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1 Progress in Digital Radiology Ewert April 2007 Progress of Digital Industrial Radiology by Uwe Ewert [email protected] http://www.bam.de INDE 2007 India, Chennai, April 25th , 2007

Progress of Digital Industrial Radiology · Outside incorporated metal mesh Central section in stringer Inner surface with carbon fibre mesh Impact. 53 Progress in Digital Radiology

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Page 1: Progress of Digital Industrial Radiology · Outside incorporated metal mesh Central section in stringer Inner surface with carbon fibre mesh Impact. 53 Progress in Digital Radiology

1

Progress in Digital Radiology EwertApril 2007

Progress of Digital Industrial Radiology

byUwe Ewert

[email protected]://www.bam.de

[email protected]://www.bam.de

INDE 2007India, Chennai, April 25th , 2007

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• Film replacement• Computed Radiography (CR) with phosphor imaging plates – High

Definition Computed Radiography (HD CR)• Digital Detector Arrays (DDA)

• High Contrast Sensitivity Radiography with DDAs• Automated Defect recognition

• Dual energy technique• X-ray back scatter technique (BS RT)• X-Ray Modeling and POD• Portable Computed Tomography for

• Nuclear power plants• Large flat components in Aircraft industry

• Small angle scatter CT and nano CT at Synchrotron• Motion neutron - radiography

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Film Replacement

Computed Radiography (CR) with phosphor imaging plates – high definition CR

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Reporting

Archive

Networking

Digital Detector Arrays

Film Digitizer

ImagingPlates

Data TransmissionScannerfor Imaging Plates

Hard CopyGrayscalePrinter Agfa

INDO-GERMAN Workshop on DIR 1999

Computed RadiographyStandards available now

Radiology with Digital Detector Arrays

Graph of:

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Motivation for Film Replacement by Computed Radiography and DDA‘s

Motivation for Film Replacement by Computed Radiography and DDA‘s

• Shorter test and interpretation time

• New application areas by higher inspection quality and wall thickness range

• No chemicals and dangerous waste

• Less consumables

Film (D4)

Flachdetektor (Hamamatsu)

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Filmless Radiography

Computed Radiography withPhosphor Imaging Plates

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The Imaging Plate CycleThe Imaging Plate Cycle

Exposure of Imaging Plate

Imaging Plate

Cassette

Lead filter

Exposure

Scanning the IP , Digitising and Erasing the residual Image

Processing Station

INDO-GERMAN Workshop on DIR 1999

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Radiography (CR) with Phosphor Imaging PlatesASME CR Code Case 2476

First digital catalogue, light alloy castingdigitized films from ASTM E 155 (BAM)

ASTM E 2422

DDA under developmentASTM E 07

Part 1: Classification of Systems, Part 2: General principles

EN 14784 CR

RadioscopyEN 13068

Film DigitisationEN 14096, ISO 14096

Classification (E 2446), Long term stability (E2445), Guide (E 2007), Practice (E 2033)

ASTM CR

New Standards on Digital Industrial Radiology

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EN 14784-2

System Selection

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Filmless Radiography

CR Applications

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High Definition CR Systems for Welding

HD CR:„VistaScan“, of Duerr, Germany

FUJI IP‘s, light blue

Systems available down to• 12 µm pixel pitch and • < 40 µm unsharpness

• “weld quality”

BAM 5: 8 mm steel

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•36 inch 12.7 mm Wall thickness Pipe Weld (SWSI-panoramic exposure )

Digital Radiography for Pipeline Testing

FilmFree meeting17.04.2007

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f = film focus distancer = outer pipe radiusR = outer radius of insulationw = projection of wall thickness

w on the detector planeVEBA-OEL 2000

Corrosion and Wall Thickness Measurement:Corrosion and Wall Thickness Measurement:

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Wall Thickness MeasurementWall Thickness Measurement

Tangential Radiographic Technique(TRT)

Tutorial at 24.04.2007INDE2007, Chennai

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High Energy X-Ray Inspection in Lieu of Manual Maintenance Check of Large Components

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Filmless Radiography

Flat Panel Detectorsand the new

High Contrast Sensitivity TechniqueHCS-RT

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New Flat-Panel Detector TechnologyNew Flat-Panel Detector Technology

Spahn 97

New DevelopmentsNew Developments

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SNRnorm

Current limit of film and CR technology

SNR limit by materials structure

High Contrast Sensitivity TechniqueEffect of Correct Calibration Procedures

DDAs exceed film quality!

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Film and Flat Panel Detector for the BAM 5 Weld.

ASTM E2002 duplex wireASTM E1025 Inconel5 Hole Penetrameter

ASTM E747 / EN 462-2Fe 13 Wire Penetrameter

EN 462-2 Step Hole Type IQI „H1“

BAM 5 is a hand welded steel plate (St 35) 8 mm thick, the welding seam is max. 10 mm thick. It contains all types of welding flaws, especially nice cracks at the surface of the welding seam.

