGC64USB Target Socket Module, PCB



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www.ti.com MSP-TS430RGC64USB

Table B-26. MSP-TS430RGC64USB Bill of Materials


1.1 C3, C4 2 47pF, SMD08052 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND

C5, C11, C13,3 4 100nF, SMD0805 311-1245-2-NDC143.1 C10, C12 0 10uF, SMD0805 DNP: C10, C124 C8 1 2.2nF, SMD08055 C9 1 470nF, SMD0805 478-1403-2-ND6 D1 1 green LED, SMD0805 P516TR-ND

DNP: headers and receptaclesenclosed with kit. Keep viasfree of solder.7 J1, J2, J3, J4 4 16-pin header, TH


8 J5 1 3-pin header, male, TH SAM1035-03-NDJP5, JP6, JP7,

9 JP8, JP9, 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3JP10

10 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND place jumper on header11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2

Place on: JP1, JP2, JP3, JP4,12 10 Jumper 15-38-1024-ND JP5, JP6, JP7, JP8, JP9, JP1013 JTAG 1 14-pin connector, male, TH HRP14H-ND

Q1: Micro Crystal MS1V-T1K DNP: Q114 Q1 0 Crystal 32.768kHz, C(Load) = 12.5pF Keep vias free of solder15 Q2 1 Crystal Q2: 4MHz Buerklin: 78D13416 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

R1, R2, R4,17 R6, R8, R9, 2 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R9, R12

R1218 R10 1 100 Ω, SMD0805 Buerklin: 07E50018 R11 1 1M Ω, SMD080518 R5 1 47k Ω, SMD0805 541-47000ATR-ND19 U1 1 Socket: QFN11T064-006 Manuf.: Yamaichi20 PCB 1 79 x 77 mm 2 layers

Rubber stand21 4 Buerklin: 20H1724 Apply to corners at bottom sideoffDNP: enclosed with kit. Is22 MSP430 2 MSP430F5509 RGC supplied by TI

http://www.ettinger.de/Art_DetaInsulating disk23 1 Insulating disk to Q2 il.cfm?ART_ARTNUM=70.08.1to Q2 2127 C33 1 220n SMD0603 Buerklin: 53D207428 C35 1 10p SMD0603 Buerklin: 56D10229 C36 1 10p SMD0603 Buerklin: 56D10230 C38 1 220n SMD0603 Buerklin: 53D207431 C39 1 4u7 SMD0603 Buerklin: 53D208632 C40 1 0.1u SMD0603 Buerklin: 53D206833 D2, D3, D4 3 LL103A Buerklin: 24S340634 IC7 1 TPD4E004 Manu: TI36 LED 0 JP3QE SAM1032-03-ND DNP



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MSP-TS430RGC64USB www.ti.com

Table B-26. MSP-TS430RGC64USB Bill of Materials (continued)No. PerPos. Ref Des Description Digi-Key Part No. CommentBoard

37 LED1 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP38 LED2 0 LEDCHIPLED_0603 FARNELL: 852-9868 DNP39 LED3 0 LEDCHIPLED_0603 FARNELL: 852-9841 DNP40 R13, R15, R16 0 470R Buerklin: 07E564 DNP41 R33 1 1k4 / 1k5 Buerklin: 07E61242 R34 1 27R Buerklin: 07E44443 R35 1 27R Buerklin: 07E44444 R36 1 33k Buerklin: 07E74045 S1 0 PB P12225STB-ND DNP46 S2 0 PB P12225STB-ND DNP46 S3 1 PB P12225STB-ND47 USB1 1 USB_RECEPTACLE FARNELL: 117-7885



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www.ti.com MSP-TS430PN80

B.26 MSP-TS430PN80

NOTE: For MSP430F47x and MSP430FG47x devices:Connect pins 7 and 10 (GND) externally to DVSS (see data sheet).Connect load capacitance on Vref pin 60 when SD16 is used (see data sheet).For use of BSL: connect pin 1 of BOOST to pin 58 of U1 and pin 3 of BOOST to pin 57 of U1.

Figure B-51. MSP-TS430PN80 Target Socket Module, Schematic



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MSP-TS430PN80 www.ti.com

Figure B-52. MSP-TS430PN80 Target Socket Module, PCB



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www.ti.com MSP-TS430PN80

Table B-27. MSP-TS430PN80 Bill of Materials

Pos. Ref Des No. per Board Description Digi-Key Part No. Comment1 C1, C2 0 12pF, SMD0805 DNP: C1, C2

DNP: Only recommendation.1.1 C3, C4 0 47pF, SMD0805 Check your crystal spec.2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND3 C5 1 100nF, SMD0805 478-3351-2-ND4 C8 1 10nF, SMD0805 478-1383-2-ND5 D1 1 green LED, SMD0603 475-1056-2-ND

DNP: Headers and receptaclesenclosed with kit.Keep viasfree of solder.6 J1, J2, J3, J4 0 25-pin header, TH


7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND8 J6, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header9 3 Jumper 15-38-1024-ND Place on: J6, JP2, JP1/Pos1-210 JTAG 1 14-pin connector, male, TH HRP14H-ND11 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder

Q1: Micro Crystal MS1V-T1K12 Q1, Q2 0 Crystal DNP: Keep vias free of solder32.768kHz, C(Load) = 12.5pF13 R3 1 560 Ω, SMD0805 541-560ATR-ND

R1, R2, R4, DNP: R4, R6, R7, R10, R11,14 R6, R7, R10, 2 0 Ω, SMD0805 541-000ATR-ND R12R11, R1215 R5 1 47k Ω, SMD0805 541-47000ATR-ND16 U1 1 Socket: IC201-0804-014 Manuf.: Yamaichi17 PCB 1 77 x 77 mm 2 layers

Adhesive for example, 3M Bumpons Part18 4 ~6mm width, 2mm height Apply to corners at bottom sidePlastic feet No. SJ-5302DNP: Enclosed with kit19 MSP430 2 MSP430FG439IPN supplied by TI



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MSP-TS430PN80A www.ti.com

B.27 MSP-TS430PN80A

Figure B-53. MSP-TS430PN80A Target Socket Module, Schematic



http://www.ti.com







Connector J6If the system is supplied from LDOI,close JP4 and set JP3 to external




2-3 (ext): External power supplyJumper JP1Open to measure current

www.ti.com MSP-TS430PN80A

Figure B-54. MSP-TS430PN80A Target Socket Module, PCB




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MSP-TS430PN80A www.ti.com

Table B-28. MSP-TS430PN80A Bill of Materials

No. perPosition Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP2 C3, C4 0 47pF, SMD0805 DNP

C6, C7,3 3 10uF, 6.3V, SMD0805 DNP C10C10, C12C5, C11,

4 C13, C14, 5 100nF, SMD0805 311-1245-2-NDC15

5 C8 1 2.2nF, SMD08056 C9 1 470nF, SMD0805 478-1403-2-ND7 C16 1 4.7uF, SMD08058 C17 1 220nF, SMD08059 D1 1 green LED, SMD0805 P516TR-ND

SAM1029-20-ND DNP: Headers and receptaclesJ1, J2, J3,10 0 20-pin header, TH (Header) SAM1213-20- enclosed with kit. Keep vias free ofJ4 ND (Receptacle) solder:11 J5 , J6 2 3-pin header, male, TH


14 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 1314-pin connector, male,15 JTAG 1 HRP14H-NDTH10-pin connector, male,16 BOOTST 0 "DNP Keep vias free of solder"TH



20 D3,D4 2 LL103A Buerklin: 24S340621 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

R1, R2, R4,R6, R8,22 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12R9,R10,

R11, R1223 R5 1 47k Ω, SMD0805 541-47000ATR-ND24 U1 1 Socket:IC201-0804-014 Manuf.: Yamaichi25 PCB 1 77 x 91 mm 2 layers

Adhesive Approximately 6mm width, for example, 3M Bumpons26 4 Apply to corners at bottom sideplastic feet 2mm height Part No. SJ-530227 MSP430 2 MSP430F5329IPN DNP: enclosed with kit, supplied by TI



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www.ti.com MSP-TS430PN80USB

B.28 MSP-TS430PN80USBDue to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; forexample, to run the MCU at 3.0 V, set it to 3.3 V.

NOTE: R11 should be populated.

Figure B-55. MSP-TS430PN80USB Target Socket Module, Schematic



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Jumper JP31-2 (int): Power supply from JTAG debug interface2-3 (ext): External power supply


USB Connector

Button S3BSL invoke

Jumper JP4Close for USB bus powered device







MSP-TS430PN80USB www.ti.com

Figure B-56. MSP-TS430PN80USB Target Socket Module, PCB



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www.ti.com MSP-TS430PN80USB

Table B-29. MSP-TS430PN80USB Bill of Materials

No. perPos. Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP: C1, C2


C5, C11,3 4 100nF, SMD0805 311-1245-2-NDC13, C143.1 C10, C12 0 10uF, SMD0805 311-1245-2-ND DNP: C10, C124 C8 1 2.2nF, SMD08055 C9 1 470nF, SMD0805 478-1403-2-ND6 D1 1 green LED, SMD0805 P516TR-ND

DNP: headers and7 J1, J2, J3, J4 4 20-pin header, TH SAM1029-20-ND receptacles enclosed with kit.

Keep vias free of solder.DNP: headers andreceptacles enclosed with kit.Keep vias free of solder.7.1 4 20-pin header, TH

SAM1213-20-ND : Header: Receptacle

8 J5 1 3-pin header, male, TH SAM1035-03-NDJP5, JP6,

JP7,9 6 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3JP8,JP9,JP10

10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on headerJP4 1 SAM1035-02-ND Place jumper only on one pin

11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-2Place on: JP1, JP2, JP3,

12 10 Jumper 15-38-1024-ND JP4, JP5, JP6, JP7, JP8,JP9, JP10

13 JTAG 1 14-pin connector, male, TH HRP14H-NDMicro Crystal MS1V-T1K DNP: Q1 Keep vias free of14 Q1 0 Crystal 32.768kHz, C(Load) = solder12.5pF

15 Q2 1 Crystal "Q2: 4MHzBuerklin: 78D134"16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

R1, R2, R4,17 R6, R8, R9, 2 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R9, R12

R1218 R10 1 100 Ω, SMD0805 Buerklin: 07E50018 R11 0 1M Ω, SMD0805 DNP18 R5 1 47k Ω, SMD0805 541-47000ATR-ND19 U1 1 Socket:IC201-0804-014 Manuf.: Yamaichi20 PCB 1 79 x 77 mm 2 layers

Rubber Apply to corners at bottom21 4 Buerklin: 20H1724standoff sideDNP: Enclosed with kit22 MSP430 2 MSP430F5529 supplied by TI

http://www.ettinger.de/Art_DeInsulating23 1 Insulating disk to Q2 tail.cfm?ART_ARTNUM=70.0disk to Q2 8.12127 C33 1 220n Buerklin: 53D207428 C35 1 10p Buerklin: 56D10229 C36 1 10p Buerklin: 56D10230 C38 1 220n Buerklin: 53D2074



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MSP-TS430PN80USB www.ti.com

Table B-29. MSP-TS430PN80USB Bill of Materials (continued)No. perPos. Ref Des Description Digi-Key Part No. CommentBoard

31 C39 1 4u7 Buerklin: 53D208632 C40 1 0.1u Buerklin: 53D206833 D2, D3, D4 3 LL103A Buerklin: 24S340634 IC7 1 TPD4E004 Manu: TI36 LED 0 JP3QE SAM1032-03-ND DNP37 LED1 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP38 LED2 0 LEDCHIPLED_0603 FARNELL: 852-9868 DNP39 LED3 0 LEDCHIPLED_0603 FARNELL: 852-9841 DNP

R13, R15,40 0 470R Buerklin: 07E564 DNPR1641 R33 1 1k4 Buerklin: 07E61242 R34 1 27R Buerklin: 07E44443 R35 1 27R Buerklin: 07E44444 R36 1 33k Buerklin: 07E74045 S1 0 PB P12225STB-ND DNP46 S2 0 PB P12225STB-ND DNP46 S3 1 PB P12225STB-ND47 USB1 1 USB_RECEPTACLE FARNELL: 117-7885



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www.ti.com MSP-TS430PZ100

B.29 MSP-TS430PZ100

NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not bemade.

Figure B-57. MSP-TS430PZ100 Target Socket Module, Schematic



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Connector J5External power connection

Remove R8 and jumper R9







MSP-TS430PZ100 www.ti.com

Figure B-58. MSP-TS430PZ100 Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430PZ100

Table B-30. MSP-TS430PZ100 Bill of Materials


DNP: Only recommendation.1b C3, C4 0 47pF, SMD0805 Check your crystal spec.2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND DNP: C63 C5 1 100nF, SMD0805 478-3351-2-ND4 C8 1 10nF, SMD0805 478-1383-2-ND5 C9 1 470nF, SMD0805 478-1403-2-ND6 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND

DNP: Headers andreceptacles enclosed withkit.Keep vias free of solder.7 J1, J2, J3, J4 0 25-pin header, TH


8 J5 1 3-pin header, male, TH SAM1035-03-ND9 J6, J7 2 2-pin header, male, TH SAM1035-02-ND place jumper on header10 2 Jumper 15-38-1024-ND Place on: J6, J711 JTAG 1 14-pin connector, male, TH HRP14H-ND

DNP: Keep vias free of12 BOOTST 0 10-pin connector, male, TH solderQ1: Micro Crystal MS1V-T1K DNP: Keep vias free of13 Q1, Q2 0 Crystal 32.768kHz, C(Load) = solder12.5pF

14 R3 1 330 Ω, SMD0805 541-330ATR-NDR1, R2, R4,

15 R8, R9, R10, 3 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R9, R10, R12R11, R12

16 R5 1 47k Ω, SMD0805 541-47000ATR-NDSocket: IC201-1004-008 or17 U1 1 Manuf.: YamaichiIC357-1004-53N

18 PCB 1 82 x 90 mm 2 layersAdhesive for example, 3M Bumpons Apply to corners at bottom19 4 ~6mm width, 2mm heightPlastic feet Part No. SJ-5302 side

DNP: enclosed with kit20 MSP430 2 MSP430FG4619IPZ supplied by TI



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MSP-TS430PZ100A www.ti.com

B.30 MSP-TS430PZ100A

Figure B-59. MSP-TS430PZ100A Target Socket Module, Schematic



http://www.ti.com







Orient Pin 1 ofMSP430 Device


Jumper JP3 to "ext"



www.ti.com MSP-TS430PZ100A

Figure B-60. MSP-TS430PZ100A Target Socket Module, PCB



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MSP-TS430PZ100A www.ti.com

Table B-31. MSP-TS430PZ100A Bill of Materials


DNP: Only recommendation.1b C3, C4 0 47pF, SMD0805 Check your crystal spec.2 C7, C9 2 10uF, 10V, Tantal Size B 511-1463-2-ND3 C5, C11, C14 3 100nF, SMD0805 311-1245-2-ND4 C8 1 10nF, SMD0805 478-1358-1-ND5 C6 0 470nF, SMD0805 478-1403-2-ND DNP6 D1 1 green LED, SMD0805 67-1553-1-ND

