To our customers,

Old Company Name in Catalogs and Other Documents

On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding.

Renesas Electronics website: http://www.renesas.com

April 1st, 2010 April 1st, 2010 Renesas Electronics Corporation

Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry

1

GET-BE-1002Ver.5.0: May,2006

NEC Electronics CorporationCompound Semiconductor Devices Division

Lead (Pb)-free Semiconductor Products

2

GET-BE-1002Ver.5.0: May,2006

Lead (Lead (PbPb))--free Semiconductor Products of free Semiconductor Products of OptoOpto--Electronics, Electronics, and RF and Microwave Devicesand RF and Microwave Devices

• As a so-called "green vendor", NEC Electronics contributes to global environmental protection by actively promoting the introduction of Lead (Pb)-free products as part of our ongoing efforts to develop and supply environmentally sound products.

• We have completed development of Lead (Pb)-free technology for all of our opto-electronics, RF, and microwave products*1 and are accepting orders for Lead (Pb)-free products.

• MoreOver, our future products will all be Lead (Pb)-free.

• In consideration of the environment, we are aiming to completelyeliminate the use of lead*2 in all of our opto-electronics, RF, and microwave products*1 by the end of September 2006 and have been progressing with the gradual switchOver*3 since October 2005.

*1:Products made by the former NEC Compound Semiconductor Devices, Ltd.*2:RoHS compliant (Some products will still have internal parts with material containing lead.) Contact a sales

representative for details.*3:Except for maintenance products being phased out.

Lead (Lead (PbPb))--free Policiesfree Policies

3

GET-BE-1002Ver.5.0: May,2006

Measures for Lead (Pb)-free Implementation1. Areas Requiring Lead (Pb)-free Mount materials such as soldering

paste and soft solder.(Modules and some power devices)

Solder Plating of Outer Leads(Plastic packages)

2. Method of Lead (Pb)-free Implementation

*Solder Dip(radial transistors):Sn-Ag-Cu Dip

(1) Solder Plating for Outer Leads

(2) Pb reduction inside the packages such as the mount materialshas already met the RoHS Directive requirements. (The complete Pb free technologies are currently under development. Its actualimplementation date is TBD).

C o n v e n t io n a lP ro d u c t s

Le a d ( P b ) - f re e P ro d u c t s

Sn-Pb Sn-Bi

Au Au

*

4

GET-BE-1002Ver.5.0: May,2006Specification for Lead (Pb)-free

Package Soldering of Outer Leads Mount Materials Pb Usage in Others

SOP Type

DIP Type

MM Type

Power Mold

Ceramic Type

Module Type(MCM)

(Laser Di)

Sn-Bi Plating

Sn-Bi Plating

Sn-Bi Plating

Sn-Ag-Cu Dip

Au Plating (Same as at present)

Au Plating (Same as at present)

Pb Not Used

Pb Not Used

Pb Not Used

Pb Not Used

Complied with the RoHSComplete Lead (Pb)-free

Implementation underway(Sn-Pb soft solder used )

Pb Not UsedPb Not Used

Pb Not Used

Pb Not Used

Pb Not UsedRadial Type(Transistor)

Sn-Bi Plating

Pb Not Used Pb Not Used

QFNType Sn-Bi Plating Pb Not Used Pb Not Used

Soldering of outer leads became Lead (Pb)-free in October, 2001. The Pb contained inside the packages met the RoHS Directive requirements in December, 2002.

Complied with the RoHSComplete Lead (Pb)-free

Implementation underway(Lead glass and Ceramic

Parts, etc.)

Sn-Ag-Cu Paste

5

GET-BE-1002Ver.5.0: May,2006Lead (Pb)-free plating comparison (1)

=Why Sn-Bi is the best solution=

Sn-Pb(Conventional) Sn-Bi Sn-CuSn-Ag Matte-Sn Ni/Pd/Au

Composition (wt%)

Melting point (˚C)Solid-liquid phase temperature

Alloy characteristics

Packagingreliability

Wettability

Soldering temperature

Joint strength

Productivity

Cost

Notes

Whisker resistance

Surface solder plating

Pb:10 Bi:2 Cu:1.5Ag:3.5 Sn:100 -

183-215 223-231 227-296221(eutectic) 232 Soluble plating

x

Cannot be applied to the lead frame containing Fe.

Interferes with resin adhesion.