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Fuji IX25SNRnorm~ 265

PerkinElmer 1620SNRnorm~ 1500

by K. Bavendiek et all.

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Fast Test of Heat Exchangerswith

Tiled DDA

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WLE/AD - Plant Inspection, Welding Engineering; PVT Meeting Freeport 2004 14

RT-testing of tube-to-tube-sheet jointsGammat B3

Ir 192, Radiator: 1 x 0.5 mm²

Possible tube dimensions: 12*1.5 up to 76.1*4 (diameter*thickness)Materials: carbon and stainless steel, Ni-alloys, Zr, (Ti, Ta)Joint design shall be considered

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X-ray tube Warrikhoff MCTS 130A-0,6 and CdTe-Detector Ajat DIC100TH

Practice test:

Testing of Heat Exchanger Weldswith a specialised Digital Detector ArrayThrough the Detector

Testing of Heat Exchanger Weldswith a specialised Digital Detector ArrayThrough the Detector

Alekseychuk, Zscherpel, Rost

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D4 film with 130 kV:1 min (1mm Sn filter)

X-Ray tube with DIC100TH detector75 kV, 0,5 mA, 10s

Research-Project BASF/Ajat/BAM since 2006, first results on test weld

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Imaging and Materials Characterisation

with

Dual Energy Technique

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Explosive Detection by Dual-Energy-RadiologyExplosive Detection by Dual-Energy-Radiology

Baggage-transport

Typical device for explosive detection of baggage and fin postal service

(Smiths Heimann)

Smiths Heimann

Fan beams at two different energies

L-line detectors

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Dual-Energy-Technique for Plastics and Composite PipesDual-Energy-Technique for

Plastics and Composite Pipes

Inspection of a multi layer pipe, made from different plastics and with partial glass fibre reinforcement for chemical industry

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X-Ray Back Scatter Techniquefor

Security and Aircraft Industry

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X-ray Back Scatter Technique:

- Advantage is the single sided access

- Comscan – Technique was too slow and was applied only in very few areas

- New evaluation of back scatter technique due to the success in the security field

- New technologies are under development, e.g. in aircraft industry

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X-Ray Back Scatter Techniquewith single sided access

X-Ray Back Scatter Techniquewith single sided access

AS&E

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X-Ray Back Scatter Techniquewith Single Sided AccessX-Ray Back Scatter Techniquewith Single Sided Access

Organic materials are visible with high contrast

Flying Spot Unit

AS&E

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X-Ray Back Scatter Technique

Source: http://www.as-e.com Accepted e.g. in UK on voluntary basis

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Backscatter image of a personSource: http://www.as-e.com

Not accepted due to European Radiation Safety Regulations

1 µRem = 0,01 µSv

Radiation protection permits:1 mSv/year (100 mRem/year)for population but not without justification!

X-Ray Back Scatter Technique

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X-Ray Back Scatter – Flying Spot TechniqueX-Ray Back Scatter – Flying Spot Technique

Letter bomb dummy

Lange, Hentschel, BAM

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Terahertz (THz): Letter Bomb DummyTerahertz (THz): Letter Bomb DummyX- ray image

THz-Image

Kupsch, Lange, Beckmann,Hentschel

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Back Scatter Technique with specialized DiaphragmBack Scatter Technique with specialized Diaphragm

Diaphragm

Imaging plate/Detector Array

Shielding box

Camera

X-ray tube

Osterloh01/2007

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Fast Back Scatter Technique with Specialized DiaphragmFast Back Scatter Technique with Specialized Diaphragm

Water in Honeycomb

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Water in Honeycomb-StructuresWater in Honeycomb-Structures

Radiograph

Back scatter image Planar-tomogram

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Detector

Collimator

Backscattersystem of InnospeXion

New Equipment

Combination of

• High sensitive DDA and

• Specialised collimator

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X-Ray Modeling for- Film replacement

- Planning of testing

- POD

X-Ray Modeling for- Film replacement

- Planning of testing

- POD

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Modelling ToolsModelling Tools

Surface presentation • Interface to CAD and CT• Separation of homogeneous regions• Arrangement of different Polygons in the virtual scene

Processes:• Absorption• Compton-Scatter / Rayleigh-Scatter• Interaction by Collision probability

m>0

m=0

s1

s2

s3object

detector

(E0,W0)

Source

Object

Detector

Jaenisch, Bellon

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Complex Geometry: Cardan jointSimulation-Example

Pore

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Surface scan @ BAM VIII.1

• Strip projection

→ →

• ATOS 3D Digitizer (www.gom.com)Flexible optical measurement device Is based on Triangulation3D-Coordinaten are calculateda Polygon net of the surface is generated (STL)