DNP: Headers andreceptacles enclosed withkit.Keep vias free of solder.7 J1, J2, J3, J4 0 25-pin header, TH


8 J5 1 3-pin header, male, TH SAM1035-03-ND10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND pPlace jumper on header11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-212 3 Jumper 15-38-1024-ND Place on: JP1, JP2, JP313 JTAG 1 14-pin connector, male, TH HRP14H-ND

DNP: Keep vias free of14 BOOTST 0 10-pin connector, male, TH solderQ1: Micro Crystal MS1V-T1K DNP: Keep vias free of15 Q1, Q2 0 Crystal 32.768kHz, C(Load) = solder12.5pF

16 R3 1 330 Ω, SMD0805 541-330ATR-NDR1, R2, R4,R6, R7, R8, DNP: R4, R6, R7, R8, R9,17 2 0 Ω, SMD0805 541-000ATR-NDR9, R10, R10, R11, R12R11, R12

18 R5 1 47k Ω, SMD0805 541-47000ATR-ND19 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi20 PCB 1 90 x 82 mm 4 layers

Rubber Apply to corners at bottom21 4 Select appropriatestandoff sideDNP: Enclosed with kit22 MSP430 2 MSP430F47197IPZ supplied by TI



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www.ti.com MSP-TS430PZ100B

B.31 MSP-TS430PZ100B

Figure B-61. MSP-TS430PZ100B Target Socket Module, Schematic



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Jumper JP3 to "ext"




JP11, JP12, JP13Connect 1-2 to connectAUXVCCx with DVCCor drive AUXVCCx externally







MSP-TS430PZ100B www.ti.com

Figure B-62. MSP-TS430PZ100B Target Socket Module, PCB




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www.ti.com MSP-TS430PZ100B

Table B-32. MSP-TS430PZ100B Bill of Materials

No. perPosition Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP

C4, C5,2 C6 , C7, 6 100nF, SMD0805 311-1245-2-ND

C8, C93 C10, C26 2 470 nF, SMD0805 478-1403-2-ND4 C11, C12 1 10 uF / 6.3 V SMD0805 C12 DNP

C13, C14,5 C16, C18, 6 4.7 uF SMD0805

C19, C296 D1 1 green LED, SMD0805 P516TR-ND

SAM1029-25-ND DNP: Headers and receptaclesJ1, J2, J3,7 0 25-pin header, TH (Header) SAM1213-25- enclosed with kit. Keep vias free ofJ4 ND (Receptacle) solder:8 J5 1 3-pin header, male, TH


JP11, JP12,11 3 4-pin header, male, TH place jumper on header 1-2JP1312 13 Jumper 15-38-1024-ND See Pos. 9 and Pos. 10 and Pos. 11

14-pin connector, male,15 JTAG 1 HRP14H-NDTH10-pin connector, male,16 BOOTST 0 "DNP Keep vias free of solder"TH

17 Q1 0 Crystal DNP: Q1 Keep vias free of solder21 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

R1, R2, R4,22 R6, R8, 2 0 Ohm, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R10, R11

R10, R1123 R5 1 47k Ω, SMD0805 541-47000ATR-ND24 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi25 PCB 1 90 x 82 mm 2 layers

Adhesive Approximately 6mm width, for example, 3M Bumpons26 4 Apply to corners at bottom sideplastic feet 2mm height Part No. SJ-530227 MSP430 2 MSP430F6733IPZ DNP: enclosed with kit, supplied by TI



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DN

PD

NP

DN

P

DN

P

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P

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12pF

47pF

47pF

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D

GN

D

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D

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100nF

100nF

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D516

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470nF

100nF

100nF

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D

VCC

100nF

GN

D

100nF

100nF

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D

100nF

LL

A103

GN

D

4.7n

HCTC XTL_ _4

HCTC XTL_ _4

HCTC XTL_ _4

HCTC XTL_ _4

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D

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DG

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74

73

72

71

70

69

68

67

66

65

60

59

58

57

56

55

54

53

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21

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52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

72

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MSP-TS430PZ100C www.ti.com

B.32 MSP-TS430PZ100C

Figure B-63. MSP-TS430PZ100C Target Socket Module, Schematic



http://www.ti.com


If the system shouldbe supplied from LDOI (J6),close JP4 and set JP3 to external




LDOI LDOO/

14

1

2

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D

GN

D

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C

12

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10

15

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8

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9

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8

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C2

1

JP

4

D4

J6








www.ti.com MSP-TS430PZ100C

Figure B-64. MSP-TS430PZ100C Target Socket Module, PCB




http://www.ti.com


MSP-TS430PZ100C www.ti.com

Table B-33. MSP-TS430PZ100C Bill of Materials

NumberPos. Ref Des Per Description Digi-Key Part No. Comment

Board1 C1, C2 0 12pF, SMD0805 DNP: C1, C2

1.1 C3, C4 2 47pF, SMD0805 DNP: C3, C42 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND

C5, C11,3 C13, C14, 6 100nF, SMD0805 311-1245-2-ND

C19, C20C10, C12,3.1 0 100nF, SMD0805 311-1245-2-ND DNP: C10, C12,C18, C17C18,17

4 C8 1 2.2nF, SMD0805 Buerklin 53 D 2925 C9 1 470nF, SMD0805 478-1403-2-ND6 D1 1 green LED, SMD0805 P516TR-ND

DNP: headers and receptacles enclosed7 J1, J2, J3, J4 4 25-pin header, TH SAM1029-25-ND with kit. Keep vias free of solder.DNP: headers and receptacles enclosed7.1 4 25-pin header, TH SAM1213-25-ND with kit. Keep vias free of solder.

8 J5, J6 2 3-pin header, male, TH SAM1035-03-NDJP5, JP6,

JP7,9 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3JP8,JP9,JP10

10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND place jumper on header10.1 JP4 1 2-pin header, male, TH SAM1035-02-ND place jumper on header11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2

Place on: JP1, JP2, JP3, JP4, JP5, JP6,12 10 Jumper 15-38-1024-ND JP7, JP8, JP9, JP1013 JTAG 1 14-pin connector, male, TH HRP14H-ND14 BOOTST 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder

DNP: Q115 Q1 0 CrystalKeep vias free of solder

16 Q2 1 Crystal DNP: Q2 Keep vias free of solder17 R3, R7 2 330 Ohm, SMD0805 541-330ATR-ND

R1, R2, R4,R6, R8, R9,18 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11, R12R10, R11,

R1219 R5 1 47k Ohm, SMD0805 541-47000ATR-ND20 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi21 PCB 1 79.5 x 99.5 mm MSP-TS430PZ100C Rev 1.0 2 layers

Rubber stand22 4 Buerklin: 20H1724 apply to corners at bottom sideoff

23 MSP430 2 MSP430F643x DNP: enclosed with kit. Is supplied by TI.24 C16 1 4.7 nF SMD0603 Buerklin 53 D 204226 D3, D4 2 LL103A Buerklin: 24S340627 JP11 1 4-pin header, male, TH SAM1035-04-ND Place jumper on Pin 1 and Pin 228 C15 1 4.7 uF, SMD0805 Buerklin 53 D 243029 C21 1 220nF, SMD0805 Buerklin 53 D 2381



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DN

P

Socket:

Yam

aic

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201-1

004-0

08

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P

DN

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GN

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.1/M

CL

K/S

38

19

P5

.1/T

A1

.2/S

37

20

P5

.2/T

A1

.0/T

A1

CL

K/A

CL

K/S

36

21

P5

.3/U

CB

1S

TE

/S3

52

2

P3

.0/U

CB

1C

LK

/S3

42

3

P3

.1/U

CB

1S

IMO

/UC

B1

SD

A/S

33

24

P3

.2/U

CB

1S

OM

I/UC

B1

SC

L/S

32

25

DVSS126

DVCC127

TEST/SBWTCK28

XRST/NMI/SBWTDIO29

PJ.0/TDO/TB0OUTH/SMCLK/SRSCG130

PJ.1/TDI/TCLK/MCLK/SRSCG031

PJ.2/TMS/ACLK/SROSCOFF32

PJ.3/TCK/COUT/SRCPUOFF33

P6.7/TA0CLK/S3134

P7.5/TA0.2/S3035

P7.6/TA0.1/S2936

P10.1/TA0.0/S2837

P7.7/TA1.2/TB0OUTH/S2738

P3.3/TA1.1/TB0CLK/S2639

P3.4/UCA1SIMO/UCA1TXD/TB0.0/S2540

P3.5/UCA1SOMI/UCA1RXD/TB0.1/S2441

P3.6/UCA1CLK/TB0.2/S2342

P3.7/UCA1STE/TB0.3/S2243

P8.0/RTCCLK/S2144

P8.1/DMAE0/S2045

P8.2/S1946

P8.3/MCLK/S1847

P2.3/UCA0STE/TB0OUTH48

P2.2/UCA0CLK/TB0.4/RTCCLK49

P2.1/UCA0SOMI/UCA0RXD/TB0.5/DMAE050P

2.0

/UC

A0

SIM

O/U

CA

0T

XD

/TB

0.6

/TB

0C

LK

51

P7

.0/T

A0

CL

K/S

17

52

P7

.1/T

A0

.0/S

16

53

P7

.2/T

A0

.1/S

15

54

P7

.3/T

A0

.2/S

14

55

P7

.4/S

MC

LK

/S1

35

6D

VS

S2

57

DV

CC

25

8P

8.4

/A7

/C7

59

P8

.5/A

6/C

66

0P

8.6

/A5

/C5

61

P8

.7/A

4/C

46

2P

1.3

/ES

ITE

ST

4/T

A1

.2/A

3/C

36

3P

1.2

/TA

1.1

/TA

0C

LK

/CO

UT

/A2

/C2

64

P1

.1/T

A0

.2/T

A1

CL

K/C

OU

T/A

1/C

1/V

RE

F+

/VE

RE

F+ 6

5P

1.0

/TA

0.1

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AE

0/R

TC

CL

K/A

0/C

0/V

RE

F-/V

ER

EF 6

6P

9.0

/ES

ICH

0/E

SIT

ES

T0

/A8

/C8

67

P9

.1/E

SIC

H1

/ES

ITE

ST

1/A

9/C

96

8P

9.2

/ES

ICH

2/E

SIT

ES

T2

/A1

0/C

10

69

P9

.3/E

SIC

H3

/ES

ITE

ST

3/A

11

/C11

70

P9

.4/E

SIC

I0/A

12

/C1

27

1P

9.5

/ES

ICI1

/A1

3/C

13

72

P9

.6/E

SIC

I2/A

14

/C1

47

3P

9.7

/ES

ICI3

/A1

5/C

15

74

ES

IVC

C7

5

ESIVSS 76ESICI 77

ESICOM 78AVCC1 79AVSS3 80

PJ.7/HFXOUT 81PJ.6/HFXIN 82

AVSS1 83

P4.2/UCA0SIMO/UCA0TXD/UCB1CLK 100

DVCC3 99

DVSS3 98

P4.1/UCB1SOMI/UCB1SCL/ACLK/S2 97

P4.0/UCB1SIMO/UCB1SDA/MCLK/S3 96

P10.0/SMCLK/S4 95

P4.7/UCB1SOMI/UCB1SCL/TA1.2/S5 94

P4.6/UCB1SIMO/UCB1SDA/TA1.1/S6 93

P4.5/UCB1CLK/TA1.0/S7 92

P4.4/UCB1STE/TA1CLK/S8 91

P5.7/UCA1STE/TB0CLK/S9 90

P5.6/UCA1CLK/S10 89

P5.5/UCA1SOMI/UCA1RXD/S11 88

P5.4/UCA1SIMO/UCA1TXD/S12 87

AVSS2 86

PJ.5/LFXOUT 85

PJ.4/LFXIN 84

IC1

12345678910

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

J3

26272829303132333435363738394041424344454647484950

J4

51

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

72

73

74

75

J5

767778798081828384858687888990919293949596979899

100

J6

C10

C11

12

JP

12

C12

C13

C14

R7

C15

P1.0

P1.0

RS

T/N

MI

TM

ST

DI

VC

C

GN

D

P1.1

P1.1

TC

K/S

BW

TC

K

TD

O/S

BW

TD

IO

PJ.0

/TD

O

PJ.0/TDO

PJ.2

/TM

S

PJ.2/TMS

PJ.3

/TC

K

PJ.3/TCK

PJ.1

/TD

I

PJ.1/TDI

P1.2

P1.2

BS

LT

X

BS

LT

X

BS

LR

X

BSLRX

P1.3

P1.3

AV

CC

AVCC

AV

SS

AVSS

AVSS

AVSS

LF

XO

UT

LF

XIN

LF

GN

DH

FG

ND

HF

XIN

HF

XO

UT

DV

CC

DV

CC

DVCC

DVCC

DV

CC

DVCC

DV

CC

DV

CC

DV

CC

DV

SS

DVSS

DV

SS

DVSS

TE

ST

/SB

WT

CK

1

TE

ST

/SB

WT

CK

TEST/SBWTCK

TE

ST

/SB

WT

CK

LC

DC

APL

CD

CA

P

ES

IVC

C

ES

IVC

C

ESICOM

ES

ICO

M

ESIVSS

RST/SBWTDIO

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

1 2 3 4 5 6

1 2 3 4 5 6

Tite

l:

Da

tum

:

Be

arb

.:

Se

ite1

/1

MS

P-T

S4

30

PZ

10

0D

7/9

/20

13

5:2

3:2

5 P

MA

3

IH

GF

ED

CB

A AB

CD

EF

GH

I

File

:

Do

k:

Re

v.:

www.ti.com MSP-TS430PZ100D

B.33 MSP-TS430PZ100D

Figure B-65. MSP-TS430PZ100D Target Socket Module, Schematic



http://www.ti.com


1

Vccext

int

Vcc

GND

GND

JTAG

SBW

RESET

Ext.

Pwr.