Excellent Good Poor x NG

6

GET-BE-1002Ver.5.0: May,2006

232

50→%Sn

100Sn

SnSn--CuCu

227 99.3

Liquidus

Liquid↑

↓Solid

Tem

pera

ture→

0Cu

1083

Solidus

1.5Cu

Lead (Pb)-free plating comparison (2)=Why Sn-Bi is the best solution=

The solid phase (solidification) temperature of Sn-Bi solder is influenced by the variation in composition, while thevariation in the liquid phase (melting) temperature remainssmall. These characteristics are similar to those of Sn-Pb.

Note: The figures shown are images and may be slightly different from actual data.

50→%Sn

100Sn

0Pb

327

61.9183

SnSn--PbPb

10Pb

Solidus

LiquidusLiquid↑

↓Solid

↓Semi-solid

↑

50→%Sn

100Sn

0Bi

271

42 139

SnSn--BiBi2Bi

Liquidus

Solidus

Liquid↑

↓Solid

↓Semi-solid

↑

↓Semi-solid

↑

221 96.5

960.5

SnSn--AgAg

50→%Sn

100Sn

0Ag

3.5Ag

Liquidus

Solidus

Liquid↑

↓Solid

↓Semi-solid

↑

7

GET-BE-1002Ver.5.0: May,2006

Pb

BiSnWt%Sn

Wt%

Sn

Eutectic point:About 100 degree C

100 80 60 40 20 0

80

60

40

20

100

0

Sn-Bi plating on Sn-Pb Solder paste

Sn-Pb-Bi Melting Characteristics(image)

Over 200 degree

There are few Bi to Sn, and Pb.Mounting by Sn-Pb solder paste is also possible.

Sn-37Pb paste(183 degree C : eutectic)

Sn-2Bi plating(Solid : 223 degree C

- Liquid : 231 degree C)

Low temperature zone(Under 150 degree C)

Lead (Pb)-free plating comparison (3)=Why Sn-Bi is the best solution=

Over 200 degree C

Over 200 degree C

Over 175 degree C

8

GET-BE-1002Ver.5.0: May,2006Identification of Lead (Pb)-free Products*

Identification by “Marking on the Product”:Lead (Pb)-free products will be marked with Dot-mark orAlternative mark except for products using small packages such as minimold package.

Dot-mark for Product

Identification by “Marking on the Package Label”Package labels for all Lead (Pb)-free products will be marked witheither “Pb-Free T.”.Taping reel label will also be marked in the same manner fortaping at shipment time.

*Note that this marking system applies only to products changed Over to Lead (Pb)-free. Conventional products not containing Pb will not be marked.

9

GET-BE-1002Ver.5.0: May,2006

Example Marking on the Product

Display surface is marked with Dot-mark or underline.

C X X X X

(Ex.) QFN

Example Markingon the Label

Packing label is marked with logo.

Lead (Lead (PbPb))--free Products Marking Methodfree Products Marking Method= Compounds / Si Microwave Devices == Compounds / Si Microwave Devices =

X X X XN

(Ex.) 8pSOP

For the details, please contact NEC Electronics Corporation.

*No marking for 175mil 8p SSOP.

Package Marking on the Label

SOP Type Dot-mark Lead (Pb)-free marking (Logo)on the Label SSOP Type Dot-mark *

(See the examples below.)QFNType Underline

DIP Type Dot-mark

TSSOP/HTSSOP No Marking

TSON Type No Marking

Mini Mold Type No Marking

Power Mold No Marking

TO-92 No Marking

Marking on the Product

“Pb-Free T.”

*

10

GET-BE-1002Ver.5.0: May,2006Lead (Pb)-free Products Marking Method

N E C2 5 X X

X XXX

DIP (4,6,8PIN)

Specified by the English-letter indicator in the 2nd digit of the Internal Code.

N E C2 7 X XX XXX

l

SOP (4pin:Laser Printing)

Marked with the vertical lineon the bottom-right corner.

1 XXX

SSOP 4PIN

Stamped with Mark.

Example Marking on the Product

== NEPOC Products (NEPOC Products (PhotocouplersPhotocouplers ·· OCMOS (OpticalOCMOS (Optical--coupled MOS)) =coupled MOS)) =

Lead (Pb)-free marking (Logo) on the inside label and outside label.

Marking on the Product Marking on the LabelInternal Code

Laser Printing Vertical LineInk Printing Italicized Product Name

Mark

Laser Printing Internal CodeInk Printing Italicized Product Name

Vertical LineFlat Lead

SSOP 4PIN

Package

SOP 4PIN

SSOP16PIN

DIP (4,6,8 PIN)

OC MOS SOP 8PIN

For the details, please contact NEC Electronics Corporation.

