NI AWR DesignEnvironment
AWR
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AWRDESIGNFORUM
Tel Aviv, Israel - 10 June, 2015
2015 National Instruments. All rights reserved. A National Instruments Company, Analog Offi ce, AWR, Microwave Offi ce, AXIEM, National Instruments, NI, and ni.com are trademarks of National Instruments. Other product and company names listed are trademarks or trade names of their respective companies.
Time Topic
09:00 09:30 Welcome, Registration and Coffee
09:30 10:30 NI AWR Design Environment Overview:
New Technologies of V12 Release
10:30 11:00 Antenna Simulations in Microwave Offi ce/AXIEM/Analyst:
Coupling the Antenna (EM) to the Circuit
11:00 11:15 Coffee Break
11:15 12:00 Microwave Cavity Filter Design, Simulation and Optimization
12:00 12:30 Transceiver Module and Multi-Element Phased Array Design
for 5G Mobile Communications
12:30 13:00 Enhanced Load-Pull Measurements and Stability Analysis
for Power Amplifi ers
13:00 14:00 Lunch
14:00 14:30 Implementing a Circuit Reference Design
14:30 15:00 High-Performance RF Measurements, Throughput and
Synchronisation with NI Software-Defi ned Automated Test Systems
15:00 15:15 Coffee Break
15:15 16:00 Improving the Performance of Side-Coupled Microstrip-Line Filters
16:00 16:30 SAW Package Design and Simulation
16:30 17:00 Q&A, Conclusion, and iPad Mini Lucky Draw
VenueCrowne Plaza Tel Aviv Beach145 Hayarkon Street Tel Aviv, 6345313 Israel
Media Partner:Registrationhttp://bit.ly/1aOwfZe
Presentation Abstracts
NI AWR Design Environment Overview: New Technologies of V12 Release This presentation begins with an overview of the NI AWR Design Environment and a review of the powerful,
innovative technologies contained within the upcoming release (version 12). It will also highlight advanced
synthesis tools for amplifiers (PAs, LNAs, and driver amps etc.) which are now available.
NI AWR Design Environment software is an advanced suite of tools developed especially for designers of
MMICs, RF PCBs, RFICs, microwave modules, communication systems, radar systems, antennas, and more.
The capabilities offered include full 3D EM simulation, 3D PCells, circuit envelope simulation, bi-directional links
to Mentor Graphics and Cadence PCB design tools, co-simulation with National Instruments LabVIEW, FPGA
hardware-in-the-loop simulation, antenna synthesis, and RF frequency planning to name just a few.
Antenna Simulations in Microwave Office/AXIEM/Analyst: Coupling the Antenna (EM) to the Circuit In this presentation, we demonstrate how Microwave Office automatically accounts for the coupling between
the antenna and the circuit in an easy-to-use framework. The designer identifies the antenna data source, the
circuit schematic driving the antenna, and the measurement under consideration. We illustrate the concept with
a number of interesting examples in phased arrays, where the antennas are simulated in both 3D planar (AXIEM)
and 3D finite-element (Analyst) electromagnetic simulators.
Microwave Cavity Filter Design, Simulation and Optimization Analyst, 3D FEM-based EM solver, has successfully been used in many applications where the problem
geometry is defined by a combination of extruded 2D geometries (board, chip, module) and predefined
parameterized cells (bond wires, SMA-connectors, air coils etc.). Analyst capabilities go beyond this and in this
presentation we demonstrate how Analyst and Microwave Office cooperate in microwave cavity filter design. In
particular, the design target is an iris-coupled waveguide resonator bandpass filter and characterization of the iris
shunt susceptance is very conveniently carried out using parameterized Analyst document. This data together
with the dispersive propagation constant enables straightforward mapping of the design equations into physical
filter dimensions. Finally, a full filter model is constructed, with all dimensions parameterized, enabling fine-tuning
of the filter before prototyping.
Transceiver Module and Multi-Element Phased Array Design for 5G Mobile Communications This presentation will cover transceiver module and satellite communication system analysis. We will explore the
pros and cons of three different transceiver architectures. We will also discuss unique Visual System Simulator
(VSS) RF modeling capabilities while investigating the benefits of each of the architectures. A comprehensive
overview of using VSS for end-to-end analysis of a satellite communication link will be presented. Subject matter
such as forward error correction encoding, spread spectrum, and GPS code generation will also be discussed.
Additionally this presentation will highlight the new phased array capability in VSS. VSS phased array simulation
accounts for gain and phase offsets of each element, angles of incidence of the transmitted or incoming signal
(theta and phi), and element location and operation frequency. The model enables users to configure the array
using custom or standard element arrangements and tapers.
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Presentation Abstracts
Implementing a Circuit Reference Design This presentation will discuss the process of simulating in Microwave Office the reference design of a TI CC2530
ZigBee chipset taken from datasheet information and analyzed all the way through to EM verification, all while
controlling the impedance condition as specified by the datasheet.
The discussion will include how to import DXF files into Microwave Office for EM simulation and understand-
ing the ways in which different layouts can lead to variations in circuit performance that can be quite different
from the requirement specified in the datasheet. The use of iNet technology to quickly and easily route the
interconnecting lines drawn across various PCB layers and automatically insert the vias will be demonstrated.
Attendees will learn how to analyze the parasitic effects (including coupling) of each interconnecting line that has
been introduced without using EM simulation, enabling designers to interactively monitor the S11 with each line
introduced and decide if they should change the length/width of that line. Finally, verifying the final design using
EM simulation will be demonstrated.
High-Performance RF Measurements, Throughput and Synchronisation with NI Software-Defined Automated Test Systems This session will provide the core principles of software-defined instrumentation and answer to questions
like, what you can do with software-defined instruments, how to implement a modular software-defined test
system architecture, and how National Instruments is committed to your success in developing software-
defined test systems. This presentation will discuss several use cases including radar systems design
and SDR (Software Defined Radio).
Improving the Performance of Side-Coupled Microstrip-Line Filters Filters are used in communications systems to keep unwanted signals from propagating through a network.
These signals may be interferers from other systems, or they may be generated by the nonlinear behavior of
components within the network.
This presentation talks about side-coupled filters constructed from microstrip on printed circuit boards (PCB).
Side-coupled filters are widely used throughout the industry because of their low cost and manufacturability.
A side-coupled filter, also known as a parallel edge-coupled filter, is built by combining several sections of
coupled transmission lines, in which each section is offset from the previous section. In addition to a relatively
large footprint, one of the drawbacks of the side-coupled filter is limited rejection of the second harmonic.
This presentation demonstrates a design approach that reduces this problem: adding notch filters improves the
rejection without significantly affecting the filters passband performance.
SAW Package Design and Simulation This example involves a packaged SAW chip. SAW resonator simulators do not necessarily take into account the
electromagnetics of the SAW layout that is causing additional delay, losses and parasitics to the SAW filter
behavior. Moreover, when the SAW chip is packaged, there are additional parasitics due to bond wire
connections, non-ideal grounding, package cavity and so on. This session discusses all electromagnetic details
of the test board, SAW package and SAW layout contributing to the distortion of the ideal filter performance,
enabling proper redesign of the filter resonators to meet the design goals.