PW

R

DVCC

AVCC

TC

K

TM

S

TD

I

TD

O

RST/SBWTDIO

TE

ST

/SB

WT

CK

GND

GND

P1.3

ESIVCC

14

1

2

10

1

2

1

111111

12

55

10

15

20

2650 30354045

51

75

55

60

65

70

76 10080 85 90 95

MS

P-T

S4

30

PZ

10

0D

Re

v. 1

.2R

oH

S

Q2 Q1

P1

.0

P1

.1

P1

.2JTAG

C2

C1

C4

R1

BSL

R2

R3

J2

J1

JP

1JP

9

C5R4

JP

3

JP

4

JP

5

JP

6

JP

7

JP

8

R5

R6

C3

C6C7

D1

R1

0JP

10

D2

R11

JP

11

D3

R12

JP2

C8

C9

R8

R9

SW

1

R1

3

TP2

TP1

SW

2

R14 IC1

J3

J4

J5

J6

C10

C11

JP12

C1

2C

13

C14

R7

C1

5 Orient Pin 1 of MSP430 deviceLEDs connected to

P1.0, P1.1, P1.2 throughJP9, JP10, JP11

(only D1 assembled)





Connector BSLFor Bootloader Tool





HF and LF oscillators withcapacitors and resistorsto connect pinheads

MSP-TS430PZ100D www.ti.com

Figure B-66. MSP-TS430PZ100D Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430PZ100D

Table B-34. MSP-TS430PZ100D Bill of Materials

NumberPos. Ref Des Per Description Digi-Key Part No. Comment

Board1 PCB 1 90.0 x 100.0 mm MSP-TS430PZ100D 2 layers, white solder mask

Rev 1.22 JP1, JP2, 3 2-pin header, male, TH SAM1035-02-ND place jumper on header

JP93 JP10, JP11, 3 2-pin header, male, TH SAM1035-02-ND DNP, keep pads free of solder

JP124 J1 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-25 JP3, JP4, 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3

JP5, JP6,JP7, JP8

6 J2 1 3-pin header, male, TH SAM1035-03-ND7 R2, R3, R5, 6 0R, 0805 541-0.0ATR-ND DNP

R6, R8, R98 R7, R12, R13 3 0R, 0805 541-0.0ATR-ND9 C5 1 1.1nF, CSMD0805 490-1623-2-ND10 C3, C7 2 1uF/10V, CSMD0805 490-1702-2-ND11 C12 1 1uF/10V, CSMD0805 490-1702-2-ND DNP12 R4 1 47k, 0805 541-47KATR-ND13 C4, C6, C10, 4 100nF, CSMD0805 490-1666-1-ND

C1114 C13 1 100nF, CSMD0805 490-1666-1-ND DNP15 C15 1 4u7, CSMD0805 445-1370-1-ND DNP16 R1 1 330R, 0805 541-330ATR-ND17 C14 1 470nF, CSMD0805 587-1290-2-ND DNP18 R10, R11 2 330R, 0805 541-330ATR-ND DNP19 R14 1 47k, 0805 541-47KATR-ND DNP20 C1, C2, C8, 4 DNP, CSMD0805 DNP

C921 SW2 1 EVQ-11L05R P8079STB-ND DNP22 SW1 1 EVQ-11L05R P8079STB-ND DNP23 J3, J4, J5, J6 4 25-pin header, TH DNP: headers and receptacles enclosed

with kit. Keep vias free of solder.SAM1029-25-ND : Header

24 J3, J4, J5, J6 4 25-pin receptacle, TH DNP: headers and receptacles enclosedwith kit. Keep vias free of solder.

SAM1213-25-ND : Receptacle25 TP1, TP2 2 Testpoint DNP, keep pads free of solder26 BSL 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder27 JTAG 1 14-pin connector, male, TH HRP14H-ND28 IC1 1 Socket: IC201-1004-008 Manuf. Yamaichi29 IC1 1 MSP430FR6989 DNP: enclosed with kit. Is supplied by TI30 Q1 1 DNP: MS3V-TR1 depends on application Micro Crystal, DNP, enclosed in kit, keep

(32768kHz/20ppm/12,5pF) vias free of solder31 Q2 1 DNP, Crystal depends on application DNP, keep vias free of solder32 D1 1 green LED, DIODE0805 P516TR-ND33 D3 1 red (DNP), DIODE0805 DNP34 D2 1 yellow (DNP), DIODE0805 DNP35 Rubber 4 Buerklin: 20H1724 apply to corners at bottom side

stand off



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MSP-TS430PZ5x100 www.ti.com

B.34 MSP-TS430PZ5x100

Figure B-67. MSP-TS430PZ5x100 Target Socket Module, Schematic



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Jumper JP3 to "ext"









www.ti.com MSP-TS430PZ5x100

Figure B-68. MSP-TS430PZ5x100 Target Socket Module, PCB



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MSP-TS430PZ5x100 www.ti.com

Table B-35. MSP-TS430PZ5x100 Bill of Materials

No. PerPos. Ref Des Description Digi-Key Part No. CommentBoard1 C1, C2 0 12pF, SMD0805 DNP

DNP: Only recommendation.1b C3, C4 47pF, SMD0805 Check your crystal spec.2 C6, C7 2 10uF, 10V, Tantal Size B 511-1463-2-ND

C5, C10, C11,3 4 100nF, SMD0805 311-1245-2-ND DNP: C12, C14C12, C13, C144 C8 0 2.2nF, SMD0805 DNP5 C9 1 470nF, SMD0805 478-1403-2-ND6 D1 1 green LED, SMD0805 67-1553-1-ND

DNP: headers and receptaclesenclosed with kit. Keep viasfree of solder.7 J1, J2, J3, J4 0 25-pin header, TH



9 JP8, JP9, 6 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3JP10

10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-2

Place on JP1, JP2, JP3, JP5,12 9 Jumper 15-38-1024-ND JP6, JP7, JP8, JP9, JP1013 JTAG 1 14-pin connector, male, TH HRP14H-ND14 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder

Q1: Micro Crystal MS1V-T1K15 Q1, Q2 0 Crystal DNP: Keep vias free of solder32.768kHz, C(Load) = 12.5pF16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

R1, R2, R4, DNP: R6, R8, R9, R10, R11,17 R6, R8, R9, 3 0 Ω, SMD0805 541-000ATR-ND R12R10, R11, R1218 R5 1 47k Ω, SMD0805 541-47000ATR-ND19 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi20 PCB 1 90 x 82 mm 2 layers

Rubber21 4 Select appropriate Apply to corners at bottom sidestandoffDNP: Enclosed with kit22 MSP430 2 MSP430F5438IPZ supplied by TI



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www.ti.com MSP-TS430PZ100USB

B.35 MSP-TS430PZ100USBDue to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; forexample, to run the MCU at 3.0 V, set it to 3.3 V.

Figure B-69. MSP-TS430PZ100USB Target Socket Module, Schematic



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Jumpers LED 1, 2, 3Open to disconnect LED1, D2, D3LE LE

LED1, D2, D3LEDs connected to P8.0,

LE LEP8.1, P8.2






USB1USB connector





MSP-TS430PZ100USB www.ti.com

Figure B-70. MSP-TS430PZ100USB Target Socket Module, PCB



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www.ti.com MSP-TS430PZ100USB

Table B-36. MSP-TS430PZ100USB Bill of Materials



C5, C11, C13,3 5 100nF, SMD0805 311-1245-2-NDC14, C19C10, C12,3.1 0 100nF, SMD0805 311-1245-2-ND DNP: C10, C12,C18, C17C18, C17

4 C8 1 2.2nF, SMD08055 C9 1 470nF, SMD0805 478-1403-2-ND6 D1 1 green LED, SMD0805 P516TR-ND

DNP: headers and receptaclesenclosed with kit. Keep vias

7 J1, J2, J3, J4 4 25-pin header, TH SAM1029-25-ND free of solder.: Header: ReceptacleDNP: headers and receptaclesenclosed with kit. Keep vias

7.1 4 25-pin header, TH SAM1213-25-ND free of solder.: Header: Receptacle


9 JP8, JP9, 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3JP10

10 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND place jumper on header11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2

Place on: JP1, JP2, JP3, JP4,12 10 Jumper 15-38-1024-ND JP5, JP6, JP7, JP8, JP9, JP1013 JTAG 1 14-pin connector, male, TH HRP14H-ND

Micro Crystal MS1V-T1K DNP: Q1. Keep vias free of14 Q1 0 Crystal 32.768kHz, C(Load) = 12.5pF solder15 Q2 1 Crystal Q2: 4MHz, Buerklin: 78D13416 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

R1, R2, R4,17 R6, R8, R9, 3 0 Ω, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R12

R1218 R10 1 100 Ω, SMD0805 Buerklin: 07E50018 R11 1 1M Ω, SMD0603 not existing in Rev 1.018 R5 1 47k Ω, SMD0805 541-47000ATR-ND19 U1 1 Socket:IC201-1004-008 Manuf.: Yamaichi20 PCB 1 79 x 77 mm 2 layers

Rubber stand21 4 Buerklin: 20H1724 apply to corners at bottom sideoffDNP: enclosed with kit. Is22 MSP430 2 MSP430F6638IPZ supplied by TI

http://www.ettinger.de/Art_DetaInsulating disk23 1 Insulating disk to Q2 il.cfm?ART_ARTNUM=70.08.1to Q2 2124 C16 1 4.7 nF SMD060327 C33 1 220n SMD0603 Buerklin: 53D207428 C35, C36 2 10p SMD0603 Buerklin: 56D10230 C38 1 220n SMD0603 Buerklin: 53D207431 C39 1 4u7 SMD0603 Buerklin: 53D2086



http://www.ti.com


MSP-TS430PZ100USB www.ti.com

Table B-36. MSP-TS430PZ100USB Bill of Materials (continued)No. PerPos. Ref Des Description Digi-Key Part No. CommentBoard

32 C40 1 0.1u SMD0603 Buerklin: 53D206833 D2, D3, D4 3 LL103A Buerklin: 24S340634 IC7 1 TPD4E004 Manu: TI35 LED 0 JP3QE SAM1032-03-ND DNP

LED1, LED2,36 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNPLED337 R13, R15, R16 0 470R SMD0603 Buerklin: 07E564 DNP38 R33 1 1k4 / 1k5 SMD0603 Buerklin: 07E61239 R34 1 27R SMD0603 Buerklin: 07E44440 R35 1 27R SMD0603 Buerklin: 07E44441 R36 1 33k SMD0603 Buerklin: 07E74042 S1, S2, S3 1 PB P12225STB-ND DNP S1 and S2. (Only S3)43 USB1 1 USB_RECEPTACLE FARNELL: 117-788544 JP11 1 4-pin header, male, TH SAM1035-04-ND place jumper only on Pin 1



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0R

12pF

12pF

47pF

47pF

GN

D

0R

100nF

330R

10uF

/6,3

V

10uF/6,3V

2.2

nF

PWR3

GN

D

GN

D

GN

D

GN

D0R

47K

100nF

100nF

470nF

100nF

100nF

0R0

R

0R

0R

GN

D

GN

DG

ND

GN

DG

ND

1k4

10p

10p

27R

27R

33k

4u7

GN

D

LL103A

TPD4E004

0.1

u

220n

220n

GN

D

GN

D

VCC

GN

DG

ND

470R

GN

D

470R

GN

D

470R

100nF

GN

D 100nF

100nF

GN

D

100R

100nF

LL103A

1M

GN

D

4.7

n

HCTC_XTL_4

HCTC_XTL_4

MS

P4

30

FG

66

26

IPZ

0R22nF

QU

AR

Z5

DN

P

1.1

for

MS

P4

30

FG

66

26

IPZ

de

vic

e

Ta

rge

tso

cke

tb

oa

rdM

SP

-TS

43

0P

Z1

00

AU

SB

Socket:

Ya

maic

hi

IC357-1

004-0

53N

DN

P

<-

SB

W

<-

JTA

G

Vcc

int

ext

GN

D

DN

P

DN

PD

NP

DN

P

DN

P

DN

P

1 3 5 7 9 11 13

2 4 6

12

148

10

JTA

G

R2

C2

C1

C3

C4

R1

C5

R3

C6

C7

C8

J5123

12345678910

1112

13

14

15

16

17

18

19

20

21

22

23

24

25

J1

26272829303132333435363738394041424344454647484950

J2

51

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

72

73

74

75

J3

767778798081828384858687888990919293949596979899

100

J4

JP

112

JP2

12

R4

123

JP

5123

JP

6123

JP

7123

JP

8123

JP

9123 JP

10

R5

C11

C12

D1

C9

C13

C10

R6

R8

R9

R12

1 2 3

JP

3

US

B1

VB

US

1

GN

D4

D-

2

D+

3

SH

IELD

5

SH

IELD

16

R33

C35

C36

R34

R35

R36

C39

D2

IC7

IO11

IO22

GND3

VCC6

IO45

IO34

C40

C33

C38

JP

412

LED3

S1

1 2

S2

1 2

R13

LED1

R15

LED2

R16

LE

D-1

12

LE

D-2

34

LE

D-3

56

C17

C18

C19

R10S3

1 2

C14

D4

R11

C16

JP

11

1 2 3 4

Q2G$1

2 1

Q2G$2

4 3

P6.4

/CB

4/A

D0+

/OA

0O

1

P6.5

/CB

5/A

D0-/O

A0N

2

P6.6

/CB

6/A

D1+

/GS

W0A

3

P6.7

/CB

7/A

D1-/G

SW

0B

4

P7.4

/CB

8/A

D2+

/OA

1O

5

P7.5

/CB

9/A

D2-/O

A1N

6

P7.6

/CB

10/A

D3+

/GS

W1A

7

P7.7

/CB

11/A

D3-/G

SW

1B

8

P5.0

/VR

EF

+/V

ER

EF

+9

P5.1

//A4/D

AC

010

P5.6

/A5/D

AC

111

NR

12

AV

SS

113

XO

UT

14

XIN

15

AV

CC

16

CP

CA

P17

P2.0

/P2M

AP

0/D

AC

018

P2.1

/P2M

AP

1/D

AC

119

P2.2

/P2M

AP

220

P2.3

/P2M

AP

321

P2.4

/P2M

AP

4/R

03

22

P2.5

/P2M

AP

523

P2.6

/P2M

AP

6/L

CD

RE

F/R

13

24

P2.7

/P2M

AP

7/R

23

25

DVCC126

DVSS127

VCORE28

LCDCAP/R3329

COM030

P5.3/COM1/S4231

P5.4/COM2/S4132

P5.5/COM3/S4033

P1.0/TA0CLK/ACLK/S3934

P1.1/TA0.0/S3835

P1.2/TA0.1/S3736

P1.3/TA0.2/S3637

P1.4/TA0.3/S3538

P1.5/TA0.4/S3439

P1.6/TA0.1/S3340

P1.7/TA0.2/S3241

P3.0/TA1CLK/CBOUT/S3142

P3.1/TA1.0/S3043

P3.2/TA1.1/S2944

P3.3/TA1.2/S2845

P3.4/TA2CLK/SMCLK/S2746

P3.5/TA2.0/S2647

P3.6/TA2.1/S2548

P3.7/TA2.2/S2449

P4.0/TB0.0/S2350

P4.1

/TB

0.1

/S22

51

P4.2

/TB

0.2

/S21

52

P4.3

/TB

0.3

/S20

53

P4.4

/TB

0.4

/S19

54

P4.5

/TB

0.5

/S18

55

P4.6

/TB

0.6

/S17

56

P4.7

/TB

0O

UT

H/S

VM

OU

T/S

16

57

P8.0

/TB

0C

LK

/S15

58

P8.1

/UC

B1S

TE

/UC

A1C

LK

/S14

59

P8.2

/UC

A1T

XD

/UC

A1S

IMO

/S13

60

P8.3

/UC

A1R

XD

/UC

A1S

OM

I/S12

61

P8.4

/UC

B1C

LK

/UC

A1S

TE

/S11

62

DV

SS

263

DV

CC

264

P8.5

/UC

B1S

IMO

/UC

B1S

DA

/S10

65

P8.6

/UC

B1S

OM

I/UC

B1S

CL/S

966

P8.7

/S8

67

P9.0

/S7

68

P9.1

/S6

69

P9.2

/S5

70

P9.3

/S4

71

P9.4

/S3

72

P9.5

/S2

73

P9.6

/S1

74

P9.7

/S0

75

VSSU76

PU.0/DP77

PUR78

PU.1/DM79

VBUS80

VUSB81

V1882

AVSS283

P7.2/XT2IN84

P7.3/XT2OUT85

VBAK86

VBAT87

P5.7/DMAE0/RTCCLK88

DVCC389

DVSS390

TEST/SBWTCK91

PJ.0/TDO92

PJ.1/TDI/TCLK93

PJ.2/TMS94

PJ.3/TCK95

RST/NMI/SBWTDIO96

P6.0/CB0/A097

P6.1/CB1/A198

P6.2/CB2/A2/OA0IP099

P6.3/CB3/A3/OA1IP0100

U1

R14

C15

TP2TP1

Q3

TM

S

TM

S

TD

I

TD

I

TD

O

TD

O

TD

O

XIN

XIN

VC

C

GND

GN

D

GND

GN

D

GN

D

GND

XO

UT

XO

UT

P1.0

P1.0

DV

CC

1

DV

CC

1

DV

CC

1

DV

CC

1

DV

CC

1

DV

CC

1

DVCC1

AV

CC

AV

CC

XT

2O

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AVSS

AVSS

AV

SS

AV

SS

M

M

I

I

O

O

XT

2IN

RS

T/N

MI

RS

T/N

MI

TC

K

TC

K

TC

KC

C

TE

ST

/SB

WT

CK

1

RS

T

RS

T

XTLGND2

XTLGND1

PU

.0/D

P

PU.0/DP

PU.0/DP

PU

R

PUR

PUR

PU

.1/D

M

PU.1/DM

PU.1/DM

VBUS

VBUS

VB

US

D-

D+

VUSB

VU

SB

VUSB

V18

V18

P1.6

P1.6

P1.7

P1.7

P8.0

P8.0

P8.1

P8.1

P8.2

P8.2

VBAK

VB

AK

VBAT

VB

AT

CP

CA

P

NR

NR

TE

ST

/SB

WT

CK

US

BIn

terfa

ce

Mis

ce

llan

eo

us

DN

P

+

+

www.ti.com MSP-TS430PZ100AUSB

B.36 MSP-TS430PZ100AUSBThe development board MSP-TS430PZ100AUSB supports the MSP430FG662x and MSP430FG642xflash devices in the 100-pin QFP package. MSP430FG6626IPZ devices are not included in the MSP-TS430PZ100AUSB kit. Free samples can be ordered fromwww.ti.com/product/MSP430FG6626/samplebuy.

Figure B-71. MSP-TS430PZ100AUSB Target Socket Module, Schematic



http://www.ti.com

http://www.ti.com/product/MSP430FG6626/samplebuy


Jumpers LED 1, 2, 3Open to disconnect LED1, D2, D3LE LE

LED1, D2, D3LEDs connected to P8.0,

LE LEP8.1, P8.2






USB1USB connector





141

2

GN

D

GN

D

VC

C

12

55

10

15

20

26 5030 35 40 45 51

75

55

60

65

70

76100 80859095

12

3

12

3

12

3

12

3

12

3

12

3

123

1 2 3

1 2 3 4

+

+

J1 J2

U1

MSP-TS430PZ100AUSB www.ti.com

Figure B-72. MSP-TS430PZ100AUSB Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430PZ100AUSB

Table B-37. MSP-TS430PZ100AUSB Bill of Materials

No. PerPos. Ref Des Description Digi-Key Part No. CommentBoard1 PCB Rev. 1.1 1 99.65mm x 79.54mm 2 layers, red solder mask2 C1, C2 2 12pF, SMD0805 DNP: C1, C2

C10, C12,3 9 100nF, SMD0805 311-1245-2-ND DNP: C10, C12,C18, C17C17, C184 C15 1 22nF, CSMD0805 311-1242-1-ND5 C16 1 4.7 nF SMD0603 311-1250-1-ND6 C3, C4 2 47pF, CSMD0805 709-1337-1-ND7 C33, C38 2 220n SMD0603 Buerklin: 53D20748 C35, C36 2 10p SMD0603 Buerklin: 56D1029 C39 1 4u7 SMD0603 Buerklin: 53D208610 C40 1 0.1u SMD0603 Buerklin: 53D2068

C5, C11, C13,11 5 100nF, SMD0805 311-1245-2-NDC14, C1912 C6, C7 2 10uF/6.3V, Tantal Size B 511-1463-2-ND13 C8 1 2.2nF, CSMD0805 709-1339-1-ND14 C9 1 470nF, SMD0805 478-1403-2-ND

green LED, HSMG-C17015 D1 1 516-1434-1-ND Avago, Farnell 5790852DIODE080516 D2, D4 2 LL103A, SOD-80 Buerklin: 24S340617 IC7 1 TPD4E004DRYR 296-23618-1-ND Manu: TI

DNP: Headers enclosed in kit.18 J1, J2, J3, J4 4 25-pin header, TH SAM1029-25-ND Keep vias free of solder.DNP: Receptacles enclosed in19 J1, J2, J3, J4 4 25-pin receptacle, TH SAM1213-25-ND kit. Keep vias free of solder.

20 J5 1 3-pin header, male, TH SAM1035-03-ND21 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND place jumper on header22 JP11 1 4-pin header, male, TH SAM1035-04-ND Place jumper on Pin 1 and 223 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2

JP5, JP6, JP7,24 JP8, JP9, 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3

JP10Jumpers for

JP1, JP2, JP3,25 JP4, JP5, JP6, 11 Jumper 15-38-1024-ND

JP7, JP8, JP9,JP10, JP11

26 JTAG 1 14-pin connector, male, TH HRP14H-ND27 LED 1 JP3QE SAM1032-03-ND DNP

LED1, LED2,28 3 FARNELL: 852-9833 DNPLED3DNP: Free samples can be29 MSP430 2 MSP430FG6626IPZ ordered in the TI Store

Q2: 4MHz30 Q2 1 Crystal Buerklin: 78D134MS3V-T1R (32.768kHz/31 Q3 1 20ppm/12.5pF)

32 R1, R2, R4 3 0 Ohm, SMD0805 541-0.0ATR-ND33 R10 1 100R, R0603 541-100GCT-ND34 R11 1 1M, R0603 541-1.0MGCT-ND35 R13, R15, R16 3 470R SMD0603 Buerklin: 07E564 DNP36 R14 1 0 Ohm, SMD0805 541-0.0ATR-ND37 R3 1 330 Ohm, SMD0805 541-330ATR-ND



http://www.ti.com

http://www.ti.com/product/MSP430FG6626/samplebuy


MSP-TS430PZ100AUSB www.ti.com

Table B-37. MSP-TS430PZ100AUSB Bill of Materials (continued)No. PerPos. Ref Des Description Digi-Key Part No. CommentBoard

38 R33 1 1k4 / 1k5 SMD0603 Buerklin: 07E61239 R34, R35 2 27R SMD0603 Buerklin: 07E44440 R36 1 33k SMD0603 Buerklin: 07E74041 R5 1 47k Ohm, SMD0805 541-47000ATR-ND

R6, R8, R9,42 4 0 Ohm, SMD0805 541-000ATR-ND DNPR1243 S1, S2 1 PB P12225STB-ND DNP44 S3 1 PB P12225STB-ND45 TP1, TP2 2 Test point DNP, Keep vias free of solder46 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi47 USB1 1 USB Receptacle FARNELL: 117-7885

Insulating disk48 1 Insulating disk for Q2 ettinger.de 70.08.121for Q2Rubber stand49 4 Buerklin: 20H1724 Apply to corners at bottom sideoff



http://www.ti.com


0R

12pF

12pF

GN

D

GN

D

0R

100nF

330R

2.2

nF

0R

0R

PWR3

GN

D

330R

47K

0R

0R

100nF

4.7

uF

GN

D

GN

D

100nF470nF

0R

QUARZ5

100nF

10uF

/6,3

V

10uF

/6,3

V

100nF

4.7

uF

4.7

uF

100nF

4.7uF

4.7

uF

4.7

uF

470nF

FE

04-1

VC

C

GN

D

GN

D

100nF

4.7uF

GN

D

GN

D

GN

D

GN

D

GN

D

VCC1

VC

C1

VC

C1

VC

C1

VC

C1

GN

D

GN

D

GN

D

GN

D

GN

D

GN

D

AV

SS

AV

SS

AV

CC

DV

CC

GND

VC

C

VCC

GN

D

MS

P4

30

:Ta

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t-So

cke

t

MS

P-T

S4

30

PE

U1

28

for

F6

77

9

Pe

ters

en

10

80

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01

/01

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LF

XT

CL

K

DN

P

<-

SB

W

<-

JTA

G

DN

P

Vcc

int

ext

DN

P

DN

P

DN

P

DNP

DN

P

DN

P

DN

P

DV

DS

YS

1.1

12345678910

1112

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

J1

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

J2

65

66

67

68

69

70

71

72

73

74

75

76

77

78

79

80

81

82

83

84

85

86

87

88

89

90

91

92

93

94

95

96

97

98

99

100

101

102

J3

103

104

105

106

107

108

109

110

111

112

113

114

115

116

117

118

119

120

121

122

123

124

125

126127

128

J4

1 3 5 7 9 11 13

2 4 6

12

148

10

JTA

G

R2

C2

C1

R1

C5

R3

12

34

56

78

910

BO

OT

ST

C3

R10

R11

J51

2

3

12

JP

1

JP

2

1 2

123

JP

5123

JP

6123

JP

7123

JP

8123

JP

9123 JP

10

R7

R5

D1

R6

R8

C6

C29

C7

C10

R4

Q1

JP

12

1234

1234

JP

11

JP

13

1234

C4

C11

C12

C8

C13

C14

C9

C16

C19

C18

C26

1

2

JP

4

JP

3

1 2 3 4

C15

C17

TP1 TP2

IC1

MS

P430F

677X

IPE

U#

XIN

1

XO

UT

2

AU

XV

CC

33

RT

CC

AP

14

RT

CC

AP

05

P1.5

/SM

CLK

/CB

0/A

56

P1.4

/MC

LK

/SD

CLK

/CB

1/A

47

P1.3

/AD

C10C

LK

/TA

CLK

/RT

CC

LK

/A3

8

P1.2

/AC

LK

/TA

3.1

/A2

9

P1.1

/TA

2.1

/VE

RE

F+

/A1

10

P1.0

/TA

1.1

/TA

0.0

/VE

RE

F-/A

011

P2.4

/PM

_TA

2.0

12

P2.5

/PM

_U

CB

0S

OM

I/PM

_U

CB

0S

CL

13

P2.6

/PM

_U

SB

0S

IMO

/PM

_U

CB

0S

DA

14

P2.7

/PM

_U

CB

0C

LK

15

P3.0

/PM

_U

CA

0R

XD

/PM

_U

CA

0S

OM

I16

P3.1

/PM

_U

CA

0T

XD

/PM

_U

CA

0S

IMO

17

P3.2

/PM

_U

CA

0C

LK

18

P3.3

/PM

_U

CA

1C

LK

19

P3.4

/PM

_U

CA

1R

XD

/PM

_U

CA

1S

OM

I20

P3.5

/PM

_U

CA

1T

XD

/PM

_U

CA

1S

IMO

21

CO

M0

22

CO

M1

23

P1.6

/CO

M2

24

P1.7

/CO

M3

25

P5.0

/CO

M4

26

P5.1

/CO

M5

27

P5.2

/CO

M6

28

P5.3

/CO

M7

29

LC

DC

AP

/R33

30

P5.4

/SD

CLK

/R23

31

P5.5

/SD

0D

IO/L

CD

RE

F/R

13

32

P5.6

/SD

1D

IO/R

03

33

P5.7

/SD

2D

IO/C

B2

34

P6.0

/SD

3D

IO35

P3.6

/PM

_U

CA

2R

XD

/PM

_U

CA

2S

OM

I36

P3.7

/PM

_U

CA

2T

XD

/PM

_U

CA

2S

IMO

37

P4.0

/PM

_U

CA

2C

LK

38

P4.1/PM_UCA3RXD/PM_UCA3SOMI39

P4.2/PM_UCA3TXD/PM_UCA3SIMO40

P4.3/PM_UCA3CLK41

P4.4/PM_UCB1SOMI/PM_UCB1SCL42

P4.5/PM_UCB1SIMO/PM_UCB1SDA43

P4.6/PM_UCB1CLK44

P4.7/PM_TA3.045

P6.1/SD4DIO/S3946

P6.2/SD5DIO/S3847

P6.3/SD6DIO/S3748

P6.4/S3649

P6.5/S3550

P6.6/S3451

P6.7/S3352

P7.0/S3253

P7.1/S3154

P7.2/S3055

P7.3/S2956

P7.4/S2857

P7.5/S2758

P7.6/S2659

P7.7/S2560

P8.0/S2461

P8.1/S2362

P8.2/S2263

P8.3/S2164

P8.4

/S20

65

P8.5

/S19

66

P8.6

/S18

67

P8.7

/S17

68

DV

SY

S69

DV

SS

270

P9.0

/S16

71

P9.1

/S15

72

P9.2

/S14

73

P9.3

/S13

74

P9.4

/S12

75

P9.5

/S11

76

P9.6

/S10

77

P9.7

/S9

78

P10.0

/S8

79

P10.1

/S7

80

P10.2

/S6

81

P10.3

/S5

82

P10.4

/S4

83

P10.5

/S3

84

P10.6

/S2

85

P10.7

/S1

86

P11

.0/S

087

P11

.1/T

A3.1

/CB

388

P11

.2/T

A1.1

89

P11

.3/T

A2.1

90

P11

.4/C

BO

UT

91

P11

.5/T

AC

LK

/RT

CC

LK

92

P2.0

/PM

_TA

0.0

93

P2.1

/PM

_TA

0.1

94

P2.2

/PM

_TA

0.2

95

P2.3

/PM

_TA

1.0

96

TE

ST

/SB

WT

CK

97

PJ.0

/TD

O98

PJ.1

/TD

I/TC

LK

99

PJ.2

/TM

S100

PJ.3

/TC

K101

~R

ST

/NM

I/SB

WT

DIO

102

SD0P0103

SD0N0104

SD1P0105

SD1N0106

SD2P0107

SD2N0108

SD3P0109

SD3N0110

VASYS2111

AVSS2112

VREF113

SD4P0114

SD4N0115

SD5P0116

SD5N0117

SD6P0118

SD6N0119

AVSS1120

AVCC121

VASYS1122

AUXVCC2123

AUXVCC1124

VDSYS125

DVCC126

DVSS1127

VCORE128

P1.0

P1.0

P2.0

P2.0

P2.1

P2.1

SD0P0SD0N0SD1P0SD1N0SD2P0SD2N0SD3P0SD3N0

SD4P0SD4N0SD5P0SD5N0SD6P0SD6N0

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SY

S1/2

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VASYS1/2

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TM

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TD

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GND

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AVCC

DV

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DV

DS

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DV

DS

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DVDSYS

AVSS

AVSS

PJ.2

PJ.2

PJ.1

PJ.1

PJ.0

PJ.0

RS

T/N

MI

RS

T/N

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TC

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TC

K

TC

KP

J.3

PJ.3

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CK

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CK

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RS

T

RS

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RS

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LC

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DC

AP

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RE

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Do

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Re

v.:

www.ti.com MSP-TS430PEU128

B.37 MSP-TS430PEU128

Figure B-73. MSP-TS430PEU128 Target Socket Module, Schematic



http://www.ti.com


1

P1.0

SB

W

JTA

G

DVDSYS

ext

int

MSP-TS430PEU128Rev. 1.1 RoHS

DVCC

AUXVCC

GND

AU

XV

CC

1

AU

XV

CC

2

AU

XV

CC

3

GND

GND

RST/NMI

TCK

TDI

TDO

TEST/SBWTCK

TMS1

25

51

01

52

03

03

5

6040 45 50 55 64

65

90

70

75

80

85

95

10

0

125 105110115120128

14

12

10

12G

ND

GN

D

VC

C

123

123

123

123

123

123

12

34

12

34

12

34

1

J1

J2

J3

J4

JTA

G

R2

C2

C1

R1

C5R3

BOOTST

C3

R1

0R

11

J5

JP

1

JP

2

JP5

JP6

JP7

JP8

JP9

JP

10

R7

R5

D1

R6

R8

C6

C29

C7

C1

0

R4

JP

12

JP

11

JP

13

C4

C11

C1

2

C8

C1

3

C1

4

C9

C1

6

C1

9

C1

8

C2

6

JP

4

JP3

C1

5C

17

TP1

TP2

IC1





JP11, JP12, JP13Connect 1-2 to connect AUXVCCx with DVCC or

drive AUXVCCx externally






MSP-TS430PEU128 www.ti.com

Figure B-74. MSP-TS430PEU128 Target Socket Module, PCB


NOTE: The MSP-TS430PEU128 Rev 1.1 ships with the following modifications:• R7 value is changed to 0 Ω instead of 330 Ω.• JTAG pin 8 is connected only to JP5 pin 3, and not to pin 2.• JP5 pin 2 is connected to IC1 pin 97.• BOOTST pin 7 is connected to IC1 pin 97.



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www.ti.com MSP-TS430PEU128

Table B-38. MSP-TS430PEU128 Bill of MaterialsNo. PerPos. Ref Des Description Digi-Key Part No. CommentBoard

94x119.4mm, 4 layers MSP-TS430PEU128 4 layers, green solder mask1 PCB 1 Rev. 1.1

2 D1 1 green LED, DIODE0805 516-1434-1-ND

3 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header

JP5, JP6, JP7, JP8, 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 1-2 (SBW)4 6JP9, JP10

5 JP11, JP12, JP13 3 4-pin header, male, TH SAM1035-04-ND Place jumpers on pins 1-2 (AVCC=VCC)

6 JP3 1 4-pin header, male, TH SAM1035-04-ND Place jumpers on pins 1-2

JP1, JP2, JP3, JP4, Jumper WM4592-NDJP5, JP6, JP7, JP8,7 13JP9, JP10, JP11,

JP12, JP13

8 R1, R2, R4, R6, R8 5 0R, 0805 541-0.0ATR-ND

9 R10, R11 2 0R, 0805 541-0.0ATR-ND DNP

10 C3 1 2.2nF, CSMD0805 490-1628-2-ND DNP

C13, C14, C16, C17, 4.7uF, 6.3V, CSMD0805 587-1302-2-ND11 7C18, C19, C29

12 C11 1 10uF, 6.3V, CSMD0805 445-1372-2-ND

13 C12 1 10uF, 6.3V, CSMD0805 445-1372-2-ND DNP

14 C1, C2 2 12pF, CSMD0805 490-5531-2-ND DNP

15 R5 1 47K, 0805 311-47KARTR-ND

C4, C5, C6, C7, C8, 100nF, CSMD0805 311-1245-2-ND16 6C15

17 C9 1 100nF, CSMD0805 311-1245-2-ND DNP

18 R3, R7 2 330R, 0805 541-330ATR-ND

19 C10, C26 2 470nF, CSMD0805 587-1282-2-ND

20 BOOTST 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder

21 JTAG 1 14-pin connector, male, TH HRP14H-ND

22 IC1 Socket 1 Socket: IC500-1284-009P Manuf. Yamaichi

23 IC1 2 MSP430F67791IPEU DNP: enclosed with kit. Is supplied by TI

24 J5 1 3-pin header, male, TH SAM1035-03-ND

Crystal: MS3V-T1R 32.768kHz DNP: Crystal enclosed with kit. Keep vias free25 Q1 1 12.5pF ±20ppm of solder

26 TP1, TP2 2 Test point DNP, keep vias free of solder

26-pin header, TH SAM1029-26-ND DNP: Headers enclosed with kit. Keep vias free27 J2,J4 2 of solder.

26-pin receptable, TH SAM1213-26-ND DNP: Receptacles enclosed with kit. Keep vias28 J2,J4 2 free of solder.

38-pin header, TH SAM1029-38-ND DNP: Headers enclosed with kit. Keep vias free29 J1, J3 2 of solder.

38-pin receptable, TH SAM1213-38-ND DNP: Receptacles enclosed with kit. Keep vias30 J1, J3 2 free of solder.

31 Rubber feet 4 Rubber feet Buerklin: 20H1724 apply to bottom side corners



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EM430F5137RF900 www.ti.com

B.38 EM430F5137RF900

Figure B-75. EM430F5137RF900 Target Board, Schematic



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CON12External power connector

Jumper JP2 to "EXT" GND

GND

VCC

Jumpers JP5, JP10Open to disconnect LEDs

D2LED (red) connectedto P3.6 through JP10

D1LED (green) connected

to P1.0 through JP5

Crystal Q1RF - 26 MHz

X1RF - Signal SMA

Button S1Reset

Push-button S2Connected to P1.7

Jumper JP1 in Spy-Bi-Wire mode

Q3Footprint for 32-kHz crystal

R431 and R441

Use 0- resistor to make XIN and XOUTavailable on connector Port 5

W


Jumper JP2Close INT for power supply from JTAG interfaceClose EXT to external power supply (CON12)



Jumper JP1

Close SBW position to debug in Spy-Bi-Wire modeClose JTAG position to debug in 4-wire JTAG mode

www.ti.com EM430F5137RF900

Figure B-76. EM430F5137RF900 Target board, PCB

The battery pack that is included with the EM430F5137RF900 kit may be connected to CON12. Ensurecorrect battery insertion regarding the polarity as indicated in battery holder.



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Table B-39. EM430F5137RF900 Bill of Materials

No. per Manufacturer's PartItem Reference Description Value Manufacturer CommentBoard Number( CUSTOMER SUPPLY ) AKER1 Q1 1 26M ASX-531(CS)CRYSTAL, SMT, 4P, 26MHz ELECTRONIC

C1-C5, C082,C222, C271, CAPACITOR, SMT, 0402, CER,2 C281, C311, 14 0.1uF 0402YC104KAT2A AVX16V, 10%, 0.1uFC321, C341,C412, C452

CAPACITOR, SMT, 0603,3 C071 1 CERAMIC, 0.47uF, 16V, 10%, 0.47uF 0603YD474KAT2A AVX

X5R4 R401 1 RES0402, 47.0K 47kΩ CRCW04024702F100 DALE

HEADER, THU, MALE, 14P,5 CON11 1 09 18 514 6323 HARTING2X7, 25.4x9.2x9.45mmHEADER, THU, MALE, 10P,6 CON10 0 09 18 510 6323 HARTING DNP2X5, 20.32x9.2x9.45mm

7 D1 1 LED, SMT, 0603, GREEN, 2.1V active APT1608MGC KINGBRIGHT8 D2 1 LED, SMT, 0603, RED, 2.0V active APT1608EC KINGBRIGHT

UNINSTALLED CRYSTAL, SMT, MICRO9 Q3 0 32.768k MS1V-T1K (UN) DNP3P, MS1V (Customer Supply) CRYSTALHEADER, THU, MALE, 3P, 1x3,10 CON12 1 22-03-5035 MOLEX9.9x4.9x5.9mm

11 C251, C261 2 50V, 5%, 27pF 27pF GRM36COG270J50 MURATAFERRITE, SMT, 0402, 1.0kΩ,12 L341 1 1kΩ BLM15HG102SN1D MURATA250mACAPACITOR, SMT, 0402,

13 C293 1 CERAMIC, 100pF, 50V, 0.25pF, 100pF GRM1555C1H101JZ01 MURATAC0G(NP0)INDUCTOR, SMT, 0402, 2.2nH, 0.0022u14 L304 1 LQP15MN2N2B02 MURATA0.1nH, 220mA, 500MHz HINDUCTOR, SMT, 0402, 15nH,15 L303, L305 2 0.015uH LQW15AN15NG00 MURATA2%, 450mA, 250MHzINDUCTOR, SMT, 0402, 18nH,16 L292, L302 2 0.018uH LQW15AN18NG00 MURATA2%, 370mA, 250MHzCAPACITOR, SMT, 0402,

17 C291 1 CERAMIC, 1pF, 50V, 0.05pF, 1pF GRM1555C1H1R0WZ01 MURATAC0G(NP0)CAPACITOR, SMT, 0402,

18 C303 1 CERAMIC, 8.2pF, 50V, 0.05pF, 8.2pF GRM1555C1H8R2WZ01 MURATAC0G(NP0)CAPACITOR, SMT, 0402,C292, C301-19 4 CERAMIC, 1.5pF, 50V, 0.05pF, 1.5pF GRM1555C1H1R5WZ01 MURATAC302, C304 C0G(NP0)INDUCTOR, SMT, 0402, 12nH,20 L291, L301 2 0.012uH LQW15AN12NG00 MURATA2%, 500mA, 250MHz

C282, C312, CAPACITOR, SMT, 0402,21 C351, C361, 5 CERAMIC, 2pF, 50V, 0.1pF, 2.0pF GRM1555C1H2R0BZ01 Murata

C371 C0GINDUCTOR, SMT, 0402, 6.2nH,22 L1 1 6.2nH LQP15MN6N2B02 Murata0.1nH, 130mA, 500MHzULTRA-SMALL TACTILE

23 S1-S2 2 SWITCH, SMT, 2P, SPST-NO, B3U-1000P OMRON1.2x3x2.5mm, 0.05A, 12V

R4-R5, R051, UNINSTALLED24 R061, R431, 0 RESISTOR/JUMPER, SMT, 0Ω ERJ-2GE0R00X PANASONIC DNP

R441 0402, 0 Ω, 5%, 1/16WRESISTOR/JUMPER, SMT,24a R7 1 0Ω ERJ-2GE0R00X PANASONIC0402, 0 Ω, 5%, 1/16W



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Table B-39. EM430F5137RF900 Bill of Materials (continued)No. per Manufacturer's PartItem Reference Description Value Manufacturer CommentBoard Number

RESISTOR, SMT, 0402, THICK25 R2-R3, R6 3 330Ω ERJ-2GEJ331 PANASONICFILM, 5%, 1/16W, 330CAPACITOR, SMT, 0402, CER,26 C431, C441 0 12pF ECJ-0EC1H120J PANASONIC12pF, 50V, 5%, NPOCAPACITOR, SMT, 0402, CER,27 C401 1 0.0022uF ECJ-0EB1H222K PANASONIC2200pF, 50V, 10%, X7RRESISTOR, SMT, THICK FILM,28 R331 1 56kΩ ERJ-2GEJ563 PANASONIC56K, 1/16W, 5%CAPACITOR, SMT, 0603,C081, C221,29 4 CERAMIC, 10uF, 6.3V, 20%, 10uF ECJ-1VB0J106M PANASONICC411, C451 X5RRESISTOR/JUMPER, SMT,30 R1 1 0Ω ERJ-2GE0R00X PANASONIC0402, 0 Ω, 5%, 1/16WUNINSTALLED CAP CERAMIC31 C041 0 4.7uF ECJ-1VB0J475K Panasonic DNP4.7UF 6.3V X5R 0603

32 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER33 Q2 0 Crystal, SMT, 32.768 kHz 32.768k MS3V-T1R Micro Crystal DNP

DUT, SMT, PQFP, RGZ-48,34 U1 1 0.5mmLS, 7.15x7.15x1mm, CC430F5137 TI

THRM.PAD35 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH36 CON1-CON9 0 Pin Connector 2x4pin 61300821121 WUERTH DNP37 JP2 1 Pin Connector 1x3pin 61300311121 WUERTH

JP3, JP5,38 3 Pin Connector 1x2pin 61300211121 WUERTHJP1038a JP7, CON13 0 Pin Connector 1x2pin 61300211121 WUERTH DNP39 JP4 1 Pin Connector 2x2pin 61300421121 WUERTH DNP40 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH



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B.39 EM430F6137RF900




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CON12External power connector

Jumper JP2 to "EXT"

Jumpers JP5, JP10Open to disconnect LEDs

D2LED (red) connectedto P3.6 JP10through


to P1.0 JP5through


X1RF - Signal SMA

Button S1Reset

Push-button S2Connected to P1.7

Q2/Q3Footprint for 32-kHz crystal


GND

GND

VCC

C392C422

L451

Jumper JP1 in Spy-Bi-Wire mode

Jumper JP2Close INT for power supply from JTAG interfaceClose EXT to external power supply (CON12)

Jumper JP1

Close SBW position to debug in Spy-Bi-Wire modeClose JTAG position to debug in 4-wire JTAG mode

R541 and R551

Use 0- resistor to make P5.0 and P5.1available on connector Port 5

W




Figure B-78. EM430F6137RF900 Target Board, PCB

The battery pack that is included with the EM430F6137RF900 kit may be connected to CON12. Ensurecorrect battery insertion regarding the polarity as indicated in battery holder.