Internal Code “Pb-Free T.”

11

GET-BE-1002Ver.5.0: May,2006

Recommended Soldering Conditions of Lead (Pb)-free Products

1. Surface Mount Type (SMD)•IR reflow with the peak temperature 260°C,•Wave soldering with the molten solder in the 260°C

soldering bath and•Partial lead heating through the 350°C solder iron tip

can be performed.

2. Through Hole Type (THD)• Wave soldering with the molten solder in the 260°C

soldering bath and• Partial lead heating through the 350°C solder iron tip

can be performed.

3. Hand Soldering Type •Partial lead heating through the 350°C solder iron tip

can be performed.- Specific conditions apply to some products. Please contact our sales representatives for details. -

12

GET-BE-1002Ver.5.0: May,2006

• Max. Temperature (Package Surface Temperature): 260°C• Soldering Time at Max. Temperature : Within 10 seconds• Soldering Time at Over 220°C : Within 60 seconds• Preheating Time at 120°C - 180°C : 120 ± 30 seconds • Max. number of Reflows : 3 times• Chlorine Composition of Rosin Flux (%) : 0.2% (wt.) or less

(Heating)- 10s

Time (sec.)

- 60s

120 ± 30s(Preheating)

Pack

age

Surf

ace

Tem

pera

ture

(ºC

)

260°C MAX.220°C

120°C180°C

Recommended Soldering Conditions of Lead (Pb)-free Products(IR Reflow)

- Specific conditions apply to some products. Please contact our sales representatives for details. -

13

GET-BE-1002Ver.5.0: May,2006

Recommended Soldering Conditions of Lead (Pb)-free Products(Wave Soldering/Partial Lead Heating)

• Max. Temperature (Molten Solder Temperature): 260°C• Flow Time : Within 10 seconds• Preheat Temperature (Package Surface Temperature):Below 120°C • Number of Flows : 1 time• Chlorine Composition of Rosin Flux: 0.2% (wt.) or less

• Max. Temperature (Outer Lead Temperature): 260°C • Time (per side of a device* or per lead*) : Within 3 seconds• Chlorine Composition of Rosin Flux :0.2% (wt.) or less

(*:Time is defined per side for SMD and per lead for THD)

Wave Soldering

Partial Lead Heating (Hand Soldering)

- Specific conditions apply to some products. Please contact our sales representatives for details. -

14

GET-BE-1002Ver.5.0: May,2006

Lead (Pb)-free Product Samples and Mass Production

We are already accepting orders for Lead (Pb)-free optical, radio-frequency, and microwave products.Please contact one of our sales representatives for samples, products and the delivery date.

Samples for Evaluation are available as below:Please contact our sales representatives for delivery date.

Package Samples Product Samples(Part number: (Part number:

Not specified) Specified)

15

GET-BE-1002Ver.5.0: May,2006Contact for Inquiries

NEC Electronics Corporation. Compound Semiconductor Devices Division.Home Page:Please visit our web site for information of Compound Semiconductor Devices Division.

URL (Address) http://www.ncsd.necel.com/

Request for Documents/Brochures:Sales Planning Group of Sales Division or our exclusive distributors

Business Information:Sales Planning Group of Sales Division Tel : 044-435-1838

E-mail : csd_salesinfo@ml.necel.com

16

GET-BE-1002Ver.5.0: May,2006

Reference

17

GET-BE-1002Ver.5.0: May,2006Plating Wettability Test Results

= Mini Mold Package =Test Method: M eniscograph

Standard: ≤ 3 sec

0

1

2

3

210 215 220 225 230 235 240 245 250

Zero

-cro

ss T

ime

(Sec

)

Inner Composition of EvaluatedPlating Solder Material in the Bath

Sn-2.5Bi Sn-PbSn-2.5Bi Sn-3Ag-0.5CuSn-Pb Sn-PbSn-Pb Sn-3Ag-0.5Cu

Lead (Pb)-free (Sn-Bi) plating exhibits wettability equivalent to the current Sn-Pb plating.

