PowerEdge T710 Technical Guidebook DELLTM .3 System Overview ... PowerEdge T710 Technical Guidebook

PowerEdge T710 Technical Guidebook

Dell

DELLTM POWEREDGETM T710 TECHNICAL GUIDEBOOK INSIDE THE POWEREDGE T710

PowerEdge T710 Technical Guidebook

Dell

Table of Contents

1 Product Comparison ......................................................................................................................... 1

1.1 Overview ................................................................................................................................... 1 2 New Technologies ............................................................................................................................. 2

2.1 Overview/Description ................................................................................................................ 2 2.2 Detailed Information .................................................................................................................. 2

2.2.1 Intel Xeon 5500 Series Processors ................................................................................... 2 2.2.2 Intel 5520 Chipset ............................................................................................................. 3 2.2.3 PCIe Generation 2 ............................................................................................................. 3 2.2.4 DDR3 Memory Technology ............................................................................................... 3 2.2.5 16-Drive Active Backplane ................................................................................................ 3 2.2.6 Next Generation Broadcom 5709C LOMs ......................................................................... 4 2.2.7 Next generation Dell Embedded Server Management ...................................................... 4

3 System Overview .............................................................................................................................. 4

3.1 Overview/Description ................................................................................................................ 4 3.2 T710 Product Features Summary ............................................................................................. 5

4 Mechanical ........................................................................................................................................ 6

4.1 Chassis Description .................................................................................................................. 6 4.2 Dimensions and Weight ............................................................................................................ 6 4.3 Front Panel View and Features ................................................................................................. 7 4.4 Back Panel View and Features ................................................................................................. 7 4.5 Power Supply Indicators ........................................................................................................... 8 4.6 Side Views and Features .......................................................................................................... 8 4.7 Internal Chassis Views .............................................................................................................. 9 4.8 Rails and Cable Management ................................................................................................... 9 4.9 Rack View ............................................................................................................................... 10 4.10 Fans ........................................................................................................................................ 10 4.11 Control Panel/LCD .................................................................................................................. 11

4.11.1 Cover Latch ..................................................................................................................... 12 4.11.2 Bezel ............................................................................................................................... 12 4.11.3 Hard Drive ....................................................................................................................... 13 4.11.4 Trusted Platform Management (TPM) ............................................................................. 13 4.11.5 Power-Off Security .......................................................................................................... 13 4.11.6 Intrusion Alert .................................................................................................................. 13 4.11.7 Secure Mode ................................................................................................................... 13

4.12 Persistent Storage ................................................................................................................... 14 4.12.1 Managed Persistent Storage ........................................................................................... 14 4.12.2 SD Module (Unmanaged Internal Persistent Storage) .................................................... 15

4.13 USB Key (Unmanaged Internal Persistent Storage) ............................................................... 16 4.14 Battery ..................................................................................................................................... 16 4.15 Field Replaceable Units (FRU) ............................................................................................... 16

5 Electrical.......................................................................................................................................... 16

5.1 Clock Circuitry ......................................................................................................................... 16 5.2 Volatility ................................................................................................................................... 16

6 Power, Thermal, and Acoustic ........................................................................................................ 16

6.1 Power Supplies ....................................................................................................................... 16 6.2 Power Supply Specifications ................................................................................................... 17 6.3 Power Efficiency ...................................................................................................................... 18 6.4 Environmental Specifications .................................................................................................. 19

PowerEdge T710 Technical Guidebook

Dell

6.6 Maximum Input Amps ............................................................................................................. 20 6.7 EnergySmart Enablement ....................................................................................................... 20 6.8 Energy Star Compliance ......................................................................................................... 20 6.9 Acoustics ................................................................................................................................. 20

7 Block Diagram ................................................................................................................................. 22

8 Processors ...................................................................................................................................... 22

8.1 Overview ................................................................................................................................. 22 8.2 Features .................................................................................................................................. 23 8.3 Supported Processors ............................................................................................................. 23 8.4 Processor Configurations ........................................................................................................ 24 8.5 Additional Processor Information ............................................................................................ 24

9 Memory ........................................................................................................................................... 24

9.1 Overview ................................................................................................................................. 24 9.2 DIMMs Supported ................................................................................................................... 24 9.3 Memory Population Scenarios ................................................................................................ 24 9.4 Slots/Risers ............................................................................................................................. 25 9.5 Speed/Memory Features ......................................................................................................... 25 9.6 Memory Population ................................................................................................................. 26 9.7 Memory Speed Limitations ...................................................................................................... 26 9.8 Mirroring .................................................................................................................................. 27

10 Chipset .........................................................................................................................