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No. perPos. Ref Des Description Part No. ManufacturerBoard( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P, AKER1 Q1 1 ASX-531(CS)26MHz ELECTRONIC

C1-C5, C112,C252, C381, CAPACITOR, SMT, 0402, CER, 16V, 10%,2 C391, C421, 14 0402YC104KAT2A AVX0.1uFC431, C451,C522, C562

CAPACITOR, SMT, 0603, CERAMIC, 0.47uF,3 C101 1 0603YD474KAT2A AVX16V, 10%, X5R4 R511 1 RES0402, 47.0K CRCW04024702F100 DALE

HEADER, THU, MALE, 14P, 2X7,5 CON11 1 09 18 514 6323 HARTING25.4x9.2x9.45mm, 90deg7 D1 1 LED, SMT, 0603, GREEN, 2.1V APT1608MGC KINGBRIGHT8 D2 1 LED, SMT, 0603, RED, 2.0V APT1608EC KINGBRIGHT10 CON12 1 HEADER, THU, MALE, 3P, 1x3, 9.9x4.9x5.9mm 22-03-5035 MOLEX11 C361, C371 2 50V, ±5%, 27pF GRM36COG270J50 MURATA12 L451 1 FERRITE, SMT, 0402, 1.0kΩ, 250mA BLM15HG102SN1D MURATA

CAPACITOR, SMT, 0402, CERAMIC, 100pF,13 C403 1 GRM1555C1H101JZ01 MURATA50V, ±0.25pF, C0G(NP0)INDUCTOR, SMT, 0402, 2.2nH, ±0.2nH,14 L414 1 LQW15AN2N2C10 MURATA1000mA, 250MHzINDUCTOR, SMT, 0402, 15nH, ±5%, 460mA,15 L413, L415 2 LQW15AN15NJ00 MURATA250MHzINDUCTOR, SMT, 0402, 18nH, ±5%, 370mA,16 L402, L412 2 LQW15AN18NJ00 MURATA250MHzCAPACITOR, SMT, 0402, CER, 1pF, 50V,17 C401 1 GJM1555C1H1R0CB01D MURATA±0.25pF, NP0CAPACITOR, SMT, 0402, CERAMIC, 8.2pF,18 C413 1 GRM1555C1H8R2CZ01 MURATA50V, ±0.25pF, C0G(NP0)

C402, C411- CAPACITOR, SMT, 0402, CERAMIC, 1.5pF,19 4 GRM1555C1H1R5CZ01 MURATAC412, C414 50V, ±0.25pF, C0G(NP0)INDUCTOR, SMT, 0402, 12nH, ±5%, 500mA,20 L401, L411 2 LQW15AN12NJ00 MURATA250MHz

C46-C48, C392, CAPACITOR, SMT, 0402, CERAMIC, 2.0pF,21 5 GRM1555C1H2R0CZ01 MurataC422 50V, ±0.25pF, C0G(NP0)INDUCTOR, SMT, 0402, 6.2nH, ±0.1nH, 700mA,22 L1 1 LQW15AN6N2D00 Murata250MHzULTRA-SMALL TACTILE SWITCH, SMT, 2P,23 S1-S2 2 B3U-1000P OMRONSPST-NO, 1.2x3x2.5mm, 0.05A, 12VRESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,24 R7 1 ERJ-2GE0R00X (UN) PANASONIC1/16WRESISTOR, SMT, 0402, THICK FILM, 5%,25 R2-R3, R6 3 ERJ-2GEJ331 PANASONIC1/16W, 330CAPACITOR, SMT, 0402, CER, 2200pF, 50V,27 C511 1 ECJ-0EB1H222K PANASONIC10%, X7R

C111, C251, CAPACITOR, SMT, 0603, CERAMIC, 10uF,28 4 ECJ-1VB0J106M PANASONICC521, C561 6.3V, 20%, X5R28a C041 1 CAP CERAMIC 4.7UF 6.3V X5R 0603 ECJ-1VB0J475M PANASONIC29 R441 1 RESISTOR, SMT, THICK FILM, 56K, 1/16W, 1% ERJ-2RKF5602 PANASONIC

RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,30 R1 1 ERJ-2GE0R00X PANASONIC1/16W31 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER

DUT, SMT, PQFP, RGC-64, 0.5mmLS,33 U1 1 CC430F6137 TI9.15x9.15x1mm, THRM.PAD34 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH



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Table B-40. EM430F6137RF900 Bill of Materials (continued)No. perPos. Ref Des Description Part No. ManufacturerBoard

35 JP2 1 Pin Connector 1x3pin 61300311121 WUERTH36a JP3, JP5, JP10 3 Pin Connector 1x2pin 61300211121 WUERTH38 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH



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B.40 EM430F6147RF900




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to P1.0 JP5through

Jumpers JP5 and JP10Open to disconnect LEDs

D2LED (red) connectedto P3.6 through JP10

Jumpers JP6 and JP8Close 1-2 for Bypass modeClose 2-3 for TPS modeJumper JP9

TPS status



TPS62730

Jumper JP2Close INT: Power supply from JTAG interfaceClose EXT: External power supply

Button S2Connected to P1.7

32-kHz crystal

R554 and R551

Use 0- resistor to make P5.0 and P5.1available on connector Port 5

W

Button S1Reset


CON12External poser connector

Jumper JP2 to "EXT"


SMA1RF - Signal SMA

Jumper JP1Close JTAG position to debug in JTAG modeClose SBW position to debug in Spy-BI-Wire mode


Figure B-80. EM430F6147RF900 Target Board, PCB

The battery pack which comes with the EM430F6147RF900 kit may be connected to CON12. Ensurecorrect battery insertion regarding the polarity as indicated in battery holder.



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No. perPos. Ref Des Description Part No. ManufacturerBoard( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P, AKER1 Q1 1 ASX-531(CS)26MHz ELECTRONIC

C1-5 C112C252 C381 CAPACITOR, SMT, 0402, CER, 16V, 10%,2 C391 C421 14 0402YC104KAT2A AVX0.1uFC431 C451C522 C562

CAPACITOR, SMT, 0603, CERAMIC, 0.47uF,3 C101 1 0603YD474KAT2A AVX16V, 10%, X5R4 R511 1 RES0402, 47.0K CRCW04024702F100 DALE

HEADER, THU, MALE, 14P, 2X7,5 CON11 1 09 18 514 6323 HARTING25.4x9.2x9.45mm, 90deg7 D1 1 LED, SMT, 0603, GREEN, 2.1V APT1608MGC KINGBRIGHT8 D2 1 LED, SMT, 0603, RED, 2.0V APT1608EC KINGBRIGHT10 CON12 1 HEADER, THU, MALE, 3P, 1x3, 9.9x4.9x5.9mm 22-03-5035 MOLEX11 C361, C371 2 50V, ±5%, 27pF GRM36COG270J50 MURATA12 L451 1 Inductor, SMD, 0402, 12nH, 5%, 370mA LQW15AN12NJ00 MURATA

CAPACITOR, SMT, 0402, CERAMIC, 100pF,13 C403 1 GRM1555C1H101JZ01 MURATA50V, ±0.25pF, C0G(NP0)INDUCTOR, SMT, 0402, 2.2nH, ±0.2nH,14 L414 1 LQW15AN2N2C10 MURATA1000mA, 250MHzInductor, SMD, 0402, 15nH, 5%, 370mA,15 L413 1 LQW15AN15NJ00 MURATA250MHzINDUCTOR,SMT,0402,15nH,±5%,460mA,250M15 L415 1 LQW15AN15NJ00 MURATAHzInductor, SMD, 0402, 18nH, 5%, 460mA,16 L402, L412 2 LQW15AN18NJ00 MURATA250MHzCAPACITOR, SMT, 0402, CER, 1pF, 50V,17 C401 1 GJM1555C1H1R0CB01D MURATA±0.25pF, NP0CAPACITOR, SMT, 0402, CERAMIC, 8.2pF,18 C413 1 GRM1555C1H8R2CZ01 MURATA50V, ±0.25pF, C0G(NP0)

C402, C411- CAPACITOR, SMT, 0402, CERAMIC, 1.5pF,19 4 GRM1555C1H1R5CZ01 MURATAC412, C414 50V, ±0.25pF, C0G(NP0)INDUCTOR, SMT, 0402, 12nH, ±5%, 500mA,20 L1, L401, L411 3 LQW15AN12NJ00 MURATA250MHzCAPACITOR, SMT, 0402, CERAMIC, 2.0pF,21 C46-C48, C392 4 GRM1555C1H2R0CZ01 MURATA50V, ±0.25pF, C0G(NP0)Inductor, SMD, 0805, 2.2uH, 20%, 600mA,22 L2 1 LQM21PN2R2MC0 MURATA50MHzULTRA-SMALL TACTILE SWITCH, SMT, 2P,23 S1-S2 2 B3U-1000P OMRONSPST-NO, 1.2x3x2.5mm, 0.05A, 12V

R1, R7, R551, RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,24 4 ERJ-2GE0R00X (UN) PANASONICR554 1/16WRESISTOR, SMT, 0402, THICK FILM, 5%,25 R2-R3, R6 3 ERJ-2GEJ331 PANASONIC1/16W, 330CAPACITOR, SMT, 0402, CER, 2200pF, 50V,27 C511 1 ECJ-0EB1H222K PANASONIC10%, X7R

C111, C251, CAPACITOR, SMT, 0603, CERAMIC, 1uF, 6.3V,28 4 ECJ-1VB0J105K PANASONICC521, C561 20%, X5R28a C041 1 CAP CERAMIC 4.7UF 6.3V X5R 0603 ECJ-1VB0J475M PANASONIC29 R441 1 RESISTOR, SMT, THICK FILM, 56K, 1/16W, 1% ERJ-2RKF5602 PANASONIC30 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER

DUT, SMT, PQFP, RGC-64, 0.5mmLS,31 U1 1 CC430F6147 TI9.15x9.15x1mm, THRM.PAD



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Table B-41. EM430F6147RF900 Bill of Materials (continued)No. perPos. Ref Des Description Part No. ManufacturerBoard

IC, Step Down Converter with Bypass Mode for33 U2 1 TPS62370 TILow Power Wireless34 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH35 JP2, JP6, JP8 3 Pin Connector 1x3pin 61300311121 WUERTH

JP3, JP5, JP9,36a 4 Pin Connector 1x2pin 61300211121 WUERTHJP1038 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH38 C7 1 Capacitor, Ceramic, 1206, 16V, X5R, 20% GRM31CR61C226ME15L MURATA38 C8-9 2 CAP, SMD, Ceramic, 0402, 2.2uF, X5R GRM155R60J225ME15D MURATA

CAP, SMD, Ceramic, 0603, 4.7uF, 16V, 10%,38 C041 1 MURATAX5R



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MSP-FET www.ti.com

B.41 MSP-FETThe MSP-FET is a powerful flash emulation tool to quickly begin application development on MSP430microcontrollers.

The MSP-FET provides a USB interface to program and debug the MSP430 devices in-system throughthe JTAG interface or the pin-saving Spy-Bi-Wire (2-wire JTAG) protocol. Furthermore, the USB interfacecan be used for UART backchannel and MSP target BSL communication. UART and I2C BSLcommunication modes are supported.

The MSP-FET development tool supports development with all MSP430 devices and is designed for usewith PCBs that contain MSP430 devices; for example, the MSP430 target socket boards.

B.41.1 Features• USB debugging interface to connect a MSP430 MCU to a PC for real-time in-system programming and

debugging• Software configurable supply voltage between 1.8 V and 3.6 V at 100 mA• Supports JTAG Security Fuse blow to protect code• Supports all MSP430 boards with JTAG header• Supports both JTAG and Spy-Bi-Wire (2-wire JTAG) debug protocols

B.41.2 Release NotesThe MSP-FET is supported by MSP Debug Stack (MSPDS) revision 3.4.0.20 and higher. Observe thefollowing MSPDS-specific MSP-FET limitations.

B.41.2.1 MSPDS 3.4.0.20 Limitations• EEM access to F149 and L092 devices is possible only when JTAG speed is set to slow.• Poly Fuse Blow in Spy-Bi-Wire mode is in beta state and is not officially supported.• The UART backchannel function is not implemented (even though an additional COM port is shown on

the PC).

B.41.2.2 MSPDS UART Backchannel ImplementationIn MSPDS v3.4.1.0 and later, the UART backchannel function is implemented and supported for the MSP-FET. The baud rates that are supported depend on the target configuration and the debug settings.Table B-42 shows which baud rates are supported with certain configuration combinations.A green cell with means that the corresponding baud rate is supported without any data loss with thespecified combination of settings.A red cell with means that the corresponding baud rate is not supported (data loss is expected) with thespecified combination of settings.

Table B-42. UART Backchannel Implementation

Target MCLK 1 MHz 1 MHz 8 MHz 8 MHz 1 MHz 1 MHz 8 MHz 8 MHzFrequency:Debugger: Active Active Active Active Inactive Inactive Inactive InactiveFlow Control: No Yes No Yes No Yes No Yes4800 baud 9600 baud 19200 baud 28800 baud 38400 baud 57200 baud 115200 baud



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Figure B-81. MSP-FET Top View

Figure B-82. MSP-FET Bottom View

B.41.2.3 MSPDS UART Backchannel Activation CommandsThe MSP-FET supports two different backchannel UART modes, one with flow control and one without.The different modes can be selected by opening the corresponding COM port with a dedicated baud rate.See Table B-43 for the specific baud rates for each command.

NOTE: The baud rates used by these commands cannot be used for communication.

If none of the specified commands are transferred before setting the communication baud rate,communication starts with these default settings: 3.3-V target VCC, no flow control mechanism.

Table B-43. UART Backchannel Activation Commands

Baud Rate Command9620 Set all backchannel UART pins to high impedance – no current flow into target device9621 Configure backchannel UART communication without handshake (default start behavior)9622 Configure backchannel UART communication with handshake9623 Voltage configuration command.

When this command is received, target VCC is set to 3300 mV. After target VCC is configured, it is switchedthrough to the target device.



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B.41.2.4 MSPDS MSP Target BSL Activation CommandsThe MSP-FET can be used for communication with the target device BSL through the I2C and UARTprotocols. The activation of the different protocols is equivalent to the MSP-FET backchannel UART. SeeTable B-44 for command details. In MSP-FET BSL communication mode, flow control is not available,because this is not supported by the MSP target device BSL.

UART BSL: The MSP-FET BSL UART mode supports the following baud rates: 9600, 14400, 19200,28800, 38400, 56000, 57600, and 115200. For the BSL UART, 8 + 1 + even parity is used.

I2C BSL: The MSP-FET is always the I2C master, and the target device BSL is always the I2C slave. 7-bitI2C addressing mode is used with a fixed I2C slave address of 0x48.

NOTE: If the MSP-FET is configured to support BSL communication, debugger functionality isdisabled. To switch to debugger mode, either perform a power cycle (unplug the USB cable)or configure the baud rate to 8001.