Disposal pre-conditions :150deg C HT 48H

Terminal material: Cu

RMA-Type Flux R-Type Flux

Test Method: MeniscographStandard: ≤ 3 sec

Evaluation Bath Temperature (deg C)

18

GET-BE-1002Ver.5.0: May,2006

Sn - 40Pb Sn-3Ag-0.5CuMount Solder PasteOuter Solder Plating Sn-10Pb Sn-2.5Bi Sn-10Pb Sn-2.5Bi6pTSMM

(Cu)

6pTUSMM(Cu)

3pTUSMM(Cu)

3pL2MM(Cu)

VerticalDirection

VerticalDirection

VerticalDirection

VerticalDirection

HorizontalDirection

HorizontalDirection

HorizontalDirection

HorizontalDirection

37 35 37 3528 31 32 3333 31 41 3913 14 15 1416 17 19 209 9 9 910 11 13 12

19 19 21 18

(unit : N)

Vertical Direction

HorizontalDirection

Vertical Direction

HorizontalDirection

Vertical Direction

HorizontalDirection

6pTSMM 6pTUSMM 3pTUSMM

Vertical Direction

HorizontalDirection

3pL2MM

Equivalent Shear Strength of the Mount Solder Paste and the Outer Solder Plating was Evaluated for Each of 4 Package Types

Mount Condition : One-time IR Reflow (with a peak temperature of 260degC)

Mini Mold PackageMini Mold Package Solder Mount Shear Strength Standard: ≥ 5 N

Lead (Pb)-free Plating Solder Joint Strength Evaluation Results

19

GET-BE-1002Ver.5.0: May,2006

(unit : N)Solder Mount Pull Strength: Standard: ≥ 5 N

All combinations of solder paste and solder plating show equivalent mount pull strength

Mount Condition : One-time IR Reflow with a peak temperature of 260 °C.Number of samples: 3 packages each.

Sn - 40Pb Sn-3Ag-0.5CuMount Solder PasteOuter Solder Plating Sn-10Pb Sn-2.5Bi Sn-10Pb Sn-2.5Bi

4pin DIP(Cu)

4pin SOP(42 Alloy) 27 28 28 28

>100 >100 >100 >100

4pin SSOP(42 Alloy)

27 28 28 28

PhotocouplersPhotocouplers

Solder Joint Strength

20

GET-BE-1002Ver.5.0: May,2006

Outer Lead SolderTest Conditions Temperature CycleTemperature Cycle

Storage at aConstant

Storage at aConstant

Temperature CycleStorage at a

Constant(-65to150C) (-65to150C) (85C,85%) (85C,85%) (-65to150C) (85C,85%)

IR ReflowNot Performed

IR ReflowPerformed

IR ReflowNot Performed

IR ReflowPerformed

IR ReflowNot Performed

IR ReflowNot Performed

L/F* Material 2000 Cycle 2000 Cycle 2000H 2000H 2000 Cycle 2000H

Cu L/F * WhiskerNot Occurred

WhiskerNot Occurred

WhiskerNot Occurred

WhiskerNot Occurred

WhiskerNot Occurred

WhiskerNot Occurred

Fe-Ni L/F * WhiskerNot Occurred

WhiskerNot Occurred

WhiskerNot Occurred

WhiskerNot Occurred - -

Fe L/F * WhiskerNot Occurred**

WhiskerNot Occurred**

WhiskerNot Occurred

WhiskerNot Occurred - -

Sn-Bi Plating Sn-Ag-Cu Dip

*L/F=Lead Frame **(-55 to 150 degree C, 1000Cycle)Judgment : ≤ 50 um

* No Problems were Observed During Long-Period Storage In Either Case, Whether Thermal Stress to the Board Mount is Applied or Not

Fe-Ni L/F(225milSOP)TC2000 Cycle

Cu L/F (Minimold)TC2000 Cycle

Fe-Ni L/F (225milSOP)HHT2000H*

Cu L/F (Minimold)HHT2000H*

*:Rough surface is caused by metal rusts.

Lead (Pb)-free Plating Whisker Test Results

Check

SEM:IR Reflow Not Performed

21

GET-BE-1002Ver.5.0: May,2006

*L/F=Lead FrameJudgment : ≤ 40 um (complied iNEMI)

Outer Lead SolderTest Conditions Temperature Cycle Storage at a Constant Temperature & Humidity

IR Reflow Not Performed

L/F* Material 1000 Cycle 3000H

Cu L/F* Whisker Not Occurred

Fe-Ni L/F*

Fe L/F*

Sn-BiPlating

Check

Results of Whisker Test (complied JEDEC standard)

(-40 to 85 degree C) (60 degree C,90%)

IR Reflow Not Performed

Whisker Not Occurred

Whisker Not Occurred

Whisker Not Occurred

Whisker Not Occurred

Whisker Not Occurred

* No Problems were Observed in JEDEC standerd condition too.