ATOS II

Measurement and Radiographic Modelling of CAD-Surface Images

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Result: 3D CAD Model of a weld• STL of “BAM 3”

Modelling of a Scanned Weldment

top

root

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Pore Contrast Considering Measured Unsharpness and Noise for POD Calculation

0.0 0.5 1.0 1.5 2.0 2.5 3.0pore diameter [mm]

0

200

400

600

800

1000

max

imum

por

e co

ntra

st

â versus a from Simulation

max pore contrast (no noise)above (noise level = 30)center (noise level = 60)below (noise level = 90)decision threshold (SNR = 2.7)

Simulation of contrast function for copper welds of different thickness

Required for copper storage containers of the Swedish final repository of nuclear waste fuels

Measured with 9 MeV LINAC undBIR-line camera

Modelling BasedPOD

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0.0 0.5 1.0 1.5 2.0 2.5 3.0pore diameter [mm]

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

PO

D m

ax c

ontra

st

Conservative POD Estimate from Simulation

SNR = 2.7POD (above)confidence boundPOD (center)confidence boundPOD (below)confidence bound

POD for Different Wall Thickness

Modelling BasedPOD

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Mobile CTin

Nuclear Power Plants and

in Aircraft Industry

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• Movement of X-ray tube parallel to pipe axis• Acquisition of few hundred projections• Reconstruction of cross sections

• Movement of X-ray tube parallel to pipe axis• Acquisition of few hundred projections• Reconstruction of cross sections

X-ray tube

Digital detector array

Planar Tomography – Reconstruction of Cross sections

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from outside to inside

3D-Reconstruction of Weldments Metallography

Planar Tomography

8

Certification byEuropeanNetworl ofInspection andQualification.

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Mobile TomosynthesisMobile Tomosynthesis

CT of Large ComponentsCT of Large Components

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Planar Tomography

Stringer Component from Aircraft

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Outside incorporated metal mesh

Central section in stringer

Inner surface with carbon fibre mesh

Impact

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Nano CT

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Berlin Electron Storage SYnchrotronBESSY

Double-MultilayerMono chromator, 5-70 keV7T WLS

asymmetricSi -Crystal,

Magnification 1: 50

CCD-Camera

rotatingSample

Storage ring

1 mm

3D-Nano-CT: Micro-driller, 19 keV, Worm holes, white refraction contrast,200 nm resolution

3D-Scatter CT: Ti/SiC-MMC, 39 keV,

light: crack contrast after fatigue

3D-CT-single cut

Gas turbine

Müller, Lange, Hentschel

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Motion Neutron Radiographywith Triggered Cycle

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BMW-Engine of running production with external electric control at ILL in Grenoble

T. Bücherl, B. Schillinger

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Oil cooling of pistons of running engine!

Oil at piston bottom

Oil ray is injected from downside to the piston

Valves(one after the other)

T. Bücherl, B. Schillinger

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Computed Radiography with Phosphor Imaging Plates is gaining more and more importance for mobile inspection and Film Replacement. New High Definition CR (HD CR) systems allow the CR application for Weld and Casting inspection with low energy X-rays. New calibration methods enable the High Contrast Sensitivity Technology(HCS RT) for radiographic inspection. The contrast sensitivity can be enhanced by a factor of 10 in comparison to film. New Digital Detector Arrays (DDA) are now available for stationary and mobile testing. They are also applied for automated defect recognition (ADR), CT, Back Scatter and Dual Energy Applications.Back Scatter Techniques are increasingly applied for Security and NDTNumeric Radiographic Modelling is applied for Experiment Planning, Film replacement, POD-calculations and trainingMobile and portable CT devices are suitable for non destructive cross sectioning in nuclear power industry and aircraft applicationsNeutron radiography at research reactors was enhanced for visualisation of motions

Summary:Summary:

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Acknowledgement

B. Redmer – BAM Berlin

U. Zscherpel – BAM Berlin

A. Alekseychuk – BAM Berlin

K. Bavendiek – Yxlon Hamburg

K. Osterloh – BAM Berlin

G.-R. Jaenisch – BAM Berlin

C. Bellon – BAM Berlin

M. Hentschel – BAM Berlin

A. Lange – BAM Berlin

J. Beckmann – BAM Berlin

Ch. Müller – BAM Berlin

S. Sood – CIT London

T. Bücherl – TUM Munich

B. Schillinger – TUM-Tech Munich

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Ende

e-mail: [email protected]://www.bam.de

e-mail: [email protected]://www.bam.de

BAM-Berlin, Lab. VIII.3Unter den Eichen 8712005 BerlinTel. (030) 81041831FAX (030) 811 5089

BAM-Berlin, Lab. VIII.3Unter den Eichen 8712005 BerlinTel. (030) 81041831FAX (030) 811 5089

BAMmain building