Table B-44. MSP Target BSL Activation Commands

Baud Rate Command9620 Set all UART or I2C pins to high impedance – no current flow into target device9601 BSL entry sequence and power up 3.3 V (UART BSL)

100000 or 100001 BSL entry sequence and power up 3.3 V (I2C BSL)400000 or 400001 BSL entry sequence and power up 3.3 V (I2C BSL)

9623 Power up 3.3 V8001 Activate debugger



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MS

P-F

ET

Rev 1

.2

1

3/1

2/2

014

3/1

2/2

014

C

4

AB

CD

Date

E

Sheet

of

F

4 2

1

Title

3 1

AB

CD

E

Siz

eN

um

ber

F

23

Rev

1

A

5

Genera

lpow

er s

upply

Additio

nalsupply

LED

USB in

terfa

ce

Host M

CU

DVCC1

DVCC3

DVCC2

AVCC1

Debug i/f

USB B

SL a

ctiv

atio

n

VBU

S b

ypass

1P6.4

/CB4/A

4

2P6.5

/CB5/A

5

3P6.6

/CB6/A

6/D

AC0

4P6.7

/CB7/A

7/D

AC1

5P7.4

/CB8/A

12

6P7.5

/CB9/A

13

7P7.6

/CB10/A

14/D

AC0

8P7.7

/CB11/A

15/D

AC1

9P5.0

/VREF+

/VEREF+

10

P5.1

/VREF-/V

EREF-

11

AVCC1

12

AVSS1

13

XIN

14

XO

UT

15

AVSS2

16

P5.6

/AD

C12CLK/D

MAE0

17

P2.0

/P2M

AP0

18

P2.1

/P2M

AP1

19

P2.2

/P2M

AP2

20

P2.3

/P2M

AP3

21

P2.4

/P2M

AP4

22

P2.5

/P2M

AP5

23

P2.6

/P2M

AP6/R

03

24

P2.7

/P2M

AP7/L

CD

REF/

25

DVCC1

26DVSS1

27VCORE(2)

28P5.2/R23

29LCDCAP/R33

30COM0

31P5.3/COM1/S42

32P5.4/COM2/S41

33P5.5/COM3/S40

34P1.0/TA0CLK/ACLK/S3

35P1.1/TA0.0/S38

36P1.2/TA0.1/S37

37P1.3/TA0.2/S36

38P1.4/TA0.3/S35

39P1.5/TA0.4/S34

40P1.6/TA0.1/S33

41P1.7/TA0.2/S32

42P3.0/TA1CLK/CBOUT/S

43P3.1/TA1.0/S30

44P3.2/TA1.1/S29

45P3.3/TA1.2/S28

46P3.4/TA2CLK/SMCLK/S

47P3.5/TA2.0/S26

48P3.6/TA2.1/S25

49P3.7/TA2.2/S24

50P4.0/TB0.0/S23

51

P4.1

/TB0.1

/S22

52

P4.2

/TB0.2

/S21

53

P4.3

/TB0.3

/S20

54

P4.4

/TB0.4

/S19

55

P4.5

/TB0.5

/S18

56

P4.6

/TB0.6

/S17

57

P4.7

/TB0O

UTH

/SVM

OU

T

58

P8.0

/TB0CLK/S

15

59

P8.1

/UCB1STE

60

P8.2

/UCA1TXD

61

P8.3

/UCA1RXD

62

P8.4

/UCB1CLK/U

CA1ST 6

3D

VSS2

64

DVCC2

65

P8.5

/UCB1SIM

O

66

P8.6

/UCB1SO

MI

67

P8.7

/S8

68

P9.0

/S7

69

P9.1

/S6

70

P9.2

/S5

71

P9.3

/S4

72

P9.4

/S3

73

P9.5

/S2

74

P9.6

/S1

75

P9.7

/S0

76VSSU

77PU.0/DP

78PUR

79PU.1/DM

80VBUS

81VUSB

82V18

83AVSS3

84P7.2/XT2IN

85P7.3/XT2OUT

86VBAK

87VBAT

88P5.7/RTCCLK

89DVCC3

90DVSS3

91TEST/SBWTCK

92PJ.0/TDO

93PJ.1/TDI/TCLK

94PJ.2/TMS

95PJ.3/TCK

96RST/NMI/SBWTDIO

97P6.0/CB0/A0

98P6.1/CB1/A1

99P6.2/CB2/A2

100P6.3/CB3/A3

U1

MSP430F6638IP

ZR

C6

100n

+C5

10uF/6

.3V

C7

100n

C9

100n

C11

100n

R1

0R

C15

68p

C16

470n

C17

220n

C18

4.7

nD

1D

2

R47 470R

R50

0R

1 IO1

2 IO2

3 GND 4IO3

5IO4

6VCC

U5

TPD4E004DRYR

R2

1k4

C14

4.7

u, d

np

C23

100n

R60

33k

C31

10p

C33

10p

R61

1M

R62

100R

J5

C8

220n

13

2

P1

R17

0R

AC

D7

B0530W

-7-F

R76

27k

C70

4.7

u, d

np

C71

100n

R85

0R, dnp

C55

1n

R3

27R

R45

27R

R46 470R

+C12

10uF/6

.3V

12345

67

1110

J1

R28

4k7

R30

4k7

1

1

11

111

11

1

11

1

11

1

11

11

1

1

VCC_D

T_REF

VCC_D

CD

C_REF

VCC_D

T2TRG

T_CTRL

VCC_SU

PPLY

2TRG

T_CTRL

LED1

TDIOFF_CTRL

PW

M_SETVF

FPG

A_TCK

FPG

A_TD

I

FPG

A_TM

S

FPG

A_TD

O

FPG

A_TRST

VF2TEST_CTRL

VF2TDI_CTRL

AVCC_PO

D

VCC_PO

D33

VCC_PO

D33

VCC_POD33

VREF+

VCORE

VBAK

MCU

_D

MAE0

DCD

C_PU

LSE

MCU

_P2.2

MCU

_P2.3

MCU

_P2.4

MCU

_P2.5

MCU

_P2.6

MCU

_P2.7

MCU_P1.0

MCU_P1.1

MCU_P1.2

MCU_P1.3

MCU_P1.4

MCU_P1.5

MCU_P1.6

MCU_P1.7

MCU_P3.0

MCU_P3.1

MCU_P3.2

MCU_P3.3

MCU_P3.4

MCU_P3.5

MCU_P3.6

MCU_P3.7

MCU_P4.0

MCU

_P4.1

MCU

_P4.2

MCU

_P4.3

MCU

_P4.4

MCU

_P4.5

MCU

_P4.6

MCU

_P4.7

MCU

_P8.1

MCU

_P8.2

MCU

_P8.3

PUR

PU.1/DM

PU.0/DP

VBUS

VUSB

AVCC_PO

D

VCC_PO

D33

VCC_PO

D33

VCC_PO

D33

AVCC_PO

DVCC_PO

D33

VREF+

VCORE

V18

V18

VBAK

HOST_TEST

HOST_RST

FPG

A_RESET

LED0

LED1

PU

R

VU

SB

PU

.1/D

M

PU

.0/D

P

DCD

C_RST

HO

ST_SCL

HO

ST_SD

A

DCD

C_IO

0

LED

0

A_VBUS5

VBU

S

A_VCC_SUPPLY_HOST

DCD

C_TEST

A_VF

MCU

_P9.5

DCDC_IO1

HOST_TCK

HOST_TMS

HOST_TDI

HOST_TDO

VCC_POD33

HO

ST_RST

VCC_PO

D33

GN

D1

VBU

S5

MCU

_P2.1

GN

D1

GN

D1

VCC_D

T2SU

PPLY

_CTRL

A_VCC_D

T

A_VCC_D

T_BSR

A_VCC_SENSE0_TRGT

VCC_POD33

VCC_D

T_SEN

SE

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B.41.3 Schematics

Figure B-83. MSP-FET USB Debugger, Schematic (1 of 5)



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MS

P-F

ET

Re

v 1

.2

3/1

2/2

014

5

1A

2

Rev

3 2

F

Num

ber

Siz

e

ED

CB

A

13

Title

1

24

F

of

Sheet

E

Date

DC

BA

4

C

3/1

2/2

014

VCC_PU

MP

VCC_JT

AG

FPG

A

1G

ND

2G

AA2/IO

51RSB1

3IO

52RSB1

4G

AB2/IO

53RSB1

5IO

95RSB1

6G

AC2/IO

94RSB1

7IO

93RSB1

8IO

92RSB1

9G

ND

10

GFB1/IO

87RSB1

11

GFB0/IO

86RSB1

12

VCO

MPLF

13

GFA0/IO

85RSB1

14

VCCPLF

15

GFA1/IO

84RSB1

16

GFA2/IO

83RSB1

17

VCC

18

VCCIB

1

19

GEC1/IO

77RSB1

20

GEB1/IO

75RSB1

21

GEB0/IO

74RSB1

22

GEA1/IO

73RSB1

23

GEA0/IO

72RSB1

24

VM

V1

25

GN

DQ

26GEA2/IO71RSB1

27FF/GEB2/IO70RSB1

28GEC2/IO69RSB1

29IO68RSB1

30IO67RSB1

31IO66RSB1

32IO65RSB1

33IO64RSB1

34IO63RSB1

35IO62RSB1

36IO61RSB1

37VCC

38GND

39VCCIB1

40IO60RSB1

41IO59RSB1

42IO58RSB1

43IO57RSB1

44GDC2/IO56RSB1

45GDB2/IO55RSB1

46GDA2/IO54RSB1

47TCK

48TDI

49TMS

50VMV1

51

GN

D

52

VPU

MP

53

NC

54

TD

O

55

TRST

56

VJT

AG

57

GD

A1/IO

49RSB0

58

GD

C0/IO

46RSB0

59

GD

C1/IO

45RSB0

60

GCC2/IO

43RSB0

61

GCB2/IO

42RSB0

62

GCA0/IO

40RSB0

63

GCA1/IO

39RSB0

64

GCC0/IO

36RSB0

65

GCC1/IO

35RSB0

66

VCCIB

0

67

GN

D

68

VCC

69

IO31RSB0

70

GBC2/IO

29RSB0

71

GBB2/IO

27RSB0

72

IO26RSB0

73

GBA2/IO

25RSB0

74

VM

V0

75

GN

DQ

76GBA1/IO24RSB0

77GBA0/IO23RSB0

78GBB1/IO22RSB0

79GBB0/IO21RSB0

80GBC1/IO20RSB0

81GBC0/IO19RSB0

82IO18RSB0

83IO17RSB0

84IO15RSB0

85IO13RSB0

86IO11RSB0

87VCCIB0

88GND

89VCC

90IO10RSB0

91IO09RSB0

92IO08RSB0

93GAC1/IO07RSB0

94GAC0/IO06RSB0

95GAB1/IO05RSB0

96GAB0/IO04RSB0

97GAA1/IO03RSB0

98GAA0/IO02RSB0

99IO01RSB0

100IO00RSB0

U2

A3PN

125-V

QG

100

R4

1k

R5

1k

12

L3

33n

+C19

10uF/6

.3V

C20

100n

C21

10n

C22

100n

C34

10n

C35

100n

C36

10n

C37

100n

C38

10n

C39

100n

C40

10n

C41

100n

C42

10n

C43

100n

C44

10n

C45

100n

C46

10n

C47

100n

C48

10n

C49

100n

C50

10n

C51

100n

C52

10n

R44

27R

1

111

1

1 1 1

1

1

1

1

1111

1

VCC_PLF

VCC_PO

D15

VCC_POD15

VCC_PO

D15

VCC_POD15

VCC_PO

D33

VCC_PO

D33

VCC_POD33

VCC_POD33

VCC_PO

D33

VCC_PO

D33

VCC_PO

D33

VCC_PO

D33

VCC_POD33

FPGA_TCK

FPGA_TDI

FPGA_TMS

FPG

A_TRST

MCU_DMAE0

MCU_P2.2

MCU_P2.3

MCU_P2.4

MCU_P2.5

MCU_P2.6

MCU_P1.0

MCU_P1.1

MCU_P1.2

MCU_P1.3

MCU_P1.4

MCU_P1.5

MCU_P1.6

MCU_P1.7

MCU_P3.0

MCU_P3.1

MCU_P3.2

MCU_P3.3

MCU_P3.4

MCU

_P3.5

MCU

_P3.6

MCU

_P3.7

MCU

_P4.0

MCU

_P4.1

MCU

_P4.2

MCU

_P4.3

MCU

_P4.4

MCU

_P4.5

MCU

_P4.6

MCU

_P4.7

MCU

_P8.1

MCU

_P8.2

MCU

_P8.3

FPG

A_IO

_TCK

FPG

A_D

IR_CTRL_TCK

FPG

A_IO

_TM

S

FPG

A_D

IR_CTRL_TM

S

FPG

A_IO

_TD

I

FPG

A_D

IR_CTRL_TD

I

FPG

A_IO

_TD

O

FPG

A_D

IR_CTRL_TD

O

MCU

_P2.7

FPG

A_D

IR_CTRL_RST

FPG

A_IO

_TEST

FPG

A_D

IR_CTRL_TEST

FPG

A_IO

_U

ART_TXD

FPG

A_D

IR_CTRL_U

ART_TXD

FPG

A_IO

_U

ART_RXD

FPG

A_D

IR_CTRL_U

ART_RXD

FPG

A_IO

_U

ART_CTS

FPGA_DIR_CTRL_UART_CTS

FPGA_IO_UART_RTS

FPGA_DIR_CTRL_UART_RTS

FPG

A_TD

O

FPGA_RESET

VCC_PO

D15

VCC_PO

D15

VCC_PO

D33

VCC_PLF

VCC_PO

D33

VCC_PO

D33

FPGA_IO_RST

FPGA_TP0

FPGA_TP1

FPGA_TP2

MCU_P9.5

MCU_P2.1

MSP-FET www.ti.com




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3/1

2/2

014

3/1

2/2

014

C

4

AB

CD

Date

E

Sheet

of

F

4 2

1

3 1

AB

CD

E

Siz

eN

um

ber

F

23

Rev

3

A1

5

S/W

contro

lled D

CD

C c

onverte

r

DCD

C M

CU

refe

rence v

olta

ge

DT le

velshifte

r supply

DCD

C c

alib

ratio

n s

witc

h

DCD

C M

CU

DCD

C M

CU

debug i/f

DT c

urre

nt m

easure

ment s

hunt

DT c

urre

nt s

ense

MSP-F

ET R

ev 1

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Energ

y m

easure

ment m

eth

od p

rote

cte

d u

nder U

.S. P

ate

nt A

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atio

n 1

3/3

29,0

73

and s

ubsequent p

ate

nt a

pplic

atio

ns

1D

VCC

2P1.0

/TA0CLK

3P1.1

/TA0.0

4P1.2

/TA0.1

5P1.3

/AD

C10CLK

6P1.4

/TA0.2

7P1.5

/TA0.0

8P1.6

/TA0.1

9P1.7

/SD

I

10

NM

I-RST

11

TEST/S

BW

TCK

12

XO

UT/P

2.7

13

XIN

/P2.6

14

DVSS

U4

MS

P430G

2452P

W

MSP430G

2452PW

12

L4

R53

R55

R56

R64

1

2

3

D4

R65

220k

C28

33p

R63

C53

100n

1N

O1

2CO

M1

3N

O2

4CO

M2

5IN

2

6IN

3

7G

ND

8N

O3

9CO

M3

10

CO

M4

11

NO

4

12

IN4

13

IN1

14

V+

U20

TS

3A

47

51

PW

R

TS3A4751PW

R

C13

1n, d

np

C56

4.7

u

+C57

2.2

u

C63

100n

R19

1 A1

2 A2

3C1,C2

D8

C66

1n

R200R

R23180k

R25

150k

R15

220k

1G

2S3

D

Q3

R26

27k, d

np

1IN

2G

ND

3EN

4N

R

5O

UT

U7

TPS73401D

DCT

C54 1n

C26

2.2

u

R24160k

C24 1n

C62

10n

C29

4.7

u

C10

1u

2 E

1B

3C

Q4

R6

220k

C1

33p

R7

220k

C65 100n

5IN

-

4IN

+

6OU

T

1

REF

2

GND

3

V+

U10

INA21XD

CK

INA214AID

CKT

C67 10p

C68 1n

R49

10R

R54

10R

R57

0.2

C69

2.2

u

C72

2.2

u

C73

2.2

u

11

DCD

C_CAL0

DCD

C_CAL2

DCD

C_TEST

DCD

C_RST

HO

ST_SD

A

DCD

C_CAL1

VCC_PO

D33

DCD

C_PU

LSE

DCD

C_IO

0

VCC_D

CD

C_REF

A_VCC_SU

PPLY

VBU

S5

VCC_SU

PPLY

A_VCC_SU

PPLY

DCD

C_CAL0

VCC_SUPPLY

VCC_DT

DCD

C_CAL1

DCD

C_CAL2

DCD

C_RST

VCC_PO

D33

GN

D1

GND1

GN

D1

GN

D1

GN

D1

VBU

S

GN

D1

GN

D1

GN

D1

DCD

CG

ND

GN

D1

DCD

CG

ND

DCD

CG

ND

DCD

CG

ND

DCD

CG

ND

DCD

CG

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A_VCC_SU

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D33

VCC_D

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SE

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T

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D1

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D1

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3/1

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3/1

2/2

014

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TP4

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TP6

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DCD

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A_VCC_SU

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ST_SD

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VCC_SU

PPLY

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PPLY

2TRG

T_CTRL

VCC_SU

PPLY

VCC_D

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MSP-FET www.ti.com

B.41.4 Layout

Figure B-88. MSP-FET USB Debugger, PCB (Top) Figure B-89. MSP-FET USB Debugger, PCB (Bottom)

B.41.5 LED SignalsThe MSP-FET shows its operating states using two LEDs, one green and one red. Table B-45 lists allavailable operation modes. An or icon indicates that the LED is off, an or icon indicates thatthe LED is on, and an or icon indicates that the LED flashes.

Table B-45. MSP-FET LED Signals

Function Power LED Mode LEDMSP-FET not connected to PC, or MSP-FET not ready; for example, after a major firmwareupdate. Connect or reconnect MSP-FET to PC.

MSP-FET connected and ready

MSP-FET waiting for data transfer

Ongoing data transfer

An error has occurred; for example, target VCC overcurrent. Unplug MSP-FET from target,and cycle the power off and on. Check target connection, and reconnect MSP-FET.

Firmware update in progress. Do not disconnect MSP-FET while both LEDs are blinking.

FPGA update in progress. Do not disconnect MSP-FET while both LEDs are blinking rapidly.



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B.41.6 JTAG Target ConnectorFigure B-90 shows the pinout of the JTAG connector.

Figure B-90. JTAG Connector Pinout

Table B-46. JTAG Connector Pin State by Operating Mode

When JTAG Protocol is When Spy-Bi-Wire ProtocolPin Name After Power-Up Selected is Selected1 TDO/TDI Hi-Z, pulled up to 3.3 V In, TDO In and Out, SBWTDIO2 VCC_TOOL 3.3 V VCC VCC

3 TDI/VPP Hi-Z, pulled up to 3.3 V Out, TDI Hi-Z, pulled up to VCC

4 VCC_TARGET In, external VCC sense In, external VCC sense In, external VCC sense5 TMS Hi-Z, pulled up to 3.3 V Out, TMS Hi-Z, pulled up to VCC

6 N/C N/C N/C N/C7 TCK Hi-Z, pulled up to 3.3 V Out, TCK Out, SBWTCK8 TEST/VPP Out, Gnd Out, TEST Hi-Z, pulled up to VCC

9 GND Ground Ground GroundOut, Target UART Clear-To- Out, Target UART Clear-To-10 UART_CTS/SPI_CLK/I2C_SCL Hi-Z, pulled up to 3.3 V Send Handshake input Send Handshake input

11 RST Out, VCC Out, RST Out12 UART_TXD/SPI_SOMI/I2C_SDA Hi-Z, pulled up to 3.3 V In, Target UART TXD output In, Target UART TXD output

In, Target UART Ready-to- In, Target UART Ready-to-13 UART_RTS Hi-Z, pulled up to 3.3 V Send Handshake output Send Handshake output14 UART_RXD/SPI_SIMO Hi-Z, pulled up to 3.3 V Out, Target UART RXD input Out, Target UART RXD input



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12 UART_TXD

11 RST

8 TEST

7 TCK

5 TMS

3 TDI

1 TDO/TDI

2 VCC_TOOL

- USB Power

10 UART_CTS

14 UART_RXD

13 UART_RTS

Pin Signal

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Figure B-91 shows the state of each pin in the connector after power-up.

Figure B-91. Pin States After Power-Up



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B.41.7 SpecificationsTable B-47 shows the physical and electrical specifications of the MSP-FET.

Table B-47. Specifications

MechanicalSize (without cables) 80 mm x 50 mm x 20 mm

InterfacesUSB interface USB 2.0, full speedTarget interface JTAG 14-pin See Table B-46 for pinoutJTAG cable length 20 cm (max)

JTAG and Spy-Bi-Wire Interface, ElectricalUSB powered, 200 mAPower supply (max)

Target output voltage 1.8 V to 3.6 V Selectable in 0.1-V steps. VCC_TOOL available from JTAG pin 2.VCC_TOOLTarget output current 100 mA (max) Current supplied through JTAG pin 2Target output overcurrent 160 mA (max)detection levelJTAG signal overcurrent 30 mA (max) Total current supplied through JTAG pins 1, 3, 5, 7, 8, 10, 11, 12, 13, 14detection level

Connect external target voltage VCC_TARGET to JTAG pin 4. JTAGExternal target supply Supported (1.8 V to 3.6 V) and SBW signals are regulated to external target voltage ±100 mV.Fuse blow Supported For devices with poly-fuse

JTAG and Spy-Bi-Wire Interface, TimingJTAG clock speed 8 MHz (max) Protocol speed selectable by software

Protocol speed selectable by software. System limitations due toSpy‑Bi‑Wire clock speed 8 MHz (max) external RC components on reset pin (SBWTDIO) might apply.JTAG and Spy-Bi-Wire Interface, Speed

Flash write speed (JTAG) Up to 20 kB/secFlash write speed Up to 7 kB/sec(Spy‑Bi‑Wire)FRAM write speed (JTAG) Up to 50 kB/secFRAM write speed Up to 14 kB/sec(Spy‑Bi‑Wire)

EnergyTrace™ TechnologyTarget output current For target output voltage = 1.8 V to 3.6 V, target output current <75 mA± 2%, ± 500 nAaccuracy and USB voltage = 5 V constant during and after calibration

B.41.8 MSP-FET Revision HistoryRevision numbers are printed on the PCB and are stored in nonvolatile memory in firmware. Table B-48shows the revision history of the MSP-FET.

Table B-48. MSP-FET Revision History

Revision Date CommentsRevision 1.2 March 2014 Initial release



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MSP-FET430UIF www.ti.com

B.42 MSP-FET430UIF

Figure B-92. MSP-FET430UIF USB Interface, Schematic (1 of 4)



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Figure B-96. MSP-FET430UIF USB Interface, PCB



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B.42.1 MSP-FET430UIF Revision HistoryRevision 1.3• Initial released hardware version

Assembly change on 1.3 (May 2005)• R29, R51, R42, R21, R22, R74: value changed from 330R to 100R

Changes 1.3 to 1.4 (Aug 2005)• J5: VBUS and RESET additionally connected• R29, R51, R42, R21, R22, R74: value changed from 330R to 100R• U1, U7: F1612 can reset TUSB3410; R44 = 0R added• TARGET-CON.: pins 6, 10, 12, 13, 14 disconnected from GND• Firmware-upgrade option through BSL: R49, R52, R53, R54 added; R49, R52 are currently DNP• Pullups on TCK and TMS: R78, R79 added• U2: Changed from SN74LVC1G125DBV to SN74LVC1G07DBV

NOTE: Using a locally powered target board with hardware revision 1.4

Using an MSP-FET430UIF interface hardware revision 1.4 with populated R62 in conjunctionwith a locally powered target board is not possible. In this case, the target device RESETsignal is pulled down by the FET tool. It is recommended to remove R62 to eliminate thisrestriction. This component is located close to the 14-pin connector on the MSP-FET430UIFPCB. See the schematic and PCB drawings in this document for the exact location of thiscomponent.

Assembly change on 1.4a (January 2006)• R62: not populated



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B.43 MSP-FET430PIF

Figure B-97. MSP-FET430PIF FET Interface Module, Schematic



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Figure B-98. MSP-FET430PIF FET Interface Module, PCB



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Appendix CSLAU278W–May 2009–Revised October 2015

Hardware Installation Guide

This section describes the hardware installation process of the following USB debug interfaces on a PCrunning Windows XP:• MSP-FET430UIF• eZ430-F2013• eZ430-RF2500• eZ430-Chronos• eZ430-RF2780• eZ430-RF2560• MSP-WDSxx "Metawatch"• LaunchPad (MSP-EXP430G2)• MSP-EXP430FR5739• MSP-EXP430F5529

The installation procedure for other supported versions of Windows is very similar and, therefore, notshown here.

Topic ........................................................................................................................... Page

C.1 Hardware Installation ........................................................................................ 181

180 Hardware Installation Guide SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback



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C.1 Hardware InstallationTable C-1 shows the USB VIDs and PIDs used in MSP430 tools.

Table C-1. USB VIDs and PIDs Used in MSP430 Tools

Tool USB VID USB PID INF File NameeZ430-F2013 0x0451 0xF430 usbuart3410.infeZ430-RF2500 0x0451 0xF432 430CDC.infeZ430-RF2780 0x0451 0xF432 430CDC.infeZ430-RF2560 0x0451 0xF432 430CDC.infMSP-WDSxx "Metawatch" 0x0451 0xF432 430CDC.infeZ430-Chronos 0x0451 0xF432 430CDC.infMSP-FET430UIF (1) 0x2047 0x0010 msp430tools.infMSP-FET 0x2047 0x0204 msp430tools.infeZ-FET 0x2047 0x0203 msp430tools.infLaunchPad (MSP-EXP430G2) 0x0451 0xF432 430CDC.infMSP-EXP430FR5739 0x0451 0xF432 430CDC.infMSP-EXP430F5529 0x0451 0xF432 430CDC.inf

(1) The older MSP-FET430UIF used with IAR versions before v5.20.x and CCS versions before v5.1 has VID 0x0451 and PID0xF430. With the firmware update, it is updated to the 0x2047 and 0x0010, respectively.

1. Before connecting of the USB Debug Interface with a USB cable to a USB port of the PC the one ofIDEs (CCS or IAR) should be installed. The IDE installation isntalls also drivers for USB DebugInterfaces without user interaction. After IDE installation the USB Debug Interface can be connectedand will be ready to work within few seconds.

2. The driver can be also installed manually. After plug in the USB Debug Interface to USB port of the PCthe Hardware Wizard starts automatically and opens the "Found New Hardware Wizard" window.

3. Select "Install from a list or specific location (Advanced)" (see Figure C-1).

Figure C-1. Windows XP Hardware Wizard

181SLAU278W–May 2009–Revised October 2015 Hardware Installation GuideSubmit Documentation Feedback


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Hardware Installation www.ti.com

4. Browse to the folder where the driver information files are located (see Figure C-2).For CCS, the default folder is: c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_CDC, orc:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_FET_XP_XX, orc:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_eZ-RF depending of firmware version of the tool.For IAR Embedded Workbench, the default folder is: <Installation Root>\Embedded Workbenchx.x\430\drivers\TIUSBFET\eZ430-UART, or<Installation Root>\Embedded Workbench x.x\430\drivers\<Win_OS>.

Figure C-2. Windows XP Driver Location Selection Folder

5. The Wizard generates a message that an appropriate driver has been found.



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6. The wizard installs the driver files.7. The wizard shows a message that it has finished the installation of the software USB Debug Interface.8. The USB debug interface is installed and ready to use. The Device Manager lists a new entry as

shown in Figure C-3, Figure C-4, or Figure C-5.

Figure C-3. Device Manager Using USB Debug Interface using VID/PID 0x2047/0x0010



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Figure C-4. Device Manager Using USB Debug Interface with VID/PID 0x0451/0xF430



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Figure C-5. Device Manager Using USB Debug Interface With VID/PID 0x0451/0xF432



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Revision History www.ti.com

Revision History

Changes from May 21, 2015 to October 13, 2015 ........................................................................................................... Page

• Added MSP Debuggers User's Guide to Related Documentation From Texas Instruments .................................. 10• Deleted former Section 1.1, Flash Emulation Tool (FET) Overview .............................................................. 12• Changed the order of the sections in Chapter 1, Get Started Now! .............................................................. 12• Added MSP-TS430PW20 to Table 1-1 ............................................................................................... 13• Added MSP-TS430RGE24A to Table 1-1 ............................................................................................ 13• Changed the paragraph that starts "The connection to the JTAG connector RST pin..." in Section 2.1, Signal Connections

for In-System Programming and Debugging ......................................................................................... 21• Changed note D of Figure 2-1, Signal Connections for 4-Wire JTAG Communication ........................................ 22• Added note that starts "On some Spy-Bi-Wire capable MSP430 devices..." .................................................... 24• Throughout document, changed "bootstrap loader" to "bootloader" .............................................................. 25• Added Section B.5, MSP-TS430PW20 ............................................................................................... 44• Added Section B.7, MSP-TS430RGE24A ............................................................................................ 50• Added note following Figure B-20 ..................................................................................................... 60• Added note following Figure B-26 ..................................................................................................... 69• Added note following Figure B-28 ..................................................................................................... 72• Added note following Figure B-34 ..................................................................................................... 81• Added note following Figure B-42 ..................................................................................................... 93• Added note following Figure B-46 ..................................................................................................... 99• Added note following Figure B-48.................................................................................................... 103• Updated Figure B-50, MSP-TS430RGC64USB Target Socket Module, PCB, with Rev 1.4 board ......................... 106• Added note following Figure B-54.................................................................................................... 113• Added note following Figure B-62.................................................................................................... 126• Added note following Figure B-64.................................................................................................... 129• Added note that starts "For bootloader use..." following Figure B-74 ........................................................... 146

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

186 Revision History SLAU278W–May 2009–Revised October 2015Submit Documentation Feedback


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